TWI536144B - Industrial server system - Google Patents
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- TWI536144B TWI536144B TW103135654A TW103135654A TWI536144B TW I536144 B TWI536144 B TW I536144B TW 103135654 A TW103135654 A TW 103135654A TW 103135654 A TW103135654 A TW 103135654A TW I536144 B TWI536144 B TW I536144B
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本發明係關於工業伺服器系統,尤指將模組耦接至背板,並相容於先進電信運算架構(AdvancedTCA)一種工業伺服器系統。 The present invention relates to an industrial server system, and more particularly to an industrial server system that couples a module to a backplane and is compatible with Advanced Telecom Computing Architecture (AdvancedTCA).
模組化系統通常係用於可靠性和成本效益為重要因素的通信網路中。此種模組化系統係包含連接且耦合互用性工件的一個或多個背板,例如電路板或"集成板",其中,該集成板可能包括但非受限之板卡、載接板、處理板、互連界面等等。其他可被所述背板連接並相耦合之互用性工件,係包含有一些類似風扇、電力設備模組(PEM)、現場可置換單元(FRU)、警報板等等的組件。 Modular systems are often used in communication networks where reliability and cost effectiveness are important factors. The modular system includes one or more backplanes that connect and couple interoperable workpieces, such as a circuit board or "integrated board", where the integrated board may include, but is not limited to, boards, carrier boards , processing boards, interconnect interfaces, and more. Other interoperable workpieces that can be coupled and coupled by the backplane include components such as fans, power equipment modules (PEMs), field replaceable units (FRUs), alarm boards, and the like.
通常,一個模組平臺系統內之背板係包括一個或多個資料傳輸連接器和電力連接器,其中,該一個或多個資料傳輸連接器,係包含連接並相耦至該背板之集成板互連的通訊鏈路。而所述之通訊鏈路係可使該等互連之集成板,耦合至一些在該背板上的組件,例如:夾層卡、處理元件、晶片集、媒體裝置等等。通常,一個資料傳輸介面, 係用來在通訊鏈路之間負責擔任一橋接器之工作,並且,在所述通訊鏈路中所傳送的資料或指令係使用各種不同之通訊協定來進行傳輸。 Typically, a backplane within a modular platform system includes one or more data transmission connectors and power connectors, wherein the one or more data transmission connectors include an interface that is coupled and coupled to the backplane The communication link of the board interconnection. The communication link is such that the interconnected integrated boards are coupled to components on the backplane, such as mezzanine cards, processing elements, wafer sets, media devices, and the like. Usually, a data transfer interface, It is used to act as a bridge between communication links, and the data or instructions transmitted in the communication link are transmitted using a variety of different communication protocols.
因此,綜合上述對於之解決方案的說明,可以得知目前所習用的解決方案係仍具有許多缺點與不足;有鑑於此,本案之發明人係極力加以研究發明,而終於研發完成本發明之一種工業伺服器系統。 Therefore, in combination with the above description of the solution, it can be known that the solutions currently in use still have many shortcomings and shortcomings; in view of this, the inventors of the present invention have tried their best to study the invention, and finally developed a kind of the present invention. Industrial server system.
本發明之主要目的,在於提供一種工業伺服器系統,其主要係於一對接背板上規劃設置四個對接區,使得至少一後板模組與至少一前板模組能夠通過安裝於該對接背板上的多個訊號連接單元而互通訊息;並且,本發明係透過該背板上連接器的一特定配置,使得結合至該背板的該些模組能同時達到良好的傳輸效率、降低能量耗損、以及增進系統散熱之效果。 The main purpose of the present invention is to provide an industrial server system, which is mainly configured to arrange four docking areas on a pair of backplanes, so that at least one rear panel module and at least one front panel module can be mounted on the docking The plurality of signal connection units on the backplane communicate with each other; and the present invention transmits a specific configuration of the connectors on the backplane such that the modules coupled to the backplane can achieve good transmission efficiency and reduce at the same time. Energy consumption and the effect of improving system cooling.
因此,為了達成本發明上述之目的,本案之發明人提出一種工業伺服器系統,係包括:一容置體;一背板,係設置於該容置體之內,並包括有:一第一對接區,係具有: 一第一傳輸區塊,係設置於該背板的正面之上;一第二傳輸區塊,係設置於該背板的正面之上,並鄰近於該第一傳輸區塊;及複數個第一資訊對接區塊,係並行設置於該背板的背面之上;一第二對接區,係位於該第一對接區的一側,並具有:一第三傳輸區塊,係設置於該背板的正面之上,並相對於該第二傳輸區塊而位於該些第一資訊對接區塊的右側;一第一通風區,係形成於該背板之上,並鄰近於該第三傳輸區塊,用以使該背板前後的空氣流通;一第二通風區,係形成於該背板之上,並鄰近於該第三傳輸區塊,用以使該背板前後的空氣流通;一第四傳輸區塊,係設置於該背板的正面上,並鄰近於該第一通風口與該第二通風口;複數個第二資訊對接區塊,係設置於該背板的背面之上;及複數個第一電源輸出區塊,係設置於該背板的背面之上,並鄰近於該些第二資訊對接區塊;一第三對接區,係相對於該第一對接區而位於該第二對接區的另一側,並具有:一第五傳輸區塊,係設置於該背板的正面上;一第六傳輸區塊,係設置於該背板的正面之上,並鄰近於 該第五傳輸區塊;一第二電源輸出區塊,係分別並排且相鄰設置於該第五傳輸區塊的一側;及一第三電源輸出區塊,係分別並排且相鄰設置於該第六傳輸區的一側;以及一第四對接區,係相對於該第二對接區而位於該第三對接區的另一側;至少一後板模組,係藉由分別與該第一資訊對接區塊、該第二資訊對接區塊和該第一電源輸出區塊互相對應的一第一資訊對接連接器、一第二資訊對接連接器和一第一電源連接器而結合至該背板的背面;一第一前板模組,係藉由分別與該第一傳輸區塊、該第四傳輸區塊、該第五傳輸區塊和該第二電源輸出區塊互相對應的一第一傳輸連接器、一第四傳輸連接器、一第五傳輸連接器和一第二電源連接器而結合至該背板的正面;一第二前板模組,係藉由分別與該第二傳輸區塊、該第三傳輸區塊、該第六傳輸區塊和該第三電源輸出區塊互相對應的一第二傳輸連接器、一第三傳輸連接器、一第六傳輸連接器和一第三電源連接器而結合至該背板的正面;以及一電源供應器,係容置於該容置體之內,並耦接於該背板的該第四對接區,以提供電力給耦接至該背板的該些模組。 Therefore, in order to achieve the above object of the present invention, the inventor of the present invention provides an industrial server system comprising: a receiving body; a backing plate disposed in the receiving body and including: a first The docking area has: a first transport block is disposed on a front surface of the backplane; a second transport block is disposed on a front surface of the backplane and adjacent to the first transport block; and a plurality of An information docking block is disposed on the back of the backplane in parallel; a second docking zone is located on one side of the first docking zone and has a third transport block disposed on the back Above the front surface of the board, and located on the right side of the first information docking block relative to the second transport block; a first ventilation zone is formed on the backplane and adjacent to the third transmission a block for circulating air in front of and behind the backboard; a second ventilation zone formed on the backplane adjacent to the third transport block for circulating air in front of and behind the backplane; a fourth transmission block is disposed on the front surface of the backboard and adjacent to the first vent and the second vent; the plurality of second information docking blocks are disposed on the back of the backboard And a plurality of first power output blocks are disposed on the back of the backboard and adjacent to The second information docking block; a third docking zone is located on the other side of the second docking zone with respect to the first docking zone, and has: a fifth transport block disposed on the back a front side of the board; a sixth transport block disposed on the front side of the back board and adjacent to The second power transmission output block is disposed side by side and adjacent to one side of the fifth transmission block; and a third power output output block is respectively arranged side by side and adjacent to each other. One side of the sixth transmission area; and a fourth docking area located on the other side of the third docking area with respect to the second docking area; at least one rear panel module is respectively An information docking block, the second information docking block and a first information docking connector, a second information docking connector and a first power connector corresponding to the first power output block are coupled to the first power connector a first front panel module, wherein the first front panel module respectively corresponds to the first transport block, the fourth transport block, the fifth transport block, and the second power output block a first transmission connector, a fourth transmission connector, a fifth transmission connector, and a second power connector are coupled to the front surface of the backplane; and a second front panel module is respectively associated with the first a second transport block, the third transport block, the sixth transport block, and the third a second transmission connector, a third transmission connector, a sixth transmission connector and a third power connector respectively corresponding to the source output blocks are coupled to the front surface of the backplane; and a power supply system The accommodating body is disposed in the accommodating body and coupled to the fourth docking area of the backboard to provide power to the modules coupled to the backboard.
1‧‧‧工業伺服器系統 1‧‧‧ Industrial Server System
11‧‧‧容置體 11‧‧‧容容
12‧‧‧背板 12‧‧‧ Backplane
121‧‧‧固定件 121‧‧‧Fixed parts
13‧‧‧後板模組 13‧‧‧Back panel module
131‧‧‧第一資訊對接連接器 131‧‧‧First Information Docking Connector
132‧‧‧第二資訊對接連接器 132‧‧‧Second information docking connector
133‧‧‧第一電源連接器 133‧‧‧First power connector
14‧‧‧第一前板模組 14‧‧‧First front panel module
141‧‧‧第一傳輸連接器 141‧‧‧First transmission connector
142‧‧‧第四傳輸連接器 142‧‧‧fourth transmission connector
143‧‧‧第五傳輸連接器 143‧‧‧ fifth transmission connector
144‧‧‧第二電源連接器 144‧‧‧Second power connector
15‧‧‧第二前板模組 15‧‧‧Second front panel module
151‧‧‧第二傳輸連接器 151‧‧‧Second transmission connector
152‧‧‧第三傳輸連接器 152‧‧‧ third transmission connector
153‧‧‧第六傳輸連接器 153‧‧‧ sixth transmission connector
154‧‧‧第三電源連接器 154‧‧‧ Third power connector
16‧‧‧電源供應器 16‧‧‧Power supply
A‧‧‧第一對接區 A‧‧‧First docking area
A1‧‧‧第一傳輸區塊 A1‧‧‧ first transmission block
A2‧‧‧第二傳輸區塊 A2‧‧‧second transmission block
A3‧‧‧第一資訊對接區塊 A3‧‧‧First Information Docking Block
B‧‧‧第二對接區 B‧‧‧Second docking area
B1‧‧‧第三傳輸區塊 B1‧‧‧ third transmission block
B2‧‧‧第一通風區 B2‧‧‧First ventilation zone
B3‧‧‧第二通風區 B3‧‧‧Second ventilation zone
B4‧‧‧第四傳輸區塊 B4‧‧‧fourth transmission block
B5‧‧‧第二資訊對接區塊 B5‧‧‧Second information docking block
B6‧‧‧第一電源輸出區塊 B6‧‧‧First power output block
C‧‧‧第三對接區 C‧‧‧ third docking area
C1‧‧‧第五傳輸區塊 C1‧‧‧ fifth transmission block
C2‧‧‧第六傳輸區塊 C2‧‧‧ sixth transmission block
C3‧‧‧第二電源輸出區塊 C3‧‧‧Second power output block
C4‧‧‧第三電源輸出區塊 C4‧‧‧ Third power output block
D‧‧‧第四對接區 D‧‧‧fourth docking area
D1‧‧‧第一電源供應區塊 D1‧‧‧First power supply block
D2‧‧‧控制模組區塊 D2‧‧‧Control Module Block
D3‧‧‧第二電源供應區塊 D3‧‧‧Second power supply block
D4‧‧‧硬碟插槽區塊 D4‧‧‧ hard disk slot block
D5‧‧‧該輸入/出區塊 D5‧‧‧The input/output block
17‧‧‧硬碟 17‧‧‧ Hard disk
第一圖係本發明之一種工業伺服器系統的立體圖;第二圖係本發明之部分立體圖;第三圖係本發明之背板的正面視圖;第四圖係本發明之第一前板模組的立體圖;第五圖係本發明之第二前板模組的立體圖;第六圖係本發明之背板的背面視圖;以及第七圖係本發明之後板模組的立體圖。 The first drawing is a perspective view of an industrial server system of the present invention; the second drawing is a partial perspective view of the present invention; the third drawing is a front view of the back plate of the present invention; and the fourth drawing is the first front plate mode of the present invention. The perspective view of the second front panel module of the present invention; the sixth diagram is a rear view of the back panel of the present invention; and the seventh diagram is a perspective view of the rear panel module of the present invention.
為了能夠更清楚地描述本發明所提出之一種工業伺服器系統,以下將配合圖式,詳盡說明本發明之較佳實施例。 In order to more clearly describe an industrial server system of the present invention, a preferred embodiment of the present invention will be described in detail below with reference to the drawings.
請參閱第一圖與第二圖,係本發明之一種工業伺服器系統的立體圖與部分立體圖。如圖所示,本發明之工業伺服器系統1主要由一容置體11、一背板12、至少一後板模組13、一第一前板模組14、一第二前板模組15、以及一電源供應器16所構成;其中,該背板12與該電源供應器16係設置於該容置體11之內,且該後板模組13、該第一前板模組14、及該第二前板模組15係耦接並結合至該背板12。 Please refer to the first and second figures, which are perspective and partial perspective views of an industrial server system of the present invention. As shown in the figure, the industrial server system 1 of the present invention mainly comprises a receiving body 11, a back plate 12, at least one rear plate module 13, a first front plate module 14, and a second front plate module. And a power supply unit 16 , wherein the back board 12 and the power supply 16 are disposed in the receiving body 11 , and the rear board module 13 and the first front board module 14 are disposed. The second front panel module 15 is coupled to and coupled to the backboard 12.
請參閱第三圖,係本發明之背板的正面視圖。如第三圖所示,該背板12係包括有一第一對接區A、一第二對接區B、一第三對接區C、及一第四對接區D;其中,該第二對接區B係位於該第一對接區A的一側,該第三對接區C係相對於該第一對接區A而位於該第二對接區B的另一側,該第四對接區D則相對於該第二對接區B而位於該第三對接區C的另一側。接著係說明位於該背板12正面之上的連接器配制,該第一對接區A係具有一第一傳輸區塊A1及一第二傳輸區塊A2分別位於該第一對接區A的上下半部。位於該第一對接區A右側的該第二對接區B係具有一第三傳輸區塊B1,係位於該第二對接區B的下半部、一第一通風區B2,係位於該第三傳輸區塊B1的上方、一第二通風區B3,係位於該第三傳輸區塊B1的右方、及一第四傳輸區塊B4,係位於該第一通風區B2的右方與該第二通風區B3的上方。 Please refer to the third figure, which is a front view of the back sheet of the present invention. As shown in the third figure, the backplane 12 includes a first docking area A, a second docking area B, a third docking area C, and a fourth docking area D; wherein the second docking area B Located on one side of the first docking area A, the third docking area C is located on the other side of the second docking area B with respect to the first docking area A, and the fourth docking area D is opposite to the The second docking zone B is located on the other side of the third docking zone C. Next, the connector is disposed on the front surface of the backplane 12. The first docking area A has a first transport block A1 and a second transport block A2 respectively located in the upper and lower half of the first docking area A. unit. The second docking zone B located on the right side of the first docking zone A has a third transport block B1 located in the lower half of the second docking zone B and a first ventilation zone B2. Above the transmission block B1, a second ventilation zone B3 is located to the right of the third transmission block B1 and a fourth transmission block B4, which is located to the right of the first ventilation zone B2 and the first Above the ventilation zone B3.
位於該第二對接區B右側的該第三對接區C係具有一第五傳輸區塊C1與一第六傳輸區塊C2,係分別位於該第三對接區C的上下半部;以及一第二電源輸出區塊C3與一第三電源輸出區塊C4,係分別位於該第五傳輸區塊C1與該第六傳輸區塊C2的右方。位於該第三對接區C右側的該第四對接區D係具有位於該第四對接區D上半部的一第一電源供應區塊D1,用以接收該電源供應器16供給 的電源、位於該第一電源供應區塊D1右方的一控制模組區塊D2,用以監控該工業伺服器系統1、以及位於控制模組區塊D2右方的一第二電源供應區塊D3,用以接收該電源供應器16供給的電源,其中,該控制模組區塊D2係作為電源供應器16的狀態顯示、軟/硬體重置、及電源開關的連接介面。此外,必須於此補充說明的是,該背板12更具有至少一第三通風口形成於該背板12未使用的區域,以增進該工業伺服器系統的散熱效果,並且,該背板12係藉由設置於該背板正面的至少一固定件121來固定設置於該容置體11之內。 The third docking zone C located on the right side of the second docking zone B has a fifth transport block C1 and a sixth transport block C2, respectively located in the upper and lower halves of the third docking zone C; The two power output block C3 and the third power output block C4 are respectively located to the right of the fifth transfer block C1 and the sixth transfer block C2. The fourth docking zone D located on the right side of the third docking zone C has a first power supply block D1 located in the upper half of the fourth docking zone D for receiving the power supply 16 supply. a power supply, a control module block D2 located to the right of the first power supply block D1, for monitoring the industrial server system 1, and a second power supply area located to the right of the control module block D2 The block D3 is configured to receive the power supply provided by the power supply unit 16, wherein the control module block D2 serves as a connection interface of the power supply 16 for status display, soft/hardware reset, and power switch. In addition, it must be additionally noted that the backboard 12 further has at least one third vent formed in an unused area of the backboard 12 to enhance the heat dissipation effect of the industrial server system, and the back panel 12 It is fixedly disposed in the receiving body 11 by at least one fixing member 121 disposed on the front surface of the backboard.
請參閱第三圖,並請同時參閱第四圖與第五圖,係第一前板模組與第二前板模組的立體圖。如第四圖所示,該第一前板模組14係藉由分別與該第一傳輸區塊A1、該第四傳輸區塊B4、該第五傳輸區塊C1和該第二電源輸出區塊C3互相對應的一第一傳輸連接器141、一第四傳輸連接器142、一第五傳輸連接器143和一第二電源連接器144而結合至該背板12的正面。如第五圖所示,該第二前板模組15係藉由分別與該第二傳輸區塊A2、該第三傳輸區塊B1、該第六傳輸區塊C2和該第三電源輸出區塊C4互相對應的一第二傳輸連接器151、一第三傳輸連接器152、一第六傳輸連接器153和一第三電源連接器154而結 合至該背板12的正面。該第一前板模組14與該第二前板模組15更分別具有一板卡管理員(Intelligent Platform Management Controller,IPMC),負責監控、記錄板卡模組上的情況,回報並處理異常事件,以及控制板卡模組上的電源和資料頻道的開啟等管理功能;並且,該第一前板模組14更包括有一精簡指令集電路(RISC),該第二前板模組15更包括有一複雜指令集電路(CISC)。 Please refer to the third figure, and please refer to the fourth and fifth figures at the same time, which is a perspective view of the first front panel module and the second front panel module. As shown in the fourth figure, the first front panel module 14 is respectively separated from the first transport block A1, the fourth transport block B4, the fifth transport block C1, and the second power output area. A first transmission connector 141, a fourth transmission connector 142, a fifth transmission connector 143 and a second power connector 144, which correspond to each other, are coupled to the front surface of the backplane 12. As shown in the fifth figure, the second front panel module 15 is respectively connected to the second transport block A2, the third transport block B1, the sixth transport block C2, and the third power output area. A second transmission connector 151, a third transmission connector 152, a sixth transmission connector 153, and a third power connector 154 corresponding to each other of the block C4 are connected. It is brought to the front side of the backboard 12. The first front panel module 14 and the second front panel module 15 respectively have an Intelligent Platform Management Controller (IPMC), which is responsible for monitoring and recording the situation on the board module, and reporting and handling abnormalities. The event, and the management function of controlling the power and data channels on the board module; and the first front panel module 14 further includes a reduced instruction set circuit (RISC), and the second front panel module 15 Includes a complex instruction set circuit (CISC).
接著係說明位於該背板12背面之上的連接器配制,請參閱第六圖,係本發明之背板的背面視圖。如第六圖所示,該第一對接區A的背面係直行設置有三個第一資訊對接區塊A3,且該第一資訊對接區塊A3係鄰近於該第二對接區B。該第二對接區B的背面係直行設置有三個第二資訊對接區塊B5,及三個第一電源輸出區塊B6,其中,該第一電源輸出區塊B6係位於該第二資訊對接區塊B5左方,並鄰近於該第三對接區C。該第四對接區D的背面係設置有一硬碟插槽區塊D4及一輸入/出區塊D5,其中,該硬碟插槽區塊D4係鄰近於該第三對接區C並具有二硬碟插槽,用以耦接至少一硬碟17,該輸入/出區塊D5係位於該硬碟插槽區塊D4下方,用以耦接至少一電氣模組,且該電氣模組係選自於下列群組之中的任一者:通用序列匯流排(USB)裝置、區域網路(LAN)或無線LAN(WLAN)裝置、整合裝置電子電路(IDE)、進階傳輸附接(ATA)裝置、 音訊裝置與其他I/O裝置。並且,請再參閱第三圖,該第六傳輸區塊C2係作為該第二前板模組15與該控制模組區塊D2、該硬碟插槽區塊D4、及該輸入/出區塊D5的傳輸介面。 Next, the connector configuration on the back side of the back sheet 12 will be described. Referring to the sixth drawing, it is a rear view of the back sheet of the present invention. As shown in the sixth figure, the back side of the first docking area A is disposed in a straight line with three first information docking blocks A3, and the first information docking block A3 is adjacent to the second docking area B. The back side of the second docking area B is provided with three second information docking blocks B5 and three first power output blocks B6, wherein the first power output block B6 is located in the second information docking area. Block B5 is to the left and adjacent to the third docking area C. The back surface of the fourth docking area D is provided with a hard disk slot block D4 and an input/output block D5, wherein the hard disk slot block D4 is adjacent to the third docking area C and has two hard The disk slot is coupled to the at least one hard disk 17 , and the input/output block D5 is located under the hard disk slot block D4 for coupling at least one electrical module, and the electrical module is selected From any of the following groups: Universal Serial Bus (USB) devices, Local Area Network (LAN) or Wireless LAN (WLAN) devices, Integrated Device Electronic Circuits (IDE), Advanced Transfer Attachment (ATA) ) device, Audio devices and other I/O devices. Moreover, referring to the third figure, the sixth transmission block C2 serves as the second front panel module 15 and the control module block D2, the hard disk slot block D4, and the input/output area. The transmission interface of block D5.
請參閱第六圖,並請同時參閱第七圖,係本發明之後板模組的立體圖。如第七圖所示,該至少一後板模組13係藉由分別與該第一資訊對接區塊A3、該第二資訊對接區塊B5和該第一電源輸出區塊B6互相對應的一第一資訊對接連接器131、一第二資訊對接連接器132和一第一電源連接器133而結合至該背板12的背面。該後板模組13係為一先進夾層卡(Advanced Mezzanine Card),並具有通信通道、模組管理控制器(MMC)、模組控制邏輯、模組記憶體、I/O介面、模組介面、熱插拔電路、和擴充應用模組,其中,上述的模組記憶體係選自於下列群組之中的任一者:揮發性記憶體、非揮發性記憶體、快閃記憶體、隨機存取記憶體(RAM)、與唯讀記憶體(ROM);並且,上述的模組控制邏輯係選自於下列群組之中的任一者:微處理器、網路處理器、微控制器、現場可程式閘陣列(FPGA)、與專用積體電路(ASIC)。 Please refer to the sixth figure, and please refer to the seventh figure at the same time, which is a perspective view of the rear panel module of the present invention. As shown in the seventh figure, the at least one rear panel module 13 is respectively corresponding to the first information docking block A3, the second information docking block B5, and the first power output block B6. The first information docking connector 131, a second information docking connector 132 and a first power connector 133 are coupled to the back of the backplane 12. The rear panel module 13 is an advanced mezzanine card (Advanced Mezzanine Card), and has a communication channel, a module management controller (MMC), a module control logic, a module memory, an I/O interface, and a module interface. The hot plug circuit, and the expansion application module, wherein the module memory system is selected from any one of the group consisting of: volatile memory, non-volatile memory, flash memory, random Access memory (RAM), and read-only memory (ROM); and the above module control logic is selected from any of the following groups: microprocessor, network processor, micro-control , Field Programmable Gate Array (FPGA), and Dedicated Integrated Circuit (ASIC).
承上述,繼續地說明設置於該背板12上的連接器所使用的傳輸介面。於本發明之一較佳實施例中,該工業伺服器系統1係將一第一前板模組14、一第二前板模組 15、及三後板模組13結合至一背板12之上。若以第二前板模組15作為一主輸入端,該第一前板模組14作為一副輸入端,則該第二前板模組15係藉由該第二傳輸區塊A2與該第三傳輸區塊B1將資料訊號輸入至該背板12,其中,該第二傳輸區塊A2係具有二組利用八個信道的組件高速互連(PCIe x8)協定介面,及二組利用四個信道的組件高速互連(PCIe x4)協定介面,該第三傳輸區塊B1係具有二組利用八個信道的組件高速互連(PCIe x8)協定介面。該第一前板模組14係藉由該第一傳輸區塊A1所具有的一組利用八個信道的組件高速互連協定介面(PCIe x8)接收自該第二前板模組15傳出的資料訊號,且該第一前板模組14更藉由該第一傳輸區塊A1所具有的二組利用四個信道的組件高速互連(PCIe x4)協定介面及三組萬兆位元附掛單元介面(XAUI)、該第四傳輸區塊B4與該第五傳輸區塊C1將資料訊號輸入至該背板12,其中,該第四傳輸區塊B4係具有六組萬兆位元附掛單元介面(XAUI),該第五傳輸區塊C1係具有三組萬兆位元附掛單元介面(XAUI)。 In view of the above, the transmission interface used by the connector provided on the backboard 12 will be continuously explained. In a preferred embodiment of the present invention, the industrial server system 1 is a first front panel module 14 and a second front panel module. 15. The three rear panel modules 13 are coupled to a backing plate 12. If the second front panel module 15 is used as a main input terminal and the first front panel module 14 is used as an auxiliary input terminal, the second front panel module 15 is coupled to the second front panel module A2. The third transmission block B1 inputs a data signal to the backplane 12, wherein the second transmission block A2 has two sets of component high-speed interconnect (PCIe x8) protocol interfaces using eight channels, and two groups of four A component of the channel high speed interconnect (PCIe x4) protocol interface, the third transport block B1 having two sets of component high speed interconnect (PCIe x8) protocol interfaces utilizing eight channels. The first front panel module 14 is received from the second front panel module 15 by a set of eight-channel component high-speed interconnect protocol interface (PCIe x8) of the first transport block A1. The first front panel module 14 further comprises two sets of four-channel high-speed interconnect (PCIe x4) protocol interface and three sets of 10 Gigabit elements by the first transport block A1. The attached unit interface (XAUI), the fourth transmission block B4 and the fifth transmission block C1 input data signals to the backplane 12, wherein the fourth transmission block B4 has six sets of 10 Gigabit elements. Attached to the unit interface (XAUI), the fifth transport block C1 has three sets of 10 Gigabit Attachment Unit Interfaces (XAUI).
於該背板12背面之上的每一後板模組13係藉由每一該第一資訊對接區塊A3所具有的一組萬兆位元附掛單元介面(XAUI),及一組利用八個信道的組件高速互連(PCIe x8)協定介面接收自該第一前板模組14與該第二前板模組15所傳出的資料訊號;並且,每一後板模組13亦 藉由每一該第二資訊對接區塊B5所具有的三組萬兆位元附掛單元介面(XAUI)接收自該第一前板模組14傳出的資料訊號。 Each of the rear panel modules 13 on the back surface of the backplane 12 is provided by a set of 10 Gigabit Attachment Unit Interfaces (XAUIs) of each of the first information docking blocks A3, and a group of utilized The eight-channel component high-speed interconnect (PCIe x8) protocol interface receives the data signals transmitted from the first front panel module 14 and the second front panel module 15; and each of the rear panel modules 13 The data signals transmitted from the first front panel module 14 are received by the three sets of 10 Gigabit Attachment Unit Interfaces (XAUIs) of each of the second information docking blocks B5.
如此,上述係已完整且清楚地說明本發明之工業伺服器系統的結構、功能與背板連接器配置;經由上述,吾人可以得知本發明係具有下列之技術特徵與優點:1.於本發明中,係於一背板12上規劃設置四個對接區(A,B,C,D);使得至少一後板模組13與至少一前板模組(14,15)能夠通過安裝於背板12上的多個連接器而互通訊息;特別地,本發明進一步於使得第三對接區C上的係鄰近於第四對接區D,如此設置可使得第二電源輸出區塊C3與第三電源輸出區塊C4鄰近設置於第一電源供應區塊D1與第二電源供應區塊D3,進而降低能量耗損以增加其電能傳輸效率;2.再者,本發明亦將第六傳輸區塊C2設置於第三對接區C之上,其目的在於第六傳輸區塊C2係為一主要的輸入/出傳輸介面,故鄰近設置於該輸入/出區塊D5,可使得其傳輸效率增加;3.此外,本發明更於該些對接區(A,B,C,D)之間的未設置連接器的區域挖設多個通風口,以增進工業伺服器系統的散熱效果。例如:將第一通風區B2與第二通風區B3各鄰近設置於第三傳輸區塊B1與第四傳輸區塊B4的側 邊,因為該二通風區所在的位置係對應到第一前板模組與第二前板模組上的重要電路及電子組件,故必需有良好的散熱來避免電子組件損壞;必須加以強調的是,上述之詳細說明係針對本發明可行實施例之具體說明,惟該實施例並非用以限制本發明之專利範圍,凡未脫離本發明技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 Thus, the above-mentioned system has completely and clearly explained the structure, function and backplane connector configuration of the industrial server system of the present invention; through the above, we can know that the present invention has the following technical features and advantages: 1. In the invention, four docking areas (A, B, C, D) are planned on a backboard 12; so that at least one rear panel module 13 and at least one front panel module (14, 15) can be installed by The plurality of connectors on the backplane 12 communicate with each other; in particular, the present invention further enables the system on the third docking zone C to be adjacent to the fourth docking zone D, such that the second power output block C3 and the second The three power output block C4 is disposed adjacent to the first power supply block D1 and the second power supply block D3, thereby reducing energy consumption to increase its power transmission efficiency; 2. Furthermore, the present invention also applies the sixth transmission block C2 is disposed above the third docking area C, and the purpose is that the sixth transmission block C2 is a main input/output transmission interface, so that the transmission efficiency is increased by being disposed adjacent to the input/output block D5; 3. In addition, the present invention is further adapted to the docking areas (A, B, C, D) The connector region is not provided a plurality of vents dug, the server system to enhance the industrial cooling effect. For example, the first ventilation zone B2 and the second ventilation zone B3 are respectively disposed adjacent to the side of the third transmission block B1 and the fourth transmission block B4. Because the position of the two ventilation zones corresponds to the important circuits and electronic components on the first front panel module and the second front panel module, it is necessary to have good heat dissipation to avoid damage of the electronic components; The detailed description of the present invention is intended to be illustrative of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention. The patent scope of this case.
1‧‧‧工業伺服器系統 1‧‧‧ Industrial Server System
11‧‧‧容置體 11‧‧‧容容
13‧‧‧後板模組 13‧‧‧Back panel module
14‧‧‧第一前板模組 14‧‧‧First front panel module
15‧‧‧第二前板模組 15‧‧‧Second front panel module
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