CN100596239C - circuit board assembly - Google Patents

Abstract

The invention discloses a circuit board assembly applied to electrical communication equipment, comprising a front board and a rear board, the front board and the rear board are plugged, and the rear board is provided with an independent Fabric (structure) plane module, It is used to implement exchange processing for business data; an independent Base (basic) plane module is provided on the front board, which is used to implement exchange processing for management data. There may be multiple circuit board components, and the multiple circuit board components are connected through the backplane. The interconnection of the Base plane and the Fabric plane is realized through the backplane; the structure is reasonable, which is conducive to wiring layout, and can make the air duct of the front board more smooth, which is conducive to heat dissipation, and can also realize the modularization of the Fabric plane. There is also a hot-swap management module on the front board, which can control the power supply or power-off of the voltage adjustment module according to the plug-in status of the rear board, so that the hot-swap board can be easily realized between the front board and the rear board. .

Description

circuit board assembly

technical field

The invention relates to a component of an electrical communication device, in particular to a circuit board assembly.

Background technique

With the development and change of telecommunication technology, telecommunication equipment develops towards the direction of large capacity, high density and high performance. In this case, the ATCA (Advanced Telecommunications Computing Architecture) specification standard (PICMG3.0) launched by the PICMG (PCI Industrial Computer Manufacturing Working Group) organization.

The ATCA specification standard mainly stipulates the topology of the entire chassis structure, power supply, system management, connector definition, heat dissipation, and system connection.

In the ATCA standard, the circuit board components in the chassis are divided into Switch (switching) boards and Server (server) boards. The switching board is responsible for the exchange of business and management data, and the server board is mainly responsible for data storage and processing.

The Switch board and the Server board in the frame are mainly connected to each other through the backplane, and the high-speed serial bus technology is used to realize the point-to-point switching structure. The data exchange between all nodes has an independent data channel, which can realize multiple Nodes switch simultaneously.

According to different topologies, the interconnection methods of the Switch board and the Server board can be divided into three types: Dual Star (double star), Dual-Dual Star (dual-double star) and Full Mesh (full mesh).

As shown in Figure 1, the dual-star configuration structure is the most basic, including two Switch boards, and the others are Server boards. The two Switch boards and the other Server boards are plugged into the They are electrically connected through the backplane to realize data exchange and interconnection.

As shown in Figure 2, in the ATCA standard, the data exchange plane on a single board is divided into a Base (basic) plane and a Fabric (structure) plane. The Base plane is mainly responsible for managing data exchange and interconnection, mainly GE/FE (thousand Gigabit Ethernet/100M Ethernet) switching; the Fabric plane is mainly responsible for the switching and interconnection of business data, including various data switching forms, such as GE (Gigabit Ethernet), FC (Fiber Channel), PCI-E (Next Generation external device interface), etc.

As shown in FIG. 3 , in the existing ATCA system, the Base (basic) plane and the Fabric (structure) plane in the server single board are directly arranged on the front board of the server single board.

Various interfaces of the Base (basic) plane and the Fabric (structural) plane on each server board are interconnected through the backplane to form the Base (basic) switching plane and the Fabric (structural) switching plane.

Among the various technologies of ATCA, the most difficult and the most difficult to realize is heat dissipation. PlCMG3.0 stipulates that the power consumption of a single board is as high as 200 watts, and the power consumption of a single chassis is as high as 3000 watts. In the above prior art, both the Base plane and the Fabric plane are arranged on the front board, since processors, bridges and other high power consumption devices are also arranged on the front board, which is not conducive to the heat dissipation of the front board.

At present, the main ways to solve the heat dissipation problem are: adopt fans with strong heat dissipation capacity and large ventilation, and can support intelligent adjustment of speed; Run with pre-designed channels; or use more efficient cooling methods, such as water cooling. These heat dissipation methods are complex in structure, and the effect is not ideal.

In addition, since the front board is mandatory in the ATCA specification, if the user does not need the fabric plane, the board must be redeveloped. Therefore, it is not easy to realize modularization of the Fabric plane even if the Fabric plane is set on the front board.

Contents of the invention

The purpose of the present invention is to provide a modularized circuit board assembly, which facilitates the heat dissipation of the system.

The purpose of the present invention is achieved through the following technical solutions:

The circuit board assembly of the present invention includes a front board and a rear board, the front board and the rear board are plugged in, and the rear board is provided with an independent structural plane module for realizing exchange processing for business data ;

A hot-swappable connector is provided at the joint between the front board and the rear board;

The rear board is provided with a voltage adjustment module, which is used to provide various voltages for the rear board;

The front board is provided with a hot-swappable management module, which can be electrically connected to the voltage adjustment module through a hot-swap connector, and controls the power supply or power-off of the voltage adjustment module according to the plug state of the rear board .

The structural plane module includes a Gigabit Ethernet control chip and a fiber channel control chip; the Gigabit Ethernet control chip and the fiber channel control chip are respectively connected to bridges arranged on the front board.

It also includes a basic Base plane module, which is used to realize the exchange and processing of management data. The basic plane module is located on the front board; or the base plane module is in the shape of a buckle board, and is fastened to the front board through a connector. or, the basic plane module is in the shape of a plug-in card and plugged into the front board.

The structural plane module is in the shape of a buckle, and is fastened to the rear board through a connector; or, the structural plane module is in the shape of a plug-in card, and is plugged into the rear board.

There are multiple circuit board components, and the multiple circuit board components are connected through a backplane.

The hot insertion between the front board and the rear board includes steps:

When the front board is inserted into the rear board, the hot swap management module determines that the rear board is inserted safely, and reports the power-on request of the rear board to the system management center;

After receiving the power-on request, the system management center instructs the hot-swap management module to supply power to the voltage adjustment module corresponding to the rear board;

After the voltage adjustment module is powered on, it converts various voltages required by the rear board and activates the rear board.

After the system management center receives the power-on request, it also includes steps:

Instruct the hot-swap management module to read the basic information of the rear board, and upload the basic information to the system management center;

The system management center judges whether the rear board matches the front board based on the basic information, and if not, stops hot-swapping, and if so, instructs the hot-swap management module to supply power to the voltage adjustment module corresponding to the corresponding rear board.

The hot unplugging between the front board and the rear board includes steps:

The hot-swappable management module first reports the power-off request of the rear board to the system management center;

After receiving the power-off request, the system management center instructs the hot-swap management module to stop supplying power to the voltage adjustment module corresponding to the corresponding rear board. .

After the system management center receives the power-off request, it also includes steps:

First stop the service of the rear board, or switch the service to the standby unit, and then instruct the hot swap management module to stop supplying power to the voltage adjustment module corresponding to the corresponding rear board.

It can be seen from the above-mentioned technical solutions provided by the present invention that the circuit board assembly described in the present invention, since the structural plane module is arranged on the rear board, can prevent the components of the front board from being placed too densely, thereby facilitating wiring The key to the layout is to make the air duct of the front board more unobstructed, which is beneficial to the heat dissipation of the system; and since the rear board and the front board can be hot-swapped, it is convenient for maintenance. The structural plane module is set on the rear board, which makes it easy to realize the modularization of the structural plane, so that the system is more flexible, and can expand the structural plane modules of different specifications according to different requirements. In addition, the rear board is not an essential unit in the ATCA specification, so when the user does not need the function of the structural plane, the user's needs can be met by not configuring the rear board without re-development. This saves R&D costs and shortens the time to market for products.

And since the front board and the rear board are plugged with a hot plug connector, the rear board is provided with a voltage adjustment module for providing various voltages for the rear board; the front board is provided with a hot plug connector. The management module can be electrically connected to the voltage adjustment module through a hot-swappable connector, and controls the power supply or power-off of the voltage adjustment module according to the plugging status of the rear board, so that the front board and the rear board can be easily connected. Implement hot-swap boards.

Description of drawings

Fig. 1 is a schematic diagram of the dual-star topology layout of the prior art circuit board assembly;

Fig. 2 is the division block diagram of switching plane in prior art ATCA standard;

Fig. 3 is the structural block diagram of prior art circuit board assembly;

Fig. 4 is a structural block diagram of Embodiment 1 of the circuit board assembly of the present invention;

Fig. 5 is the structural block diagram of Base (basic) plane of the present invention;

Fig. 6 is the structural block diagram of Fabric (structure) plane of the present invention;

7 is a structural block diagram of Embodiment 2 of the circuit board assembly of the present invention;

Fig. 8 is a schematic circuit diagram of hot swapping between the front board and the rear board of the present invention.

Detailed ways

The specific structure of the circuit board assembly provided by the present invention includes a front board and a rear board. The bridge connection on the bridge is used to realize the exchange and processing of business data. An independent basic plane module is provided on the front board, and the basic plane module is connected to a bridge disposed on the front board to implement exchange processing for management data. A hot-swappable connector Zone3 is also provided between the front board and the rear board to realize hot-swapping.

The basic plane module includes an Ethernet control chip, and the Ethernet control chip is connected to a bridge set on the front board.

The structural plane module includes a Gigabit Ethernet control chip and a Fiber Channel control chip, etc.; the Gigabit Ethernet control chip and the Fiber Channel control chip are respectively connected to bridges arranged on the front board. The basic plane module and the structural plane module can also be made into a gusset shape, and correspondingly there are buckles on the front board and the rear board, and the basic plane module and the structural plane module are fastened to the buckles of the front board and the rear board. Or it is made into a card shape, and slots are correspondingly provided on the front board and the rear board, and the basic plane module and the structural plane module are inserted into the slots of the front board and the rear board. This is more conducive to the modularization of the basic plane and the structural plane.

There may be multiple circuit board components, and the multiple circuit board components are connected through the backplane. The basic plane modules of each circuit board assembly are interconnected through the backplane, and the structural plane modules of each circuit board assembly are also interconnected through the backplane.

A preferred specific embodiment of the circuit board assembly of the present invention—as shown in FIG. 4 , includes a front board and a rear board, and the front board and the rear board are inserted through hot-swappable connector Zone3 and positioning pins. An independent Fabric (structure) plane module is provided on the rear board to implement exchange processing for service data. An independent Base (basic) plane module is provided on the front board to implement exchange processing for management data. Multiple circuit board components can be connected through the backplane. The first zone connector Zone1 and the second zone connector Zone2 are provided between the backplane and the front board. The interfaces of the Base planes of different circuit board components are then connected through the backplane The second zone connector Zone2 on the backplane is interconnected to form a Base (basic) switching plane. The interfaces of the Fabric planes of different circuit board components are also interconnected through the second zone connector Zone2 on the backplane to form a Fabric (structure) Exchange plane.

As shown in Figure 5, the Base plane module includes an Ethernet control chip, and the Ethernet control chip is connected to a bridge set on the front board, and the bridge is connected to the Ethernet control chip through a PCI-E (next generation external equipment interface) interface , the Ethernet control chip is connected to the second zone connector Zone2 of the ATCA system backplane through the 100M or Gigabit Ethernet interface, and then realizes the switching and interconnection of the Base plane through the backplane.

The main function of the Ethernet control chip is to convert the signal from the Ethernet into a PCI-E signal that the bridge chip can handle.

As shown in Figure 6, the Fabric plane module includes a Gigabit Ethernet control chip and a Fiber Channel control chip; the Gigabit Ethernet control chip and the Fiber Channel control chip are respectively connected to the front board through the PCI-E interface. bridge connection. The GE (Gigabit Ethernet) interface of the Ethernet control chip is connected to the front board of the ATCA system through the hot-swappable connector Zone3, and then connected to the backplane through the second zone connector Zone2 of the front board. Fabric GE plane switching and connection, and further connected to the entire service network. The main function of the Ethernet control chip is to convert the signal from the Ethernet into a PCI-E signal that the processor and the bridge system can handle.

The FC (Fiber Channel) interface of the Fiber Channel control chip is also connected to the front board of the ATCA system through hot-swappable Zone 3, and then connected to the backplane through the second zone connector Zone2 of the front board, and Fabric FC is realized through the backplane. For plane switching and connection, the main function of the fiber channel control chip is to convert the fiber channel interface signal into a PCI-E signal that the system and the bridge system can handle.

As shown in Figure 7, in the second embodiment of the present invention, the Fabric plane is made into a buckle plate and buckled on the rear board, or it can be made into a plug-in card and inserted on the rear board. Make the base plane of the front board in the form of a daughter board or a plug-in card.

In the present invention, a hot-swappable connector is provided at the joint between the front board and the rear board; a voltage adjustment module is provided on the rear board to provide various voltages for the rear board; The management module can be electrically connected to the voltage adjustment module through a hot-swappable connector, and the voltage adjustment module can be powered on or off according to the plugging status of the rear board.

A micro switch is also arranged on the rear board, and the hot swap management module judges the plugging state between the rear board and the front board according to the opening and closing state of the micro switch.

The hot swap between the front board and the rear board includes the power-on process when inserting and the power-off process when pulling out. The power-on process when inserting is as follows:

When the rear board is inserted into the front board, the hot-swap management module first judges whether the rear board is inserted safely. If it is inserted safely, the hot-swap management module reports the power-on request of the rear board to the system management center, and the system management center After receiving the power-on request, instruct the hot-swap management module to read the basic information of the rear board, and upload the basic information to the system management center; the system management center judges whether the rear board is compatible with the front board through the basic information. Matching, if not matching, stop hot-swapping, if matching, instruct the hot-swapping management module to supply power to the voltage adjustment module corresponding to the corresponding rear board. After the voltage adjustment module is powered on, it converts various voltages required by the rear board and activates the rear board.

The specific process is shown in Figure 8. Insert the rear board, and after the hot-swap management module detects the plug-in signal, turn on the power switch of 5V Standby (Standby power supply is sometimes called management power supply), and light up the hot-swap indicator light.

Close the panel handle (the panel handle is connected to the micro switch), and when the hot-swap management module detects that the micro switch is closed, it will control the hot-swap indicator light to flash, indicating that the rear board is requesting activation.

The hot swap management module reports the power-on request of the rear board to the system management center. The system management center issues a command to the hot-swap management module to turn on the I2C bus switch, and the hot-swap management module reads the board information (such as manufacturer, production date, software version, etc.) of the rear board through the I2C bus, and then reports it to the system control center.

The system management center judges whether the board is matched according to the reported board information, and then decides whether to power on the rear board, and the rear board enters the ready-to-activate state. If the single board is matched, the system management center will issue an order to let the hot-swappable management module turn on the main power supply (12V) switch, and convert various voltages required by the rear board through the voltage adjustment module, and the rear board enters the active state, and at the same time Turn off the hot-plug indicator.

The power-off process when unplugging is as follows:

When the rear board needs to be pulled out from the front board, the hot-swappable management module first reports the power-off request of the rear board to the system management center; after receiving the power-off request, the system management center first stops the rear board service, or switch the service to the standby unit, and then instruct the hot-swappable management module to stop supplying power to the voltage adjustment module corresponding to the corresponding rear board; after the power supply is stopped, the rear board can be safely pulled out.

The specific process is shown in Figure 8. When the rear board is in the active state, turn on the micro switch, the rear board enters the power-off request state, and the hot-swap management module controls the hot-swap indicator light to flash.

The hot-swappable management module reports to the system management center the request for power-off of the rear board, and notifies the system to stop the business on the rear board, or to switch the business to the standby unit and wait for the power-off preparation. At this time, the rear board enters the cancellation service preparation Power-off state.

After the system management center completes the power-off processing, it sends a power-off command to the hot-swap management module, and the hot-swap management module turns off the I2C bus switch and the main power supply (12V) switch.

The hot-swap management module controls the hot-swap indicator to stop blinking.

Pull out the rear board, and turn off the 5V standby power switch of the hot-swappable management module.

The above is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed in the present invention can easily think of changes or Replacement should be covered within the protection scope of the present invention.

Claims (9)

1, a kind of circuit board assemblies comprises front card and back card/back board, and front card and back card/back board are pegged graft, and it is characterized in that described back card/back board is provided with independent structures fabric plane module, is used to realize that the exchange at business datum handles;

Described front card and back card/back board splicing position are provided with hot plug connector;

Described back card/back board is provided with voltage regulator module, is used to back card/back board that various voltages are provided; Described front card is provided with the hot plug administration module, is electrically connected with voltage regulator module by hot plug connector, and according to the plug State Control of described back card/back board voltage regulator module is powered or outage.

2, circuit board assemblies according to claim 1 is characterized in that, described structural plan module comprises gigabit Ethernet control chip and optical-fibre channel control chip; Described gigabit Ethernet control chip and optical-fibre channel control chip respectively be arranged at front card on the bridge sheet be connected.

3, circuit board assemblies according to claim 1 and 2 is characterized in that, also comprises basic base plane module, is used to realize the exchange of management data is handled, and described basic plane module is positioned on the front card; Perhaps described basic plane module is the buckle shape, snaps onto on the front card by connector; Perhaps, described basic plane module is the plug-in card shape, is plugged on the front card.

4, circuit board assemblies according to claim 1 and 2 is characterized in that, described structural plan module is the buckle shape, snaps onto on the back card/back board by connector; Perhaps, described structural plan module is the plug-in card shape, is plugged on the back card/back board.

5, circuit board assemblies according to claim 1 and 2 is characterized in that, described circuit board assemblies has a plurality of, and is connected by backboard between a plurality of circuit board assemblies.

6, circuit board assemblies according to claim 1 is characterized in that, heat is inserted and comprised step between described front card and the back card/back board:

When front card inserted back card/back board, the hot plug administration module was determined the insertion of back card/back board safety, and reported the request of powering on of back card/back board to the system management center;

After the described request of powering on was received at the system management center, instruction hot plug administration module was to the voltage regulator module power supply of described back card/back board correspondence;

Voltage regulator module get electric after, change out the required various voltages of back card/back board, activate back card/back board.

7, circuit board assemblies according to claim 6 is characterized in that, after the described request of powering on is received at the system management center, also comprises step:

Instruction hot plug administration module reads the essential information of back card/back board, and essential information is uploaded to the system management center;

The system management center judges by essential information whether back card/back board is supporting with front card, if do not match then stop hot plug, if supporting then instruct the voltage regulator module power supply of hot plug administration module to corresponding back card/back board correspondence.

8, circuit board assemblies according to claim 1 is characterized in that, hot drawing goes out to comprise step between described front card and the back card/back board:

The hot plug administration module at first reports the following electricity request of back card/back board to the system management center;

After the system management center received described electricity request down, instruction hot plug administration module stopped the voltage regulator module power supply to corresponding back card/back board correspondence.

9, circuit board assemblies according to claim 8 is characterized in that, after the request of described electricity is down received at the system management center, also comprises step:

At first stop the business of back card/back board, or allow business switch to stand-by unit, then, instruction hot plug administration module stops the voltage regulator module power supply to corresponding back card/back board correspondence.

Images