TWI493107B - System and method for position control of a mechanical piston in a pump - Google Patents

System and method for position control of a mechanical piston in a pump Download PDF

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Publication number
TWI493107B
TWI493107B TW102126755A TW102126755A TWI493107B TW I493107 B TWI493107 B TW I493107B TW 102126755 A TW102126755 A TW 102126755A TW 102126755 A TW102126755 A TW 102126755A TW I493107 B TWI493107 B TW I493107B
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TW
Taiwan
Prior art keywords
pump
motor
frequency
dispensing
brushless
Prior art date
Application number
TW102126755A
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Chinese (zh)
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TW201350680A (en
Inventor
Gonnella George
Cedrone James
Gashgaee Iraj
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from PCT/US2005/042127 external-priority patent/WO2006057957A2/en
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of TW201350680A publication Critical patent/TW201350680A/en
Application granted granted Critical
Publication of TWI493107B publication Critical patent/TWI493107B/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/06Control using electricity
    • F04B49/065Control using electricity and making use of computers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/06Control using electricity
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B13/00Pumps specially modified to deliver fixed or variable measured quantities
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B17/00Pumps characterised by combination with, or adaptation to, specific driving engines or motors
    • F04B17/03Pumps characterised by combination with, or adaptation to, specific driving engines or motors driven by electric motors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00Machines, pumps, or pumping installations having flexible working members
    • F04B43/0009Special features
    • F04B43/0081Special features systems, control, safety measures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00Machines, pumps, or pumping installations having flexible working members
    • F04B43/02Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B2201/00Pump parameters
    • F04B2201/02Piston parameters
    • F04B2201/0201Position of the piston
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B2201/00Pump parameters
    • F04B2201/12Parameters of driving or driven means
    • F04B2201/1208Angular position of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Reciprocating Pumps (AREA)
  • Control Of Positive-Displacement Pumps (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

用於在一幫浦中一機械活塞之位置控制之系統及方法System and method for position control of a mechanical piston in a pump

本發明大體而言係關於流體幫浦。更明確地說,本發明之實施例係關於用於在適用於半導體製造中之馬達驅動單級或多級幫浦中一機械活塞之位置控制之系統及方法。The invention generally relates to fluid pumps. More specifically, embodiments of the present invention relate to systems and methods for position control of a mechanical piston in a motor-driven single or multi-stage pump suitable for use in semiconductor manufacturing.

存在對流體被幫浦裝置施配之量及/或速率之精確控制為必要的許多應用。例如,在半導體處理中,重要的係控制諸如光阻化學品之光化學品塗覆至半導體晶圓之量及速率。在處理期間塗覆至半導體晶圓之塗層通常需要以埃為單位而量測的在整個晶圓之表面上之某一平坦度及/或均勻厚度。必須仔細地控制處理化學品塗覆(亦即,施配)至晶圓上之速率以確保均勻地塗覆處理液體。There are many applications where precise control of the amount and/or rate of fluid being dispensed by the pumping device is necessary. For example, in semiconductor processing, it is important to control the amount and rate at which a photochemical such as a photoresist chemical is applied to a semiconductor wafer. Coatings applied to semiconductor wafers during processing typically require some flatness and/or uniform thickness across the surface of the wafer as measured in angstroms. The rate at which the chemical coating (i.e., dispensing) is applied to the wafer must be carefully controlled to ensure uniform application of the treatment liquid.

用於半導體工業中之光化學品現今通常係極昂貴的,每公升花費多達$1000及以上。因此,高度需要確保使用最小但充足量之化學品且確保化學品不受到幫浦裝置之損害。Photochemicals used in the semiconductor industry are now extremely expensive, costing up to $1000 per liter and more. Therefore, it is highly desirable to ensure that a minimum but sufficient amount of chemicals is used and that the chemicals are not damaged by the pumping device.

不幸地是,此等所需品質可由於許多相關障礙而極難以在現今之幫浦系統中達成。例如,歸因於引入之供應問題,壓力可隨不同系統而變化。歸因於流體動力學及特性,壓力需要隨不同流體而變化(例如,具有較高黏度之流體需要較多壓力)。在操作中,來自幫浦系統(例如,步進馬達)之各種部分的振動尤其在施配階段中可能會不利 地影響幫浦系統之效能。在利用氣動幫浦之幫浦系統中,當出現螺線管時,其可導致大的壓力尖峰。在利用多級幫浦之幫浦系統中,操作中之小假信號(glitch)亦可導致液體中之尖銳壓力尖峰。此等壓力尖峰及後續之壓降可損害流體(亦即,可不利地改變流體之物理特徵)。此外,壓力尖峰可導致積聚流體壓力,其可導致施配幫浦施配比所欲流體多的流體或以具有不利動力學之方式來施配流體。此外,因為此等障礙係相關的,所以解決一個障礙有時可能會導致許多其他問題及/或使問題更惡化。Unfortunately, these qualities are extremely difficult to achieve in today's pumping systems due to many related obstacles. For example, due to the supply issues introduced, the pressure can vary from system to system. Due to fluid dynamics and properties, the pressure needs to vary with different fluids (for example, fluids with higher viscosities require more pressure). In operation, vibrations from various parts of the pump system (eg, stepper motors) may be disadvantageous especially during the dispensing phase. The ground affects the effectiveness of the pump system. In a pump system that utilizes a pneumatic pump, when a solenoid is present, it can cause large pressure spikes. In a multi-stage pump system, the small glitches in operation can also cause sharp pressure spikes in the liquid. These pressure spikes and subsequent pressure drops can damage the fluid (i.e., can adversely alter the physical characteristics of the fluid). In addition, pressure spikes can result in accumulated fluid pressure that can cause the dispensed pump to dispense more fluid than desired or dispense fluid in a manner that is unfavorable. In addition, because these obstacles are related, solving one obstacle can sometimes lead to many other problems and/or worsen the problem.

通常,幫浦系統在一循環內不能令人滿意地控制壓力變化。存在對新穎幫浦系統之需要,該新穎幫浦系統具有提供即時平穩運動及對流體移動與施配量之極精確並可重複之位置控制的能力。詳言之,存在對在一幫浦中一機械活塞之精確且可重複之位置控制的需要。本發明之實施例可解決該等需要及更多需要。In general, the pump system does not satisfactorily control pressure changes in a cycle. There is a need for a novel pumping system that has the ability to provide instant smooth motion and extremely precise and repeatable position control of fluid movement and dispensing. In particular, there is a need for precise and repeatable position control of a mechanical piston in a pump. Embodiments of the present invention address these needs and more.

本發明之實施例提供用於在一幫浦中一機械活塞之精確且可重複之位置控制之系統及方法,其大體上消除或減少用於半導體製造中之先前所開發之幫浦系統及方法的缺點。更明確地說,本發明之實施例提供一具有馬達驅動幫浦之幫浦系統。Embodiments of the present invention provide systems and methods for precise and repeatable position control of a mechanical piston in a pump that substantially eliminates or reduces previously developed pump systems and methods for use in semiconductor manufacturing Shortcomings. More specifically, embodiments of the present invention provide a pump system having a motor driven pump.

在本發明之一實施例中,馬達驅動幫浦為一施配幫浦。In one embodiment of the invention, the motor-driven pump is a dispensing pump.

在本發明之實施例中,施配幫浦可為多級或單級幫浦之一部分。In an embodiment of the invention, the dispensing pump can be part of a multi-stage or single-stage pump.

在本發明之一實施例中,一雙級施配幫浦藉由一永磁同步馬達(PMSM)及一利用場導向控制(FOC)之數位信號處理器(DSP)來驅動。In one embodiment of the invention, a dual stage dispensing pump is driven by a permanent magnet synchronous motor (PMSM) and a digital signal processor (DSP) utilizing field oriented control (FOC).

在本發明之一實施例中,施配幫浦藉由一具有一用於即時位置回饋之位置感應器的無刷DC馬達(BLDCM)來驅動。In one embodiment of the invention, the dispensed pump is driven by a brushless DC motor (BLDCM) having a position sensor for instant position feedback.

本文中所揭示之本發明之實施例的優點包括提供即時平穩運動 及對流體移動與施配量之極精確並可重複之位置控制的能力。Advantages of embodiments of the invention disclosed herein include providing immediate smooth motion And the ability to accurately and repeat position control of fluid movement and dispensing.

本發明之一目標為在無不良地損害施配幫浦之精確位置控制的情況下減少熱產生。此目標藉由一定製控制機制而可在本發明之實施例中達成,該定製控制機制經組態以增加用於決定性功能(諸如施配)之馬達之位置控制演算法的操作頻率及將操作頻率降低至用於非決定性功能之最佳範圍。One of the objectives of the present invention is to reduce heat generation without adversely damaging the precise positional control of the dispensed pump. This goal can be achieved in an embodiment of the invention by a custom control mechanism configured to increase the operating frequency of the position control algorithm of the motor for decisive functions (such as dispensing) and The operating frequency is reduced to the optimum range for non-deterministic functions.

由本發明之實施例所提供之另一優點為增強之速度控制。本文中所揭示之定製控制機制可使馬達以極低速度運轉且仍維持一恆定速度,此使本文中所揭示之新穎幫浦系統能夠以最小變化而在一寬廣速度範圍內操作,從而大體上增加了施配效能及操作能力。Another advantage provided by embodiments of the present invention is enhanced speed control. The custom control mechanism disclosed herein allows the motor to operate at very low speeds while still maintaining a constant speed, which enables the novel pump system disclosed herein to operate with a minimum variation over a wide range of speeds, thereby generally Increased dispensing efficiency and operational capability.

10‧‧‧幫浦系統10‧‧‧ pump system

15‧‧‧流體源15‧‧‧ Fluid source

20‧‧‧幫浦控制器20‧‧‧ pump controller

25‧‧‧晶圓25‧‧‧ Wafer

27‧‧‧電腦可讀媒體27‧‧‧ Computer readable media

30‧‧‧控制指令30‧‧‧Control instructions

35‧‧‧處理器35‧‧‧ Processor

40‧‧‧通信鏈路40‧‧‧Communication link

45‧‧‧通信鏈路45‧‧‧Communication link

100‧‧‧多級幫浦100‧‧‧Multi-level pump

105‧‧‧饋入級部分105‧‧‧Feed-level part

110‧‧‧施配級部分110‧‧‧Sorting part

112‧‧‧壓力感應器112‧‧‧pressure sensor

120‧‧‧過濾器120‧‧‧Filter

125‧‧‧入口閥125‧‧‧Inlet valve

130‧‧‧隔離閥130‧‧‧Isolation valve

135‧‧‧阻障閥135‧‧‧Resistance valve

140‧‧‧淨化閥140‧‧‧purification valve

145‧‧‧排放閥145‧‧‧Drain valve

147‧‧‧出口閥147‧‧‧Export valve

150‧‧‧饋入級幫浦150‧‧‧Feed-level pump

155‧‧‧饋入腔室155‧‧‧Feed into the chamber

160‧‧‧饋入級隔膜160‧‧‧Feed-in diaphragm

165‧‧‧活塞165‧‧‧Piston

170‧‧‧導螺桿170‧‧‧ lead screw

175‧‧‧饋入馬達175‧‧‧Feeding motor

180‧‧‧施配級幫浦180‧‧‧Gate level pump

185‧‧‧施配腔室185‧‧‧Matching chamber

190‧‧‧施配級隔膜190‧‧‧ dispensed diaphragm

192‧‧‧活塞192‧‧‧Piston

195‧‧‧導螺桿195‧‧‧ lead screw

200‧‧‧施配馬達200‧‧‧ dispensed motor

3000‧‧‧馬達總成3000‧‧‧Motor assembly

3010‧‧‧隔膜總成3010‧‧‧Separator assembly

3020‧‧‧導螺桿3020‧‧‧ lead screw

3030‧‧‧馬達3030‧‧‧Motor

3040‧‧‧位置感應器3040‧‧‧ position sensor

4000‧‧‧幫浦4000‧‧‧ pump

4005‧‧‧施配區塊4005‧‧‧ allocation block

4010‧‧‧入口4010‧‧‧ entrance

4015‧‧‧淨化/排放出口4015‧‧‧purification/discharge exit

4020‧‧‧施配出口4020‧‧‧ dispensed exports

4025‧‧‧幫浦蓋4025‧‧‧帮浦盖

4027‧‧‧活塞外殼4027‧‧‧ piston housing

4030‧‧‧閥板4030‧‧‧Valve plate

圖1為根據本發明之一實施例之具有無刷DC馬達之馬達總成的圖示;圖2為根據本發明之一實施例之實施無刷DC馬達之多級幫浦的圖示;圖3為根據本發明之一實施例之實施多級幫浦之幫浦系統的圖示;圖4為用於本發明之一實施例之閥門及馬達時序的圖示;圖5為根據本發明之一實施例比較無刷DC馬達與步進馬達之平均轉矩輸出及速度範圍的曲線圖;圖6為根據本發明之一實施例比較無刷DC馬達與步進馬達之間的平均馬達電流及負載的曲線圖;圖7為展示30kHz馬達操作與10kHz馬達操作之間的差異的曲線圖;圖8為根據本發明之一實施例說明無刷DC馬達與步進馬達在各種級中之循環時序的流程圖; 圖9為根據本發明之一實施例例示步進馬達與無刷DC馬達在過濾過程開始時之壓力控制時序的流程圖;及圖10為根據本發明之一實施例之實施無刷DC馬達之單級幫浦的圖示。1 is a diagram of a motor assembly having a brushless DC motor in accordance with an embodiment of the present invention; and FIG. 2 is a diagram of a multi-stage pump implementing a brushless DC motor in accordance with an embodiment of the present invention; 3 is a diagram of a pumping system for implementing a multi-stage pump according to an embodiment of the present invention; FIG. 4 is a diagram showing the timing of valves and motors used in an embodiment of the present invention; FIG. 5 is a diagram of a valve and a motor according to an embodiment of the present invention; An embodiment compares a graph of average torque output and speed range of a brushless DC motor and a stepper motor; FIG. 6 is a graph comparing average motor current between a brushless DC motor and a stepper motor according to an embodiment of the present invention; FIG. 7 is a graph showing the difference between a 30 kHz motor operation and a 10 kHz motor operation; FIG. 8 is a timing diagram illustrating a brushless DC motor and a stepping motor in various stages according to an embodiment of the present invention; Flow chart 9 is a flow chart illustrating pressure control timing of a stepping motor and a brushless DC motor at the beginning of a filtering process according to an embodiment of the present invention; and FIG. 10 is a diagram of a brushless DC motor according to an embodiment of the present invention. An illustration of a single-stage pump.

本發明之較佳實施例在下文中參看諸圖來描述,該等圖未必按比例繪製且其中相似數字用以指代各種圖式之相似且對應之部分。The preferred embodiments of the present invention are described with reference to the drawings, which are not necessarily to

本發明之實施例係針對一具有多級幫浦之幫浦系統,其用於在半導體製造期間將流體饋入且施配至晶圓上。具體而言,本發明之實施例提供一實施多級幫浦之幫浦系統,該多級幫浦包含一藉由一步進馬達驅動之饋入級幫浦及一藉由一無刷DC馬達驅動之施配級幫浦,以用於對流體至晶圓上之流體移動及施配量之極準確且可重複的控制。應注意,如本文中所述之多級幫浦及體現此幫浦之幫浦系統僅以實例方式而非限制方式來提供,且本發明之實施例可經實施用於其他多級幫浦組態。將在下文中更詳細地描述具有精確且可重複之位置控制的馬達驅動幫浦系統之實施例。Embodiments of the present invention are directed to a pumping system having a multi-stage pump for feeding and dispensing fluid onto a wafer during semiconductor fabrication. Specifically, an embodiment of the present invention provides a pumping system for implementing a multi-stage pump, the multi-stage pump including a feed stage pump driven by a stepping motor and a brushless DC motor driven A graded pump is used for extremely accurate and repeatable control of fluid movement and dosing of fluid onto the wafer. It should be noted that the multi-stage pump as described herein and the pump system embodying the pump are provided by way of example only and not limitation, and embodiments of the invention may be implemented for other multi-stage pump groups state. Embodiments of a motor driven pump system with precise and repeatable position control will be described in more detail below.

圖1為根據本發明之一實施例之具有馬達3030及與其耦接之位置感應器3040之馬達總成3000的示意圖。在圖1中所示之實例中,隔膜總成3010經由導螺桿3020而連接至馬達3030。在一實施例中,馬達3030為永磁同步馬達("PMSM")。在一有刷DC馬達中,電流極性藉由整流器及電刷來改變。然而,在PMSM中,極性反轉藉由與轉子位置同步而切換之功率電晶體來執行。因此,PMSM之特徵可在於"無刷"且被認為比有刷DC馬達可靠。此外,PMSM可藉由以轉子磁鐵來產生轉子磁通量而達成較高效率。PMSM之其他優點包括減少之振動、減少之雜訊(藉由消除電刷)、有效之散熱、較小之佔據面積及低轉子慣性。視如何纏繞定子而定,藉由轉子之運動而在定子中誘發的反電 磁力可具有不同輪廓。一輪廓可具有梯形形狀且另一輪廓可具有正弦形狀。在本揭示案內,術語PMSM意欲表示所有類型之無刷永磁馬達且可與術語無刷DC馬達("BLDCM")互換地使用。1 is a schematic diagram of a motor assembly 3000 having a motor 3030 and a position sensor 3040 coupled thereto in accordance with an embodiment of the present invention. In the example shown in FIG. 1, diaphragm assembly 3010 is coupled to motor 3030 via lead screw 3020. In an embodiment, the motor 3030 is a permanent magnet synchronous motor ("PMSM"). In a brushed DC motor, the current polarity is varied by a rectifier and a brush. However, in the PMSM, polarity inversion is performed by a power transistor that is switched in synchronization with the rotor position. Therefore, the PMSM can be characterized as "brushless" and is considered to be more reliable than a brushed DC motor. In addition, the PMSM can achieve higher efficiency by generating rotor flux with a rotor magnet. Other advantages of PMSM include reduced vibration, reduced noise (by eliminating brushes), efficient heat dissipation, low footprint, and low rotor inertia. Depending on how the stator is wound, the anti-electricity induced in the stator by the motion of the rotor The magnetic force can have different contours. One profile may have a trapezoidal shape and the other profile may have a sinusoidal shape. Within the present disclosure, the term PMSM is intended to mean all types of brushless permanent magnet motors and can be used interchangeably with the term brushless DC motor ("BLDCM").

在本發明之實施例中,BLDCM 3030可用作諸如圖2中所示之多級幫浦100之幫浦中的饋入馬達及/或施配馬達。在此實例中,多級幫浦100可包括一饋入級部分105及一單獨施配級部分110。饋入級105及施配級110可包括滾動隔膜幫浦以在多級幫浦100中幫浦流體。例如,饋入級幫浦150("饋入幫浦150")包括:一饋入腔室155,其用以收集流體;一饋入級隔膜160,其用以在饋入腔室155內移動並排出流體;一活塞165,其用以移動饋入級隔膜160;一導螺桿170;及一饋入馬達175。導螺桿170經由螺帽、齒輪或用於將來自馬達之能量賦予導螺桿170的其他機構而耦接至饋入馬達175。饋入馬達175使螺帽旋轉,該螺帽又使導螺桿170旋轉,從而導致活塞165致動。饋入馬達175可為任何適當馬達(例如,步進馬達、BLDCM,等等)。在本發明之一實施例中,饋入馬達175實施一步進馬達。In an embodiment of the invention, the BLDCM 3030 can be used as a feed motor and/or a dosing motor in a pump such as the multi-stage pump 100 shown in FIG. In this example, multi-stage pump 100 can include a feed stage portion 105 and a separate dispense stage portion 110. The feed stage 105 and the dispense stage 110 can include a rolling diaphragm pump to pump fluid in the multi-stage pump 100. For example, the feed stage pump 150 ("Feed Pump 150") includes a feed chamber 155 for collecting fluid and a feed stage diaphragm 160 for moving within the feed chamber 155. And discharging the fluid; a piston 165 for moving the feed stage diaphragm 160; a lead screw 170; and a feed motor 175. The lead screw 170 is coupled to the feed motor 175 via a nut, a gear, or other mechanism for imparting energy from the motor to the lead screw 170. Feeding motor 175 rotates the nut, which in turn rotates lead screw 170, causing piston 165 to actuate. Feed motor 175 can be any suitable motor (eg, stepper motor, BLDCM, etc.). In one embodiment of the invention, feed motor 175 implements a stepper motor.

施配級幫浦180("施配幫浦180")可包括一施配腔室185、一施配級隔膜190、一活塞192、一導螺桿195及一施配馬達200。施配馬達200可為任何適當馬達,包括BLDCM。在本發明之一實施例中,施配馬達200實施圖1之BLDCM 3030。施配馬達200可藉由在施配馬達200處利用場導向控制("FOC")之數位信號處理器("DSP")、藉由多級幫浦100載有之控制器或藉由(例如,在幫浦100外部的)單獨幫浦控制器來控制。施配馬達200可進一步包括一用於施配馬達200之位置之即時回饋的編碼器(例如,細線旋轉位置編碼器或位置感應器3040)。使用位置感應器會給予活塞192之位置之準確且可重複的控制,此導致對施配腔室185中之流體移動之準確且可重複的控制。例如,藉由使用根據一實施例將8000個脈衝給予DSP之2000線編碼器,有可能準確地量 測至0.045度之旋轉並在0.045度之旋轉下控制。此外,BLDCM可以少量振動或無振動而以低速度運轉。施配級部分110可進一步包括一壓力感應器112,其判定流體在施配級110處之壓力。由壓力感應器112所判定之壓力可用以控制各種幫浦之速度。適當壓力感應器包括基於陶瓷及基於聚合物之壓阻性及電容性壓力感應器,包括由德國Korb之Metallux AG所製造的壓力感應器。The dispensing stage 180 ("spreading pump 180") can include a dispensing chamber 185, a dispensing stage diaphragm 190, a piston 192, a lead screw 195, and a dispensing motor 200. The mating motor 200 can be any suitable motor, including a BLDCM. In one embodiment of the invention, the dispensing motor 200 implements the BLDCM 3030 of FIG. The mating motor 200 can be utilized by a digital signal processor ("DSP") using field oriented control ("FOC") at the dispensing motor 200, by a controller carried by the multi-stage pump 100, or by (eg , controlled by a separate pump controller outside the pump 100. The mating motor 200 can further include an encoder (e.g., a fine line rotational position encoder or position sensor 3040) for applying instant feedback of the position of the motor 200. The use of a position sensor imparts accurate and repeatable control of the position of the piston 192, which results in accurate and repeatable control of fluid movement in the dispensing chamber 185. For example, by using a 2000 line encoder that gives 8000 pulses to the DSP in accordance with an embodiment, it is possible to accurately quantify The rotation to 0.045 degrees was measured and controlled under a rotation of 0.045 degrees. In addition, BLDCM can operate at low speed with little or no vibration. The dispensing stage portion 110 can further include a pressure sensor 112 that determines the pressure of the fluid at the dispensing stage 110. The pressure determined by the pressure sensor 112 can be used to control the speed of various pumps. Suitable pressure sensors include ceramic-based and polymer-based piezoresistive and capacitive pressure sensors, including pressure sensors manufactured by Metallux AG of Korb, Germany.

自流體流動的觀點,位於饋入級部分105與施配級部分110之間的係過濾器120,其用以過濾來自處理流體之雜質。許多閥門(例如,入口閥125、隔離閥130、阻障閥135、淨化閥140、排放閥145及出口閥147)可經適當地定位以控制流體如何流過多級幫浦100。打開或關閉多級幫浦100之閥門以允許或限制流體流動至多級幫浦100之各種部分。此等閥門可為氣動致動的(例如,氣體驅動的)隔膜閥,其視確定了壓力還是真空而打開或關閉。其他適當閥門係可能的。From the point of view of fluid flow, a filter 120 is positioned between the feed stage portion 105 and the dispense stage portion 110 for filtering impurities from the process fluid. A number of valves (eg, inlet valve 125, isolation valve 130, barrier valve 135, purge valve 140, drain valve 145, and outlet valve 147) may be suitably positioned to control how fluid flows through the multi-stage pump 100. The valves of the multi-stage pump 100 are opened or closed to allow or restrict fluid flow to various portions of the multi-stage pump 100. These valves may be pneumatically actuated (e.g., gas actuated) diaphragm valves that open or close depending on whether pressure or vacuum is determined. Other suitable valves are possible.

在操作中,多級幫浦100可包括就緒段、施配段、填充段、預過濾段、過濾段、排放段、淨化段及靜態淨化段(見圖4)。在饋入段期間,打開入口閥125,且饋入級幫浦150移動(例如,拉動)饋入級隔膜160以將流體吸入至饋入腔室155中。一旦充足量之流體已填充饋入腔室155,即關閉入口閥125。在過濾段期間,饋入級幫浦150移動饋入級隔膜160以自饋入腔室155排出流體。打開隔離閥130及阻障閥135以允許流體穿過過濾器120而流至施配腔室185。根據一實施例,可首先打開隔離閥130(例如,在“預過濾段”中)以允許壓力建置於過濾器120中,且接著打開阻障閥135以允許流體流入施配腔室185中。根據其他實施例,可打開隔離閥130及阻障閥135,且可移動饋入幫浦以在過濾器之施配側上建置壓力。在過濾段期間,可使施配幫浦180到達其原位。如皆以引用的方式併入本文的由Laverdiere等人在2004年11月23日申請之標題為"SYSTEM AND METHOD FOR A VARIABLE HOME POSITION DISPENSE SYSTEM"的美國臨時專利申請案第60/630,384號及由Laverdiere等人在2005年11月21日申請之標題為"SYSTEM AND METHOD FOR VARIABLE HOME POSITION DISPENSE SYSTEM"的國際申請案第PCT/US2005/042127號以及2008年9月30日申請之對應美國國家階段申請案第11/666,124號中所述,施配幫浦之原位可為在施配循環中在施配幫浦處給予最大可用容積但小於施配幫浦可提供之最大可用容積的位置。基於施配循環之各種參數來選擇原位以減小多級幫浦100之未使用的滯留容積(hold up volume)。可使饋入幫浦150類似地到達提供小於其最大可用容積之容積的原位。In operation, the multi-stage pump 100 may include a ready section, a dispensing section, a filling section, a pre-filtration section, a filtration section, a discharge section, a purification section, and a static purification section (see FIG. 4). During the feed section, the inlet valve 125 is opened and the feed stage pump 150 moves (eg, pulls) the feed stage diaphragm 160 to draw fluid into the feed chamber 155. Once a sufficient amount of fluid has filled the feed chamber 155, the inlet valve 125 is closed. During the filtration section, the feed stage pump 150 moves into the stage diaphragm 160 to discharge fluid from the feed chamber 155. The isolation valve 130 and the barrier valve 135 are opened to allow fluid to pass through the filter 120 to the dispensing chamber 185. According to an embodiment, the isolation valve 130 may be first opened (eg, in a "pre-filter section") to allow pressure to be built into the filter 120, and then the barrier valve 135 is opened to allow fluid to flow into the dispensing chamber 185 . According to other embodiments, the isolation valve 130 and the barrier valve 135 can be opened and the feed pump can be moved to build pressure on the mating side of the filter. During the filtration section, the dispensing pump 180 can be brought to its home position. The title of "SYSTEM AND METHOD FOR A VARIABLE HOME", filed on November 23, 2004 by Laverdiere et al., is incorporated herein by reference. POSITION DISPENSE SYSTEM, US Provisional Patent Application No. 60/630,384, and International Application No. PCT/US2005 entitled "SYSTEM AND METHOD FOR VARIABLE HOME POSITION DISPENSE SYSTEM", filed November 29, 2005 by Laverdiere et al. /042127 and the corresponding US National Phase Application No. 11/666,124, filed on September 30, 2008, the placement of the pump can be used to maximize the availability of the pump in the dispensing cycle. The volume is less than the position of the maximum available volume that can be supplied by the pump. The home position is selected based on various parameters of the dispense cycle to reduce the unused hold up volume of the multi-stage pump 100. The inlet pump 150 similarly reaches an in situ position that provides a volume that is less than its maximum available volume.

隨著流體流入施配腔室185中,流體之壓力增加。如皆以引用的方式併入本文的由Gonnella等人在2005年12月2日申請之標題為"SYSTEM AND METHOD FOR CONTROL OF FLUID PRESSURE"的美國專利申請案第11/292,559號(現已核准)中所述,施配腔室185中之壓力可藉由調節饋入幫浦150之速度來控制。根據本發明之一實施例,當施配腔室185中之流體壓力達到預定壓力設定點(例如,如由壓力感應器112所判定)時,施配級幫浦180開始撤回施配級隔膜190。換言之,施配級幫浦180增加施配腔室185之可用容積以允許流體流入施配腔室185中。此可(例如)藉由以預定速率來反轉施配馬達200而加以完成,從而導致施配腔室185中之壓力降低。若施配腔室185中之壓力降至設定點以下(在系統之容限內),則增加饋入馬達175之速率以導致施配腔室185中之壓力達到設定點。若壓力超過設定點(在系統之容限內),則減小饋入馬達175之速率,從而導致下游施配腔室185中之壓力減少。可重複增加及減小饋入馬達175之速度的過程,直至施配級幫浦到達原位,此時可停止兩個馬達。As the fluid flows into the dispensing chamber 185, the pressure of the fluid increases. U.S. Patent Application Serial No. 11/292,559, entitled "SYSTEM AND METHOD FOR CONTROL OF FLUID PRESSURE", filed on December 2, 2005, by the name of the s. As described, the pressure in the dispensing chamber 185 can be controlled by adjusting the speed of the feed to the pump 150. In accordance with an embodiment of the present invention, when the fluid pressure in the dispensing chamber 185 reaches a predetermined pressure set point (e.g., as determined by the pressure sensor 112), the dispensing stage pump 180 begins to withdraw the dispensing stage diaphragm 190. . In other words, the dispensing stage pump 180 increases the available volume of the dispensing chamber 185 to allow fluid to flow into the dispensing chamber 185. This can be accomplished, for example, by reversing the dispensing motor 200 at a predetermined rate, resulting in a decrease in pressure in the dispensing chamber 185. If the pressure in the dispensing chamber 185 falls below the set point (within the tolerance of the system), the rate of feed into the motor 175 is increased to cause the pressure in the dispensing chamber 185 to reach the set point. If the pressure exceeds the set point (within the tolerance of the system), the rate of feed into the motor 175 is reduced, resulting in a decrease in pressure in the downstream dispensing chamber 185. The process of increasing and decreasing the speed of feeding into the motor 175 can be repeated until the dispensing stage pump reaches the home position, at which point the two motors can be stopped.

根據另一實施例,在過濾段期間第一級馬達之速度可使用"死帶"(dead band)控制機制來控制。當施配腔室185中之壓力達到初始臨限 值時,施配級幫浦可移動施配級隔膜190以允許流體更自由地流入施配腔室185中,藉此導致施配腔室185中之壓力下降。若壓力下降至最小壓力臨限值以下,則增加饋入馬達175之速度,從而導致施配腔室185中之壓力增加。若施配腔室185中之壓力增加至超出最大壓力臨限值,則減小饋入馬達175之速度。此外,可重複增加及減小饋入馬達175之速度的過程,直至施配級幫浦到達原位。According to another embodiment, the speed of the first stage motor during the filter segment can be controlled using a "dead band" control mechanism. When the pressure in the dispensing chamber 185 reaches the initial threshold In the event of a value, the dispensing stage pump can move the staged diaphragm 190 to allow fluid to flow more freely into the dispensing chamber 185, thereby causing a drop in pressure in the dispensing chamber 185. If the pressure drops below the minimum pressure threshold, the rate of feed into the motor 175 is increased, resulting in an increase in pressure in the dispensing chamber 185. If the pressure in the dispensing chamber 185 increases beyond the maximum pressure threshold, the rate of feed to the motor 175 is reduced. In addition, the process of increasing and decreasing the speed of feeding into the motor 175 can be repeated until the dispensing stage pump reaches the home position.

在排放段之開始時,打開隔離閥130,關閉阻障閥135且打開排放閥145。在另一實施例中,阻障閥135可在排放段期間保持打開且在排放段之結束時關閉。在此時間期間,若阻障閥135打開,則壓力可被控制器獲悉,因為可藉由壓力感應器112而量測之施配腔室中之壓力將受到過濾器120中之壓力的影響。饋入級幫浦150將壓力施加至流體以經由打開之排放閥145而自過濾器120移除氣泡。饋入級幫浦150可經控制以導致以預定速率而發生排放,此允許較長之排放時間及較低之排放速率,藉此允許對排放廢物量之準確控制。若饋入幫浦為氣動式幫浦,則可在排放流體路徑中進行流體流動限制,且可增加或減小施加至饋入幫浦之氣壓以維持"排放"設定點壓力,從而給予另外未受控制之方法的某一控制。At the beginning of the discharge section, the isolation valve 130 is opened, the barrier valve 135 is closed and the discharge valve 145 is opened. In another embodiment, the barrier valve 135 can remain open during the discharge section and closed at the end of the discharge section. During this time, if the barrier valve 135 is open, the pressure can be learned by the controller because the pressure in the dispensing chamber that can be measured by the pressure sensor 112 will be affected by the pressure in the filter 120. The feed stage pump 150 applies pressure to the fluid to remove air bubbles from the filter 120 via the open discharge valve 145. The feed stage pump 150 can be controlled to cause emissions to occur at a predetermined rate, which allows for longer discharge times and lower discharge rates, thereby allowing for accurate control of the amount of waste discharged. If the feed pump is a pneumatic pump, fluid flow restriction can be made in the discharge fluid path, and the pressure applied to the feed pump can be increased or decreased to maintain the "emission" set point pressure, thereby giving another A certain control of the method being controlled.

在淨化段之開始時,關閉隔離閥130,關閉阻障閥135(若其在排放段中打開),關閉排放閥145,且打開淨化閥140並打開入口閥125。施配幫浦180將壓力施加至施配腔室185中之流體以經由淨化閥140而排放氣泡。在靜態淨化段期間,停止施配幫浦180,但淨化閥140保持打開以繼續排放空氣。在淨化或靜態淨化段期間所移除之任何過量流體可被導引出多級幫浦100(例如,返回至流體源或丟棄)或再循環至饋入級幫浦150。在就緒段期間,可打開入口閥125、隔離閥130及阻障閥135且關閉淨化閥140,使得饋入級幫浦150可達到來源(例如,來源瓶)之周圍壓力。根據其他實施例,可在就緒段處關閉所有閥門。At the beginning of the purge section, the isolation valve 130 is closed, the barrier valve 135 is closed (if it is open in the discharge section), the discharge valve 145 is closed, and the purge valve 140 is opened and the inlet valve 125 is opened. The dispensing pump 180 applies pressure to the fluid in the dispensing chamber 185 to vent air bubbles via the purge valve 140. During the static purge section, the dispensing of the pump 180 is stopped, but the purge valve 140 remains open to continue to vent the air. Any excess fluid removed during the purge or static purge section can be directed out of the multi-stage pump 100 (eg, back to the fluid source or discarded) or recycled to the feed stage pump 150. During the ready phase, the inlet valve 125, the isolation valve 130, and the barrier valve 135 can be opened and the purge valve 140 closed so that the feed stage pump 150 can reach the ambient pressure of the source (eg, the source bottle). According to other embodiments, all valves can be closed at the ready section.

在施配段期間,出口閥147打開且施配幫浦180將壓力施加至施配腔室185中之流體。因為出口閥147可比施配幫浦180緩慢地對控制作出反應,所以可首先打開出口閥147且可在某一預定時段以後起動施配馬達200。此防止施配幫浦180推動流體穿過部分打開之出口閥147。此外,此防止流體沿由閥門打開所導致之施配噴嘴(其為微型幫浦)向上移動,繼之以馬達動作所導致之前向流體運動。在其他實施例中,可打開出口閥147且可同時藉由施配幫浦180而開始施配。During the dispensing section, the outlet valve 147 opens and the pump 180 is applied to apply pressure to the fluid in the dispensing chamber 185. Because the outlet valve 147 can react slowly to the control than the dispensing pump 180, the outlet valve 147 can be first opened and the dispensing motor 200 can be started after a predetermined period of time. This prevents the dispensing pump 180 from pushing fluid through the partially open outlet valve 147. In addition, this prevents fluid from moving upward along the dispensing nozzle (which is a micro-pull) caused by the opening of the valve, followed by movement of the fluid prior to the action of the motor. In other embodiments, the outlet valve 147 can be opened and the dispensing can begin at the same time by dispensing the pump 180.

可執行一額外反吸段,其中移除施配噴嘴中之過量流體。在該反吸段期間,出口閥147可關閉且一輔助馬達或真空可用以將過量流體自出口噴嘴中吸出。或者,出口閥147可保持打開,且可反轉施配馬達200以將流體反吸至施配腔室中。該反吸段有助於防止過量流體滴至晶圓上。An additional suckback section can be performed in which excess fluid in the dispensing nozzle is removed. During the suckback section, the outlet valve 147 can be closed and an auxiliary motor or vacuum can be used to draw excess fluid from the outlet nozzle. Alternatively, the outlet valve 147 can remain open and the dispensing motor 200 can be reversed to draw back fluid into the dispensing chamber. This suckback section helps prevent excess fluid from dripping onto the wafer.

圖3為體現多級幫浦100之幫浦系統10的圖示。幫浦系統10可進一步包括一流體源15及一幫浦控制器20,其與多級幫浦100協作以將流體施配至晶圓25上。多級幫浦100之操作可藉由幫浦控制器20來控制。幫浦控制器20可包括一電腦可讀媒體27(例如,RAM、ROM、快閃記憶體、光碟、磁碟機或其他電腦可讀媒體),該電腦可讀媒體27含有用於控制多級幫浦100之操作的一組控制指令30。處理器35(例如,CPU、ASIC、RISC、DSP或其他處理器)可執行該等指令。幫浦控制器20可在幫浦100之內部或外部。具體而言,幫浦控制器可駐留於多級幫浦100上或經由用於傳達控制信號、資料或其他資訊之一或多個通信鏈路而連接至多級幫浦100。作為實例,幫浦控制器20在圖3中被展示為經由通信鏈路40及45而通信地耦接至多級幫浦100。通信鏈路40及45可為網路(例如,以太網路、無線網路、全球區域網路、DeviceNet網路或此項技術中已知或開發之其他網路)、匯流排(例如,SCSI匯流排)或其他通信鏈路。幫浦控制器20可被實施為自載PCB 板、遠端控制器或以其他適當方式來實施。幫浦控制器20可包括適當介面(例如,網路介面、I/O介面、類比數位轉換器及其他組件)以允許幫浦控制器20與多級幫浦100通信。幫浦控制器20可包括此項技術中已知之各種電腦組件,包括處理器、記憶體、介面、顯示設備、周邊裝置或其他電腦組件。幫浦控制器20可控制多級幫浦中之各種閥門及馬達以導致多級幫浦準確地施配流體,包括低黏度流體(亦即,小於100厘泊(centipoire))或其他流體。如皆以引用的方式併入本文的Cedrone等人在2005年12月2日申請之標題為"I/O INTERFACE SYSTEM AND METHOD FOR A PUMP"的美國臨時專利申請案第60/741,657號(已於2006年11月20日改請為美國專利申請案第11/602,449號及國際申請案第PCT/US06/45127號)中所述之I/O介面連接器描述可用於將幫浦控制器20連接至各種介面及製造工具的I/O配接器。FIG. 3 is an illustration of a pumping system 10 embodying a multi-stage pump 100. The pump system 10 can further include a fluid source 15 and a pump controller 20 that cooperates with the multi-stage pump 100 to dispense fluid onto the wafer 25. The operation of the multi-stage pump 100 can be controlled by the pump controller 20. The pump controller 20 can include a computer readable medium 27 (e.g., RAM, ROM, flash memory, compact disc, disk drive, or other computer readable medium) containing computer control medium 27 for controlling multiple levels A set of control commands 30 for the operation of the pump 100. The processor 35 (eg, a CPU, ASIC, RISC, DSP, or other processor) can execute the instructions. The pump controller 20 can be internal or external to the pump 100. In particular, the pump controller can reside on the multi-stage pump 100 or be connected to the multi-stage pump 100 via one or more communication links for communicating control signals, data or other information. As an example, the pump controller 20 is shown in FIG. 3 as being communicatively coupled to the multi-stage pump 100 via communication links 40 and 45. Communication links 40 and 45 can be networks (eg, Ethernet, wireless, global area networks, DeviceNet networks, or other networks known or developed in the art), busses (eg, SCSI) Bus) or other communication link. The pump controller 20 can be implemented as a self-supporting PCB The board, remote controller or implemented in other suitable manners. The pump controller 20 may include a suitable interface (eg, a network interface, an I/O interface, an analog digital converter, and other components) to allow the pump controller 20 to communicate with the multi-stage pump 100. The pump controller 20 can include various computer components known in the art, including processors, memory, interfaces, display devices, peripheral devices, or other computer components. The pump controller 20 can control the various valves and motors in the multi-stage pump to cause the multi-stage pump to accurately dispense fluids, including low viscosity fluids (i.e., less than 100 centipoire) or other fluids. U.S. Provisional Patent Application Serial No. 60/741,657, entitled "I/O INTERFACE SYSTEM AND METHOD FOR A PUMP", filed on Dec. 2, 2005, by Cedrone et al. The description of the I/O interface connector described in U.S. Patent Application Serial No. 11/602,449, and the International Application No. PCT/US06/45127, filed on November 20, 2006, can be used to connect the pump controller 20 I/O adapters for various interfaces and manufacturing tools.

圖4提供多級幫浦100之操作之各種段之閥門及施配馬達時序的圖示。雖然將若干閥門展示為在段改變期間同時關閉,但可略微分開地(例如,100毫秒)對閥門之關閉進行定時以減小壓力尖峰。例如,在排放段與淨化段之間,可在排放閥145之前不久關閉隔離閥130。然而,應注意,其他閥門時序可用於本發明之各種實施例中。此外,可同時執行該等段中之若干者(例如,可同時執行填充/施配級,在此狀況下,入口閥及出口閥皆可在施配/填充段中打開)。應進一步注意,特定段在每一循環中不必進行重複。例如,可能不在每一循環中執行淨化段及靜態淨化段。類似地,可能不在每一循環中執行排放段。又,可在再裝料之前執行多個施配。4 provides an illustration of the timing of the various stages of the operation of the multi-stage pump 100 and the timing of the dispensed motor. While several valves are shown as being simultaneously closed during a segment change, the closing of the valve can be timed slightly (eg, 100 milliseconds) to reduce pressure spikes. For example, between the discharge section and the purge section, the isolation valve 130 can be closed shortly before the discharge valve 145. However, it should be noted that other valve timings can be used in various embodiments of the present invention. In addition, several of the segments can be performed simultaneously (eg, a fill/distribution stage can be performed simultaneously, in which case both the inlet and outlet valves can be opened in the dispense/fill section). It should be further noted that a particular segment does not have to be repeated in each cycle. For example, the purge section and the static purge section may not be executed in each cycle. Similarly, the discharge section may not be executed in each cycle. Also, multiple dispenses can be performed prior to refilling.

打開及關閉各種閥門可在流體中導致壓力尖峰。在靜態淨化段之結束時關閉淨化閥140(例如)可導致施配腔室185中之壓力增加。可發生此情況,因為每一閥門可在其關閉時排出少量流體。淨化閥 140(例如)可在其關閉時將少量流體排入施配腔室185中。因為當歸因於關閉淨化閥140而發生壓力增加時關閉出口閥147,所以若未降低該壓力,則可在後續之施配段期間發生流體至晶圓上的“噴濺”。為在靜態淨化段或額外段期間釋放此壓力,可反轉施配馬達200以將活塞192收回一預定距離以補償由關閉阻障閥135及/或淨化閥140所導致之任何壓力增加。在以引用的方式併入本文的由Gonnella等人在2005年12月2日申請之標題為"SYSTEM AND METHOD FOR CORRECTING FOR PRESSURE VARIATIONS USING A MOTOR"的美國臨時專Opening and closing various valves can cause pressure spikes in the fluid. Closing the purge valve 140, for example at the end of the static purge section, can result in an increase in pressure in the dispense chamber 185. This can happen because each valve can discharge a small amount of fluid when it is closed. Purification valve 140, for example, can discharge a small amount of fluid into the dispensing chamber 185 when it is closed. Because the outlet valve 147 is closed when a pressure increase occurs due to the closing of the purge valve 140, if the pressure is not reduced, a "splash" of fluid onto the wafer can occur during the subsequent dispensing section. To release this pressure during the static purge section or additional section, the dispense motor 200 can be reversed to retract the piston 192 a predetermined distance to compensate for any pressure increase caused by closing the barrier valve 135 and/or the purge valve 140. U.S. Provisional Application entitled "SYSTEM AND METHOD FOR CORRECTING FOR PRESSURE VARIATIONS USING A MOTOR", filed on December 2, 2005 by Gonnella et al., incorporated herein by reference.

利申請案第60/741,681號(已於2006年11月20日改請為美國專利申請案第11/602,472號及國際申請案第PCT/US06/45176號)中描述了校正由關閉閥門(例如,淨化閥140)所導致之壓力增加的一實施例。Correction by closing the valve (for example, in U.S. Patent Application Serial No. 11/602,472 and International Application No. PCT/US06/45176, filed on Nov. 20, 2006). An embodiment of the pressure increase caused by the purge valve 140).

處理流體中之壓力尖峰亦可藉由避免關閉閥門以產生入陷空間及在入陷空間之間打開閥門來減小。在以引用的方式併入本文的由Gonnella等人在2005年12月2日申請之標題為"METHOD AND SYSTEM FOR VALVE SEQUENCING IN A PUMP"的美國臨時專利申請案第60/742,168號(已於2006年11月20日改請為美國專利申請案第11/602,465號及國際申請案第PCT/US06/44980號)描述了用於對閥門打開及關閉進行定時以降低處理流體中之壓力尖峰的一實施例。The pressure spikes in the treatment fluid can also be reduced by avoiding closing the valve to create a trapped space and opening the valve between the trapped spaces. U.S. Provisional Patent Application Serial No. 60/742,168, filed on Jan. 2, 2005, which is hereby incorporated by reference in its entirety in One of the steps for timing the opening and closing of a valve to reduce the pressure spike in the treatment fluid is described in U.S. Patent Application Serial No. 11/602,465, the entire disclosure of which is incorporated herein by reference. Example.

應進一步注意,在就緒段期間,施配腔室185中之壓力可基於隔膜之特性、溫度或其他因素而改變。如以引用的方式併入本文的由James Cedrone在2005年12月2日申請之標題為"SYSTEM AND METHOD FOR PRESSURE COMPENSATION IN A PUMP"的美國臨時專利申請案第60/741,682號(已於2006年11月20日改請為美國專利申請案第11/602,508號及國際申請案第PCT/US06/45175號)中所述,施配馬達200可經控制以補償此壓力浮動。因此,本發明之實施例提供具有可避免或減緩潛在地損害壓力改變之輕度流體處理特徵之多級幫 浦。本發明之實施例可亦採用其他幫浦控制機構及閥門襯墊以有助於降低壓力對處理流體之有害效應。在以引用的方式併入本文的由Zagars等人在2005年2月4日申請之標題為"PUMP CONTROLLER FOR PRECISION PUMPING APPARATUS"的美國專利申請案第11/051,576號(現為美國專利第7,476,087號)中可找到多級幫浦100之幫浦總成的額外實例。It should be further noted that during the ready phase, the pressure in the dispensing chamber 185 may vary based on the characteristics of the diaphragm, temperature, or other factors. U.S. Provisional Patent Application Serial No. 60/741,682, filed on December 2, 2005, which is incorporated by reference in its entirety in The dispensing motor 200 can be controlled to compensate for this pressure fluctuation as described in U.S. Patent Application Serial No. 11/602,508, the disclosure of which is incorporated herein by reference. Accordingly, embodiments of the present invention provide a multi-level gang with mild fluid handling features that can avoid or mitigate potential damage to pressure changes. Pu. Other pump control mechanisms and valve gaskets may also be employed in embodiments of the present invention to help reduce the deleterious effects of pressure on the treatment fluid. U.S. Patent Application Serial No. 11/051,576, entitled "PUMP CONTROLLER FOR PRECISION PUMPING APPARATUS", filed on February 4, 2005, by the name of Zagars et al., which is hereby incorporated by reference. An additional example of a multi-stage pump 100 pump assembly can be found.

在一實施例中,多級幫浦100併入步進馬達作為饋入馬達175且併入BLDCM 3030作為施配馬達200。適當馬達及關聯部分可獲得自美國NH之EAD Motors of Dover或其類似公司。在操作中,BLDCM 3030之定子產生定子磁通量且轉子產生轉子磁通量。定子磁通量與轉子磁通量之間的相互作用界定BLDCM 3030之轉矩且因此界定其速度。在一實施例中,數位信號處理器(DSP)用以實施所有場導向控制(FOC)。FOC演算法在體現於電腦可讀媒體中之電腦可執行軟體中得以實現。數位信號處理器與晶載硬體周邊裝置一起現可與計算能力、速度及可程式性一同使用以控制BLDCM 3030並以相對較低之附加成本以微秒為單位來圓滿地執行FOC演算法。可用於實施本文中所揭示之本發明之實施例的DSP之一實例為可購自位於美國TX之Dallas的Texas Instruments公司的16位元DSP(件號TMS320F2812PGFA)。In an embodiment, the multi-stage pump 100 incorporates a stepper motor as the feed motor 175 and incorporates the BLDCM 3030 as the dispense motor 200. Suitable motors and associated parts are available from EAD Motors of Dover, USA, or similar companies. In operation, the stator of the BLDCM 3030 produces stator flux and the rotor produces rotor flux. The interaction between the stator flux and the rotor flux defines the torque of the BLDCM 3030 and thus its speed. In one embodiment, a digital signal processor (DSP) is used to implement all field oriented control (FOC). The FOC algorithm is implemented in a computer executable software embodied in a computer readable medium. Digital signal processors, along with on-board hardware peripherals, can now be used with computing power, speed, and programmability to control the BLDCM 3030 and successfully perform FOC algorithms in microseconds at relatively low additional cost. An example of a DSP that can be used to implement embodiments of the invention disclosed herein is a 16-bit DSP (part number TMS320F2812 PGFA) available from Texas Instruments, Inc. of Dallas, TX, USA.

BLDCM 3030可併入至少一位置感應器以感應實際轉子位置。在一實施例中,位置感應器可在BLDCM 3030之外部。在一實施例中,位置感應器可在BLDCM 3030之內部。在一實施例中,BLDCM 3030可為無感應器的。在圖1中所示之實例中,位置感應器3040耦接至BLDCM 3030以用於BLDCM 3030之實際轉子位置的即時回饋,該即時回饋由DSP用來控制BLDCM 3030。具有位置感應器3040之額外益處在於:其證明對機械活塞(例如,圖2之活塞192)之位置之極準確且可重複的控制,此意謂對活塞排移施配幫浦(例如,圖2之施配幫浦 180)中之流體移動及施配量之極準確且可重複的控制。在一實施例中,位置感應器3040為細線旋轉位置編碼器。在一實施例中,位置感應器3040為2000線編碼器。根據本發明之一實施例,2000線編碼器可將8000個脈衝或計數提供至DSP。藉由使用2000線編碼器,有可能準確地量測至0.045度之旋轉並在0.045度之旋轉下控制。亦可使用其他適當之編碼器。例如,位置感應器3040可為1000或8000線編碼器。The BLDCM 3030 can incorporate at least one position sensor to sense the actual rotor position. In an embodiment, the position sensor can be external to the BLDCM 3030. In an embodiment, the position sensor can be internal to the BLDCM 3030. In an embodiment, the BLDCM 3030 can be sensorless. In the example shown in FIG. 1, position sensor 3040 is coupled to BLDCM 3030 for immediate feedback of the actual rotor position of BLDCM 3030, which is used by the DSP to control BLDCM 3030. An additional benefit of having position sensor 3040 is that it demonstrates extremely accurate and repeatable control of the position of the mechanical piston (eg, piston 192 of Figure 2), which means applying a pump to the piston displacement (eg, 2 with the pump Extremely accurate and repeatable control of fluid movement and dosing in 180). In an embodiment, position sensor 3040 is a thin line rotary position encoder. In an embodiment, the position sensor 3040 is a 2000 line encoder. In accordance with an embodiment of the present invention, a 2000 line encoder can provide 8000 pulses or counts to the DSP. By using a 2000 line encoder, it is possible to accurately measure the rotation to 0.045 degrees and control it under a rotation of 0.045 degrees. Other suitable encoders can also be used. For example, position sensor 3040 can be a 1000 or 8000 line encoder.

BLDCM 3030可以極低速度來運轉且仍維持一恆定速度,此意謂少量振動或無振動。在諸如步進馬達之其他技術中,在不將振動引入於幫浦系統中之情況下尚不可能以較低速度來運轉,此由不良之恆定速度控制所導致。此振動將導致不良之施配效能且引起極狹窄之操作視窗範圍。此外,振動可對處理流體造成有害效應。下文中之表1及圖5至9比較一步進馬達及一BLDCM且示範在多級幫浦100中將BLDCM 3030用作施配馬達200之許多優點。The BLDCM 3030 can operate at very low speeds while still maintaining a constant speed, which means little or no vibration. In other techniques, such as stepper motors, it is not possible to operate at lower speeds without introducing vibration into the pump system, which is caused by poor constant speed control. This vibration will result in poor dispensing performance and will result in an extremely narrow operating window range. In addition, vibration can have deleterious effects on the treatment fluid. Table 1 and Figures 5 through 9 below compare a stepper motor and a BLDCM and demonstrate the many advantages of using the BLDCM 3030 as a mating motor 200 in a multi-stage pump 100.

如自表1可見,與步進馬達相比,BLDCM可提供大體上增加之解析度與連續之旋轉運動、較低之功率消耗、較高之轉矩傳遞及較寬廣之速度範圍。注意,BLDCM解析度可比步進馬達所提供之解析度多或超過約10倍。為此,可由BLDCM所提供之進步的最小單位被稱為"馬達增量",其可與通常結合步進馬達而使用之術語"步進"區分。馬達增量為BLDCM根據一實施例可提供連續運動、而步進馬達以離散 步進來移動時之移動的最小可量測單位。As can be seen from Table 1, the BLDCM provides substantially increased resolution and continuous rotational motion, lower power consumption, higher torque transfer, and a wider range of speeds than stepper motors. Note that the BLDCM resolution can be more or more than about 10 times greater than the resolution provided by the stepper motor. To this end, the smallest unit of progress that can be provided by the BLDCM is referred to as "motor increment", which can be distinguished from the term "stepping", which is commonly used in connection with stepper motors. The motor increment is BLDCM according to an embodiment to provide continuous motion while the stepper motor is discrete The smallest measurable unit of movement when stepping to move.

圖5為根據本發明之一實施例比較步進馬達與BLDCM之平均轉矩輸出及速度範圍的曲線圖。如圖5中所說明,與步進馬達之轉矩輸出相比,BLDCM可在較高速度下維持幾乎恆定之高轉矩輸出。此外,BLDCM之速度範圍比步進馬達之速度範圍寬廣(例如,約1000倍或1000倍以上)。相反,步進馬達傾向於具有較低之轉矩輸出,該轉矩輸出傾向於隨速度增加而不良地下降(亦即,轉矩輸出在較高速度下減少)。5 is a graph comparing the average torque output and speed range of a stepper motor and a BLDCM in accordance with an embodiment of the present invention. As illustrated in Figure 5, the BLDCM maintains a nearly constant high torque output at higher speeds than the torque output of the stepper motor. In addition, the speed range of the BLDCM is wider than the speed range of the stepper motor (for example, about 1000 times or more). In contrast, stepper motors tend to have lower torque outputs that tend to degrade poorly as speed increases (i.e., torque output decreases at higher speeds).

圖6為根據本發明之一實施例比較步進馬達與BLDCM之間的平均馬達電流及負載的曲線圖。如圖6中所說明,BLDCM可對系統上之負載進行調適及調整且僅使用為承載該負載所需之功率。相反,無論是否需要,步進馬達皆使用為最大條件而設定之電流。例如,步進馬達之峰值電流為150毫安(mA)。相同的150mA用於移動1-lb.負載以及10-lb.負載,即使移動1-lb.負載無需與移動10-lb.負載一樣多的電流。因此,在操作中,步進馬達不管負載如何而皆消耗對於最大條件之功率,從而導致能量之低效且浪費的使用。6 is a graph comparing average motor current and load between a stepper motor and a BLDCM in accordance with an embodiment of the present invention. As illustrated in Figure 6, the BLDCM can adapt and adjust the load on the system and use only the power required to carry the load. Instead, the stepper motor uses the current set for the maximum condition, whether or not it is needed. For example, the stepper motor has a peak current of 150 milliamps (mA). The same 150 mA is used to move 1-lb. load and 10-lb. load, even if moving 1-lb. load does not require as much current as moving 10-lb. Thus, in operation, the stepper motor consumes power for maximum conditions regardless of load, resulting in inefficient and wasteful use of energy.

就BLDCM而言,電流係隨負載之增加或減少而調整。在任一特定時間點,BLDCM將自補償並以在所需要之速度下轉動自身且產生用以移動所需之負載之力所必須的電流量來供應自身。當馬達不移動時,電流可為極低的(在10mA以下)。因為受控之BLDCM係自補償的(亦即,其可根據系統上之負載而適應性地調整電流),所以其一直係開啟的,即使在馬達不移動時亦如此。相比而言,視應用而定,當步進馬達不移動時,可斷開步進馬達。In the case of BLDCM, the current system is adjusted as the load increases or decreases. At any particular point in time, the BLDCM will self-compensate and supply itself with the amount of current necessary to rotate itself at the desired speed and generate the force to move the required load. When the motor is not moving, the current can be extremely low (below 10 mA). Because the controlled BLDCM is self-compensating (i.e., it can adaptively adjust the current based on the load on the system), it is always on, even when the motor is not moving. In contrast, depending on the application, the stepper motor can be turned off when the stepper motor does not move.

為維持位置控制,需要極頻繁地執行用於BLDCM之控制機制。在一實施例中,控制迴路在30kHz下運轉,每循環約33ms。因此,每隔33ms,控制迴路檢核以查看BLDCM是否在正確位置處。若 BLDCM在正確位置處,則不試圖進行任何動作。若BLDCM不在正確位置處,則其調整電流且試圖迫使BLDCM到達BLDCM應所處之位置。此迅速之自補償動作致能極精確之位置控制,其在某些應用中係高度需要的。使控制迴路在高於正常速度(例如,10kHz)之速度(例如,30kHz)下運轉可意謂系統中之額外熱產生。此係因為BLDCM切換電流愈頻繁,產生熱之機會就愈大。In order to maintain position control, the control mechanism for the BLDCM needs to be executed very frequently. In one embodiment, the control loop operates at 30 kHz for approximately 33 ms per cycle. Therefore, every 33 ms, the control loop checks to see if the BLDCM is in the correct position. If The BLDCM is in the correct position and does not attempt to perform any action. If the BLDCM is not in the correct position, it adjusts the current and attempts to force the BLDCM to the position where the BLDCM should be. This rapid self-compensating action enables extremely precise position control, which is highly desirable in certain applications. Operating the control loop at a speed above normal speed (eg, 10 kHz) (eg, 30 kHz) may mean additional heat generation in the system. This is because the more frequent the BLDCM switches current, the greater the chance of generating heat.

根據本發明之一態樣,在某些實施例中,BLDCM經組態以考慮到熱產生。具體而言,控制迴路經組態以在單一循環期間在兩個不同速度下運轉。在循環之施配部分期間,控制迴路在較高速度(例如,30kHz)下運轉。在循環之剩餘的非施配部分期間,控制迴路在較低速度(例如,10kHz)下運轉。此組態可尤其適用於施配期間之超準確之位置控制係決定性的應用中。作為實例,在施配時間期間,控制迴路在30kHz下運轉,此提供極佳之位置控制。在剩餘的時間,速度切回至10kH。藉由如此進行,溫度可顯著地下降。In accordance with an aspect of the present invention, in certain embodiments, the BLDCM is configured to account for heat generation. In particular, the control loop is configured to operate at two different speeds during a single cycle. During the dispensing portion of the cycle, the control loop operates at a higher speed (eg, 30 kHz). The control loop operates at a lower speed (eg, 10 kHz) during the remaining non-dosing portion of the cycle. This configuration is especially suitable for use in ultra-accurate position control system decisive applications during dispensing. As an example, during the dispensing time, the control loop operates at 30 kHz, which provides excellent position control. At the remaining time, the speed is switched back to 10kH. By doing so, the temperature can be significantly lowered.

循環之施配部分可視應用而加以定製。作為另一實例,施配系統可實施20秒循環。在一20秒循環中,5秒可用於施配,而剩餘的15秒可用於登入或再裝料,等等。在各循環之間,可存在15至20秒之就緒時期。因此,BLDCM之控制迴路將在較高頻率(例如,30kHz)下運轉循環之小百分比(例如,5秒)且在較低頻率(例如,10kHz)下運轉較大百分比(例如,15秒)。The dispensing of the loop is customized for the application. As another example, the dispensing system can implement a 20 second cycle. In a 20 second cycle, 5 seconds can be used for dispensing, while the remaining 15 seconds can be used for login or reloading, and so on. There may be a ready period of 15 to 20 seconds between cycles. Thus, the control loop of the BLDCM will operate a small percentage of the cycle (eg, 5 seconds) at a higher frequency (eg, 30 kHz) and a larger percentage (eg, 15 seconds) at a lower frequency (eg, 10 kHz).

如熟習此項技術者可瞭解,該等參數(例如,5秒、15秒、30kHz、10kHz,等等)意欲為例示性的而非限制性的。操作速度及時間可被調整或另外經組態以適用,只要其在本文中所揭示之本發明之範疇及精神內即可。經驗方法可用於判定該等可程式化參數。例如,10kHz為用以驅動BLDCM之相當典型的頻率。儘管可使用不同速度,但在慢於10kHz下運轉BLDCM之控制迴路可具有失去位置控制的危 險。因為通常難以再獲得位置控制,所以需要使BLDCM保持位置。As will be appreciated by those skilled in the art, such parameters (e.g., 5 seconds, 15 seconds, 30 kHz, 10 kHz, etc.) are intended to be illustrative and not limiting. The operating speed and time may be adjusted or otherwise configured to be suitable as long as it is within the scope and spirit of the invention as disclosed herein. Empirical methods can be used to determine such programmable parameters. For example, 10 kHz is a fairly typical frequency used to drive BLDCM. Although different speeds can be used, the control loop that operates the BLDCM at slower than 10 kHz can be at risk of losing position control. risk. Since it is often difficult to obtain position control again, it is necessary to keep the BLDCM in position.

本發明之此態樣之一目標為在無不良地損害位置控制之情況下在循環之非施配階段期間盡可能多地減小速度。此目標可經由用於BLDCM之定製控制機制而在本文中所揭示之實施例中達成。定製控制機制經組態以增加頻率(例如,30kHz),以獲得對於諸如施配之決定性功能之某一額外/增加的位置控制。定製控制機制亦經組態以藉由允許非決定性功能在較低頻率(例如,10kHz)下執行而減少熱產生。此外,定製控制機制經組態以最小化在非施配循環期間藉在較低頻率下運轉而導致之任何位置控制損失。One of the aspects of this aspect of the invention aims to reduce the speed as much as possible during the non-dosing phase of the cycle without adversely damaging the position control. This goal can be achieved in the embodiments disclosed herein via a custom control mechanism for BLDCM. The custom control mechanism is configured to increase the frequency (eg, 30 kHz) to obtain some additional/increased position control for decisive functions such as dispensing. The custom control mechanism is also configured to reduce heat generation by allowing non-deterministic functions to be performed at lower frequencies (eg, 10 kHz). In addition, the custom control mechanism is configured to minimize any positional control losses caused by operation at lower frequencies during non-dosing cycles.

定製控制機制經組態以提供所需之施配輪廓,其可藉由壓力而加以特徵化。該特徵化可基於壓力信號之偏差。例如,平坦壓力輪廓將暗示平穩運動、較少振動及因此較佳位置控制。對比而言,偏差壓力信號將暗示不良之位置控制。圖7為例示30kHz馬達操作與10kHz馬達操作之間的差異的曲線圖(在0.5mL/s下10mL)。第一個20秒為施配階段。如在圖7中可見,在施配階段期間,在30kHz下之施配具有比在10kHz下之施配之壓力輪廓含較少雜訊且較平穩的壓力輪廓。The custom control mechanism is configured to provide the desired dispense profile that can be characterized by pressure. This characterization can be based on the deviation of the pressure signal. For example, a flat pressure profile would imply smooth motion, less vibration, and therefore better position control. In contrast, the deviation pressure signal would imply poor position control. Figure 7 is a graph illustrating the difference between a 30 kHz motor operation and a 10 kHz motor operation (10 mL at 0.5 mL/s). The first 20 seconds is the dispensing phase. As can be seen in Figure 7, during the dispensing phase, the dispensing at 30 kHz has a lesser noise and a smoother pressure profile than the pressure profile dispensed at 10 kHz.

至於所關注之位置控制,在10kHz下與在15kHz下運轉BLDCM之間的差異可為不顯著的。然而,若速度下降至10kHz以下(例如5kHz),則可能不夠快到足以保持良好之位置控制。例如,BLDCM之一實施例經組態用於施配流體。當位置迴路在1ms下(亦即,在約10kHz或10kHz以上)運轉時,未發生人眼可見之效應。然而,當其達到1、2或3ms範圍時,流體中之效應變得可見。作為另一實例,若閥門之時序在1ms以下變化,則流體之結果之任何變化可能不為人眼可見。然而,在1、2或3ms範圍內,變化可為可見的。因此,定製控制機制較佳地在約10kHz或10kHz以上執行時間決定性功能(例如,對馬達、閥門等等進行定時)。As for the position control of interest, the difference between running BLDCM at 10 kHz and at 15 kHz may be insignificant. However, if the speed drops below 10 kHz (eg 5 kHz), it may not be fast enough to maintain good position control. For example, one embodiment of the BLDCM is configured to dispense a fluid. When the position loop is operated at 1 ms (i.e., at about 10 kHz or above), no effect visible to the human eye occurs. However, when it reaches the range of 1, 2 or 3 ms, the effect in the fluid becomes visible. As another example, if the timing of the valve changes below 1 ms, any change in the result of the fluid may not be visible to the human eye. However, the variation can be visible in the range of 1, 2 or 3 ms. Thus, the custom control mechanism preferably performs time deterministic functions (eg, timing motors, valves, etc.) at about 10 kHz or more.

另一考慮涉及施配系統中之內部計算。若施配系統經設定以在低達1kHz下運轉,則不存在比1ms精細之任何解析度且不可執行需要比1ms精細之計算。在此狀況下,10kHz將為用於施配系統之實用頻率。如上文所述,該等數字意欲為例示性的。有可能將速度設定為低於10kHz(例如,5kHz或甚至2kHz)。Another consideration relates to internal calculations in the dispensing system. If the dispensing system is set to operate at as low as 1 kHz, there is no resolution that is finer than 1 ms and it is not possible to perform calculations that require more than 1 ms. In this case, 10 kHz will be the practical frequency for the dispensing system. As noted above, such numbers are intended to be illustrative. It is possible to set the speed below 10 kHz (eg 5 kHz or even 2 kHz).

類似地,有可能將速度設定為高於30kHz,只要其滿足效能需求即可。本文中所揭示之例示性施配系統使用具有許多線(例如,8000個線)之編碼器。每一線之間的時間為速度。即使BLDCM相當緩慢地運轉,該等線亦為極細之線,因此其可極快地出現,基本上脈動至編碼器。若BLDCM每一秒運轉一回轉,則彼意謂8000個線及因此在該秒中之8000個脈衝。若該等脈衝之寬度不變化(亦即,該等寬度恰處於目標寬度且反覆地保持相同),則其為極良好之速度控制的指示。若該等寬度振盪,則視系統設計(例如,容限)及應用而定,其為較不良之(未必為差的)速度控制的指示。Similarly, it is possible to set the speed above 30 kHz as long as it meets the performance requirements. The exemplary dispensing system disclosed herein uses an encoder having a plurality of lines (eg, 8000 lines). The time between each line is speed. Even though the BLDCM operates quite slowly, the lines are also very thin lines, so they can appear extremely quickly, essentially pulsing to the encoder. If the BLDCM runs one revolution per second, then it means 8000 lines and therefore 8000 pulses in the second. If the width of the pulses does not change (i.e., the widths are just below the target width and remain the same repeatedly), then this is an indication of very good speed control. If the widths oscillate, depending on the system design (e.g., tolerance) and application, it is an indication of a lesser (not necessarily poor) speed control.

另一考慮涉及對數位信號處理器(DSP)之處理能力的實用限制。作為實例,為在一循環內施配,可能花費幾乎或剛好約20μs來執行對於位置控制器、電流控制器及其類似控制器之所有必要計算。在30kHz下運轉會給予約30μs,其足以進行該等計算,其中剩下的時間用以執行控制器中之其他過程。有可能使用可在快於30kHz下運轉之更有功效的處理器。然而,在快於30μs之速率下操作會產生報酬遞減(diminishing return)。例如,50kHz僅給予約20μs(1/50000Hz=0.00002s=20μs)。在此狀況下,可在50kHz下獲得較佳之速度效能,但系統具有不充足的時間來進行運轉控制器所必須的所有過程,因此導致一處理問題。而且,運轉50kHz意謂電流將更頻繁地切換,其促成前述之熱產生問題。Another consideration involves practical limitations on the processing power of digital signal processors (DSPs). As an example, to dispense in a loop, it may take almost or just about 20 [mu]s to perform all necessary calculations for the position controller, current controller, and the like. Operating at 30 kHz will give about 30 [mu]s, which is sufficient for such calculations, with the remainder of the time being used to perform other processes in the controller. It is possible to use a more efficient processor that can run faster than 30 kHz. However, operating at a rate faster than 30 μs produces a diminishing return. For example, 50 kHz is only given for about 20 μs (1/50000 Hz = 0.00002 s = 20 μs). In this case, better speed performance can be obtained at 50 kHz, but the system has insufficient time to perform all the processes necessary to operate the controller, thus causing a processing problem. Moreover, running 50 kHz means that the current will switch more frequently, which contributes to the aforementioned heat generation problems.

總之,為減少熱輸出,一解決方法為組態BLDCM以在施配期間 在較高頻率(例如,30kHz)下運轉,且在非施配操作(例如,再裝料)期間下降至或切回至較低頻率(例如,10kHz)。在組態定製控制機制及關聯參數中所考慮的因素包括位置控制效能及計算(其與處理器之處理能力有關)與熱產生(其與在計算後切換電流之次數有關)之速度。在上述實例中,在10kHz下之位置效能損失對於非施配操作係不顯著的,在30kHz下之位置控制對於施配係極佳的,且總的熱產生顯著地降低。藉由減少熱產生,本發明之實施例可在防止溫度改變影響被施配之流體的方面提供一技術優點。此可特別適用於涉及施配敏感及/或昂貴流體之應用中,在此狀況下,將高度需要避免熱或溫度改變可影響流體之任何可能性。加熱流體亦可影響施配操作。一種此效應被稱為自然反吸效應。該反吸效應解釋:當施配操作變暖時,其使流體膨脹。隨著其開始在幫浦外部冷卻,流體收縮且自噴嘴之末端縮回。因此,由於自然反吸效應,容積可能不精確且可能為不一致的。In summary, to reduce heat output, a solution is to configure BLDCM during the dispensing period. Operates at a higher frequency (eg, 30 kHz) and drops to or switches back to a lower frequency (eg, 10 kHz) during non-dosing operations (eg, reloading). The factors considered in configuring the custom control mechanism and associated parameters include the speed of position control performance and calculations (which are related to the processing power of the processor) and the heat generation (which is related to the number of switching currents after calculation). In the above example, the positional efficiency loss at 10 kHz is not significant for the non-dosing operating system, the positional control at 30 kHz is excellent for the dispensing system, and the overall heat production is significantly reduced. By reducing heat generation, embodiments of the present invention can provide a technical advantage in preventing temperature changes from affecting the fluid being dispensed. This may be particularly useful in applications involving the application of sensitive and/or expensive fluids, in which case it will be highly desirable to avoid any possibility that heat or temperature changes may affect the fluid. Heating the fluid can also affect the dispensing operation. One such effect is known as the natural suckback effect. This suckback effect explains that it expands the fluid as the dispensing operation warms. As it begins to cool outside the pump, the fluid contracts and retracts from the end of the nozzle. Therefore, due to the natural suckback effect, the volume may be inaccurate and may be inconsistent.

圖8為根據本發明之一實施例說明步進馬達與BLDCM在各種級中之循環時序的流程圖。遵循上述實例,步進馬達實施饋入馬達175且BLDCM實施施配馬達200。圖8中之陰影區域指示馬達在操作中。根據本發明之一實施例,步進馬達與BLDCM可以有助於過濾循環期間之壓力控制的方式來組態。圖9中提供步進馬達與BLDCM之壓力控制時序之一實例,其中陰影區域指示馬達在操作中。8 is a flow chart illustrating the timing of cycling of a stepper motor and a BLDCM in various stages, in accordance with an embodiment of the present invention. Following the above example, the stepper motor implements the feed motor 175 and the BLDCM implements the dispense motor 200. The shaded area in Figure 8 indicates that the motor is in operation. In accordance with an embodiment of the present invention, the stepper motor and BLDCM can be configured in a manner that facilitates pressure control during the filtration cycle. An example of a pressure control sequence for a stepper motor and a BLDCM is provided in Figure 9, where the shaded area indicates that the motor is in operation.

圖8與圖9說明饋入馬達175及施配馬達200之一例示性組態。更具體而言,一旦達到設定點,BLDCM(亦即,施配馬達200)即可開始以程式化過濾速率來開始反轉。同時,步進馬達(亦即,饋入馬達175)速率變化以維持壓力信號之設定點。此組態提供若干優點。例如,在流體上不存在壓力尖峰,流體上之壓力係恆定的,對於黏度改變不需要調整,不同系統之間無變化,且在流體上將不出現真空。8 and 9 illustrate an exemplary configuration of one of the feed motor 175 and the dispense motor 200. More specifically, once the set point is reached, the BLDCM (i.e., dispense motor 200) can begin to reverse at a programmed filtration rate. At the same time, the stepper motor (i.e., feed motor 175) changes in speed to maintain the set point of the pressure signal. This configuration offers several advantages. For example, there is no pressure spike on the fluid, the pressure on the fluid is constant, no adjustment is required for viscosity changes, no change between different systems, and no vacuum will occur on the fluid.

儘管根據多級幫浦而加以描述,但本發明之實施例亦可實施一 單級幫浦。圖10為用於幫浦4000之幫浦總成的圖示。幫浦4000可類似於上文所述之多級幫浦100之一級(亦即,施配級),且可包括單一腔室及由如本文中所述之BLDCM之實施例所驅動的滾動隔膜幫浦,其中相同或類似控制機制用於位置控制。幫浦4000可包括施配區塊4005,其界定穿過幫浦4000之各種流體流徑且至少部分地界定一幫浦腔室。施配幫浦區塊4005可為PTFE、改質之PTFE或其他材料的整體區塊。因為該等材料不與許多處理流體反應或最低程度地與其反應,所以使用該等材料允許流道及幫浦腔室藉由最小量之額外硬體而直接加工於施配區塊4005中。施配區塊4005因此藉由提供整合之流體歧管而減少對於管路之需要。Although described in terms of a multi-stage pump, embodiments of the present invention may also implement one Single-stage pump. Figure 10 is an illustration of a pump assembly for a pump 4000. The pump 4000 can be similar to the one of the multi-stage pump 100 described above (ie, the dispensing stage) and can include a single chamber and a rolling diaphragm driven by an embodiment of a BLDCM as described herein. Pump, where the same or similar control mechanism is used for position control. The pump 4000 can include a dispensing block 4005 that defines various fluid flow paths through the pump 4000 and at least partially defines a pumping chamber. The distribution of the pump block 4005 can be an integral block of PTFE, modified PTFE or other materials. Because the materials do not react with or react minimally with many processing fluids, the use of such materials allows the flow channels and pump chambers to be directly processed into the dispensing block 4005 with a minimum amount of additional hardware. The dispensing block 4005 thus reduces the need for piping by providing an integrated fluid manifold.

施配區塊4005亦可包括各種外部入口及出口,包括(例如)用於收納流體之入口4010、用於淨化/排放流體之淨化/排放出口4015,及用於在施配段期間施配流體之施配出口4020。在圖10之實例中,施配區塊4005包括外部淨化出口4010,因為幫浦僅具有一個腔室。以引用的方式全部併入本文之由Iraj Gashgaee在2005年12月2日申請之標題為"O-RING-LESS LOW PROFILE FITTING AND ASSEMBLY THEREOF"的美國臨時專利申請案第60/741,667號(已於2006年11月20日改請為美國專利申請案第11/602,513號及國際申請案第PCT/US06/44981號)描述可用於將施配區塊4005之外部入口及出口連接至流體路線之無o形環接頭之實施例。The dispensing block 4005 can also include various external inlets and outlets, including, for example, an inlet 4010 for containing fluid, a purge/discharge outlet 4015 for purifying/discharging fluid, and for dispensing a fluid during the dispensing section The distribution is 4020. In the example of Figure 10, the dispensing block 4005 includes an external purge outlet 4010 because the pump has only one chamber. U.S. Provisional Patent Application No. 60/741,667, entitled "O-RING-LESS LOW PROFILE FITTING AND ASSEMBLY THEREOF", filed on December 2, 2005 by Iraj Gashgaee, incorporated herein by reference. The description of U.S. Patent Application Serial No. 11/602,513 and International Application No. PCT/US06/44981, the disclosure of which is incorporated herein by reference to the entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire all An embodiment of an o-ring joint.

施配區塊4005將流體自入口導引至入口閥(例如,藉由閥板4030至少部分地界定)、自入口閥導引至幫浦腔室、自幫浦腔室導引至排放/淨化閥且自幫浦腔室導引至出口4020。幫浦蓋4025可保護幫浦馬達免受損害,而活塞外殼4027可提供對活塞之保護且可由聚乙烯或其他聚合物形成。閥板4030提供可經組態以將流體流動引導至幫浦4000之各種組件之閥門(例如,入口閥及淨化/排放閥)之系統的The dispensing block 4005 directs fluid from the inlet to the inlet valve (eg, at least partially defined by the valve plate 4030), from the inlet valve to the pump chamber, from the pump chamber to the discharge/purification The valve is directed from the pump chamber to the outlet 4020. The pump cover 4025 protects the pump motor from damage, while the piston housing 4027 provides protection to the piston and may be formed from polyethylene or other polymers. The valve plate 4030 provides a system that can be configured to direct fluid flow to valves of various components of the pump 4000 (eg, inlet valves and purge/discharge valves)

閥門外殼。閥板4030及對應閥門可類似於如上文所述結合閥板230而描述之方式來形成。入口閥及淨化/排放閥中之每一者至少部分地整合於閥板4030中,且為視壓力還是真空施加至對應隔膜而打開或關閉的隔膜閥。或者,該等閥門中之一些可在施配區塊4005之外部或配置於額外閥板中。在圖10之實例中,一PTFE薄片夾於閥板4030與施配區塊4005之間以形成各種閥門之隔膜。閥板4030包括每一閥門之閥門控制入口(未圖示)以將壓力或真空施加至對應隔膜。Valve housing. Valve plate 4030 and corresponding valves may be formed in a manner similar to that described above in connection with valve plate 230. Each of the inlet valve and the purge/discharge valve is at least partially integrated into the valve plate 4030 and is applied to the diaphragm valve that opens or closes for the pressure or vacuum corresponding to the diaphragm. Alternatively, some of the valves may be external to the dispensing block 4005 or disposed in an additional valve plate. In the example of Figure 10, a PTFE sheet is sandwiched between valve plate 4030 and dispensing block 4005 to form a diaphragm for various valves. Valve plate 4030 includes a valve control inlet (not shown) for each valve to apply pressure or vacuum to the corresponding diaphragm.

如同多級幫浦100一樣,幫浦4000可包括若干特徵以防止流體滴液進入多級幫浦100之容納電子器件的區域。"防滴"(drip proof)特徵可包括突出唇緣、傾斜特徵、組件之間的密封、金屬/聚合物介面處之偏移及上文所述之用以使電子器件與滴液隔離的其他特徵。電子器件及歧管可類似於上文所述之用以在幫浦腔室中減少熱對流體之效應的方式而加以組態。Like the multi-stage pump 100, the pump 4000 can include several features to prevent fluid dripping into the area of the multi-stage pump 100 that houses the electronics. "Drip proof" features may include protruding lips, beveled features, seals between components, offsets at the metal/polymer interface, and other described above to isolate electronics from drops feature. The electronics and manifold can be configured similar to that described above to reduce the effects of heat on the fluid in the pump chamber.

因此,本文中所揭示之系統及方法之實施例可利用BLDCM以在幫浦系統中驅動單級或多級幫浦,以用於進行適用於半導體製造中的即時平穩運動及對流體移動與施配量之極精確並可重複的位置控制。BLDCM可採用一位置感應器以用於對一執行定製FOC機制之處理器的即時位置回饋。相同或類似FOC機制適用於單級及多級幫浦。Thus, embodiments of the systems and methods disclosed herein may utilize BLDCM to drive single or multi-stage pumps in a pumping system for performing instantaneous smooth motion and fluid movement and application in semiconductor manufacturing. Extremely accurate and repeatable position control of the dosing. The BLDCM can employ a position sensor for instant position feedback to a processor executing a custom FOC mechanism. The same or similar FOC mechanism applies to single-stage and multi-stage pumps.

雖然本文中已參考說明性實施例而詳細地描述了本發明,但應瞭解,該描述僅為舉例而言且不以限制意義來解釋。因此,應進一步瞭解,一般技術者在參閱該描述後將清楚且可進行本發明之實施例之細節的許多改變及本發明之額外實施例。預期所有此等改變及額外實施例在本發明之範疇及精神內。因此,本發明之範疇應由以下申請專利範圍及其法定均等物來判定。The present invention has been described in detail herein with reference to the exemplary embodiments thereof Therefore, it will be apparent to those skilled in the art that the appended claims All such changes and additional embodiments are intended to be within the scope and spirit of the invention. Therefore, the scope of the invention should be determined by the following claims and their legal equivalents.

Claims (20)

一種幫浦系統,其包含:一幫浦;一無刷DC馬達,其驅動一駐留於該幫浦中之施配幫浦,其中該施配幫浦包含一入口及一出口;一電腦可讀媒體,其承載用於控制該幫浦之軟體指令;及一處理器,其通信地耦接至該電腦可讀媒體及該幫浦,其中該等軟體指令可藉由該處理器來執行以根據一控制機制而控制該無刷DC馬達,用以操作該施配幫浦將流體自該入口導引至該入口;其中該控制機制經組態以在一單一循環期間在至少兩個控制器頻率下運轉該無刷DC馬達。 A pump system comprising: a pump; a brushless DC motor driving a dispensing pump residing in the pump, wherein the dispensing pump includes an inlet and an outlet; a computer readable medium a processor that carries the software instructions for controlling the pump; and a processor communicatively coupled to the computer readable medium and the pump, wherein the software instructions are executable by the processor to perform Controlling the brushless DC motor for operating the dispensed pump to direct fluid from the inlet to the inlet; wherein the control mechanism is configured to operate at at least two controller frequencies during a single cycle The brushless DC motor. 如請求項1之幫浦系統,其中該等至少兩個控制器頻率包含一用於該單一循環之一施配部分之第一頻率。 The pumping system of claim 1, wherein the at least two controller frequencies comprise a first frequency for a portion of the one of the single cycles. 如請求項2之幫浦系統,其中該第一頻率約為30kHz。 The pumping system of claim 2, wherein the first frequency is about 30 kHz. 如請求項1之幫浦系統,其中該控制機制經組態以最小化該無刷DC馬達在該施配幫浦之操作期間的熱產生。 The pumping system of claim 1, wherein the control mechanism is configured to minimize heat generation by the brushless DC motor during operation of the dispensing pump. 如請求項1之幫浦系統,其中該等至少兩個控制器頻率包含一第一頻率及一第二頻率,其中該控制機制經組態以在施配期間在該第一頻率下運轉該無刷DC馬達且在非施配操作期間在第二頻率下運轉該無刷DC馬達。 The pumping system of claim 1, wherein the at least two controller frequencies comprise a first frequency and a second frequency, wherein the control mechanism is configured to operate the first frequency at the first frequency during the dispensing The DC motor is brushed and the brushless DC motor is operated at a second frequency during a non-dosing operation. 如請求項5之幫浦系統,其中該第二頻率係低於該第一頻率。 The pump system of claim 5, wherein the second frequency is lower than the first frequency. 如請求項6之幫浦系統,其中該第一頻率約為30kHz,而其中該第二頻率約為10kHz。 The pump system of claim 6, wherein the first frequency is about 30 kHz, and wherein the second frequency is about 10 kHz. 一種幫浦,其包含: 一施配幫浦,其中該施配幫浦為一活塞排移幫浦,該活塞排移幫浦包含:一入口;一出口;一施配腔室;一活塞;一施配級隔膜,其定位於該施配腔室與該活塞之間;一無刷DC馬達;及一導螺桿,其連接該活塞與該無刷DC馬達;其中該無刷DC馬達藉由體現於一電腦可讀媒體上且可由一實施一控制機制之處理器執行的軟體指令來控制,,用以操作該施配幫浦將流體自該入口導引至該入口;其中該處理器通信地耦接至該電腦可讀媒體及該幫浦;及其中該控制機制經組態以在一單一循環期間在至少兩個控制器頻率下運轉該無刷DC馬達。。 A pump that contains: A pump is provided, wherein the pump is a piston displacement pump, the piston displacement pump comprises: an inlet; an outlet; a dispensing chamber; a piston; a dispensing diaphragm, the positioning Between the dispensing chamber and the piston; a brushless DC motor; and a lead screw connecting the piston and the brushless DC motor; wherein the brushless DC motor is embodied on a computer readable medium Controlled by a software command executed by a processor implementing a control mechanism for operating the dispensing pump to direct fluid from the inlet to the inlet; wherein the processor is communicatively coupled to the computer readable medium and The pump; and the control mechanism is configured to operate the brushless DC motor at at least two controller frequencies during a single cycle. . 如請求項8之幫浦,其中該等至少兩個控制器頻率包含一用於該單一循環之一施配部分之第一頻率。 The pump of claim 8, wherein the at least two controller frequencies comprise a first frequency for a portion of the one of the single cycles. 如請求項9之幫浦,其中該第一頻率約為30kHz。 The pump of claim 9, wherein the first frequency is about 30 kHz. 如請求項8之幫浦,其中該控制機制經組態以最小化該無刷DC馬達在該施配幫浦之操作期間的熱產生。 The pump of claim 8, wherein the control mechanism is configured to minimize heat generation by the brushless DC motor during operation of the dispensed pump. 如請求項8之幫浦,其中該等至少兩個控制器頻率包含一第一頻率及一第二頻率,其中該控制機制經組態以在施配期間在該第一頻率下運轉該無刷DC馬達且在非施配操作期間在第二頻率下運轉該無刷DC馬達。 The pump of claim 8, wherein the at least two controller frequencies comprise a first frequency and a second frequency, wherein the control mechanism is configured to operate the brushless at the first frequency during dispensing The DC motor operates the brushless DC motor at a second frequency during a non-dosing operation. 如請求項12之幫浦,其中該第二頻率係低於該第一頻率。 The pump of claim 12, wherein the second frequency is lower than the first frequency. 如請求項13之幫浦,其中該第一頻率約為30kHz,而其中該第二 頻率約為10kHz。 The pump of claim 13, wherein the first frequency is about 30 kHz, and wherein the second The frequency is approximately 10 kHz. 一種方法,其包含:在一具有一入口及一出口之幫浦中,將一無刷DC馬達連接至該一機械活塞;及控制在施配期間在該第一頻率運轉該無刷DC馬達,及在該幫浦非施配操作期間在第二頻率下運轉該無刷DC馬達。 A method comprising: connecting a brushless DC motor to the mechanical piston in a pump having an inlet and an outlet; and controlling the brushless DC motor to operate at the first frequency during dispensing, And operating the brushless DC motor at a second frequency during the pump non-dispensing operation. 如請求項15之方法,其中該第二頻率係低於該第一頻率。 The method of claim 15, wherein the second frequency is lower than the first frequency. 如請求項15之方法,其中更進一步包含:將該機械活塞之即時位置回饋提供至一處理器,而該處理器通信地耦接至該幫浦。 The method of claim 15, further comprising: providing immediate feedback of the mechanical piston to a processor, and the processor is communicatively coupled to the pump. 如請求項15之方法,其中更進一步包含:在一單一循環期間在該第一及第二頻率運轉該無刷DC馬達。 The method of claim 15, further comprising: operating the brushless DC motor at the first and second frequencies during a single cycle. 如請求項15之方法,其中該控制進一步包含在一循環之一施配部分期間將該無刷DC馬達之一操作頻率增加至約30kHz。 The method of claim 15, wherein the controlling further comprises increasing the operating frequency of one of the brushless DC motors to about 30 kHz during one of the dispensing portions of the cycle. 如請求項15之方法,其中該控制進一步包含在一循環之一非施配部分期間將該無刷DC馬達之一操作頻率減少至約10kHz。 The method of claim 15, wherein the controlling further comprises reducing the operating frequency of one of the brushless DC motors to about 10 kHz during one of the non-dosing portions of the cycle.
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