TWI492319B - A method and apparatus of wet processor with fragmental detection in a spin dryer - Google Patents
A method and apparatus of wet processor with fragmental detection in a spin dryer Download PDFInfo
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- TWI492319B TWI492319B TW100126122A TW100126122A TWI492319B TW I492319 B TWI492319 B TW I492319B TW 100126122 A TW100126122 A TW 100126122A TW 100126122 A TW100126122 A TW 100126122A TW I492319 B TWI492319 B TW I492319B
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Description
本發明係有關於一種濕製程設備旋乾機偵測破片之方法及裝置,特別是以偵測網偵測破片產生之撞擊信號使旋乾機停止旋轉以避免更多破片產生。The invention relates to a method and a device for detecting a fragment of a wet processing device rotary dryer, in particular, the detection network detects the impact signal generated by the fragment, so that the rotary dryer stops rotating to avoid more fragmentation.
一般濕製程設備旋乾機如第1圖所示,第1圖為習知濕製程設備旋乾機之透視圖。習知濕製程設備旋乾機100於晶圓夾102進入製程腔體101後,使之高速旋轉而進行脫水,蝕刻液或純水為製程腔體101收集後經由排水槽103排出。若有破片產生,將損及製程腔體101甚至晶圓夾102內之晶圓,產生更多破片。授予Doris Kramer等人之美國專利第6,073,361號案教導一種旋乾機外部偵測轉速之設備,但不能偵測破片。授予Okuchi等人之美國專利第6,286,524號案教導一種旋乾機移除晶圓表面之微粒之方法及裝置,亦不能偵測破片之微粒。Generally, the wet process equipment rotary dryer is shown in Fig. 1. Fig. 1 is a perspective view of a conventional wet process equipment rotary dryer. The wet processing device spin dryer 100 enters the process chamber 101 after the wafer holder 102 enters the process chamber 101, and is rotated at a high speed to perform dehydration. The etching liquid or pure water is collected by the processing chamber 101 and discharged through the drain tank 103. If a fragment is generated, the wafer in the process chamber 101 or even the wafer holder 102 will be damaged, resulting in more fragments. U.S. Patent No. 6,073,361 to Doris Kramer et al. teaches a device for detecting the rotational speed of a rotary dryer externally, but does not detect fragmentation. U.S. Patent No. 6,286,524 to Okuchi et al. teaches a method and apparatus for removing the particles on the surface of a wafer by a spin dryer, and does not detect particles of the fragments.
故有一種需求,能於旋乾機高速旋轉時偵測破片之產生。Therefore, there is a need to detect the occurrence of fragments when the spin dryer rotates at a high speed.
本發明即針對此一需求,提出一種能解決以上缺點之偵測破片之方法及裝置。The present invention addresses the need for this and proposes a method and apparatus for detecting fragments that can solve the above disadvantages.
本發明之目的在提供一種濕製程設備旋乾機偵測破片之方法,於旋乾機高速旋轉時偵測破片之產生,避免更多破片產生,以增進良率。The object of the present invention is to provide a method for detecting a fragment by a wet processing device rotary dryer, which detects the generation of fragments when the rotary dryer rotates at a high speed, and avoids more fragmentation to improve the yield.
本發明之次一目的在提供一種濕製程設備旋乾機偵測破片之裝置,以簡單有效之裝置偵測破片之產生,減少設備成本。A second object of the present invention is to provide a device for detecting a fragment of a wet process equipment rotary dryer, which can detect the generation of fragments by a simple and effective device, and reduce equipment costs.
為達成上述目的及其他目的,本發明之第一觀點教導一種濕製程設備旋乾機偵測破片之方法,於旋乾機高速旋轉晶圓夾時偵測破片之產生,而停止旋轉以避免更多破片產生,包括:在晶圓夾外週邊增設一個偵測網,於高速旋轉產生破片時,將破片撞擊偵測網產生之變形張力轉換為撞擊信號;撞擊信號經由控制電路控制旋乾機停止旋轉;控制電路發出警告信號,促使操作人員清除破片並維修偵測網;維修完成再繼續旋乾操作。In order to achieve the above and other objects, the first aspect of the present invention teaches a method for detecting a fragment by a wet process equipment spin dryer, which detects the generation of a fragment when the spin dryer rotates the wafer clip at a high speed, and stops rotating to avoid further A plurality of fragments are generated, including: adding a detection net around the outer periphery of the wafer holder, and transforming the deformation tension generated by the fragment collision detection net into an impact signal when the high-speed rotation generates the fragment; the impact signal is controlled by the control circuit to control the rotary dryer. Rotation; the control circuit sends a warning signal to prompt the operator to clear the fragment and repair the detection net; the maintenance is completed and then the spin-drying operation is continued.
本發明之另一觀點教導一種濕製程設備旋乾機偵測破片之裝置,套裝於晶圓夾之外圍,利用偵測網偵測破片之產生,至少包括:一個偵測網座,為圓筒狀,兩端為上環及下環,由支柱固定,以套裝於晶圓夾之外圍,使晶圓夾能在其中旋轉;一組偵測網,由一組金屬線構成,每一金屬線之一端固定於上環,另一端固定於下環,其中一端與偵測元件連接,金屬線間之間隙使旋乾時之水或蝕刻液通過。金屬線為不銹鋼或塑材,金屬線間之間隙為1 mm至5 mm,較佳為3 mm,直徑為0.2 mm至1 mm,較佳為0.5 mm。有破片時破片撞擊該偵測網,偵測元件將偵測網產生之變形張力信號、阻抗改變信號或聲頻信號轉換為撞擊信號;一組控制電路,於收到撞擊信號時,發出警告信號,並控制旋乾機停止旋轉。Another aspect of the present invention teaches a device for detecting a fragment of a wet-process device rotary dryer, which is disposed on the periphery of the wafer holder and detects the generation of the fragment by using the detection net, and at least includes: a detection net holder, which is a cylinder The upper end and the lower ring are fixed by the struts to fit around the periphery of the wafer holder to enable the wafer holder to rotate therein; a set of detection nets consisting of a set of metal wires, each metal wire One end is fixed to the upper ring, and the other end is fixed to the lower ring, one end of which is connected to the detecting element, and the gap between the metal wires passes through the water or the etching liquid when the spin is dry. The metal wires are stainless steel or plastic, and the gap between the wires is 1 mm to 5 mm, preferably 3 mm, and the diameter is 0.2 mm to 1 mm, preferably 0.5 mm. When there is a fragment, the fragment hits the detection network, and the detecting component converts the deformation tension signal, the impedance change signal or the audio signal generated by the detection network into an impact signal; and a set of control circuit sends a warning signal when receiving the impact signal. And control the spin dryer to stop rotating.
本發明之以上及其他目的及優點參考以下之參照圖示及最佳實施例之說明而更易完全瞭解。The above and other objects and advantages of the present invention will be more fully understood from the description and appended claims appended claims.
請參考第2圖,第2圖係依據本發明實施例濕製程設備旋乾機增加破片偵測裝置之透視圖。具有破片偵測裝置之旋乾機200,於製程腔體101與晶圓夾102之間,增加破片偵測網座202,偵測網座202為圓筒狀,兩端為上環204及下環206,由四支支柱210固定,以套裝於晶圓夾之外圍,使晶圓夾102能在其中旋轉;一組偵測網208,由一組金屬線構成,金屬線為不銹鋼或塑材構成,金屬線間之間隙為1 mm至5 mm,較佳為3 mm。直徑為0.2 mm至1 mm,較佳為0.5 mm。每一金屬線之一端固定於上環204,另一端固定於該下環206,其中一端與偵測元件連接(未圖示),金屬線間之間隙使旋乾時之水或蝕刻液通過,有破片時破片撞擊該偵測網208,偵測元件將偵測網產生之變形張力或阻抗改變轉換為撞擊信號,控制電路(未圖示),於收到撞擊信號時,發出警告信號,並控制旋乾機使其停止旋轉。Please refer to FIG. 2, which is a perspective view of a wet filming device for adding a fragment detecting device according to an embodiment of the present invention. The rotary dryer 200 with the fragment detecting device increases the fragment detecting net holder 202 between the processing chamber 101 and the wafer holder 102. The detecting net base 202 is cylindrical, and the upper end is the upper ring 204 and the lower ring. 206, fixed by four pillars 210 to fit around the periphery of the wafer holder to enable the wafer holder 102 to rotate therein; a set of detection nets 208 consisting of a set of metal wires, the metal wires being made of stainless steel or plastic material The gap between the wires is 1 mm to 5 mm, preferably 3 mm. The diameter is from 0.2 mm to 1 mm, preferably 0.5 mm. One end of each metal wire is fixed to the upper ring 204, and the other end is fixed to the lower ring 206, one end of which is connected to the detecting element (not shown), and the gap between the metal wires passes through the water or the etching liquid when the spin is dry, When the fragment is broken, the fragment hits the detection net 208, and the detecting component converts the deformation tension or impedance change generated by the detection net into an impact signal, and the control circuit (not shown) issues a warning signal when receiving the impact signal, and controls The spin dryer stops it from rotating.
第3圖顯示偵測網之側面透視圖。第3圖(A)為偵測網倒臥之側面透視圖。第3圖(B)為偵測網直立之側面透視圖。偵測網座202兩端為上環204及下環206,由四支支柱210-1、210-2、210-3及210-4固定。Figure 3 shows a side perspective view of the detection net. Figure 3 (A) is a side perspective view of the detection net lying down. Figure 3 (B) is a side perspective view of the detection net upright. The two ends of the detection net base 202 are an upper ring 204 and a lower ring 206, and are fixed by four legs 210-1, 210-2, 210-3 and 210-4.
藉由以上較佳之具體實施例之詳述,係希望能更加清楚描述本創作之特徵與精神,而並非以上述所揭露的較佳具體實例來對本發明之範疇加以限制。相反的,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範疇內。The features and spirit of the present invention are more clearly described in the detailed description of the preferred embodiments of the present invention, and are not intended to limit the scope of the invention. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the invention as claimed.
100...濕製程設備旋乾機100. . . Wet process equipment rotary dryer
101...製程腔體101. . . Process chamber
102...晶圓夾102. . . Wafer clip
103...排水槽103. . . Drainage channels
200...具有破片偵測裝置之旋乾機200. . . Rotary dryer with fragment detection device
202...破片偵測網座202. . . Fragment detection net
204...上環204. . . Sheung Wan
206...下環206. . . Lower ring
208...偵測網208. . . Detection network
210...支柱210. . . pillar
第1圖為習知濕製程設備旋乾機之透視圖。Figure 1 is a perspective view of a conventional wet process equipment spin dryer.
第2圖係依據本發明實施例濕製程設備旋乾機增加破片偵測裝置之透視圖。Fig. 2 is a perspective view showing the addition of the fragment detecting device of the wet processing apparatus rotary dryer according to the embodiment of the present invention.
第3圖顯示偵測網之側面透視圖;Figure 3 shows a side perspective view of the detection net;
第3圖(A)為偵測網倒臥之側面透視圖;Figure 3 (A) is a side perspective view of the detection net lying down;
第3圖(B)為偵測網直立之側面透視圖。Figure 3 (B) is a side perspective view of the detection net upright.
101‧‧‧製程腔體101‧‧‧Processing cavity
102‧‧‧晶圓夾102‧‧‧ wafer clip
103‧‧‧排水槽103‧‧‧Drainage trough
200‧‧‧具有破片偵測裝置之旋乾機200‧‧‧Rotary dryer with fragment detection device
202‧‧‧破片偵測網座202‧‧‧ Fragment detection network
204‧‧‧上環204‧‧‧Sheung Wan
206‧‧‧下環206‧‧‧The ring
208‧‧‧偵測網208‧‧‧Detection Network
210‧‧‧支柱210‧‧‧ pillar
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TWI492319B true TWI492319B (en) | 2015-07-11 |
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Citations (4)
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US5221360A (en) * | 1987-04-27 | 1993-06-22 | Semitool, Inc. | Semiconductor processor methods |
JPH07130821A (en) * | 1993-11-09 | 1995-05-19 | Nec Kyushu Ltd | Method for detecting breakdown of semiconductor wafer |
JPH09297297A (en) * | 1996-05-09 | 1997-11-18 | Hitachi Ltd | Rotary type drying method for lcd glass substrate and device therefor |
US6571488B2 (en) * | 2001-05-08 | 2003-06-03 | Mosel Vitelic, Inc. | System for sensing position of spin dryer cover |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US5221360A (en) * | 1987-04-27 | 1993-06-22 | Semitool, Inc. | Semiconductor processor methods |
JPH07130821A (en) * | 1993-11-09 | 1995-05-19 | Nec Kyushu Ltd | Method for detecting breakdown of semiconductor wafer |
JPH09297297A (en) * | 1996-05-09 | 1997-11-18 | Hitachi Ltd | Rotary type drying method for lcd glass substrate and device therefor |
US6571488B2 (en) * | 2001-05-08 | 2003-06-03 | Mosel Vitelic, Inc. | System for sensing position of spin dryer cover |
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