TWI489936B - Coating structure of thermal conductivity having direction - Google Patents

Description

Directional thermal conductive coating structure

The invention relates to a directional thermal conductive coating structure, in particular to a long column crystal which is designed to have an offset angle from the normal direction of the crystal surface by controlling the crystal growth direction of the thermal conductive coating structure, so that the thermal energy of the heat source body can be The directional long column crystal is conducted to a predetermined position for heat dissipation operation, so that the overall size of the electronic device is designed to be relatively flexible, which not only greatly enhances the heat dissipation effect, but also achieves the purpose of miniaturization of the electronic device.

In daily life, in many electrical and electronic devices, many electronic components, such as light-emitting diodes or central processing units (CPUs), etc., are usually provided, and these electronic components usually continue to release heat energy during operation. Heat sources; in many cases, these heat sources can have many adverse effects, such as: reducing the load on the crash, shortening the service life, or slowing down the operation, resulting in reduced operational efficiency; therefore, In many electrical and electronic devices, at least one heat-dissipating module is added to the heat source to dissipate the heat energy released by the heat-dissipating source. In the current heat-dissipating module, most of the technologies are oriented toward materials and structures to improve heat dissipation. The effect is that materials tend to use materials with high thermal conductivity to improve the efficiency of heat conduction. In terms of structure, most of them tend to increase the surface area of the heat dissipation module, thereby improving the heat exchange efficiency with the external environment; therefore, the existing The heat dissipation module is mostly made up of a heat dissipation base and a plurality of heat dissipation fins extending from the heat dissipation body, thereby increasing the surface area of the heat dissipation module, thereby improving the heat exchange efficiency; thus, the size of the electronic device cannot be increased. Miniaturization.

Please refer to the Republic of China Invention Patent Publication No. 200632128 "heat-dissipating metal surface coating structure and its manufacturing method", which provides a heat-dissipating metal surface coating structure and a manufacturing method thereof, the heat-dissipating metal surface coating structure comprising at least one heat-dissipating metal and a carbon structure of a frame structure formed on a surface of a heat dissipating metal surface, and the heat dissipating metal may be a copper or aluminum alloy or a metal having a high thermal conductivity; and the film process method may be chemical vapor deposition or physical vapor deposition. Or other material preparation methods are completed; however, in the above case, the heat-dissipating coating structure is a divergent heat dissipation, which means that the non-directional comprehensive heat dissipation, not only has the problem of poor heat dissipation, the application thereof There are also restrictions on how to develop a coating structure that can control the direction of heat dissipation, so that it has multiple heat dissipation directions, and thus greatly improve the heat dissipation effect. It is waiting for the relevant industry to think about the goal and direction of breakthrough.

Now, the inventor is in view of the above-mentioned existing heat dissipation structure suitable for an electronic device. There are still many defects in the actual implementation, so it is a tireless spirit, and it is improved by its rich professional knowledge and years of practical experience, and the invention is developed accordingly.

The main object of the present invention is to provide a long column crystal which has an offset angle from the normal direction of the crystal plane by controlling the crystal growth direction of the thermal conductive coating structure, so that the thermal energy of the heat source body can be conducted by the directional long column crystal conduction. The heat dissipation action is performed to the predetermined position, so that the overall size of the electronic device is designed to have a relatively large elasticity, not only to achieve a specific direction of conduction heat flow, but also to have a plurality of heat dissipation flow directions, effectively transferring heat, thereby greatly improving the heat dissipation effect, and The utility model saves the space occupied by the traditional heat sink device in the electronic device and achieves the purpose of miniaturization of the electronic device.

In order to achieve the above-mentioned implementation object, the inventors propose a directional thermal conductive coating structure for coating a heat source surface of an electronic device (which may be, for example, a consumer electronic product such as a panel, a light emitting diode, or a central processing unit). The thermally conductive coating structure is mainly composed of a plurality of long column crystals formed by a ceramic material by, for example, chemical vapor deposition or physical vapor deposition, and the long column crystal may be a hexagonal crystal, a tetragonal crystal or an orthorhombic crystal. First, the long columnar crystal system has a nanometer scale and is periodically arranged, wherein each long column crystal has an offset angle from a normal direction of the crystal face thereof, so that the heat energy of the heat source body can be conducted by the long column crystal To the predetermined position for performing the heat dissipation operation; thereby, the heat energy of the heat source body can be conducted to the predetermined position by the directional long column crystal to perform the heat dissipation operation, so that the heat energy can be collected to a specific place and then discharged or dissipated. The device (such as a fan) takes away the heat to achieve the purpose of miniaturization of the electronic device. It can control the heat dissipation direction and increase the heat dissipation direction of multiple parties, thus achieving the effect of greatly improving heat dissipation.

In an embodiment of the invention, the thermally conductive coating structure has long column crystals with different offset angles, thereby achieving multi-side heat dissipation flow to enhance heat dissipation.

In an embodiment of the invention, the offset angle is in the range of 5° to 50°, preferably in the range of 15° to 45°.

In an embodiment of the invention, the thermal conductive coating structure has transparency, so that the thermal conductive coating can achieve the effect of conducting heat flow in a specific direction without affecting the appearance of the electronic device, thereby increasing the aesthetic and commercial benefits of the electronic device.

(1) ‧‧‧thermal coating structure

(11)‧‧‧Long column crystal

(12)‧‧‧ Crystallized surface

(2) ‧ ‧ heat source

First: a schematic cross-sectional view of a directional thermal conductive coating structure according to a preferred embodiment of the present invention

Second: Scanning electron microscope (SEM) cross-section of a thermally conductive coating structure having a long-column crystal without an offset angle in a preferred embodiment of the present invention

Third: Scanning electron microscope (SEM) cross-section of a thermally conductive coating structure having a 15° offset angle of a long column crystal according to a preferred embodiment of the present invention

Fourth: Scanning electron microscope (SEM) cross-section of a thermally conductive coating structure having a 30° offset angle of a long column crystal according to a preferred embodiment of the present invention

The object of the present invention and its structural and functional advantages will be explained in conjunction with the specific embodiments according to the structure shown in the following drawings, so that the reviewing committee can have a more in-depth and specific understanding of the present invention.

First, referring to the first figure, a schematic cross-sectional view of a directional thermal conductive coating structure according to a preferred embodiment of the present invention; it is noted that the directional thermal conductive coating structure (1) of the present invention is used for draping Covering the surface of the heat source body (2) of the electronic device, wherein the electronic device can be, for example, a consumer electronic product such as a panel, a light emitting diode or a central processing unit; the thermally conductive coating structure (1) of the present invention is mainly made of a ceramic material. Formed by a plurality of long column crystals (11) which are in a nanometer order and have a periodic arrangement in which the normal direction of each long column crystal (11) and its crystal plane (12) Having an offset angle θ, the thermal energy of the heat source body (2) can be conducted to a predetermined position by the long column crystal (11) for heat dissipation operation; wherein the heat conductive coating structure (1) can be deposited by chemical vapor deposition ( For example, vapor deposition or ion sputtering, etc., or a physical vapor deposition (such as organic metal chemical vapor deposition (MOCVD) or microwave plasma assisted chemical vapor deposition (MPCVD), etc.) And various other common or innovative coatings The method can also be used to implement the thermally conductive coating structure (1) of the present invention; it is noted here that the subject matter of the present invention is not in the coating process method employed, and many related process methods have been extensively disclosed in the literature. Or in the prior art, the process of the thermally conductive coating structure (1) will not be described again.

In addition, in the present embodiment, the thermally conductive coating structure (1) may have long column crystals (11) having different offset angles θ, for example, the right half of the first figure, the long column crystals (11) are shifted to the right, The long column crystal (11) in the left half is shifted to the left, wherein the angle θ of the long column crystal (11) and the normal direction of the crystal face (12) may be between 5° and 50°, preferably Further, the long column crystal (11) may be one of a hexagonal crystal, a tetragonal crystal or an orthorhombic crystal depending on the type of the ceramic material, and is not limited thereto.

When the directional thermal conductive coating structure (1) according to the above preferred embodiment is used in practice, please refer to the first figure, when the surface of the heat source body (2) (for example, the panel) of the electronic device is covered with the present invention. In the thermal conductive coating structure (1), the thermal energy of the heat source body (2) can be conducted to a predetermined position by the directional long column crystal (11) for heat dissipation, and the thermal energy diffusion mode is as shown in the first figure. No. so that the heat energy can be collected to a specific place and then discharged or taken away by a fan; wherein the heat conductive coating structure (1) of the present invention can have transparency so that it does not affect the appearance of the electronic device, thereby increasing Aesthetic and commodity benefits.

Please refer to the second figure, which is a 1 μm analytical scanning electron microscope (SEM) cross-sectional view of a thermally conductive coating structure according to a preferred embodiment of the present invention, wherein the long column crystal (11) does not have an offset angle, that is, a thermally conductive coating structure. (1) The long column crystal (11) does not have an offset angle θ with the normal direction of the crystal plane (12), so the purpose of conducting heat flow in a specific direction cannot be achieved; please refer to the third and fourth figures, respectively. Scanning electron microscopy of a thermally conductive coating structure with long column crystals at 15° and 30° offset angles SEM (cross-sectional view); thereby, in the design of the electronic device, the heat source body (2) can be placed at the position of the optimal structure, and then the thermal conductive coating structure (1) the crystal growth direction is designed to design the required offset angle θ It not only controls the heat dissipation direction, but also increases the heat dissipation direction of multiple parties, thereby achieving the effect of greatly improving heat dissipation, and also conforming to the optimal position design of the heat sink (such as a fan) to achieve the purpose of miniaturization of the electronic device.

It should be noted that the thermal conductive coating structure (1) of the present invention has an offset angle θ between the long column crystal (11) and the normal direction of the crystal plane (12), which can be designed by controlling the crystal growth direction according to actual needs, so The extent of the offset angle θ is the spirit of the invention, and the resulting effects are the same as the technical advantages, and should be considered as equivalent variations or modifications of the present invention.

It can be seen from the above description that the present invention has the following advantages compared with the prior art:

1. The present invention designs a long column crystal having an offset angle from the normal direction of the crystal plane by controlling the crystal growth direction of the thermally conductive coating structure, so that the thermal energy of the heat source body can be conducted to a predetermined position by the directional long column crystal. In order to dissipate heat, not only can the heat flow be transmitted in a specific direction, but also the heat dissipation direction can be effectively transmitted, thereby effectively transferring heat, thereby greatly improving the heat dissipation effect, which is of great benefit to protecting the service life of the electronic device.

2. The long column crystal of the invention discharges the heat energy of the heat source body according to the required path, and can be designed with the optimized position of the heat sink device, so that the entire electronic device saves a lot of space occupied by the conventional heat sink device, not only taking into consideration the heat dissipation. Efficiency, and at the same time reach electronic equipment Set the purpose of miniaturization.

In summary, the directional thermal conductive coating structure of the present invention can achieve the intended use efficiency by the above-disclosed embodiments, and the present invention has not been disclosed before the application, and has completely complied with the patent law. Regulations and requirements.爰Issuing an application for a patent for invention in accordance with the law, and asking for a review, and granting a patent, is truly sensible.

The illustrations and descriptions of the present invention are merely preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; those skilled in the art, which are characterized by the scope of the present invention, Equivalent variations or modifications are considered to be within the scope of the design of the invention.

(1) ‧‧‧thermal coating structure

(11)‧‧‧Long column crystal

(12)‧‧‧ Crystallized surface

(2) ‧ ‧ heat source

Claims (8)

A directional thermal conductive coating structure is coated on the surface of a heat source body of an electronic device, and the heat conductive coating structure is mainly composed of a plurality of long column crystals formed by the growth of a ceramic material, and the long columnar crystal system has a nanometer scale and has Periodically arranged, wherein each long column crystal has an offset angle from a normal direction of the crystal face thereof, so that the heat energy of the heat source body is conducted to the predetermined position by the elongated column crystal to perform heat dissipation, wherein the offset angle is In the range of 5 ° ~ 50 °. The directional thermal conductive coating structure according to claim 1, wherein the thermally conductive coating structure is a long column crystal having different offset angles. The directional thermal conductive coating structure according to claim 1, wherein the offset angle is in the range of 15° to 45°. The directional thermal conductive coating structure according to claim 1, wherein the long columnar crystal system is one of a hexagonal crystal, a tetragonal crystal or an orthorhombic crystal. The directional thermal conductive coating structure according to claim 1, wherein the electronic device is a consumer electronic product. The directional thermal conductive coating structure according to claim 1, wherein the thermally conductive coating structure has transparency. The directional thermal conductive coating structure as described in claim 1 of the patent application, wherein the The thermally conductive coating structure is formed by a chemical vapor deposition. The directional thermal conductive coating structure according to claim 1, wherein the thermally conductive coating structure is formed by a physical vapor deposition.