TWI488341B - Insulator-integrated leadframe assembly, led package and led light bar - Google Patents

Insulator-integrated leadframe assembly, led package and led light bar Download PDF

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Publication number
TWI488341B
TWI488341B TW101112796A TW101112796A TWI488341B TW I488341 B TWI488341 B TW I488341B TW 101112796 A TW101112796 A TW 101112796A TW 101112796 A TW101112796 A TW 101112796A TW I488341 B TWI488341 B TW I488341B
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TW
Taiwan
Prior art keywords
frame
lead frame
body
connecting
direction
Prior art date
Application number
TW101112796A
Other languages
Chinese (zh)
Other versions
TW201342667A (en
Inventor
Chiou Yueh Wang
Chen Hsiu Lin
Shih Chang Hsu
Original Assignee
Lite On Electronics Guangzhou
Lite On Technology Corp
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Application filed by Lite On Electronics Guangzhou, Lite On Technology Corp filed Critical Lite On Electronics Guangzhou
Priority to TW101112796A priority Critical patent/TWI488341B/en
Publication of TW201342667A publication Critical patent/TW201342667A/en
Application granted granted Critical
Publication of TWI488341B publication Critical patent/TWI488341B/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Description

Connecting sheet, LED package and LED strip

The invention relates to a connecting piece for a leadless package, in particular to a quad flat no-lead (QFN) connecting piece for packaging a light emitting diode chip and The light-emitting diode package and the light bar formed by the same.

When a light emitting diode (LED) wafer is packaged in a QFN package, a metal plate is first etched to form a plurality of lead frame units arranged in a matrix, and each of them is molded by a molding method. An insulating housing of a lead frame unit is formed on the metal plate to form a continuous web, wherein each lead frame unit is used to set the wafer. The continuous web can be formed into a plurality of cells, each of which comprises a single lead frame unit and an insulating housing.

However, in the existing connecting sheet for the QFN package, all the insulating housings corresponding to the lead frame units are connected together to form a whole large-area plastic structure. Due to the different thermal expansion coefficients of the plastic material and the metal material, the molding process of the insulating shell has easily caused the warpage of the continuous web, and the baking of the packaging process for a long time is more problematic, which may result in Poor packaging yield and affect the reliability of the package.

In addition, in general, the LED chip needs to cooperate with the phosphor layer to form white light. When the package is coated with the phosphor layer, the wafer needs to be illuminate to dynamically adjust the content and distribution area of the fluorescent material of the phosphor layer, due to the existing continuous material sheet. The lead frame units are connected together, that is, all the lead frame units are electrically connected, and the package unit cannot be directly detected on the connecting piece, so that the connecting piece needs to be cut into separate package monomers. The package monomer can be tested.

Accordingly, it is an object of the present invention to provide a web for a quad flat planar leadless package that is less susceptible to warpage.

Another object of the present invention is to provide a web for a quad flat planar leadless package that can be inspected on a web.

Still another object of the present invention is to provide a package of a square planar leadless package type light emitting diode.

It is still another object of the present invention to provide a light bar that connects a plurality of light emitting diode packages.

Therefore, the connecting sheet of the present invention comprises a lead frame and a plurality of insulating shell connecting strips. The lead frame connecting plate comprises a frame body and a plurality of lead frame units, wherein the lead frame unit is arranged in a matrix in a first direction and a second direction perpendicular to each other, and each lead frame unit comprises a first frame a body, a second frame spaced from the first frame, and a connecting structure. The connecting structure extends in at least one of the first direction and the second direction, so that the lead frame unit is connected to the adjacent lead frame unit in at least one direction and the lead frame unit of the adjacent frame is connected to the frame. The insulating housing connecting strips are formed on the lead frame connecting plate at intervals, and each insulating housing connecting strip covers the lead frame unit in the same row in a first direction and extends to cover a frame adjacent to both ends of the row of lead frame units One part of the body, and at least the bottom surface of the first frame of each lead frame unit and the bottom surface of the second frame are exposed. Thereby, the stress residual and the board warpage caused by the difference in thermal expansion coefficient between the metal material and the insulating material can be reduced, and the amount of the insulating material can be reduced to save the material cost.

According to an embodiment, the first frame and the second frame of each lead frame unit are arranged along the second direction, and the connection structure of each lead frame unit is formed by a plurality of connecting strips, and the connecting strips are respectively The two sides of the first body and the second frame parallel to the second direction extend outward in the first direction. Further, each of the insulating housing connecting strips has a plurality of notches, each of the notches correspondingly exposing a connecting strip between the second frame bodies of the adjacent two lead frame units, and between the adjacent two second frame bodies The tie bar is broken. Thereby, the electrical independence of each lead frame unit can be detected on the connecting piece, which facilitates the work of package inspection and improves the accuracy of the color coordinate position of the single LED package.

According to an embodiment, each of the insulating housing connecting strips has a plurality of concave cup structures, and each concave cup structure correspondingly exposes a first top surface of each lead frame unit and a partial top surface of the second frame for providing a wafer . Each of the insulating housing connecting strips has a plurality of filling portions, each of the filling portions respectively corresponding to a gap between the first frame body and the second frame body filling each lead frame unit, and each filling portion is formed by a corresponding concave cup structure The exposed portion protrudes from the top surface of the first frame and the top surface of the second frame and the convex portion extends to both sides to cover a portion of the top surface of the first frame and a portion of the top surface of the second frame. This can block the intrusion of moisture from the bottom.

According to an embodiment, the frame body has an outer frame portion and a plurality of extension portions, and the extension portion extends from the outer frame portion toward the lead frame unit and is connected to the adjacent lead frame unit, and each extension portion is formed with At least one through hole, each of the two ends of the insulating shell connecting strip respectively covers the corresponding extending portion and fills the through hole, and the connecting portion of the insulating shell connecting strip and the frame can be increased by the extending portion and the through hole.

According to an embodiment, the first frame of each lead frame unit has a first base portion and a first protruding portion, the first base portion is coupled with the insulating housing connecting strip, and the first protruding portion is convex in the second direction. An insulating housing connecting strip is exposed; the second frame of each lead frame unit has a second base portion and a second protruding portion, the second base portion is coupled to the insulating housing connecting strip, and the second protruding portion is opposite to The direction of the first projection protrudes from the insulating case connecting strip. Each of the lead frame units may further include a plurality of stepped structures formed on at least a portion of the first frame at a periphery of the bottom surface of the first base and at least a portion of the second frame at a periphery of the bottom of the second base. Each of the lead frame units may further include a plurality of recessed structures respectively formed on the first frame at least a portion of the periphery of the bottom surface of the first protrusion and at least one of the second frame at the periphery of the bottom surface of the second protrusion Part of the area. The stepped structure may be filled with the insulating housing connecting strip to cover the periphery of the bottom surface of the first base and the second base, and expose the bottom surface to increase the bonding of the insulating shell connecting strip and the lead frame unit. Moreover, the recessed structure can be filled with solder to increase the soldering strength of the leadframe unit and the circuit board.

The light emitting diode package of the present invention comprises: a lead frame unit, an insulating case and at least one wafer. The lead frame unit includes a first frame body, a second frame body, and a plurality of connecting strips. The first frame body and the second frame body are arranged at intervals in a line direction, and the connecting strips extend outward from the two sides of the first frame body and the second frame body in parallel with the linear direction. Insulated housing covered lead frame And exposing at least the bottom surface of the first frame body of the lead frame unit and the bottom surface of the second frame body, and the end surface of the connecting bar connected to the first frame body is aligned with the side surface of the insulating case, and the insulating case has a plurality of The corners are separated, and the connecting strips connected to the second frame are respectively exposed to the insulating case. The wafer is disposed on the lead frame unit and electrically connected to the lead frame unit.

According to an embodiment, the insulative housing has a concave cup structure corresponding to the first frame of the lead frame unit and a portion of the top surface of the second frame for providing the wafer. The insulating housing further has a filling portion, the filling portion fills a gap between the first frame body and the second frame body of the lead frame unit, and a portion of the filling portion exposed by the concave cup structure protrudes from a top surface of the first frame body and The top surface of the second frame and the convex portion extend to both sides to cover a portion of the top surface of the first frame and a portion of the top surface of the second frame. The concave cup structure may be in the form of a deep cup or a shallow cup, and the height of the concave cup structure in the form of a shallow cup is between 0.5 and 1.5 times the thickness of the wafer. Further, the light emitting diode package may further include a lens body connected to the insulating case and covering the concave cup structure and the wafer; or may include a light transmitting body filled in the concave cup structure to seal the wafer.

According to an embodiment, the LED package further includes a lens body, and the insulating case and the lens body are integrally formed by the light transmissive material.

The light emitting diode light bar of the present invention comprises: a plurality of lead frame units and an insulating case connecting strip. The plurality of lead frame units are arranged along a first direction, and each lead frame unit comprises a first frame body, a second frame body, and a connecting structure, and the first frame body and the second frame body are along a first One direction is perpendicular to the second direction, and the connection structure of each lead frame unit is composed of a plurality of connecting strips, and the connecting strips are respectively parallelized by the first frame body and the second frame body in the second direction The first direction extends outwardly, wherein the connecting strips between the adjacent two first frames are connected, and the connecting strip between the adjacent two second frames is disconnected. The insulating housing connecting strip covers the lead frame unit in a first direction, and at least exposes a bottom surface of the first frame body of each lead frame unit and a bottom surface of the second frame body, and the insulating housing connecting strip has a plurality of notches. Each of the notches corresponds to expose a connecting strip between the adjacent two second frames.

According to the invention, the continuous sheet of the invention can reduce stress residual and the problem of panel warpage caused by the difference in thermal expansion coefficient between the metal material and the insulating material, and can reduce the amount of the insulating material to save material cost. Further, each lead frame unit can be electrically independent to perform detection on the connecting piece to facilitate the inspection and inspection work. In addition, the content of the fluorescent material and the distribution area can be adjusted in real time through the detection result, thereby improving the accuracy of the color coordinate position of the single LED package.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the invention.

Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 1 to FIG. 4, a preferred embodiment of the continuous board of the present invention is used to package a light-emitting diode chip 9 (see FIG. 6). The connecting sheet comprises: a lead frame connecting plate 100 and a plurality of insulation. The housing connecting strip 200, for the sake of convenience of description, the insulating housing connecting strip 200 of the first row of the right side in FIGS. 1 to 4 is not shown, and in FIGS. 3 and 4, the area of the insulating housing connecting strip 200 It is represented by the bottom of the net and is used to separate from the lead frame 100.

The lead frame connecting plate 100 includes a frame body 10 and a plurality of lead frame units 1 which are etched by a metal plate, and all of the lead frame units 1 are matrixed in a first direction I and a second direction II perpendicular to each other. Arranged in the frame body 10, and each lead frame unit 1 includes a first frame body 11, a second frame body 12 spaced apart from the first frame body 11, and a connecting structure. In this embodiment, each The first frame body 11 and the second frame body 12 of the lead frame unit 1 are arranged at intervals in the second direction II, and the connection structure of each lead frame unit 1 is composed of a plurality of connecting bars 13, and the connecting bars 13 are respectively Both the body 11 and the second frame 12 extend parallel to the second direction II in the first direction I. That is, in the present embodiment, the connection structure extends in the first direction I, so that the lead frame unit 1 is connected to the adjacent lead frame unit 1 in the first direction I and the lead frame unit 1 of the adjacent frame 10 is The frame 10 is connected.

The insulating case connecting strips 200 are formed on the lead frame connecting plate 100 at a distance from each other in a molding manner, and each of the insulating case connecting strips 200 covers the lead frame unit 1 in the same row and extends in the first direction I. A portion of the frame 10 adjacent to both ends of the row of lead frame units 1 (i.e., the extension 102 of the frame 10, as described in more detail below) is covered. The first frame 11 of each lead frame unit 1 has a first base portion 111 and a first protruding portion 112. The first base portion 111 is coupled to the insulating housing connecting strip 200, and the first protruding portion 112 is along the second portion. The direction II protrudes from the insulative housing connecting strip 200. The second frame 12 of each lead frame unit 1 has a second base portion 121 and a second protruding portion 122. The second base portion 121 is coupled to the insulating housing connecting strip 200, and the second protruding portion 122 faces oppositely The direction of the first protruding portion 112 protrudes from the insulating case connecting strip 200. The first frame body 11 further has a top surface 113 and a bottom surface 114 on opposite sides. The second frame body 12 also has a top surface 123 and a bottom surface 124. The top surface 113 of the first frame body 11 and the second surface The top surface 123 of the frame body 12 is used for electrically connecting the wafers 9, and the bottom surface 114 of the first frame body 11 and the bottom surface 124 of the second frame body 12 are for soldering to a circuit board (not shown).

Each of the lead frame units 1 further includes a plurality of stepped structures 141 formed on a portion of the first frame 11 at a periphery of the bottom surface 114 of the first base portion 111 and the second frame 12 at a bottom surface 124 of the second base portion 121. A part of the perimeter. Each of the lead frame units 1 further includes a plurality of recessed structures 142 formed in a portion of the first frame 11 at a periphery of the bottom surface 114 of the first protrusion 112 and the second frame 12 at the second protrusion. A portion of the periphery of the bottom surface 124 of the 122, the recessed structures 142 of the first frame 11 and the second frame 12 may be symmetrically disposed. The stepped structure 141 is filled with the insulating case connecting strip 200 to cover the periphery of the bottom surfaces 114, 124, and exposes the bottom surfaces 114, 124 to increase the bonding of the insulating case connecting strip 200 to the lead frame unit 1. Moreover, the recess structure 142 can be filled with solder (not shown) to increase the soldering strength with the board. Moreover, each of the lead frame units 1 further includes two blind holes 15 respectively formed on the top surface 113 of the first frame body 11 and the top surface 123 of the second frame body 12. The blind holes 15 are located in the insulating case connecting strip 200. The position covered thereby thereby increasing the bondability of the insulating housing link 200 and the lead frame unit 1. In this embodiment, the top surface 113 of the first frame body 11 and the top surface 123 of the second frame body 12 respectively form a blind hole 15 and are curved in shape, but in other equivalent embodiments, the first frame body The top surface 113 of the 11 and the top surface 123 of the second frame 12 may also be formed with a plurality of blind holes 15 respectively, and the shape may also be changed without being curved.

In addition, the frame 10 of the lead frame 100 has an outer frame portion 101 and a plurality of extending portions 102 extending from the outer frame portion 101 in a direction relatively close to the lead frame unit 1 and adjacent to the lead frame The unit 1 is connected, and each of the extending portions 102 is formed with at least one through hole 103, which is one in the embodiment, but each of the extending portions 102 may also form a plurality of through holes 103. The two ends of each of the insulating case connecting strips 200 respectively cover the corresponding extending portions 102 and fill the through holes 103. The extending portions 102 and the through holes 103 can increase the bonding of the insulating case connecting strips 200 to the frame 10.

In this embodiment, each of the insulating housing connecting strips 200 has a plurality of concave cup structures 21, and each concave cup structure 21 correspondingly exposes a portion of the first frame body 11 and the second frame body 12 of each lead frame unit 1 The faces 113 and 123 are provided for the wafer 9 (see FIG. 6), and each of the insulating case connecting strips 200 has a plurality of filling portions 22 (further with reference to FIG. 5), and each of the filling portions 22 respectively fills each of the wires. a gap between the first frame body 11 and the second frame body 12 of the frame unit 1, and a portion of each of the filling portions 22 exposed by the corresponding concave cup structure 21 protrudes from the top surface 113 of the first frame body 11 and the second frame The top surface 123 of the body 12 and the convex portion extend to both sides to cover a portion of the top surface 113 of the first frame 11 and a portion of the top surface 123 of the second frame 12, thereby preventing moisture from invading from the bottom. Of course, if used to package a flip chip, the filling portion 22 is not higher than the top surface 113 of the first frame 11 and the top surface 123 of the second frame 12.

The insulating housing connecting strips 200 are spaced apart from each other without being connected (ie, the insulating housing connecting strips 200 extend only in the first direction I, and each insulating housing connecting strip 200 is not connected to each other in the second direction II), and insulation can be avoided. Large-area connection of materials reduces stress residuals and plate warpage caused by the difference in thermal expansion coefficient between metal materials and insulating materials, and can reduce the amount of insulating materials to save material costs. Furthermore, in the present embodiment, the insulating housing connecting strip 200 is made of a mixture of a plastic material and a filling material, and the filling material may be glass fiber, carbon fiber, boron nitride, magnesium oxide, zinc oxide, cerium oxide, Titanium dioxide, aluminum oxide, tantalum carbide, talc, mica, calcium carbonate, barium carbonate, magnesium carbonate, etc., the filler content is at least 60% by weight, and preferably 80% by weight or more, which can reduce the coefficient of thermal expansion between the insulating material and the metal material. Differences further reduce the problem of board warping. In other embodiments, the insulative housing tie strip 200 can be a silicone material.

In this embodiment, each of the insulating housing connecting strips 200 further has a plurality of notches 201, and each of the notches 201 correspondingly exposes the connecting strips 13 between the second frames 12 of the adjacent two leadframe units 1 and adjacent thereto. The connecting strip 13 between the two second frames 12 is broken. The notch 201 is configured to facilitate the separate cutting of the connecting strips 13 between the second frame bodies 12 after the insulating shell connecting strips 200 are formed, thereby making the second frame bodies 12 of each lead frame unit 1 electrically independent, that is, two or two The electrical connections between the leadframe units 1 are not connected to enable detection of the packaged cells. It is worth noting that the package monomer can be detected on the continuous plate (such as optical characteristics), and it does not need to be tested after cutting. It helps to correct the color coordinates of the light-emitting component immediately after the spot test (lighting test). position. In this embodiment, the insulating housing connecting strip 200 is disposed along the first direction I to match the extending direction of the connecting structure of the lead frame unit 1 so as to be able to break the connecting strip 13 between the second frames 12, so that The two bodies 12 are electrically independent, and the connecting strips 13 between the first frames 11 are retained to strengthen the structural strength of the insulating housing connecting strips 200 to prevent the insulating housing connecting strips 200 from breaking. Moreover, since both sides of the insulating case connecting strip 200 parallel to the first direction I have been separated from the adjacent insulating case connecting strips 200 at the time of forming, and the lead frame unit 1 is not connected along the second direction II, When cutting to form a package unit, it is only necessary to simultaneously cut the connecting strip 13 between the insulating shell connecting strip 200 and the first frame 11 in the second direction II, and the cutting process can be reduced in the first direction I without cutting. The resulting burrs reduce the cost of tool wear. However, the insulating housing connecting strip 200 can also be disposed along the second direction II, and the effect of reducing the warpage problem can also be achieved, but the cutting procedure needs to be increased. Furthermore, the connection structure of the lead frame unit 1 may further include a connecting strip (not shown) extending in the second direction II, that is, the connection structure of the lead frame unit 1 may also be along the first direction I and the second direction. II extending in two directions, except that each lead frame unit 1 in the first direction I is connected to each other, and the lead frame units 1 in the second direction II are connected to each other to increase the supporting strength of the connecting piece, but also Need to increase the cutting process.

The connecting material sheet may further form a lens body 3 (for example, as shown in FIG. 6) after the wafer 9 and the fluorescent layer (not shown) are disposed, or may fill the concave cup structure 21 with a light-transmitting material (for example, silicone rubber). The light-transmissive body 4 is formed (for example, as shown in FIG. 10), or the wafer 9 can be first formed on the lead frame unit 1 and then molded with a light-transmitting material (for example, silicone) to integrally form the insulating case 2 and the lens. The insulating case connecting strip (not shown) of the body 3 (for example, as shown in FIG. 11) is subjected to a cutting process after detection to form a light bar 300 (for example, as shown in FIG. 12) or a separate package (for example, a drawing). 6, Figure 10, Figure 11). Here, the phosphor layer may be directly coated on the wafer 9, and then a lens body 3 is formed on the wafer 9, or the phosphor layer may be uniformly mixed with the light transmissive material and then filled into the concave cup structure 21, and the mixture may be mixed. The effect of light.

Referring to FIG. 6 to FIG. 8 , a first preferred embodiment of the LED package of the present invention comprises: a lead frame unit 1 , an insulating housing 2 , a lens body 3 and two wafers 9 . One of the wafers 9 may be a Zener diode to perform ESD protection on the other wafer 9.

The lead frame unit 1 (that is, the lead frame unit 1 in the aforementioned connecting piece) includes a first frame 11, a second frame 12 and a plurality of connecting strips 13. The first frame body 11 and the second frame body 12 are arranged at intervals along the line direction II (corresponding to the second direction II described above), and the connecting bars 13 are respectively parallelized by the first frame body 11 and the second frame body 12. Both sides extend outward (ie, extend along the first direction I). Other specific structures of the lead frame unit 1 are as described in the foregoing embodiments of the web sheet, and will not be repeated.

The insulating case 2 is cut by the insulating case connecting strip 200 of the connecting piece piece, is combined with the lead frame unit 1 in a molding manner, and is cut and connected together when the insulating case connecting strip 200 is cut. The connecting strips 13 between the first frames 11 are such that the end faces of the connecting strips 13 connected to the first frame 11 are aligned with the two side faces 23 of the insulating housing 2, and further, the notches 201 of the original insulating housing connecting strips 200 That is, the notch 24 corresponding to each of the insulating housings 2 is formed, that is, the insulating housing 2 has two notches 24, and the connecting strips 13 connected to the second frame 12 are respectively exposed to the insulating housing 2. Furthermore, the insulative housing 2 has a concave cup structure 21 and a filling portion 22 corresponding to the first frame body 11 of the lead frame unit 1 and a part of the top surface 113, 123 of the second frame body 12 (see 3) The wafer 9 is provided, and the filling portion 22 is the filling portion 22 in the above-mentioned continuous web, and will not be described again. The wafer 9 is disposed on the lead frame unit 1 and is electrically connected to the lead frame unit 1. The lens body 3 covers the concave cup structure 21 and the wafer 9. The wafer 9 may be provided with only one or two or more, and is not limited to the embodiment.

Referring to FIG. 9, in the present embodiment, the concave cup structure 21 is a shallow cup type, and the height h is 0.5 times to 1.5 times the thickness t of the wafer 9, which may be determined according to the thickness t of the wafer 9 to be set. The structure 21 is generally narrow and wide, such as a hollow frustoconical shape, and has a cone angle of about 70 degrees. The height h of the concave cup structure 21 is not higher than 1.5 times the thickness t of the wafer 9, so as to reduce the amount of illumination of the insulating housing 2 irradiated by the wafer 9, which can slow the deterioration of the insulating material and increase the service life of the insulating housing 2. And reliability. In addition, after testing, this package has good reliability even in addition to good light uniformity.

Referring to FIG. 10, a second preferred embodiment of the LED package of the present invention is substantially the same as the first preferred embodiment of the package, but in the second preferred embodiment, the insulative housing 2 The height of the concave cup structure 21 is greater than 1.5 times the thickness of the wafer 9, that is, the concave cup structure 21 has a deeper depth and is a deep cup type, which can reflect more lateral light of the wafer 9, which is comparable to that of the first preferred embodiment. The shallow cup structure has better light uniformity. The concave cup structure 21 is filled with a light-transmitting body 4 to seal the wafer 9, and the top surface 41 of the light-transmitting body 4 is substantially coplanar with the top surface 25 of the insulating housing 2. In another embodiment, the concave cup structure 21 is not filled with the light-transmitting body 4, and the concave cup structure 21 is covered with an optical lens, so that the light-emitting diode package can produce better light-emitting uniformity.

Referring to FIG. 11 , a third preferred embodiment of the LED package of the present invention is substantially the same as the first preferred embodiment of the package, but the insulative housing of the third preferred embodiment. 2 and the lens body 3 are integrally formed of a light permeable material, and the insulating housings 2 of the first and second preferred embodiments are opaque. That is, the manufacturing process of the third preferred embodiment is that the wafer 9 is first disposed on the lead frame unit 1, and then the insulating case connecting the insulating case 2 and the lens body 3 is molded by a light transmissive material. A strip (not shown), in the present embodiment, the blind hole 15 is located at the contour edge of the lens body 3 and surrounds the wafer 9, thereby increasing the bonding of the lens body 3 and the lead frame unit 1. The cutting procedure is the same as the first preferred embodiment. After testing, the light uniformity of this embodiment is also good.

Referring to Figure 12, a preferred embodiment of the LED strip 300 of the present invention is formed on the basis of a single insulative housing connecting strip 200 (see Figure 1). This embodiment is based on the aforementioned invention. The first preferred embodiment of the body package is exemplified in the undivided structure, that is, the light bar 300 is composed of a plurality of connected packages, and the number of packages included therein may be determined according to requirements. That is, a plurality of light bars can also be cut out for a single insulated housing tie bar 200. Similarly, the second preferred embodiment of the package includes a plurality of connected structures and a third preferred embodiment of the package. The plurality of connected structures may also form a light bar.

In summary, the preferred embodiment of the continuous sheet of the present invention can reduce stress residual and metal material and insulation by forming a plurality of insulating shell connecting strips 200 which are not connected in the second direction II. The difference in thermal expansion coefficient of the material causes a problem of plate warpage, and the amount of insulating material can be reduced to save material cost. Further, the extending direction of the connecting structure (the connecting strip 13) of the lead frame unit 1 coincides with the extending direction of the insulating case connecting strip 200, so that the cutting process can be reduced, thereby reducing the cost of tool wear. Moreover, the insulating housing connecting strip 200 has a notch 201 to expose the connecting strip 13 between the second frame bodies 12, so that the connecting strips 13 at the notches 201 are first disconnected, so that each lead frame unit 1 is electrically independent. It can be directly tested on the continuous board to facilitate the inspection and inspection work. It helps to correct the color coordinate position of the LED package immediately after the spot measurement, and improve the color coordinate position of the single LED package. Confirmation rate.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

100. . . Lead frame

200. . . Insulating housing connecting strip

300. . . Light

201. . . gap

10. . . framework

101. . . Outer frame

102. . . Extension

103. . . Through hole

1. . . Lead frame unit

11. . . First frame

111. . . First base

112. . . First projection

113. . . Top surface

114. . . Bottom

12. . . Second frame

121. . . Second base

122. . . Second projection

123. . . Top surface

124. . . Bottom

13. . . Connecting strip

141. . . Step structure

142. . . Sag structure

15. . . Blind hole

2. . . Insulating housing

twenty one. . . Concave cup structure

twenty two. . . Filling section

twenty three. . . side

twenty four. . . Missing angle

25. . . Top surface

3. . . Lens body

4. . . Translucent body

41. . . Top surface

9. . . Wafer

Figure 1 is a perspective view showing a preferred embodiment of a continuous web of the present invention;

Figure 2 is an enlarged view of a partial area of Figure 1;

Figure 3 is a plan view of Figure 2;

Figure 4 is a rear view of Figure 3;

Figure 5 is a schematic cross-sectional view showing the filling portion of the preferred embodiment;

Figure 6 is a perspective view showing a first preferred embodiment of the light emitting diode package of the present invention;

Figure 7 is a plan view showing the first preferred embodiment;

Figure 8 is a bottom plan view showing the first preferred embodiment;

Figure 9 is a cross-sectional view showing the first preferred embodiment;

Figure 10 is a perspective view showing a second preferred embodiment of the light emitting diode package of the present invention;

Figure 11 is a perspective view showing a third preferred embodiment of the light emitting diode package of the present invention;

Figure 12 is a perspective view showing a preferred embodiment of the light-emitting diode strip of the present invention.

100. . . Lead frame

200. . . Insulating housing connecting strip

10. . . framework

101. . . Outer frame

102. . . Extension

103. . . Through hole

1. . . Lead frame unit

11. . . First frame

12. . . Second frame

13. . . Connecting strip

15. . . Blind hole

twenty one. . . Concave cup structure

Claims (15)

  1. A connecting sheet material comprising: a lead frame connecting plate, comprising a frame body and a plurality of lead frame units, wherein the lead frame unit is arranged in a matrix in a first direction and a second direction perpendicular to each other In the body, each lead frame unit includes a first frame body, a second frame body spaced apart from the first frame body, and a connecting structure; the connecting structure is at least along the first direction and the second direction Extending in a direction, the leadframe unit is connected to the adjacent leadframe unit in at least one direction and the leadframe unit adjacent to the frame is connected to the frame; and the plurality of insulating shell connecting strips are mutually Formed on the lead frame connecting plate at intervals, and each insulating housing connecting strip covers the lead frame unit in the same row along the first direction and extends to cover a portion of the frame adjacent to both ends of the row of lead frame units And at least the bottom surface of the first frame of each lead frame unit and the bottom surface of the second frame are exposed.
  2. According to the lining sheet of claim 1, wherein the first frame and the second frame of each lead frame unit are arranged along the second direction, and the connection structure of each lead frame unit The connecting strip is composed of the first frame body and the second frame body extending outward in the first direction parallel to the two sides of the second direction.
  3. The contiguous web of claim 2, wherein each of the insulating housing strips has a plurality of notches, each of the notches correspondingly exposing a connection between the second frames of the adjacent two leadframe units Strips, and the connecting strip between the adjacent two second frames is broken.
  4. The gusset web according to claim 1, wherein each of the insulating shell connecting strips has a plurality of concave cup structures, and each concave cup structure corresponds to the first frame and the first body of each lead frame unit Part of the top surface of the two frames.
  5. The connecting sheet according to the fourth aspect of the invention, wherein each of the insulating shell connecting strips has a plurality of filling portions, and each of the filling portions respectively corresponding to the first frame and the second filling each lead frame unit a gap between the frame bodies, and a portion of each of the filling portions exposed by the corresponding concave cup structure protrudes from a top surface of the first frame body and a top surface of the second frame body, and the convex portion extends to both sides to cover the first portion a partial top surface of the frame body and a partial top surface of the second frame body.
  6. The gusset web of claim 1, wherein the frame has an outer frame portion and a plurality of extension portions, the extension portion being oriented from the outer frame portion to the lead frame unit Extending and connecting with adjacent lead frame units, each extending portion is formed with at least one through hole, and both ends of each insulating housing connecting strip respectively cover corresponding extending portions and fill the through holes thereof.
  7. The splicing sheet according to the first aspect of the invention, wherein the first frame of each lead frame unit has a first base and a first protruding portion, and the first base is coupled to the insulating housing. The strips are combined, and the first protruding portion protrudes the insulating housing connecting strip along the second direction; the second frame of each lead frame unit has a second base and a second protruding portion, the second The base portion is coupled to the insulating housing connecting strip, and the second protruding portion protrudes the insulating housing connecting strip in a direction opposite to the first protruding portion.
  8. The gusset web of claim 7, wherein each leadframe unit further comprises a plurality of recessed structures, respectively formed on the first frame at least a portion of the periphery of the bottom surface of the first projection And the second frame is located at least a portion of the periphery of the bottom surface of the second protrusion.
  9. The gusset web according to claim 8 , wherein each lead frame unit further comprises a plurality of stepped structures formed on the first frame at least a part of the periphery of the bottom surface of the first base and The two frames are located at least in a portion of the periphery of the bottom surface of the second base.
  10. A light emitting diode package comprising: a lead frame unit, comprising a first frame body, a second frame body, at least two first connecting strips, and at least two second connecting strips; the first frame body And the second frame is spaced apart in a line direction, and the first connecting strips extend outwardly from the opposite sides of the first frame body, and the second connecting strips are respectively separated by the second frame body The opposite sides extend perpendicularly to the straight line direction, and the first connecting strip and the second connecting strip extend outwardly different lengths; an insulating housing encloses the lead frame unit and at least exposes the lead frame unit a bottom surface of the body and a bottom surface of the second frame, and an end surface of each of the first connecting strips is aligned with one side of the insulating housing, and the insulating housing has a plurality of notched corners, each second connection The strip protrudes from one of the corners of the insulating housing; and at least one wafer is disposed on the lead frame unit and electrically connected to the lead frame unit.
  11. The illuminating diode package of claim 10, wherein the insulating housing has a concave cup structure, and the concave cup structure is correspondingly exposed. The first frame of the leadframe unit and a portion of the top surface of the second frame are configured to provide the wafer, and the height of the concave cup structure is between 0.5 and 1.5 times the thickness of the wafer.
  12. The illuminating diode package of claim 10, wherein the insulating housing has a concave cup structure corresponding to the first frame and the second frame of the lead frame unit a portion of the top surface for providing the wafer, the LED package further comprising a lens body coupled to the insulating housing and covering the concave cup structure and the wafer.
  13. The illuminating diode package of claim 10, wherein the insulating housing has a concave cup structure corresponding to the first frame and the second frame of the lead frame unit a portion of the top surface for providing the wafer, the LED package further comprising a light transmissive body filled in the concave cup structure, the top surface of the transparent body being substantially coplanar with the top surface of the insulating housing .
  14. The illuminating diode package according to claim 10, further comprising a lens body, wherein the insulating case and the lens body are integrally formed of a light permeable material.
  15. A light-emitting diode light bar comprising: a plurality of lead frame units arranged along a first direction, and each lead frame unit comprises a first frame body, a second frame body, and a connection structure, the first The frame body and the second frame body are arranged along a second direction perpendicular to the first direction, and the connection structure of each lead frame unit is formed by a plurality of connecting strips, and the connecting strips are respectively formed by the first And the two sides of the frame body and the second frame parallel to the second direction extend outward in the first direction, The connecting strips between the adjacent two first frames are connected, and the connecting strips between the adjacent two second frames are disconnected; an insulating housing connecting strip is wrapped along the first direction Covering the lead frame unit, and exposing at least a bottom surface of the first frame body of each lead frame unit and a bottom surface of the second frame body, the insulating housing connecting strip has a plurality of notches, and each notch correspondingly exposes two adjacent ones a connecting strip between the second frame; and a plurality of wafers correspondingly disposed on each lead frame unit and electrically connected to the corresponding lead frame unit.
TW101112796A 2012-04-11 2012-04-11 Insulator-integrated leadframe assembly, led package and led light bar TWI488341B (en)

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Application Number Priority Date Filing Date Title
TW101112796A TWI488341B (en) 2012-04-11 2012-04-11 Insulator-integrated leadframe assembly, led package and led light bar

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Publication number Priority date Publication date Assignee Title
CN105742467A (en) * 2014-12-30 2016-07-06 震扬集成科技股份有限公司 Carrier array and light emitting diode package
TWM510542U (en) * 2014-12-30 2015-10-11 Icled Technologies Corp Carrier array and light emitting diode package

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020071253A1 (en) * 1999-05-27 2002-06-13 Lam Allen K. Symmetrical package for semiconductor die
US20070120139A1 (en) * 2005-02-24 2007-05-31 Kabushiki Kaisha Toshiba Semiconductor light emitting device
TW201021252A (en) * 2008-09-03 2010-06-01 Nichia Corp Light emitting device, resin package, resin compact and method of manufacturing the same
TWM401207U (en) * 2010-11-03 2011-04-01 Harvatek Corp Light-emitting diode packaging structure
US20110186901A1 (en) * 2010-01-29 2011-08-04 Kabushiki Kaisha Toshiba Led package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020071253A1 (en) * 1999-05-27 2002-06-13 Lam Allen K. Symmetrical package for semiconductor die
US20070120139A1 (en) * 2005-02-24 2007-05-31 Kabushiki Kaisha Toshiba Semiconductor light emitting device
TW201021252A (en) * 2008-09-03 2010-06-01 Nichia Corp Light emitting device, resin package, resin compact and method of manufacturing the same
US20110186901A1 (en) * 2010-01-29 2011-08-04 Kabushiki Kaisha Toshiba Led package
TWM401207U (en) * 2010-11-03 2011-04-01 Harvatek Corp Light-emitting diode packaging structure

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