KR101537795B1 - Method for fabricating light emitting diode packang and light emitting diode package - Google Patents
Method for fabricating light emitting diode packang and light emitting diode package Download PDFInfo
- Publication number
- KR101537795B1 KR101537795B1 KR1020090027310A KR20090027310A KR101537795B1 KR 101537795 B1 KR101537795 B1 KR 101537795B1 KR 1020090027310 A KR1020090027310 A KR 1020090027310A KR 20090027310 A KR20090027310 A KR 20090027310A KR 101537795 B1 KR101537795 B1 KR 101537795B1
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- KR
- South Korea
- Prior art keywords
- dicing
- substrate
- molding
- led
- mark
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an LED package by using a dicing alignment mark of a substrate and a dicing mark of a molding portion formed on the substrate so as to immediately determine whether the molding portion has been formed at an accurate position with respect to the substrate. do.
To this end, a method of manufacturing an LED package according to the present invention includes: preparing a substrate provided with a dicing alignment mark; Molding a molding part having a dicing mark on the substrate; And dicing the substrate in a package unit so that the dicing alignment mark and the dicing mark are aligned with each other.
Dicing, mark, housing, substrate, tolerance, groove, defect, discrimination, contact, exposure, molding
Description
The present invention relates to a method of manufacturing an LED package and an LED package thereof, and more particularly, to a method of manufacturing an LED package, and more particularly, To an LED package manufacturing method and an LED package that can easily determine whether a substrate with a molding part is defective before mounting an LED chip.
In general, a light emitting diode (LED) is a device in which electrons and holes meet at a PN junction by applying a current, and the LED emits light with a low voltage and a low current It has many advantages over existing light sources such as continuous light emission and low power consumption.
In particular, LEDs are widely used for various display devices, backlight sources, etc. Recently, a technique has been developed for emitting white light by using three LED chips emitting red light, green light and blue light, respectively, or by converting wavelength using phosphors And the application range is expanded by the illumination device.
The above-described LED is usually fabricated in a package structure. In the LED package manufacturing process, for example, a substrate on which a wiring pattern including a plurality of lead frame patterns is formed is prepared. This substrate is provided with a dicing alignment mark for the dicing process. Next, one or more molding portions are formed on the substrate by, for example, an injection molding process. This molding part is cut together with the substrate by a dicing process to become a housing of various LED packages. The molding portion has a plurality of cavities, each of which exposes a lead frame or an electrode pattern of each LED package that is divided after dicing. An LED chip is mounted on the cavity, and the LED chip and the lead frame or the electrode pattern are electrically connected by wiring. Usually, the LED chip mounting and wiring process is performed before the dicing process. By the dicing process, the substrate and the moldings thereon are cut together to produce several individual LED packages.
Conventionally, since only the dicing alignment mark on the substrate is used as a reference for dicing, accurate dicing can not be achieved. That is, although the originally intended dicing line matches the above dicing alignment mark, there may be an error in the molding part. This error leads to defects in the finally fabricated LED package, which results in a decrease in production yield. Also, it was impossible to discriminate whether the molding part was formed at the correct position with respect to the substrate before the dicing step by using only the dicing alignment mark. If it is possible to determine in advance whether the position of the molding part is defective with respect to the substrate, the cause of the defect can be corrected in advance, and the time and economic waste caused when the continuous process is performed using the defective material can be reduced.
An object of the present invention is to provide an LED package manufacturing method which can easily determine whether a molding part is formed at an accurate position with respect to a substrate before a LED chip is mounted by a dicing alignment mark formed on the substrate and a dicing mark formed on the molding part. .
According to another aspect of the present invention, there is provided an LED package, wherein the polarity of the LED package can be easily determined according to a shape of a groove formed at an edge of the housing, the shape being indicative of a direction of a cathode or an anode.
According to an aspect of the present invention, there is provided a method of manufacturing an LED package capable of identifying a defect, the method comprising: preparing a substrate having a dicing alignment mark; Molding a molding part having a dicing mark on the substrate; And dicing the substrate in a package unit so that the dicing alignment mark and the dicing mark are aligned with each other.
In the present embodiment, the LED package manufacturing method includes: mounting the LED chip on the substrate before the dicing step; Connecting the bonding wires so that the mounted LED chips are electrically connected; And forming an encapsulant to cover the LED chip and the bonding wire. The step of molding the molding part may be formed by filling the groove formed in the lead frame of the substrate with an injection material and having a partial contact surface with the groove.
According to another aspect of the present invention, there is provided an LED package comprising: a substrate; and an LED package manufactured by dividing a molding part formed on the substrate into a plurality of LED packages by a dicing process, the LED packages being separated from the substrate by the dicing process; And a housing separated by the molding part by the dicing step, wherein the housing is provided with a groove used as a dicing mark in the edge by the dicing step.
In this embodiment, if the groove indicates the direction of the cathode or the anode, the lead frames are provided with chip alignment grooves for determining the mounting positions of the LED chips. The chip alignment groove includes a contact surface partially in contact with the housing and an exposed surface exposed to the outside. Further, the chip alignment groove is filled with an injection material during injection molding of the molding part.
According to the embodiment of the present invention, it is possible to easily determine whether or not the molding portion is formed at the correct position with respect to the substrate, depending on whether or not the dicing alignment marks of the substrate match the dicing marks of the injection- . Accordingly, it is possible to determine whether the molding portion is defective in position with respect to the substrate before mounting the LED chip, and it is possible to reduce the time and economic waste caused when the next process is performed using the defective material.
In addition, according to the embodiment of the present invention, since the chip alignment groove defining the mounting position of the LED chip is filled with the molding material at the time of molding, there is an effect that the bonding difference between the substrate and the molding part can be immediately discriminated.
According to the embodiment of the present invention, the grooves formed at the corners of one side of the housing indicate the direction of the cathode or the anode, so that the polarity can be easily discriminated.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.
FIG. 1 is a view showing a substrate to which the present invention is applied, FIG. 2 is a view showing a state where the molding part is formed on the substrate shown in FIG. 1, and FIG. 3 is a cross- FIG. 4 is a perspective view showing the lead frames shown in FIG. 3. FIG.
A method of manufacturing an LED package according to the present invention will now be described. First, a
Next, the
Next, the first and
Chip alignment grooves for defining the mounting positions of the LED chips are formed in the first and
4, the first
Next, the first and
Next, an
Further, an optical member (not shown) may be further provided on the sealing
Next, the
5, the LED package according to the present invention includes lead frames 22, 23 separated from the
The
The
The first and
An
BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a substrate to which the present invention is applied.
2 is a view showing a state in which a molding part is formed on the substrate shown in Fig. 1; Fig.
Fig. 3 is a diagram showing a state in which an LED chip is mounted on the substrate shown in Fig. 2; Fig.
Fig. 4 is a perspective view showing the lead frames shown in Fig. 3; Fig.
Fig. 5 is a perspective view of an LED package manufactured by dicing the molding part with the substrate shown in Fig. 3; Fig.
Description of the Related Art
2:
21: molding part 211: dicing mark
22, 23: lead frames 221, 231: first and second chip alignment grooves
24a, 24b: first and second LED chips 25: sealing material
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020090027310A KR101537795B1 (en) | 2009-03-31 | 2009-03-31 | Method for fabricating light emitting diode packang and light emitting diode package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020090027310A KR101537795B1 (en) | 2009-03-31 | 2009-03-31 | Method for fabricating light emitting diode packang and light emitting diode package |
Publications (2)
Publication Number | Publication Date |
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KR20100108969A KR20100108969A (en) | 2010-10-08 |
KR101537795B1 true KR101537795B1 (en) | 2015-07-22 |
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KR1020090027310A KR101537795B1 (en) | 2009-03-31 | 2009-03-31 | Method for fabricating light emitting diode packang and light emitting diode package |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201128812A (en) | 2009-12-01 | 2011-08-16 | Lg Innotek Co Ltd | Light emitting device |
AT513747B1 (en) | 2013-02-28 | 2014-07-15 | Mikroelektronik Ges Mit Beschränkter Haftung Ab | Assembly process for circuit carriers and circuit carriers |
AT514599B1 (en) * | 2013-07-05 | 2015-02-15 | Melecs Ews Gmbh & Co Kg | Method for equipping electronic circuit boards with optical components |
JP6293899B2 (en) | 2014-08-04 | 2018-03-14 | 富士機械製造株式会社 | Mounting device |
JP6838528B2 (en) * | 2017-08-31 | 2021-03-03 | 日亜化学工業株式会社 | Substrate manufacturing method and light emitting device manufacturing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004311916A (en) * | 2003-02-21 | 2004-11-04 | Kyocera Corp | Package for light emitting element and light emitting device |
JP2005175280A (en) * | 2003-12-12 | 2005-06-30 | Citizen Electronics Co Ltd | Method for manufacturing package for electronic component |
KR100643318B1 (en) * | 2005-05-26 | 2006-11-10 | 럭스피아 주식회사 | Very small light emitting diode package and manufacturing methods of it |
JP2008235580A (en) * | 2007-03-20 | 2008-10-02 | Nichia Corp | Manufacturing method of semiconductor device |
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2009
- 2009-03-31 KR KR1020090027310A patent/KR101537795B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004311916A (en) * | 2003-02-21 | 2004-11-04 | Kyocera Corp | Package for light emitting element and light emitting device |
JP2005175280A (en) * | 2003-12-12 | 2005-06-30 | Citizen Electronics Co Ltd | Method for manufacturing package for electronic component |
KR100643318B1 (en) * | 2005-05-26 | 2006-11-10 | 럭스피아 주식회사 | Very small light emitting diode package and manufacturing methods of it |
JP2008235580A (en) * | 2007-03-20 | 2008-10-02 | Nichia Corp | Manufacturing method of semiconductor device |
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