TWI485793B - Surface polishing device and surface polishing method - Google Patents

Surface polishing device and surface polishing method Download PDF

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TWI485793B
TWI485793B TW100148618A TW100148618A TWI485793B TW I485793 B TWI485793 B TW I485793B TW 100148618 A TW100148618 A TW 100148618A TW 100148618 A TW100148618 A TW 100148618A TW I485793 B TWI485793 B TW I485793B
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broom
treated
cleaning
surface cleaning
high hardness
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TW201327703A (en
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Chin Cheng Lin
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Chin Cheng Lin
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表面清潔裝置與表面清潔方法Surface cleaning device and surface cleaning method

本發明是關於一種表面清潔裝置與表面清潔方法,特別是關於應用於電子工業,清潔基板上例如溢膠等髒汙之清潔裝置與清潔方法。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a surface cleaning apparatus and a surface cleaning method, and more particularly to a cleaning apparatus and a cleaning method for cleaning the substrate, such as overflowing glue, etc., which are applied to the electronics industry.

對於基板表面髒汙的清潔,是一種產業上經常需要的技術。尤其是在各種產品的製造、加工,常常會在物品表面上遺留髒汙,影響產品的功能或觀感,必須以各種適用的方法加以去除。然而隨著電子製造技術的進步,各種電子產品尺寸逐漸縮小,使得對於電子產品基板表面的清潔,較以往困難。The cleaning of the surface of the substrate is a technique that is often required in the industry. Especially in the manufacture and processing of various products, it often leaves dirt on the surface of the article, affecting the function or look of the product, and must be removed by various applicable methods. However, with the advancement of electronic manufacturing technology, the size of various electronic products has been gradually reduced, making it more difficult to clean the surface of electronic product substrates.

舉例而言,目前廣泛使用在消費性電子元件的所謂四方扁平無引腳封裝(Quad Flat Non-leaded package,簡稱QFN封裝),是一種以導線架作為基板的封裝方法。其封裝製程主要包括:提供一具有多數單元的導線架,在導線架的散熱片部份定位晶片,連接晶片的接腳與導線架的接點(pad)部分,及以封裝材料覆蓋導線架的晶片表面,並使封裝材料填滿導線架的開口部分。將封裝材料硬化後,即形成具有多數單元的QFN封裝電子元件。將完成的組件切割後,即獲得所需的電子元件。For example, a so-called Quad Flat Non-leaded Package (QFN package), which is widely used in consumer electronic components, is a packaging method using a lead frame as a substrate. The packaging process mainly comprises: providing a lead frame having a plurality of cells, positioning the wafer in the heat sink portion of the lead frame, connecting the pad of the chip to the pad portion of the lead frame, and covering the lead frame with the packaging material. The surface of the wafer is filled with the encapsulating material to fill the opening portion of the lead frame. After the encapsulation material is hardened, a QFN package electronic component having a plurality of cells is formed. After the finished component is cut, the desired electronic components are obtained.

在上述封裝材料的塗布及硬化過程中,該塗布材料會溢出於該導線架的開口以外部份,形成「溢膠」(excessive glue或overflow glue)。嚴重時,溢膠會覆蓋該導線架的接點部分,影響該接點的歐姆接觸性能。即使溢膠現象並不嚴重,仍需將溢膠清除,以維持電子元件的性能與美觀。During the coating and hardening of the encapsulating material, the coating material may overflow beyond the opening of the lead frame to form an "excessive glue" or "overflow glue". In severe cases, the overflow will cover the contact portion of the lead frame, affecting the ohmic contact performance of the contact. Even if the overflow phenomenon is not serious, it is necessary to remove the overflow glue to maintain the performance and aesthetics of the electronic components.

習知技術對於這種溢膠的清潔,主要是以磨輪處理。不過,在清潔溢膠以及類似髒汙時,所面臨的技術難題在於,溢膠或髒汙的硬度可能高於基板的硬度。 能夠除去溢膠或髒汙的磨輪或其他工具表面,必然也會磨除基板的表面。反之,不會移除基板表面的磨輪或其他工具表面,則無法移除硬度較高的溢膠或髒汙。以上述QFN封裝技術而言,該導線架表面主要為散熱片部份。如果將該導線架表面磨除一厚度,將影響其散熱效果。在其他應用領域,移除溢膠或髒汙時連帶移除裝置表面,也會損及裝置的性能,使得磨除方式無法用來作表面的清潔。Conventional techniques for the cleaning of such spills are mainly processed by grinding wheels. However, in cleaning spills and similar dirt, the technical problem is that the hardness of the glue or dirt may be higher than the hardness of the substrate. The ability to remove spilled or dirty grinding wheels or other tool surfaces will inevitably remove the surface of the substrate. Conversely, the grinding wheel or other tool surface on the surface of the substrate will not be removed, and the higher hardness spill or dirt cannot be removed. In the above QFN packaging technology, the surface of the lead frame is mainly a heat sink portion. If the thickness of the lead frame is removed by a thickness, it will affect its heat dissipation. In other applications, removing the surface of the device when removing glue or dirt can also damage the performance of the device, making the grinding method impossible to clean the surface.

對於上述技術難題,習知技術的解決方法包括將待處理表面定位,嚴格控制磨輪表面與待處理表面間距,使得磨輪只能磨除待處理表面上的髒污,但不會損及待處理表面。不過,如上所述,該待處理表面的硬度通常低於髒汙的硬度。隱含一種現象,就是在塗布、硬化封裝材料,或進行其他處理時,特別是熱處理時,該待處理表面不可避免會發生變形。以致於在移除溢膠或髒汙時,待處理表面並非平整。因此,即使嚴格控制磨輪表面與待處理表面的間距,仍然難以避免損及該待處理表面。更不用說,在磨除製程中磨輪或其他工具的表面也會遭到移除,改變其表面高度。使得嚴格控制其表面高度的目的也難以達成。For the above technical problems, the solution of the prior art includes positioning the surface to be treated, strictly controlling the distance between the surface of the grinding wheel and the surface to be treated, so that the grinding wheel can only remove the dirt on the surface to be treated, but does not damage the surface to be treated. . However, as described above, the hardness of the surface to be treated is generally lower than the hardness of the soil. It is implied that the surface to be treated is inevitably deformed when coating, hardening the encapsulating material, or performing other treatments, particularly heat treatment. The surface to be treated is not flat when the spill or dirt is removed. Therefore, even if the distance between the surface of the grinding wheel and the surface to be treated is strictly controlled, it is difficult to avoid damage to the surface to be treated. Needless to say, the surface of the grinding wheel or other tool is also removed during the grinding process, changing the surface height. The purpose of strictly controlling the surface height is also difficult to achieve.

另一種清潔表面髒汙的方法,是以高速水柱噴射待處理表面,以移除溢膠或髒汙,但不會損及待處理表面。但是這種稱為「水刀」(wateriet)的技術,設備昂貴,難以應用在廉價的電子元件製造。同時,由於所要移除的溢膠或髒汙,往往與不需移除的材料,例如封裝材料黏連,且粘度極高。以高速水柱沖刷的結果,在移除溢膠或髒汙的同時,也將不需移除的材料一並移除。仍然無法得到所需的品質。Another method of cleaning the surface is to spray the surface to be treated with a high speed water column to remove spilled or dirty particles without damaging the surface to be treated. But this kind of technology called "wateriet" is expensive and difficult to apply to inexpensive electronic components. At the same time, due to the glue or dirt to be removed, it is often adhered to materials that do not need to be removed, such as packaging materials, and the viscosity is extremely high. As a result of the high-speed water column flushing, the material that does not need to be removed is also removed while removing the glue or dirt. Still can't get the quality you need.

不但如此,上述以磨輪移除表面髒汙的工法,會產生大量粉塵;而以水刀移除的工法,則需使用大量的水。兩種方法都嚴重影響環境清潔,不利於環保。Not only that, the above method of removing the surface dirt by the grinding wheel generates a large amount of dust; while the water knife removal method requires a large amount of water. Both methods seriously affect the environmental cleanliness and are not conducive to environmental protection.

因此,目前業界有需要一種新穎的表面清潔裝置與方法,可以移除待處理表 面上的材料,但不損及該待處理表面。Therefore, there is a need in the industry for a novel surface cleaning apparatus and method that can remove a table to be processed. The material on the surface, but does not damage the surface to be treated.

同時也需要有一種新穎的表面清潔裝置與方法,可以使用廉價的設備,以簡單的方式,移除待處理表面上的材料,但不損及該待處理表面。There is also a need for a novel surface cleaning apparatus and method that can be used to remove material on a surface to be treated in a simple manner without damaging the surface to be treated.

同時也需一種新穎的表面清潔裝置與方法,可以降低移除待處理表面上的材料時,對環境所造成的汙染。There is also a need for a novel surface cleaning apparatus and method that reduces environmental pollution caused by removal of material on the surface to be treated.

本發明的目的乃在提供一種新穎的表面清潔裝置與方法,可以移除待處理表面上的材料,但不損及該待處理表面。It is an object of the present invention to provide a novel surface cleaning apparatus and method that removes material on a surface to be treated without damaging the surface to be treated.

本發明的目的也在提供一種新穎的表面清潔裝置與方法,可以使用廉價的設備,以簡單的方式,移除待處理表面上的材料,但不損及該待處理表面。It is also an object of the present invention to provide a novel surface cleaning apparatus and method that can be used to remove material on a surface to be treated in a simple manner without damaging the surface to be treated.

本發明的目的也在提供一種新穎的表面清潔裝置與方法,可以降低移除待處理表面上的材料時,對環境所造成的汙染。It is also an object of the present invention to provide a novel surface cleaning apparatus and method that reduces environmental pollution caused by removal of material on a surface to be treated.

根據本發明的表面清潔裝置,是包括一基板定位裝置,以固定一待處理表面;一掃拂裝置,以對該待處理表面作連續的掃拂;一移動裝置,用以使該待處理表面與該掃拂裝置作相對運動;及一流質清潔材料供應裝置,以將一流質清潔材料供應到該掃拂裝置的掃拂表面,用以移除該待處理表面上的部分材料;其中,該流質清潔材料包括一可流動載體以及至少一種高硬度材料顆粒。A surface cleaning apparatus according to the present invention includes a substrate positioning device for fixing a surface to be treated; a broom device for continuously sweeping the surface to be treated; and a moving device for making the surface to be treated The broom device is used for relative movement; and a first-class quality cleaning material supply device is provided for supplying the first-class quality cleaning material to the broom surface of the broom device for removing a part of the material on the surface to be treated; wherein the liquid material The cleaning material includes a flowable carrier and at least one particle of high hardness material.

在本發明的實施例中,該基板定位裝置可為一真空吸盤。該移動裝置用以將該待處理表面移動到該掃拂裝置的掃拂表面,或使該掃拂裝置的掃拂表面移動到待處理表面,並使兩者在該位置作相對運動。該移動裝置可以裝置在該掃拂裝置、該定位裝置或兩者上。In an embodiment of the invention, the substrate positioning device can be a vacuum chuck. The moving device is configured to move the surface to be treated to the broom surface of the broom device or to move the broom surface of the broom device to the surface to be treated and to move the two relative to each other. The mobile device can be mounted on the broom device, the positioning device, or both.

該掃拂裝置提供連續掃拂一表面的功能,並可為一轉動型掃拂裝置,平面型 掃拂裝置或旋轉型掃拂裝置。使該掃拂材料以高速連續掃拂該待處理表面。該掃拂材料可為具有相當長度的軟質條狀材料。在本發明的實施例中是使用不織布。該掃拂裝置也可為一具有柔軟表面的輪狀材料。The broom device provides a continuous broom surface function and can be a rotary broom device, flat type Broom device or rotary broom device. The broom material is continuously broomed at a high speed on the surface to be treated. The broom material can be a soft strip of material having a substantial length. In the embodiment of the invention, a non-woven fabric is used. The broom device can also be a wheeled material having a soft surface.

該流質清潔材料供應裝置是一可控制流質供應量的裝置。該流質清潔材料之可流動載體較好為液體或黏稠性物體。在本發明的實施例中是使用水。至於該高硬度材料顆粒,通常為硬度在8或以上,顆粒尺寸在#500與#1500之間的材料。碳化矽應用在本發明實施例中,獲得優異的效果。該高硬度材料顆粒與該可流動載體的比例約可在10g/l與50g/l之間,較好在15g/l與25g/l之間。The fluid cleaning material supply device is a device that controls the supply of liquid. The flowable carrier of the fluid cleaning material is preferably a liquid or viscous object. Water is used in the embodiment of the invention. As for the high hardness material particles, it is usually a material having a hardness of 8 or more and a particle size between #500 and #1500. Tantalum carbide is used in the embodiment of the present invention to obtain an excellent effect. The ratio of the high hardness material particles to the flowable carrier may be between about 10 g/l and 50 g/l, preferably between 15 g/l and 25 g/l.

本發明的表面清潔裝置還可以包括一清洗裝置,用來清洗該已經移除待處理材料的待處理表面。本發明的表面清潔裝置尚可包括一乾燥裝置,用來將該處理後或清洗後的待處理表面作乾燥處理。此外,本發明的表面清潔裝置還可以包括一回收裝置,用來回收使用過的流質清潔材料。The surface cleaning apparatus of the present invention may further comprise a cleaning device for cleaning the surface to be treated from which the material to be treated has been removed. The surface cleaning apparatus of the present invention may further comprise a drying device for drying the treated or cleaned surface to be treated. Further, the surface cleaning apparatus of the present invention may further comprise a recovery means for recovering the used liquid cleaning material.

根據本發明的表面清潔方法,則包括下列步驟:固定一待處理表面;對該待處理表面施加一流質清潔材料;及於施加同時以一掃拂材料連續掃拂該待處理表面:其中,該流質清潔材料包括一可流動載體以及至少一種高硬度材料顆粒。The surface cleaning method according to the present invention comprises the steps of: fixing a surface to be treated; applying a first-class quality cleaning material to the surface to be treated; and continuously sweeping the surface to be treated with a broom material while applying: wherein the liquid is The cleaning material includes a flowable carrier and at least one particle of high hardness material.

本發明的表面清潔方法另可包括使該待處理表面與該掃拂材料的掃拂表面作相對運動的步驟。The surface cleaning method of the present invention may further comprise the step of relatively moving the surface to be treated with the broom surface of the broom material.

在本發明的實例中,該待處理表面可以利用一定位裝置或移動定位裝置加以固定。如為一移動定位裝置,除固定之外,尚可將該待處理表面移動,以與該掃拂材料的掃拂表面作相對運動。當然,該相對運動也可利用移動該掃拂材料的方 式,或同時移動該待處理表面與該掃拂材料的方式實施。In an embodiment of the invention, the surface to be treated may be secured by a positioning device or a moving positioning device. If it is a mobile positioning device, in addition to fixing, the surface to be treated can be moved to move relative to the broom surface of the broom material. Of course, the relative motion can also utilize the side of the broom material. Or in the manner of moving the surface to be treated and the broom material at the same time.

在本發明的實例中,該掃拂材料也可以轉動掃拂、平面掃拂或旋轉掃拂,或者上述方式的結合方式,掃拂該待處理表面。In an embodiment of the invention, the broom material may also be rotated by a broom, a flat broom or a rotating broom, or a combination of the above, to sweep the surface to be treated.

本發明的方法還可包括一清洗已清潔的待處理表面的步驟、乾燥待處理表面及其他表面的步驟及/或回收該流質清潔材料及移除材料的步驟。The method of the present invention may further comprise the steps of washing the cleaned surface to be treated, drying the surface to be treated and other surfaces, and/or recovering the liquid cleaning material and removing the material.

該流質清潔材料之可流動載體較好為液體或黏稠性物體。在本發明的實施例中是使用水。該高硬度材料顆粒可為硬度在8或以上,顆粒尺寸在#500與#1500之間的材料。在本發明的實施例中是使用碳化矽。該高硬度材料顆粒與該可流動載體的比例約可在10g/l與50g/l之間,較好在15g/l與25g/l之間。The flowable carrier of the fluid cleaning material is preferably a liquid or viscous object. Water is used in the embodiment of the invention. The high hardness material particles may be materials having a hardness of 8 or more and a particle size between #500 and #1500. In the embodiment of the invention, tantalum carbide is used. The ratio of the high hardness material particles to the flowable carrier may be between about 10 g/l and 50 g/l, preferably between 15 g/l and 25 g/l.

以下將以實例說明本發明之裝置與方法。但需說明,以下實施例的說明,僅在用以例示本發明之實施方式,不是用來詳細列舉本發明的主要架構、裝置、材料、組成、步驟等。因此不能用來限制本發明的範圍。The apparatus and method of the present invention will be described below by way of examples. It is to be understood that the following description of the embodiments of the invention is intended to be illustrative of the embodiments of the invention Therefore, it cannot be used to limit the scope of the invention.

根據本發明的表面清潔裝置,是包括一基板定位裝置,以固定一待處理表面;一掃拂裝置,以對該待處理表面作連續的掃拂;一移動裝置,用以使該待處理表面與該掃拂裝置作相對運動;及一流質清潔材料供應裝置,以將一流質清潔材料供應到該掃拂裝置的掃拂表面,用以移除該待處理表面上的材料;其中,該流質清潔材料包括一可流動載體以及至少一種高硬度材料顆粒;且該基板移動定位裝置可將該待處理表面移送至該掃拂裝置的掃拂表面。A surface cleaning apparatus according to the present invention includes a substrate positioning device for fixing a surface to be treated; a broom device for continuously sweeping the surface to be treated; and a moving device for making the surface to be treated The broom device is used for relative movement; and a first-class quality cleaning material supply device is provided to supply a first-class quality cleaning material to the broom surface of the broom device for removing material on the surface to be treated; wherein the liquid cleaning The material includes a flowable carrier and at least one high hardness material particle; and the substrate movement positioning device can transfer the surface to be treated to the broom surface of the broom device.

在本發明的實施例中,該基板定位裝置用以固定該待處理表面,因此可以利用任何業界常用的基板定位裝置。該定位裝置可為一真空吸盤、一夾具或箝制機構。該移動裝置用以使該待處理表面與該掃拂裝置作相對運動,將該待處理表面 移動到該掃拂裝置的掃拂表面,或使該掃拂裝置的掃拂表面移動到待處理表面,並使兩者在該位置(可稱為清潔位置)作相對運動。該移動裝置當然也可使用業界常用的自動化或手動型移動裝置,應用上可為一螺桿、一帶輪,一滑軌驅動裝置等。該移動裝置可以裝置在該掃拂裝置、該定位裝置或兩者上。以上兩者均為業界常見的設備,其詳細結構、組成及操作,在此均不需贅述。In an embodiment of the invention, the substrate positioning device is used to secure the surface to be treated, and thus any substrate positioning device commonly used in the industry can be utilized. The positioning device can be a vacuum chuck, a clamp or a clamping mechanism. The moving device is configured to move the surface to be treated and the broom device to move the surface to be processed Move to the broom surface of the broom device or move the broom surface of the broom device to the surface to be treated and cause the two to move relative to each other (referred to as the cleaning position). The mobile device can of course also use an automatic or manual type mobile device commonly used in the industry, and the application can be a screw, a pulley, a slide driving device and the like. The mobile device can be mounted on the broom device, the positioning device, or both. The above two are common equipments in the industry, and their detailed structure, composition and operation are not mentioned here.

該掃拂裝置提供連續掃拂一表面的功能,並可為一轉動型掃拂裝置,平面型掃拂裝置或旋轉型掃拂裝置。該掃拂裝置包括一掃拂材料,可為具有相當長度的軟質條狀材料。所適用之材料並無限制,只要能夠帶動該流質清潔材料在該待處理表面流動即可。適用之材料包括:橡膠、塑膠、樹脂、木材、植物纖維、動物纖維、動物體毛、人造纖維、複合纖維、紙以及上述材料間,或與其他材料形成的複合材料。其中,不織布為特別適用之範例,因其容易取得,且成本低廉。如果使用轉動型掃拂裝置或旋轉型掃拂裝置,則可將該掃拂材料的一端固定在一轉輪表面,由該轉輪高速轉動,使掃拂材料從該轉輪的輪面掃拂待處理表面(轉動型掃拂裝置)或使掃拂材料從該轉輪的軸面(與轉軸垂直的表面)掃拂待處理表面(旋轉型掃拂裝置)。該轉動型掃拂裝置的轉動速率通常可為800M/min.,而旋轉型掃拂裝置的轉動速率則通常可為1,725M/min.。如為平面型掃拂裝置,則可將該掃拂材料的一端固定在一固定桿或多數固定桿,使該固定桿高速連續移動或來回運動,帶動該掃拂材料的自由端連續或來回掃拂該待處理表面。平面型掃拂裝置固定桿的移動速度通常可為300M/min.。該掃拂裝置也可為一具有柔軟表面的輪狀材料。適用之材料如同上述。The broom device provides a continuous broom surface function and can be a rotary broom device, a flat broom device or a rotary broom device. The broom device includes a broom material which may be a soft strip of material having a substantial length. The material to be applied is not limited as long as it can drive the liquid cleaning material to flow on the surface to be treated. Suitable materials include: rubber, plastic, resin, wood, plant fiber, animal fiber, animal body hair, rayon, composite fiber, paper, and composite materials formed between these materials or other materials. Among them, non-woven fabric is a particularly applicable example because it is easy to obtain and low in cost. If a rotary broom device or a rotary broom device is used, one end of the broom material can be fixed to the surface of a wheel, and the wheel rotates at a high speed to sweep the broom material from the wheel surface of the wheel. The surface to be treated (rotary type broom device) or the broom material is swept from the axial surface of the wheel (the surface perpendicular to the rotating shaft) to the surface to be treated (rotary type broom device). The rotational speed of the rotary broom device can be typically 800 M/min., while the rotational speed of the rotary broom device can typically be 1,725 M/min. In the case of a flat type broom device, one end of the broom material can be fixed to a fixed rod or a plurality of fixed rods, so that the fixed rod moves continuously or back and forth at high speed, and the free end of the broom material is continuously or swept back and forth.拂 The surface to be treated. The moving speed of the flat type broom device fixing rod can usually be 300 M/min. The broom device can also be a wheeled material having a soft surface. Suitable materials are as described above.

該流質清潔材料供應裝置是用來連續供應流質清潔材料,故可為任何工業上常用的流質供應裝置,例如可控制流質供應量的裝置,包括一儲存槽,一輸送管, 一控制驅動裝置及至少一供應頭。該供應頭可為一管狀開口、一噴灑頭或一噴嘴。視該流質清潔材料的組程而定,該流質清潔材料的供應速率約在於300ml/min.至800ml/min.之間。但並非任何技術上的限制,此行業人士可根據該流質清潔材料的組成與該待處理表面與待移除材料的特性,藉由實驗決定。至於該流質清潔材料供應裝置,因屬於已知之裝置,其詳細架構、組成及操作,在此不需贅述。The liquid cleaning material supply device is used for continuously supplying liquid cleaning materials, so it can be any liquid supply device commonly used in the industry, for example, a device capable of controlling the supply of liquid, including a storage tank, a conveying pipe, A control drive and at least one supply head. The supply head can be a tubular opening, a sprinkler head or a nozzle. Depending on the composition of the fluid cleaning material, the supply rate of the fluid cleaning material is between about 300 ml/min. and 800 ml/min. However, it is not a technical limitation, and the person in the industry can determine by experiment based on the composition of the liquid cleaning material and the characteristics of the surface to be treated and the material to be removed. As for the liquid cleaning material supply device, since it is a known device, the detailed structure, composition and operation thereof need not be described here.

該流質清潔材料包括一種可流動載體以及至少一種高硬度材料顆粒。其中,該可流動載體較好為液體或黏稠性物體,可以任何適用的材料或材料組成形成。在本發明的實施例中是使用水。因其取得容易,成本低廉,且回收容易,不會對環境造成污染。其他材料例如乙醇、油體,包括植物來源油體以及礦物來源油體,以及以上材料的組成物,均可應用在本發明。至於該高硬度材料顆粒,在本發明中也無任何限制。通常而言,硬度在8或以上的材料所形成,顆粒尺寸在#500與#1500之間的材料,即適合應用在本發明。適用的材料包括:各種金屬氧化物,碳酸物、矽酸物、碳化矽、以及金剛砂、核桃砂等。其中,碳化矽應用在本發明實施例中,獲得優異的效果。在濃度方面,通常而言,該高硬度材料顆粒與該可流動載體的比例約可在10g/l與50g/l之間,較好在15g/l與25g/l之間。但該濃度並非任何技術上的限制。高硬度材料顆粒含量太低,會減損清潔的效果,含量太高,則可能損及待處理表面。此行業人士可以在應用中,根據流質清潔顆粒與該待處理表面與待移除材料的特性,藉由實驗決定。重點是,因為本發明的流質清潔材料包含可流動載體與高硬度材料顆粒。有提升應用上容許度的優點。此外,該高硬度材料顆粒在使用時最好呈現懸浮在該可流動載體內的狀態,以提升其清潔效果。The fluid cleaning material comprises a flowable carrier and at least one particle of high hardness material. Wherein, the flowable carrier is preferably a liquid or viscous object and can be formed of any suitable material or material composition. Water is used in the embodiment of the invention. Because it is easy to obtain, low in cost, and easy to recycle, it will not pollute the environment. Other materials such as ethanol, oil bodies, including plant-derived oil bodies and mineral-derived oil bodies, as well as compositions of the above materials, can be used in the present invention. As for the high hardness material particles, there is no limitation in the present invention. In general, a material having a hardness of 8 or more and a material having a particle size between #500 and #1500 is suitable for use in the present invention. Suitable materials include: various metal oxides, carbonates, tannins, tantalum carbide, and silicon carbide, walnut sand, and the like. Among them, tantalum carbide is used in the embodiment of the invention to obtain an excellent effect. In terms of concentration, in general, the ratio of the high hardness material particles to the flowable carrier may be between about 10 g/l and 50 g/l, preferably between 15 g/l and 25 g/l. However, this concentration is not a technical limitation. If the content of the high hardness material is too low, the effect of cleaning will be degraded, and if the content is too high, the surface to be treated may be damaged. This industry can be determined experimentally based on the characteristics of the liquid cleaning particles and the surface to be treated and the material to be removed. The point is because the fluid cleaning material of the present invention comprises a flowable carrier and particles of high hardness material. There are advantages to improving the tolerance of the application. Further, the high hardness material particles preferably exhibit a state of being suspended in the flowable carrier when used to enhance the cleaning effect.

本發明的表面清潔裝置還可以包括一清洗裝置,用來清洗該已經移除待處理 材料的待處理表面。該清洗裝置可為一業界常用的清洗裝置,以將清潔過程中遺留在該待處理表面以及其他表面的物質移除。該清洗裝置通常為一可供應清潔液體的裝置,將清潔液體提供到待清洗表面,將表面物質以沖刷、溶解等方式移除。此外,本發明的表面清潔裝置尚可包括一乾燥裝置,用來將該處理後或清洗後的待處理表面作乾燥處理。該乾燥裝置可為一氣流產生裝置,以對該待處理表面供應氣流,以移除殘餘的清洗液、可流動載體、高硬度材料顆粒及/或移除的材料。The surface cleaning device of the present invention may further comprise a cleaning device for cleaning the removed to be processed The surface to be treated of the material. The cleaning device can be a cleaning device commonly used in the industry to remove substances left on the surface to be treated and other surfaces during the cleaning process. The cleaning device is typically a device that supplies cleaning liquid, provides cleaning liquid to the surface to be cleaned, and removes surface material by flushing, dissolving, and the like. Further, the surface cleaning device of the present invention may further comprise a drying device for drying the treated or cleaned surface to be treated. The drying device can be an airflow generating device to supply airflow to the surface to be treated to remove residual cleaning fluid, flowable carrier, particles of high hardness material, and/or material removed.

本發明的表面清潔裝置還可以包括一回收裝置,用來回收使用過的流質清潔材料。該回收裝置可以利用重力等方式,收集使用過的流質清潔材料,以利進行後續處理。在本發明的實例中,是使用水作為可流動載體,並使用碳化矽作為高硬度材料顆粒。如果待處理材料為封裝材料,則所回收的流質清潔材料中所含的碳化矽與封裝材料因比重不同,且不會溶解於水,因此回收後容易分離。分離後的高硬度材料顆粒可以簡易處理後,再度利用。因此,本發明可以將表面清潔對環境的污染,減至最低。The surface cleaning apparatus of the present invention may further comprise a recovery unit for recovering the used fluid cleaning material. The recycling device can collect the used liquid cleaning material by gravity or the like for subsequent processing. In the examples of the present invention, water is used as the flowable carrier, and tantalum carbide is used as the particles of the high hardness material. If the material to be treated is an encapsulating material, the niobium carbide and the encapsulating material contained in the recovered liquid cleaning material are different in specific gravity and do not dissolve in water, so that they are easily separated after recovery. The separated high-hardness material particles can be easily treated and reused. Therefore, the present invention can minimize the contamination of the environment by surface cleaning.

根據本發明的表面清潔方法,則包括下列步驟:固定一待處理表面;對該待處理表面施加一流質清潔材料;及於施加同時以一掃拂材料連續掃拂該待處理表面:其中,該流質清潔材料包括一可流動載體以及至少一種高硬度材料顆粒。The surface cleaning method according to the present invention comprises the steps of: fixing a surface to be treated; applying a first-class quality cleaning material to the surface to be treated; and continuously sweeping the surface to be treated with a broom material while applying: wherein the liquid is The cleaning material includes a flowable carrier and at least one particle of high hardness material.

本發明的表面清潔方法另可包括使該待處理表面與該掃拂材料的掃拂表面作相對運動的步驟。The surface cleaning method of the present invention may further comprise the step of relatively moving the surface to be treated with the broom surface of the broom material.

在本發明的實例中,該待處理表面可以利用一定位裝置或移動定位裝置加以固定。如為一移動定位裝置,除固定之外,尚可將該待處理表面移動,以與該掃 拂材料的掃拂表面作相對運動。當然,該相對運動也可利用移動該掃拂材料的方式,或同時移動該待處理表面與該掃拂材料的方式實施。In an embodiment of the invention, the surface to be treated may be secured by a positioning device or a moving positioning device. If it is a mobile positioning device, in addition to fixing, the surface to be treated can be moved to The broom surface of the crucible material is moved relative to each other. Of course, the relative motion can also be implemented by moving the broom material or by simultaneously moving the surface to be treated and the broom material.

在本發明的實例中,該掃拂材料與該流質清潔材料的裝置、材質、特性均如上述。該掃拂材料也可以轉動掃拂、平面掃拂或旋轉掃拂,或者上述方式的結合方式,掃拂該待處理表面。也如上述。In the example of the present invention, the apparatus, material, and characteristics of the broom material and the fluid cleaning material are as described above. The broom material can also be rotated by a broom, a flat broom or a rotating broom, or a combination of the above, to sweep the surface to be treated. Also as above.

本發明的方法還可包括一清洗已清潔的待處理表面的步驟、乾燥待處理表面及其他表面的步驟及/或回收該流質清潔材料及移除材料的步驟。其實施方式也如前述。The method of the present invention may further comprise the steps of washing the cleaned surface to be treated, drying the surface to be treated and other surfaces, and/or recovering the liquid cleaning material and removing the material. The embodiment is also as described above.

適合以本發明的表面清潔裝置及表面清潔方法進行表面清潔的,包括各種產業上所製成的產品。由其是需要從硬度較低的表面移除硬度較高的物質時,本發明的裝置與方法,可以提供有效移除,且不傷及待處理表面的優點。適用於電子產業時,該待處理表面可為一基板表面,包括各種材質的基板,例如矽基板、玻璃基版、金屬基板、塑膠、橡膠基板等。而該待移除材料則包括附著在該待處理基板上的材料、雜質、髒汙、甚至其他基板或基板材料。以上述QFN封裝而言,該待處理表面為導線架表面,待移除材料則為溢膠及髒汙。在其他製程或封裝方法,該待處理表面則可為任一製程步驟所製得的裝置或組件的任一表面,待移除材料則為任何附著在該表面上的物質或材料。Surface cleaning suitable for the surface cleaning apparatus and surface cleaning method of the present invention includes various industrially produced products. The apparatus and method of the present invention can provide effective removal without compromising the advantages of the surface to be treated, as it is required to remove a higher hardness material from a lower hardness surface. When applied to the electronics industry, the surface to be treated may be a substrate surface, including substrates of various materials, such as a germanium substrate, a glass substrate, a metal substrate, a plastic, a rubber substrate, and the like. The material to be removed includes materials, impurities, dirt, and even other substrate or substrate materials attached to the substrate to be processed. In the above QFN package, the surface to be treated is the surface of the lead frame, and the material to be removed is overflowed and dirty. In other processes or packaging methods, the surface to be treated may be any surface of the device or component produced in any of the process steps, and the material to be removed is any material or material attached to the surface.

此外,本發明因使用該掃拂裝置與該流質清潔材料供應裝置,故而該待處理表面之平坦度並無嚴格限制,意即無須嚴格控制。換言之,經過塗布封裝材料,熱處理硬化的基板,雖然發生變形,本發明仍能在簡單的固定下,將基板表面的溢膠、髒汙加以清除。且不會傷及基板表面。Further, since the present invention uses the broom device and the liquid cleaning material supply device, the flatness of the surface to be treated is not strictly limited, that is, it is not strictly controlled. In other words, the substrate which has been subjected to the heat treatment and hardening by the application of the encapsulating material can be removed, and the present invention can remove the glue and dirt on the surface of the substrate with a simple fixing. It does not damage the surface of the substrate.

實施例Example

第1圖表示本發明的表面清潔裝置使用在清潔QFN封裝後的基板時的實施例機構示意圖。圖中顯示待處理的基板10放置於一真空吸盤21上,該真空吸盤21以管線22耦接到一真空產生器23。該真空吸盤21上,管線22與壓縮機真空產生器23形成本發明的基板固定裝置20。在本實例中,掃拂裝置40包括輪軸41、轉輪42、一端固定在轉輪轉動面的掃拂材料43,以及驅動該轉輪42的驅動裝置(未圖示)。驅動裝置驅動轉輪沿轉軸41轉動,帶動掃拂材料43以高速掃拂下方的基板10表面。Fig. 1 is a view showing an embodiment of a surface cleaning apparatus of the present invention used in cleaning a substrate after QFN packaging. The figure shows that the substrate 10 to be processed is placed on a vacuum chuck 21 which is coupled to a vacuum generator 23 by a line 22. On the vacuum chuck 21, the line 22 and the compressor vacuum generator 23 form the substrate holding device 20 of the present invention. In the present example, the broom device 40 includes an axle 41, a reel 42, a broom material 43 having one end fixed to the rotating surface of the reel, and a driving device (not shown) for driving the reel 42. The driving device drives the rotating wheel to rotate along the rotating shaft 41, and drives the broom material 43 to sweep the surface of the lower substrate 10 at a high speed.

在本實施例中,掃拂裝置40的位置是固定不動。移動裝置30包括驅動輪31、皮帶32、輪軸33以及驅動馬達(未圖示)。皮帶32上設置多數定位座34,用以固定固定裝置20的真空吸盤21。該驅動馬達轉動時,帶動輪軸33轉動,以將該定位座34以及其上的真空吸盤21,連同待處理基板10移動到該掃拂材料43的掃拂表面。該掃拂表面代表該掃拂材料43的自由端能夠接觸的位置所包括的區域,並非單純為一數學上的「平面」。在本實例中,進行清潔時,是使該待處理基板10在該掃拂材料43下方直線移動,接受掃拂,以清潔其表面。在其他實例中,則更使該該待處理基板10在該掃拂材料43下方來回直線移動,接受掃拂,以提高清潔效果。In the present embodiment, the position of the broom device 40 is fixed. The moving device 30 includes a drive wheel 31, a belt 32, an axle 33, and a drive motor (not shown). A plurality of positioning seats 34 are provided on the belt 32 for fixing the vacuum chuck 21 of the fixing device 20. When the drive motor rotates, the wheel shaft 33 is rotated to move the positioning seat 34 and the vacuum chuck 21 thereon, together with the substrate 10 to be processed, to the broom surface of the broom material 43. The broom surface represents the area covered by the position at which the free end of the broom material 43 can be contacted, and is not simply a mathematical "plane". In the present example, when cleaning is performed, the substrate to be processed 10 is linearly moved under the broom material 43 to receive a broom to clean the surface thereof. In other examples, the substrate to be processed 10 is moved linearly back and forth under the broom material 43 to receive a broom to improve the cleaning effect.

在本發明其他實施例中,是移動該掃拂裝置40,以接近該待處理基板10表面。無論何種作法,都可以使該拂裝置40與該待處理基板10個別或同時移動,並重複作相對運動,以提高清潔效果。In other embodiments of the invention, the broom device 40 is moved to access the surface of the substrate 10 to be processed. Regardless of the method, the crucible device 40 can be moved individually or simultaneously with the substrate 10 to be processed, and the relative movement can be repeated to improve the cleaning effect.

在本實施例中的掃拂裝置40,是以轉動方式驅動該掃拂材料43。但如前所述,該掃拂材料43也可作平面掃拂或作旋轉掃拂。此時,該掃拂材料43較好為剛性,但硬度不足以刮傷該基板10表面的材料,例如各種材料的刷毛。The broom device 40 in this embodiment rotationally drives the broom material 43. However, as previously mentioned, the broom material 43 can also be used as a flat broom or as a rotating broom. At this time, the broom material 43 is preferably rigid, but the hardness is insufficient to scratch the material of the surface of the substrate 10, such as bristles of various materials.

該流質清潔材料供應裝置50包括一儲存槽、一泵浦(均未圖示),一輸送管51及一供應頭52。用已將該流質清潔材料53供應到該基板10的待處理表面。該流質清潔材料53含有一種可流動載體及至少一種高硬度材料顆粒。The fluid cleaning material supply device 50 includes a storage tank, a pump (none of which is shown), a delivery tube 51 and a supply head 52. The liquid cleaning material 53 has been supplied to the surface to be treated of the substrate 10. The fluid cleaning material 53 contains a flowable carrier and at least one particle of high hardness material.

雖然本發明並不受限於任何理論,但發明人發現:該流質清潔材料53供應到該基板10的待處理表面後,會因該掃拂材料43的連續掃拂,而刮削該基板10的待處理表面。該流質清潔材料53含有的高硬度材料顆粒在該掃拂材料43帶動下作與待處理表面平行的運動,碰撞該待處理表面上的髒污、溢膠等,可以將其刮除。但是因為摻有可流動載體,並僅以掃拂方式驅動,可以減緩其碰撞該待處理表面,因而防止刮削該待處理表面。Although the present invention is not limited to any theory, the inventors have found that after the liquid cleaning material 53 is supplied to the surface to be treated of the substrate 10, the substrate 10 is scraped by the continuous broom of the broom material 43. Surface to be treated. The high-hardness material particles contained in the liquid cleaning material 53 are moved in parallel with the surface to be treated by the broom material 43, and collide with the surface, the glue, and the like on the surface to be treated, and can be scraped off. However, because it is doped with a flowable carrier and is driven only by a broom, it can be slowed to collide with the surface to be treated, thus preventing the surface to be treated from being scraped.

第1圖中雖未顯示,但本發明的表面清潔裝置還包括一控制裝置,耦接至該定位裝置20、該移動裝置30、該掃拂裝置40以及該流質清潔材料供應裝置50,以控制例如該該定位裝置20的真空吸盤21啟閉、該移動裝置30的移動與否、方向與速度、該掃拂裝置40的位置與轉速以及該流質清潔材料供應裝置50的啟閉及供應速率等。但此種控制顯屬業界已知之技術。在此也不需贅述。Although not shown in FIG. 1, the surface cleaning apparatus of the present invention further includes a control device coupled to the positioning device 20, the moving device 30, the broom device 40, and the liquid cleaning material supply device 50 for controlling For example, the vacuum chuck 21 of the positioning device 20 is opened and closed, the movement of the moving device 30, the direction and speed, the position and rotation speed of the broom device 40, and the opening and closing and supply rate of the liquid cleaning material supply device 50, and the like. . However, such control is a technology known in the industry. There is no need to repeat them here.

此外,第1圖雖未顯示,但本發明的表面清潔裝置另包括一清洗裝置61,用來清洗清潔後的基板10;一乾燥裝置62,用來將清洗後的基板10乾燥;以及一回收裝置63,用來回收使用過的流質清潔材料。此種控制亦屬業界已知之技術。在此也不需贅述。In addition, although not shown in FIG. 1, the surface cleaning apparatus of the present invention further includes a cleaning device 61 for cleaning the cleaned substrate 10, a drying device 62 for drying the cleaned substrate 10, and a recycling device. Apparatus 63 for recovering used fluid cleaning material. Such control is also a technology known in the industry. There is no need to repeat them here.

第2圖表示本發明表面清潔方法應用在上述實施例的流程圖。如圖所示,於步驟201將該基板10放置在該真空吸盤21上,於步驟202開啟該掃拂裝置40,使掃拂材料43開始掃拂,並開啟該流質清潔材料供應裝置50,開始供應流質清潔材料。於步驟203移動該基板10進入並通過該掃拂材料43的掃拂表面。如有 必要,重複該步驟203一定次數。接者,於步驟204將該基板10移動到該清洗裝置61進行清洗,於步驟205將該基板10移動到該乾燥裝置62進行乾燥。如此完成該基板10的清潔處理。Fig. 2 is a flow chart showing the application of the surface cleaning method of the present invention to the above embodiment. As shown in the figure, the substrate 10 is placed on the vacuum chuck 21 in step 201. The broom device 40 is turned on in step 202, the broom material 43 is started to sweep, and the liquid cleaning material supply device 50 is turned on. Supply liquid cleaning materials. The substrate 10 is moved in step 203 into and through the broom surface of the broom material 43. If If necessary, repeat step 203 a certain number of times. Then, in step 204, the substrate 10 is moved to the cleaning device 61 for cleaning, and in step 205, the substrate 10 is moved to the drying device 62 for drying. The cleaning process of the substrate 10 is thus completed.

第3圖顯示本發明的清潔效果。其中第3A圖為一QFN封裝處理後的基板照片;第3B圖為經過本發明裝置及方法處理後之基板照片。顯示本發明確能除去大部份的溢膠及髒汙。目測結果也顯示,經過本發明處理後的基板,表面沒有刮傷或破損。證明本發明卻能達成清潔基板但又不損傷基板的目的。Figure 3 shows the cleaning effect of the present invention. 3A is a photograph of a substrate after a QFN package process; and FIG. 3B is a photograph of the substrate processed by the device and method of the present invention. It is shown that the present invention does remove most of the spill and dirt. The visual results also showed that the substrate treated by the present invention had no scratches or breakage on the surface. It is proved that the present invention achieves the purpose of cleaning the substrate without damaging the substrate.

此外,QFN封裝後的基板,均有變形的可能,表面平坦度不佳。但本發明使用掃拂方式及流質清潔材料清潔,因此即使基板變形,本發明仍能達到良好的清潔效果,也無虞損傷基板表面。In addition, the substrate after QFN packaging has the possibility of deformation and poor surface flatness. However, the present invention is cleaned using a broom method and a liquid cleaning material, so that even if the substrate is deformed, the present invention can achieve a good cleaning effect without damaging the substrate surface.

不但如此,本發明所使用的機台,結構簡單,可以利用習知機台稍加改變就可完成。所使用的流質清潔材料,也是容易取得,成本低廉的材料。該流質清潔材料使用後容易與基板上移除的材料分離,再度利用。足證本發明確有成本低廉、實施容易且環保的優點。Moreover, the machine used in the present invention has a simple structure and can be completed by a slight change of the conventional machine. The liquid cleaning materials used are also easy to obtain and low cost materials. The liquid cleaning material is easily separated from the material removed on the substrate after use, and is reused. The invention has the advantages of low cost, easy implementation and environmental protection.

以上是對本發明實施方法的說明,用來例示本發明。習於斯藝之人士不難由以上說明,作出各種變化與衍生。只要不超出本發明申請專利範圍記載,都屬於本發明之專利範圍。The above is a description of the method of carrying out the invention and is intended to illustrate the invention. It is not difficult for those who are accustomed to the art to make various changes and derivatives. It is within the scope of the invention as long as it does not go beyond the scope of the patent application of the present invention.

10‧‧‧基板10‧‧‧Substrate

20‧‧‧基板固定裝置20‧‧‧Substrate fixing device

21‧‧‧真空吸盤21‧‧‧vacuum suction cup

22‧‧‧管線22‧‧‧ pipeline

23‧‧‧真空產生器23‧‧‧Vacuum generator

30‧‧‧移動裝置30‧‧‧Mobile devices

31‧‧‧驅動輪31‧‧‧Drive wheel

32‧‧‧皮帶32‧‧‧Land

33‧‧‧輪軸33‧‧‧Axle

34‧‧‧定位座34‧‧‧ Positioning Block

40‧‧‧掃拂裝置40‧‧‧Broom device

41‧‧‧輪軸41‧‧‧Axle

42‧‧‧轉輪42‧‧‧Runner

43‧‧‧掃拂材料43‧‧‧Broom material

50‧‧‧流質清潔材料供應裝置50‧‧‧liquid cleaning material supply device

51‧‧‧輸送管51‧‧‧ delivery tube

52‧‧‧供應頭52‧‧‧Supply head

53‧‧‧流質清潔材料53‧‧‧liquid cleaning materials

第1圖表示本發明的表面清潔裝置使用在清潔QFN封裝後的基板時的實施例機構示意圖。Fig. 1 is a view showing an embodiment of a surface cleaning apparatus of the present invention used in cleaning a substrate after QFN packaging.

第2圖為其應用方法流程圖。Figure 2 is a flow chart of its application method.

第3圖為顯示本發明清潔效果的照片,其中第3A圖為處理前,第3B圖為 處理後。Fig. 3 is a photograph showing the cleaning effect of the present invention, wherein Fig. 3A is before processing, and Fig. 3B is After processing.

10‧‧‧基板10‧‧‧Substrate

20‧‧‧基板固定裝置20‧‧‧Substrate fixing device

21‧‧‧真空吸盤21‧‧‧vacuum suction cup

22‧‧‧管線22‧‧‧ pipeline

23‧‧‧真空產生器23‧‧‧Vacuum generator

30‧‧‧移動裝置30‧‧‧Mobile devices

31‧‧‧驅動輪31‧‧‧Drive wheel

32‧‧‧皮帶32‧‧‧Land

33‧‧‧輪軸33‧‧‧Axle

34‧‧‧定位座34‧‧‧ Positioning Block

40‧‧‧掃拂裝置40‧‧‧Broom device

41‧‧‧輪軸41‧‧‧Axle

42‧‧‧轉輪42‧‧‧Runner

43‧‧‧掃拂材料43‧‧‧Broom material

50‧‧‧流質清潔材料供應裝置50‧‧‧liquid cleaning material supply device

51‧‧‧輸送管51‧‧‧ delivery tube

52‧‧‧供應頭52‧‧‧Supply head

53‧‧‧流質清潔材料53‧‧‧liquid cleaning materials

Claims (31)

一種表面清潔裝置,包括:一基板定位裝置,以固定一待處理表面;一掃拂裝置,以一掃拂材料對該待處理表面作連續的掃拂;其中該掃拂材料為具有相當長度的軟質條狀材料。一移動裝置,用以使該待處理表面與該掃拂裝置作相對運動;及一流質清潔材料供應裝置,以將一流質清潔材料供應到該掃拂裝置的掃拂表面,用以移除該待處理表面上的部分材料;其中,該流質清潔材料包括一可流動載體以及至少一種高硬度材料顆粒。 A surface cleaning device comprising: a substrate positioning device for fixing a surface to be treated; and a broom device for continuously sweeping the surface to be treated with a broom material; wherein the broom material is a soft strip having a considerable length Shaped material. a moving device for moving the surface to be treated and the broom device; and a first-class quality cleaning material supply device for supplying the first-class quality cleaning material to the broom surface of the broom device for removing the A portion of the material on the surface to be treated; wherein the fluid cleaning material comprises a flowable carrier and at least one particle of high hardness material. 如申請專利範圍第1項的表面清潔裝置,其中,該基板定位裝置為一真空吸盤。 The surface cleaning device of claim 1, wherein the substrate positioning device is a vacuum chuck. 如申請專利範圍第1項的表面清潔裝置,其中該移動裝置可將該待處理表面移動到該掃拂裝置的掃拂表面。 The surface cleaning device of claim 1, wherein the moving device moves the surface to be treated to a broom surface of the broom device. 如申請專利範圍第1項的表面清潔裝置,其中該移動裝置可將該掃拂裝置的掃拂表面移動到待處理表面。 A surface cleaning apparatus according to claim 1, wherein the moving device moves the broom surface of the broom device to a surface to be treated. 如申請專利範圍第3或4項的表面清潔裝置,其中該移動裝置另可使該待處理表面移動與該掃拂裝置兩者作相對運動。 The surface cleaning device of claim 3, wherein the moving device moves the surface to be treated and the broom device to move relative to each other. 如申請專利範圍第1項的表面清潔裝置,其中,該掃拂裝置是選自下列當中之一:轉動型掃拂裝置,平面型掃拂裝置及旋轉型掃拂裝置。 The surface cleaning device of claim 1, wherein the broom device is one selected from the group consisting of a rotary broom device, a flat broom device, and a rotary broom device. 如申請專利範圍第1項的表面清潔裝置,其中,該掃拂材料為不織布。 The surface cleaning device of claim 1, wherein the broom material is a non-woven fabric. 如申請專利範圍第1項的表面清潔裝置,其中,該流質清潔材料供應裝 置是一可控制流質供應量的裝置。 The surface cleaning device of claim 1, wherein the liquid cleaning material supply device It is a device that controls the supply of liquid. 如申請專利範圍第1項的表面清潔裝置,其中,該流質清潔材料之可流動載體為一種液體或一種黏稠性物體。 The surface cleaning device of claim 1, wherein the flowable carrier of the fluid cleaning material is a liquid or a viscous object. 如申請專利範圍第9項的表面清潔裝置,其中,該流質清潔材料為水。 The surface cleaning device of claim 9, wherein the liquid cleaning material is water. 如申請專利範圍第1項的表面清潔裝置,其中,該高硬度材料顆粒,為硬度在8或以上,顆粒尺寸在#500與#1500之間的材料。 The surface cleaning device of claim 1, wherein the high hardness material particles are materials having a hardness of 8 or more and a particle size between #500 and #1500. 如申請專利範圍第11項的表面清潔裝置,其中,該高硬度材料顆粒為碳化矽。 The surface cleaning device of claim 11, wherein the high hardness material particles are niobium carbide. 如申請專利範圍第1項的表面清潔裝置,其中,該高硬度材料顆粒與該可流動載體的比例約在10g/l與50g/l之間。 The surface cleaning apparatus of claim 1, wherein the ratio of the high hardness material particles to the flowable carrier is between about 10 g/l and 50 g/l. 如申請專利範圍第13項的表面清潔裝置,其中,該高硬度材料顆粒與該可流動載體的比例在15g/l與25g/l之間。 The surface cleaning device of claim 13, wherein the ratio of the high hardness material particles to the flowable carrier is between 15 g/l and 25 g/l. 如申請專利範圍第1項的表面清潔裝置,另包括一清洗裝置,用來清洗該已經移除待處理材料的待處理表面。 The surface cleaning device of claim 1, further comprising a cleaning device for cleaning the surface to be treated from which the material to be treated has been removed. 如申請專利範圍第1項的表面清潔裝置,另包括一乾燥裝置,用來將該處理後或清洗後的待處理表面作乾燥處理。 The surface cleaning device of claim 1, further comprising a drying device for drying the treated or cleaned surface to be treated. 如申請專利範圍第1項的表面清潔裝置,另包括一回收裝置,用來回收使用過的流質清潔材料。 The surface cleaning device of claim 1, further comprising a recovery device for recovering the used liquid cleaning material. 一種表面清潔方法,包括下列步驟:固定一待處理表面;對該待處理表面施加一流質清潔材料;及於施加同時以一掃拂材料連續掃拂該待處理表面; 其中,該掃拂材料為具有相當長度的軟質條狀材料;且其中,該流質清潔材料包括一可流動載體以及至少一種高硬度材料顆粒。 A surface cleaning method comprising the steps of: fixing a surface to be treated; applying a first-class quality cleaning material to the surface to be treated; and continuously sweeping the surface to be treated with a broom material while applying; Wherein, the broom material is a soft strip material having a considerable length; and wherein the fluid cleaning material comprises a flowable carrier and at least one high hardness material particle. 如申請專利範圍第18項的表面清潔方法,另包括使該待處理表面與該掃拂材料的掃拂表面作相對運動的步驟。 The surface cleaning method of claim 18, further comprising the step of causing the surface to be treated to move relative to the broom surface of the broom material. 如申請專利範圍第19項的表面清潔方法,其中,該待處理表面以一移動定位裝置加以固定,以將該待處理表面固定後移動,以與該掃拂材料的掃拂表面作相對運動。 The surface cleaning method of claim 19, wherein the surface to be treated is fixed by a moving positioning device to fix and move the surface to be treated to move relative to the broom surface of the broom material. 如申請專利範圍第19項的表面清潔方法,其中,該相對運動是利用:移動該待處理表面、移動該掃拂材料的方式,及同時移動該待處理表面與該掃拂材料的方式中,任一種方式實施。 The surface cleaning method of claim 19, wherein the relative movement is: a method of moving the surface to be treated, moving the broom material, and simultaneously moving the surface to be treated and the broom material, Either way. 如申請專利範圍第18項的表面清潔方法,其中,該掃拂材料以轉動掃拂、平面掃拂及旋轉掃拂中,至少一種方法掃拂該待處理表面。 The surface cleaning method of claim 18, wherein the broom material sweeps the surface to be treated by at least one of a rotating broom, a flat broom and a rotating broom. 如申請專利範圍第18項的表面清潔方法,另包括一清洗已清潔的待處理表面的步驟。 The surface cleaning method of claim 18, further comprising the step of cleaning the cleaned surface to be treated. 如申請專利範圍第18項的表面清潔方法,另包括一乾燥待處理表面及其他表面的步驟。 The surface cleaning method of claim 18, further comprising the step of drying the surface to be treated and other surfaces. 如申請專利範圍第18項的表面清潔方法,另包括一回收該流質清潔材料及移除材料的步驟。 The surface cleaning method of claim 18, further comprising the step of recovering the liquid cleaning material and removing the material. 如申請專利範圍第18項的表面清潔方法,其中,該流質清潔材料之可流動載體為一種液體或一種黏稠性物體。 The surface cleaning method of claim 18, wherein the flowable carrier of the fluid cleaning material is a liquid or a viscous object. 如申請專利範圍第26項的表面清潔方法,其中,該流質清潔材料之可流 動載體為水。 The surface cleaning method of claim 26, wherein the fluid cleaning material is flowable The carrier is water. 如申請專利範圍第18項的表面清潔方法,其中,該高硬度材料顆粒為硬度在8或以上,顆粒尺寸在#500與#1500之間的材料。 The surface cleaning method of claim 18, wherein the high hardness material particles are materials having a hardness of 8 or more and a particle size between #500 and #1500. 如申請專利範圍第28項的表面清潔方法,其中,該高硬度材料顆粒為碳化矽。 The surface cleaning method of claim 28, wherein the high hardness material particles are niobium carbide. 如申請專利範圍第18項的表面清潔方法,其中,該高硬度材料顆粒與該可流動載體的比例約在10g/l與50g/l之間。 The surface cleaning method of claim 18, wherein the ratio of the high hardness material particles to the flowable carrier is between about 10 g/l and 50 g/l. 如申請專利範圍第30項的表面清潔方法,其中,該高硬度材料顆粒與該可流動載體的比例約在15g/l與25g/l之間。 The surface cleaning method of claim 30, wherein the ratio of the high hardness material particles to the flowable carrier is between about 15 g/l and 25 g/l.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201005865A (en) * 2008-06-04 2010-02-01 Ebara Corp Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
TW201013811A (en) * 2008-07-02 2010-04-01 Tokyo Electron Ltd Substrate cleaning device
TW201142001A (en) * 2010-05-07 2011-12-01 Hitachi Chemical Co Ltd Polishing agent for CMP and polishing method using the same

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