TWI484548B - - Google Patents
Info
- Publication number
- TWI484548B TWI484548B TW101150756A TW101150756A TWI484548B TW I484548 B TWI484548 B TW I484548B TW 101150756 A TW101150756 A TW 101150756A TW 101150756 A TW101150756 A TW 101150756A TW I484548 B TWI484548 B TW I484548B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150756A TW201426844A (en) | 2012-12-28 | 2012-12-28 | Manufacturing method of micro-channel structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101150756A TW201426844A (en) | 2012-12-28 | 2012-12-28 | Manufacturing method of micro-channel structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201426844A TW201426844A (en) | 2014-07-01 |
| TWI484548B true TWI484548B (en) | 2015-05-11 |
Family
ID=51725652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150756A TW201426844A (en) | 2012-12-28 | 2012-12-28 | Manufacturing method of micro-channel structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201426844A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI635041B (en) | 2017-06-09 | 2018-09-11 | 國立臺灣師範大學 | Micro-flow channel chip and manufacturing method thereof |
| CN113300072B (en) * | 2021-05-11 | 2022-07-15 | 中国电子科技集团公司第二十九研究所 | Radio frequency array front end three-dimensional integrated structure and manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW495885B (en) * | 2000-02-09 | 2002-07-21 | Semitool Inc | Method and apparatus for processing a microelectronic workpiece at an elevated temperature |
| TW201232580A (en) * | 2010-12-09 | 2012-08-01 | Tessera Inc | High density three-dimensional integrated capacitors |
| CN101638213B (en) * | 2008-08-01 | 2012-12-19 | 微智半导体股份有限公司 | Micro structural manufacture method capable of integrating semiconductor processing |
-
2012
- 2012-12-28 TW TW101150756A patent/TW201426844A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW495885B (en) * | 2000-02-09 | 2002-07-21 | Semitool Inc | Method and apparatus for processing a microelectronic workpiece at an elevated temperature |
| CN101638213B (en) * | 2008-08-01 | 2012-12-19 | 微智半导体股份有限公司 | Micro structural manufacture method capable of integrating semiconductor processing |
| TW201232580A (en) * | 2010-12-09 | 2012-08-01 | Tessera Inc | High density three-dimensional integrated capacitors |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201426844A (en) | 2014-07-01 |