TWI484527B - - Google Patents

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Publication number
TWI484527B
TWI484527B TW101151245A TW101151245A TWI484527B TW I484527 B TWI484527 B TW I484527B TW 101151245 A TW101151245 A TW 101151245A TW 101151245 A TW101151245 A TW 101151245A TW I484527 B TWI484527 B TW I484527B
Authority
TW
Taiwan
Application number
TW101151245A
Other languages
Chinese (zh)
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TW201349280A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of TW201349280A publication Critical patent/TW201349280A/en
Application granted granted Critical
Publication of TWI484527B publication Critical patent/TWI484527B/zh

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TW101151245A 2012-05-31 2012-12-28 Inductively coupled plasma processing chamber with automatic frequency tuning for source and bias RF power TW201349280A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210175897.2A CN103456591B (en) 2012-05-31 2012-05-31 The inductively coupled plasma process chamber of automatic frequency tuning source and biased radio-frequency power supply

Publications (2)

Publication Number Publication Date
TW201349280A TW201349280A (en) 2013-12-01
TWI484527B true TWI484527B (en) 2015-05-11

Family

ID=49738844

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101151245A TW201349280A (en) 2012-05-31 2012-12-28 Inductively coupled plasma processing chamber with automatic frequency tuning for source and bias RF power

Country Status (2)

Country Link
CN (1) CN103456591B (en)
TW (1) TW201349280A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667487B (en) * 2016-09-29 2019-08-01 美商超精細研究股份有限公司 Radio frequency coil tuning methods and apparatus

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647735B (en) * 2013-03-15 2019-01-11 美商蘭姆研究公司 Modeling to establish ion energy associated with the plasma system
CN106298418B (en) * 2015-05-18 2018-10-16 中微半导体设备(上海)有限公司 inductively coupled plasma processing system and processing method
CN106298419B (en) * 2015-05-18 2018-10-16 中微半导体设备(上海)有限公司 inductively coupled plasma processing system and processing method
CN104849598B (en) * 2015-05-25 2018-04-10 上海美诺福科技股份有限公司 The control circuit and detecting system of a kind of radio-frequency signal generator
US10347464B2 (en) * 2015-09-15 2019-07-09 Lam Research Corporation Cycle-averaged frequency tuning for low power voltage mode operation
CN110416047B (en) * 2018-04-27 2021-03-02 北京北方华创微电子装备有限公司 Radio frequency impedance matching method and device and semiconductor processing equipment
US11355325B2 (en) 2020-05-28 2022-06-07 Applied Materials, Inc. Methods and systems for monitoring input power for process control in semiconductor process systems
CN113065237B (en) * 2021-03-19 2022-11-08 四川英杰电气股份有限公司 Method for automatically setting frequency modulation boundary and radio frequency power supply
CN114446758B (en) * 2022-01-21 2024-04-12 北京北方华创微电子装备有限公司 Semiconductor process chamber and semiconductor process method
CN114724945A (en) * 2022-05-18 2022-07-08 北京屹唐半导体科技股份有限公司 Plasma nitridation doping method and device and semiconductor device

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US20030192646A1 (en) * 2002-04-12 2003-10-16 Applied Materials, Inc. Plasma processing chamber having magnetic assembly and method
TW200829087A (en) * 2006-11-22 2008-07-01 Pearl Kogyo Co Ltd High frequency power source device and supply method of high frequency power
TW200903625A (en) * 2007-07-04 2009-01-16 Advanced Micro Fab Equip Inc Multi-station decoupled reactive ion etch chamber
US20100089319A1 (en) * 2008-10-09 2010-04-15 Applied Materials, Inc. Rf return path for large plasma processing chamber
TW201108866A (en) * 2009-08-17 2011-03-01 Advanced Micro Fab Equip Inc Plasma processing chamber having switchable bias frequency and a switchable match network therefore
US20110135844A1 (en) * 2009-11-17 2011-06-09 Applied Materials, Inc. Large area plasma processing chamber with at-electrode rf matching
CN201962350U (en) * 2010-11-09 2011-09-07 中微半导体设备(上海)有限公司 Device for in situ cleaning deposition reaction chamber of III-group element and V-group element compounds

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KR0170387B1 (en) * 1989-10-03 1999-03-30 제임스 조셉 드롱 High-frequency semiconductor wafer processing method using a negative self-bias
US5688357A (en) * 1995-02-15 1997-11-18 Applied Materials, Inc. Automatic frequency tuning of an RF power source of an inductively coupled plasma reactor
TW200300649A (en) * 2001-11-27 2003-06-01 Alps Electric Co Ltd Plasma processing apparatus, its driving method, matching circuit design system, and plasma processing method
KR20060029621A (en) * 2003-06-19 2006-04-06 플라즈마 컨트롤 시스템 엘엘씨 Plasma production device and method and rf driver circuit with adjustable duty cycle

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030192646A1 (en) * 2002-04-12 2003-10-16 Applied Materials, Inc. Plasma processing chamber having magnetic assembly and method
TW200829087A (en) * 2006-11-22 2008-07-01 Pearl Kogyo Co Ltd High frequency power source device and supply method of high frequency power
TW200903625A (en) * 2007-07-04 2009-01-16 Advanced Micro Fab Equip Inc Multi-station decoupled reactive ion etch chamber
US20100089319A1 (en) * 2008-10-09 2010-04-15 Applied Materials, Inc. Rf return path for large plasma processing chamber
TW201108866A (en) * 2009-08-17 2011-03-01 Advanced Micro Fab Equip Inc Plasma processing chamber having switchable bias frequency and a switchable match network therefore
US20110135844A1 (en) * 2009-11-17 2011-06-09 Applied Materials, Inc. Large area plasma processing chamber with at-electrode rf matching
CN201962350U (en) * 2010-11-09 2011-09-07 中微半导体设备(上海)有限公司 Device for in situ cleaning deposition reaction chamber of III-group element and V-group element compounds

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667487B (en) * 2016-09-29 2019-08-01 美商超精細研究股份有限公司 Radio frequency coil tuning methods and apparatus
TWI685668B (en) * 2016-09-29 2020-02-21 美商超精細研究股份有限公司 Magnetic resonance imaging system, and tuning system for use with the magnetic resonance imaging system

Also Published As

Publication number Publication date
CN103456591A (en) 2013-12-18
TW201349280A (en) 2013-12-01
CN103456591B (en) 2016-04-06

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