TWI484280B - Display device and manufacturing method of display device - Google Patents
Display device and manufacturing method of display device Download PDFInfo
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本發明是有關於一種顯示裝置和顯示裝置的製造方法,尤指一種垂直整合無線通信模組、電子紙模組和基板,以使顯示裝置的面積較小和較低成本的顯示裝置和顯示裝置的製造方法。The present invention relates to a display device and a display device manufacturing method, and more particularly to a display device and a display device that vertically integrates a wireless communication module, an electronic paper module, and a substrate to make the display device smaller in area and lower in cost. Manufacturing method.
請參照第1圖,第1圖是為現有技術說明一種顯示裝置100的示意圖。如第1圖所示,顯示裝置100包含一電子紙模組102與一近場通訊(Near Field Communication,NFC)模組104,其中現有技術是利用一貼合製程通過結合(Anisotropic Conductive Film bonding,ACF電子紙模組102與近場通訊模組104的接腳,以整合電子紙模組102與近場通訊模組104為顯示裝置100。然而,現有技術具有下列缺點:第一、因為由於近場通訊模組佈件為高溫製程但電子紙模組貼合製程為常溫製程,所以現有技術是利用貼合製程通過結合電子紙模組102與近場通訊模組104的接腳,以整合電子紙模組102與近場通訊模組104,所以貼合製程較為複雜;第二、因為電子紙模組102與近場通訊模組104是為獨立的模組,所以顯示裝置100具有較大的面積與較高的成本。因此,現有技術並不是用以生產顯示裝置100的一個好的選擇。Please refer to FIG. 1. FIG. 1 is a schematic view showing a display device 100 for the prior art. As shown in FIG. 1 , the display device 100 includes an electronic paper module 102 and a Near Field Communication (NFC) module 104. The prior art utilizes a bonding process (Anisotropic Conductive Film bonding, The pins of the ACF electronic paper module 102 and the near field communication module 104 are used to integrate the electronic paper module 102 and the near field communication module 104 into the display device 100. However, the prior art has the following disadvantages: first, because The field communication module fabric is a high temperature process, but the electronic paper module bonding process is a normal temperature process. Therefore, the prior art uses a bonding process to integrate the electronic device module 102 with the pin of the near field communication module 104 to integrate the electronic device. The paper module 102 and the near field communication module 104 are relatively complicated in the bonding process. Second, since the electronic paper module 102 and the near field communication module 104 are independent modules, the display device 100 has a large size. Area and higher cost. Therefore, the prior art is not a good choice for producing the display device 100.
本發明的一實施例提供一種顯示裝置。該顯示裝置包含一基板、一無線通信模組及一電子紙模組。該無線通信模組是先佈件在該基板的第一側,用以接收一無線電波,並轉換該無線電波為一電能,其中在該無線通信模組佈件在該基板的第一側之後,該基板通過一冶具平坦化;該電子紙模組是在一常溫環境中(20℃-50℃),貼合在該基板的第二側,以及利用該電能,顯示一影像,其中該基板的第一側是相對於該基板的第二側。An embodiment of the invention provides a display device. The display device comprises a substrate, a wireless communication module and an electronic paper module. The wireless communication module is configured to receive a radio wave on the first side of the substrate, and convert the radio wave into an electric energy, wherein the wireless communication module is disposed on the first side of the substrate The substrate is planarized by a metallurgical tool; the electronic paper module is attached to the second side of the substrate in a normal temperature environment (20 ° C - 50 ° C), and displays an image by using the electrical energy, wherein the substrate The first side is relative to the second side of the substrate.
本發明的另一實施例提供一種顯示裝置的製造方法。該製造方法包含佈件一無線通信模組在一基板的第一側;在該無線通信模組佈件在該基板的第一側之後,利用一冶具使該基板平坦化;在該基板平坦化之後,在一常溫環境中,貼合一電子紙模組在該基板的第二側,其中該基板的第一側是相對於該基板的第二側。Another embodiment of the present invention provides a method of fabricating a display device. The manufacturing method includes a fabric-wireless communication module on a first side of the substrate; after the wireless communication module is disposed on the first side of the substrate, the substrate is planarized by a metallurgical tool; planarizing the substrate Thereafter, in a normal temperature environment, an electronic paper module is attached to the second side of the substrate, wherein the first side of the substrate is opposite to the second side of the substrate.
本發明提供一種顯示裝置和顯示裝置的製造方法。該顯示裝置和該製造方法是將一無線通信模組和一電子紙模組分別佈件及貼合在一基板的第一側和該基板的第二側,其中該基板的第一側是相對於該基板的第二側,且該電子紙模組是通過該基板內的孔洞接收該無線通信模組所轉換的電能。因此,相較於現有技術,本發明具有下列優點:第一、因為本發明是垂直整合該無線通信模組、該電子紙模組和該基板,所以該顯示裝置的面積較小;第二、因為該電子紙模組是直接通過該基板內的孔洞接收該無線通信模組所轉換的電能,所以本發明可節省該無線通信模組和該電子紙模組之間的打線 (bonding)的成本;第三、因為該電子紙模組是直接通過該基板內的孔洞接收該無線通信模組所轉換的電能,所以該顯示裝置並不需要電池。The present invention provides a display device and a method of manufacturing the display device. The display device and the manufacturing method are respectively configured to fabricate and attach a wireless communication module and an electronic paper module to a first side of a substrate and a second side of the substrate, wherein the first side of the substrate is opposite On the second side of the substrate, the electronic paper module receives the electrical energy converted by the wireless communication module through a hole in the substrate. Therefore, compared with the prior art, the present invention has the following advantages: First, because the present invention vertically integrates the wireless communication module, the electronic paper module, and the substrate, the display device has a small area; Because the electronic paper module directly receives the electrical energy converted by the wireless communication module through the hole in the substrate, the invention can save the wire between the wireless communication module and the electronic paper module. The cost of (bonding); third, because the electronic paper module directly receives power converted by the wireless communication module through a hole in the substrate, the display device does not require a battery.
請參照第2圖,第2圖是為本發明的一實施例說明一種顯示裝置200的示意圖。顯示裝置200包含一基板202、一無線通信模組204及一電子紙模組206,其中基板202包含孔洞208、210和212。但本發明並不受限於基板202僅包含三個208、210和212,亦即基板202可包含複數個孔洞。無線通信模組204是在一高溫環境下(例如130℃-160℃),佈件在基板202的第一側,其中無線通信模組204是可為一近場通訊(Near Field Communication,NFC)模組、一無線區域網路(wireless LAN,WLAN)模組、一紫蜂短距無線傳輸標準(IEEE 802.15.4,Zigbee)模組、一藍芽(Bluetooth)模組、一無線廣域網(Wireless Wide Area Network,WWAN)模組、一全球行動通訊系統(Global System for Mobile Communications,GSM)模組、一通用封包無線服務技術(General Packet Radio Service,GPRS)模組、一第三代行動通訊技術(third generation,3G)模組、一第四代行動通訊技術(fourth generation,4G)模組或一行為者網路理論(Actor Network Theory+,Ant+)模組。另外,在本發明的另一實施例中,無線通信模組204是在高溫環境下(例如130℃-160℃),佈件在基板202的第一側和基板202的第二側,其中基板202的第一側是相對於基板202的第二側。無線通信模組204是用以接收一無線電波,並轉換無線 電波為一電能。請參照第3圖,第3圖是為說明在無線通信模組204貼合在基板202的第一側之後,基板202是通過一冶具214平坦化的示意圖。當無線通信模組204貼合在基板202的第一側之後,基板202的第二側可能會因為無線通信模組204而不平坦,導致電子紙模組206無法密合的貼合在基板202的第二側,造成氣泡孔洞產生。因此,如第3圖所示,在無線通信模組204貼合在基板202的第一側之後,基板202是通過冶具214平坦化,以至於電子紙模組206可密合的貼合在基板202的第二側。另外,當基板202是為一環氧樹脂玻璃纖維(FR4)基板時,基板202較厚;當基板202是為一聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)基板或一聚醯亞胺(polyimide,PI)基板時,基板202較薄。但本發明並不受限於基板202是為環氧樹脂玻璃纖維基板、聚對苯二甲酸乙二酯基板或聚醯亞胺(polyimide,PI)基板。Please refer to FIG. 2, which is a schematic diagram of a display device 200 according to an embodiment of the invention. The display device 200 includes a substrate 202, a wireless communication module 204, and an electronic paper module 206. The substrate 202 includes holes 208, 210, and 212. However, the present invention is not limited to the substrate 202 including only three 208, 210, and 212, that is, the substrate 202 may include a plurality of holes. The wireless communication module 204 is in a high temperature environment (for example, 130 ° C - 160 ° C), and the cloth is on the first side of the substrate 202. The wireless communication module 204 can be a near field communication (NFC). Module, a wireless local area network (WLAN) module, a purple bee short-range wireless transmission standard (IEEE 802.15.4, Zigbee) module, a Bluetooth module, a wireless wide area network (Wireless Wide Area Network (WWAN) module, a Global System for Mobile Communications (GSM) module, a General Packet Radio Service (GPRS) module, and a third-generation mobile communication technology (third generation, 3G) module, a fourth generation (4G) module or an Actor Network Theory+ (Ant+) module. In addition, in another embodiment of the present invention, the wireless communication module 204 is in a high temperature environment (for example, 130 ° C - 160 ° C), the cloth is on the first side of the substrate 202 and the second side of the substrate 202, wherein the substrate The first side of the 202 is the second side relative to the substrate 202. The wireless communication module 204 is configured to receive a radio wave and convert the wireless The electric wave is an electric energy. Please refer to FIG. 3 . FIG. 3 is a schematic diagram illustrating the planarization of the substrate 202 by a metallurgical tool 214 after the wireless communication module 204 is attached to the first side of the substrate 202 . After the wireless communication module 204 is attached to the first side of the substrate 202, the second side of the substrate 202 may be uneven due to the wireless communication module 204, so that the electronic paper module 206 cannot be closely adhered to the substrate 202. The second side causes bubble holes to be created. Therefore, as shown in FIG. 3, after the wireless communication module 204 is attached to the first side of the substrate 202, the substrate 202 is planarized by the tool 214, so that the electronic paper module 206 can be closely adhered to the substrate. The second side of 202. In addition, when the substrate 202 is an epoxy resin glass fiber (FR4) substrate, the substrate 202 is thicker; when the substrate 202 is a polyethylene terephthalate (PET) substrate or a polyphthalate In the case of a polyimide (PI) substrate, the substrate 202 is thin. However, the present invention is not limited to the substrate 202 being an epoxy resin glass fiber substrate, a polyethylene terephthalate substrate, or a polyimide (PI) substrate.
請參照第4圖,第4圖是為說明在基板202平坦化後,電子紙模組206貼合在基板202的第二側的示意圖。電子紙模組206是在一常溫環境(20~50℃)中,貼合在基板202的第二側。然後,在電子紙模組206貼合在基板202的第二側之後,移除冶具214。電子紙模組206是用以通過基板202內的孔洞208、210和212接收無線通信模組204所轉換的電能,且利用電能,顯示一影像。電子紙模組206是可為一電泳式(Electro-Phoretic Display,EPD)電子紙模組、一膽固醇液晶(Cholesteric Liquid Crystal,CHLC)電子紙模組、一主動式矩陣(Active Matrix)電子紙模組、一被動式(Segment Type)電子紙模 組或一微機電系統(Micro Electro Mechanical Systems,MEMS)電子紙模組。另外,當電子紙模組206是可為電泳式電子紙模組時,電子紙模組206亦可為一微膠囊化(Microcapsule)電子紙模組、一微杯化(Microcup)電子紙模組或一快速反應液態粉狀顯示(Quick Response Liquid Powder Display,QR-LPD)電子紙模組。另外,在本發明的另一實施例中,電子紙模組206可另耦接一電源,亦即電子紙模組206可由外接的電源所提供的電能,顯示一影像。Referring to FIG. 4, FIG. 4 is a schematic view showing the electronic paper module 206 attached to the second side of the substrate 202 after the substrate 202 is planarized. The electronic paper module 206 is attached to the second side of the substrate 202 in a normal temperature environment (20 to 50 ° C). Then, after the electronic paper module 206 is attached to the second side of the substrate 202, the tool 214 is removed. The electronic paper module 206 is configured to receive the electrical energy converted by the wireless communication module 204 through the holes 208, 210, and 212 in the substrate 202, and display an image using the electrical energy. The electronic paper module 206 can be an Electro-Phoretic Display (EPD) electronic paper module, a Cholesteric Liquid Crystal (CHLC) electronic paper module, and an Active Matrix electronic paper mold. Group, a passive type (Segment Type) electronic paper mold Group or a Micro Electro Mechanical Systems (MEMS) electronic paper module. In addition, when the electronic paper module 206 is an electrophoretic electronic paper module, the electronic paper module 206 can also be a microcapsule electronic paper module and a microcup electronic paper module. Or a quick response liquid powder display (QR-LPD) electronic paper module. In addition, in another embodiment of the present invention, the electronic paper module 206 can be coupled to a power source, that is, the electronic paper module 206 can display an image by the power provided by the external power source.
請參照第5圖和第6圖,第5圖是為說明顯示裝置200另包含一保護層216的示意圖,和第6圖是為說明顯示裝置200另包含二保護層216、218的示意圖。如第5圖所示,當顯示裝置200另包含保護層216時,保護層216先貼合以覆蓋和保護電子紙模組206後,再移除冶具214,其中保護層216是為一透明的保護層,且保護層216是可為一體成型或亦可為由複數個保護單元所組成。在本發明的另一實施例中,顯示裝置200另包含二保護層216、218。如第6圖所示,顯示裝置200另包含二保護層216、218時,保護層216先貼合以覆蓋和保護電子紙模組206,之後再移除冶具214。然後,再貼合保護層218覆蓋和保護無線通信模組204,其中保護層218和保護層216一樣,在此不再贅述。Please refer to FIG. 5 and FIG. 6. FIG. 5 is a schematic diagram for explaining that the display device 200 further includes a protective layer 216, and FIG. 6 is a schematic view for explaining that the display device 200 further includes two protective layers 216 and 218. As shown in FIG. 5, when the display device 200 further includes a protective layer 216, the protective layer 216 is first attached to cover and protect the electronic paper module 206, and then the tool 214 is removed, wherein the protective layer 216 is transparent. The protective layer, and the protective layer 216 may be integrally formed or may be composed of a plurality of protection units. In another embodiment of the invention, display device 200 further includes two protective layers 216, 218. As shown in FIG. 6, when the display device 200 further includes two protective layers 216, 218, the protective layer 216 is first attached to cover and protect the electronic paper module 206, and then the tool 214 is removed. Then, the protective layer 218 is applied to cover and protect the wireless communication module 204. The protection layer 218 is the same as the protection layer 216, and details are not described herein.
請參照第2圖、第3圖、第4圖和第7圖,第7圖是為本發明的另一實施例說明一種顯示裝置的製造方法的流程圖。第7圖的製 造方法是利用第2圖、第3圖和第4圖的顯示裝置200說明,詳細步驟如下:步驟700:開始;步驟702:佈件無線通信模組204在基板202的第一側;步驟704:在無線通信模組204佈件在基板202的第一側之後,利用冶具214使基板202平坦化;步驟706:在基板202平坦化之後,在一常溫環境中,貼合電子紙模組206在基板202的第二側;步驟708:在電子紙模組206貼合在基板202的第二側之後,移除冶具214;步驟710:結束。Referring to FIG. 2, FIG. 3, FIG. 4, and FIG. 7, FIG. 7 is a flow chart showing a method of manufacturing a display device according to another embodiment of the present invention. The system of Figure 7 The manufacturing method is described by using the display device 200 of FIG. 2, FIG. 3 and FIG. 4, and the detailed steps are as follows: Step 700: Start; Step 702: The cloth wireless communication module 204 is on the first side of the substrate 202; Step 704 After the wireless communication module 204 is disposed on the first side of the substrate 202, the substrate 202 is planarized by the tool 214; Step 706: After the substrate 202 is planarized, the electronic paper module 206 is attached in a normal temperature environment. On the second side of the substrate 202; Step 708: After the electronic paper module 206 is attached to the second side of the substrate 202, the tool 214 is removed; Step 710: End.
在步驟702中,無線通信模組204是在一高溫環境下(例如130℃-160℃),佈件在基板202的第一側,其中基板202具有孔洞208、210和212。無線通信模組204是可為一近場通訊模組、一無線區域網路模組、一紫蜂短距無線傳輸標準模組、一藍芽模組、一無線廣域網模組、一全球行動通訊系統模組、一通用封包無線服務技術模組、一第三代行動通訊技術模組、一第四代行動通訊技術模組或一行為者網路理論模組。另外,在本發明的另一實施例中,無線通信模組204是在高溫環境下,貼合在基板202的第一側和基板202的第二側,其中基板202的第一側是相對於基板202的第二側。在步驟704中,當無線通信模組204佈件在基板202的第一側之後, 基板202的第二側可能會因為無線通信模組204而造成不平坦,導致電子紙模組206無法完全密合的貼合在基板202的第二側。因此,如第3圖所示,在無線通信模組204貼合在基板202的第一側之後,基板202是通過冶具214平坦化,以至於電子紙模組206可完全密合的貼合在基板202的第二側。In step 702, the wireless communication module 204 is in a high temperature environment (e.g., 130 ° C - 160 ° C), and the fabric is on the first side of the substrate 202, wherein the substrate 202 has holes 208, 210, and 212. The wireless communication module 204 can be a near field communication module, a wireless area network module, a purple bee short-range wireless transmission standard module, a Bluetooth module, a wireless wide area network module, and a global mobile communication. System module, a general packet wireless service technology module, a third generation mobile communication technology module, a fourth generation mobile communication technology module or a actor network theory module. In addition, in another embodiment of the present invention, the wireless communication module 204 is attached to the first side of the substrate 202 and the second side of the substrate 202 in a high temperature environment, wherein the first side of the substrate 202 is opposite to The second side of the substrate 202. In step 704, after the wireless communication module 204 is disposed on the first side of the substrate 202, The second side of the substrate 202 may be uneven due to the wireless communication module 204, so that the electronic paper module 206 cannot be completely adhered to the second side of the substrate 202. Therefore, as shown in FIG. 3, after the wireless communication module 204 is attached to the first side of the substrate 202, the substrate 202 is planarized by the tool 214, so that the electronic paper module 206 can be completely adhered to each other. The second side of the substrate 202.
在步驟706中,電子紙模組206是在常溫環境(20-50℃)中,貼合在基板202的第二側。電子紙模組206是用以通過基板202內的孔洞208、210和212接收無線通信模組204所轉換的電能,且利用電能,顯示一影像。電子紙模組206是可為一電泳式電子紙模組、一膽固醇液晶電子紙模組、一主動式矩陣有機發光二極體電子紙模組或一微機電系統電子紙模組。另外,當電子紙模組206是可為電泳式電子紙模組時,電子紙模組206亦可為一微膠囊化電子紙模組、一微杯化電子紙模組或一快速反應液態粉狀顯示電子紙模組。然後,在步驟708中,當電子紙模組206貼合在基板202的第二側之後,移除冶具214。In step 706, the electronic paper module 206 is attached to the second side of the substrate 202 in a normal temperature environment (20-50 ° C). The electronic paper module 206 is configured to receive the electrical energy converted by the wireless communication module 204 through the holes 208, 210, and 212 in the substrate 202, and display an image using the electrical energy. The electronic paper module 206 can be an electrophoretic electronic paper module, a cholesterol liquid crystal electronic paper module, an active matrix organic light emitting diode electronic paper module or a microelectromechanical system electronic paper module. In addition, when the electronic paper module 206 is an electrophoretic electronic paper module, the electronic paper module 206 can also be a micro-encapsulated electronic paper module, a micro-cup electronic paper module, or a fast-reacting liquid powder. The electronic paper module is displayed. Then, in step 708, after the electronic paper module 206 is attached to the second side of the substrate 202, the tool 214 is removed.
請參照第5圖、第6圖和第8圖,第8圖是為本發明的另一實施例說明一種顯示裝置的製造方法的流程圖。第8圖的製造方法是利用第5圖和第6圖的顯示裝置200說明,詳細步驟如下:步驟800:開始;步驟802:佈件無線通信模組204在基板202的第一側; 步驟804:在無線通信模組204佈件在基板202的第一側之後,利用冶具214使基板202平坦化;步驟806:在基板202平坦化之後,在一常溫環境中,貼合電子紙模組206在基板202的第二側;步驟808:在電子紙模組206貼合在基板202的第二側之後,貼合保護層216;步驟810:移除冶具214;步驟812:結束。Referring to FIG. 5, FIG. 6, and FIG. 8, FIG. 8 is a flow chart showing a method of manufacturing a display device according to another embodiment of the present invention. The manufacturing method of FIG. 8 is illustrated by the display device 200 of FIGS. 5 and 6, and the detailed steps are as follows: Step 800: Start; Step 802: The cloth wireless communication module 204 is on the first side of the substrate 202; Step 804: After the wireless communication module 204 is disposed on the first side of the substrate 202, the substrate 202 is planarized by using the tool 214; Step 806: After the substrate 202 is planarized, the electronic paper mold is attached in a normal temperature environment. The group 206 is on the second side of the substrate 202; Step 808: After the electronic paper module 206 is attached to the second side of the substrate 202, the protective layer 216 is attached; Step 810: The tool 214 is removed; Step 812: End.
第8圖的實施例和第7圖的實施例的差別在於,在步驟808、中,在電子紙模組206貼合在基板202的第二側之後,貼合保護層216,其中保護層216(如第5圖所示)是用以覆蓋和保護電子紙模組206,其中保護層216是為一透明的保護層,且保護層216是可為一體成型或亦可為由複數個保護單元所組成。在本發明的另一實施例中,在電子紙模組206貼合在基板202的第二側之後,形成保護層216,在移除冶具214之後,形成保護層218。如第6圖所示,二保護層216、218是用以分別覆蓋和保護電子紙模組206和無線通信模組204,其中保護層218和保護層216一樣,在此不再贅述。The difference between the embodiment of FIG. 8 and the embodiment of FIG. 7 is that, in step 808, after the electronic paper module 206 is attached to the second side of the substrate 202, the protective layer 216 is adhered, wherein the protective layer 216 (As shown in FIG. 5) is used to cover and protect the electronic paper module 206, wherein the protective layer 216 is a transparent protective layer, and the protective layer 216 may be integrally formed or may be composed of a plurality of protection units. Composed of. In another embodiment of the present invention, after the electronic paper module 206 is attached to the second side of the substrate 202, the protective layer 216 is formed. After the tool 214 is removed, the protective layer 218 is formed. As shown in FIG. 6, the two protective layers 216 and 218 are used to cover and protect the electronic paper module 206 and the wireless communication module 204, respectively. The protective layer 218 is the same as the protective layer 216, and details are not described herein.
綜上所述,本發明所提供的顯示裝置和顯示裝置的製造方法,是將無線通信模組和電子紙模組分別佈件及貼合在基板的第一側和基板的第二側,其中基板的第一側是相對於基板的第二側,且電子紙模組是通過基板內的孔洞接收無線通信模組所轉換的電能。因 此,相較於現有技術,本發明具有下列優點:第一、因為本發明是垂直整合無線通信模組、電子紙模組和基板,所以顯示裝置的面積較小;第二、因為電子紙模組是直接通過基板內的孔洞接收無線通信模組所轉換的電能,所以本發明可節省無線通信模組和電子紙模組之間的打線(bonding)的成本;第三、因為電子紙模組是直接通過基板內的孔洞接收無線通信模組所轉換的電能,所以顯示裝置並不需要電池。In summary, the display device and the display device are provided by the wireless communication module and the electronic paper module respectively, and are respectively attached to the first side of the substrate and the second side of the substrate, wherein The first side of the substrate is opposite to the second side of the substrate, and the electronic paper module receives the electrical energy converted by the wireless communication module through the holes in the substrate. because Therefore, compared with the prior art, the present invention has the following advantages: First, because the invention is a vertically integrated wireless communication module, an electronic paper module and a substrate, the display device has a small area; and second, because the electronic paper mold The group directly receives the electric energy converted by the wireless communication module through the holes in the substrate, so the invention can save the cost of bonding between the wireless communication module and the electronic paper module; third, because the electronic paper module The power converted by the wireless communication module is directly received through the holes in the substrate, so the display device does not need a battery.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
100、200‧‧‧顯示裝置100, 200‧‧‧ display devices
102、206‧‧‧電子紙模組102, 206‧‧‧ Electronic paper module
104‧‧‧近場通訊模組104‧‧‧ Near Field Communication Module
202‧‧‧基板202‧‧‧Substrate
204‧‧‧無線通信模組204‧‧‧Wireless communication module
208、210、212‧‧‧孔洞208, 210, 212‧ ‧ holes
214‧‧‧冶具214‧‧‧
216、218‧‧‧保護層216, 218‧‧ ‧ protective layer
700-710、800-812‧‧‧步驟700-710, 800-812‧‧‧ steps
第1圖是為現有技術說明一種顯示裝置的示意圖。Fig. 1 is a schematic view showing a display device for the prior art.
第2圖是為本發明的一實施例說明一種顯示裝置的示意圖。Fig. 2 is a schematic view showing a display device according to an embodiment of the present invention.
第3圖是為說明在無線通信模組佈件在基板的第一側之後,基板是通過冶具平坦化的示意圖。FIG. 3 is a schematic view showing the substrate being planarized by a metallurgy after the wireless communication module is placed on the first side of the substrate.
第4圖是為說明在基板平坦化後,電子紙模組貼合在基板的第二側的示意圖。Fig. 4 is a schematic view showing the electronic paper module being attached to the second side of the substrate after the substrate is flattened.
第5圖是為說明顯示裝置另包含保護層的示意圖。Fig. 5 is a schematic view for explaining that the display device further includes a protective layer.
第6圖是為說明顯示裝置另包含二保護層的示意圖。Figure 6 is a schematic view for explaining that the display device further includes two protective layers.
第7圖是為本發明的另一實施例說明一種顯示裝置的製造方法的流程圖。Fig. 7 is a flow chart showing a method of manufacturing a display device according to another embodiment of the present invention.
第8圖是為本發明的另一實施例說明一種顯示裝置的製造方法的流程圖。Fig. 8 is a flow chart showing a method of manufacturing a display device according to another embodiment of the present invention.
200‧‧‧顯示裝置200‧‧‧ display device
202‧‧‧基板202‧‧‧Substrate
204‧‧‧無線通信模組204‧‧‧Wireless communication module
206‧‧‧電子紙模組206‧‧‧Electronic paper module
208、210、212‧‧‧孔洞208, 210, 212‧ ‧ holes
Claims (16)
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