CN100390819C - Electrophoresis display smart card and method for manufacturing the same - Google Patents
Electrophoresis display smart card and method for manufacturing the same Download PDFInfo
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- CN100390819C CN100390819C CNB2004100585223A CN200410058522A CN100390819C CN 100390819 C CN100390819 C CN 100390819C CN B2004100585223 A CNB2004100585223 A CN B2004100585223A CN 200410058522 A CN200410058522 A CN 200410058522A CN 100390819 C CN100390819 C CN 100390819C
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- smart card
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- electrophoretic display
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- 238000001962 electrophoresis Methods 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims description 82
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000012769 display material Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 14
- 238000005516 engineering process Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 13
- 238000002360 preparation method Methods 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 8
- 238000007731 hot pressing Methods 0.000 claims description 7
- 230000006698 induction Effects 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 abstract description 11
- 238000005452 bending Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 84
- 229920003023 plastic Polymers 0.000 description 15
- 239000004033 plastic Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 9
- 238000013461 design Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000003475 lamination Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 230000001939 inductive effect Effects 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 229920002457 flexible plastic Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- -1 polyethylene vinyl acetate Polymers 0.000 description 2
- 229920001522 polyglycol ester Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- OSNILPMOSNGHLC-UHFFFAOYSA-N 1-[4-methoxy-3-(piperidin-1-ylmethyl)phenyl]ethanone Chemical compound COC1=CC=C(C(C)=O)C=C1CN1CCCCC1 OSNILPMOSNGHLC-UHFFFAOYSA-N 0.000 description 1
- MFYSUUPKMDJYPF-UHFFFAOYSA-N 2-[(4-methyl-2-nitrophenyl)diazenyl]-3-oxo-n-phenylbutanamide Chemical compound C=1C=CC=CC=1NC(=O)C(C(=O)C)N=NC1=CC=C(C)C=C1[N+]([O-])=O MFYSUUPKMDJYPF-UHFFFAOYSA-N 0.000 description 1
- LVOJOIBIVGEQBP-UHFFFAOYSA-N 4-[[2-chloro-4-[3-chloro-4-[(5-hydroxy-3-methyl-1-phenylpyrazol-4-yl)diazenyl]phenyl]phenyl]diazenyl]-5-methyl-2-phenylpyrazol-3-ol Chemical compound CC1=NN(C(O)=C1N=NC1=CC=C(C=C1Cl)C1=CC(Cl)=C(C=C1)N=NC1=C(O)N(N=C1C)C1=CC=CC=C1)C1=CC=CC=C1 LVOJOIBIVGEQBP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 241001354471 Pseudobahia Species 0.000 description 1
- 241000532412 Vitex Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001055 blue pigment Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 235000009347 chasteberry Nutrition 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 235000019239 indanthrene blue RS Nutrition 0.000 description 1
- UHOKSCJSTAHBSO-UHFFFAOYSA-N indanthrone blue Chemical compound C1=CC=C2C(=O)C3=CC=C4NC5=C6C(=O)C7=CC=CC=C7C(=O)C6=CC=C5NC4=C3C(=O)C2=C1 UHOKSCJSTAHBSO-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 239000001053 orange pigment Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- DGBWPZSGHAXYGK-UHFFFAOYSA-N perinone Chemical compound C12=NC3=CC=CC=C3N2C(=O)C2=CC=C3C4=C2C1=CC=C4C(=O)N1C2=CC=CC=C2N=C13 DGBWPZSGHAXYGK-UHFFFAOYSA-N 0.000 description 1
- ZZSIDSMUTXFKNS-UHFFFAOYSA-N perylene red Chemical compound CC(C)C1=CC=CC(C(C)C)=C1N(C(=O)C=1C2=C3C4=C(OC=5C=CC=CC=5)C=1)C(=O)C2=CC(OC=1C=CC=CC=1)=C3C(C(OC=1C=CC=CC=1)=CC1=C2C(C(N(C=3C(=CC=CC=3C(C)C)C(C)C)C1=O)=O)=C1)=C2C4=C1OC1=CC=CC=C1 ZZSIDSMUTXFKNS-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
The present invention discloses an electrophoresis display smart card and a manufacturing method thereof. The smart card comprises an outer protective film, a function circuit and a display device, wherein the display device is an electrophoresis display device; the function circuit comprises an electrophoresis display control circuit and a drive circuit to control the display of the electrophoresis display device. The manufacturing method of the smart card of the present invention comprises that: firstly, the electrophoresis display device and a flexible electronic circuit board are prepared; then, electronic elements are assembled on the flexible electronic circuit board; finally, the electrophoresis display device and the flexible electronic circuit board are combined into a whole and are sealed. The present invention uses the electrophoresis display device as a smart card to provide display. Because the flexible electrophoresis display device is light and thin, and the material of display layers is not sensitive to the external environment, function circuits on the upper and the lower display layers can be separately manufactured, which simplifies the production process. Simultaneously, the stability and the high flexibility of the electrophoresis display device are mused. Under a bending state, a display screen still keeps high contrast, and the work performance is not affected.
Description
Technical field
The present invention relates to a kind of smart card and manufacture method thereof, relate in particular to a kind of electrophoresis showed smart card and manufacture method thereof.
Background technology
Smart card (Smart Card) generally is meant a plastic cards of giving sizing, has encapsulated integrated circuit (IC) chip above, is used for storage and deal with data.The smart card that we use always roughly divides four kinds: storage card, encryption storage card, CPU card, radio-frequency card etc.Whether from the contacted angle of read write line, smart card is divided into contact and contactless two kinds again.Contact type intelligent card with RF-wise is an example below, smart card is done one simply introduce.
Contactless smart card has another name called the induced intelligent card, is born in the beginning of the nineties, owing to exist magnetic card and the incomparable advantage of contact intelligent card, makes it once appearance, just causes immediately widely and pays close attention to, and applied with surprising rapidity.Contactless smart card is made up of integrated circuit (IC) chip, induction antenna, and is sealed between common plastics layer such as Polyvinylchloride (PVC) film no exposed parts fully.The read-write process of contactless smart card is usually by finishing read-write operation by radiowave between contactless smart card and the read write line.
Contactless smart card itself is passive body, when read write line when sticking into capable read-write operation, the signal that read write line sends is made up of two parts stack: a part is a power supply signal, after this signal is received by clamping, inductance capacitance (L/C) in itself produces resonance, produces a transient energy and supplies with chip operation.Another part then is a combined data signal, and commander's chip is finished data, modification, storage etc., and returns to read write line.By the formed read-write system of contactless IC card, no matter be hardware configuration, or operating process has all obtained very big simplification, simultaneously by means of advanced management software, but the mode of operation of off line all makes the reading and writing data process more simple.Contactless smart card adopts radiofrequency signal to carry out the information transmission more, and general radio frequency signal frequency comprises 125kHZ, 13.56MHz, and 915MHz, 2.45GHz etc. are for the application of smart card, comparatively popular and universal with 13.56MHz at present.
Contactless smart card is compared with contact intelligent card, it is when having inherited the contact intelligent card advantage, as high capacity, high security etc., overcome the unavoidable shortcoming of contact again, as read and write the failure rate height, expose the read-write process of the pollution, damage, wearing and tearing, static and this inconvenience of plug-in card that cause etc. owing to the contact.Form that contactless smart card seals fully and contactless working method, make it not to be subjected to the influence of extraneous undesirable element, thereby serviceable life is fully near natural life-span of integrated circuit (IC) chip, thereby the convenience of the frequency of utilization of card itself and time limit and operation all is higher than contact intelligent card greatly.
Then, no matter be which kind of smart card owing to self do not have Presentation Function, its information transmission with the read-write machine is unidirectional, the user can't be initiatively the unfreezing internal information, still need grasp the card internal information by special arrangement or query mode.
In order to overcome above-mentioned inconvenience, in recent years, people more and more wish Presentation Function and smart card are combined as a whole, and go up display screen by card, can carry out the bidirectional information transmission with the read-write machine, make the smart card user can initiatively obtain the card internal information.
United States Patent (USP) 4,746,787 disclose a kind of intellective IC card Presentation Function, read-write that has, and have described the read-write process of signal in the patent in detail.This smart card uses liquid crystal display LCD to be display device, and it all is independent one-tenth piece that the structure of intellective IC card is formed as display, control circuit, battery etc.The signal read-write process that arrives involved in the present invention will no longer describe in detail, and (but being not limited to) this read-write process described in can this patent is carried out.
United States Patent (USP) 6,676,021 discloses a kind of displayable Intelligent Recognition card, it has adopted the flexible thin film type electrochemical cell, galvanochemistry colour developing (electrochromic), photic colour developing (photo-chromic) or thermic colour developing (thermo-chromic) are adopted in its display part, but this demonstration is disposable, and can't show repeated use repeatedly.
On the other hand, in display screen research and development field, the development trend of display screen is to develop towards light and thin direction.Particularly for display screen technology, it is in light weight because of it to mould basic display screen, but flexible and rolling batch process is that people endeavour hot of research and development always.These display screens comprise flexible liquid crystal, flexible Organic Light Emitting Diode, and little containing electrophoresis showed etc. all are fit to the display application of smart card.
For moulding base fluid crystalline substance or organic light-emitting diode (OLED) display screen, because the display layer material extreme sensitivity of environment to external world, absorption, the scattering and permeating of a small amount of steam and oxygen will display material operate as normal and serviceable lifes.So this class display material need be avoided being exposed in air or the external environment.Present general application mode is to have (under ultra-clean dust free room and vacuum condition) under the environment of protectiveness; display layer and control circuit (backplane) be assembled into be contained within an integral body between the base material up and down; formation has the whole display device of control circuit, just can be used for the follow-up assembling of smart card.This class is moulded basic display device and is not only made complexity, and because its display layer and its control circuit are difficult to separatedly, the common technological process of production of its production and existing smart card can't combine effectively.Existing these display device are used for radio frequency smart card; general production procedure as shown in Figure 1; at first under the protection environment, make the display device (step 101) that has control circuit through special process; make radio frequency identification inductive antenna coil (step 102) then; then make driving circuit (step 103); then with display device; coil and driving circuit are fixed smooth (step 104); with display device; coil is connected (step 105) with circuit between the driving circuit; then with integrated circuit (IC) chip and radio-frequency (RF) component assembling (step 106); diaphragm carries out overall package (step 107) about utilizing at last, finally forms smart card.
Yet; owing to mould base fluid crystalline substance and the Organic Light Emitting Diode display layer material extreme sensitivity of environment to external world; at present in production run; the capital all respectively adds one or more layers with circuit plastic-based material behind, has the diaphragm of bonding agent before display screen, to keep the display screen operate as normal and to prolong its serviceable life.When the enough thick so that display screen performance of protective seam was stablized, the pliability of display screen will significantly reduce, and this structure often is unfavorable for the flexible requirement of smart card, and the thickness of whole smart card increases greatly, also can lack portability.
The another kind of selection then is to utilize expensive protective film; flexible glass (Flexible glass) base material as the production of the U.S. BarixCoating of Vitex company technology; it by multilayer inorganic and organic barrier layer form, have fabulous performance, its steam rate of propagation only is 10
-5～10
-6Gram/square metre/day, but utilize the smart card cost of this material too high.
In addition, moulding the base fluid crystal display screen has extremely strict requirement to the spacing of upper/lower electrode, and when display layer is bent and changes the spacing of upper/lower electrode, the performance of liquid crystal display will be greatly affected.For above-mentioned reasons, really be not used widely with the smart card of Presentation Function at present.
Recently, electrophoresis showed is because high-contrast (even under sunburst), visual bistability and advantage light, high flexibility that it had, this technology obtains people gradually and payes attention to, and discloses little containing electrophoretic display system of electric field driven as PCT patent WO98/03896; Nakamura etc. have reported with the scraper type method and have been coated with the technology of little containing electrophoretic display materials on indium tin oxide (ITO) plastic sheeting continuously; PCT patent WO01/67170A1 has announced a kind of rolling production method of little containing electrophoretic display panel, and its display layer can rolling be preserved separately; Mr. Chen Yu has reported a kind of ultra-thin high resolution flexible electrophoretic display panel at " nature " magazine in 2003, and under case of bending, display screen still keeps high-contrast, and serviceability is unaffected.
Simultaneously, with respect to moulding base fluid crystalline substance or Organic Light Emitting Diode, environment is comparatively insensitive to external world for little containing electrophoresis showed layer, therefore can make independent upper strata display layer and lower floor's control circuit layer, and the upper strata display layer can keep stability medium-term and long-term preservation of conventional environment.Therefore, because the stability and the high degree of flexibility of slim electrophoresis showed have made it to become the desirable display material that can be applicable to smart card.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of electrophoresis showed smart card and manufacture method thereof, provides Presentation Function with electrophoretic display materials.
The invention provides a kind of electrophoresis showed smart card, comprise display device and intelligent card function circuit, described display device is display message under functional circuit control, wherein, described display device is an electrophoretic display apparatus, described functional circuit comprises electrophoresis showed control circuit and driving circuit, to control the demonstration of described electrophoretic display apparatus.
Wherein, described functional circuit integral body is formed on the same base material, and described functional circuit can be formed at the one or both sides of same base material.
Described functional circuit also comprises recognition device.
Described recognition device can be a rfid device, comprises induction antenna and integrated circuit (IC) chip.
Described electrophoresis showed control circuit can be the single face control circuit, is formed at a side of base material; Can be two-sided control circuit also, be formed at the both sides of base material.
Described two-sided control circuit can independently be formed at the both sides of base material respectively, also can be formed at the both sides of base material with the mode integral body that is communicated with.
Described display control unit is corresponding with the position and the area of described electrophoretic display apparatus.
The one side of described smart card or two-sidedly have a described electrophoretic display apparatus.
Described functional circuit and described electrophoretic display apparatus can be positioned at the homonymy or the heteropleural of described smart card.
Described smart card also comprises outer diaphragm, with described display device and functional circuit seal protection.
The invention provides a kind of manufacture method of electrophoresis showed smart card, comprise the steps:
Preparation electrophoretic display apparatus and flexible electronic wiring board;
Electronic component is assembled on the described flexible electronic wiring board;
With described electrophoretic display apparatus and the driving fit of flexible electronic wiring board is one.
Wherein, the preparation of described electrophoretic display apparatus comprises the steps:
According to the size of viewing area, utilize the coating instrument on base material, to be coated with display material continuously and become piece;
On described display material piece, be coated with one deck bonding coat continuously.
Described flexible electronic circuit comprises induction antenna coil, driving circuit and display control circuit.
Described flexible electronic wiring board is to make to form on same base material, and is the one or both sides that integral body is formed at same base material.
Described flexible electronic circuit can be made by method of superposition, removal method or half lap addition.
Described electronic component assembling step can be utilized surface mounted technology assembling.
Described with electrophoretic display apparatus and flexible PCB integrating step, wherein, described electrophoretic display apparatus is corresponding with the position of the display control circuit of described flexible PCB.
Described with electrophoretic display apparatus and flexible PCB integrating step, wherein, described flexible PCB has two-sided control circuit, and is corresponding to respectively two electrophoretic display apparatus.
Described with electrophoretic display apparatus and flexible PCB integrating step, can adopt heating, pressurization or hot-press method.
Described with electrophoretic display apparatus and flexible PCB driving fit step, can adopt outer diaphragm to finish packaging by hot pressing simultaneously.
The present invention has used electrophoretic display apparatus to provide demonstration as smart card, because flexible electrophoresis showed was both light and thin, can utilize a large amount of rolling productions of coating instrument again, display layer material environment to external world is comparatively insensitive, and upper strata display device and lower floor's control circuit can separate preparation under conventional environment like this, have simplified production procedure, the stability and the high-flexibility of electrophoresis showed have also been utilized simultaneously, under case of bending, display screen still keeps high-contrast, and serviceability is unaffected.
Description of drawings
Fig. 1 is existing demonstration smart card flow sheet;
Fig. 2 is the manufacture method embodiment process flow diagram of the present invention's electrophoresis showed smart card;
The electrophoretic display apparatus synoptic diagram that Fig. 3 is carried by the present invention;
Fig. 4 A is electrophoretic display materials single layer structure figure;
Fig. 4 B is electrophoretic display materials sandwich construction figure;
Fig. 5 makes the flexible PCB schematic flow sheet for method of superposition;
Fig. 6 makes another schematic flow sheet of flexible PCB for method of superposition;
Fig. 7 is for removing manufactured flexible PCB schematic flow sheet;
Fig. 8 adds manufactured flexible PCB schematic flow sheet for half lap;
Fig. 9 makes synoptic diagram for the active-matrix driving circuit;
Figure 10 is the OTFT circuit structure diagram;
Figure 11 A is the vertical view of the digital type circuit of lower floor's control circuit;
Figure 11 B is the sectional view of the digital type circuit of lower floor's control circuit;
Figure 11 C is the two-sided lower floor control circuit synoptic diagram of a shared laminar substrate;
Figure 12 A is the electrophoretic display panel structural representation that has lower floor's control circuit;
Figure 12 B is the two-sided display screen structural representation that has two-sided control circuit, dual display;
Figure 13 is for using the present invention's the demonstration smart card first example structure synoptic diagram;
Figure 14 is for using the present invention's the demonstration smart card first example structure decomposing schematic representation;
Figure 15 is for using the present invention's the demonstration smart card second example structure synoptic diagram;
Figure 16 is for using the present invention's demonstration smart card the 3rd example structure synoptic diagram.
Embodiment
Because flexible electrophoresis showed was both light and thin, display layer material environment to external world is comparatively insensitive, and upper strata display layer and lower floor's functional circuit can separately be made like this, combines with the production procedure of other smart cards, makes whole process simplification.Contactless smart card with RF-wise is an example below, and the present invention is described in detail.
Utilize the present invention; in the process of the smart card that the preparation band shows; can on same base material, unify to make flexible circuit; for example; contactless smart card for RF-wise; can on same base material, make the radio frequency identification inductive antenna coil simultaneously; circuit of display driving; control circuit and between circuit connect; utilize surface mounted technology that integrated circuit (IC) chip and other electric component group are loaded on relevant position on induction antenna coil and the driving circuit then; when diaphragm sealing fabrication, simultaneously display layer and control circuit are integrated by sinter at last.
Specifically; the manufacture method step of electrophoresis showed smart card as shown in Figure 2; at first the size according to the viewing area prepares electrophoretic display apparatus layer (step 201); on same base material, prepare flexible PCB (step 202) then; at flexible PCB relevant position assembling integrated circuit (IC) chip and other electronic components (step 203); utilize hot pressing with electrophoresis showed layer and flexible PCB driving fit, be sealed to card (step 204) with diaphragm simultaneously.
Wherein, for step 201 and 202, do not have special sequence requirement, can prepare respectively also and can prepare simultaneously, and in the step 204, to the hot binding of display layer and circuit board, can seal step with diaphragm to finish simultaneously, also hot pressing is finished respectively.And diaphragm is also also nonessential, and diaphragm can be made by the common plastics material, and diaphragm is encapsulated as a conventional procedures, and it does not directly influence the function of smart card, but can improve the durability of smart card.
Emphasis to above step is described in detail below:
(1) electrophoretic display apparatus layer preparation
In the preparation of flexible electrophoretic display apparatus layer, display material is coated on the substrate serially, is coated with one deck bonding coat then and is covered on the display material layer.Coating can utilize different instruments to finish, as the scraper type of Nakamura in SID ' 98 Digest report, and the pre-metering-type coating of describing in the Chinese patent application (application number 200310123446.5 and 200320130781.3).
As shown in Figure 3, display device is usually by transparency carrier 1, display material layer 2, and bonding coat 3 is formed, and substrate 1 is made up of two parts again usually: transparent flexible bottom 5, as have the terephthalic acid (TPA) polyglycol ester or the naphthalenedicarboxylic acid polyglycol ester film of barrier layer; Transparency conducting layer 6 is as indium tin oxide ITO etc.In the present invention; the making of upper strata display material layer 2 can be according to required display screen size; accurately control the consumption of display material by the coating instrument; on the transparent base 1 that has barrier layer or protective seam upper strata display material; be coated with into piece continuously, be coated with one deck bonding coat 3 then continuously on display material layer 2.
Electrophoresis showed is invented by Ota as far back as the seventies, utilizes coloured charged particle to move under electric field and develops the color.Charged colored particle can be divided into inorganic pigment particles and organic pigment particles, comprise titania, zinc oxide, silicon dioxide, carbon black, iron oxide, organic yellow uitramarine (Aiarylide yellow, Arylideyellow, Hansa yellow Benzidine yellow), organic orange pigment (Perinone Orange, Diarylide Orange), organic blue pigment (Ultramarine blue, Indanthrone blue), organic red pigment (Anthraquinoid red, Perylene red) etc.These particles can be through surface chemical modification, and to improve the stability of electrophoresis dispersed particle, what be applicable to this comprises United States Patent (USP) 6,194, and 488 and the macromolecule modified chemical method in European patent 1393122 disclosed electrophoresis showed pigment particles surfaces.Colored particle is distributed in the dielectric solvent, adds charge control agent and other surfactants etc., can obtain electrophoresis dispersion.
Electrophoresis dispersion is contained within the polymer microsphere, utilizes coating technique can obtain upper strata electrophoresis showed layer.The structure of typical display material layer 2 is shown in Fig. 4 A and Fig. 4 B, Jap.P. 2551783 disclosed multiple little containing electrophoretic display technology (phase separation, interfacial polymerization, interface precipitation etc.) all can apply to this, after making the microballoon 12 that contains electrophoresis particle suspending liquid, it is scattered in macromolecule 13 liquid or the dispersion liquid, utilizes coating accurate coating of instrument or printing.Electrophoretic display materials layer 2 thickness can pass through the microballoon size, and coating formula and coating print speed printing speed etc. is controlled.The coating process of commercial usefulness comprises dipping formula (dip coating), scraper type (knife or bladecoating), slit die formula (slot-die coating), drum-type (roll coating) etc., the coating wet-film thickness is usually between the 1-500 micron, concerning electrophoretic display panel was used, material display layer thickness was better at the 2-100 micron, and the 5-50 micron is better.Microballoon can be individual layer in the distribution of material display layer closely to be arranged, shown in Fig. 4 A; Or multilayer closely arranges, shown in Fig. 4 B.
Being covered in bonding coat 3 on the display layer comprises numerous macromolecular thermoplastic materials and comprises polyethylene vinyl acetate ester (EVA), polyester (polyester), epoxy resin (epoxy), polyurethane (polyurethane), acrylate (acrylics) etc., or the potpourri of two or more above above-mentioned materials; Can also utilize the compound substance that mixes inorganic filler.Bonding coat can be an one dielectric layer, and its resistivity or specific inductive capacity should be approaching compatible with lower floor's control circuit material with display layer, and in follow-up diaphragm seal process, bonding coat plays sealing the link to each other effect of upper strata display layer with lower floor's control circuit.
(2) flexible electronic circuit
In the smart card of collection demonstration and radio-frequency (RF) identification, functional circuit comprises that induction antenna coil, circuit of display driving, control circuit all can utilize the flexible electronic line design, can make through several different methods.
The flexible electronic wiring board normally is made up of one or more layers conductive layer, dielectric layer, semiconductor layer, and its mode of production mainly contains following several method: method of superposition (Additive process), removal method (Subtractive process) or half lap addition (Semi-additive process).
The mode of method of superposition is meant on flexible parent metal, by design in advance, adds required various electronic work ergosphere selectively, piles up by accumulation layer by layer to form.Use the means of this method to comprise polymer thick film printing technology, metaliding etc.Fig. 5 is with the example that is made as of two-sided conductive layer, and 500 is the common plastics flexible parent metal; 510 for the boring step, can utilize Mechanics of Machinery method or laser drill; 520 is conductive layer printing and perforation printing (printing through hole); 530 is second conductive layer printing.
If do not adopt the boring step, two-sided conductive layer also can adopt as Fig. 6 and make: 600 for the common plastics flexible parent metal, and 610 are printed conductive layer selectively, and 620 for printing protective seam selectively, 630 be the printing of second layer conductive layer also and ground floor link.
The mode of removal method makes conductive layer cover whole plate normally on integral substrate, utilizes protective seam to cover required part then, utilizes etching method to remove unnecessary conductive layer part, removes protective seam again and required conductive layer is exposed.The removal method is widely used in the copperplate printing circuit.Fig. 7 is the processing procedure of two-sided copperplate circuit: 700 are flexible base, board (701 are metal crystal seed thin layer, and 702 is flexible plastic film, presses amine, polyester etc. as polyamides), and 710 for the boring step, can utilize Mechanics of Machinery method or laser drill; 720 are whole plate plating, and at present the most frequently used is copper facing, electroplates PTH method (plating throughhole) with perforation upper and lower conductive layers is linked; 730 are the unnecessary conductive layer part of etching method removal.
Half lap addition (Semi-additive process) then is at first to utilize protective seam (resist) to cover finally to want etching to remove unnecessary part, plates conductive layer selectively with electrochemical plating then, removes protective seam again.As shown in Figure 8,800 is flexible base, board (801 are metal crystal seed thin layer, and 802 is flexible plastic film, press amine, polyester etc. as polyamides), and 810 is protective mulch, and 820 for the boring step, can utilize Mechanics of Machinery method or laser drill; 830 plating of selection that have for the unprotect layer region are electroplated PTH method (plating through hole) with perforation upper and lower conductive layers are linked; 840 remove protective seam and crystal seed layer for chemical removal method (strip).
The radio frequency identification inductive antenna coil method adopts metal materials such as copper, aluminium and silver more, according to material conductance and rf frequency, different designs can be arranged, and general design mostly is the garden shape or the rectangular planes coil of multi-turn.Can utilize the polymer thick film technology, the printed silver slurry forms; Also can utilize copperplate or aluminium sheet material, adopt engraving method to make.Driving circuit on the smart card can be simple electric signal amplifier, after radiofrequency signal is received by clamping, the inductance capacitance of itself (L/C) is through the transient energy (electrical signal intensity is a 1-2 volt and a milliampere grade electric current in the coil usually) of resonance generation, can be amplified to 5-10V, like this, display screen can be driven.The smart card driving circuit can be complicated card read/write apparatus, as United States Patent (USP) 4,746,787 structures of announcing, it comprises microprocessor, storer and demonstration control, the information of chip in the smart card can be shown in display screen, and this driving circuit often needs thin battery that power supply is provided.The production method of above-mentioned flexible electronic wiring board is equally applicable to the making of smart card driving circuit.
For lower floor's control circuit of display device, its flexible electronic circuit is divided into direct drive-type (Direct-drive) by function, passive matrix (Passive Matrix Addressing) and active-matrix (ActiveMatrix Addressing) circuit.
Directly the drive-type circuit divides digital type and dot matrix type.Their all available polymer thick film technology that describes in detail above or copperplate printing circuit are made.
When smart card need show high definition picture, display screen will adopt the active-matrix method to drive.The active-matrix circuit is made of thin film transistor (TFT) (TFT) circuit.The flexible thin-film transistor circuit adopts method of superposition to make more.As shown in Figure 9, be base material with sheet metal such as stainless steel thin slice or the plastic sheeting that is coated with metal level, the metal level of thin film transistor (TFT), dielectric layer and semiconductor layer utilize vacuum deposition method to make.18 is sheet metal or the plastics flexible substrate that is coated with metal level; 19 is the insulated barriers layer, plays insulation and intercepts the impurity effect; 20 is the transistor gate metal level; 21 is dielectric layer; 22 is semiconductor layer; 23 is the high doping semiconductor layer; 24 is source transistor/leakage metal level.
The OTFT circuit can be used for the display control circuit of smart card too owing to its pliability.Gelinck etc. have reported the detailed structure of this OTFT circuit: it comprises two metal layers, two-layer organic layer (one deck is the transistor gate insulation course, and one deck is a semiconductor layer).As shown in figure 10,25 is the common plastics base material, and 26 is vacuum-deposited gold layer, and 27 are the insulation organic layer, and solution application coating or printing are made, and 28 is another layer gold layer, and 29 is organic semiconductor layer.Its method for making is that common printed, photoetching and vacuum moulding machine are combined, and can rolling production.
(3) element assembling
Show the integrated package, electric signal amplifier element of the required electronic package vinculum circle IC chip of functional circuit in the smart card, driving circuit etc.Be suitable for the IC chip of smart card such as the Mifare chip of Philips company, Mu chip of Japanese Hitachi company etc., their size is 0.7 millimeter * 0.7 millimeter, thickness only is the 0.1-0.4 millimeter.Tiny chip is positioned over the position of design in advance, can utilizes surface mounted technology.Existing instrument has the surface mounted machine of Siemens Company and PANASONIC.Element is assembled on the substrate, also need jointing material, comprise isotropy (isotropic conductive adhesive) or Z-axis conductive material, conductive tape (conductive tape), there is U.S. Loctite company in manufacturer, Minnesota Mining and Manufacturing Company and U.S. Acheson company etc.
(4) hot sealing film forming
Bonding coat on the display material layer in the display device of upper strata not only plays the adhesive effect to display material layer, also plays the effect that links to each other with lower floor's control circuit.Upper strata display material and lower floor's control circuit are incorporated into one, can adopt heating, pressurization or hot-press method.At present, the vacuum hotpressing of commercial usefulness (vacuum lamination), cylinder lamination (roll lamination) etc. all can apply to this.In the lamination process, bonding coat 3 can produce certain deformation, and is continuous with the material (as 8,9 among Figure 11,10) of lower floor's control circuit, produces void-free sealing.
With digital type control circuit shown in Figure 11 is example, and its usable polymers thick film technology is made, and for example, multilayer dielectric and conductive layer can be coated with the mesh print process.The material of dielectric and conductive layer has the supply of a lot of producers, and the polymer thick film PTF series ink as U.S. Acheson and DuPont company comprises ultra-violet curing and heat curing dielectric material, carbon black conductive ink and silver-colored conductive ink etc.At Figure 11 A, Figure 11 B is the vertical view and the sectional view of the digital type circuit of lower floor's control circuit, as shown in the figure, this number type circuit has the substrate 7 of control circuit, is formed with connection electrode 8 and dielectric layer 9 on the substrate, and connection electrode 8 is passed dielectric layer 9 and is electrically connected with the line segment electrode 10 of lower floor control circuit.The lower floor's control circuit of Figure 11 B and upper strata display device can form the complete electrophoretic display panel by control circuit control colour developing, shown in Figure 12 A behind lamination.
Another side with substrate 7 no control circuits among Figure 11 B is a base material, utilizes the mesh print process to make, and can produce control circuit at the another side of substrate, makes the two-sided lower floor control circuit of the shared laminar substrate shown in Figure 11 C thus.The control circuit on substrate two sides can be identical or different design.By above-mentioned laminating method, the two sides of control circuit all can each link to each other with a upper strata display device.Like this, the display screen of shared laminar substrate once just can show on the two sides, shown in Figure 12 B.
When the finally sealed of smart card, adopting plastic material usually is diaphragm, as Polyvinylchloride (PVC) film, is packaged into card for making each layer after hot pressing, and the plastic basis material diaphragm can have hot melt adhesive layer (hot-melt), as the polyethylene vinyl acetate ester.Because this step is to realize by heating and pressurizing, and is similar with the levels associated methods of display, so, both can be combined, the encapsulation of smart card and the lamination of display can be finished simultaneously.
Utilize the present invention, can design the diversified smart card that has electrophoresis showed, illustrate some specific design examples below:
Example one: coil and be presented at the same side
As shown in figure 13,1300 is plastic basis material, the 1310 silver-colored material coils of making for polymer thick film, and 1320 is lower floor's control circuit of display, and 1330 is driving circuit, and 1340 is the connection between coil, driving circuit and the control circuit, and 1350 is the IC chip.
After above-mentioned steps is finished; as shown in figure 14; obtain the incorporate base materials 1000 of each functional circuit such as coil, driving circuit and control circuit; after electrophoretic display apparatus 1010 is positioned over control circuit 1320 tops; diaphragm 1020 and 1030 is positioned over upper and lower; as shown below, utilize hot pressing that above four laminations are formed on one, form the smart card that comprises demonstration and radio frequency recognition function.
Example two: coil be presented at relative both sides
As shown in figure 15,1500 is plastic basis material, 1510 inductive coils that form for the copperplate etching, 1520 is the display lower floor control circuit at the base material opposite side, 1530 is the driving circuit at the base material opposite side, and 1540 for connecting the boring of two lateral circuits, utilizes with perforation and electroplate PTH method (plating through hole) with two lateral circuit UNICOMs, 1550 is the connection between coil, driving circuit and the control circuit, and 1560 is the IC chip.
Example three: coil, double-sided display also has power supply
As shown in figure 16,1600 is plastic basis material, 1610 is inductive coil, 1620 is the two-sided lower floor control circuit of display part, 1630 is driving circuit, and 1640 is the connection between coil, driving circuit and the control circuit, and 1650 is the IC chip, 1660 is power supply, as the flexible thin film type electrochemical cell of U.S. PowerPaper company.
Driving circuit section herein can also comprise storer, microprocessor etc., by built-in power 1660 power supplies, after radiofrequency signal receives, when finishing read-write, can be shown on the electrophoretic display panel selectively by driving circuit output information needed.
Claims (22)
1. an electrophoresis showed smart card comprises display device and intelligent card function circuit, and described display device is display message under functional circuit control, it is characterized in that:
Described display device is an electrophoretic display apparatus;
Described functional circuit comprises electrophoresis showed control circuit and driving circuit, to control the demonstration of described electrophoretic display apparatus;
Described electrophoretic display apparatus and functional circuit are independently made respectively.
2. smart card as claimed in claim 1 is characterized in that described functional circuit integral body is formed on the same base material.
3. smart card as claimed in claim 1 is characterized in that described functional circuit is formed at the one or both sides of same base material.
4. smart card as claimed in claim 1 is characterized in that described functional circuit also comprises recognition device.
5. smart card as claimed in claim 4 is characterized in that described recognition device is a rfid device, comprises induction antenna and integrated circuit (IC) chip.
6. smart card as claimed in claim 1 is characterized in that described electrophoresis showed control circuit is the single face control circuit, is formed at a side of base material; Or be two-sided control circuit, be formed at the both sides of base material.
7. smart card as claimed in claim 6 is characterized in that described two-sided control circuit can independently be formed at the both sides of base material respectively, also can be formed at the both sides of base material with the mode integral body that is communicated with.
8. smart card as claimed in claim 1 is characterized in that described electrophoresis showed control circuit is corresponding with the position and the area of described electrophoretic display apparatus.
9. smart card as claimed in claim 1 is characterized in that described smart card has tow sides and shows that it is to be connected with a upper strata display device respectively with the two-sided lower floor control circuit on the same substrate to be made that the two sides shows.
10. smart card as claimed in claim 1 is characterized in that described functional circuit and described electrophoretic display apparatus are positioned at the homonymy or the heteropleural of described smart card.
11. smart card as claimed in claim 1 is characterized in that described smart card also comprises outer diaphragm, with described display device and functional circuit seal protection.
12. the manufacture method of an electrophoresis showed smart card is characterized in that comprising the steps:
The preparation electrophoretic display apparatus;
Preparation has the flexible electronic wiring board of electrophoresis control circuit and driving circuit;
Electronic component is assembled on the described flexible electronic wiring board, and wherein the flexible electronic wiring board comprises polymer thick film circuit and copperplate printing circuit;
With described electrophoretic display apparatus and the driving fit of flexible electronic wiring board is one.
13. method as claimed in claim 12 is characterized in that the preparation of described electrophoretic display apparatus comprises the steps:
According to the size of viewing area, utilize the coating instrument on base material, to be coated with display material continuously and become piece;
On described display material piece, be coated with one deck bonding coat continuously.
14. method as claimed in claim 12 is characterized in that described flexible electronic circuit comprises induction antenna coil, driving circuit and display control circuit.
15. method as claimed in claim 12 is characterized in that described flexible electronic wiring board is to make to form on same base material.
16. method as claimed in claim 12 is characterized in that described flexible electronic wiring board integral body is formed at the one or both sides of same base material.
17. method as claimed in claim 12 is characterized in that described flexible electronic circuit can be by method of superposition, removal method or the making of half lap addition.
18. method as claimed in claim 12 is characterized in that described electronic component assembling step, can utilize surface mounted technology assembling.
19. method as claimed in claim 12 is characterized in that describedly with electrophoretic display apparatus and flexible PCB driving fit step, wherein, described electrophoretic display apparatus is corresponding with the position of the display control circuit of described flexible PCB.
20. method as claimed in claim 12 is characterized in that described wherein, described flexible PCB has two-sided control circuit with electrophoretic display apparatus and flexible PCB driving fit step, respectively two electrophoretic display apparatus of corresponding driving fit.
21. method as claimed in claim 12 is characterized in that describedly with electrophoretic display apparatus and flexible PCB driving fit step, can adopt heating, pressurization or hot-press method.
22. method as claimed in claim 12 is characterized in that describedly with electrophoretic display apparatus and flexible PCB driving fit step, can adopt outer diaphragm to finish packaging by hot pressing simultaneously.
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| CN102447309A (en) * | 2010-10-11 | 2012-05-09 | 东莞万士达液晶显示器有限公司 | Electronic device |
| CN102737582B (en) * | 2012-04-06 | 2014-07-09 | 信利工业(汕尾)有限公司 | Termination point (TP) On/In Cell type organic electroluminescent display integrated with near field communication (NFC) antenna |
| TWI484280B (en) * | 2012-10-25 | 2015-05-11 | Sipix Technology Inc | Display device and manufacturing method of display device |
| CN106293224B (en) * | 2016-08-08 | 2019-05-07 | 京东方科技集团股份有限公司 | A kind of hand-written electric paper and preparation method thereof, hand-written electric paper device |
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| JP2000285219A (en) * | 1999-03-31 | 2000-10-13 | Toppan Forms Co Ltd | Rewrite type ic information carrying medium |
| JP2003271911A (en) * | 2002-03-13 | 2003-09-26 | Toppan Printing Co Ltd | Ic card |
| CN1493059A (en) * | 2001-02-28 | 2004-04-28 | ������������ʽ���� | Memory card and its manufacturing method |
| CN1519775A (en) * | 2002-12-27 | 2004-08-11 | 株式会社半导体能源研究所 | Card and accounting system utilizing such card |
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| JP2000285219A (en) * | 1999-03-31 | 2000-10-13 | Toppan Forms Co Ltd | Rewrite type ic information carrying medium |
| CN1493059A (en) * | 2001-02-28 | 2004-04-28 | ������������ʽ���� | Memory card and its manufacturing method |
| JP2003271911A (en) * | 2002-03-13 | 2003-09-26 | Toppan Printing Co Ltd | Ic card |
| CN1519775A (en) * | 2002-12-27 | 2004-08-11 | 株式会社半导体能源研究所 | Card and accounting system utilizing such card |
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