TWI481848B - Optical registration carrier - Google Patents

Optical registration carrier Download PDF

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TWI481848B
TWI481848B TW102139592A TW102139592A TWI481848B TW I481848 B TWI481848 B TW I481848B TW 102139592 A TW102139592 A TW 102139592A TW 102139592 A TW102139592 A TW 102139592A TW I481848 B TWI481848 B TW I481848B
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Taiwan
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code
address
sample
coding
carrier
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TW102139592A
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TW201418693A (en
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Kuo Tung Tiao
Sheng Li Chang
Jung Po Chen
Chun Chieh Huang
Jyh Chern Chen
Rung Ywan Tsai
Tai Ting Huang
Yuan Chin Lee
Feng Hsiang Lo
Lung Pin Chung
Hung Chih Chiang
Kuo Yao Weng
Chih Ming Cheng
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Ind Tech Res Inst
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Publication of TWI481848B publication Critical patent/TWI481848B/en

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Description

光學定址承載器Optical address carrier

本揭露是有關於一種檢驗元件,且特別是有關於一種具有光學定址功能之檢驗承載器。The present disclosure relates to a test element, and more particularly to an inspection carrier having an optical addressing function.

利用光學方式檢測檢體時,由於檢測之檢體的受測點並非單一位置,而常常是多個非固定的位置。然而,受限於受測之檢體上無任何規律特徵點可供參考,通常只能採取開路測試(open-loop)的方式取像或訊號檢測,或者是透過光學掃描裝置,例如係雷射掃描振鏡(galvo mirror)上所配置的檢流計(galvanometer)、光學編碼器或磁性編碼器,輸出光學掃描裝置目前的掃描位置資訊,再利用複雜且非線性的座標轉換關係式推算出實際的受測點位置。When the sample is optically detected, since the detected point of the detected sample is not a single position, it is often a plurality of non-fixed positions. However, there is no regular feature point on the tested subject for reference. Usually, it can only be taken by open-loop method for image or signal detection, or by optical scanning device, such as laser. A galvanometer, optical encoder or magnetic encoder configured on a galvo mirror outputs the current scanning position information of the optical scanning device, and then uses a complex and non-linear coordinate transformation relationship to derive the actual The location of the measured point.

由於受測點距離上述的位置資訊輸出點的距離遠大於受測檢體的維度,使得量測的誤差在作非線性座標轉換時被放大,造成受測點推算位置與實際位置間的定位精度差。此外,對於需要長時間持續間隔觀察的檢體試片,一旦檢體試片從原來的檢測設備移開之後,再次移入觀察時會有影像錯位的情況發生, 不利於檢體進行時間變化的前後比對。Since the distance of the measured point from the above-mentioned position information output point is much larger than the dimension of the tested object, the measurement error is amplified when the nonlinear coordinate conversion is performed, resulting in the positioning accuracy between the estimated position of the measured point and the actual position. difference. In addition, for a sample test piece that requires long-term continuous observation, once the sample test piece is removed from the original detection device, an image misalignment occurs when the observation piece is moved again. It is not conducive to the comparison of the time before and after the sample changes.

本揭露係有關於一種光學設備,具有檢體偵測裝置及位置偵測裝置。該設備同時獲得檢體檢驗資訊和相對應的位址資訊,以定址檢體上的所有採樣點的檢驗結果與位置。本揭露係提供一種具有光學定址功能之承載器。該承載器能夠將樣品採樣影像檢測結果定址到承載器編碼區之對應位址碼。The disclosure relates to an optical device having a sample detecting device and a position detecting device. The device simultaneously obtains the test information of the sample and the corresponding address information to address the test result and location of all the sample points on the sample. The present disclosure provides a carrier having an optical addressing function. The carrier is capable of addressing the sampled sample image detection result to a corresponding address code of the carrier code region.

根據本揭露之一實施例,提出一種承載樣品之承載器。承載器包括承載器的主體、位於主體上的檢測區以及編碼區。樣品承載於檢測區。編碼區包括至少一編碼微結構,其位於主體上或主體之中,編碼微結構的尺寸至少小於100微米。從檢測區獲得的多個樣品採樣影像可對應於編碼區的多個位址碼,而且每個樣品採樣影像和與其對應的位址碼之間的所有相對位置是相同的。According to an embodiment of the present disclosure, a carrier carrying a sample is proposed. The carrier includes a body of the carrier, a detection zone on the body, and a coding zone. The sample is carried in the detection zone. The coding region includes at least one coded microstructure located on or in the body, the coded microstructure having a size of at least less than 100 microns. The plurality of sample sample images obtained from the detection zone may correspond to a plurality of address codes of the coding region, and all relative positions between each sample sample image and its corresponding address code are the same.

根據本揭露之一實施例,提出一種承載樣品之承載器。承載器包括位於承載器表面上的多個檢測區以及多個編碼區。樣品承載於多個檢測區。多個編碼區與多個檢測區交錯配置。每一個檢測區獲得的多個樣品採樣影像可對應於每一個編碼區的多個位址碼,而且每個樣品採樣影像和與其對應的位址碼之間的所有相對位置是相同的。According to an embodiment of the present disclosure, a carrier carrying a sample is proposed. The carrier includes a plurality of detection zones on the surface of the carrier and a plurality of coding zones. The sample is carried in multiple detection zones. A plurality of coding regions are interleaved with a plurality of detection regions. The plurality of sample sample images obtained for each detection zone may correspond to a plurality of address codes of each code region, and all relative positions between each sample sample image and its corresponding address code are the same.

根據本揭露之另一實施例,提出一種樣品承載器之位址 定址方法。樣品承載器至少具有編碼區和樣品檢測區。移動掃描光束瞄準編碼區的目標位址編碼區段。掃描所在位址編碼區段以解碼出所在位址編碼區段的區段位址碼。比較所在位址編碼區段的區段位址碼與目標位址編碼區段的區段位址碼,其中當所在位址編碼區段的區段位址碼與目標位址編碼區段的區段位址碼不一樣,估算所需微調距離後移動掃描光束,再一次掃描所在位址編碼區段以解碼出所在位址編碼區段的區段位址碼。當所在位址編碼區段的區段位址碼與目標位址編碼區段的區段位址碼相同時,掃描目標位址編碼區段產生時脈訊號,觸發採樣樣品檢測區相應的樣品影像訊號。According to another embodiment of the present disclosure, an address of a sample carrier is proposed Addressing method. The sample carrier has at least a coding zone and a sample detection zone. The moving scanning beam is aimed at the target address encoding section of the coding region. The address encoding section is scanned to decode the sector address code of the address encoding section in which the address is located. Comparing the sector address code of the address coding section and the sector address code of the target address coding section, where the sector address code of the address coding section and the sector address code of the target address coding section are compared Differently, after estimating the required fine-tuning distance, the scanning beam is moved, and the address encoding section is scanned again to decode the sector address code of the address encoding section. When the sector address code of the address coding section is the same as the sector address code of the target address coding section, the scan target address coding section generates a clock signal, which triggers the corresponding sample image signal of the sample detection area.

根據本揭露之一實施例,提出一種樣品承載器之樣品影像採樣方法。樣品承載器具有包含溝和軌的微結構區域或明暗相間條紋的微結構區域和樣品檢測區,樣品承載於所述樣品檢測區。使用一光束掃描包含溝和軌的微結構區域或明暗相間條紋的微結構區域以產生時脈訊號,以觸發採樣所述樣品檢測區中相應的樣品影像訊號。由另一光束掃描樣品檢測區中的樣品,透過採樣、處理並生成相應的樣品影像。According to an embodiment of the present disclosure, a sample image sampling method of a sample carrier is proposed. The sample carrier has a microstructured region comprising a groove and a track or a microstructured region of light and dark interphase stripes and a sample detection zone, the sample being carried in the sample detection zone. A beam of light is used to scan the microstructured regions of the trenches and tracks or the microstructured regions of the light and dark stripes to generate a clock signal to trigger sampling of corresponding sample image signals in the sample detection zone. The sample in the sample detection zone is scanned by another beam, sampled, processed, and the corresponding sample image is generated.

為讓本揭露的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.

1、2‧‧‧光學設備1, 2‧‧‧ Optical equipment

10、20、30、40、50、60、70、80‧‧‧光學裝置10, 20, 30, 40, 50, 60, 70, 80‧‧‧ optical devices

12、12-1、12-2、22、32、42、52、62、72、82、92-1、92-2、92-3、92-4‧‧‧檢片12, 12-1, 12-2, 22, 32, 42, 52, 62, 72, 82, 92-1, 92-2, 92-3, 92-4‧‧‧

12A、22A、32A、42A、52A、62A、72A、82A、272A、274A、920A、922A、924A、926A、2760A‧‧‧檢測區12A, 22A, 32A, 42A, 52A, 62A, 72A, 82A, 272A, 274A, 920A, 922A, 924A, 926A, 2760A‧‧‧ detection area

12B、22B、32B、42B、52B、62B、72B、82B、272B、274B、920B、922B、924B、926B、2760B‧‧‧編碼區12B, 22B, 32B, 42B, 52B, 62B, 72B, 82B, 272B, 274B, 920B, 922B, 924B, 926B, 2760B‧‧‧ coding area

102、142、202、242、302、342、402、442、502、542、602、742、842‧‧‧光源102, 142, 202, 242, 302, 342, 402, 442, 502, 542, 602, 742, 842 ‧ ‧ light source

104、144、204、244、304、344、404、444、504、544、604、644、704、744、804、844‧‧‧感測器104, 144, 204, 244, 304, 344, 404, 444, 504, 544, 604, 644, 704, 744, 804, 844 ‧ ‧ sensors

106、146、206、246、306、346、406、446、506、546、606、646、706、746、806、846‧‧‧分光元件106, 146, 206, 246, 306, 346, 406, 446, 506, 546, 606, 646, 706, 746, 806, 846 ‧ ‧ splitter components

110、140、210、240、310、340、410、440、510、540、610、640、710、740、810、840‧‧‧物鏡110, 140, 210, 240, 310, 340, 410, 440, 510, 540, 610, 640, 710, 740, 810, 840 ‧ ‧ objective lens

108、208‧‧‧致動器108, 208‧‧ ‧ actuator

121‧‧‧軌121‧‧‧ track

123‧‧‧溝123‧‧‧ditch

160、260‧‧‧控制器160, 260‧‧ ‧ controller

180、280‧‧‧處理模組180, 280‧‧ ‧ processing module

182、282‧‧‧處理單元182, 282‧ ‧ processing unit

184、284‧‧‧運算器184, 284‧‧‧ arithmetic

186、286‧‧‧儲存單元186, 286‧‧‧ storage unit

643、843‧‧‧四分之一波板643, 843‧‧‧ quarter wave board

2600‧‧‧基板2600‧‧‧Substrate

2610‧‧‧正型光阻層2610‧‧‧Positive photoresist layer

2610A‧‧‧圖案化正型光阻層2610A‧‧‧ patterned positive photoresist layer

2620‧‧‧位址編碼區段2620‧‧‧Address Code Section

2620a‧‧‧第一軌2620a‧‧‧First track

2620b‧‧‧第二軌2620b‧‧‧second track

2620c‧‧‧第一溝2620c‧‧‧first ditch

2620d‧‧‧第二溝2620d‧‧‧second ditch

271‧‧‧表面271‧‧‧ surface

272、274‧‧‧試片272, 274‧‧‧ test strips

273‧‧‧頂表面273‧‧‧ top surface

2740、2760‧‧‧主體2740, 2760‧‧‧ subjects

2742‧‧‧細胞培養容器2742‧‧‧ cell culture container

276‧‧‧微量滴定板276‧‧‧Microtiter plate

2762‧‧‧微井2762‧‧‧Microwell

2764‧‧‧相鄰區域2764‧‧‧Adjacent areas

2771‧‧‧第一編碼區2771‧‧‧First coding area

2772‧‧‧第二編碼區2772‧‧‧Second coding area

B1、B2‧‧‧區間B1, B2‧‧‧

C1、C2、C3‧‧‧編碼位置C1, C2, C3‧‧‧ coding location

L1、L2‧‧‧光束L1, L2‧‧‧ beams

m‧‧‧微結構m‧‧‧Microstructure

P1、P2‧‧‧檢體位置P1, P2‧‧‧ specimen position

S1、S2‧‧‧光訊號S1, S2‧‧‧ Optical Signal

S‧‧‧檢體/樣品S‧‧‧sample/sample

X1~X4‧‧‧位置X1~X4‧‧‧ position

X、Y、Z‧‧‧方向X, Y, Z‧‧ Direction

圖1~3繪示依照本揭露不同實施例之光學設備的示意圖。1 to 3 are schematic views of optical devices in accordance with various embodiments of the present disclosure.

圖4~9繪示依照本揭露不同實施例之光學裝置與檢測之檢片的示意圖。4 to 9 are schematic views of an optical device and a test strip according to various embodiments of the present disclosure.

圖10A~10D係繪示依照本揭露不同實施例之檢片的示意圖。10A-10D are schematic views of a test strip according to various embodiments of the present disclosure.

圖11係繪示依照本揭露一實施例之檢片的俯視圖。FIG. 11 is a top plan view of a test piece according to an embodiment of the present disclosure.

圖12係繪示依照本揭露一實施例之第二光束聚焦於檢片之不同位置時的示意圖。FIG. 12 is a schematic diagram of a second light beam being focused on different positions of a test strip according to an embodiment of the present disclosure.

圖13係繪示第二光束聚焦於如圖11之區間B2跨越不同軌道時所對應之第二光訊號強度之示意圖。FIG. 13 is a schematic diagram showing the intensity of the second light signal corresponding to the second light beam being focused on the different tracks in the interval B2 of FIG. 11 .

圖14~15係繪示依照本揭露不同實施例之光學設備的掃描路徑的示意圖。14-15 are schematic diagrams showing scan paths of optical devices in accordance with various embodiments of the present disclosure.

圖16係繪示依照本揭露一實施例之光學定址方法的流程圖。16 is a flow chart of an optical addressing method in accordance with an embodiment of the present disclosure.

圖17顯示檢測區中與編碼區中感興趣的區域之間的對應關係(mapping)以及掃描這兩個區域的光束。Figure 17 shows the mapping between the detection zone and the region of interest in the coding zone and the scanning of the two regions.

圖18顯示出掃描範圍包括感興趣區域之影像區段。Figure 18 shows an image segment in which the scan range includes the region of interest.

圖19顯示相對於位址編碼區段中溝和軌之掃描光束的掃描方向以及掃瞄後獲得的弦波形訊號。Figure 19 shows the scanning direction of the scanning beam of the groove and the track with respect to the address encoding section and the chord waveform signal obtained after the scanning.

圖20顯示編碼區分成多個位址編碼區段與區段位址碼。Figure 20 shows that the code is divided into a plurality of address coded sectors and a sector address code.

圖21A顯示根據本揭露的一個實施例,編碼區由編記有條形碼的軌/溝微結構組成,透過解碼微結構而得到時脈訊號,並根據此一時脈訊號擷取影像。FIG. 21A shows an embodiment of the present invention. The coding region is composed of a track/channel microstructure with a barcode, and the clock signal is obtained through the decoding microstructure, and the image is captured according to the clock signal.

圖21B顯示根據本揭露的一個實施例,編碼區由編記有條形 碼的軌/溝微結構組成,透過解碼微結構而得到時脈訊號以及區段位址碼,並根據此一時脈訊號擷取影像。21B shows that the coding region is encoded by a strip according to an embodiment of the present disclosure. The track/trunk microstructure of the code is obtained by decoding the microstructure to obtain a clock signal and a segment address code, and capturing an image according to the clock signal.

圖21C顯示根據本揭露一實施例的一種位址定址方法的流程圖。21C shows a flow chart of an address addressing method in accordance with an embodiment of the present disclosure.

圖22A是“交錯式25碼”編碼之一例。Fig. 22A is an example of "interlaced 25 code" coding.

圖22B顯示“交錯式25碼”的符號表。Fig. 22B shows a symbol table of "interlaced 25 code".

圖23顯示8個相鄰的粗線排列在一起時的特殊情況下,區段號碼(X77,Y33)的條形碼。Figure 23 shows the bar code of the section number (X77, Y33) in the special case where eight adjacent thick lines are arranged together.

圖24顯示在條形碼之X方向資料條碼區域與Y方向資料條碼區域間,置入複數個黑白相間細線的間隔區。Fig. 24 shows a spacer in which a plurality of black and white thin lines are placed between the X-direction data barcode area and the Y-direction data barcode area of the barcode.

圖25顯示在條形碼重複相同組資料條碼區域。Figure 25 shows the same group of data barcode areas repeated in the barcode.

圖26A是二進制編碼之“0”和“1”代碼之一例。Fig. 26A is an example of binary coded "0" and "1" codes.

圖26B顯示位址編碼區段的位址編碼規則。Figure 26B shows the address encoding rules for the address encoding section.

圖26C顯示的二進制位址編碼之一例,位址編碼區段的區段號碼為(X5,Y5)。An example of the binary address encoding shown in Fig. 26C is that the sector number of the address encoding section is (X5, Y5).

圖27A-27C繪示說明使用黃光微影製程製造編碼區或位址編碼區段的製造步驟。27A-27C illustrate fabrication steps for fabricating a code region or an address code segment using a yellow lithography process.

圖28A-28B顯示具檢測區和編碼區之不同類型的承載器。Figures 28A-28B show different types of carriers with detection and coding zones.

圖29繪示具有位在不同焦平面上的編碼區之微量滴定板示意圖。Figure 29 is a schematic illustration of a microtiter plate having coding regions positioned on different focal planes.

圖1~3係繪示依照本揭露不同實施例之光學設備的示意圖。請先參考圖1,光學設備1包括一光學裝置10、一控制器160及一處理模組180。控制器160例如係包括致動器108之電路。光學裝置10包括一檢體偵測裝置及一位置偵測裝置,檢體偵測裝置包括第一光源102、第一感測器104、第一分光元件106及第一物鏡110。位置偵測裝置包括第二光源142、第二感測器144、第二分光元件146及第二物鏡140。1 to 3 are schematic views of optical devices in accordance with various embodiments of the present disclosure. Referring first to FIG. 1 , the optical device 1 includes an optical device 10 , a controller 160 , and a processing module 180 . Controller 160 is, for example, a circuit that includes actuator 108. The optical device 10 includes a sample detecting device and a position detecting device. The sample detecting device includes a first light source 102, a first sensor 104, a first beam splitting element 106, and a first objective lens 110. The position detecting device includes a second light source 142, a second sensor 144, a second beam splitting element 146, and a second objective lens 140.

光學設備1可以用於檢測一檢片12,檢片12包括檢測區12A及編碼區12B。於一實施例中,檢測區12A上係具有一檢體S,且檢測區12A具有複數個檢測位置(未繪示),編碼區12B具有複數個編碼位置(未繪示)。第一光源102透過第一物鏡110聚焦於檢體S上,且第二光源142透過第二物鏡140聚焦於編碼區12B上,第一光源102及第二光源142係同時聚焦。第一分光元件106及第二分光元件146例如係雙色分光鏡(Dichroic Mirror)。如圖1所示,可以應用第一分光元件106將第一光源102反射至第一物鏡110後聚焦於檢測區12A,且應用第二分光元件146將第二光源142反射至第二物鏡140後聚焦於編碼區12B。The optical device 1 can be used to detect a test strip 12 comprising a detection zone 12A and a coding zone 12B. In one embodiment, the detection area 12A has a sample S, and the detection area 12A has a plurality of detection positions (not shown), and the code area 12B has a plurality of coding positions (not shown). The first light source 102 is focused on the sample S through the first objective lens 110, and the second light source 142 is focused on the code region 12B through the second objective lens 140. The first light source 102 and the second light source 142 are simultaneously focused. The first beam splitting element 106 and the second beam splitting element 146 are, for example, a dichroic mirror. As shown in FIG. 1, the first light splitting element 106 can be applied to reflect the first light source 102 to the first objective lens 110 and then focus on the detection area 12A, and the second light splitting element 146 is applied to reflect the second light source 142 to the second objective lens 140. Focusing on the coding area 12B.

於一實施例中,第一光源102係提供具有第一波長之光束,第二光源142係提供具有第二波長之光束,第一波長及第二波長可以相同或不同,並不作限制。當第一波長與第二波長相同時,第一光源102及第二光源142可以整合為單一光源,以節省空間及成本。當第一波長與第二波長不相同時,可以分別依據檢 測區12A及編碼區12B的特性,提供適當波長的光源。舉例來說,當檢體為一螢光標記之生物樣品時,第一光源102之第一波長需為可以激發此種螢光標記之特定波長。然而,第一光源102之第一波長不一定適合偵測編碼區12B。因此,第一光源102及第二光源142為獨立之光源可以提高檢測及定址的適用範圍。In one embodiment, the first light source 102 provides a light beam having a first wavelength, and the second light source 142 provides a light beam having a second wavelength. The first wavelength and the second wavelength may be the same or different, and are not limited. When the first wavelength is the same as the second wavelength, the first light source 102 and the second light source 142 can be integrated into a single light source to save space and cost. When the first wavelength is different from the second wavelength, it can be separately checked The characteristics of the measurement area 12A and the coding area 12B provide a light source of a suitable wavelength. For example, when the specimen is a fluorescently labeled biological sample, the first wavelength of the first source 102 needs to be a specific wavelength at which such a fluorescent marker can be excited. However, the first wavelength of the first light source 102 is not necessarily suitable for detecting the code region 12B. Therefore, the first light source 102 and the second light source 142 are independent light sources, which can improve the application range of detection and addressing.

於此實施例中,編碼位置包括不同反射率或不同光學極化方向之位置編碼資訊。如圖1所示,控制器160控制第一光源102之第一光束L1聚焦於複數個檢測位置後係分別對應產生複數個第一光訊號S1,此些第一光訊號S1可以通過第一分光元件106並傳遞至第一感測器104。並且,控制器160可以控制第二光源142之第二光束L2聚焦於複數個編碼位置後分別對應產生複數個第二光訊號S2,此些第二光訊號S2可以通過第二分光元件146並傳遞至第二感測器144。In this embodiment, the encoding position includes position encoding information of different reflectances or different optical polarization directions. As shown in FIG. 1 , the controller 160 controls the first light beam L1 of the first light source 102 to focus on a plurality of detection positions to generate a plurality of first optical signals S1 respectively, and the first optical signals S1 can pass the first splitting light. Element 106 is passed to first sensor 104. In addition, the controller 160 can control the second light beam L2 of the second light source 142 to focus on the plurality of code positions to generate a plurality of second light signals S2, and the second light signals S2 can pass through the second light splitting element 146 and transmit To the second sensor 144.

於此實施例中,致動器108係設置於第一物鏡110及第二物鏡140上,用以接收控制器160命令控制第一物鏡110及第二物鏡140的移動,第一物鏡110及第二物鏡140兩者的相對位置係固定地,因此,可以使得第一物鏡110及第二物鏡140與檢片12之間產生位移,據以得到多個檢體資訊及編碼資訊。值得注意的是,第一光束L1聚焦之每一個檢測位置與對應之第二光束L2聚焦之編碼位置之間,具有一個固定的相對位置,控制器160控制第一物鏡110及第二物鏡140的聚焦位置同時移動時,此固定之相對位置不會改變。處理模組180可接著根據此些第一光訊 號S1及此些第二光訊號S2計算檢體之定址資訊。In this embodiment, the actuator 108 is disposed on the first objective lens 110 and the second objective lens 140 for receiving the controller 160 to command the movement of the first objective lens 110 and the second objective lens 140. The first objective lens 110 and the first objective lens 110 The relative positions of the two objective lenses 140 are fixed. Therefore, displacement between the first objective lens 110 and the second objective lens 140 and the test piece 12 can be generated, thereby obtaining a plurality of sample information and coded information. It should be noted that each of the detection positions of the first light beam L1 is in focus with a corresponding position of the second light beam L2, and the controller 160 controls the first objective lens 110 and the second objective lens 140. When the focus position moves at the same time, the relative position of the fixed does not change. The processing module 180 can then follow the first optical signals The number S1 and the second optical signals S2 calculate the addressing information of the sample.

如圖1所示,處理模組180可以包括一處理單元182、一運算器184及一儲存單元186。處理單元182耦接至第一感測器104及第二感測器144,處理單元182例如係一微處理器(Microprocessor)或處理器(Processor)。運算器184例如係電腦或中央處理機(CPU)。儲存單元186例如係記憶體(Memory)、磁帶、磁碟或光碟,儲存單元186係選擇性地設置並耦接於運算器184。As shown in FIG. 1 , the processing module 180 can include a processing unit 182 , an operator 184 , and a storage unit 186 . The processing unit 182 is coupled to the first sensor 104 and the second sensor 144. The processing unit 182 is, for example, a microprocessor or a processor. The arithmetic unit 184 is, for example, a computer or a central processing unit (CPU). The storage unit 186 is, for example, a memory, a magnetic tape, a magnetic disk, or a compact disk. The storage unit 186 is selectively disposed and coupled to the computing unit 184.

於此實施例中,運算器184命令控制器160調整第一物鏡110及第二物鏡140的聚焦位置。進一步來說,控制器160控制第一光源102之第一光束L1掃描路徑經過檢測位置,使得入射之第一光束L1由此些檢測位置反射為此些第一光訊號S1。同時,控制器160控制第二光源142之第二光束L2掃描路徑同時經過編碼位置,使得入射之第二光束L2由此些編碼位置反射為此些第二光訊號S2。接著,處理單元182接收此些第一光訊號S1及此些第二光訊號S2,由於每一個檢體位置及與此檢體位置對應之編碼位置之間的相對位置係固定,因此,可根據接收之第一光訊號S1產生一檢體資訊,且根據一接收之第二光訊號S2產生對應此檢體資訊之一位置資訊。然後,運算器依據此位置資訊計算檢體之定址資訊。儲存單元186可以接收並儲存此定址資訊。In this embodiment, the operator 184 commands the controller 160 to adjust the focus positions of the first objective lens 110 and the second objective lens 140. Further, the controller 160 controls the scan path of the first light beam L1 of the first light source 102 to pass through the detection position, so that the incident first light beam L1 is reflected by the first light signals S1. At the same time, the controller 160 controls the scanning path of the second light beam L2 of the second light source 142 to pass through the encoding position, so that the incident second light beam L2 is reflected by the encoding positions to the second optical signals S2. Then, the processing unit 182 receives the first optical signal S1 and the second optical signals S2, and the relative position between each sample position and the code position corresponding to the sample position is fixed, so The received first optical signal S1 generates a sample information, and generates a position information corresponding to the sample information according to the received second optical signal S2. Then, the operator calculates the address information of the sample based on the location information. The storage unit 186 can receive and store the addressing information.

請參考圖2,光學設備2包括光學裝置20、控制器260及處理模組280。控制器260例如係包括致動器208之電路。光學裝置20包括一檢體偵測裝置及一位置偵測裝置,檢體偵測裝置包 括第一光源202、第一感測器204、第一分光元件206及第一物鏡210。位置偵測裝置包括第二光源242、第二感測器244、第二分光元件246及第二物鏡240。Referring to FIG. 2, the optical device 2 includes an optical device 20, a controller 260, and a processing module 280. Controller 260 is, for example, a circuit that includes actuator 208. The optical device 20 includes a sample detecting device and a position detecting device, and the detecting device package The first light source 202, the first sensor 204, the first beam splitting element 206, and the first objective lens 210 are included. The position detecting device includes a second light source 242, a second sensor 244, a second beam splitting element 246, and a second objective lens 240.

光學設備2可以用於檢測一檢片22,檢片22包括檢測區22A及編碼區22B。處理模組280可以包括一處理單元282、一運算器284及一儲存單元286。處理單元282耦接至第一感測器204及第二感測器244。光學設備2包括的元件與檢測檢片22的方法與光學設備1很接近,差異在於:控制器260係用以控制整個光學裝置20的移動,使得光學裝置20與檢片22之間產生位移,據以得到多個檢體資訊及編碼資訊。控制器260控制致動器208,以移動整個光學裝置20,使得整個光學裝置20可以沿著垂直於第一光源202之第一光束L1光軸之一方向上移動,且沿著平行於第一光源202之第一光束L1光軸之一方向上移動,而來掃描檢片22。然後,處理模組280可接著根據此些第一光訊號S1及此些第二光訊號S2獲得樣品檢查結果和所述檢體其相應的定址資訊。The optical device 2 can be used to detect a test strip 22 comprising a detection zone 22A and a coding zone 22B. The processing module 280 can include a processing unit 282, an arithmetic unit 284, and a storage unit 286. The processing unit 282 is coupled to the first sensor 204 and the second sensor 244. The optical device 2 includes elements and a method of detecting the detecting piece 22 in close proximity to the optical device 1, except that the controller 260 is used to control the movement of the entire optical device 20 such that displacement between the optical device 20 and the detecting piece 22 is caused. According to the results of multiple sample information and coding information. The controller 260 controls the actuator 208 to move the entire optical device 20 such that the entire optical device 20 can move in one direction perpendicular to the optical axis of the first light beam L1 of the first light source 202, and along parallel to the first light source The first light beam L1 of 202 moves in one of the optical axes to scan the slice 22. Then, the processing module 280 can then obtain the sample inspection result and the corresponding address information of the sample according to the first optical signal S1 and the second optical signals S2.

如圖3所示,光學設備3包括一個光學裝置20、控制器260和處理模組280。光學設備3是類似於光學設備2。光學設備2和光學設備3之間的相同的元件以相同的圖示標記表示,而相似處於此處不再重複。圖3的光學設備3與圖2的光學設備2之間的差異在於:致動器308是用於控制待測物22,使檢片22可沿著垂直於第一光源202之第一光束L1光軸之一方向上移動,且沿著平行於第一光源202之第一光束L1光軸之一方向上移動。As shown in FIG. 3, the optical device 3 includes an optical device 20, a controller 260, and a processing module 280. The optical device 3 is similar to the optical device 2. The same elements between the optical device 2 and the optical device 3 are denoted by the same reference numerals, and the similarities are not repeated here. The difference between the optical device 3 of FIG. 3 and the optical device 2 of FIG. 2 is that the actuator 308 is for controlling the object to be tested 22 such that the slice 22 can follow the first light beam L1 perpendicular to the first light source 202. The optical axis moves in one of the directions and moves in a direction parallel to the optical axis of the first light beam L1 of the first light source 202.

圖4~9繪示依照本揭露不同實施例之光學裝置與檢測的檢片之示意圖。請先參考圖4,光學裝置30包括一檢體偵測裝置及一位置偵測裝置,檢體偵測裝置包括第一光源302、第一感測器304、第一分光元件306及第一物鏡310。位置偵測裝置包括第二光源342、第二感測器344、第二分光元件346及第二物鏡340。光學裝置30可以替換上述之光學裝置10或光學裝置20,以應用於光學設備1~3中。4 to 9 are schematic views of an optical device and a detected test piece according to different embodiments of the present disclosure. Referring to FIG. 4, the optical device 30 includes a sample detecting device and a position detecting device. The sample detecting device includes a first light source 302, a first sensor 304, a first beam splitting element 306, and a first objective lens. 310. The position detecting device includes a second light source 342, a second sensor 344, a second beam splitting element 346, and a second objective lens 340. The optical device 30 can be replaced with the optical device 10 or the optical device 20 described above to be applied to the optical devices 1 to 3.

應用光學裝置30之光學設備可以用於檢測一檢片32,檢片32包括檢測區32A及編碼區32B。光學裝置30包括的元件與檢測檢片32的方法與光學裝置10及20很接近,差異在於光學裝置30的第一光源302及第一感測器304設置的位置係互相交換,且第二光源342及第二感測器344設置的位置係互相交換。因此,第一光訊號S1及第二光訊號S2的傳遞路徑與圖1之光學裝置10及圖2~3之光學裝置20不同。The optical device of the application optics 30 can be used to detect a patch 32 that includes a detection zone 32A and a code zone 32B. The optical device 30 includes an element and a method for detecting the detecting piece 32 in close proximity to the optical devices 10 and 20, with the difference that the positions of the first light source 302 and the first sensor 304 of the optical device 30 are mutually exchanged, and the second light source is exchanged. The positions set by 342 and the second sensor 344 are interchanged. Therefore, the transmission paths of the first optical signal S1 and the second optical signal S2 are different from the optical device 10 of FIG. 1 and the optical device 20 of FIGS. 2 to 3.

請參考圖5,光學裝置40包括一檢體偵測裝置及一位置偵測裝置,檢體偵測裝置包括第一光源402、第一感測器404、第一分光元件406及第一物鏡410。位置偵測裝置包括第二光源442、第二感測器444、第二分光元件446及第二物鏡440。光學裝置40可以替換上述之光學裝置10或光學裝置20,以應用於光學設備1~3中。Referring to FIG. 5 , the optical device 40 includes a sample detecting device and a position detecting device. The sample detecting device includes a first light source 402 , a first sensor 404 , a first beam splitting component 406 , and a first objective lens 410 . . The position detecting device includes a second light source 442, a second sensor 444, a second beam splitting element 446, and a second objective lens 440. The optical device 40 can be replaced with the optical device 10 or the optical device 20 described above to be applied to the optical devices 1 to 3.

應用光學裝置40之光學設備可以用於檢測一檢片42,檢片42包括檢測區42A及編碼區42B。光學裝置40包括的元件 與檢測檢片42的方法與光學裝置30很接近,差異在於光學裝置40的第一光源402及第一感測器404設置的位置係互相交換。因此,第一光訊號S1的傳遞路徑與圖4之光學裝置30不同。The optical device of the application optics 40 can be used to detect a test strip 42 that includes a detection zone 42A and a coding zone 42B. Optical device 40 includes components The method of detecting the test strip 42 is very close to the optical device 30, with the difference that the positions of the first light source 402 and the first sensor 404 of the optical device 40 are interchanged. Therefore, the transmission path of the first optical signal S1 is different from that of the optical device 30 of FIG.

請參考圖6,光學裝置50包括一檢體偵測裝置及一位置偵測裝置,檢體偵測裝置包括第一光源502、第一感測器504、第一分光元件506及第一物鏡510。位置偵測裝置包括第二光源542、第二感測器544、第二分光元件546及第二物鏡540。光學裝置50可以替換上述之光學裝置10或光學裝置20,以應用於光學設備1~3中。Referring to FIG. 6 , the optical device 50 includes a sample detecting device and a position detecting device. The sample detecting device includes a first light source 502 , a first sensor 504 , a first beam splitting component 506 , and a first objective lens 510 . . The position detecting device includes a second light source 542, a second sensor 544, a second beam splitting element 546, and a second objective lens 540. The optical device 50 can be replaced with the optical device 10 or the optical device 20 described above to be applied to the optical devices 1 to 3.

應用光學裝置50之光學設備可以用於檢測一檢片52,檢片52包括檢測區52A及編碼區52B。光學裝置50包括的元件與檢測檢片52的方法與光學裝置30很接近,差異在於光學裝置50的第二光源542及第二感測器544設置的位置係互相交換。因此,第二光訊號S2的傳遞路徑與圖4之光學裝置30不同。The optical device of the application optics 50 can be used to detect a test strip 52 comprising a detection zone 52A and a coding zone 52B. The optical device 50 includes components and methods of detecting the test strip 52 in close proximity to the optical device 30, with the difference that the positions of the second light source 542 and the second sensor 544 of the optical device 50 are interchanged. Therefore, the transmission path of the second optical signal S2 is different from that of the optical device 30 of FIG.

請參考圖7,光學裝置60包括一檢體偵測裝置及一位置偵測裝置,檢體偵測裝置包括第一光源602、第一感測器604、第一分光元件606及第一物鏡610。位置偵測裝置包括第二感測器644、第二分光元件646及第二物鏡640。光學裝置60可以替換上述之光學裝置10或光學裝置20,以應用於光學設備1~3中。Referring to FIG. 7 , the optical device 60 includes a sample detecting device and a position detecting device. The sample detecting device includes a first light source 602 , a first sensor 604 , a first beam splitting component 606 , and a first objective lens 610 . . The position detecting device includes a second sensor 644, a second beam splitting element 646 and a second objective lens 640. The optical device 60 can be replaced with the optical device 10 or the optical device 20 described above to be applied to the optical devices 1 to 3.

應用光學裝置60之光學設備可以用於檢測一檢片62,檢片62包括檢測區62A及編碼區62B。光學裝置60包括的元件與檢測檢片62的方法與光學裝置10及20很接近,差異在於光學 裝置60僅設置第一光源602,而省略第二光源的設置。也就是說,將圖1~3之光學裝置10~20中的第一光源102及202及第二光源142及242整合為單一之第一光源602,因此,以節省空間及成本。此外,於此實施例之第二分光元件646例如係一偏極化分光鏡(Polarization Beam Splitter;PBS),將四分之一波板643設置於第二分光元件646及第二物鏡640之間,可以提升回傳至第二感測器644之第二光訊號S2的能量效率。The optical device of the application optics device 60 can be used to detect a test strip 62 that includes a detection zone 62A and a coding zone 62B. The optical device 60 includes components and methods of detecting the test strip 62 that are in close proximity to the optical devices 10 and 20, with the difference being optical. The device 60 is only provided with the first light source 602, while omitting the setting of the second light source. That is to say, the first light sources 102 and 202 and the second light sources 142 and 242 of the optical devices 10 to 20 of FIGS. 1 to 3 are integrated into a single first light source 602, thereby saving space and cost. In addition, the second beam splitting element 646 of this embodiment is, for example, a Polarization Beam Splitter (PBS), and the quarter wave plate 643 is disposed between the second beam splitting element 646 and the second objective lens 640. The energy efficiency of the second optical signal S2 that is transmitted back to the second sensor 644 can be improved.

請參考圖8,光學裝置70包括一檢體偵測裝置及一位置偵測裝置,檢體偵測裝置包括第一感測器704、第一分光元件706及第一物鏡710。位置偵測裝置包括第二光源742、第二感測器744、第二分光元件746及第二物鏡740。光學裝置70可以替換上述之光學裝置10或光學裝置20,以應用於光學設備1~3中。Referring to FIG. 8 , the optical device 70 includes a sample detecting device and a position detecting device. The sample detecting device includes a first sensor 704 , a first beam splitting component 706 , and a first objective lens 710 . The position detecting device includes a second light source 742, a second sensor 744, a second beam splitting element 746, and a second objective lens 740. The optical device 70 can be replaced with the optical device 10 or the optical device 20 described above to be applied to the optical devices 1 to 3.

應用光學裝置70之光學設備可以用於檢測一檢片72,檢片72包括檢測區72A及編碼區72B。光學裝置70包括的元件與檢測檢片72的方法與光學裝置10和20很接近,差異在於光學裝置70僅設置第二光源742,而省略第一光源的設置。也就是說,將圖1~3之光學裝置10和20中的第一光源102和202及第二光源142和242整合為單一之第二光源742,因此,可以節省空間及成本。The optical device of the application optics 70 can be used to detect a test strip 72 that includes a detection zone 72A and a coded zone 72B. The optical device 70 includes elements and methods of detecting the test piece 72 that are in close proximity to the optical devices 10 and 20, with the difference that the optical device 70 only provides the second light source 742, omitting the arrangement of the first light source. That is, the first light sources 102 and 202 and the second light sources 142 and 242 of the optical devices 10 and 20 of FIGS. 1 to 3 are integrated into a single second light source 742, thereby saving space and cost.

請參考圖9,光學裝置80包括一檢體偵測裝置及一位置偵測裝置,檢體偵測裝置包括第一感測器804、第一分光元件806及第一物鏡810。位置偵測裝置包括第二光源842、四分之一波板 843、第二感測器844、第二分光元件846及第二物鏡840。光學裝置80可以替換上述之光學裝置10或光學裝置20,以應用於光學設備1~3中。Referring to FIG. 9 , the optical device 80 includes a sample detecting device and a position detecting device. The sample detecting device includes a first sensor 804 , a first beam splitting component 806 , and a first objective lens 810 . The position detecting device includes a second light source 842 and a quarter wave plate 843. The second sensor 844, the second beam splitting element 846, and the second objective lens 840. The optical device 80 can be replaced with the optical device 10 or the optical device 20 described above to be applied to the optical devices 1 to 3.

應用光學裝置80之光學設備可以用於檢測一檢片82,檢片82包括檢測區82A及編碼區82B。光學裝置80包括的元件與檢測檢片82的方法與光學裝置10和20很接近,差異在於光學裝置80僅設置第二光源842,而省略第一光源的設置,以節省空間及成本。此外,於此實施例之第二分光元件846例如係一偏極化分光鏡,將四分之一波板843設置於第二分光元件846及第二物鏡840之間,可以提升回傳至第二感測器844之第二光訊號S2的能量效率。The optical device of the application optics 80 can be used to detect a patch 82 that includes a detection zone 82A and a code zone 82B. The optical device 80 includes components and methods of detecting the patch 82 that are in close proximity to the optical devices 10 and 20, with the difference that the optical device 80 only provides the second light source 842, omitting the arrangement of the first light source to save space and cost. In addition, the second beam splitting element 846 of this embodiment is, for example, a polarization beam splitter, and the quarter wave plate 843 is disposed between the second beam splitter 846 and the second objective lens 840, which can be improved back to the first The energy efficiency of the second optical signal S2 of the second sensor 844.

圖10A~10D係繪示依照本揭露不同實施例之檢片的示意圖,檢片92-1~92-4各具有檢測區920A~926A及編碼區920B~926B,可以應用於本揭露任一實施例之光學裝置10~80。請先參考圖10A,檢片92-1的編碼區920B之複數個編碼位置C1~C2可以分別對應至複數個微結構m,例如是具有複數個特定方式排列之孔洞,此特定之排列方式係與位置編碼有關。此外,當第一光源之聚焦位置由檢體位置P1移動至檢體位置P2時,第二光源之聚焦位置係對應地由編碼位置C1移動至編碼位置C2,且檢體位置P1與編碼位置C1之間的距離d1係與檢體位置P2與編碼位置C2之間的距離d2相同。10A-10D are schematic views of a test piece according to different embodiments of the present disclosure. Each of the test pieces 92-1~92-4 has detection areas 920A-926A and coding areas 920B-926B, which can be applied to any implementation of the present disclosure. For example, the optical device 10~80. Referring to FIG. 10A, a plurality of coding positions C1 to C2 of the coding region 920B of the slice 92-1 may respectively correspond to a plurality of microstructures m, for example, holes having a plurality of specific manners, and the specific arrangement is Related to location coding. Further, when the focus position of the first light source is moved from the sample position P1 to the sample position P2, the focus position of the second light source is correspondingly moved from the code position C1 to the code position C2, and the sample position P1 and the code position C1 The distance d1 between the two is the same as the distance d2 between the sample position P2 and the code position C2.

請參考圖10B,檢片92-2與檢片92-1很相似,差別在 於複數個編碼位置C1~C2對應之複數個微結構m是以特定方式排列之圓孔及長洞排列。當然,微結構m亦可以是其他形狀之孔洞或凹槽(未繪示),並不作限制。請參考圖10C,複數個編碼位置C1~C2對應之複數個微結構m也可以是混合複數個溝軌及孔洞(包含圓孔或長孔)之結構。請參考圖10D,複數個編碼位置C1~C2對應之複數個微結構m亦可以是複數個溝軌,且每一個溝軌上設置有複數個編碼結構或位置編碼資訊。Referring to FIG. 10B, the slice 92-2 is similar to the slice 92-1, and the difference is The plurality of microstructures m corresponding to the plurality of coding positions C1 to C2 are arranged in a specific manner in a circular hole and a long hole. Of course, the microstructure m may also be a hole or a groove (not shown) of other shapes, and is not limited. Referring to FIG. 10C, the plurality of micro-structures m corresponding to the plurality of coding positions C1 to C2 may also be a structure in which a plurality of groove tracks and holes (including round holes or long holes) are mixed. Referring to FIG. 10D, the plurality of micro-structures m corresponding to the plurality of coding positions C1 to C2 may also be a plurality of groove tracks, and each of the groove tracks is provided with a plurality of coding structures or position coding information.

於另一實施例中,複數個編碼位置C1~C2亦可以對應至不同反射率或不同光學極化方向的複數個位置編碼資訊。換句話說,並不限制此些編碼位置C1~C2係對應於圖10A~10D之微結構,只要光束照射到此些編碼位置C1~C2可以產生不同光強度之訊號即可。換句話說,只要光束聚焦於不同編碼位置後,反射為複數個光訊號,且此些光訊號之能量不同即可,並不限制編碼位置的形式。In another embodiment, the plurality of coding positions C1 C C2 may also correspond to a plurality of position coded information with different reflectances or different optical polarization directions. In other words, the coding positions C1 to C2 are not limited to the microstructures of FIGS. 10A to 10D, and signals of different light intensities may be generated as long as the light beams are irradiated to the coding positions C1 to C2. In other words, as long as the beam is focused on different coding positions, the reflection is a plurality of optical signals, and the energy of the optical signals is different, and the form of the coding position is not limited.

圖11係繪示依照本揭露一實施例之檢片的俯視圖。以下係以圖1之光學設備1為例,說明光學設備1檢測並定址檢片12的具體方法。請同時參考圖1及圖11,檢片12(例如係一檢測試片)具有一編碼區12B,具有複數個編碼位置C1~C3,例如係對應至具有複數個微結構之溝123及軌121。控制器160控制第二光源142之第二光束L2於每一個溝123及軌121之編碼結構進行掃描,以得到位置編碼資訊。並且,控制器160控制此光束跨越溝123及軌121進行掃描,以得到一跨軌資訊。FIG. 11 is a top plan view of a test piece according to an embodiment of the present disclosure. Hereinafter, the optical device 1 of FIG. 1 will be taken as an example to describe a specific method for the optical device 1 to detect and address the slice 12. Referring to FIG. 1 and FIG. 11 together, the detecting piece 12 (for example, a detecting test piece) has a coding area 12B having a plurality of coding positions C1 C C3, for example, corresponding to the groove 123 and the track 121 having a plurality of microstructures. . The controller 160 controls the second light beam L2 of the second light source 142 to scan the coding structure of each of the grooves 123 and the tracks 121 to obtain position coded information. Moreover, the controller 160 controls the beam to scan across the groove 123 and the track 121 to obtain a cross-track information.

於一實施例中,係依據編碼方式將不同的編碼結構配置在編碼區12B中不同的溝123及軌121上,而每一軌道上的編碼結構係沿著檢片12的Y軸方向(即溝123及軌121之軌道方向)分佈於區間B1,而軌道兩端的區間B2沒有設置編碼結構。In an embodiment, different coding structures are arranged on different grooves 123 and tracks 121 in the coding area 12B according to the coding mode, and the coding structure on each track is along the Y-axis direction of the slice 12 (ie, The track direction of the groove 123 and the rail 121 is distributed in the section B1, and the section B2 at both ends of the track is not provided with the coding structure.

圖12係繪示依照本揭露一實施例之光束聚焦於檢片12不同位置時的示意圖。如圖12所示,當第一光束L1由第一位置X1移動至第二位置X2時,第二光束L2係對應地由第三位置X3移動至第四位置X4時,且第一位置X1與第三位置X3之間的距離係等於第二位置X2與第四位置X4之間的距離。FIG. 12 is a schematic diagram of a light beam focused on different positions of the patch 12 according to an embodiment of the present disclosure. As shown in FIG. 12, when the first light beam L1 is moved from the first position X1 to the second position X2, the second light beam L2 is correspondingly moved from the third position X3 to the fourth position X4, and the first position X1 is The distance between the third position X3 is equal to the distance between the second position X2 and the fourth position X4.

圖13係繪示當第二光束L2聚焦於如圖11之區間B2並沿著檢片12的X軸方向跨越不同軌道時所對應之第二光訊號S2強度之示意圖。請參考圖13,當第二光束L2聚焦於區間B2,並沿著檢片12的X軸方向跨越不同軌道時,第二感測器144(繪示於圖1)所感測到代表位置資訊之光強度會在第二光束L2聚焦在軌121上時具有強度最強之訊號。而當第二光束L2聚焦在相鄰之兩個軌(land)121之間的溝(groove)123上時,第二感測器144所感測到代表位置資訊之光強度會有最弱之訊號強度。藉由代表位置資訊之光強度的不同,可以推算出第二光束L2聚焦的溝軌位置。並且,藉由代表位置資訊之光強度波形的計數,可以推算跨軌的數目。更進一步地,在掃描的過程中(例如係以第二光束L2沿著檢片12的Y軸方向移動),可以使用伺服控制的方式將位置資訊光強度維持在最強或在最弱,據以得知此一掃描進行的溝及軌之 特定位置。並可以藉由判讀溝軌上的位置編碼結構,透過解碼方式獲得精確之定址(addressing)資訊。FIG. 13 is a schematic diagram showing the intensity of the second optical signal S2 corresponding when the second light beam L2 is focused on the interval B2 of FIG. 11 and spans different tracks along the X-axis direction of the slice 12. Referring to FIG. 13, when the second light beam L2 is focused on the interval B2 and spans different tracks along the X-axis direction of the slice 12, the second sensor 144 (shown in FIG. 1) senses the position information. The light intensity will have the strongest signal when the second beam L2 is focused on the rail 121. When the second light beam L2 is focused on the groove 123 between the two adjacent land 121, the second sensor 144 senses that the light intensity representing the position information has the weakest signal. strength. By the difference in light intensity representing the position information, the position of the groove track in which the second light beam L2 is focused can be derived. And, by counting the light intensity waveforms representing the position information, the number of cross rails can be estimated. Further, during the scanning process (for example, the second light beam L2 is moved along the Y-axis direction of the slice 12), the position information light intensity can be maintained at the strongest or the weakest by servo control. Know the groove and track of this scan Specific location. And by reading the position coding structure on the groove track, the accurate addressing information can be obtained through decoding.

圖14~15係繪示依照本揭露不同實施例之光學設備的掃描路徑的示意圖。請先參考圖14,第二光束L2可以先從編碼區12B之溝軌的一端掃描至另一端,再循原路徑折返,並於編碼區12B的區間B2進行跨軌,然後再重複進行上述的掃描動作。請參考圖15,第二光束L2也可以先從編碼區12B之溝軌的一端掃描至另一端,於編碼區12B的區間B2進行跨軌,然後以反方向從位置編碼溝軌的一端掃描至另一端,再重複進行上述有如S形的跨軌及掃描動作。14-15 are schematic diagrams showing scan paths of optical devices in accordance with various embodiments of the present disclosure. Referring to FIG. 14 first, the second light beam L2 may be scanned from one end of the groove track of the coded area 12B to the other end, then folded back according to the original path, and cross-tracked in the interval B2 of the coded area 12B, and then repeated above. Scan action. Referring to FIG. 15, the second light beam L2 may also be scanned from one end of the groove track of the coded area 12B to the other end, cross-tracked in the interval B2 of the coded area 12B, and then scanned from the end of the position-coded groove track in the opposite direction to At the other end, the above-described S-shaped cross-track and scanning operations are repeated.

於此實施例中,檢片12-1及12-2之掃描路徑的規劃,可以沿著編碼區12B之溝軌的軌結構來進行掃描,也可沿著編碼區12B之溝軌的溝結構來進行掃描。除此之外,可以縮短編碼區12B之溝軌的溝軌間距,以提升掃描解析度(即影像或訊號取樣點的密度),或是將圖14~15編碼區12B之溝軌的溝與軌同時佈滿著位置編碼結構,此時,訊號的掃描解析度將會是原先圖14~15所繪示之編碼區12B的掃描解析度的兩倍。In this embodiment, the planning of the scan paths of the slices 12-1 and 12-2 may be performed along the track structure of the groove track of the code area 12B, or may be along the groove structure of the groove track of the code area 12B. To scan. In addition, the groove pitch of the groove track of the coding area 12B can be shortened to improve the scanning resolution (ie, the density of image or signal sampling points), or the groove of the groove track of the coding region 12B of FIGS. 14-15. The track is also filled with the position coding structure. At this time, the scanning resolution of the signal will be twice the scanning resolution of the coding area 12B originally shown in FIGS. 14-15.

圖16係繪示依照本揭露一實施例之光學定址方法的流程圖。首先,先承載檢片。接著,執行步驟S400,使用控制器將光束移到檢片之檢測區及編碼區。然後,執行步驟S410,進行跨越溝軌之動作。執行步驟S420,鎖定溝軌。執行步驟S430,進行掃描。執行步驟S440,獲得檢體資訊及位置資訊。執行步驟S450, 儲存檢體資訊及位置資訊。接著,執行步驟S460,進行一判斷步驟以確認是否進行下一個溝軌掃描。若是,則回到步驟S410。若否,則執行步驟S470,進行位置解碼、影像處理、重建及顯示。最後,卸載檢片。當然,圖16僅係提供本揭露一實施例之光學定址方法的流程示意,當然,本揭露前述實施例所揭露之光學定址方法皆可以使用,並不作限制。16 is a flow chart of an optical addressing method in accordance with an embodiment of the present disclosure. First, the test piece is carried first. Next, step S400 is performed to move the light beam to the detection area and the coding area of the slice using the controller. Then, step S410 is performed to perform an action across the groove track. Step S420 is executed to lock the groove track. Step S430 is performed to perform scanning. Step S440 is performed to obtain the sample information and the location information. Go to step S450, Store sample information and location information. Next, step S460 is performed to perform a determining step to confirm whether to perform the next groove track scanning. If yes, the process returns to step S410. If no, step S470 is performed to perform position decoding, image processing, reconstruction, and display. Finally, uninstall the test piece. Of course, the optical addressing method disclosed in the foregoing embodiments can be used without limitation.

本揭露上述實施例所揭露之光學設備與定址方法,利用一光束投射在檢片之檢測區的檢體上,進行取像或訊號檢測,而在檢片上相鄰於檢測區之編碼區,利用另一光束投射在此編碼區以獲取位置資訊。由於兩光束係相鄰且同步移動,使得每一取樣點之檢體資訊,具有一對應之位置資訊,因而獲得檢體資訊代表的影像或訊號具備定址特徵。此外,受測點可以是任一位置而且可以對多個受測點進行取像或訊號檢測,甚至可以利用對同一位置的多次檢測,透過對這些檢測取平均值的處理手法消除隨機雜訊,產出高訊號雜訊比(S/N)值的結果。或者,在訊號微弱的情況下,進行長時間的積分疊加以獲得足夠能量但無位置錯位(offset)的結果。透過定址(registration)方式亦能夠在不降低解析度的情況下,將小範圍影像拼接出大範圍影像。The optical device and the addressing method disclosed in the above embodiments disclose a light beam projected on a sample of a detection area of a slice to perform image capturing or signal detection, and are adjacent to a coding area of the detection area on the slice. Another beam is projected in this coding area to obtain position information. Since the two beams are adjacent and synchronously moved, the sample information of each sampling point has a corresponding position information, so that the image or signal represented by the sample information has the addressing feature. In addition, the measured point can be any position and can take image or signal detection for multiple measured points, and even multiple detections of the same position can be used to eliminate random noise by processing the average of these detections. , the result of producing a high signal noise ratio (S/N) value. Or, in the case where the signal is weak, a long-time integral superposition is performed to obtain sufficient energy but no result of positional offset. Through the registration method, small-scale images can be spliced out of a wide range of images without reducing the resolution.

除此之外,由於檢測區及編碼區之兩光束間相鄰且同步移動,因此,量測編碼區的光束反射之光訊號所得之位置資訊,與真正實際的受測點位置之間關係簡單且線性,誤差累積少而定位精度高;而由於檢測區與編碼區同時位於同一檢片或試片(承載 容器)上,即便中途離開原先的檢測設備,後續再次移入觀察時,仍具有可追溯性,不會有影像錯位的情況發生,非常便於進行檢體的時間變化比對,以及影像或訊號處理。再者,本揭露上述實施例之光學設備,除了用於光學檢測之外,還可以應用於光學治療、雷射光鉗等光學操作,以提供操作過程所需之精準定位上的輔助。In addition, since the two beams of the detection area and the coding area are adjacent and synchronously moved, the relationship between the position information obtained by measuring the optical signal reflected by the beam of the coding area and the position of the actual actual measured point is simple. And linear, the error accumulation is small and the positioning accuracy is high; and because the detection area and the coding area are simultaneously located in the same test piece or test piece (bearing On the container, even if it leaves the original detection device midway, it will be traceable when it is moved in again, and there will be no image misalignment, which is very convenient for time-change comparison of the sample, and image or signal processing. Furthermore, the optical device of the above embodiment, in addition to being used for optical detection, can also be applied to optical operations such as optical therapy, laser light clamps, etc., to provide assistance in precise positioning required for the operation process.

此外,利用條形碼或光碟的編碼原則,上述的位址碼(address codes)可以被設計成位址編碼結構(address coding structure))或位址編碼微結構。即,位址碼可以通過解碼(或讀出)位址編碼微結構所存儲的代碼或數據的方式獲得,而位址編碼微結構依照條形碼或光碟之設計可能會導致不同的光訊號。In addition, using the coding principles of the barcode or the optical disc, the above address codes can be designed as an address coding structure or an address coding microstructure. That is, the address code can be obtained by decoding (or reading) the code or data stored by the address-encoding microstructure, and the address-coded microstructure may result in different optical signals depending on the design of the barcode or the optical disc.

條形碼可作為具存儲容量的介質,由不同的粗細(一般在毫米範圍內變化)的矩形黑線和平行於黑線的空白行構成。雖然條形碼有不同的編碼原則,但條形碼其基本上由四部分組成:(1)啟始碼、(2)資料碼、(3)檢查碼以確保數據的準確性及(4)終止碼。以39碼(code 3 of 9,code 39)為例,即一字元由5條黑色線條(簡稱bar)與4條白色(空白)線條(簡稱space)總共9條線所組成,其中有3條是粗的線條。光學式讀取裝置(通常為雷射或CCD掃描儀)則利用光線在掃描黑線(低反射率)與白線(高反射率)的低高反射差異,產生不同時間寬度之脈波,來區分一個至多個碼元的差異,解譯出條碼上的訊息。The bar code can be used as a medium with storage capacity, consisting of rectangular black lines of different thicknesses (typically varying in the millimeter range) and blank lines parallel to the black lines. Although bar codes have different coding principles, bar codes basically consist of four parts: (1) start code, (2) data code, (3) check code to ensure data accuracy, and (4) termination code. Take 39 code (code 3 of 9, code 39) as an example, that is, a character consists of 5 black lines (bar) and 4 white (space) lines (space) for a total of 9 lines, of which 3 The strip is a thick line. An optical reading device (usually a laser or CCD scanner) uses the difference between the low and high reflections of the scanned black line (low reflectivity) and the white line (high reflectivity) to generate pulse waves of different time widths to distinguish The difference between one or more symbols, the message on the barcode is interpreted.

光碟(optical disc)則是能提供巨量儲存能力的另一種介 質。光碟片的記錄原理是在聚碳酸脂基板上以螺旋狀分佈的訊坑(pit)型態記錄資料。讀取資料時是使用雷射光經物鏡聚焦在碟片表面,利用此聚焦之雷射光點照射在記錄區與非記錄區所造成的反射光強度不同,即可用來判別讀到的訊坑之變化,而轉換為資料。從光碟反射的光將入射到偵測器上。通常是使用一個4分偵測器(quadrant detector)。該偵測器將光訊號轉換成電訊號。利用4分偵測器每部份之電訊號,數學運算可以進一步獲得聚焦和循軌誤差資訊。聚焦誤差訊號(focusing error signal;FES)一般經由像散聚焦檢測(astigmatic focusing detection)方法產生,將兩個對角部份之訊號總和減去另一個方向的兩個對角部份之訊號總和。關於循軌誤差訊號(tracking error signal;TES),最常用的方法之一是利用“推挽法”(push-pull method)產生可重覆寫入(re-writable)或可燒錄(recordable)光碟之TES。當從光學讀取頭物鏡輸出的聚焦光束入射到光碟的溝軌結構時,反射光束將包括0階、-1階、+1階和高階光束。光碟的溝軌結構就像光柵。但是,由於物鏡的孔徑有限,只有0階光束以及部分的-1階和+1階光束可以被物鏡收集。反射光束將被投射在4分偵測器(quad detector)上,而-1階光束和+1階光束會因為與0階光束具有不同相位而與0階光束產生干涉。一般來說,-1階光束入射到4分偵測器的兩個相鄰部份,而+1階光束會入射到4分偵測器的其他兩個相鄰部份。這兩部分的訊號差異被稱為“推挽訊號”。4分偵測器上所有訊號的總和被稱為”跨軌訊號”。對於所有的光碟,例如DVD或藍光光碟,基本上這些方 法和這些訊號的定義幾乎是一樣的。光儲存相關的詳細資訊,可參考書籍『光學記錄:技術概述』(Optical Recording:A Technical Overview,Addison-Wesley出版社,1990年)與美國專利第5946287號和美國專利第6269070號。Optical discs are another kind of media that can provide huge storage capacity. quality. The recording principle of the optical disc is to record data in a pit pattern which is spirally distributed on the polycarbonate substrate. When reading data, the laser light is focused on the surface of the disc by the objective lens, and the intensity of the reflected light caused by the focused laser spot irradiated on the recording area and the non-recording area is different, and can be used to discriminate the change of the read pit. And converted to data. Light reflected from the disc will be incident on the detector. Usually a quadrant detector is used. The detector converts the optical signal into an electrical signal. Using the electrical signals of each part of the 4-point detector, mathematical operations can further obtain focus and tracking error information. The focusing error signal (FES) is generally generated by an astigmatic focusing detection method, which subtracts the sum of the signals of the two diagonal portions from the sum of the signals of the two diagonal portions of the other direction. One of the most common methods for tracking error signals (TES) is to use the "push-pull method" to generate re-writable or recordable. TES of the disc. When the focused beam output from the optical pickup objective lens is incident on the groove track structure of the optical disk, the reflected beam will include 0th order, -1st order, +1st order, and higher order beams. The groove structure of a disc is like a grating. However, due to the limited aperture of the objective lens, only the 0th order beam and some of the -1st order and +1st order beams can be collected by the objective lens. The reflected beam will be projected onto a quad detector, and the -1st beam and the +1st order beam will interfere with the 0th order beam because of the different phase from the 0th order beam. In general, the -1st order beam is incident on two adjacent parts of the 4-point detector, and the +1st order beam is incident on the other two adjacent parts of the 4-point detector. The signal difference between these two parts is called "push-pull signal". The sum of all the signals on the 4-point detector is called the "cross-track signal". For all discs, such as DVD or Blu-ray discs, basically these The definition of the law and the signal are almost the same. For more information on optical storage, reference is made to the book "Optical Recording: A Technical Overview, Addison-Wesley, 1990" and U.S. Patent No. 5,946,287 and U.S. Patent No. 6,629,070.

針對生物醫學或生物方面的應用,所觀察目標或樣品的的大小範圍可以從幾奈米到幾十微米,而所取得的影像應該有至少數百奈米的解析率。在本揭露中,編碼區中的位址編碼結構的尺寸應該小於1毫米,並且可以根據樣品的結構尺寸進行變更。若用於編碼細胞大小的樣品,編碼結構的大小必需至少小於100微米,例如哺乳動物細胞大小約為10~50微米左右。用於觀察細胞胞器大小的樣品,編碼結構的大小須小於一微米。For biomedical or biological applications, the size of the observed target or sample can range from a few nanometers to tens of microns, and the resulting image should have an resolution of at least a few hundred nanometers. In the present disclosure, the size of the address-coding structure in the coding region should be less than 1 mm and can be changed depending on the structural size of the sample. If used to encode a sample of cell size, the size of the coding structure must be at least less than 100 microns, for example, the mammalian cell size is about 10 to 50 microns. For samples of cell size, the size of the coding structure must be less than one micron.

圖17顯示檢測區中與編碼區中感興趣區域(Region of Interest,ROI)之間的對應關係(mapping)以及用於掃描這兩個區域之光束。正如圖17的左側所示,在選出樣品中用作影像觀察的感興趣區域之後,可透過如上文所述的光學裝置之伺服機制,讓樣品的感興趣區域Rs(以實線標記)可以對應到與其相對之編碼區的伺服圖案Ra(以虛線標記)。如圖17的右側部分所示,檢體偵測裝置的光束L1和位置偵測裝置的光束L2分別聚焦於檢測區12A和編碼區12B,從檢測區12A擷取到的影像訊號與從編碼區12B讀取到的位址可通過上述光學裝置的伺服機制同步。Figure 17 shows the mapping between the detection zone and the Region of Interest (ROI) in the coding zone and the beam used to scan the two regions. As shown on the left side of Fig. 17, after selecting the region of interest for image observation in the sample, the region of interest Rs (marked by the solid line) of the sample can be made to correspond to the servo mechanism of the optical device as described above. The servo pattern Ra (marked by a dashed line) to the coding area opposite thereto. As shown in the right part of FIG. 17, the light beam L1 of the sample detecting device and the light beam L2 of the position detecting device are respectively focused on the detecting area 12A and the encoding area 12B, and the image signal and the slave encoding area are extracted from the detecting area 12A. The address read by 12B can be synchronized by the servo mechanism of the above optical device.

圖18顯示出掃描範圍包括ROI的影像區段。正如圖18所示,對應於ROI之編碼區的伺服圖案Ra(虛線標記)可以被劃 分成多個小區塊(即位址編碼區段)Bi(以粗線標記),以每一個位址編碼區段定義出影像區段的最小單元(如:影像區段(i,j)),並用於擷取ROI。也就是說,利用細小的影像區段(i,j),有可能僅通過掃描特定區段(以實線標記的掃描區段)即可擷取ROI的樣品影像,這有助於更迅速、更準確地擷取影像。Figure 18 shows an image segment in which the scan range includes the ROI. As shown in Fig. 18, the servo pattern Ra (dashed mark) corresponding to the coding area of the ROI can be drawn Divided into multiple cell blocks (ie, address coded segments) Bi (marked with thick lines), and the smallest unit of the image segment (eg, image segment (i, j)) is defined for each address coded segment, and used Take the ROI. That is to say, with the small image segment (i, j), it is possible to capture the sample image of the ROI only by scanning a specific segment (the scanning segment marked with a solid line), which helps to more quickly, Capture images more accurately.

類似於條碼的原理,為了定位所擷取的影像,每個影像區段可以被定義為單一變數區段(variable sector),例如區段1、區段2...等,或定義為包含一個以上變數的區段,例如區段(1,1)、區段(1,2)...等。將區段碼記錄於位址編碼區段的微結構中,可提供至少兩個功能:(i)記錄影像區段的位址碼(區段碼),及(ii)提供時脈訊號作為擷取樣品影像像素的時間基準。Similar to the principle of bar code, in order to locate the captured image, each image segment can be defined as a single variable sector, such as segment 1, segment 2, etc., or defined as containing one. A section of the above variables, such as a section (1, 1), a section (1, 2), etc. Recording the segment code in the microstructure of the address encoding section provides at least two functions: (i) recording the address code (segment code) of the image segment, and (ii) providing the clock signal as 撷Take the time base of the sample image pixels.

具體而言,位址編碼區段的編碼微結構可編譯成編碼區的區段位址碼(例如影像區段號碼)。而且通過解碼此編碼微結構,亦可以獲得對應於採樣檢測區中的樣品影像訊號之時脈訊號。In particular, the encoded microstructure of the address encoding section can be compiled into a sector address code (eg, an image sector number) of the encoding region. Moreover, by decoding the coded microstructure, a clock signal corresponding to the sample image signal in the sampling detection area can also be obtained.

圖19顯示掃描光束相對於位址編碼區段中溝和軌的掃描方向以及掃瞄所得的波形訊號。如圖19所示,當高斯光束入射於具有軌溝微結構(含條形碼訊號)的位址編碼區段,並沿著與溝的延伸方向垂直的方向進行掃描(如箭頭所示)時,即可使用光偵測器擷取到從軌溝微結構反射回來的訊號。其中,光偵測器可以檢測到0階、+1階和-1階的繞射光。此處所述之光偵測器例如是前述位置偵測裝置所包括的第二感測器,可用來捕捉位置訊號。此處所述之光偵測器例如是4分偵測器。由於0階繞射光與 +1階和-1階的繞射光,彼此有相位差,因此會產生干涉,這些干涉訊號經過數學運算後就可以產生推挽訊號。如圖19中間所示即為針對4分偵測器所接收之繞射訊號進行數學運算所得到的弦波訊號。此一弦波訊號也可以經比較器進一步轉換為方波訊號,如圖19的下方所示。利用此一訊號的頻率與振幅的差異可以解出目前掃描的位址編碼區段(即區段(i,j))之資料。此外,推挽訊號的弦波訊號或方波訊號也可以用來產生時脈訊號,以準確地觸發同步電路,使另一光偵測器於檢測區進行檢體(樣品)影像採樣。此處所述之另一光偵測器例如是前述檢體偵測裝置所包括的第一感測器,可用來捕捉檢體(樣品)影像訊號。此處所述之另一光偵測器例如是崩潰光二極體(avalanche photo-diode,APD)或光電倍增管(PMT)。Figure 19 shows the scanning direction of the scanning beam relative to the grooves and tracks in the address encoding section and the waveform signal obtained by the scanning. As shown in FIG. 19, when a Gaussian beam is incident on an address coding section having a track microstructure (including a bar code signal) and is scanned in a direction perpendicular to the direction in which the groove extends (as indicated by an arrow), A photodetector can be used to capture the signal reflected from the track microstructure. Among them, the photodetector can detect the diffracted light of 0th order, +1st order, and -1st order. The photodetector described herein is, for example, a second sensor included in the position detecting device, which can be used to capture a position signal. The photodetector described herein is, for example, a 4-point detector. Due to the 0th order diffracted light The diffracted lights of +1st order and -1st order have a phase difference with each other, so interference occurs. These interference signals can generate a push-pull signal after mathematical operations. As shown in the middle of Fig. 19, it is a sine wave signal obtained by mathematically calculating the diffraction signal received by the 4-point detector. The chord signal can also be further converted into a square wave signal by the comparator, as shown in the lower part of FIG. The difference between the frequency and the amplitude of the signal can be used to solve the data of the currently scanned address code segment (ie, segment (i, j)). In addition, the sine wave signal or square wave signal of the push-pull signal can also be used to generate a clock signal to accurately trigger the synchronization circuit, so that another photodetector can perform sample (sample) image sampling in the detection area. Another photodetector described herein is, for example, a first sensor included in the sample detecting device, which can be used to capture a sample (sample) image signal. Another photodetector described herein is, for example, an avalanche photo-diode (APD) or a photomultiplier tube (PMT).

編碼區實施例Code area embodiment

實施例1Example 1

位址編碼區段,乃是編碼區之一小區塊,如圖20所示,每個小區塊都有一個特定的區段號碼:(Xa ,Yb ),其中Xa 表示在X方向的第a 區塊,Yb 表示在Y方向上的第b 區塊。因此,樣品(檢體)所在的檢測區可以被劃分為相同大小的多個檢測區段且皆有相對應的位址編碼區段。當光學設備利用位置偵測裝置之光束(雷射光束)掃瞄位址編碼區段的微結構,並解碼出編碼區中的位址編碼區段之數據時,同一時間,光學設備的檢體偵測裝置可取得檢測區的檢體影像資訊,並產生一個完整的影像。The address coding section is a cell block of the coding area. As shown in FIG. 20, each cell block has a specific sector number: (X a , Y b ), where X a represents the X direction. The a- th block, Y b represents the b- th block in the Y direction. Therefore, the detection area in which the sample (sample) is located can be divided into a plurality of detection sections of the same size and each has a corresponding address coding section. When the optical device scans the microstructure of the address encoding section by using the beam of the position detecting device (laser beam) and decodes the data of the address encoding section in the encoding area, the specimen of the optical device at the same time The detecting device can obtain the image information of the specimen in the detection area and generate a complete image.

位址編碼區段是以微結構方式編記該區段之位址碼。在此以”交錯式25碼”的編碼原則來編列位址編碼區段之軌/溝微結構為解釋例,如圖21A-21B顯示,並說明如何由光學設備(前述光學設備所包括光學裝置、控制器及處理模組,其中具體實施時,更包括光學讀取頭、解碼模組與圖像影像產生模組等元件)來讀取軌/溝微結構中的資訊進而產生出時脈訊號、區段位址碼,並進一步擷取位於檢測區中不同位置點的樣品訊號及生成影像。The address encoding section is a microcoded address code of the section. Here, the track/groove microstructure of the address coding section is illustrated by the coding principle of "interlaced 25 code" as an example, as shown in FIGS. 21A-21B, and how the optical device is included (the optical device included in the aforementioned optical device) The controller and the processing module, in which the optical read head, the decoding module and the image image generating module are included in the implementation, the information in the track/groove microstructure is read to generate the clock signal. And the segment address code, and further extract sample signals located at different positions in the detection area and generate images.

根據本揭露一實施例,圖21A顯示位址編碼區段主要由具有一固定週期的直線軌/溝微結構所組成,然因以”交錯式25碼”編碼原則來進行區段位址碼的編列,並融入於該具有固定週期的直線軌/溝微結構中,故有少部分直線軌/溝微結構會較寬,例如2倍寬度,因此整體結構類似於光柵結構。圖21A之下半部與中間部份乃分別顯示位址編碼區段微結構之橫截面圖和俯視圖。影像採樣方法是使用一個光束(圖17中的L2)掃描位址編碼區段直線軌/溝微結構並產生出時脈訊號。另一個光束(圖17的L1)則掃描樣品檢測區並依據時脈訊號規律地擷取相對應位置的光強度訊號(樣品訊號),最後影像產生模組將這些對應於檢測區不同位置的光強度訊號之樣品資訊連接在一起而產生出一張完整的影像。According to an embodiment of the present disclosure, FIG. 21A shows that the address encoding section is mainly composed of a linear track/groove microstructure having a fixed period, and the sector address code is arranged by the "interlaced 25 code" coding principle. And incorporated into the linear track/groove microstructure with a fixed period, so that a small portion of the linear track/groove microstructure will be wider, for example, 2 times wider, so the overall structure is similar to the grating structure. The lower half and the middle portion of Fig. 21A show a cross-sectional view and a top view, respectively, of the address coded segment microstructure. The image sampling method uses a beam (L2 in Figure 17) to scan the address-encoded segment linear track/groove microstructure and generate a clock signal. The other beam (L1 of Fig. 17) scans the sample detection area and regularly captures the light intensity signal (sample signal) of the corresponding position according to the clock signal. Finally, the image generation module compares the light corresponding to different positions of the detection area. The sample information of the intensity signal is connected together to produce a complete image.

圖21B揭露當光束在掃瞄位址編碼區段之直線軌/溝微結構時,除產生時脈訊號外,亦可以擷取並產生出區段編碼訊號,此區段編碼訊號經由解碼模組進行解碼後即可獲得該位址編碼區段之區段位址碼(Xa ,Yb )。FIG. 21B discloses that when the beam is in the linear track/groove microstructure of the scanning address encoding section, in addition to generating the clock signal, the segment encoding signal can also be captured and generated, and the segment encoding signal is transmitted through the decoding module. After decoding, the sector address code (X a , Y b ) of the address coding section can be obtained.

圖21C顯示根據本揭露一實施例的一種位址定址方法的流程圖。首先,開始掃描(即讀取)。接下來,移動掃描光束至編碼區並瞄準ROI中的目標區段N,掃描所在(位址編碼)區段以解碼出所在區段的區段位址碼。然後,判斷所在區段的區段位址碼是否相同於目標區段N的區段位址碼。其中,當所在區段的區段位址碼不同於目標區段N的區段位址碼時,即估算所需微調距離並移動掃瞄光束,再一次掃描所在(位址編碼)區段以解碼出所在區段的區段位址碼。而當所在區段的區段位址碼相同於目標區段N的區段位址碼時,這意味著所在的位址編碼區段就是目標位址編碼區段N,此時可藉由掃描目標區段N的軌/溝微結構而產生時脈訊號,並由另一掃描光束根據此一時脈訊號對檢測區相對應的樣品影像訊號進行採樣,以擷取檢測區中樣品的對應影像。當完成擷取檢測區中樣品的對應影像後,需判定是否已經掃描ROI所有的區段。如果ROI所有的區段尚未掃描完畢,則將掃描光束移動到下一個區段,並對該區段的區段位址碼進行掃描以擷取樣品影像。如果ROI所有的區段均已掃描完畢,後續將由處理模組進行處理並產生ROI的樣品影像,最後完成掃描。21C shows a flow chart of an address addressing method in accordance with an embodiment of the present disclosure. First, start scanning (ie reading). Next, the scanning beam is moved to the coding region and aimed at the target segment N in the ROI, and the (address coded) segment is scanned to decode the segment address code of the segment in which it is located. Then, it is determined whether the sector address code of the sector in which the sector is located is the same as the sector address code of the target sector N. Wherein, when the sector address code of the segment is different from the segment address code of the target segment N, the required fine-tuning distance is estimated and the scanning beam is moved, and the (address-coded) segment is scanned again to decode The segment address code of the zone in which it is located. When the sector address code of the sector is the same as the sector address code of the target sector N, this means that the address coding section is the target address coding section N, and the target area can be scanned by this time. The track/channel microstructure of the segment N generates a clock signal, and another scanning beam samples the sample image signal corresponding to the detection region according to the clock signal to capture a corresponding image of the sample in the detection region. After the corresponding image of the sample in the detection zone is completed, it is determined whether all segments of the ROI have been scanned. If all segments of the ROI have not been scanned, the scanning beam is moved to the next segment and the segment address code for the segment is scanned to capture the sample image. If all the segments of the ROI have been scanned, the processing module will process the image of the ROI and finally complete the scan.

本案不侷限於上述公開的實施例。The present case is not limited to the embodiments disclosed above.

圖22A是“交錯式25碼”編碼之一例。如圖22A所示的編碼規則:粗線代表位元“1”,細線代表位元“0”,阿拉伯數字可由2條粗黑線加上3條細黑線組成的5個位元來表示,或由2條粗白線加上3條細白線組成的5個位元來表示,且黑白線相交可組成 一連串的數字條碼。舉例:字元“3”由黑線“11000”組成,字元“8”由白線“10010”組成,字元“5”由黑線“10100”組成,字元“2”由白線“01001”組成。而起始(START)字元由黑線“00”組成,結束(END)字元由黑線“10”組成。圖22B列出交錯式25碼的字元對照表。在圖示範例中,粗線寬度為細線寬度之2~3倍。但粗線寬度與細線寬度不在限制範圍內,只要能區分出粗線或細線即可。圖21A、圖21B中即以此“交錯式25碼”的編碼原則將區段位址號碼轉換成直線軌/溝微結構,其中溝代表黑線,而軌代表白線;或溝表示白線,而軌表示黑線。Fig. 22A is an example of "interlaced 25 code" coding. The encoding rule shown in FIG. 22A: the thick line represents the bit "1", the thin line represents the bit "0", and the Arabic numeral can be represented by 5 thick black lines plus 5 thin black lines. Or 5 bits consisting of 2 thick white lines plus 3 thin white lines, and the black and white lines intersect to form A series of digital barcodes. For example, the character "3" is composed of a black line "11000", the character "8" is composed of a white line "10010", the character "5" is composed of a black line "10100", and the character "2" is composed of a white line "01001". composition. The start (START) character consists of the black line "00" and the end (END) character consists of the black line "10". Figure 22B shows an interlaced 25-character character table. In the example shown, the thick line width is 2 to 3 times the width of the thin line. However, the thick line width and the thin line width are not within the limit, as long as the thick line or thin line can be distinguished. 21A and 21B, the segment address number is converted into a linear track/groove microstructure by the coding principle of "interlaced 25 code", wherein the groove represents a black line and the track represents a white line; or the groove represents a white line, and the track Indicates a black line.

這裡,條碼的編碼規則並不僅限於實施例中,任何類型的一維編碼規則,如:Code 39碼、Code 32碼、Code 93碼、Codebar碼、交錯式25碼、工業25碼、矩陣25碼、Code 11碼、Code 128碼、中國郵政碼、UPC規範之條碼、EAN規範之條碼、ISBN規範之條碼、ISSN規範之條碼、MSI碼...等或其變化型,皆可用作本揭露之定址編碼法則。Here, the encoding rule of the barcode is not limited to the embodiment, any type of one-dimensional encoding rules, such as: Code 39 code, Code 32 code, Code 93 code, Code bar code, interlaced 25 code, industrial 25 code, matrix 25 code. , Code 11 code, Code 128 code, China Post code, UPC code bar code, EAN code bar code, ISBN code bar code, ISSN code bar code, MSI code, etc., or their variants, can be used as this disclosure Addressing coding rules.

編碼區的微結構不限於線性軌/溝微結構。此外,本揭露也可採用類似於商業條碼標籤,具有固定週期的明暗相間條紋的平面圖案,只要搭配的設備能夠掃描並獲得時脈訊號和區段位址碼的數據即可。The microstructure of the coding region is not limited to a linear track/groove microstructure. In addition, the present disclosure can also adopt a planar pattern similar to a commercial barcode label with a fixed period of light and dark stripes, as long as the matching device can scan and obtain the data of the clock signal and the segment address code.

實施例2Example 2

如“交錯式25碼”的編碼規則,當區段號碼為(X77,Y33)時,將會有連續8條粗線相鄰在一起的特殊情形(如圖23):X方 向的十位數字元“7”由黑線00011組成,X方向的個位數字元“7”由白線“00011”組成,Y方向的十位數字元“3”由黑線“11000”組成,Y方向的個位數字元“3”由白線“11000”組成。當這些字元串接起來,便為“00000011111111000000”,此時將有8條粗線連續相鄰在一起,如此可能會使裝置在產生時脈訊號或解讀區段位址碼時發生錯誤,所以最好能降低粗線相鄰在一起的數量。對此,可以在X方向資料條碼區域與Y方向資料條碼區域之間,置入複數個黑白相間細線,以區隔開X方向資料條碼與Y方向資料條碼,同時避免上述有8條粗線連續相鄰在一起的情形,如圖24所示的間隔(Space)區域。For example, the "interlaced 25-code" encoding rule, when the segment number is (X77, Y33), there will be a special case where 8 consecutive thick lines are adjacent (see Figure 23): X-square The tens digit "7" of the octet is composed of black line 00011, the unit digit "7" in the X direction is composed of white line "00011", and the tens digit "3" in the Y direction is composed of black line "11000". The ones digit "3" in the Y direction is composed of a white line "11000". When these characters are concatenated, it is "00000011111111000000". At this time, there will be 8 thick lines consecutively adjacent to each other. This may cause the device to generate an error when generating the clock signal or interpreting the segment address code, so the most It is good to reduce the number of thick lines adjacent to each other. In this case, a plurality of black and white thin lines may be placed between the X-direction data barcode area and the Y-direction data barcode area to separate the X-direction data barcode and the Y-direction data barcode, and avoid the above-mentioned 8 thick lines continuously. In the case of being adjacent to each other, as shown in the space of FIG.

實施例3Example 3

於本實施例中,為了避免伺服編碼區不幸有沾污或刮傷等情形,而導致無法正確解讀位址編碼區段的區段位址碼,在位址編碼區段中可重複編列複數組具相同區段位址碼的資料條碼區域(該組資料條碼區域),該組資料條碼區域包括X方向區段位址碼、間隔區域與Y方向區段位址碼。如圖25所示,重複編列兩次相同區段位址碼的該組資料條碼區域,可確保解讀區段位址碼時的正確性。當解讀出來的兩組區段號碼不相同時,即表示其中一個有錯誤,此時掃描光束可在移動一小段距離後,再重新讀取該區段位址碼。或是,可重複編列三次相同區段位址碼的該組資料條碼區域,而當解讀出來的三組區段位址碼中至少有兩組相同時,即可表示該區段位址碼被正確解碼。In this embodiment, in order to avoid the situation that the servo coding area is unfortunately contaminated or scratched, and the segment address code of the address coding section cannot be correctly interpreted, the complex array can be repeatedly arranged in the address coding section. The data barcode area of the same sector address code (the data barcode area of the group), the data barcode area of the group includes the X-direction sector address code, the interval area and the Y-direction sector address code. As shown in FIG. 25, repeating the group of data barcode regions of the same segment address code twice ensures the correctness of the segment address code. When the two sets of segment numbers are different, it means that one of them has an error. At this time, the scanning beam can be read again after moving a short distance. Alternatively, the group of data bar codes of the same segment address code may be repeatedly arranged three times, and when at least two of the three groups of segment address codes are identical, the segment address code is correctly decoded.

實施例4Example 4

圖26A及圖26B揭露以數位二進制編碼規則作為編製區段位址碼的例子。如圖26A的左側部分所示,由12個黑色和白色條紋相間組成二進制數據資料“0”,其中從左邊算來的第1、5、9個條紋是粗黑色條紋。圖26A的右側部分所示,由12個黑色和白色條紋相間組成二進制數據資料“1”,其中從左邊算來的第一個條紋是粗黑色條紋。在本揭露中,二進制編碼之“0”和“1”的條紋組合不限於本實施例中的組合。當然此編碼條紋也可使用軌/溝微結構來表示。26A and 26B disclose an example of using a digital binary encoding rule as a sector ID code. As shown in the left part of Fig. 26A, the binary data "0" is composed of 12 black and white stripes, wherein the first, fifth, and nine stripes from the left are thick black stripes. As shown in the right part of Fig. 26A, the binary data "1" is composed of 12 black and white stripes, and the first stripe from the left is a thick black stripe. In the present disclosure, the combination of stripes of "0" and "1" of the binary code is not limited to the combination in this embodiment. Of course, this coded stripe can also be represented using a track/groove microstructure.

圖26B說明位址編碼區段的位址資訊配置原理。舉例來說,區段位址碼可以4個位元來表示X方向的區段號碼,而以5個位元來表示Y方向的區段號碼。因此,在X方向可以編列16個區段位址碼(以十進制而言,即為0到15),而Y方向可以編碼出32的區段位址碼(以十進制而言,即為0到31)。圖26C顯示以區段位址碼(X5,Y5)所編列出的直線軌/溝微結構(條紋結構)。Fig. 26B illustrates the principle of address information configuration of the address coding section. For example, the sector address code may represent a sector number in the X direction by 4 bits and a sector number in the Y direction in 5 bits. Therefore, 16 sector address codes (in the case of decimal, 0 to 15) can be listed in the X direction, and the sector address code of 32 can be encoded in the Y direction (in the case of decimal, 0 to 31) . Figure 26C shows the linear track/groove microstructure (striped structure) listed in the segment address code (X5, Y5).

在本揭露中,位址編碼區段或編碼區可利用黃光微影製程、奈米壓印或射出成型來形成微結構。一實施例中,位址編碼區段或編碼區乃是利用通過黃光微影製程製造。如圖27A-C所示,可提供一基板2600,諸如矽基板、玻璃基板或塑膠材料基板,並在該基板上塗佈厚度d1的正型光阻層2610。利用具有一編碼圖案的光罩(未圖示)作為遮罩,使正型光阻層2610於深紫外線下 進行曝光,以形成具有該編碼圖案的圖案化正型光阻層2610A。最後,使用真空濺鍍或蒸鍍法在所述圖案化正型光阻層上覆蓋一金屬反射層,從而完成位址編碼區段2620(位於編碼區)。此金屬反射層例如可以金、銀、鋁或其合金製得。In the present disclosure, the address coding section or coding area can be formed into a microstructure using a yellow lithography process, nanoimprinting or injection molding. In one embodiment, the address encoding section or encoding area is fabricated using a yellow lithography process. As shown in FIGS. 27A-C, a substrate 2600, such as a germanium substrate, a glass substrate, or a plastic material substrate, may be provided, and a positive-type photoresist layer 2610 having a thickness d1 is coated on the substrate. Using a photomask (not shown) having a coding pattern as a mask, the positive photoresist layer 2610 is exposed to deep ultraviolet rays. Exposure is performed to form a patterned positive photoresist layer 2610A having the encoded pattern. Finally, a patterned metal reflective layer is overlaid on the patterned positive photoresist layer using vacuum sputtering or evaporation to complete the address encoding section 2620 (located in the encoding region). The metal reflective layer can be made, for example, of gold, silver, aluminum or alloys thereof.

一般情況下,位址編碼區段內包含有一或多個微結構,所述微結構具有平行的溝和夾在平行溝之間的多個軌,這些溝和軌可交替地配置。其中,任一個軌是位於所述溝中任意兩個最鄰近的溝之間,這些溝之寬度可以是相同的或是不同的,而這些軌之寬度也可以是相同的或不同的。In general, the address encoding section includes one or more microstructures having parallel grooves and a plurality of tracks sandwiched between the parallel grooves, the grooves and tracks being alternately arranged. Wherein, any one of the tracks is located between any two adjacent grooves in the groove, and the widths of the grooves may be the same or different, and the widths of the tracks may be the same or different.

如圖27C的剖面圖所示,位址編碼區段2620至少包括具第一寬度w1的第一軌2620a和具第二寬度w2的第二軌2620b、具第二寬度w2的第一溝2620c和具第一寬度w1的第二溝2620d。當使用波長為λ的掃描光束讀取或掃描此位址編碼區段2620時,如果光阻層的厚度d1大約是波長λ的1/4(即d1λ/4),則掃描該位址編碼區段2620可以得到較佳的跨軌訊號(cross-track signals)。舉例而言,當掃描光束波長λ為650nm時,厚度d1約為160 nm,寬度w1和w2分別為350奈米和700奈米。如果光阻層厚度d1約為掃描光束波長λ的1/8~1/6(即d1λ/8~λ/6),則掃描該位址編碼區段可以得到較佳的推挽訊號。As shown in the cross-sectional view of FIG. 27C, the address encoding section 2620 includes at least a first rail 2620a having a first width w1 and a second rail 2620b having a second width w2, a first trench 2620c having a second width w2, and A second groove 2620d having a first width w1. When the address encoding section 2620 is read or scanned using a scanning beam of wavelength λ, if the thickness d1 of the photoresist layer is approximately 1/4 of the wavelength λ (i.e., d1) λ/4), scanning the address encoding section 2620 can obtain better cross-track signals. For example, when the scanning beam wavelength λ is 650 nm, the thickness d1 is about 160 nm, and the widths w1 and w2 are 350 nm and 700 nm, respectively. If the thickness d1 of the photoresist layer is about 1/8 to 1/6 of the wavelength λ of the scanning beam (ie, d1) λ/8~λ/6), scanning the address coding section can obtain a better push-pull signal.

可替換的是,上述的光阻材料可以是正型或負型光阻材料,而在上述位址編碼區段上形成的微結構則可被設計為各種寬度之軌和溝結構。而針對編碼區段之製造、材料或設計,均不限 於上面描述的實施例。Alternatively, the photoresist material described above may be a positive or negative photoresist material, and the microstructures formed on the address code segments described above may be designed as rail and trench structures of various widths. Not limited to the manufacturing, materials or design of the coding section The embodiment described above.

本揭露所述的承載器可以是一個檢驗試片或檢驗板片,如病理試片、細胞培養室試片(cell culture chamber slides)、微流晶片(microfluidic chip)、微流板或微孔板(即所謂的微量滴定板)。透過在用以承載樣品之承載器(試片或微孔板)上或承載器中設置編碼區之設計,即可以參考光學掃描裝置所記錄的位址編碼區段,而提供樣品在承載器上的絕對位址或座標。此方式特別適用於需在不同時間對相同的試片或承載器進行多次掃描的情況。這樣一來,即可輕易返回到任何感興趣區域(ROI),以進行反覆觀察和記錄。且當有需要在光學裝置的不同平台之間進行更換時,也可以藉由輸入樣本在承載器上的絕對位址或座標,而快速地檢出感興趣區域。The carrier of the present disclosure may be a test strip or a test sheet, such as a pathological test piece, a cell culture chamber slides, a microfluidic chip, a microfluidic plate or a microplate. (the so-called microtiter plate). By providing a design of the coding region on the carrier (slice or microplate) for carrying the sample or in the carrier, the address coding section recorded by the optical scanning device can be referred to, and the sample is provided on the carrier. Absolute address or coordinates. This method is especially useful when multiple scans of the same test strip or carrier are required at different times. This way, you can easily return to any area of interest (ROI) for repeated observation and recording. And when there is a need to replace between different platforms of the optical device, the region of interest can also be quickly detected by inputting the absolute address or coordinates of the sample on the carrier.

由於編碼區是在承載器(試片或微孔板)上或在承載器中形成,此用以承載樣本的承載器可提供光學定址功能,而允許對於樣本的採樣點檢測結果可定址到編碼區的位址編碼區段中的對應位址碼。Since the coding region is formed on a carrier (slice or microplate) or in a carrier, the carrier for carrying the sample can provide an optical addressing function, while allowing the sampling point detection result for the sample to be addressed to the encoding. The corresponding address code in the address coding section of the area.

關於承載器的編碼區位置,檢測區不一定要和編碼區位於相同的焦平面上。圖28A-28B顯示不同類型承載器的檢測區和編碼區。如圖28A所示,承載樣品S(如組織切片)之檢測區272A和編碼區272B位於在試片272的同一表面上(相同的焦平面)271。而在圖28B中,試片274包括設置有至少一個細胞培養容器2742的主體2740。其中,樣品S(如培養的細胞)係位於試片274 的上表面273且在檢測區274A內。然而,位址編碼微結構2750則埋在試片274的主體2740內,其中,檢測區274A與編碼區274B即位於不同的焦平面上。Regarding the location of the coding region of the carrier, the detection region does not have to be on the same focal plane as the coding region. Figures 28A-28B show the detection and coding regions of different types of carriers. As shown in FIG. 28A, the detection zone 272A and the coding zone 272B carrying the sample S (such as a tissue section) are located on the same surface (the same focal plane) 271 of the test strip 272. In FIG. 28B, the test strip 274 includes a body 2740 provided with at least one cell culture vessel 2742. Wherein sample S (eg, cultured cells) is located on test strip 274 The upper surface 273 is within the detection zone 274A. However, the address coded microstructure 2750 is embedded within the body 2740 of the test strip 274, wherein the detection zone 274A and the coded zone 274B are located on different focal planes.

圖29顯示具有位在不同的焦平面上的編碼區之微量滴定板的仰視圖和剖面圖。在另一例中,如圖29所示,承載器是微量滴定板276,其具有主體2760及配置於該主體2760上的多個微井2762。樣品S係裝載於圓形微井2762內,而用以承載樣品S的檢測區2760A乃包圍於微井2762之內。編碼區2760B位於微井2762的相鄰區域2764內且位於相鄰區域2764的底部。編碼區2760B包括位於不同的焦平面的第一編碼區2771和第二編碼區2772,且這兩區2771/2772是埋在微井2762的相鄰區域2764內。Figure 29 shows a bottom view and a cross-sectional view of a microtiter plate having coding regions positioned on different focal planes. In another example, as shown in FIG. 29, the carrier is a microtiter plate 276 having a body 2760 and a plurality of microwells 2762 disposed on the body 2760. The sample S is loaded into the circular microwell 2762, and the detection zone 2760A for carrying the sample S is enclosed within the microwell 2762. The coding region 2760B is located within the adjacent region 2764 of the microwell 2762 and at the bottom of the adjacent region 2764. The coding region 2760B includes a first coding region 2771 and a second coding region 2772 at different focal planes, and the two regions 2771/2772 are buried within an adjacent region 2764 of the microwell 2762.

在一實施例中,檢測區和編碼區是位於兩個不同的焦平面上。而在其他實施例中,也可以將一個或多個編碼區配置在不同的焦平面上,或配置在與檢測區不同的焦平面上。當位置偵測裝置聚焦於不同焦平面上的編碼區以進行定址時,檢體偵測裝置也會聚焦於樣品在不同焦平面上的不同位置,從而實現樣品結構的分層掃描以及樣品三維結構的重建。In an embodiment, the detection zone and the coding zone are located on two different focal planes. In other embodiments, one or more of the code regions may be disposed on different focal planes or on a different focal plane than the detection region. When the position detecting device focuses on the coding regions on different focal planes for addressing, the sample detecting device also focuses on different positions of the samples on different focal planes, thereby realizing layered scanning of the sample structure and three-dimensional structure of the sample. Reconstruction.

雖然本揭露已以實施例揭露如上,然其並非用以限定本揭露,任何所屬技術領域中具有通常知識者,在不脫離本揭露的精神和範圍內,當可作些許的更動與潤飾,故本揭露的保護範圍當視後附的申請專利範圍所界定者為準。The present disclosure has been disclosed in the above embodiments, but it is not intended to limit the disclosure, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of protection of this disclosure is subject to the definition of the scope of the appended claims.

S‧‧‧樣品S‧‧‧ sample

276‧‧‧微量滴定板276‧‧‧Microtiter plate

2760‧‧‧主體2760‧‧‧ Subject

2760A‧‧‧檢測區2760A‧‧‧Detection area

2760B‧‧‧編碼區2760B‧‧‧ coding area

2762‧‧‧微井2762‧‧‧Microwell

2764‧‧‧相鄰區域2764‧‧‧Adjacent areas

2771‧‧‧第一編碼區2771‧‧‧First coding area

2772‧‧‧第二編碼區2772‧‧‧Second coding area

Claims (13)

一種承載樣品之承載器,包括:多個檢測區,位於該承載器表面上,其中該樣品承載於該多個檢測區;以及多個編碼區,其中該多個編碼區與該多個檢測區交錯配置;其中每一個該檢測區上該樣品的多個採樣影像對應於每一個該編碼區的多個位址碼,而且每個採樣影像和與其對應的位址碼之間的相對位置是相同的。 A carrier for carrying a sample, comprising: a plurality of detection zones on the surface of the carrier, wherein the sample is carried in the plurality of detection zones; and a plurality of coding zones, wherein the plurality of coding zones and the plurality of detection zones a staggered configuration; wherein each of the plurality of sample images of the sample on the detection area corresponds to a plurality of address codes of each of the code regions, and a relative position between each sample image and a corresponding address code thereof is the same of. 如申請專利範圍第1項該承載樣品之承載器,更包括安裝在主體上的多個微井,其相應地包圍該多個檢測區,其中該多個的編碼區位於該多個微井間的相鄰區域之中或之上。 The carrier for carrying a sample according to claim 1, further comprising a plurality of microwells mounted on the main body, respectively surrounding the plurality of detection zones, wherein the plurality of coding zones are located between the plurality of microwells In or on adjacent areas. 如申請專利範圍第2項該承載樣品之承載器,其中每一個該編碼區包括位於不同焦平面上的第一編碼區和第二編碼區,該第一編碼區和該第二編碼區內埋於該多個微井間的該相鄰區域之中或之上。 The carrier for carrying a sample according to claim 2, wherein each of the coding regions comprises a first coding region and a second coding region located on different focal planes, and the first coding region and the second coding region are buried In or on the adjacent region between the plurality of microwells. 如申請專利範圍第3項該承載樣品之承載器,其中該第一編碼區或該第二編碼區包括至少一編碼微結構,其位於該多個微井間的該相鄰區域之中或之上,且該第一編碼區或該第二編碼區之該至少一編碼微結構編記有區段碼。 The carrier for carrying a sample according to claim 3, wherein the first coding region or the second coding region comprises at least one coded microstructure located in the adjacent region between the plurality of microwells or And the at least one coded microstructure of the first coding region or the second coding region is encoded with a segment code. 如申請專利範圍第4項該承載樣品之承載器,其中該至少一編碼微結構之一編碼原理選自於Code 39碼、Code 32碼、Code 93碼、Codebar碼、交錯式25碼、工業25碼、矩陣25碼、Code 11碼、Code 128碼、中國郵政碼、UPC規範之條碼、EAN規範之條碼、ISBN規範之條碼、ISSN規範之條碼、MSI碼或數位二進制編碼規則。 The carrier for carrying a sample according to claim 4, wherein the coding principle of the at least one coding microstructure is selected from Code 39 code, Code 32 code, Code 93 code, Code bar code, interlaced 25 code, and industry 25 Code, matrix 25 code, Code 11 code, Code 128 code, China Post code, UPC specification bar code, EAN code bar code, ISBN code bar code, ISSN code bar code, MSI code or digital binary code rule. 如申請專利範圍第4項該承載樣品之承載器,其中該第一編碼區或該第二編碼區的該至少一編碼微結構包括經由掃描產生一時脈訊號,而該時脈訊號是用以採樣該檢測區中相應的樣品影像。 The carrier for carrying a sample according to claim 4, wherein the at least one coding microstructure of the first coding area or the second coding area comprises generating a clock signal by scanning, and the clock signal is used for sampling Corresponding sample images in the detection zone. 如申請專利範圍第4項該承載樣品之承載器,其中該至少一編碼微結構包括交替地配置的多個溝和多個軌,該多個溝是彼此相互平行而該多個軌之任一軌位於任意兩個相鄰的溝之間。 The carrier for carrying a sample according to claim 4, wherein the at least one coded microstructure comprises a plurality of grooves and a plurality of tracks alternately arranged, the plurality of grooves being parallel to each other and the plurality of tracks The rail is located between any two adjacent grooves. 如申請專利範圍第7項該承載樣品之承載器,其中該多個溝,包括至少一個具第一寬度的第一溝和/或至少一個具第二寬度的第二溝。 The carrier for carrying a sample according to claim 7, wherein the plurality of grooves comprises at least one first groove having a first width and/or at least one second groove having a second width. 如申請專利範圍第7項該承載樣品之承載器,其中該多個軌包括至少一個具第一寬度的第一軌和/或至少一個具第二寬度的第二軌。 The carrier for carrying a sample according to claim 7 wherein the plurality of rails comprises at least one first rail having a first width and/or at least one second rail having a second width. 一種樣品承載器之位址定址方法,其中該樣品承載器至少具有編碼區和樣品檢測區,該樣品承載於該樣品檢測區,該方法包括:a)移動掃描光束瞄準該編碼區的目標位址編碼區段;b)掃描所在位址編碼區段以解碼出該所在位址編碼區段的區段位址碼; c)比較該所在位址編碼區段的區段位址碼與該目標位址編碼區段的區段位址碼,其中當該所在位址編碼區段的區段位址碼與該目標位址編碼區段的區段位址碼不一樣,估算所需微調距離後移動該掃描光束,再一次掃描所在位址編碼區段以解碼出該所在位址編碼區段的區段位址碼;以及d)當該所在位址編碼區段的區段位址碼與該目標位址編碼區段的區段位址碼相同時,掃描該目標位址編碼區段產生時脈訊號,觸發採樣該樣品檢測區中相應的樣品影像訊號。 An address addressing method for a sample carrier, wherein the sample carrier has at least a coding region and a sample detection region, the sample being carried in the sample detection region, the method comprising: a) moving a scanning beam to target a target address of the coding region Encoding the section; b) scanning the address encoding section to decode the sector address code of the address encoding section of the address; c) comparing the sector address code of the address coding section of the address with the sector address code of the target address coding section, where the sector address code of the location coded section and the target address coding area The segment address code of the segment is different. After the required fine adjustment distance is estimated, the scanning beam is moved, and the address encoding segment of the address is scanned again to decode the segment address code of the coded segment of the address; and d) When the sector address code of the address coding section is the same as the sector address code of the target address coding section, scanning the target address coding section to generate a clock signal, triggering sampling of the corresponding sample in the sample detection area Image signal. 如申請專利範圍第10項該樣品承載器之位址定址方法,其中該目標位址編碼區段包括軌和溝的微結構,掃描該目標位址編碼區段之該軌和溝的微結構以產生該時脈訊號。 The address addressing method of the sample carrier of claim 10, wherein the target address coding section comprises a track and a groove microstructure, and the microstructure of the track and the groove of the target address coded section is scanned. The clock signal is generated. 如申請專利範圍第10項該樣品承載器之位址定址方法,更包括由另一光束掃描該樣品檢測區中的樣品,透過採樣、處理和生成該相應的樣品影像。 The address addressing method of the sample carrier of claim 10, further comprising scanning a sample in the sample detection zone by another beam, by sampling, processing, and generating the corresponding sample image. 如申請專利範圍第10項該樣品承載器之位址定址方法,其中進一步包括重複步驟a)至d)多次,以掃描在該編碼區中的多個該位址編碼區段。 The address addressing method of the sample carrier of claim 10, further comprising repeating steps a) through d) a plurality of times to scan a plurality of the address encoding segments in the coding region.
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