TWI614500B - Image registering and stitching method and image detection system for cell detection chip - Google Patents

Abstract

A method for image localization and splicing of a cell detection wafer and an image detection system. According to the size of the imaging area of the image capturing device and the size of the detection area of the cell detecting device, the image planning device captures a moving path of the image of the cell detecting chip, wherein the detecting area includes a configuration for positioning the image. Multiple tokens. Then, the image capturing device is controlled to move over the cell detecting wafer in accordance with the planned moving path to capture a plurality of images of the cell detecting wafer. Finally, the image is positioned and stitched into a complete wafer image based on the position of the mark appearing in the image.

Description

Image detection and splicing method for cell detection wafer and image detection system

The present invention relates to a cell detection method and device, and more particularly to a method for image localization and splicing of a cell detection wafer and an image detection system.

With the development of the biotechnology industry, methods for detecting cancer cells have also been gradually developed. One of the detection methods is the detection of circulating tumor cells (CTC), that is, detecting cancer cells in the circulatory system. Although the current CTC analysis is still in the research stage, the analysis of the number of CTCs still has its clinical value. For example, through the number of CTCs in the patient's blood, the physician can make predictions of tumor metastasis and assessment of treatment modalities. The amount of CTC is usually related to the possibility of tumor metastasis, so the higher the number, the higher the probability of metastasis, and also the degree of growth of the source tumor.

When a blood sample is taken, since the number of cells in the sample is quite large, especially red blood cells, etc., it is necessary to go through a purification step. In the technology of CTC separation, there are four main types, namely, cell density gradient centrifugation, cell size sorting (similar to the concept of filter filtration), immune antibody-coated microstructural capture, and immunomagnetic bead separation. After the CTC is separated by different methods, DNA or fluorescent signals are analyzed. On the separation of CTCs, due to the large number of blood samples, high-throughput biochips are required to simultaneously detect a large number of cells, such as wafers arranged in a two-dimensional array, and a 5 μm slit is created at the edge of the wafer to limit the cells. Align the range to avoid cell loss. Since the two microarrays can be arranged in a single layer structure, cell fluorescence contrast can be utilized to achieve high sensitivity detection.

However, even if the structure of the wafer is simplified and the operation time of the wafer is shortened, a considerable time period is still incurred in the detection.

The present invention provides an image localization and splicing method for a cell detection wafer and an image detection system, which can provide positioning and splicing functions of the captured wafer image.

The image localization and splicing method of the cell detection wafer of the present invention is suitable for controlling an image capturing device to capture an image of a cell detecting chip by an electronic device having a processor, and positioning and splicing the captured image. According to the size of the imaging area of the image capturing device and the size of the detection area of the cell detecting device, the image planning device captures a moving path of the image of the cell detecting chip, wherein the detecting area includes a configuration for positioning the image. Multiple tokens. Next, the control image capturing device moves over the cell detecting wafer in accordance with the planned moving path to capture a plurality of images of the cell detecting wafer. The image is then positioned and stitched into a complete wafer image based on the location of the mark appearing in the image.

In an embodiment of the present invention, the step of locating and splicing the image into a complete wafer image according to the position of the mark appearing in the image further includes searching according to the shooting sequence or shooting position of each image in the moving path. Adjacent images are imaged, and adjacent images are stitched according to the positions of the marks appearing in adjacent images to obtain a complete wafer image.

In an embodiment of the present invention, the number and location of the marks in the cell detecting wafer are determined according to the size of the imaging area of the image capturing device and the size of the detection area of the cell detecting wafer, so that the image capturing device is At least one of the symbols is included in each of the captured images.

In an embodiment of the present invention, the method further comprises using a photoresist to make a mark on the cell detecting wafer, the photoresist comprising SU-8 or AZ9260.

In an embodiment of the present invention, the step of using a photoresist to make a mark on the cell detecting wafer comprises applying a first photoresist to the surface of the slide and performing soft baking, exposure and development to form a microstructure of the flow channel, And applying a second photoresist to the position of each mark on the surface of the slide and performing soft baking, exposure and development to form a microstructure of the mark.

The image detecting system of the cell detecting wafer of the present invention includes an image capturing device and an electronic device. The image capturing device is disposed above the cell detecting wafer for moving a plurality of images of the cell detecting wafer. The electronic device includes a connection device, a storage device, and a processor. The connecting device is used to connect the image capturing device. The storage device is used to store a plurality of modules. The processor is coupled to the connection device and the storage device for executing the module stored in the storage device. The module includes a moving path planning module, a control module, and an image mosaic module. The moving path planning module is configured to plan a moving path of the image of the cell detecting chip according to the size of the imaging area of the image capturing device and the size of the detection area of the cell detecting device, wherein the detecting area includes the configuration A number of markers used to locate an image. The control module is configured to control the image capturing device to move over the cell detecting wafer according to the moving path planned by the moving path planning module to capture an image. The image splicing module is configured to position and splice the image into a complete wafer image according to the position of the mark appearing in the image.

In an embodiment of the present invention, the image splicing module includes finding a neighboring image according to a shooting sequence or a shooting position of each image in a moving path, and splicing the splicing according to the position of the mark appearing in the adjacent image. Neighbor images to obtain a complete wafer image.

In an embodiment of the present invention, the moving path planning module further determines the number and position of the marks in the cell detecting chip according to the size of the imaging area of the image capturing device and the size of the detection area of the cell detecting chip. At least one symbol is included in each image captured by the image capturing device.

In an embodiment of the present invention, the indicia comprises one of a number, a letter, a symbol, a pattern, or a combination thereof.

Based on the above, the image localization and splicing method and the image detection system of the cell detection wafer of the present invention are configured to record the detection area by using a camera to record and time-lapse by using a camera to locate the mark in the detection area of the cell detection wafer. Images of various areas in the middle. Then, through the image mosaic algorithm, the symbols in each image and the images with the same mark are found, and then the images are aligned and spliced according to the position of the marks in the image, so that the marks in the stitched images overlap. . With the aid of the above symbols, the electronic device can quickly recognize the overlapping portions and splicing the wafer images into a complete wafer image.

In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings.

An embodiment of the present invention uses a density centrifugation method (for example, Ficoll) to directly separate a circulating tumor cell (CTC), a lymphocyte, and the like from the blood, and performs a cursor on the separated sample, and then drops the present invention. In an embodiment of a Self-Assembled Cell Array (SACA) wafer. This wafer utilizes the properties of the fluid such that the instilled sample can exhibit a single layer arrangement of cells over time.

In detail, an embodiment of the present invention uses a micro-flow well type detection platform to perform cell sorting, and utilizes a fluid action to enable cell drop points to be dispersed, thereby avoiding excessive number of cells falling at the same position and causing a decrease in detection effect. 1A and 1B are schematic diagrams of a cell detection platform and a cell detection wafer, respectively, according to an embodiment of the invention. Referring to FIG. 1A, a plurality of cell detecting wafers (for example, wafers 10) may be disposed on the cell detecting platform 1, for example, a material of a transparent material (for example, a glass slide) is used as a platform main body, and a thickness is formed by yellow lithography on the surface of the slide glass. A flow path of about 5 micrometers (μm) serves as a power source for driving cell flow. In detail, the circular hole in the middle of the wafer 10 serves as an injection hole for the cell suspension, and the hole around the wafer 10 serves as an evaporation hole, so that the liquid in the flow path can be evaporated therefrom. The outward pulling force when the liquid evaporates not only gives the cells a stable flow pulling force, but also spreads the center cells to the periphery, and more avoids the rapid evaporation of water to cause cell death.

Referring to FIG. 1B, the wafer 10 is formed, for example, by laminating two upper and lower slides 12, 14. The two slides 12, 14 are sandwiched by a 5 micron-thick photoresist 16 made of yellow lithography. The opening in the middle of the slide 12 serves as an injection hole for the cell suspension, and the thickness of the photoresist 16 serves as a well wall, so that the bottom of the well has a narrow passage that flows outward, through which the liquid in the well passes through the surrounding hole. Evaporate outward. The evaporation causes two forces: one is the lateral pulling force, which causes the cells in the center of the well to move outward, resulting in a "flattening" phenomenon; the other pulls down the force, which accelerates the sedimentation and alignment of the cells. With a small acceleration alignment, the possibility of cell desorption can be reduced.

It should be noted that in order to prevent the cells from escaping as the liquid in the well evaporates, the thickness of the photoresist 36 is set to be at least 5 microns, which allows cells having a diameter greater than this thickness to be confined in the well. As can be seen from the enlarged view on the right side of Fig. 1B, the photoresist 36 acts like a filter hole, which allows the liquid to pass, but the cells remain in the well because they are caught by the upper and lower slides 12, 14.

The flow of injecting cells into the wafer 10 will be briefly described below with reference to FIG. 1B. First, the wafer 10 is filled with a PBS solution, and then dropped into the cell suspension 18 from the cell suspension injection port. At this time, the cell 18a will be subjected to downward gravity and lateral pulling force, and the cells closer to the well edge will be affected by the lateral pulling force to rapidly flow to the bottom lateral flow channel, and finally the cell will be blocked by the narrow filter hole and confined in the well. . Thereby, excessive cell dispersion can be avoided. On the other hand, cells close to the center, although subjected to a small lateral pull force, will still settle down due to the influence of gravity, and the cells that eventually settle at the same position will be flattened (eg, cell 18b) without causing cells. Stacked to form a single layer arrangement.

In order to be able to complete the detection of cells in the wafer 10 in a short time, an embodiment of the present invention designs an automatic detection imaging system for the wafer 10, which is reserved in the detection area of the wafer 10 and utilizes electronic control. The platform controls the camera to move on the wafer 10 to record the wafer image, and then uses the marks in the captured image to position and splicing the captured image to obtain a complete wafer image. In this way, in addition to significantly reducing the time spent on manual operations, researchers can also eliminate the need for subsequent image analysis.

For example, FIG. 2 is a block diagram of an image detecting system for a cell detecting wafer according to an embodiment of the invention. Referring to FIG. 2, the image detecting system 2 of the present embodiment includes an electronic device 20 and an image capturing device 30, wherein the electronic device 20 is, for example, a personal computer, a server, a workstation, or the like having computing power, including a connecting device. 22. The storage device 24 and the processor 26 are described as follows:

The connection device 22 is, for example, a universal serial bus (USB), an RS232 interface, a universal asynchronous transceiver (UART), an integrated circuit bus (I2C), a serial peripheral interface (SPI), and a display port. The Thunderbolt interface or the local area network (LAN) interface can provide the electronic device 20 to connect to the image capturing device 30 by wire to control the image capturing device 30 to move and capture images.

It should be noted that the image capturing device 30 includes components such as a lens, an image sensor, and an actuator. The lens is, for example, a combination of one or more meniscus lenses that change the focal length by changing the position of the lens to focus on the object being photographed. The image sensor is configured, for example, with a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS) component, or other kinds of photosensitive elements, which can sense the light intensity entering the lens. To produce an image. The actuator is, for example, a stepper motor that pushes the lens of the image capturing device 30 over the cell detecting wafer to capture an image of the cell detecting wafer based on a control signal emitted by the electronic device 20.

The storage device 24 can be any type of fixed or removable random access memory (RAM), read-only memory (ROM), flash memory or Similar elements or combinations of the above elements. In this embodiment, the storage device 24 is configured to store the mobile path planning module 242, the control module 244, and the image mosaic module 246. The modules are, for example, programs stored in the storage device 24.

The processor 26 is, for example, a central processing unit (CPU), or another programmable general purpose or special purpose microprocessor (Microprocessor), a digital signal processor (DSP), and a programmable program. Controllers, Application Specific Integrated Circuits (ASICs), Programmable Logic Devices (PLDs), or other similar devices or combinations of these devices. The processor 26 is coupled to the connection device 22 and the storage device 24, and loads the program of the mobile path planning module 242, the control module 244, and the image mosaic module 246 from the storage device 24, thereby performing the cell detection chip of the present invention. Image positioning and stitching methods. The detailed steps of this method are illustrated by the following examples.

FIG. 3 is a flow chart of a method for image positioning and splicing of a cell detecting wafer according to an embodiment of the present invention. Referring to FIG. 2 and FIG. 3 simultaneously, the method of the present embodiment is applicable to the image detecting system 2 of FIG. 2, and the detailed steps of the image positioning and splicing method of the present invention are described below with the components in the image detecting system 2.

First, the mobile path planning module 242 is executed by the processor 26 of the electronic device 20 to plan the image capturing device 30 according to the size of the imaging area of the image capturing device 30 and the size of the detection area of the cell detecting wafer to be detected. The cell detects a moving path of the image of the wafer (step S302), wherein the detecting area includes a plurality of marks configured to locate the image.

In detail, in the case where the image detecting system 2 performs the control of the image capturing device 30, in order to reduce the number of images during the entire wafer scanning, an embodiment of the present invention uses a 4x objective lens for image scanning. The image resolution achieved by the 4x objective lens is about 0.62 pixels/μm (pixel/μm), and the average size of white blood cells is 10μm. A cell can be assigned a resolution of about 6*6 pixels. It is sufficient for distinguishing cell fluorescence and performing basic circulatory tumor cell determination.

It should be noted that, in the above embodiment, the image detecting system 2 controls the movement of the image capturing device 30 by the electronic device 20, and records the image by video recording. In yet another embodiment, the image sensing system 2 can be fabricated as a portable, small electronically controlled platform that can be applied to any microscope system. The wafer center can be moved to the middle of the objective lens by placing it on the platform of the optical microscope itself and moving the microscope platform for the most basic positional calibration.

On the other hand, since the present embodiment uses a high-density cell detection method in the cell detection wafer, the difference in image of different regions is less obvious. In order to increase the difference in order to facilitate the subsequent stitching of the image, the embodiment adds markers such as numbers, letters, symbols, patterns, and the like to the bottom of the cell detecting wafer, and if necessary, enhances the edge of the mark by using an optical dark field effect. Among them, the principle of the optical dark field is to block the incident light by the opaque structure, so that the light cannot directly enter the objective lens and the eyepiece. In the absence of an object, the field of view is completely black, and when there is an object, the light is diffused at the edge of the object, making its edges bright and visible in the dark field. In this way, images of different regions can be easily identified and positioned without disturbing the fluorescent signal.

4 is a schematic diagram of a detection area of a cell detection wafer according to an embodiment of the invention. Referring to FIG. 4, this embodiment illustrates the detailed structure in the detection area 40 of the cell detection wafer 10 of FIG. The detection area 40 includes digital patterns 42 arranged in a zigzag order. The digital patterns 42 are formed by using a photoresist, for example, by using a digital graphic 42 having a relatively complicated shape as a mark of each area in the detection area 40. The electronic device 20 serves as a reference for subsequent stitching images. In addition, in this way, the corresponding position of the captured image on the cell detecting wafer can also be known by the size of the number.

It should be noted that, in the fabrication of the above photoresist, an embodiment of the present invention uses the photoresist of the SU-8 3000 system to fabricate the microstructure on the slide, and then uses the photoresist of the AZ 9620 to fabricate the digital pattern on the slide. The production process is shown in Figure 5A~5E as follows:

In Fig. 5A, the surface of the slide 52 was sequentially washed with acetone, isopropyl alcohol, DI Water, and placed on a hot plate for dewatering (120 ° C, 5 minutes).

In Fig. 5B, the slide 52 is moved to the fragment and the photoresist 54 is coated with a spin coater. The photoresist used in this embodiment is SU-8 3010. After the coating is completed, the soft baking step is performed, thereby removing most of the solvent in the photoresist 54 to make the structure relatively stable. After the temperature of the slide glass 52 is lowered to room temperature, exposure is performed using a single side, and after exposure and post-exposure baking, the structure which reacts upon exposure is enhanced, and natural cooling is also performed after completion.

In Figure 5C, the photoresist 54 on the slide 52 is developed using SU-8 developer to create a structure. In order to confirm whether or not the structure was completed, it was rinsed with isopropyl alcohol after 30 seconds of development, and it was confirmed by drying after drying. After the development is completed, the isopropyl alcohol on the slide 52 is washed with DI Water to complete the fabrication of the microstructure 54a of the flow path.

It should be noted that since the adhesion of SU-8 to glass is limited, a small mark cannot adhere to the surface of the glass, and therefore the portion where the mark is made is made using AZ 9260 photoresist. Prior to coating the AZ 9260 photoresist, the slide 52 was washed sequentially with isopropyl alcohol and DI Water, and then dehydrated and baked using HMDS for 5 minutes to increase the AZ 9260 photoresist on the slide 52. Adhesion.

In Figure 5D, an AZ 9260 photoresist 56 is applied to the slide 52 on which the microstructure 54a has been fabricated at a rotational speed (rpm) of 2000, with a thickness of 10 microns, and then the slide 52 is placed at 100 °C. The heating plate was soft baked for about 2 minutes, and then exposed to light after exposure, and the exposure dose was 200 mJ/cm ² (mJ/cm ² ).

In Fig. 5E, the AZ 400K developer was mixed with DI Water (1:3 ratio), and the development time was about 90 seconds. The slide 52 coated with the AZ 9260 photoresist 56 was developed, and after development, it was rinsed with DI Water. It was placed on a hot plate for hard baking (120 ° C, 5 minutes) to complete the fabrication of the marked microstructure 56a.

Returning to the flow of FIG. 3, the processor 26 then executes the control module 244 to control the image capturing device 30 to move over the cell detecting wafer to capture multiple sheets of the cell detecting wafer according to the moving path planned by the moving path planning module 242. Image (step S304). In detail, the image detecting system 2 of the present embodiment further provides the electronic device 20 to design a moving speed, a moving route, and the like. The design of the route can use the area of the imaging area of the image capturing device 30 as a reference. For example, by using a pattern of a known size (for example, a grid of cell counting disks, a cell size of 50 microns), an imaging area of the image capturing device 30 at a certain magnification can be obtained. If the imaging area of the image capturing device 30 is about 2 mm long and 1 mm wide, the movement of the image capturing device 30 on the Y axis needs to be moved at least 7 times (the wafer-based hole is 7 mm).

Finally, the processor 26 executes the image splicing module 246 to position and splice the images into the complete wafer image according to the positions of the symbols appearing in the image captured by the image capturing device 30 (step S306). In an embodiment, the mobile path planning module 242 determines the number and location of the symbols in the cell detection chip according to, for example, the size of the imaging area of the image capturing device 30 and the size of the detection area of the cell detecting chip. At least one mark is included in each of the images captured by the image capturing device 30. In this way, the image splicing module 246 can know the corresponding position in the wafer image according to the mark in each image, and then use the pattern of the mark to splicing the adjacent images to obtain a complete wafer image. In another embodiment, the image splicing module 246 can directly locate adjacent images according to the shooting sequence or shooting position of each image in the moving path, and adjacent to each other according to the position of the mark appearing in the adjacent image. The images are stitched together to obtain a complete wafer image.

For example, FIG. 6A is a schematic diagram of a moving image capturing device according to an embodiment of the invention. FIG. 6B and FIG. 6C are schematic diagrams showing a stitched image according to an embodiment of the invention. Referring to FIG. 6A, the moving path of the image capturing device of the present embodiment is, for example, a simple bow shape. By recording and timing the image capturing area 60, the image of each area in the detecting area 40 can be obtained. The maximum moving speed of the image capturing device is, for example, 0.35 mm/sec (mm/s). To avoid image sticking during recording, the moving speed of the image capturing device can be set to 0.25 mm/sec. FIG. 6B illustrates images (eg, images 62, 64, 66) captured by the image capture device during movement, and by stitching the images, a complete wafer image 68 as shown in FIG. 6C can be obtained.

7A and 7B are schematic diagrams of stitching images according to symbol positions in an image according to an embodiment of the invention. Referring to FIG. 7A, in this embodiment, since each position of the detection area of the cell detecting wafer has a corresponding digital figure, and the image capturing device overlaps between the images captured during the shooting, the use of this The features of the digital graphics appearing in the overlapping portion can be used to splicing the images of the regions or images into a complete wafer image through the image processing software. For example, the image 72 and the image 74 can be spliced through the features of the digital graphic 8 and the digital graphic 5 appearing in the image 72 and the image 74. The adjacent images are stitched one by one by the above method, and finally spliced into a complete wafer image 76 as shown in FIG. 7B.

In summary, the image localization and splicing method of the cell detection wafer of the present invention and the image detection system are arranged in the detection area of the cell detection chip to configure the mark which can be used for positioning, and the camera is used for recording and timing by means of video recording and timing mapping. An image of each area in the area. Then, through the image mosaic algorithm, the symbols in each image and the images with the same mark are found, and then the images are aligned and spliced according to the position of the marks in the image, so that the marks in the stitched images overlap. . With the aid of the above symbols, the electronic device can quickly recognize the overlapping portions and splicing the wafer images into a complete wafer image.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present case. Any person having ordinary knowledge in the technical field can protect the case without making any changes or refinements without departing from the spirit and scope of the present case. The scope is subject to the definition of the scope of the patent application.

1‧‧‧ cell detection platform

10‧‧‧ wafer

12, 14‧‧‧ slides

16‧‧‧Light resistance

18‧‧‧ cell suspension

18a, 18b‧‧‧ cells

2‧‧‧Image Detection System

20‧‧‧Electronic devices

22‧‧‧Connecting device

24‧‧‧Storage device

242‧‧‧Mobile Path Planning Module

244‧‧‧Control Module

246‧‧‧Image splicing module

26‧‧‧ Processor

30‧‧‧Image capture device

40‧‧‧Detection area

42‧‧‧Digital graphics

52‧‧‧ slides

54, 56‧‧‧Light resistance

54a‧‧ ‧ flow path microstructure

56a‧‧‧mark microstructure

60‧‧‧Photography area

62, 64, 66, 72, 74‧ ‧ images

76‧‧‧Complete wafer imagery

S302~S306‧‧‧ steps of image localization and splicing method of cell detection wafer in an embodiment of the present invention

1A and 1B are schematic diagrams of a cell detection platform and a cell detection wafer, respectively, according to an embodiment of the invention. 2 is a block diagram of an image detection system for a cell detection wafer according to an embodiment of the invention. FIG. 3 is a flow chart of a method for image positioning and splicing of a cell detecting wafer according to an embodiment of the present invention. 4 is a schematic diagram of a detection area of a cell detection wafer according to an embodiment of the invention. 5A-5E are schematic diagrams showing the fabrication of a runner and a marker microstructure in accordance with an embodiment of the invention. FIG. 6A is a schematic diagram of a moving image capturing device according to an embodiment of the invention. FIG. 6B and FIG. 6C are schematic diagrams showing a stitched image according to an embodiment of the invention. 7A and 7B are schematic diagrams of stitching images according to symbol positions in an image according to an embodiment of the invention.

S302~S306‧‧‧Steps

Claims (10)

A method for image localization and splicing of a cell detection wafer is adapted to control an image capturing device to capture an image of a cell detecting wafer by an electronic device having a processor and to position and splicing the captured image. The method comprises the following steps: And locating the image capturing device to capture the moving path of the image of the cell detecting chip according to the size of the image capturing area of the image capturing device and the size of the detecting area of the cell detecting device, wherein the detecting region includes a configuration for Positioning a plurality of marks of the image; controlling the image capturing device to move over the cell detecting wafer according to the planned moving path to capture a plurality of images of the cell detecting wafer; and according to the appearance in the image The position of the mark, the image is positioned and the image is spliced into a complete wafer image, wherein the mark is made on the cell detection wafer using a photoresist of a yellow lithography process. The method of claim 1, wherein the step of locating the image and splicing the image into a complete image of the wafer according to the position of the mark appearing in the image further comprises: And capturing an adjacent image according to a shooting order or a shooting position in the moving path; and splicing the adjacent image according to a position of the mark appearing in the adjacent image to obtain a complete image of the wafer. The method of claim 1, wherein the number and location of the marks in the cell detecting wafer comprises a size of the image capturing area according to the image capturing device and a size of the detecting area of the cell detecting wafer It is determined that at least one of the symbols is included in each of the images captured by the image capturing device. The method of claim 1, wherein the photoresist comprises SU-8 or AZ9260. The method of claim 4, wherein the step of using the photoresist on the cell detection wafer to form the mark comprises: coating a first photoresist on the surface of the slide and performing soft baking, exposure and development, A microstructure of the flow channel is formed; and a second photoresist is applied to the position of each of the marks on the surface of the slide and soft baked, exposed and developed to produce the microstructure of the mark. The method of claim 1, wherein the symbol comprises one of a number, a letter, a symbol, a pattern, or a combination thereof. An image detecting system for a cell detecting wafer, comprising: an image capturing device disposed above a cell detecting wafer to move a plurality of images of the cell detecting wafer; and an electronic device comprising: a connecting device connected to the image capturing device; a storage device that stores a plurality of modules; and a processor coupled to the connection device and the storage device to execute the module stored in the storage device, the module comprising: The moving path planning module plans to capture the moving path of the image of the cell detecting chip according to the size of the imaging area of the image capturing device and the size of the detection area of the cell detecting device, wherein the detecting The area includes a plurality of symbols configured to locate the image; and the control module controls the image capturing device to move over the cell detecting wafer according to the moving path planned by the moving path planning module to capture the image. And an image splicing module, according to the position of the mark appearing in the image, positioning the image and splicing the image into a complete wafer image, wherein the mark is a yellow lithography process on the cell detecting wafer Made of photoresist. The system of claim 7, wherein the image splicing module comprises: finding an adjacent image according to a shooting sequence or a shooting position of each of the images in the moving path, and according to the adjacent image The location of the indicia that appears appears to stitch the adjacent image to obtain a complete image of the wafer. The system of claim 7, wherein the moving path planning module further determines the size of the cell detection wafer according to the size of the imaging area of the image capturing device and the size of the detection area of the cell detecting wafer. The number and position of the marks are such that at least one of the marks is included in each of the images captured by the image capturing device. The system of claim 7, wherein the indicia comprises one of a number, a letter, a symbol, a pattern, or a combination thereof.