TWI479300B - Electronic device having waterproof glue rework heating structure and rework method of waterproof glue - Google Patents

Description

Electronic device with waterproof rubber heavy structure heating structure and heavy working method of waterproof rubber

The present invention relates to an electronic device having a waterproof rubber heavy-duty heating structure, and more particularly to an electronic device having a waterproof rubber heavy-duty heating structure and a heavy-duty method for waterproofing rubber.

The waterproof function of smart phones has become a selling point demand for the added value of existing mobile phones. The waterproof design of current mobile phones has the use of O-ring design or thermoplastic polyurethane resin (TPU) 2 shot design. . However, as the display size of smart phones is moving toward more than 4 inches, and the thickness is actually developing below 10 mm, the conventional waterproof design method cannot meet the specifications of the products. Therefore, the industry has introduced a waterproof PU glue process. To replace the commonly used mechanism design and meet the waterproof requirements.

The waterproof PU glue process is built on the inside of the smart phone. After the electronic components are assembled, the waterproof PU glue is set on the inner casing of the smart phone, and when the shell of the smart phone is combined with the cover body, The cover will be glued to the waterproof PU glue, so that the assembled smart phone can be waterproofed by waterproof PU glue.

Although the use of waterproof PU glue can achieve the purpose of waterproofing, when the smart phone finds problems in the subsequent testing stage or needs to be repaired after-sales, the waterproof PU glue must be removed to separate the shell from the cover, that is, wisdom. The adhesive part of the type of mobile phone and the waterproof PU glue must be reworked to repair the electronic components installed inside the casing. The conventional heavy-duty method uses a heat gun to heat the surface of the smart phone. The thermal energy is used to soften the waterproof PU glue between the casing and the cover body by the conduction of the cover body, and at the same time, the cover body and the waterproof PU glue are peeled off by a disassembling piece, but the waterproof PU glue needs to be heated to 90~ It can be softened and removed at 95 °C. Excessive heating temperature (90~95 °C) will cause damage to the electronic components installed inside the casing, such as transparent conductive layer (ITO), and the cover and the casing are easy to use. The strength of the stripping of the disassembled film is poorly controlled and damaged, resulting in an increase in maintenance costs. Furthermore, heating the smart phone to 90 to 95 °C requires too long heating hours, and the operation risk is high. The number of mobile phones is also limited, resulting in low maintenance efficiency.

Therefore, how to develop an electronic device with a waterproof rubber heavy-duty heating structure and a heavy-duty method for waterproofing rubber to improve the problems of the prior art is an urgent problem to be solved.

The main purpose of the present invention is to provide an electronic device with a waterproof rubber heavy-duty heating structure and a heavy-duty method for waterproofing rubber, thereby solving the prior art method of removing the waterproof adhesive, which causes the electronic components disposed inside the casing, and the cover and the casing. The damage causes the maintenance cost to be increased, the heating time is long, the operation risk is high, the number of heat-receivable mobile phones can be limited, and the maintenance efficiency is low.

In order to achieve the above object, a broader aspect of the present invention provides an electronic device comprising at least: a cover; a housing structure having at least a glue area; and a waterproof adhesive coated in the dispensing area. The housing structure is combined with the cover body; and a rework heating structure is disposed on the housing structure, and includes: a heating wire disposed in the housing structure in a buried incident manner, and the point The glue area is correspondingly disposed; the at least one contact end is connected to the heating wire, and the waterproof glue is heated by the at least one contact end and the heating wire during the waterproof rubber rework.

Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in the various aspects of the present invention, and the description and illustration are in the nature of

1A, 1B, 2A and 2B, wherein FIG. 1A is a schematic view showing the appearance of the electronic device according to the first preferred embodiment of the present invention, and FIG. 1B is a partial structural view of the electronic device shown in FIG. 1A. 2A is a schematic cross-sectional structural view of the housing structure and the heating wire of the electronic device shown in FIG. 1A, and FIG. 2B is a schematic cross-sectional structure of the 2A A and the cover body and the waterproof glue. The electronic device 1 of the present invention mainly includes a housing structure 11, a cover 12, a rework heating structure 13 and a waterproof adhesive 14, wherein the housing structure 11 of the electronic device 1 of the present invention can be a plastic part and The electronic device 15 is internally disposed, and the electronic device 1 can be a smart phone, but not limited thereto, as long as the electronic device 1 for connecting the cover 12 and the housing structure 11 by the waterproof adhesive 14 is protected by the present invention. range.

Please refer to FIGS. 1B and 2A again. The housing structure 11 of the present invention has an outer wall 111 and an inner wall 112. The height of the outer wall 111 is higher than the inner wall 112, and a relationship is formed between the outer wall 111 and the inner wall 112. Dispensing area 113.

Please refer to the figures 1A, 1B and 2A of the present invention. The rework heating structure 13 of the present invention is mainly composed of a heating wire 131 and at least one contact end 132. The heating wire 131 can be a metal wire, and the implementation aspect can be In one embodiment, the heating wire 131 and the casing structure 11 are formed in a buried manner, that is, the heating wire 131 is partially disposed in the casing structure in a buried manner. Medium 11, and is set corresponding to the dispensing area 113 (as shown in FIG. 2A).

Referring to FIGS. 1A and 1B , at least one contact end 132 is connected to the heating wire 131 , and at least one contact end 132 is disposed on the housing structure 11 , and at least one contact end 132 is after the electronic device 1 is assembled. Exposed to the outer surface of the electronic device 1 (as shown in FIG. 1A ), when the waterproof adhesive 14 is subjected to the rework process, a heater (not shown) may be connected to the at least one contact end 132 to pass through the contact end 132 . The heating wire 131 is heated by conducting heat, so that the heating wire 131 can heat the waterproof rubber 14 also disposed inside the dispensing region 113 to soften the waterproof rubber 14.

Referring to FIG. 1B , in the embodiment, the heating wire 131 is disposed around the housing structure 11 , but the embodiment thereof is not limited thereto, and the heating wire 131 can also be disposed in a segmental manner. In the housing structure 11, as long as the heating wire 131 is disposed at a position corresponding to the dispensing region 113 and the heating wire 131 is connected to the at least one contact end 132, the range protected by the present invention; in this embodiment, at least one contact end The number of the 132 is set to 2, and can be respectively disposed at the two ends of the heating wire 131. However, not limited thereto, only a single contact end 132 may be provided, as long as the contact end 132 can be connected to the heating wire 131. All are protected by this case.

Referring to FIGS. 2A and 2B again, the waterproof rubber 14 of the present invention is applied to the dispensing region 113 of the housing structure 11 to connect the housing structure 11 and the cover 12 in combination. In this embodiment, waterproofing is provided. The glue 14 can be a hygroscopic glue, which can be, but is not limited to, a PU type absorbent gel.

Referring to FIG. 2B again, the waterproof adhesive 14 is implemented in such a manner that after all the electronic components 15 included in the electronic device 1 are assembled, the waterproof adhesive 14 can be applied to the dispensing region 113 of the housing structure 11. When the housing structure 11 is combined with the cover 12, the cover 12 will be adhered to the waterproof adhesive 14 so that the assembled electronic device 1 can achieve the waterproof function by the waterproof adhesive 14.

When the electronic device 1 finds a problem in the subsequent testing stage or performs after-sales maintenance, the bonding portion of the cover 12 and the waterproof adhesive 14 must be subjected to a rework process, and the waterproof adhesive 14 is removed to make the housing structure 11 and the cover 12 The electronic component 15 disposed inside the casing structure 11 can be inspected for separation.

Please refer to FIG. 3 and cooperate with the drawings of FIGS. 1A, 1B, 2A and 2B, wherein FIG. 3 is a flow chart of the method for reworking the waterproof rubber of the second preferred embodiment of the present invention. As shown in the figure, the waterproofing of the embodiment The glue rework method comprises the following steps: First, a thermocouple heater (not shown) is brought into contact with the contact end 132 of the outer surface of the electronic device 1 to conduct heat energy to the heating wire 131 through the contact end 132 to heat The wire 131 can heat the waterproof rubber 14 also disposed inside the dispensing region 113 to soften the waterproof rubber 14 (as shown in step S31), and then cooperate with a temperature sensor during heating of the thermocouple heater. It is detected and judged whether the heating temperature reaches the softening temperature of the waterproof rubber 14 (as shown in step S32), for example, 90 to 95 °C.

When the determination result is no, that is, the softening temperature of the waterproof rubber 14 is not reached and the cover 12 and the waterproof rubber 14 cannot be peeled off, the step S31 is continued, and the contact end 132 and the heating wire 131 are continued with the thermocouple heater. Heating is performed to soften the waterproof rubber 14.

On the other hand, when the judgment result is YES, it means that the softening temperature of the waterproof rubber 14 has been heated, and the thermocouple heater can be stopped to heat the contact end 132, and the cover body 12 and the waterproof rubber 14 can be easily peeled off directly ( As shown in step S32, the electronic component 15 disposed inside the casing structure 11 is inspected.

Since the heating wire 131 of the present invention is disposed in the casing structure 11 during the injection molding process, the heating wire 131 can be a heating conduit inside the casing structure 11 and the contact end 132 connected to the heating wire 131. Exposed on the outer surface of the electronic device 1 and directly contacted with the exposed contact end 132 by the heater. The conduction of the contact end 132 enables the heat to be quickly and concentrated in the heating wire 131 to avoid high temperature. The damage of the electronic component 15 disposed inside the casing structure 11 and the temperature sensor can determine whether the temperature has reached the working temperature of the waterproof rubber 14 and can be directly removed when the temperature arrives, which can be achieved as follows. efficacy:

1. High safety, only need to heat the contact end 132 to reach the softening temperature of the waterproof rubber 14, and easily separate the waterproof rubber 14 from the cover 12;

2. The operation is convenient, and the direct contact with the exposed contact end 132 in combination with the heater enables the heat to be quickly and concentrated in the heating wire 131, which can reduce the wear rate of the internal electronic component 15 and reduce the cost, and the short working time can improve the maintenance. Efficiency and achieve energy saving purposes;

3. Multiple electronic devices 1 can be repaired at the same time to save human resources.

In summary, the electronic device with the waterproof rubber heavy-duty heating structure provided by the present invention and the waterproofing method of the waterproof rubber are disposed in the housing structure by means of the buried incident mode, and the point of the housing structure The glue area is correspondingly disposed, and the contact end connected to the heating wire is exposed on the outer surface of the electronic device, and the heat is quickly and concentrated in the heating wire by the contact of the heater with the contact end during the waterproof rubber rework, directly The rubber is heated and softened, the safety is high, the wear rate of the internal electronic components can be reduced, the cost can be reduced, the short working time can improve the maintenance efficiency and achieve the purpose of energy saving, and more than one electronic device can be repaired at one time. Achieve the power to save human resources. Therefore, the electronic device with the waterproof rubber heavy structure heating structure and the heavy work method of the waterproof rubber in this case have great industrial utilization value, and the application is made according to law.

The present invention has been described in detail by the above-described embodiments, and is intended to be modified by those skilled in the art.

1. . . Electronic device

11. . . Shell structure

111. . . Outer wall

112. . . Inner wall

113. . . Dispensing area

12. . . Cover

13. . . Heavy work heating structure

131. . . Heating wire

132. . . Contact end

14. . . waterproof glue

15. . . Electronic component

S31-S33. . . Waterproof glue rework steps

FIG. 1A is a schematic perspective view showing the appearance of an electronic device according to a first preferred embodiment of the present invention.

Fig. 1B is a partial structural view of the electronic device shown in Fig. 1A.

Fig. 2A is a schematic cross-sectional view showing the structure of the casing and the heating wire of the electronic device shown in Fig. 1A.

Fig. 2B is a schematic cross-sectional view showing the combination of the second embodiment A and the cover body and the waterproof glue.

Figure 3 is a flow chart showing the method of reworking the waterproof rubber of the second preferred embodiment of the present invention.

1. . . Electronic device

11. . . Shell structure

111. . . Outer wall

112. . . Inner wall

113. . . Dispensing area

13. . . Heavy work heating structure

131. . . Heating wire

132. . . Contact end

Claims (10)

An electronic device comprising at least:
a cover
a shell structure having at least a little glue area;
a waterproof rubber coated in the dispensing region to combine the housing structure with the cover; and a rework heating structure disposed on the housing structure and comprising:
a heating wire is disposed in the housing structure in a buried incident manner, and is disposed corresponding to the dispensing region;
The at least one contact end is connected to the heating wire, and the waterproof glue is heated by the at least one contact end and the heating wire during the waterproof rubber rework. The electronic device of claim 1, wherein the waterproof adhesive is a hygroscopic adhesive. The electronic device of claim 2, wherein the hygroscopic adhesive is a PU type absorbent gel. The electronic device of claim 1, wherein the heating wire is a metal wire. The electronic device of claim 4, wherein the metal wire is one of a copper wire or an aluminum wire. The electronic device of claim 1, wherein the at least one contact end is disposed on the housing structure and is exposed on an outer surface of the electronic device after the electronic device is assembled. A method for reworking heavy waterproof glue, which is suitable for an electronic device, the electronic device has a cover body, a shell structure, a waterproof glue and a heavy-duty heating structure, and the waterproof glue is coated on one of the shell structures. In the glue region, the housing structure is combined with the cover body, the rework heating structure has a heating wire and at least one contact end connected to the heating wire, the heating wire and the housing structure are buried Forming, and the heating wire is corresponding to the dispensing area, and at least comprises the following steps:
Connecting a heater to the at least one contact end to heat the heating wire to drive the waterproof glue to soften;
It is determined whether the temperature of the heater reaches the softening temperature of the waterproof rubber; and when the determination result is YES, the cover body and the waterproof rubber are peeled off. The method for reworking a waterproof rubber according to claim 7, wherein the waterproof adhesive is a hygroscopic adhesive. The method for reworking a waterproof rubber according to claim 7, wherein the heating wire is a metal wire. The rework method of the waterproof rubber according to claim 7, wherein the at least one contact end is disposed on the housing structure, and is exposed on an outer surface of the electronic device after the electronic device is assembled.