TWI476106B - - Google Patents

Info

Publication number
TWI476106B
TWI476106B TW101123034A TW101123034A TWI476106B TW I476106 B TWI476106 B TW I476106B TW 101123034 A TW101123034 A TW 101123034A TW 101123034 A TW101123034 A TW 101123034A TW I476106 B TWI476106 B TW I476106B
Authority
TW
Taiwan
Application number
TW101123034A
Other versions
TW201400173A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101123034A priority Critical patent/TW201400173A/zh
Publication of TW201400173A publication Critical patent/TW201400173A/zh
Application granted granted Critical
Publication of TWI476106B publication Critical patent/TWI476106B/zh

Links

TW101123034A 2012-06-27 2012-06-27 絕緣膜之黏貼設備及其黏貼方法 TW201400173A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101123034A TW201400173A (zh) 2012-06-27 2012-06-27 絕緣膜之黏貼設備及其黏貼方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101123034A TW201400173A (zh) 2012-06-27 2012-06-27 絕緣膜之黏貼設備及其黏貼方法

Publications (2)

Publication Number Publication Date
TW201400173A TW201400173A (zh) 2014-01-01
TWI476106B true TWI476106B (zh) 2015-03-11

Family

ID=50344833

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101123034A TW201400173A (zh) 2012-06-27 2012-06-27 絕緣膜之黏貼設備及其黏貼方法

Country Status (1)

Country Link
TW (1) TW201400173A (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200603256A (en) * 2004-03-26 2006-01-16 Fuji Photo Film Co Ltd Process for forming permanent pattern
WO2006046634A1 (ja) * 2004-10-28 2006-05-04 Tokyo Electron Limited ゲート絶縁膜の形成方法，半導体装置及びコンピュータ記録媒体
CN1259811C (zh) * 2001-07-05 2006-06-14 柏腾科技股份有限公司 于非导电材料形成电磁波干扰遮蔽膜的方法
US7642185B2 (en) * 2004-04-28 2010-01-05 Fujitsu Microelectronics Limited Insulating film forming method capable of enhancing adhesion of silicon carbide film, etc. and semiconductor device
CN201998515U (zh) * 2011-03-01 2011-10-05 吴江市博众精工科技有限公司 一种调整模组

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1259811C (zh) * 2001-07-05 2006-06-14 柏腾科技股份有限公司 于非导电材料形成电磁波干扰遮蔽膜的方法
TW200603256A (en) * 2004-03-26 2006-01-16 Fuji Photo Film Co Ltd Process for forming permanent pattern
US7642185B2 (en) * 2004-04-28 2010-01-05 Fujitsu Microelectronics Limited Insulating film forming method capable of enhancing adhesion of silicon carbide film, etc. and semiconductor device
WO2006046634A1 (ja) * 2004-10-28 2006-05-04 Tokyo Electron Limited ゲート絶縁膜の形成方法，半導体装置及びコンピュータ記録媒体
CN201998515U (zh) * 2011-03-01 2011-10-05 吴江市博众精工科技有限公司 一种调整模组

Also Published As

Publication number Publication date
TW201400173A (zh) 2014-01-01

Similar Documents

Publication Publication Date Title
BR112014020044A2 (zh)
BR112014017635A2 (zh)
BR112014017614A2 (zh)
BR112014017625A2 (zh)
BR112014017659A2 (zh)
BR112014017646A2 (zh)
BR112014017638A2 (zh)
BR112014017607A2 (zh)
BR112015003591A2 (zh)
BR112014017634A2 (zh)
BR112014017609A2 (zh)
BR112014017644A2 (zh)
BR112014017647A2 (zh)
BR112015014795A2 (zh)
BR112014017618A2 (zh)
BR112014017630A2 (zh)
BR112014017652A2 (zh)
BR112014017621A2 (zh)
BR112014017622A2 (zh)
BR112014017627A2 (zh)
BR112014017623A2 (zh)
BR112014017631A2 (zh)
BR112014017641A2 (zh)
BR112014017636A2 (zh)
BR112014017667A2 (zh)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees