TWI475339B - Method and system for positioning a substrate to be exposed and a film - Google Patents
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- TWI475339B TWI475339B TW101149344A TW101149344A TWI475339B TW I475339 B TWI475339 B TW I475339B TW 101149344 A TW101149344 A TW 101149344A TW 101149344 A TW101149344 A TW 101149344A TW I475339 B TWI475339 B TW I475339B
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本發明是有關於一種影像檢測對位方法及系統,特別是指一種無需特殊的對位標靶設計而可精確對位的待曝光基材及底片的對位方法及系統。The invention relates to an image detection alignment method and system, in particular to a method and a system for aligning a substrate to be exposed and a film to be accurately aligned without special alignment target design.
高端的電子產品如行動電話、液晶顯示器、平板電腦、照相裝置、個人數位助理等,其顯示螢幕的線路設計日趨精細,許多製程的精度要求也更加嚴格,例如:曝光製程,以目前多以人工目測的對位方式,將難以應付未來更為嚴苛的要求。此外,目前以十字形、圓形或方形的特殊的對位標靶圖形,無法適用在例如觸控面板的透明基材上。High-end electronic products such as mobile phones, LCD monitors, tablets, camera devices, personal digital assistants, etc., the display line design of the screen is becoming more and more sophisticated, and the precision requirements of many processes are also more stringent. For example, the exposure process is mostly artificial. The visual alignment method will be difficult to cope with the more stringent requirements of the future. In addition, the special alignment target pattern of a cross, a circle or a square is currently not applicable to a transparent substrate such as a touch panel.
因此,本發明之一目的,即在提供一種無需特殊的對位標靶設計而可精確對位的待曝光基材及底片的對位方法及系統。Accordingly, it is an object of the present invention to provide a method and system for aligning a substrate to be exposed and a film to be accurately aligned without the need for a special alignment target design.
本發明之另一目的,即在提供一種適用於透明材質的待曝光基材及底片的對位方法及系統。Another object of the present invention is to provide a method and system for aligning a substrate to be exposed and a film suitable for a transparent material.
於是,本發明待曝光基材及底片的對位方法是配合至少二攝影單元、一調整機構及一控制裝置運作,該調整機構受該控制裝置控制以調整該基材及該底片的相對位置,該方法包含下述步驟:(a)各該攝影單元分別拍攝一張影像,各該影像的視野範圍包括一基材邊緣及一底片邊界;(b)該控制裝置定位出兩影像中的基材邊緣及底片邊界;(c)該控制裝 置依據該基材邊緣及該底片邊界計算一偏移量;及(d)該控制裝置依據該偏移量驅動該調整機構,藉此調整該基材及該底片的相對位置,使該基材及該底片彼此對齊。Therefore, the alignment method of the substrate to be exposed and the film of the present invention is operated by matching at least two photographic units, an adjusting mechanism and a control device, and the adjusting mechanism is controlled by the control device to adjust the relative position of the substrate and the film. The method comprises the following steps: (a) each of the photographing units respectively captures an image, the field of view of each image includes a substrate edge and a film boundary; (b) the control device positions the substrate in the two images Edge and film boundary; (c) the control device Calculating an offset according to the edge of the substrate and the boundary of the film; and (d) the control device drives the adjustment mechanism according to the offset, thereby adjusting the relative position of the substrate and the film to make the substrate And the backsheets are aligned with one another.
本發明待曝光基材及底片的對位方法之第一實施例中,各該攝影單元的拍攝位置分別朝向該基材的同一邊緣,該控制裝置的詳細步驟如下:步驟(b)是定位出其中一影像中的底片邊界與影像中心線的一第一交點,與定位出另一影像中的底片邊界與影像中心線的一第二交點;步驟(c)是計算該第一交點及該第二交點之間的一距離、其中一影像中的基材邊緣與經過該第一交點並垂直底片邊界的一第一間距,及另一影像中的該基材邊緣與經過該第二交點並垂直該底片邊界之第二間距,且是藉由該距離、該第一間距及該第二間距代入三角函式換算一偏移角度;及步驟(d)依據該偏移角度驅動該調整機構以調整該基材的位置,使該第一間距大致等於該第二間距。In the first embodiment of the method for aligning the substrate to be exposed and the film of the present invention, the photographing positions of the photographing units are respectively directed to the same edge of the substrate, and the detailed steps of the control device are as follows: step (b) is positioning a first intersection of the film boundary and the image center line in one of the images, and a second intersection of the film boundary and the image center line in the other image; step (c) is to calculate the first intersection and the first a distance between two intersections, a first spacing of the substrate edge in one of the images and a boundary between the first intersection and the vertical film, and an edge of the substrate in the other image passing through the second intersection and perpendicular a second pitch of the boundary of the film, wherein the distance, the first pitch and the second pitch are substituted into a trigonometric conversion offset angle; and the step (d) drives the adjustment mechanism according to the offset angle to adjust The substrate is positioned such that the first spacing is substantially equal to the second spacing.
本發明待曝光基材及底片的對位方法之第二實施例中,各該攝影單元的拍攝位置分別朝向該基材的上邊緣及下邊緣,該控制裝置的詳細步驟如下:步驟(b)是分別定位出兩影像中的基材邊緣及底片邊界;步驟(c)是計算其中一影像的該基材邊緣及該底片邊界之間的上方間距,以及另一影像的該基材邊緣及該底片邊界之間的下方間距;及步驟(d)是依據該上方間距及該下方間距之差值調整該基材的位置,使該上方間距大致等於該下方間距。In the second embodiment of the method for aligning the substrate to be exposed and the film of the present invention, the photographing positions of the photographing units are respectively directed toward the upper edge and the lower edge of the substrate, and the detailed steps of the control device are as follows: step (b) Positioning the edge of the substrate and the boundary of the film in the two images respectively; step (c) is calculating the upper spacing between the edge of the substrate of one image and the boundary of the film, and the edge of the substrate of another image and The spacing between the lower edges of the film; and the step (d) is to adjust the position of the substrate according to the difference between the upper pitch and the lower pitch such that the upper pitch is substantially equal to the lower pitch.
本發明待曝光基材及底片的對位方法之第三實施例 中,各該攝影單元的拍攝位置分別朝向該基材的左邊緣及右邊緣,該控制裝置的詳細步驟如下:步驟(b)是分別定位出兩影像中的基材邊緣及底片邊界;步驟(c)是計算其中一影像的該基材邊緣及該底片邊界之間的左方間距,以及另一影像的該基材邊緣及該底片邊界之間的右方間距;及步驟(d)是依據該左方間距及該右方間距之差值調整該基材的位置,使該左方間距大致等於該右方間距。Third embodiment of the method for aligning a substrate to be exposed and a film of the present invention The photographing positions of the photographing units are respectively directed to the left and right edges of the substrate, and the detailed steps of the control device are as follows: step (b) is to respectively locate the edge of the substrate and the boundary of the film in the two images; c) calculating the left-hand spacing between the edge of the substrate and the boundary of the film of one of the images, and the distance between the edge of the substrate of the other image and the boundary of the film; and step (d) is based on The difference between the left spacing and the right spacing adjusts the position of the substrate such that the left spacing is approximately equal to the right spacing.
本發明的對位系統包括:一調整機構,受控制以調整該基材及該底片的相對位置;至少二攝影單元,分別拍攝一張影像,各該影像的視野範圍包括一基材邊緣及一底片邊界;及一控制裝置,電性連接該調整機構及各該攝影單元,該控制裝置具有:一影像處理單元,定位出兩影像中的基材邊緣及底片邊界,一判斷單元,依據該基材邊緣及該底片邊界計算一偏移量,及一控制單元,依據該偏移量驅動該調整機構,藉此調整該基材及該底片的相對位置,使該基材及該底片彼此對齊。The alignment system of the present invention comprises: an adjustment mechanism controlled to adjust the relative position of the substrate and the negative film; at least two photographic units respectively capturing an image, and the field of view of each of the images includes a substrate edge and a And a control device electrically connected to the adjusting mechanism and each of the photographing units, the control device having: an image processing unit positioning the edge of the substrate and the boundary of the film in the two images, and a determining unit according to the base An offset is calculated between the edge of the material and the boundary of the film, and a control unit drives the adjustment mechanism according to the offset, thereby adjusting the relative positions of the substrate and the film to align the substrate and the film with each other.
本發明的對位系統中,各該攝影單元的拍攝位置分別朝向該基材的同一邊緣;該影像處理單元是定位出其中一影像中的底片邊界與影像中心線的一第一交點,與定位出另一影像中的底片邊界與影像中心線的一第二交點;該判斷單元是計算該第一交點及該第二交點之間的一距離、其中一影像中的基材邊緣與經過該第一交點並垂直底片邊界的一第一間距,及另一影像中的該基材邊緣與經過該第二交點並垂直該底片邊界之第二間距,且是藉由該距離、該第一間距及該第 二間距代入三角函式換算一偏移角度;該控制單元是依據該偏移角度驅動該調整機構以調整該基材的位置,使該第一間距大致等於該第二間距。In the alignment system of the present invention, the photographing positions of the photographing units are respectively directed to the same edge of the substrate; the image processing unit is to locate a first intersection of the film boundary and the image center line in one of the images, and positioning a second intersection of the film boundary in the other image and the center line of the image; the determining unit calculates a distance between the first intersection and the second intersection, and the edge of the substrate in one of the images passes through the first a first pitch of the intersection and the vertical film boundary, and a second pitch of the substrate edge in the other image and the second intersection and perpendicular to the boundary of the film, and the distance, the first pitch and The first The two pitches are substituted into the trigonometric function to convert an offset angle; the control unit drives the adjusting mechanism according to the offset angle to adjust the position of the substrate such that the first pitch is substantially equal to the second pitch.
較佳的,各該攝影單元的拍攝位置分別朝向該基材的上邊緣及下邊緣;該影像處理單元是分別定位出兩影像中的基材邊緣及底片邊界;該判斷單元是計算其中一影像的該基材邊緣及該底片邊界之間的上方間距,以及另一影像的該基材邊緣及該底片邊界之間的下方間距;該控制單元是依據該上方間距及該下方間距之差值調整該基材的位置,使該上方間距大致等於該下方間距。Preferably, the photographing positions of the photographing units are respectively directed to the upper edge and the lower edge of the substrate; the image processing unit respectively positions the edge of the substrate and the boundary of the film in the two images; the determining unit calculates one of the images The distance between the edge of the substrate and the boundary of the film, and the spacing between the edge of the substrate and the boundary of the film of another image; the control unit is adjusted according to the difference between the upper pitch and the lower pitch The substrate is positioned such that the upper spacing is substantially equal to the lower spacing.
較佳的,各該攝影單元的拍攝位置分別朝向該基材的左邊緣及右邊緣;該影像處理單元是分別定位出兩影像中的基材邊緣及底片邊界;該判斷單元是計算其中一影像的該基材邊緣及該底片邊界之間的左方間距,以及另一影像的該基材邊緣及該底片邊界之間的右方間距;該控制單元是依據該左方間距及該右方間距之差值調整該基材的位置,使該左方間距大致等於該右方間距。Preferably, the photographing positions of the photographing units are respectively directed to the left edge and the right edge of the substrate; the image processing unit respectively positions the edge of the substrate and the boundary of the film in the two images; the determining unit calculates one of the images The distance between the edge of the substrate and the left edge of the film, and the distance between the edge of the substrate of another image and the boundary of the film; the control unit is based on the left and the right The difference adjusts the position of the substrate such that the left spacing is approximately equal to the right spacing.
較佳的,該待曝光基材是一透明玻璃,該底片是對該透明玻璃之光阻進行曝光顯影。Preferably, the substrate to be exposed is a transparent glass, and the negative film is exposed and developed to the photoresist of the transparent glass.
本發明待曝光基材及底片的對位方法及系統之功效在於:無需特殊的對位標靶設計而可精確對位,且適用於透明材質的基材,確實可解決現有技術的缺失。The effect of the alignment method and system of the substrate and the film to be exposed in the invention is that the substrate can be precisely aligned without special alignment target design, and is suitable for the substrate of transparent material, and can indeed solve the defects of the prior art.
有關本發明之前述及其他技術內容、特點與功效,在以 下配合參考圖式之較佳實施例的詳細說明中,將可清楚的呈現。The foregoing and other technical contents, features and effects of the present invention are The detailed description of the preferred embodiment with reference to the drawings will be apparent.
參閱圖1,本發明之較佳實施例中,一待曝光基材5的影像檢測對位系統100包括至少二攝影單元1、一機台2、一調整機構3及一驅動設備4;其中,機台2包括一影像處理單元21、一記憶單元22、一判斷單元23及一控制單元24;驅動設備4包括控制調整機構3在X方向移動的二驅動模組411、413、控制調整機構3在Y方向移動的二驅動模組412、414及控制調整機構3微調在X-Y平面的轉動角度的一旋轉模組40。Referring to FIG. 1, in a preferred embodiment of the present invention, an image detecting and aligning system 100 for a substrate 5 to be exposed includes at least two photographic units 1, a machine 2, an adjusting mechanism 3, and a driving device 4; The machine 2 includes an image processing unit 21, a memory unit 22, a determining unit 23 and a control unit 24; the driving device 4 includes two driving modules 411, 413 for controlling the movement of the adjusting mechanism 3 in the X direction, and a control adjusting mechanism 3. The two driving modules 412 and 414 moving in the Y direction and the control adjusting mechanism 3 finely adjust a rotation module 40 at a rotation angle of the XY plane.
調整機構3是一驅動設備,並配置一透明材質(如:玻璃)的待曝光基材5及一用於對於該待曝光基材5的光阻進行曝光的底片6,其中,底片6受固定使其位置不發生變動,且基材5被夾持固定並可受控制調整基材5的位置以相對於底片6進行定位;攝影設備1可分別朝向同側或不同側的相異位置拍攝,本實施例中,攝影設備1具有一第一攝影單元11、一第二攝影單元12、一第三攝影單元13、一第四攝影單元14及一第五攝影單元15,且第一攝影單元11、第二攝影單元12、第三攝影單元13、第四攝影單元14及第五攝影單元15的拍攝視野涵蓋同方向(X方向或Y方向)的基材5的邊緣及底片6的邊界。The adjusting mechanism 3 is a driving device, and is configured with a transparent material (such as glass) to expose the substrate 5 and a negative film 6 for exposing the photoresist of the substrate 5 to be exposed, wherein the negative film 6 is fixed. The position of the substrate 5 is not fixed, and the substrate 5 is clamped and fixed and can be controlled to adjust the position of the substrate 5 to be positioned relative to the film 6; the photographing device 1 can be photographed toward different positions on the same side or on different sides, respectively. In this embodiment, the photographing apparatus 1 has a first photographing unit 11, a second photographing unit 12, a third photographing unit 13, a fourth photographing unit 14, and a fifth photographing unit 15, and the first photographing unit 11 The imaging fields of the second imaging unit 12, the third imaging unit 13, the fourth imaging unit 14, and the fifth imaging unit 15 cover the edges of the substrate 5 and the boundary of the negative film 6 in the same direction (X direction or Y direction).
然而,其他實施例中,亦可設計兩組攝影單元而不必動用到五組攝影單元11-15,例如:採用第一攝影單元11及第二攝影單元12在位置I及II進行角度的調整定位後,接 著,第一攝影單元11在同一位置I不動,以精密定位儀器控制第二攝影單元12到位置III進行X軸方向置中的調整定位,然後,再以精密定位儀器控制令第一攝影單元11及第二攝影單元12在位置IV及位置V進行Y軸方向置中的調整定位,因此,不以五組攝影單元11-15為限制。However, in other embodiments, two sets of photographing units may be designed without using five sets of photographing units 11-15, for example, using the first photographing unit 11 and the second photographing unit 12 to adjust the angles of the positions at positions I and II. After The first photographing unit 11 is not moved at the same position I, and the precise positioning instrument controls the second photographing unit 12 to the position III to perform the adjustment positioning in the X-axis direction. Then, the first photographing unit 11 is controlled by the precision positioning instrument. The second photographing unit 12 performs the adjustment positioning in the Y-axis direction at the position IV and the position V. Therefore, the five photographing units 11-15 are not limited.
參閱圖1及圖2,第一攝影單元11、第二攝影單元12是設置在朝向基材5的上方的同一邊緣51的位置I、II,第三攝影單元13、第四攝影單元14及第五攝影單元15是分別設置在相對於基材5的邊緣52的下方位置III、相對於基材5的邊緣53的左方位置IV、相對於基材5的邊緣54的右方位置V。Referring to FIGS. 1 and 2, the first photographing unit 11 and the second photographing unit 12 are positions I and II disposed at the same edge 51 above the substrate 5, and the third photographing unit 13, the fourth photographing unit 14, and the The five photographing units 15 are respectively disposed at a position III below the edge 52 of the substrate 5, a left position IV with respect to the edge 53 of the substrate 5, and a right position V with respect to the edge 54 of the substrate 5.
參閱圖3,配合圖1及圖2,為本發明待曝光基材及底片的對位方法之較佳實施例說明如下。Referring to FIG. 3, with reference to FIG. 1 and FIG. 2, a preferred embodiment of the method for aligning the substrate to be exposed and the film of the present invention is as follows.
步驟S60 :設置攝影裝置1與基材5的拍攝位置。 Step S60 : setting the photographing position of the photographing device 1 and the substrate 5.
接著,角度調整程序61可以使基材5的邊緣平行的對齊於底片6的邊緣,介紹如下。Next, the angle adjustment program 61 can align the edges of the substrate 5 in parallel with the edges of the backsheet 6, as described below.
步驟S611: 攝影設備1相對於基材5的同一邊緣上的兩相異位置拍攝至少二張影像。 Step S611: The photographing apparatus 1 captures at least two images with respect to two different positions on the same edge of the substrate 5.
參閱圖4,如圖1的第一攝影單元11、第二攝影單元12是朝向如圖2的同一邊緣上的兩相異位置I、II拍攝,第一攝影單元11的拍攝到一影像301的畫面範圍至少包括一基材邊緣511及一底片邊界611,另一第二攝影單元12拍攝到的另一影像302的畫面範圍至少包括與基材邊緣511屬於同一邊線上的另一基材邊緣512,以及與底片邊界611 屬於同一邊線上的的另一底片邊界612。Referring to FIG. 4, the first photographing unit 11 and the second photographing unit 12 of FIG. 1 are photographed toward two different positions I and II on the same edge as FIG. 2, and the first photographing unit 11 photographs an image 301. The screen range includes at least one substrate edge 511 and a film boundary 611, and the image range of the other image 302 captured by the other second camera unit 12 includes at least another substrate edge 512 belonging to the same edge as the substrate edge 511. , and the film boundary 611 Another negative film boundary 612 belonging to the same sideline.
步驟S612: 定位其中一影像301的基材邊緣511、底片邊界611及另一影像302的基材邊緣512、底片邊界612,然後,由機台2的記憶單元22加以儲存。影像處理單元21是藉由既定的影像辨識技術進行定位,既定的影像辨識技術是二值化、邊緣偵測或線條偵測等,關於二值化、邊緣偵測或線條偵測的技術為現有技術,在此不加以贅述。 Step S612: Position the substrate edge 511 of one of the images 301, the film boundary 611, and the substrate edge 512 and the film boundary 612 of the other image 302, and then store them by the memory unit 22 of the machine 2. The image processing unit 21 is positioned by a predetermined image recognition technology. The predetermined image recognition technology is binarization, edge detection or line detection. The technology for binarization, edge detection or line detection is existing. Technology will not be described here.
步驟S613 :影像處理單元21定位出影像301中的底片邊界611與影像中心線401的一第一交點P1 ,與定位出另一影像302中的底片邊界612與影像中心線402的一第二交點P2 。 Step S613 : The image processing unit 21 locates a first intersection P 1 of the film boundary 611 and the image center line 401 in the image 301, and locates a film boundary 612 and a second image center line 402 in the other image 302. Intersection point P 2 .
步驟S614 :判斷單元23計算第一交點P1 及第二交點P2 之間的一距離S、基材邊緣511與經過第一交點P1 並垂直底片邊界611的一第一間距d1 ,及基材邊緣512與經過第二交點P2 並垂直底片邊界612之第二間距d2 。 Step S614: a first determination unit 23 calculates the intersection P. 1 and a distance between the 2 S, and perpendicular to the substrate edges 511 and 611 of the backsheet through the first boundary point of intersection P P. 1 a second point of intersection of the first pitch d 1, and The substrate edge 512 is at a second pitch d 2 that passes through the second intersection P 2 and is perpendicular to the backsheet boundary 612.
步驟S615 :判斷單元23藉由距離S、第一間距d1 及第二間距d2 代入三角函式換算一偏移角度θ,即偏移角度θ=tan-1 ((d2 -d1 )/S)。 Step S615 : The determining unit 23 substitutes the distance S, the first spacing d 1 and the second spacing d 2 into the trigonometric conversion to an offset angle θ, that is, the offset angle θ=tan −1 ((d 2 -d 1 ) /S).
步驟S616 :控制單元24計算如何依據偏移角度θ調整基材5的位置,驅使驅動設備4使基材5的邊緣對齊底片6的邊緣,本實施例中,也就是使第一間距d1 大致等於第二間距d2 。 Step S616: The control unit 24 calculates how to adjust the position of the substrate θ 5 according to an offset angle, driven by the driving device 4 causes the edge of the substrate 5 is aligned with the edge of the backsheet 6, in this embodiment, i.e. the first spacing d 1 is substantially Equal to the second spacing d 2 .
接下來,是將基材5對齊於底片6的中央位置,本實施例中,藉由計算基材5及底片6兩者外圍的邊緣間距並平均 分配,就可達到精確定位的效果。Next, the substrate 5 is aligned at the center of the backsheet 6. In this embodiment, the edge spacing of the periphery of both the substrate 5 and the backsheet 6 is calculated and averaged. With the distribution, the effect of precise positioning can be achieved.
參閱圖5,本發明方法中,Y方向的間距調整程序S62的步驟S621-624及X方向的間距調整程序S63的步驟S631-634介紹如下。Referring to Fig. 5, in the method of the present invention, steps S621-624 of the pitch adjustment program S62 in the Y direction and steps S631-634 of the pitch adjustment program S63 in the X direction are described below.
步驟S621 :相對於基材邊緣51拍攝一上邊緣影像303及相對於基材邊緣52拍攝一下邊緣影像304。 Step S621 : an upper edge image 303 is taken with respect to the substrate edge 51 and an edge image 304 is taken with respect to the substrate edge 52.
參閱圖1、圖2及圖6,第二攝影單元12及第三攝影單元13朝向在基材5的上下兩相對側邊的位置II、III,相對於基材邊緣51拍攝一上邊緣影像303及相對於基材邊緣52拍攝一下邊緣影像304。需說明的是,也可以使用第一攝影單元11配合第三攝影單元13,不限於第二攝影單元12及第三攝影單元13之組合方式。Referring to FIG. 1 , FIG. 2 and FIG. 6 , the second photographing unit 12 and the third photographing unit 13 are directed to the upper edge image 303 with respect to the substrate edge 51 at positions II and III on the upper and lower opposite sides of the substrate 5 . The edge image 304 is taken with respect to the edge 52 of the substrate. It should be noted that the first photographing unit 11 may be used in conjunction with the third photographing unit 13, and is not limited to the combination of the second photographing unit 12 and the third photographing unit 13.
另外,第二攝影單元12及第三攝影單元13在如圖4的位置II、III亦可同時拍攝到相對於基材5之光阻進行曝光顯影的底片邊界61’及底片邊界62’。Further, the second photographing unit 12 and the third photographing unit 13 can simultaneously photograph the film boundary 61' and the film boundary 62' which are exposed and developed with respect to the photoresist of the substrate 5 at positions II and III in Fig. 4 .
因此,如圖6的上邊緣影像303包括基材邊緣51’及底片邊界61’,下邊緣影像304包括基材邊緣52’及底片邊界62’。Thus, the upper edge image 303 of Figure 6 includes a substrate edge 51' and a backsheet boundary 61', and the lower edge image 304 includes a substrate edge 52' and a backsheet boundary 62'.
步驟S622 :影像處理單元21藉由既定的影像辨識技術定位上邊緣影像303中的基材邊緣51’、底片邊界61’及下邊緣影像304中的基材邊緣52’、底片邊界62’,然後,由機台2的記憶單元22加以儲存。 Step S622 : the image processing unit 21 locates the substrate edge 51', the film boundary 61', and the substrate edge 52' in the lower edge image 304, the film boundary 62' in the upper edge image 303 by a predetermined image recognition technology, and then Stored by the memory unit 22 of the machine 2.
步驟S623 :判斷單元23計算基材邊緣51’距離底片邊界61’的一上方間距dy1 ,以及計算基材邊緣52’距離底片邊 界62’的一下方間距dy2 ,並藉此計算上方間距dy1 及下方間距dy2 的差值。 Step S623 : the judging unit 23 calculates an upper distance d y1 of the substrate edge 51 ′ from the film boundary 61 ′, and calculates a lower distance d y2 of the substrate edge 52 ′ from the film boundary 62 ′, and thereby calculates the upper spacing d The difference between y1 and the spacing d y2 below.
步驟S624 :控制單元24依據上方間距dy1 及下方間距dy2 的差值調整基材5及底片6的相對位置,使上方間距dy1 大致等於下方間距dy2 ;例如,機台2可控制Y方向之驅動模組412、414,使基材5的邊緣對齊預定位置。 Step S624 : The control unit 24 adjusts the relative positions of the substrate 5 and the negative film 6 according to the difference between the upper spacing d y1 and the lower spacing d y2 such that the upper spacing d y1 is substantially equal to the lower spacing d y2 ; for example, the machine 2 can control Y The direction drive modules 412, 414 align the edges of the substrate 5 with a predetermined position.
參閱圖3,並配合圖1及圖7,本發明方法中,X方向的間距調整程序S63包含的步驟介紹如下。Referring to Fig. 3, and in conjunction with Figs. 1 and 7, in the method of the present invention, the steps included in the X-direction spacing adjustment program S63 are as follows.
步驟S631 :相對於基材的左邊緣拍攝一左邊緣影像及相對於基材的右邊緣拍攝一右邊緣影像;第四攝影單元14及第五攝影單元15分別朝向在基材5的左右兩相對側邊的位置IV、V,相對於基材邊緣53拍攝一左邊緣影像305及相對於基材邊緣54拍攝一右邊緣影像306(如圖7)。另外,第四攝影單元14及第五攝影單元15在位置IV、V亦可同時拍攝到相對於基材5之光阻進行曝光顯影的底片邊界63及右邊界64,因此,如圖7的左邊緣影像305包括基材邊緣53及底片邊界63;如圖7的右邊緣影像306包括基材邊緣54及底片邊界64。 Step S631 : photographing a left edge image with respect to the left edge of the substrate and capturing a right edge image with respect to the right edge of the substrate; the fourth photographing unit 14 and the fifth photographing unit 15 respectively face the left and right sides of the substrate 5 The side positions IV, V, a left edge image 305 is taken relative to the substrate edge 53 and a right edge image 306 is taken relative to the substrate edge 54 (Fig. 7). In addition, the fourth photographing unit 14 and the fifth photographing unit 15 can simultaneously capture the film boundary 63 and the right border 64 of the exposure and development with respect to the photoresist of the substrate 5 at the positions IV and V, and thus, as shown in FIG. 7 The edge image 305 includes a substrate edge 53 and a backsheet border 63; the right edge image 306 of FIG. 7 includes a substrate edge 54 and a backsheet boundary 64.
步驟S632 :影像處理單元21藉由既定的影像辨識技術定位左邊緣影像305的拍攝畫面中的基材邊緣53’及右邊緣影像306的拍攝畫面中的基材邊緣54’,然後,由機台2的記憶單元22加以儲存。 Step S632 : The image processing unit 21 locates the substrate edge 53' and the substrate edge 54' in the captured image of the right edge image 306 in the captured image of the left edge image 305 by a predetermined image recognition technology, and then, by the machine The memory unit 22 of 2 is stored.
步驟S633 :判斷單元23計算左方的基材邊緣53’距離左方的底片邊界63’的一左方間距dx1 ,以及計算右方的基 材邊緣54’距離右方的底片邊界64’的一右方間距dx2 ,並藉此計算左方間距dx1 及右方間距dx2 的差值。 Step S633: judging unit 23 calculates the left edge of the substrate 53 'from the left boundary of the backsheet 63' of a left distance d x1, and calculating the right edge of the substrate 54 'from the right boundary of the backsheet 64' A right-hand spacing d x2 , and thereby calculating the difference between the left-hand spacing d x1 and the right-hand spacing d x2 .
步驟S634 :控制單元24依據左方間距dx1 及右方間距dx2 的差值調整基材5及底片6的相對位置,使左方間距dx1 大致等於右方間距dx2 ;例如,機台2可控制X方向之驅動模組411、413,使基材5的邊緣對齊預定位置。 Step S634 : The control unit 24 adjusts the relative positions of the substrate 5 and the film 6 according to the difference between the left distance d x1 and the right distance d x2 such that the left distance d x1 is substantially equal to the right distance d x2 ; for example, the machine 2 The X-direction drive modules 411, 413 can be controlled to align the edges of the substrate 5 with a predetermined position.
步驟S64: 完成前述步驟後,就可進行曝光程序。 Step S64: After the foregoing steps are completed, the exposure process can be performed.
綜上所述,本發明待曝光基材5及底片6的對位方法及系統100之功效在於:藉由拍攝基材5及底片6的兩相異位置的影像,配合兩影像中的基材邊緣及底片邊界計算偏移量,然後利用例如角度或間距的偏移量來驅動調整機構3以調整基材5旋轉或位移,因此無需特殊的對位標靶設計而可精確對位,且適用於透明材質的基材5,可解決現有技術的缺失,故確實能達成本發明之目的。In summary, the method and system 100 for aligning the substrate 5 and the film 6 to be exposed according to the present invention have the effect of matching the substrates in the two images by capturing images of the two different positions of the substrate 5 and the film 6. The edge and the film boundary calculate the offset, and then the adjustment mechanism 3 is driven by an offset such as an angle or a pitch to adjust the rotation or displacement of the substrate 5, so that the alignment can be accurately aligned without a special alignment target design, and is applicable. The substrate 5 of a transparent material can solve the defects of the prior art, and thus the object of the present invention can be achieved.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
100‧‧‧影像檢測對位系統100‧‧‧Image Detection Alignment System
1‧‧‧攝影設備1‧‧‧Photographic equipment
11‧‧‧第一攝影單元11‧‧‧ first photography unit
12‧‧‧第二攝影單元12‧‧‧Second photography unit
13‧‧‧第三攝影單元13‧‧‧ third photography unit
14‧‧‧第四攝影單元14‧‧‧Fourth photography unit
15‧‧‧第五攝影單元15‧‧‧Fifth photography unit
2‧‧‧機台2‧‧‧ machine
21‧‧‧影像處理單元21‧‧‧Image Processing Unit
22‧‧‧記憶單元22‧‧‧ memory unit
23‧‧‧判斷單元23‧‧‧judging unit
24‧‧‧控制單元24‧‧‧Control unit
3‧‧‧調整機構3‧‧‧Adjustment agency
301-306‧‧‧影像301-306‧‧‧Image
4‧‧‧驅動設備4‧‧‧Drive equipment
40‧‧‧旋轉模組40‧‧‧Rotary Module
401、402‧‧‧影像中心線401, 402‧‧‧ image center line
411、412、413、414411, 412, 413, 414
‧‧‧驅動模組‧‧‧Drive Module
5‧‧‧基材5‧‧‧Substrate
51-54、51’-54’‧‧‧基材邊緣51-54, 51’-54’‧‧‧ ‧ edge of the substrate
6‧‧‧底片6‧‧‧ negative film
61-64、61’-64’‧‧‧底片邊界61-64, 61’-64’‧‧‧ negative film boundary
611-612‧‧‧邊緣611-612‧‧‧ edge
S60‧‧‧步驟S60‧‧ steps
S61‧‧‧步驟S61‧‧‧ steps
S611-S614‧‧‧步驟S611-S614‧‧‧Steps
S62‧‧‧步驟S62‧‧‧Steps
S621-S624‧‧‧步驟S621-S624‧‧‧Steps
S63‧‧‧步驟S63‧‧‧ steps
S631-S634‧‧‧步驟S631-S634‧‧‧Steps
圖1是一示意圖,說明本發明的待曝光基材及底片的影像檢測對位系統的較佳實施例;圖2是一示意圖,說明本發明的較佳實施例中的攝影設備的拍攝位置;圖3是一流程圖,說明本發明的待曝光基材及底片的對 位方法的角度調整程序;圖4是一示意圖,說明本發明的較佳實施例中,計算偏移角度所需的相關參數;圖5是一流程圖,說明本發明的待曝光基材及底片的對位方法中對齊X方向及Y方向的預定位置的程序;圖6是一示意圖,說明本發明的較佳實施例中,計算Y方向位移所需的相關參數;及圖7是一示意圖,說明本發明的較佳實施例中,計算X方向位移所需的相關參數。1 is a schematic view showing a preferred embodiment of an image detecting alignment system of a substrate and a film to be exposed according to the present invention; and FIG. 2 is a schematic view showing a photographing position of the photographing apparatus in the preferred embodiment of the present invention; Figure 3 is a flow chart showing the pair of substrate and film to be exposed of the present invention The angle adjustment procedure of the bit method; FIG. 4 is a schematic diagram illustrating the relevant parameters required to calculate the offset angle in the preferred embodiment of the present invention; FIG. 5 is a flow chart illustrating the substrate and the negative film to be exposed of the present invention. The program for aligning the predetermined positions in the X direction and the Y direction in the alignment method; FIG. 6 is a schematic view showing the relevant parameters required for calculating the displacement in the Y direction in the preferred embodiment of the present invention; and FIG. 7 is a schematic diagram, In the preferred embodiment of the invention, the relevant parameters required for the displacement in the X direction are calculated.
S60、S61‧‧‧步驟S60, S61‧‧‧ steps
S611-S614‧‧‧步驟S611-S614‧‧‧Steps
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Publication number | Priority date | Publication date | Assignee | Title |
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TW200606596A (en) * | 2004-06-25 | 2006-02-16 | Nikon Corp | Aligning apparatus, aligning method, exposure apparatus, exposure method and device manufacturing method |
US20100084950A1 (en) * | 2008-10-06 | 2010-04-08 | Sanyo Denki Co., Ltd. | Brushless motor stator |
TW201129883A (en) * | 2009-06-29 | 2011-09-01 | V Technology Co Ltd | Alignment method, alignment apparatus and exposure apparatus |
US20130182234A1 (en) * | 2010-09-30 | 2013-07-18 | Carl Zeiss Smt Gmbh | Projection Exposure System and Projection Exposure Method |
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US20100084950A1 (en) * | 2008-10-06 | 2010-04-08 | Sanyo Denki Co., Ltd. | Brushless motor stator |
TW201129883A (en) * | 2009-06-29 | 2011-09-01 | V Technology Co Ltd | Alignment method, alignment apparatus and exposure apparatus |
US20130182234A1 (en) * | 2010-09-30 | 2013-07-18 | Carl Zeiss Smt Gmbh | Projection Exposure System and Projection Exposure Method |
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