TWI475339B - Method and system for positioning a substrate to be exposed and a film - Google Patents

Description

Method and system for aligning substrate and film to be exposed

The invention relates to an image detection alignment method and system, in particular to a method and a system for aligning a substrate to be exposed and a film to be accurately aligned without special alignment target design.

High-end electronic products such as mobile phones, LCD monitors, tablets, camera devices, personal digital assistants, etc., the display line design of the screen is becoming more and more sophisticated, and the precision requirements of many processes are also more stringent. For example, the exposure process is mostly artificial. The visual alignment method will be difficult to cope with the more stringent requirements of the future. In addition, the special alignment target pattern of a cross, a circle or a square is currently not applicable to a transparent substrate such as a touch panel.

Accordingly, it is an object of the present invention to provide a method and system for aligning a substrate to be exposed and a film to be accurately aligned without the need for a special alignment target design.

Another object of the present invention is to provide a method and system for aligning a substrate to be exposed and a film suitable for a transparent material.

Therefore, the alignment method of the substrate to be exposed and the film of the present invention is operated by matching at least two photographic units, an adjusting mechanism and a control device, and the adjusting mechanism is controlled by the control device to adjust the relative position of the substrate and the film. The method comprises the following steps: (a) each of the photographing units respectively captures an image, the field of view of each image includes a substrate edge and a film boundary; (b) the control device positions the substrate in the two images Edge and film boundary; (c) the control device Calculating an offset according to the edge of the substrate and the boundary of the film; and (d) the control device drives the adjustment mechanism according to the offset, thereby adjusting the relative position of the substrate and the film to make the substrate And the backsheets are aligned with one another.

In the first embodiment of the method for aligning the substrate to be exposed and the film of the present invention, the photographing positions of the photographing units are respectively directed to the same edge of the substrate, and the detailed steps of the control device are as follows: step (b) is positioning a first intersection of the film boundary and the image center line in one of the images, and a second intersection of the film boundary and the image center line in the other image; step (c) is to calculate the first intersection and the first a distance between two intersections, a first spacing of the substrate edge in one of the images and a boundary between the first intersection and the vertical film, and an edge of the substrate in the other image passing through the second intersection and perpendicular a second pitch of the boundary of the film, wherein the distance, the first pitch and the second pitch are substituted into a trigonometric conversion offset angle; and the step (d) drives the adjustment mechanism according to the offset angle to adjust The substrate is positioned such that the first spacing is substantially equal to the second spacing.

In the second embodiment of the method for aligning the substrate to be exposed and the film of the present invention, the photographing positions of the photographing units are respectively directed toward the upper edge and the lower edge of the substrate, and the detailed steps of the control device are as follows: step (b) Positioning the edge of the substrate and the boundary of the film in the two images respectively; step (c) is calculating the upper spacing between the edge of the substrate of one image and the boundary of the film, and the edge of the substrate of another image and The spacing between the lower edges of the film; and the step (d) is to adjust the position of the substrate according to the difference between the upper pitch and the lower pitch such that the upper pitch is substantially equal to the lower pitch.

Third embodiment of the method for aligning a substrate to be exposed and a film of the present invention The photographing positions of the photographing units are respectively directed to the left and right edges of the substrate, and the detailed steps of the control device are as follows: step (b) is to respectively locate the edge of the substrate and the boundary of the film in the two images; c) calculating the left-hand spacing between the edge of the substrate and the boundary of the film of one of the images, and the distance between the edge of the substrate of the other image and the boundary of the film; and step (d) is based on The difference between the left spacing and the right spacing adjusts the position of the substrate such that the left spacing is approximately equal to the right spacing.

The alignment system of the present invention comprises: an adjustment mechanism controlled to adjust the relative position of the substrate and the negative film; at least two photographic units respectively capturing an image, and the field of view of each of the images includes a substrate edge and a And a control device electrically connected to the adjusting mechanism and each of the photographing units, the control device having: an image processing unit positioning the edge of the substrate and the boundary of the film in the two images, and a determining unit according to the base An offset is calculated between the edge of the material and the boundary of the film, and a control unit drives the adjustment mechanism according to the offset, thereby adjusting the relative positions of the substrate and the film to align the substrate and the film with each other.

In the alignment system of the present invention, the photographing positions of the photographing units are respectively directed to the same edge of the substrate; the image processing unit is to locate a first intersection of the film boundary and the image center line in one of the images, and positioning a second intersection of the film boundary in the other image and the center line of the image; the determining unit calculates a distance between the first intersection and the second intersection, and the edge of the substrate in one of the images passes through the first a first pitch of the intersection and the vertical film boundary, and a second pitch of the substrate edge in the other image and the second intersection and perpendicular to the boundary of the film, and the distance, the first pitch and The first The two pitches are substituted into the trigonometric function to convert an offset angle; the control unit drives the adjusting mechanism according to the offset angle to adjust the position of the substrate such that the first pitch is substantially equal to the second pitch.

Preferably, the photographing positions of the photographing units are respectively directed to the upper edge and the lower edge of the substrate; the image processing unit respectively positions the edge of the substrate and the boundary of the film in the two images; the determining unit calculates one of the images The distance between the edge of the substrate and the boundary of the film, and the spacing between the edge of the substrate and the boundary of the film of another image; the control unit is adjusted according to the difference between the upper pitch and the lower pitch The substrate is positioned such that the upper spacing is substantially equal to the lower spacing.

Preferably, the photographing positions of the photographing units are respectively directed to the left edge and the right edge of the substrate; the image processing unit respectively positions the edge of the substrate and the boundary of the film in the two images; the determining unit calculates one of the images The distance between the edge of the substrate and the left edge of the film, and the distance between the edge of the substrate of another image and the boundary of the film; the control unit is based on the left and the right The difference adjusts the position of the substrate such that the left spacing is approximately equal to the right spacing.

Preferably, the substrate to be exposed is a transparent glass, and the negative film is exposed and developed to the photoresist of the transparent glass.

The effect of the alignment method and system of the substrate and the film to be exposed in the invention is that the substrate can be precisely aligned without special alignment target design, and is suitable for the substrate of transparent material, and can indeed solve the defects of the prior art.

The foregoing and other technical contents, features and effects of the present invention are The detailed description of the preferred embodiment with reference to the drawings will be apparent.

Referring to FIG. 1, in a preferred embodiment of the present invention, an image detecting and aligning system 100 for a substrate 5 to be exposed includes at least two photographic units 1, a machine 2, an adjusting mechanism 3, and a driving device 4; The machine 2 includes an image processing unit 21, a memory unit 22, a determining unit 23 and a control unit 24; the driving device 4 includes two driving modules 411, 413 for controlling the movement of the adjusting mechanism 3 in the X direction, and a control adjusting mechanism 3. The two driving modules 412 and 414 moving in the Y direction and the control adjusting mechanism 3 finely adjust a rotation module 40 at a rotation angle of the XY plane.

The adjusting mechanism 3 is a driving device, and is configured with a transparent material (such as glass) to expose the substrate 5 and a negative film 6 for exposing the photoresist of the substrate 5 to be exposed, wherein the negative film 6 is fixed. The position of the substrate 5 is not fixed, and the substrate 5 is clamped and fixed and can be controlled to adjust the position of the substrate 5 to be positioned relative to the film 6; the photographing device 1 can be photographed toward different positions on the same side or on different sides, respectively. In this embodiment, the photographing apparatus 1 has a first photographing unit 11, a second photographing unit 12, a third photographing unit 13, a fourth photographing unit 14, and a fifth photographing unit 15, and the first photographing unit 11 The imaging fields of the second imaging unit 12, the third imaging unit 13, the fourth imaging unit 14, and the fifth imaging unit 15 cover the edges of the substrate 5 and the boundary of the negative film 6 in the same direction (X direction or Y direction).

However, in other embodiments, two sets of photographing units may be designed without using five sets of photographing units 11-15, for example, using the first photographing unit 11 and the second photographing unit 12 to adjust the angles of the positions at positions I and II. After The first photographing unit 11 is not moved at the same position I, and the precise positioning instrument controls the second photographing unit 12 to the position III to perform the adjustment positioning in the X-axis direction. Then, the first photographing unit 11 is controlled by the precision positioning instrument. The second photographing unit 12 performs the adjustment positioning in the Y-axis direction at the position IV and the position V. Therefore, the five photographing units 11-15 are not limited.

Referring to FIGS. 1 and 2, the first photographing unit 11 and the second photographing unit 12 are positions I and II disposed at the same edge 51 above the substrate 5, and the third photographing unit 13, the fourth photographing unit 14, and the The five photographing units 15 are respectively disposed at a position III below the edge 52 of the substrate 5, a left position IV with respect to the edge 53 of the substrate 5, and a right position V with respect to the edge 54 of the substrate 5.

Referring to FIG. 3, with reference to FIG. 1 and FIG. 2, a preferred embodiment of the method for aligning the substrate to be exposed and the film of the present invention is as follows.

Step S60 : setting the photographing position of the photographing device 1 and the substrate 5.

Next, the angle adjustment program 61 can align the edges of the substrate 5 in parallel with the edges of the backsheet 6, as described below.

Step S611: The photographing apparatus 1 captures at least two images with respect to two different positions on the same edge of the substrate 5.

Referring to FIG. 4, the first photographing unit 11 and the second photographing unit 12 of FIG. 1 are photographed toward two different positions I and II on the same edge as FIG. 2, and the first photographing unit 11 photographs an image 301. The screen range includes at least one substrate edge 511 and a film boundary 611, and the image range of the other image 302 captured by the other second camera unit 12 includes at least another substrate edge 512 belonging to the same edge as the substrate edge 511. , and the film boundary 611 Another negative film boundary 612 belonging to the same sideline.

Step S612: Position the substrate edge 511 of one of the images 301, the film boundary 611, and the substrate edge 512 and the film boundary 612 of the other image 302, and then store them by the memory unit 22 of the machine 2. The image processing unit 21 is positioned by a predetermined image recognition technology. The predetermined image recognition technology is binarization, edge detection or line detection. The technology for binarization, edge detection or line detection is existing. Technology will not be described here.

Step S613 : The image processing unit 21 locates a first intersection P ₁ of the film boundary 611 and the image center line 401 in the image 301, and locates a film boundary 612 and a second image center line 402 in the other image 302. Intersection point P ₂ .

Step S614: a first determination unit 23 calculates the intersection _{P. 1} and a distance between the ₂ S, and perpendicular to the substrate edges 511 and 611 of the backsheet through the first boundary point of intersection P _{P. 1} a second point of intersection of the first pitch d _1, and The substrate edge 512 is at a second pitch d _{2 that} passes through the second intersection P ₂ and is perpendicular to the backsheet boundary 612.

Step S615 : The determining unit 23 substitutes the distance S, the first spacing d ₁ and the second spacing d ₂ into the trigonometric conversion to an offset angle θ, that is, the offset angle θ=tan ⁻¹ ((d ₂ -d ₁ ) /S).

Step S616: The control unit 24 calculates how to adjust the position of the substrate θ 5 according to an offset angle, driven by the driving device 4 causes the edge of the substrate 5 is aligned with the edge of the backsheet 6, in this embodiment, i.e. the first spacing d ₁ is substantially Equal to the second spacing d ₂ .

Next, the substrate 5 is aligned at the center of the backsheet 6. In this embodiment, the edge spacing of the periphery of both the substrate 5 and the backsheet 6 is calculated and averaged. With the distribution, the effect of precise positioning can be achieved.

Referring to Fig. 5, in the method of the present invention, steps S621-624 of the pitch adjustment program S62 in the Y direction and steps S631-634 of the pitch adjustment program S63 in the X direction are described below.

Step S621 : an upper edge image 303 is taken with respect to the substrate edge 51 and an edge image 304 is taken with respect to the substrate edge 52.

Referring to FIG. 1 , FIG. 2 and FIG. 6 , the second photographing unit 12 and the third photographing unit 13 are directed to the upper edge image 303 with respect to the substrate edge 51 at positions II and III on the upper and lower opposite sides of the substrate 5 . The edge image 304 is taken with respect to the edge 52 of the substrate. It should be noted that the first photographing unit 11 may be used in conjunction with the third photographing unit 13, and is not limited to the combination of the second photographing unit 12 and the third photographing unit 13.

Further, the second photographing unit 12 and the third photographing unit 13 can simultaneously photograph the film boundary 61' and the film boundary 62' which are exposed and developed with respect to the photoresist of the substrate 5 at positions II and III in Fig. 4 .

Thus, the upper edge image 303 of Figure 6 includes a substrate edge 51' and a backsheet boundary 61', and the lower edge image 304 includes a substrate edge 52' and a backsheet boundary 62'.

Step S622 : the image processing unit 21 locates the substrate edge 51', the film boundary 61', and the substrate edge 52' in the lower edge image 304, the film boundary 62' in the upper edge image 303 by a predetermined image recognition technology, and then Stored by the memory unit 22 of the machine 2.

Step S623 : the judging unit 23 calculates an upper distance d _{y1 of the} substrate edge 51 ′ from the film boundary 61 ′, and calculates a lower distance d _{y2 of the} substrate edge 52 ′ from the film boundary 62 ′, and thereby calculates the upper spacing d The difference between _y1 and the spacing d _y2 below.

Step S624 : The control unit 24 adjusts the relative positions of the substrate 5 and the negative film 6 according to the difference between the upper spacing d _y1 and the lower spacing d _y2 such that the upper spacing d _y1 is substantially equal to the lower spacing d _y2 ; for example, the machine 2 can control Y The direction drive modules 412, 414 align the edges of the substrate 5 with a predetermined position.

Referring to Fig. 3, and in conjunction with Figs. 1 and 7, in the method of the present invention, the steps included in the X-direction spacing adjustment program S63 are as follows.

Step S631 : photographing a left edge image with respect to the left edge of the substrate and capturing a right edge image with respect to the right edge of the substrate; the fourth photographing unit 14 and the fifth photographing unit 15 respectively face the left and right sides of the substrate 5 The side positions IV, V, a left edge image 305 is taken relative to the substrate edge 53 and a right edge image 306 is taken relative to the substrate edge 54 (Fig. 7). In addition, the fourth photographing unit 14 and the fifth photographing unit 15 can simultaneously capture the film boundary 63 and the right border 64 of the exposure and development with respect to the photoresist of the substrate 5 at the positions IV and V, and thus, as shown in FIG. 7 The edge image 305 includes a substrate edge 53 and a backsheet border 63; the right edge image 306 of FIG. 7 includes a substrate edge 54 and a backsheet boundary 64.

Step S632 : The image processing unit 21 locates the substrate edge 53' and the substrate edge 54' in the captured image of the right edge image 306 in the captured image of the left edge image 305 by a predetermined image recognition technology, and then, by the machine The memory unit 22 of 2 is stored.

Step S633: judging unit 23 calculates the left edge of the substrate 53 'from the left boundary of the backsheet 63' of a left distance d _x1, and calculating the right edge of the substrate 54 'from the right boundary of the backsheet 64' A right-hand spacing d _x2 , and thereby calculating the difference between the left-hand spacing d _x1 and the right-hand spacing d _x2 .

Step S634 : The control unit 24 adjusts the relative positions of the substrate 5 and the film 6 according to the difference between the left distance d _x1 and the right distance d _x2 such that the left distance d _x1 is substantially equal to the right distance d _x2 ; for example, the machine 2 The X-direction drive modules 411, 413 can be controlled to align the edges of the substrate 5 with a predetermined position.

Step S64: After the foregoing steps are completed, the exposure process can be performed.

In summary, the method and system 100 for aligning the substrate 5 and the film 6 to be exposed according to the present invention have the effect of matching the substrates in the two images by capturing images of the two different positions of the substrate 5 and the film 6. The edge and the film boundary calculate the offset, and then the adjustment mechanism 3 is driven by an offset such as an angle or a pitch to adjust the rotation or displacement of the substrate 5, so that the alignment can be accurately aligned without a special alignment target design, and is applicable. The substrate 5 of a transparent material can solve the defects of the prior art, and thus the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

100‧‧‧Image Detection Alignment System

1‧‧‧Photographic equipment

11‧‧‧ first photography unit

12‧‧‧Second photography unit

13‧‧‧ third photography unit

14‧‧‧Fourth photography unit

15‧‧‧Fifth photography unit

2‧‧‧ machine

21‧‧‧Image Processing Unit

22‧‧‧ memory unit

23‧‧‧judging unit

24‧‧‧Control unit

3‧‧‧Adjustment agency

301-306‧‧‧Image

4‧‧‧Drive equipment

40‧‧‧Rotary Module

401, 402‧‧‧ image center line

411, 412, 413, 414

‧‧‧Drive Module

5‧‧‧Substrate

51-54, 51’-54’‧‧‧ ‧ edge of the substrate

6‧‧‧ negative film

61-64, 61’-64’‧‧‧ negative film boundary

611-612‧‧‧ edge

S60‧‧ steps

S61‧‧‧ steps

S611-S614‧‧‧Steps

S62‧‧‧Steps

S621-S624‧‧‧Steps

S63‧‧‧ steps

S631-S634‧‧‧Steps

1 is a schematic view showing a preferred embodiment of an image detecting alignment system of a substrate and a film to be exposed according to the present invention; and FIG. 2 is a schematic view showing a photographing position of the photographing apparatus in the preferred embodiment of the present invention; Figure 3 is a flow chart showing the pair of substrate and film to be exposed of the present invention The angle adjustment procedure of the bit method; FIG. 4 is a schematic diagram illustrating the relevant parameters required to calculate the offset angle in the preferred embodiment of the present invention; FIG. 5 is a flow chart illustrating the substrate and the negative film to be exposed of the present invention. The program for aligning the predetermined positions in the X direction and the Y direction in the alignment method; FIG. 6 is a schematic view showing the relevant parameters required for calculating the displacement in the Y direction in the preferred embodiment of the present invention; and FIG. 7 is a schematic diagram, In the preferred embodiment of the invention, the relevant parameters required for the displacement in the X direction are calculated.

S60, S61‧‧‧ steps

S611-S614‧‧‧Steps

Claims (9)

A method for aligning a substrate to be exposed and a film, working with at least two photographic units, an adjusting mechanism and a control device, the adjusting mechanism being controlled by the control device to adjust the relative position of the substrate and the film, the method comprising The following steps are: (a) each of the photographing units respectively captures an image, and the field of view of each of the images includes a substrate edge and a film boundary; (b) the control device positions the substrate edge and the film in the two images. (c) the control device calculates an offset according to the edge of the substrate and the boundary of the film; and (d) the control device drives the adjustment mechanism according to the offset, thereby adjusting the substrate and the film The relative position is such that the substrate and the backsheet are aligned with each other. According to the method for aligning the substrate to be exposed and the film according to claim 1, wherein the photographing positions of the photographing units are respectively directed to the same edge of the substrate, the detailed steps of the control device are as follows: Step (b) Is to locate a first intersection of the film boundary in one of the images and the center line of the image, and to locate a second intersection of the film boundary and the image center line in the other image; step (c) is to calculate the first a distance between the intersection point and the second intersection point, a first spacing of the substrate edge in one of the images and a boundary between the first intersection and the vertical film, and the edge of the substrate in the other image a second intersection and a second spacing of the boundary of the film, and by the distance Offset, the first pitch and the second pitch are substituted into a trigonometric conversion offset angle; and step (d) drives the adjustment mechanism to adjust the position of the substrate according to the offset angle. According to the method for aligning the substrate to be exposed and the film according to claim 1, wherein the photographing positions of the photographing units are respectively directed to the upper edge and the lower edge of the substrate, the detailed steps of the control device are as follows: Step (b) is to respectively locate the edge of the substrate and the boundary of the film in the two images; and step (c) is to calculate the distance between the edge of the substrate of one image and the boundary of the film, and the base of another image The spacing between the edge of the material and the boundary of the film; and step (d) is to adjust the position of the substrate according to the difference between the upper pitch and the lower pitch such that the upper pitch is substantially equal to the lower pitch. According to the method for aligning the substrate to be exposed and the film according to claim 1, wherein the photographing positions of the photographing units are respectively directed to the left and right edges of the substrate, the detailed steps of the control device are as follows: Step (b) is to respectively locate the edge of the substrate and the boundary of the film in the two images; and step (c) is to calculate the left margin between the edge of the substrate of one image and the boundary of the film, and the image of another image a distance between the edge of the substrate and the boundary between the edges of the film; and step (d) is to adjust the position of the substrate according to the difference between the distance between the left side and the distance between the right side, such that the left distance is substantially equal to the right side spacing. An image detecting and aligning system for a substrate and a film to be exposed, the system comprising: an adjusting mechanism controlled to adjust a relative position of the substrate and the film; at least two photographic units respectively capturing an image, each of the images The field of view includes a substrate edge and a film boundary; and a control device electrically connected to the adjustment mechanism and each of the camera units, having: an image processing unit that positions the edge of the substrate and the boundary of the film in the two images, a determining unit, calculating an offset according to the edge of the substrate and the boundary of the film, and a control unit driving the adjusting mechanism according to the offset, thereby adjusting the relative position of the substrate and the film to make the base The material and the backsheet are aligned with each other. The image detecting and aligning system of the substrate to be exposed and the film according to claim 5, wherein the photographing positions of the photographing units are respectively directed to the same edge of the substrate; the image processing unit is positioned one of the a first intersection of the film boundary and the image center line in the image, and a second intersection of the film boundary and the image center line in the other image; the determining unit calculates the first intersection and the second intersection a distance therebetween, a first spacing of the substrate edge in one of the images and a boundary between the first intersection and the vertical film, and the edge and the edge of the substrate in the other image Passing the second intersection and perpendicular to the second spacing of the boundary of the film, and substituting the distance, the first spacing and the second spacing into a trigonometric conversion offset angle; and the control unit is based on the offset The adjustment mechanism is angled to adjust the position of the substrate. The image detecting and aligning system of the substrate to be exposed and the film according to claim 5, wherein the photographing positions of the photographing units are respectively directed to the upper edge and the lower edge of the substrate; the image processing unit is respectively Positioning the edge of the substrate and the boundary of the film in the two images; the determining unit is to calculate the upper spacing between the edge of the substrate and the boundary of the film of one of the images, and the edge of the substrate of the other image and the boundary of the film The spacing between the lower portions; and the control unit adjusts the position of the substrate according to the difference between the upper pitch and the lower pitch such that the upper pitch is substantially equal to the lower pitch. The image detecting and aligning system of the substrate and the film to be exposed according to the fifth aspect of the patent application, wherein the shooting positions of the respective shooting units are respectively directed to the left and right edges of the substrate, and the image processing units are respectively Positioning the edge of the substrate and the boundary of the film in the two images; the determining unit is to calculate the left spacing between the edge of the substrate and the boundary of the film of one of the images, and the edge of the substrate and the bottom of the other image The right spacing between the slice boundaries; and the control unit adjusts the position of the substrate according to the difference between the left spacing and the right spacing such that the left spacing is approximately equal to the right spacing. The image detecting alignment system of the substrate to be exposed and the film according to any one of claims 5 to 8, wherein the substrate to be exposed is a transparent glass, and the negative film is light of the transparent glass. Resistance to exposure and development.