TWI472052B - - Google Patents

Info

Publication number
TWI472052B
TWI472052B TW97133011A TW97133011A TWI472052B TW I472052 B TWI472052 B TW I472052B TW 97133011 A TW97133011 A TW 97133011A TW 97133011 A TW97133011 A TW 97133011A TW I472052 B TWI472052 B TW I472052B
Authority
TW
Taiwan
Application number
TW97133011A
Other languages
Chinese (zh)
Other versions
TW201010133A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW097133011A priority Critical patent/TW201010133A/zh
Publication of TW201010133A publication Critical patent/TW201010133A/zh
Application granted granted Critical
Publication of TWI472052B publication Critical patent/TWI472052B/zh

Links

TW097133011A 2008-08-28 2008-08-28 Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof TW201010133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097133011A TW201010133A (en) 2008-08-28 2008-08-28 Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097133011A TW201010133A (en) 2008-08-28 2008-08-28 Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof

Publications (2)

Publication Number Publication Date
TW201010133A TW201010133A (en) 2010-03-01
TWI472052B true TWI472052B (enExample) 2015-02-01

Family

ID=44828074

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097133011A TW201010133A (en) 2008-08-28 2008-08-28 Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof

Country Status (1)

Country Link
TW (1) TW201010133A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419374B (zh) * 2011-08-09 2013-12-11 Univ Chang Gung Production Method of Wafer Level Light Emitting Diode
TWI462327B (zh) * 2012-02-06 2014-11-21 Lite On Electronics Guangzhou 定位系統
US11881546B2 (en) * 2019-12-05 2024-01-23 Mikro Mesa Technology Co., Ltd. Device with light-emitting diode

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI284424B (en) * 2002-03-22 2007-07-21 Philips Lumileds Lighting Co Producing self-aligned and self-exposed photoresist patterns on light emitting devices
TWM332939U (en) * 2007-09-21 2008-05-21 Kingbright Electronic Co Ltd LED with silicon gel structure
TW200834970A (en) * 2007-02-14 2008-08-16 Advanced Optoelectronic Tech Packaging structure of photoelectric device and method of fabricating the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI284424B (en) * 2002-03-22 2007-07-21 Philips Lumileds Lighting Co Producing self-aligned and self-exposed photoresist patterns on light emitting devices
TW200834970A (en) * 2007-02-14 2008-08-16 Advanced Optoelectronic Tech Packaging structure of photoelectric device and method of fabricating the same
TWM332939U (en) * 2007-09-21 2008-05-21 Kingbright Electronic Co Ltd LED with silicon gel structure

Also Published As

Publication number Publication date
TW201010133A (en) 2010-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees