TWI469281B - Conformation of preventing mix-up of substrate strips and usage of wrong mold chase when molding - Google Patents

Description

Preventing the combination of the substrate strip mixture and the wrong mold when the mold is sealed

SUMMARY OF THE INVENTION The present invention relates to apparatus suitable for use in the manufacture or processing of semiconductor devices, and more particularly to a combination of substrate strip blending and misalignment molds for preventing mold sealing.

At present, semiconductor wafers must be packaged after manufacturing integrated circuits to be assembled into printed circuit boards for use in a variety of electronic products. Due to advances in the process technology of semiconductor packaging, the utilization rate of the substrate strip as a wafer carrier is improved, and the quality of each substrate strip and each die is closely related to the production cost. The conventional package first joins and electrically connects the wafer to a substrate strip, and then loads the substrate strip into a molding machine, and then melts and injects into a cavity by using a plurality of compound pellets, and is cured. A sealant capable of covering the wafer is formed. The types of molds and substrate strips used in the molding machine are variously adjusted according to the customer's needs, product types, etc., and the misuse of the wrong mold will cause the entire substrate strip and the wafers mounted thereon to be scrapped. . Moreover, in order to meet the customized elastic production, the types of molds are increasing day by day, so it is necessary to manage thousands of sets of molds at the same time in the process, and the current manual management methods are often easily misused due to human error.

In view of the above, the main object of the present invention is to provide a combination of a substrate strip mixture and a mold with a wrong mold during molding, thereby achieving elastic production of the molding process.

A second object of the present invention is to provide a combination structure for preventing the substrate strip mixture and the wrong mold when the mold is sealed, and the system can determine whether the substrate strip and the mold match, thereby determining whether the correct substrate strip is used or not. Mold.

The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses a combination structure for preventing a substrate strip mixture and a wrong mold when molding, comprising at least one human machine operation interface, a plurality of connectors and a plurality of mold accompanying elements having a mold identification code. The man-machine interface corresponds to a molding machine for communicating with a programmable controller (PLC) of the molding machine, and the molding machine has a plurality of mold mounting spaces. The connectors are mounted on the molding machine to correspond to the mold mounting space. The mold accommodating components are detachably disposed to the connectors, so that the programmable controller reads the mold identification codes corresponding to the molds installed in the mold mounting spaces via the connectors.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.

In the above-described combination of the substrate strip compounding and the misplaced mold for preventing the molding, the connectors may have a plurality of pins for connecting to the mold accompanying members.

In the above-mentioned combination of the substrate strip compounding and the wrong mold in the mold sealing prevention, the pattern of the mold accompanying components may be selected from the group consisting of a card, a USB connecting device, an RS232 connector, a label and a card. one.

In the foregoing combination of the substrate strip mixing and the wrong mold for preventing the mold sealing, a substrate mapping system server may be further included, and the number list is stored, and the number list includes a plurality of mold identification codes and a plurality of substrates. The man-machine interface is connected to the substrate mapping system server; when a substrate strip feeding signal is triggered, the man-machine interface requests and downloads the number list, and by the person The machine operation interface receives the mold identification code and the substrate strip identification code of the mold machine, and compares the two according to the number list.

It can be seen from the above technical solutions that the combination of the substrate strip mixing and the wrong mold in the mold sealing process of the present invention has the following advantages and effects:

1. By connecting the connector of the mold sealing machine with the mold accompanying component with the mold identification code as one of the technical means, the mold identification code in the mold sealing machine is known, and it is judged whether the mold is used correctly, that is, prevention The wrong mold and the mistake of the mixture are used to achieve the elastic production of the molding process.

Secondly, the substrate mapping system server and the human-machine interface can be connected as one of the technical means, and whether the substrate strip identification code matches the mold identification code is determined by the number list of the substrate mapping system server, thereby determining whether to use or not The correct substrate strip and mold.

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings in which FIG. The components and combinations related to this case, the components shown in the figure are not drawn in proportion to the actual number, shape and size of the actual implementation. Some size ratios are proportional to other related sizes or have been exaggerated or simplified to provide clearer description of. The actual number, shape and size ratio of the implementation is an optional design, and the detailed component layout may be more complicated.

According to a first embodiment of the present invention, a main structural diagram of the first embodiment is illustrated by a combination of a substrate strip mixture and a mold with a wrong mold during molding. The combination of the substrate strip compounding and the wrong mold when the mold is prevented from sealing mainly comprises at least one human machine operation interface 110, a plurality of connectors 120, and a plurality of molds having a mold identification code (mold chase ID). Element 130.

The man-machine interface 110 corresponds to a molding machine 10 for communicating with a programmable logic controller (PLC) 11 of the molding machine 10. The term "correspondence" as used herein refers to the number of correspondences and the proximity of the installation positions, indicating that a man-machine interface is disposed beside each of the molding machines. The human-machine interface can be a thin client with basic computing and comparison functions and a keyboard or touch screen for human operation. It is particularly noted that the man-machine interface 110 is not an operation interface inside the molding machine 10, but is an additional monitoring and comparison device external to the molding machine 10. Moreover, the molding machine 10 has a plurality of mold mounting spaces 12 for mounting a plurality of molds 13. Generally, each of the molds 13 includes an upper mold, a lower mold, and a bottom mold. The molds 13 have various specifications according to customer needs, product types, and the like, and can be installed in the mold mounting spaces 12 for mold sealing operations. Generally, after the plurality of substrate strips 20 complete the steps of bonding and electrically connecting, the mold sealing operation is performed. First, the substrate strips 20 are loaded in the molding machine 10, and then the molds 13 are used for combination. The mold is filled with a sealing material in the cavity to seal the wafers on the substrate strips 20.

Therefore, the man-machine interface 110 is not an operation or/and control element inside the molding machine 10, but a wiring monitoring device outside the molding machine 10. Usually, the man-machine interface 110 is connectable to the programmable controller 11 via a cable. Specifically, in addition to the compact computer, the human-machine interface 110 can also be a portable computer or a desktop computer, and has functions of data input, calculation, comparison, and storage. The programmable controller 11 is a control component inside the molding machine 10, and includes a microprocessor and a preset program or firmware, except that the internal components of the molding machine 10 are controlled. It should also communicate with the man-machine interface 110.

As shown in FIG. 1, the connectors 120 are mounted on the molding machine 10 to correspond to the mold mounting spaces 12. The term "correspondence" as used herein refers to the correspondence between the number and the arrangement order. For example, when the mold sealing machine 10 has four mold mounting spaces 12, when the mold mounting spaces are programmed one to two, three, four, and four from the left to the right, the exposed surface of the mold sealing machine 10 is also There are four connectors 120, which are also numbered one, two, three, and four from left to right, wherein the connectors numbered one by one correspond to the mold mounting space numbered one. Therefore, as shown in Fig. 1, one connector 120 will designate a mold mounting space 12; and a mold pallet component 130 will also designate a mold 13, and the identification code in the mold accompanying component represents the specification of the corresponding following mold 13. Or the type can be compiled by the user, or the model or specification of the mold itself can be used. Therefore, the mold 13 of different specifications may have different mold identification codes 131 for identification and distinction.

The mold routing components 130 are detachably disposed to the connectors 120 such that the programmable controller 11 reads the molds corresponding to the molds 13 installed in the mold mounting spaces 12 via the connectors 120. Identification code 131. It is particularly noted that the mold-carrying elements 130 are not separate components that are combined with the molds 13, but should be moved following the movement of the molds 13, thereby avoiding the high temperature of the molds during the molding operation. burn. In other words, the movement of the mold-carrying elements 130 must follow the movement of the specified mold, and as the mold is adjusted, the mold-carrying elements 130 must move with it. In detail, the shape of the mold accompanying components 130 may be selected from one of a card, a USB connection device, an RS232 connector, a label, and a cassette. Specifically, as shown in FIG. 2, the connectors 120 may have a plurality of pins 121 for connecting to the mold routing elements 130. The plurality of sockets 130 can have a plurality of sockets 132 or a connection mechanism matched to the connectors 120 for corresponding insertion of the connectors 120. The pins 121 and 132 can be, for example, applications of RS232 male and female connectors. Alternatively, the positions of the pins and jacks are interchangeable. As shown in FIG. 1 , when the molds 13 are installed in the mold mounting spaces 12 of the molding machine 10 , the mold routing components 130 should also be connected to the corresponding connectors 120 , and The programmable controller 11 reads out the mold identification code 131 corresponding to the molds 13. In the present embodiment, the mold identification code of the A-size mold 13 is "1000", and the mold identification code of the B-size mold 13 is "0100". The mold identification codes can be stored in the corresponding mold-carrying components by means of data storage, barcode recording or mechanical short circuit. In this embodiment, the mold identification code 131 of the mold accompanying components 130 is read out through the connectors 120 by means of a pin connection to determine the molds of the molds 13 . Whether the identification code 131 is the same, whether the specification is in conformity, whether it is suitable for the molding machine 10, and whether it can be produced or used correctly can prevent the use of the wrong mold.

As shown in FIG. 1, the combination of the substrate strip mix and the misused mold for preventing mold sealing preferably further includes a substrate mapping system server 140. The human machine interface 110 is wired to the substrate mapping system server 140. The substrate mapping system server 140 stores a number list 141, which includes data that matches a plurality of die identification codes and a plurality of substrate strip identification codes. However, without limitation, it can also be used in a single machine operation of a molding machine 10, and the number list 141 can be directly stored in the man-machine operation interface 110, and the human-machine operation interface 110 performs identification code comparison. , can save additional costs. The number list 141 carries the data that the mold identification code matches the substrate strip identification code. Therefore, the number list 141 can know which template identification codes are applicable to which substrate strip identification codes, or whether a certain mold identification code is Applicable to a certain substrate strip identification code. Generally, each substrate strip 20 has a substrate strip identification code 21 for indicating the specification of the substrate strip 20, manufacturer information, production batch number, inspection number, position number, serial number of the motherboard, or other related process number. and many more. The substrate strip identifier 21 can be a one-dimensional barcode, a two-dimensional barcode, or other type of code, usually located at a corner or an edge of the outer surface of the substrate strip 20, which can be interpreted by a reader. Substrate strip identification code 21.

As shown in Fig. 3, a flow chart showing the construction of the combination of the substrate strip mixture and the mold with the wrong mold when the mold is prevented is shown. In the pre-pressing operation of the mold, the molding machine 10 has completed the adjustment of the molds 13 and connected the mold-carrying elements having the mold identification codes 131 to the connectors 120. Then, when the pre-molding step is performed, the substrate strips 20 are loaded into the molding machine 10, and at this time, the molding machine 10 triggers a substrate strip feeding signal to be transmitted to the human machine. The operation interface 110. The man-machine interface 110 requires the number list 141 to be downloaded by the substrate mapping system server 140 to cause the number list 141 to be downloaded to the man-machine interface 110. At the same time, the man-machine interface 110 uses the SECS CEID function to trigger a reader (not shown) to read the substrate strip identifier 21 of the substrate strip 20 that has been fed. Moreover, the man-machine interface 110 checks whether the substrate strip identification code 21 is in the qualified list of the number list 141 to avoid the occurrence of the mixture of the substrate strips.

In addition, the mold identification code 131 can be received by the man-machine interface 110 before the substrate strip is loaded, and the operator can input the batch number of the substrate strip to be sealed. After downloading the number list 141, it is possible to compare the two according to the number list 141 to determine whether the correct mold is used. For example, as shown in FIG. 1 , after the connectors 120 are correspondingly connected to the mold accompanying components 130, the mold identification code 131 of the molds 13 can be known, such as the mold identification of the combined A-size mold 13 . The code 131 is identified as "1000". When the mold identification code 131 corresponding to the B specification mold 13 is attached to the molding machine 10, it is discriminated as "0100", and after comparison, the B specification can be found. The mold is the wrong mold, and the man-machine interface 110 sends an error message to the programmable controller 11 to inform the occurrence of the error, so that the situation of avoiding misuse of the mold occurs.

Moreover, in the molding operation, the man-machine interface 110 continuously checks the identification code of the loaded substrate strip, and after correcting the alignment, does not interfere with the molding operation. If the substrate strip of the substrate is found to be inconsistent with the number list 141, the man-machine interface 110 can issue a warning signal to request the mold machine 10 to stop the operation, thereby preventing the molding operation. The error in the middle substrate strip mix.

According to a second embodiment of the present invention, it is used to illustrate the application of a plurality of molding machines. Another combination of the substrate strip mix and the wrong mold for preventing mold sealing is illustrated in the main structure diagram of FIG. 4, including a plurality of personal computer operation interfaces 110, a plurality of connectors 120, and a plurality of mold recognitions. The mold of the code carries the component 130. The same elements as those in the first embodiment will be denoted by the same reference numerals, and it is understood that they have the same functions as described above and will not be further described herein.

In this embodiment, the combination structure of the substrate strip mixture and the wrong mold for preventing mold sealing can be simultaneously applied to two or more mold laminating machines 10 and two or more human machine operation interfaces 110 are disposed. The man-machine interface 110 can be connected to the same substrate mapping system server 140, that is, the substrate mapping system server 140 controls the number list applicable to the plurality of molding machines to make the versions consistent. When one of the man-machine operation interfaces 110 finds that the wrong mold 13 is found, only the erroneous molding machine 10 is stopped. Another correct molding machine 10 can continue the manufacturing process without interruption, so as not to shut down the entire molding operation.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modifications, equivalent changes and modifications made without departing from the technical scope of the present invention are still within the technical scope of the present invention.

10. . . Mold sealing machine

11. . . Programmable controller (PLC)

12. . . Mold installation space

13. . . Mold

20. . . Substrate strip

twenty one. . . Substrate strip identification code

100. . . Preventing the combination of the substrate strip mixture and the wrong mold when the mold is sealed

110. . . Man-machine interface

120. . . Connector

121. . . Pin

130. . . Molding component

131. . . Mold identification code

132. . . Jack

140. . . Baseboard imaging system server

141. . . Numbered list

200. . . Preventing the combination of the substrate strip mixture and the wrong mold when the mold is sealed

Fig. 1 is a view showing the main structure of a combination of a substrate strip mixture and a mold with a wrong mold when the mold is sealed according to the first embodiment of the present invention.

Fig. 2 is a schematic view showing the connection of a connector and a mold accompanying member in the combined construction according to the first embodiment of the present invention.

Figure 3 is a flow chart showing the use of the combined construction in accordance with a first embodiment of the present invention.

Fig. 4 is a view showing the main structure of a combination of a substrate strip mixture and a mold with a wrong mold when the mold is sealed according to the first embodiment of the present invention.

10. . . Mold sealing machine

11. . . Programmable controller (PLC)

12. . . Mold installation space

13. . . Mold

20. . . Substrate strip

twenty one. . . Substrate strip identification code

100. . . Preventing the combination of the substrate strip mixture and the wrong mold when the mold is sealed

110. . . Man-machine interface

120. . . Connector

130. . . Molding component

131. . . Mold identification code

140. . . Baseboard imaging system server

141. . . Numbered list

Claims (4)

The utility model relates to a combination structure for preventing a substrate strip mixture and a wrong mold when molding, comprising: at least one man-machine interface corresponding to a mold sealing machine, and a programmable controller (PLC) for the mold sealing machine Communication, and the molding machine has a plurality of mold installation spaces; a plurality of connectors are installed on the molding machine to correspond to some mold installation space; and a plurality of molds having mold identification codes are provided The row elements are detachably disposed to the connectors such that the programmable controller reads the mold identification codes corresponding to the molds installed in the mold mounting spaces via the connectors. The combination of the substrate strip compounding and the wrong mold in the mold sealing according to the first aspect of the patent application, wherein the connectors have a plurality of pins for connecting to the mold accompanying components. According to the first aspect of the patent application, the combination of the substrate strip compound and the wrong mold is used for preventing the mold sealing, wherein the pattern of the mold accompanying components is selected from the card, the USB connecting device, the RS232 connector, the label and the label. One of the cards. According to the combination of the substrate strip mixing and the wrong mold for preventing the sealing according to the first, second or third aspect of the patent application, a substrate mapping system server is further included, and the number list is stored, and the number list includes a plurality of The man-machine interface is connected to the substrate image system server when the die identification code matches the plurality of substrate strip identification codes; when the substrate strip feed signal is triggered, the man-machine interface requests and downloads the number And receiving, by the man-machine interface, the mold identification code and the substrate strip identification code fed by the mold machine, and comparing the two according to the number list.