TWI461255B - 用於產生薄墊中的模塑窗之方法 - Google Patents

用於產生薄墊中的模塑窗之方法 Download PDF

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Publication number
TWI461255B
TWI461255B TW100110367A TW100110367A TWI461255B TW I461255 B TWI461255 B TW I461255B TW 100110367 A TW100110367 A TW 100110367A TW 100110367 A TW100110367 A TW 100110367A TW I461255 B TWI461255 B TW I461255B
Authority
TW
Taiwan
Prior art keywords
polishing
layer
recess
hole
adhesive layer
Prior art date
Application number
TW100110367A
Other languages
English (en)
Chinese (zh)
Other versions
TW201143969A (en
Inventor
Boguslaw A Swedek
Doyle E Bennett
Dominic J Benvegnu
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201143969A publication Critical patent/TW201143969A/zh
Application granted granted Critical
Publication of TWI461255B publication Critical patent/TWI461255B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW100110367A 2010-04-16 2011-03-25 用於產生薄墊中的模塑窗之方法 TWI461255B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/762,175 US8393940B2 (en) 2010-04-16 2010-04-16 Molding windows in thin pads

Publications (2)

Publication Number Publication Date
TW201143969A TW201143969A (en) 2011-12-16
TWI461255B true TWI461255B (zh) 2014-11-21

Family

ID=44788545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100110367A TWI461255B (zh) 2010-04-16 2011-03-25 用於產生薄墊中的模塑窗之方法

Country Status (5)

Country Link
US (1) US8393940B2 (OSRAM)
JP (1) JP5657775B2 (OSRAM)
KR (1) KR101761389B1 (OSRAM)
TW (1) TWI461255B (OSRAM)
WO (1) WO2011129959A2 (OSRAM)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
KR101602544B1 (ko) * 2010-11-18 2016-03-10 캐보트 마이크로일렉트로닉스 코포레이션 투과성 영역을 포함하는 연마 패드
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
JP5893479B2 (ja) * 2011-04-21 2016-03-23 東洋ゴム工業株式会社 積層研磨パッド
US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
ITTV20120147A1 (it) * 2012-07-30 2014-01-31 Hausbrandt Trieste 1892 Spa Capsula per la preparazione di bevande
US8961266B2 (en) * 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
US10058970B2 (en) 2014-05-02 2018-08-28 3M Innovative Properties Company Interrupted structured abrasive article and methods of polishing a workpiece
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10213894B2 (en) * 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
EP3478447A4 (en) * 2016-06-29 2020-03-11 Saint-Gobain Abrasives, Inc. ABRASIVE TOOLS AND TRAINING METHODS
TWI629297B (zh) * 2016-07-05 2018-07-11 智勝科技股份有限公司 研磨層及其製造方法以及研磨方法
US10259099B2 (en) * 2016-08-04 2019-04-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapering method for poromeric polishing pad
KR20190039171A (ko) * 2016-08-31 2019-04-10 어플라이드 머티어리얼스, 인코포레이티드 환형 플래튼 또는 연마 패드를 갖는 연마 시스템
KR101947877B1 (ko) * 2016-11-24 2019-02-13 두산중공업 주식회사 병렬 복열 방식의 초임계 이산화탄소 발전 시스템
KR101904322B1 (ko) 2017-01-23 2018-10-04 에스케이씨 주식회사 연마패드 및 이의 제조방법
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
US10569383B2 (en) 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
JP7134005B2 (ja) * 2018-07-26 2022-09-09 富士紡ホールディングス株式会社 研磨パッド

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197434A (ja) * 1995-01-23 1996-08-06 Sony Corp 研磨用パッド
TW200510470A (en) * 2003-04-22 2005-03-16 Jsr Corp Polishing pad and method of polishing a semiconductor wafer
TW200906543A (en) * 2007-06-08 2009-02-16 Applied Materials Inc Thin polishing pad with window and molding process

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JP3431115B2 (ja) * 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6994607B2 (en) * 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6358130B1 (en) * 1999-09-29 2002-03-19 Rodel Holdings, Inc. Polishing pad
US6685537B1 (en) 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
EP1252973B1 (en) 2001-04-25 2008-09-10 JSR Corporation Polishing pad for a semiconductor wafer which has light transmitting properties
JP2003273046A (ja) * 2002-03-13 2003-09-26 Nihon Micro Coating Co Ltd 研磨装置及びテープ並びに方法
US6875077B2 (en) * 2002-03-18 2005-04-05 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
JP2008044103A (ja) * 2003-04-09 2008-02-28 Jsr Corp 研磨複層体および半導体ウエハの研磨方法
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
US6986705B2 (en) * 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
CN100424830C (zh) * 2004-04-23 2008-10-08 Jsr株式会社 用于抛光半导体晶片的抛光垫、层叠体和方法
JP4904027B2 (ja) 2005-08-10 2012-03-28 ニッタ・ハース株式会社 研磨パッド
US7179151B1 (en) * 2006-03-27 2007-02-20 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197434A (ja) * 1995-01-23 1996-08-06 Sony Corp 研磨用パッド
TW200510470A (en) * 2003-04-22 2005-03-16 Jsr Corp Polishing pad and method of polishing a semiconductor wafer
TW200906543A (en) * 2007-06-08 2009-02-16 Applied Materials Inc Thin polishing pad with window and molding process

Also Published As

Publication number Publication date
JP2013525124A (ja) 2013-06-20
WO2011129959A3 (en) 2012-04-19
JP5657775B2 (ja) 2015-01-21
KR101761389B1 (ko) 2017-07-25
US20110256818A1 (en) 2011-10-20
TW201143969A (en) 2011-12-16
WO2011129959A2 (en) 2011-10-20
US8393940B2 (en) 2013-03-12
KR20130088744A (ko) 2013-08-08

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