TWI456609B - - Google Patents

Info

Publication number
TWI456609B
TWI456609B TW102118591A TW102118591A TWI456609B TW I456609 B TWI456609 B TW I456609B TW 102118591 A TW102118591 A TW 102118591A TW 102118591 A TW102118591 A TW 102118591A TW I456609 B TWI456609 B TW I456609B
Authority
TW
Taiwan
Application number
TW102118591A
Other languages
Chinese (zh)
Other versions
TW201445598A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW102118591A priority Critical patent/TW201445598A/zh
Application granted granted Critical
Publication of TWI456609B publication Critical patent/TWI456609B/zh
Publication of TW201445598A publication Critical patent/TW201445598A/zh

Links

TW102118591A 2013-05-27 2013-05-27 可提高電感背膜加工產量的方法 TW201445598A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102118591A TW201445598A (zh) 2013-05-27 2013-05-27 可提高電感背膜加工產量的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102118591A TW201445598A (zh) 2013-05-27 2013-05-27 可提高電感背膜加工產量的方法

Publications (2)

Publication Number Publication Date
TWI456609B true TWI456609B (ja) 2014-10-11
TW201445598A TW201445598A (zh) 2014-12-01

Family

ID=52112304

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102118591A TW201445598A (zh) 2013-05-27 2013-05-27 可提高電感背膜加工產量的方法

Country Status (1)

Country Link
TW (1) TW201445598A (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001257117A (ja) * 2000-03-13 2001-09-21 Koa Corp チップインダクタおよびその製造方法、並びに、そのコア
JP2002057053A (ja) * 2000-08-10 2002-02-22 Murata Mfg Co Ltd 表面実装型インダクタの製造方法
TW567509B (en) * 2001-08-09 2003-12-21 Murata Manufacturing Co Winding chip coil and method for adjusting the same
JP2005197540A (ja) * 2004-01-09 2005-07-21 Tdk Corp チップインダクタの接着組立方法及び装置
CN201845656U (zh) * 2010-11-09 2011-05-25 深圳市优创展科技有限公司 一种用于电感封胶的装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001257117A (ja) * 2000-03-13 2001-09-21 Koa Corp チップインダクタおよびその製造方法、並びに、そのコア
JP2002057053A (ja) * 2000-08-10 2002-02-22 Murata Mfg Co Ltd 表面実装型インダクタの製造方法
TW567509B (en) * 2001-08-09 2003-12-21 Murata Manufacturing Co Winding chip coil and method for adjusting the same
JP2005197540A (ja) * 2004-01-09 2005-07-21 Tdk Corp チップインダクタの接着組立方法及び装置
CN201845656U (zh) * 2010-11-09 2011-05-25 深圳市优创展科技有限公司 一种用于电感封胶的装置

Also Published As

Publication number Publication date
TW201445598A (zh) 2014-12-01

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