TWI454637B - - Google Patents

Info

Publication number
TWI454637B
TWI454637B TW101106449A TW101106449A TWI454637B TW I454637 B TWI454637 B TW I454637B TW 101106449 A TW101106449 A TW 101106449A TW 101106449 A TW101106449 A TW 101106449A TW I454637 B TWI454637 B TW I454637B
Authority
TW
Taiwan
Application number
TW101106449A
Other languages
Chinese (zh)
Other versions
TW201237316A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201237316A publication Critical patent/TW201237316A/zh
Application granted granted Critical
Publication of TWI454637B publication Critical patent/TWI454637B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69Details of refractors forming part of the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
TW101106449A 2011-03-07 2012-02-29 Led optical module and led chip for illumination TW201237316A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110061327.6A CN102679187B (zh) 2011-03-07 2011-03-07 用于照明的led光模组和led芯片

Publications (2)

Publication Number Publication Date
TW201237316A TW201237316A (en) 2012-09-16
TWI454637B true TWI454637B (ja) 2014-10-01

Family

ID=46797429

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101106449A TW201237316A (en) 2011-03-07 2012-02-29 Led optical module and led chip for illumination

Country Status (3)

Country Link
CN (1) CN102679187B (ja)
TW (1) TW201237316A (ja)
WO (1) WO2012119338A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103162143B (zh) * 2013-03-16 2015-04-15 李忠训 基于高压恒流技术的led模组
CN104676376B (zh) * 2015-02-11 2018-04-24 深圳市西德利集团有限公司 一种led灯具
CN111640837A (zh) * 2020-06-03 2020-09-08 深圳市聚能达业光电科技有限公司 一种陶铝cob线路支架

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093206A (ja) * 2000-09-18 2002-03-29 Stanley Electric Co Ltd Led信号灯具
CN101639171A (zh) * 2008-07-31 2010-02-03 东芝照明技术株式会社 灯泡形灯
CN101765350A (zh) * 2008-12-23 2010-06-30 明景科技股份有限公司 高功率散热模块
CN201661917U (zh) * 2010-04-08 2010-12-01 佶益投资股份有限公司 发光二极管照明装置
CN201689910U (zh) * 2010-03-21 2010-12-29 秦彪 一种照明用的led灯芯和led芯片
CN201731340U (zh) * 2010-07-06 2011-02-02 安徽世林照明股份有限公司 Led照明灯泡

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM328763U (en) * 2007-05-21 2008-03-11 Univ Nat Taiwan Structure of heat dissipation substrate
CN201121867Y (zh) * 2007-11-05 2008-09-24 黎昌兴 Led灯内铝管气流提速散热装置
CN102106002A (zh) * 2008-08-21 2011-06-22 松下电器产业株式会社 照明用光源
DE102008039364A1 (de) * 2008-08-22 2010-03-04 Osram Gesellschaft mit beschränkter Haftung Halbleiter-Leuchtvorrichtung
CN101614333A (zh) * 2009-03-23 2009-12-30 广州南科集成电子有限公司 高效散热led照明光源及制造方法
CN101576208A (zh) * 2009-06-03 2009-11-11 深圳万润科技股份有限公司 Led日光灯
CN201599745U (zh) * 2010-01-20 2010-10-06 深圳市同洲电子股份有限公司 一种led灯具及led灯具的基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093206A (ja) * 2000-09-18 2002-03-29 Stanley Electric Co Ltd Led信号灯具
CN101639171A (zh) * 2008-07-31 2010-02-03 东芝照明技术株式会社 灯泡形灯
CN101765350A (zh) * 2008-12-23 2010-06-30 明景科技股份有限公司 高功率散热模块
CN201689910U (zh) * 2010-03-21 2010-12-29 秦彪 一种照明用的led灯芯和led芯片
CN201661917U (zh) * 2010-04-08 2010-12-01 佶益投资股份有限公司 发光二极管照明装置
CN201731340U (zh) * 2010-07-06 2011-02-02 安徽世林照明股份有限公司 Led照明灯泡

Also Published As

Publication number Publication date
CN102679187B (zh) 2016-06-01
CN102679187A (zh) 2012-09-19
TW201237316A (en) 2012-09-16
WO2012119338A1 (zh) 2012-09-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees