TWI452656B - Substrate product and method of manufacturing a substrate - Google Patents

Description

Substrate product and method of manufacturing substrate

The present invention relates to a substrate, and more particularly to a substrate product and a method of manufacturing a substrate applied to the fields of CIGS, panel, germanium wafer, and the like.

According to the current market, there are many types of solar cells. For example, a thin-film solar cell is made of a material composed of copper indium selenide (CIS), and later, in order to improve conversion efficiency, copper indium gallium selenide is used. (copper indium gallium selenide, referred to as CIGS) four-element material.

In addition, the semiconductor device is formed by a method of forming a device layer on the surface of the germanium wafer by a method such as thin film or diffusion, and the application of the germanium wafer diffusion process is also quite extensive. Further, liquid crystal display elements (LCDs) and light emitting diodes (LEDs) are also widely used in electronic devices.

Conventional substrates such as CIGS form various reaction precursor layers in various ways (coating, CVD) on the functional surface of the substrate, and then react with light or heat to form a functional plating layer. However, during the process heating operation, the heating, such as the area, thickness, conduction and radiation of the precursor layer, tends to cause uneven heating, so that subsequent processes such as sputtering or diffusion are affected, especially the temperature is uniform. Sex also depends on many factors such as the uniformity, thickness and surface condition of the coating, so it is often difficult to control. Although the heating source and the substrate placement position can be slightly adjusted, it is still impossible to adjust to the uniformity of heat at all the substrates and the substrate, so that the quality of the functional plating layer is not good or the entire substrate cannot be completely reacted. Obviously, the conventional substrate may have uneven heating, which is not conducive to subsequent processing, and the yield is lowered, especially for large-area substrates. In addition, other types of substrate processes (such as LCD panels, The same problem arises with wafer diffusion, light-emitting diodes, etc.

The main object of the present invention is to provide a substrate product and a method for manufacturing the substrate, which can make the substrate absorb light and heat uniformly, thereby improving the heat uniformity of the substrate to improve the yield.

The present invention provides a substrate product comprising: a substrate having a functional surface and a non-functional surface; at least one plating layer formed by at least one of a photoreaction and a thermal reaction with a reactive precursor And a heat absorbing layer disposed on the non-functional surface of the substrate for uniformly absorbing light and heat in the environment during formation of the plating precursor.

The invention further provides a method for manufacturing a substrate, comprising the steps of: providing a substrate having a functional surface and a non-functional surface, wherein a reactive precursor is disposed on a functional surface of the substrate; and a heat absorbing layer is formed The non-functional surface of the substrate is configured to enable the reaction precursor to uniformly absorb light and heat in the environment; and to perform at least one of photoreaction and thermal reaction on the substrate to react the reaction precursor into a plating layer .

The heat absorbing layer is provided on the non-functional surface of the substrate in an adhesive manner, or the heat absorbing layer is formed on the non-functional surface of the substrate in a roughened manner.

The invention has the following beneficial effects: the invention provides a structure with good heat absorption on one side (back side) of the non-functional surface of the substrate, so that the absorption of light and heat is uniform, and the heat is uniformly transmitted to the functional surface, thereby improving. The uniformity of the substrate is heated to facilitate the subsequent heating process to improve the yield. Especially for large-area substrates, the effect is better.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description of the invention and the accompanying drawings. For reference and description, it is not intended to limit the invention.

[First Embodiment]

Referring to FIG. 1 and FIG. 2, the present invention provides a method for manufacturing a substrate, including the following steps:

First, a substrate 1 is provided. The substrate 1 can be made of glass, ceramic or polymer material, and the substrate 1 can also have light transmissivity, preferably made of glass. The material of the substrate 1 is not limited. , can be appropriately changed according to the different needs of the substrate. The substrate 1 has a functional surface 11 and a non-functional surface 12. The functional surface 11 and the non-functional surface 12 are located on opposite surfaces of the substrate 1. The functional surface 11 and the non-functional surface 12 are respectively located on the front and back surfaces of the substrate 1. . At least one plating layer 2 is provided on the functional surface 11 of the substrate 1. The type and material of the plating layer 2 are not limited, and can be appropriately changed according to the type of the product, so as to form a functional coating such as a panel, CIGS thin film solar energy. Board, wafer, etc.

Then, a non-functional surface 12 of the substrate 1 is provided with a layer of heat absorbing material to form a heat absorbing layer 3; the heat absorbing layer 3 is printed, sprayed, attached, sputtered, plated, physically deposited ( A thick film or film formed by PVD) or chemical deposition (CVD) or the like, and the heat absorbing layer 3 is provided on the non-functional surface 12 of the substrate 1 in an adhesive manner. The material of the heat absorbing layer 3 may be a carbide (such as SiC), a nitride (such as AlN), an oxide, and the material of the heat absorbing layer 3 may also be a carbon, a metal element or a metal-containing compound. The material of the heat absorbing layer 3 is still selected in consideration of its absorption of light and heat, such as the wavelength of light of the heat source, the absorption rate, and the like.

The heat absorbing layer 3 can be arranged to be formed in the process and then removed or permanently retained in the substrate 1 in a certain process, depending on the product condition. Endothermic The thickness t2 of the layer 3 is not limited in size, but the thickness t2 of the heat absorbing layer 3 is preferably larger than the thickness t1 of the plating layer 2 of the functional surface 11.

Referring to FIG. 2, the present invention provides a substrate product comprising a substrate 1, at least one plating layer 2 and a heat absorbing layer 3. The substrate 1 is preferably made of glass, and the material of the substrate 1 is not limited. The substrate 1 has a functional surface 11 and a non-functional surface 12. The plating layer 2 is provided on the functional surface 11 of the substrate 1. The heat absorbing layer 3 is disposed on the non-functional surface 12 of the substrate 1, and the heat absorbing layer 3 is a thick film formed by printing, spraying, attaching, sputtering, electroplating, physical deposition (PVD) or chemical deposition (CVD). Or a film, the heat absorbing layer 3 is provided on the non-functional surface 12 of the substrate 1 in an adhesive manner. The material of the heat absorbing layer 3 may be a carbide, a nitride or an oxide, and the material of the heat absorbing layer 3 may also be a carbon, a metal element or a metal-containing compound. The thickness t2 of the heat absorbing layer 3 is preferably larger than the thickness t1 of the plating layer 2 of the functional surface 11 to have a better heat conduction effect.

[Second embodiment]

Referring to FIG. 3, the second embodiment of the present invention differs from the first embodiment mainly in that the heat absorbing layer 3' is formed in a different manner, that is, in the physical or chemical manner on the non-functional surface 12 of the substrate 1. The surface treatment is performed to form the heat absorbing layer 3' on the non-functional surface 12 in a roughened manner.

The invention provides a structure (heat absorbing layer 3) with good heat absorption on the non-functional surface 12 of the substrate 1 so that the absorption of light and heat is uniform, and the heat is uniformly transmitted to the functional surface 11 and the plating layer 2, thereby improving The uniformity of the substrate is heated to facilitate the subsequent heating process, which improves the yield, especially for large-area substrates.

The plating layer 2 disposed on the functional surface 11 of the substrate 1 and the subsequent processes are disposed on the plating layer 2, including but not limited to, for example, copper indium gallium selenide (CIGS), etc. material The prior art is not the focus of the present invention, and therefore will not be described again. The present invention can be applied to substrate products and substrates in various fields such as CIGS, panels, germanium wafers, and light-emitting diodes.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalents of the present invention and the equivalents of the drawings are all included in the present invention. Within the scope of protection, it is given to Chen Ming.

1‧‧‧Substrate

11‧‧‧ functional surface

12‧‧‧Non-functional surface

2‧‧‧ plating

3‧‧‧heat absorption layer

3'‧‧‧heat absorbing layer

T1‧‧‧ thickness

T2‧‧‧ thickness

1 is a flow chart of a method of manufacturing a substrate of the present invention.

2 is a schematic plan view of a substrate article of the present invention.

3 is a schematic plan view showing another embodiment of the substrate product of the present invention.

1. . . Substrate

11. . . Functional surface

12. . . Non-functional surface

2. . . Plating

3. . . Heat absorbing layer

T1. . . thickness

T2. . . thickness

Claims (10)

A substrate product comprising: a substrate having a functional surface and a non-functional surface; at least one plating layer formed on the substrate by at least one of a photoreaction and a thermal reaction with a reactive precursor And a heat absorbing layer disposed on the non-functional surface of the substrate for uniformly absorbing light and heat in the environment during formation of the plating precursor. The substrate article of claim 1, wherein the heat absorbing layer is a thick film or film. The substrate article of claim 1, wherein the heat absorbing layer is disposed on the non-functional surface of the substrate in an attached manner. The substrate article of claim 1, wherein the heat absorbing layer is formed on the non-functional surface in a roughened manner. The substrate article of claim 1, wherein the material of the heat absorbing layer is a carbide, a nitride, an oxide, a carbon, a metal or a metal-containing compound. A method for manufacturing a substrate, comprising the steps of: providing a substrate having a functional surface and a non-functional surface, wherein a reactive precursor is disposed on a functional surface of the substrate; and a heat absorbing layer is formed on the substrate The non-functional surface is configured to enable the reaction precursor to uniformly absorb light and heat in the environment; and to perform at least one of a photoreaction and a thermal reaction on the substrate to react the reaction precursor into a plating layer. The method of manufacturing a substrate according to claim 6, wherein the heat absorbing layer is a thick film or film formed by printing, spraying, attaching, sputtering, electroplating, physical deposition or chemical deposition. The method for manufacturing a substrate according to claim 6, wherein the heat absorbing layer is provided on the non-functional surface of the substrate in an adhesive manner. The method of manufacturing a substrate according to claim 6, wherein the heat absorbing layer is formed on the non-functional surface in a roughened manner. The method for producing a substrate according to claim 6, wherein the material of the heat absorbing layer is a carbide, a nitride, an oxide, a carbon, a metal or a metal-containing compound.