TWI450350B - Test method of multi - grain and its point measuring machine - Google Patents

Description

Multi-grain test method and its spot measuring machine

The invention relates to a test method and a spot measuring machine thereof, in particular to a multi-grain test method and a spot measuring machine thereof.

The technology of light-emitting diodes (LEDs) is becoming more and more mature, and the fields of application are becoming wider and wider, such as wall lamps, auxiliary lights and garden lights used in general houses, or backlights used in displays.

However, with the rapid growth of the light-emitting diode, in addition to the high brightness, high power, and long life of the light-emitting diode itself, how to maintain the quality of the light-emitting diode is also very important, so the light-emitting diode manufacturing After completion, it is necessary to detect the light-emitting characteristics of the light-emitting diode to determine whether the quality of the light-emitting diode is good.

The LEDs are grown on the wafer during fabrication, and laser cutting is used to form a plurality of LED dies on the wafer. When the LED die is detected, it is performed by a probe set of the spot measuring machine, so that the LED chips are located on the same side of the two electrodes, so that the single LED die to be tested emits light, and accordingly the LED is sensed. The luminescent properties of the grains.

In order to increase the speed of detection, the measuring machine gradually develops toward the direction of multi-die spot measurement, that is, the spot measuring machine starts to have a plurality of probe sets for detecting multiple dies at the same time. However, during the spotting process, the die adheres to a film, and the film gradually shrinks, causing some of the grains to shift, and thus the probe cannot properly enable the electrodes of the LED die.

Accordingly, it is an object of the present invention to provide a multi-die test method that can continue to perform correct and fast multi-die spotting operations when a grain offset condition occurs.

At the same time, the present invention also provides a spot measuring machine for multi-die testing to achieve the above-described multi-die test method.

A multi-die test method is used for spot testing a plurality of test dies for a plurality of test dies, the test finder comprising a plurality of probe sets, the test method comprising the steps of: obtaining the plurality of crystals to be tested One position data of the granules; according to the position data, spotting the unmeasured dies with the offsets by using the probe sets; and moving the probe sets and the dies to be tested according to the position data At least one of the probe sets is spotted with at least one of the probe sets to produce an offset.

In a preferred embodiment of the present invention, the spotting of the die to be tested without the offset according to the location data includes the following steps: when the positions of the probe groups correspond to When the data is obtained, it is judged that the die to be tested does not have an offset; and the probe sets are controlled to be in a pin-out state, thereby performing spot measurement on the die to be tested without offset.

In a preferred embodiment of the present invention, wherein the at least one of the probe sets and the at least one of the test dies are moved according to the position data, and at least one of the probe sets is offset. Measuring the die to perform the spot measurement system includes the following steps: when the positions of the probe sets cannot correspond to the position data, determining that the die to be tested is offset; and moving the probe sets and the to-be-tested At least one of the dies and controlling at least one of the sets of probes to be in the ejector state, thereby performing a spot test on the dies to be measured that are offset.

The invention further discloses a multi-die spot measuring machine for simultaneously testing a plurality of die to be tested, the spot measuring machine comprising a detecting platform, a plurality of probe sets, a plurality of pin collecting modules and a control module; The platform is configured to carry the die to be tested; a plurality of pin collection modules are respectively coupled to the probe sets to control at least one of the probe sets to be vertically moved relative to the die to be tested a pin-receiving state; the control module is configured to move the probe set and the detection platform to perform up-and-down actuation and plane displacement according to the position data of the one of the die to be tested.

In a preferred embodiment of the present invention, the pin collection module includes at least one of a voice coil motor and a battery valve.

In a preferred embodiment of the present invention, a scanning module is further included for scanning the die to be tested to obtain the location data.

Compared with the conventional spot tester test program and the spot measuring machine, the multi-grain test method and the spot measuring machine of the present invention can not only perform spot measurement on a plurality of crystal grains at the same time, but also can be used when the crystal grains are offset. , continue to perform the correct test action without stopping the entire test program, so it can achieve more efficient test than the known test machine test program.

The specific embodiments of the present invention will be further described by the following examples and drawings.

The invention is illustrated by the following description of the preferred embodiments of the invention, and is not intended to limit the invention. The contents of this preferred embodiment are detailed below.

Please refer to the first figure, the second figure and the third figure. The first figure is the relative positional relationship between the probe set and the die when there are no offsets of the plurality of crystal grains, and the second figure is the grain generation bias. The relative positional relationship between the probe set and the die during shifting, and the third figure is the step diagram of the multi-die test procedure of the spot tester. The multi-die test program of the spot measuring machine of the present invention is for measuring the plurality of test pieces 12a and 12b by the spot measuring machine, and the spot measuring machine comprises a plurality of probe sets 11a and 11b; wherein the probe set 11a And 11b include probes 111a, 112a, 111b and 112b for enabling the die 12a and 12b to be tested during the spotting; as shown in the first figure, when the positions of the die 12a and 12b to be tested are correct, The positions of the probes 111a, 112a, 111b, and 112b of the needle sets 11a and 11b may correspond to the electrodes of the die 12a and 12b to be tested, and as shown in the second figure, the position of the die 12a to be tested is shifted. The positions of the probes 111a and 112a of the probe set 11a cannot correspond to the electrodes of the die 12a to be tested. If the spot measurement is continued according to the normal procedure, the electrodes of the die 12a cannot be enabled and The result of the spot test loses the reference.

Therefore, the multi-die test program of the spot measuring machine of the present invention comprises the following steps:

S101: Obtain a position data of the plurality of die to be tested 12a and 12b;

S103: Perform a spot test on the undetected die 12a and 12b with the probe sets 11a and 11b according to the location data. The step may further include the following steps in a preferred embodiment: First, the position data is compared with the probe set position data of the probe sets 11a and 11b to determine the unmeasured die 12a and 12b; and then the probes are controlled. The groups 11a and 11b are in a needle-out state, thereby performing spot measurement on the unmeasured crystal grains 12a and 12b which are not offset; the needle-out state described herein means that the horizontal positions of the probe groups 11a and 11b are relatively close to each other. The die 12a and 12b are measured. Conversely, when the horizontal positions of the probe sets 11a and 11b are farther away from the die 12a and 12b to be tested, it can be regarded as a pinning state.

S105: moving the probe sets 11a and 11b and the at least one of the die to be tested 12a and 12b according to the position data, and performing spot measurement on the generated die 12a and 12b with offset; wherein, this step In a preferred embodiment, the method further includes the following steps: first, comparing the location data with the probe set location data of the probe sets 11a and 11b to determine the offset die 12a to be measured. And 12b; then, moving the probe sets 11a and 11b and at least one of the die to be tested 12a and 12b, and controlling at least one of the probe sets 11a and 11b to be in a needle-out state, thereby Spot measurements are made on the die to be tested 12a and 12b which are offset.

In another embodiment of the present invention, the multi-die spot measuring machine may first perform spot measurement on the die to be measured with offset, and then perform spot measurement on the die to be tested without offset, that is, Step S105 is performed first, and then step S103 is performed. Therefore, the above steps are not limited in sequence, and the order of testing is the preferred embodiment with the shorter test time.

Please refer to the fourth figure, which is a structural diagram of the multi-die spot measuring machine of the present invention. The present invention further discloses a multi-die spot measuring machine 200 for simultaneously testing a plurality of die 300 to be tested, the spot measuring machine 200 comprising a detecting platform 21, a scanning module 22, a plurality of probe sets 23, and a plurality of The needle collection module 24 and a control module 25 are provided.

The detecting platform 21 is configured to carry the die 300 to be tested; the scanning module 22 is configured to scan the die 300 to obtain the position data of the die 300, and further, The die 300 can be pre-scanned by the externally generated position data, and the spotting machine 200 can directly import the position data and determine whether the die 300 to be measured is offset.

A plurality of pin collection modules 24 are respectively coupled to the probe sets 23 to control at least one of the probe sets 23 to move vertically relative to the die 300 to be tested; wherein the probe set 23 can include The probes 231 and 232 are connected to the probes 231 and 232 respectively, so as to control the vertical movement of the probes 231 and 232 relative to the die 300 to be tested; when the probe set 23 faces the die 300 to be tested When moving, it is the aforementioned needle-out state. On the other hand, when the probe set 23 is moved in the opposite direction of the die 300 to be tested, it is the aforementioned pinning state; in a preferred embodiment of the present invention, the pinching module 24 can be a voice coil. Motor or a battery valve.

The control module 25 can move up and down and planar displacement according to at least one of the probe set 23 and the detection platform 21 according to the position data of the die 300 to be tested. There are two ways for the spotting machine 200 to perform the spot test. Generally, after the probe set 23 is first adjusted to a fixed position, the control module 25 moves the detecting platform 21 according to the position data of the die 300 to be tested. On the other hand, if the detection platform 21 is stationary, the control module 25 moves the probe set 23 to perform a spot test.

In summary, the multi-die test method and the spot measuring machine of the present invention can not only perform spot measurement on a plurality of die to be tested at the same time, but also can be compared with the conventional spot tester test program and the spot tester. When the die to be measured is offset, the correct spotting action is continued without stopping the entire test procedure, so that a more efficient test than the conventional spot tester can be achieved.

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.

11a, 11b. . . Probe set

111a, 112a, 111b, 112b. . . Probe

12a, 12b. . . Grain to be tested

200. . . Point measuring machine

twenty one. . . Detection platform

twenty two. . . Scanning module

twenty three. . . Probe set

231, 232. . . Probe

twenty four. . . Needle collection module

25. . . Control module

300. . . Grain to be tested

S101-S105. . . Dot tester multi-die test procedure

The first figure is a relative positional relationship between the probe set and the die when there is no offset of the plurality of crystal grains;

The second figure is a relative positional relationship between the probe set and the crystal grains when the crystal grains are shifted;

The third diagram is a step diagram of the multi-die test procedure of the spot tester;

The fourth figure is a structural diagram of the multi-die spot measuring machine of the present invention.

S101-S105. . . Dot tester multi-die test procedure

Claims (8)

A multi-die test method is used for spot testing a plurality of test dies for a plurality of test dies, the test finder comprising a plurality of probe sets, the test method comprising the steps of: obtaining the plurality of crystals to be tested According to the position data, when the positions of the probe groups correspond to the position data, it is judged that the samples to be tested are not offset, and the pair of probes are not offset. The die to be tested is subjected to spot measurement; and according to the position data, when the positions of the probe sets cannot correspond to the position data, determining that the die to be tested is offset, and moving the probe sets and the At least one of the to-be-measured dies is spot-measured with at least one of the sets of probes to produce an offset die. The test method of claim 1, wherein the spotting of the unmeasured die with the probe set according to the location data includes: controlling the probe The needle set is in a needle-out state, thereby performing spot measurement on the die to be tested without offset. The test method of claim 2, wherein the at least one of the probe sets and the at least one of the test dies are moved according to the position data, and at least one of the probe sets is offset. The spot measurement of the die to be tested includes: moving at least one of the probe sets and the die to be tested, and controlling at least one of the probe sets to be in the exit pin state, thereby generating a bias Move the die to be tested for spot measurement. The test method of claim 2, wherein controlling the probe groups in the needle-out state controls the probe group to move toward the die to be tested to cause the probe groups to be in the needle-out state. . A multi-die spot measuring machine is used for simultaneously testing a plurality of die to be tested, the spot measuring machine comprises: a detecting platform for carrying the to-be-tested crystal grains; a plurality of probe sets; a plurality of receiving The needle module is respectively connected to the probe sets to control at least one of the probe sets to be in a needle-out state or a needle-retracting state relative to the vertical movement of the die to be tested; And the control module is configured to control the at least one of the probe sets and the detection platform to perform an up and down operation according to the location data. And a plane displacement; wherein, when the positions of the probe groups correspond to the position data, the control module determines that the die to be tested does not generate an offset, and the probe pairs are not offset The die to be tested is spot-measured; when the positions of the probe sets cannot correspond to the location data, the control module determines that the die to be measured is offset, and moves the probe sets according to the location data. And at least one of the crystals to be tested to be offset Crystal grains measured point. The spot measuring machine of claim 5, wherein the pinching module comprises a voice coil motor. The spot measuring machine according to claim 5, wherein the needle receiving module It contains a solenoid valve. The spot measuring machine of claim 5, wherein the pinching module controls at least one of the probe sets to move toward the die to be tested to cause the probe sets to be in the needle The state, and controlling at least one of the probe sets to move in opposite directions of the die to be tested, causes the probe sets to be in the pinning state.