TWI445482B - Electronic device - Google Patents

Description

Electronic device

The present invention relates to an electronic device and the electronic device.

In recent years, electronic devices have begun to adopt metal casings. In order to meet the requirements of consumers for thinning and thinning electronic devices, the metal casings used in electronic devices are becoming thinner and lighter, and the thickness thereof is generally about 1 mm, and the thinnest portion is even only about 0.5 mm. However, the thickness of the metal casing is thinned to weaken the structural strength, resulting in a decrease in the anti-fall performance of the electronic device. If the electronic device is hit by an external force or accidentally dropped, it may damage the electronic device. How to make the electronic device light and thin and ensure its anti-drop performance is a problem that the industry has been trying to solve.

In view of the above, it is necessary to provide an electronic device having better anti-drop performance and a method of manufacturing the metal casing of the electronic device.

An electronic device includes a metal housing and a support frame fixedly coupled to the metal housing, the metal housing including a bottom wall and a side wall extending from an edge of the bottom wall to a side thereof, the support frame including support walls sequentially contacting The support wall is connected to the side wall of the metal casing, the connection of the support wall forms a receiving portion, and the electronic device further includes a protection piece disposed on the receiving portion, the protection piece and the metal The housing is fixedly connected, and the bottom wall is formed with a recessed portion at an intermediate portion by chemical etching, and the thickness of the bottom wall adjacent to the periphery of the side wall is larger than the thickness of the recessed portion.

The recessed portion of the metal casing is formed by a chemical etching method due to a chemical etching method It does not squash or impact the metal casing, and does not require fixture positioning. The overall structural strength of the metal casing is not affected, and the stability of the overall structure of the metal casing can be maintained, thereby ensuring the thinness and thinness of the metal casing. Can improve the anti-drop performance of electronic devices.

100‧‧‧Electronic devices

10‧‧‧Metal housing

11‧‧‧ bottom wall

12‧‧‧ side wall

13‧‧‧Depression

20‧‧‧Support frame

21‧‧‧Support wall

22‧‧‧ accommodating department

23‧‧‧ Groove

30‧‧‧Protection film

40‧‧‧ display

1 is a perspective assembled view of an electronic device according to an embodiment of the present invention.

2 is an exploded perspective view of the electronic device shown in FIG. 1.

Figure 3 is an enlarged view of the portion III shown in Figure 2.

4 is a partial cross-sectional view of the electronic device of FIG. 1 taken along line IV-IV.

The electronic device provided by the present invention and the manufacturing method of the metal casing of the electronic device will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 and FIG. 2, the electronic device 100 includes various functional modules for implementing various functions. However, in order to save space, the present embodiment focuses on the metal casing 10 and the support frame 20 of the electronic device 100. Display 40 and other structures. The electronic device 100 of the present embodiment may be a touch computer, a mobile phone, an MP3, a PDA (Personal Digital Assistant), a digital photo frame, a liquid crystal display, or the like. In the present embodiment, a touch computer will be described as an example. The support frame 20 is fixedly coupled to the metal housing 10. The display screen 40 is disposed on the support frame 20.

The metal casing 10 is substantially square and includes a bottom wall 11 and four side walls 12 extending from the edge of the bottom wall 11 toward one side thereof and sequentially connected. The bottom wall 11 is formed with a recessed portion 13. The recessed portion 13 is located substantially at the middle portion of the bottom wall 11, so that the thickness of the bottom wall 11 adjacent to the periphery of the side wall 12 is larger than the thickness of the recessed portion 13, and the mechanical strength of the periphery is also relatively large. In the present embodiment, the material of the metal casing 10 is an aluminum alloy. It can be understood that the metal casing 10 is made of wood. The quality can also be other metals such as magnesium alloy or stainless steel. The thickness of the bottom wall 11 is less than or equal to 1.2 mm. The depressed portion 13 is formed by a chemical etching method. In this embodiment, the four side walls 12 are all curved outward curved structures, and the adjacent two side walls 12 are connected to each other to form a curved surface that smoothly transitions with the curved structure of the side wall 12 to increase the aesthetics of the electronic device 100. It can be understood that the side wall 12 can also be designed to be substantially perpendicular to the wall surface of the bottom wall 11. In the present embodiment, the recessed portion 13 is substantially square in size smaller than the bottom wall 11. It can be understood that the recessed portion 13 is a single recessed structure, and its outer shape may also be a circular shape, a hexagonal shape or other irregular shapes; the recessed portion 13 may also be a multi-recessed structure composed of a plurality of undulating or mesh-shaped recesses.

A method of manufacturing a metal casing 10 of an electronic device 100 includes the steps of: blanking, providing a metal blank; stamping to obtain a preform of the metal casing 10, the preform including the bottom wall 11 and from the edge of the bottom wall 11 a side wall 12 extending on one side and connected in sequence; shielding a peripheral portion of the bottom wall 11 to protect the peripheral portion from corrosion; chemically etching the middle portion of the bottom wall 11 of the preform to form the recess portion 13; The residual chemical etching solution is removed to obtain a metal casing 10. The thickness of the recess 13 can be controlled by the time of chemical etching. The longer the chemical etching, the smaller the thickness of the depressed portion 13. In the present embodiment, the metal blank is an aluminum alloy. It can be understood that the material of the metal blank can also be other metals such as magnesium alloy or stainless steel.

Referring to FIG. 3 and FIG. 4 together, the support frame 20 is disposed in the metal casing 10 and closely adjacent to the four side walls 12 of the metal casing 10. The support frame 20 includes four support walls 21 that are sequentially connected. The electronic device 100 further includes a protective sheet 30 fixedly coupled to the metal housing 10. Four receiving portions 22 are formed at the joint of the adjacent support walls 21 for accommodating the protective sheet 30. The support wall 21 is adjacent to the top surface of the metal casing 10 (not shown) and has an elongated strip 23 for receiving a colloid (not shown). The support frame 20 and the metal casing 10 are in the groove 23 The glue is fixedly attached and the protective sheet 30 is placed in the housing portion 22. It can be understood that the recess 23 can also be omitted, and the support wall 21 can be fixedly connected to the metal casing 10 by other means, such as welding, providing a snap element or the like.

The protective sheet 30 is matched with the shape of the receiving portion 22 of the support frame 20. In the present embodiment, the protective sheet 30 is fixedly coupled to the metal casing 10 by welding. The material of the protective sheet 30 is preferably an alloy having a large hardness (rockwell hardness of 50 or more) such as stainless steel or tungsten steel. It can be understood that the protective sheet 30 can be fixedly connected to the metal casing 10 in other manners, such as a snap structure or the like.

The display screen 40 is disposed on the support frame 20 and is fixedly connected to the support frame 20.

The recessed portion 13 of the thin metal casing 10 is formed by a chemical etching method. Compared with the stamping, since the chemical etching method does not press or impact the metal casing 10, it does not exert a force on the metal casing 10, Therefore, the crystal structure of the metal casing 10 does not change, and the metal casing 10 does not have local stress, so that the overall structural strength of the metal casing 10 is not affected, and the stability of the overall structure of the metal casing 10 can be maintained. . Compared with the CNC milling, since the chemical etching method does not require a positioning jig having a large clamping force, the metal casing 10 does not deform. Therefore, the recess 13 is formed by the chemical etching method, which not only ensures the thinness and thinness of the metal casing 10, but also improves the anti-drop performance of the electronic device 100. In addition, from the perspective of cost, since the chemical etching method does not require a difficult and costly mold (used when stamping is formed) or a tool (which is required for CNC milling), the chemical etching method is simpler than the prior art. , the cost is lower. Moreover, since the protective sheet 30 having a relatively high hardness is disposed in the accommodating portion 22 of the support frame 20, when the electronic device 100 is accidentally dropped or impacted by an external force, the protective sheet 30 can buffer the external force, thereby further improving the anti-drop performance of the electronic device 100. The greater the hardness of the material of the protective sheet 30, the better the protection effect on the electronic device 100. The protective sheet 30 has a simple structure and a small volume, and is disposed inside the metal casing 10 without affecting the appearance of the electronic device 100.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

100‧‧‧Electronic devices

10‧‧‧Metal housing

11‧‧‧ bottom wall

12‧‧‧ side wall

13‧‧‧Depression

20‧‧‧Support frame

21‧‧‧Support wall

30‧‧‧Protection film

40‧‧‧ display

Claims (5)

An electronic device comprising a metal housing and a support frame fixedly coupled to the metal housing, wherein the metal housing comprises a bottom wall and a side wall extending from an edge of the bottom wall toward a side thereof The support frame includes support walls that are sequentially connected, the support walls are connected to the side walls of the metal casing, the connection of the support walls forms a receiving portion, and the electronic device further includes a protection disposed on the receiving portion. a protective piece is fixedly connected to the metal casing, and the bottom wall is formed with a concave portion at an intermediate portion by a chemical etching method, and a thickness of the bottom wall adjacent to a periphery of the side wall is greater than a thickness of the concave portion Big. The electronic device of claim 1, wherein the metal casing is made of an aluminum alloy, a magnesium alloy or a stainless steel. The electronic device of claim 1, wherein the metal casing has a thickness of less than or equal to 1.2 mm. The electronic device of claim 1, wherein the depressed portion is a single concave structure having a circular shape, a hexagonal shape or other irregular shape, or a plurality of depressions formed by a multi-wave or mesh depression. structure. The electronic device of claim 1, wherein the protective sheet is made of stainless steel or tungsten steel.