201215279 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子裝置及該電子裝置之金屬殼體之製 造方法。 【先前技#f】 [0002] 近年來電子裝置開始採用金屬殼體，為滿足消費者對電 子裝置輕薄化之要求，電子裝置採用之金屬殼體愈來愈 輕薄，其厚度一般約為1 mm，最薄處甚至僅約為0. 5mm， 然，金屬殼體厚度變薄使結構強度減弱，導致電子裝置 抗摔性能降低。如電子裝置受到外力撞擊或意外跌落， 則有可能損壞電子裝置。如何使電子裝置輕薄化並保證 其抗摔性能較好係業界一直努力解決之問題。 【發明内容】 [0003] 鑒於以上内容，有必要提供一種抗摔性能較好之電子裝 置及該電子裝置之金屬殼體之製造方法。 [0004] 一種電子裝置，其包括金屬殼體及與金屬殼體固定連接 之支撐框，金屬殼體包括底壁及從底壁邊緣向其一側延 伸之側壁，底壁藉由化學腐蝕方法於中間部位形成有凹 陷部，底壁鄰近側壁之周邊之厚度比所述凹陷部之厚度 大。 [0005] 一種電子裝置之金屬殼體之製造方法，其包括如下步驟 :下料，提供金屬毛坯；衝壓，得到金屬殼體之預型體 ，預型體包括底壁及從底壁邊緣向其一侧延伸之側壁； 將預型體進行化學腐蝕，於底壁之中間部位形成凹陷部 099131977 ，得到金屬殼體，底壁鄰近側壁之周邊之厚度比凹陷部 表單編號A0101 第4頁/共15頁 0992056006-0 201215279 [0006] [0007] ❹ [0008] Ο [0009] 099131977 之厚度大。 該金屬殼體之凹陷部採用化學腐蝕方法形成，由於化學 腐钮方法不會擠壓或衝擊金屬殼體，亦無需夾具定位， 金屬殼體之整體結構強度不會受到影響，能夠保持金屬 殼體整體結構之穩定性，從而既能保證金屬殼體之輕薄 化，亦能提高電子裝置之抗摔性能。 【實施方式】 下面以具體實施方式並結合附圖對本發明提供之電子裝 置及該電子裝置之金屬殼體之製造方法作進一步詳細說 明。 請參閱圖1及圖2，電子裝置100包括各種功能模組以用於 實現各種相應之功能，然，為節省篇幅，本實施方式重 點介紹該電子裝置100之金屬殼體10、支撐框20及顯示屏 40等結構。本實施方式之電子裝置100可為觸摸式電腦、 手機、MP3、PDA (Personal Digital Assistant) 、數碼相框、液晶顯示器等。在本實施方式中，以觸摸 式電腦為例進行說明。支撐框20與金屬殼體10固定連接 。顯示屏40設置於支撐框20上。 金屬殼體10大致呈方形，其包括底壁11及從底壁11邊緣 向其一側延伸且依次相連之四側壁12。底壁11形成有凹 陷部13。凹陷部13大致位於底壁11之中間部位，因此底 壁11鄰近側壁12之四周之厚度比凹陷部13之厚度大，四 周之機械強度亦相應較大。在本實施方式中，金屬殼體 10之材質為鋁合金。可理解，金屬殼體10之材質亦可為 其它金屬，如鎂合金或不銹鋼等。底壁11之厚度小於或 表單編號A0101 第5頁/共15頁 0992056006-0 201215279 Γ·侧。凹陷部13採用化學腐財法形成。本實施方 式中’，壁12均杨外㈣之_結構，彳目鄰之二側 壁12之相核為與側壁12之弧形結構Μ過渡之孤面， 以增加電子裝置100之美觀度 為基本垂直於底壁11之壁面。 。可理解，側壁12亦可設計 本實施方式_，凹陷部13 大致呈尺寸比底壁11小之方形 可理解’凹陷部13為單 凹陷結構，其外形亦可為圓形、六邊形或其他不規則形 狀；凹陷部13亦可由多波浪狀或網狀凹陷構成之多凹陷 結構。 [_ -種電子裝置_之金屬殼龍之製造方法包括如下步驟 .下料，提供金屬毛坯；衝壓，得到金屬餐體1〇之預型 體，預型體包括底壁U及從底壁“邊緣向其一側延伸且 依次相連之四側壁12 ;遮蔽底壁u之周邊部位，以保護 該周邊部位不會被腐蝕；對預型體之底壁11令部進行化 子腐姓以形成凹陷部13 ;清洗，以去除殘留之化學腐餘 溶液，得到金屬殼體〗〇。凹陷部13之厚度可由化學腐蝕 之時間控制。化學腐蝕之時間愈長，凹陷部13之厚度愈 小。本實施方式中金屬毛坯為鋁合金。可理解，金屬毛 坯之材質亦可為其它金屬，如鎂合金或不銹鋼等。 [0011]請一併參閱圖3及圖4，支撐框20設置於金屬殼體1〇内並 與金屬殼體1〇之四侧壁12緊密相鄰。支撐框2〇包括依次 相連之四支撐壁21。電子裝置1〇〇還包括與金屬殼體1〇固 定連接之保護片30。相鄰之支撐壁21相連處形成有四容 納部22 ’用於容納保護片3〇。支撐壁21鄰近金屬殼體1〇 之頂面（圖未標）開設有長條形之用來容納膠體（圖未 099131977 表單編號A0101 第6頁/共15頁 0992056006-0 201215279 示）之凹槽23。支撐框20與金屬殼體10藉由凹槽23中之 膠體固定連接，並使保護片30位於容納部22内。可理解 ，凹槽23亦可省略，支撐壁21上可採用其他方式與金屬 殼體10固定連接，如焊接，設置卡扣元件等。 [0012] 保護片30與支撐框20之容納部22之形狀相配合。本實施 方式中，保護片30藉由焊接方式固定連接於金屬殼體10 。保護片30之材質優選為硬度較大（洛氏硬度達50以上 )之合金，如不銹鋼、鎢鋼等。可理解，保護片30可採 0 用其他方式與金屬殼體10固定連接，如卡合結構等。 [0013] 顯示屏40設置於支撐框20上，並與支撐框20固定連接。 ' [0014] 厚度較薄之金屬殼體10之凹陷部13採用化學腐蝕方法形 成，相對於衝壓形成，由於化學腐蝕方法不會擠壓或衝 擊金屬殼體10，不會對金屬殼體10產生力之作用，故， 金屬殼體10之晶體結構不會改變，金屬殼體10亦不會有 局部應力作用，從而金屬殼體10之整體結構強度不會受 到影響，能夠保持金屬殼體10整體結構之穩定性。相對 ◎ 於CNC銑削形成，由於化學腐蝕方法無需採用夾持力較大 之定位夾具，所以金屬殼體1 0不會產生形變。故，採用 化學腐蝕方法形成凹陷部13，既保證了金屬殼體10之輕 薄化，又提高了電子裝置100之抗摔性能。另外，從成本 方面考慮，由於化學腐蝕方法不需要難度較大、成本較 高之模具（衝壓形成時需採用）或刀具（CNC銑削時需採 用），相對於現有技術，化學腐蝕方法則更簡單，成本 更低。又由於支撐框20之容納部22内設置有硬度較大之 保護片30，當電子裝置100意外跌落或受到外力撞擊時， 099131977 表單編號A0101 第7頁/共15頁 0992056006-0 201215279 保護片30可緩衝外力，進一步提高了電子裝置100之抗摔 性能。保護片30材質之硬度愈大，其對電子裝置100之保 護效果愈好。保護片30結構簡單、體積小，且設置於金 屬殼體10内部，不影響電子裝置100之外觀。 [0015] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0016] 圖1係本發明實施方式之電子裝置之立體組裝圖。 [0017] 圖2係圖1所示電子裝置之立體分解圖。 [0018] 圖3係圖2所示III處之放大圖。 [腿9] 圖4係圖1所示電子裝置沿IV-IV線之局部剖視圖。 【主要元件符號說明】 [0020] 電子裝置100 [0021] 金屬殼體10 [0022] 底壁 11 [0023] 側壁 12 [0024] 凹陷部13 [0025] 支撐框2 0 [0026] 支撐壁21 099131977 表單編號A0101 第8頁/共15頁 0992056006-0 201215279 ίυυζ,ι j [0028] [0029] [0030] 容納部22 凹槽23 保護片30 顯示屏4 0 Ο ο 099131977 表單編號Α0101 第9頁/共15頁 0992056006-0201215279 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to an electronic device and a method of manufacturing the metal casing of the electronic device. [Previous technology #f] [0002] In recent years, electronic devices have begun to adopt metal casings. In order to meet the requirements of consumers for thinning and thinning electronic devices, metal casings used in electronic devices are becoming thinner and thinner, and their thickness is generally about 1 mm. The thinnest portion is even only about 0.5 mm. However, the thickness of the metal casing is thinned to weaken the structural strength, resulting in a decrease in the anti-fall performance of the electronic device. If the electronic device is hit by an external force or accidentally dropped, it may damage the electronic device. How to make the electronic device light and thin and ensure its anti-drop performance is a problem that the industry has been trying to solve. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide an electronic device having better drop resistance and a method of manufacturing the metal case of the electronic device. [0004] An electronic device includes a metal casing and a support frame fixedly coupled to the metal casing, the metal casing including a bottom wall and a side wall extending from an edge of the bottom wall to one side thereof, the bottom wall being chemically corroded The intermediate portion is formed with a recessed portion, and the thickness of the bottom wall adjacent to the periphery of the sidewall is larger than the thickness of the recessed portion. [0005] A method of manufacturing a metal casing for an electronic device, comprising the steps of: blanking, providing a metal blank; stamping to obtain a preform of a metal casing, the preform comprising a bottom wall and from the edge of the bottom wall The sidewall extending on one side; the preform is chemically etched, and a recessed portion 099131977 is formed in the middle portion of the bottom wall to obtain a metal shell, and the thickness of the bottom wall adjacent to the periphery of the sidewall is larger than the recessed portion. Form No. A0101 Page 4 of 15 Page 0992056006-0 201215279 [0006] [0007] [0009] 099131977 The thickness is large. The concave portion of the metal casing is formed by chemical etching. Since the chemical corrosion button method does not squeeze or impact the metal casing, and the fixture is not required to be positioned, the overall structural strength of the metal casing is not affected, and the metal casing can be maintained. The stability of the overall structure can not only ensure the thinness and thinness of the metal casing, but also improve the anti-drop performance of the electronic device. [Embodiment] Hereinafter, an electronic device provided by the present invention and a method of manufacturing a metal case of the electronic device will be described in further detail with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2 , the electronic device 100 includes various functional modules for implementing various functions. However, in order to save space, the present embodiment focuses on the metal casing 10 and the support frame 20 of the electronic device 100 . Display 40 and other structures. The electronic device 100 of the present embodiment may be a touch computer, a mobile phone, an MP3, a PDA (Personal Digital Assistant), a digital photo frame, a liquid crystal display, or the like. In the present embodiment, a touch computer will be described as an example. The support frame 20 is fixedly coupled to the metal casing 10. The display screen 40 is disposed on the support frame 20. The metal casing 10 is substantially square and includes a bottom wall 11 and four side walls 12 extending from one edge of the bottom wall 11 to one side thereof and sequentially connected. The bottom wall 11 is formed with a recessed portion 13. The depressed portion 13 is located substantially at the intermediate portion of the bottom wall 11, so that the thickness of the bottom wall 11 adjacent to the periphery of the side wall 12 is larger than the thickness of the depressed portion 13, and the mechanical strength of the four weeks is correspondingly large. In the present embodiment, the material of the metal casing 10 is an aluminum alloy. It can be understood that the material of the metal casing 10 can also be other metals such as magnesium alloy or stainless steel. The thickness of the bottom wall 11 is less than or Form No. A0101 Page 5 of 15 0992056006-0 201215279 Γ· Side. The depressed portion 13 is formed by a chemical rot method. In the present embodiment, the wall 12 is a structure of the outer layer (4), and the phase core of the side wall 12 of the adjacent side is an isolated surface of the curved structure of the side wall 12 to increase the aesthetics of the electronic device 100. It is perpendicular to the wall surface of the bottom wall 11. . It can be understood that the sidewall 12 can also be designed in the present embodiment. The recessed portion 13 is substantially smaller in size than the bottom wall 11. The recessed portion 13 has a single recessed structure, and its shape can also be circular, hexagonal or other. Irregular shape; the recessed portion 13 may also be a multi-recessed structure composed of a plurality of undulating or mesh-shaped recesses. [_ - The electronic device _ The method of manufacturing the metal shell dragon includes the following steps: cutting, providing a metal blank; stamping, obtaining a preform of the metal food 1 ,, the preform including the bottom wall U and the bottom wall The four side walls 12 extending from the edge to one side and sequentially connected to each other; shielding the peripheral portion of the bottom wall u to protect the peripheral portion from being corroded; and forming a depression on the bottom wall portion 11 of the preform Part 13; cleaning to remove residual chemical residual solution to obtain a metal shell. The thickness of the depressed portion 13 can be controlled by the time of chemical etching. The longer the chemical etching time, the smaller the thickness of the depressed portion 13. In the mode, the metal blank is an aluminum alloy. It can be understood that the material of the metal blank can also be other metals, such as magnesium alloy or stainless steel, etc. [0011] Please refer to FIG. 3 and FIG. 4 together, the support frame 20 is disposed on the metal shell 1 The inside of the crucible is closely adjacent to the side wall 12 of the metal casing 1 . The support frame 2 includes four supporting walls 21 connected in sequence. The electronic device 1 further includes a protective sheet 30 fixedly connected to the metal casing 1 . Adjacent support walls 21 are connected There are four receiving portions 22' for accommodating the protective sheet 3. The supporting wall 21 is adjacent to the top surface of the metal casing 1 (not shown) and has an elongated strip for accommodating the colloid (Fig. 099131977 Form No. A0101 No. 6 The groove 23 of the support frame 20 and the metal casing 10 are fixedly connected by the glue in the groove 23, and the protective sheet 30 is placed in the accommodating portion 22. It is understood that the concave portion is concave. The groove 23 can also be omitted, and the support wall 21 can be fixedly connected to the metal casing 10 by other means, such as welding, providing a snap element, etc. [0012] The protective sheet 30 is matched with the shape of the receiving portion 22 of the support frame 20. In the present embodiment, the protective sheet 30 is fixedly connected to the metal casing 10 by welding. The material of the protective sheet 30 is preferably an alloy having a high hardness (rockwell hardness of 50 or more), such as stainless steel, tungsten steel, etc. The protective sheet 30 can be fixedly connected to the metal casing 10 by other means, such as a snap-fit structure, etc. [0013] The display screen 40 is disposed on the support frame 20 and fixedly connected to the support frame 20. '[0014] Thickness The recess 13 of the thin metal casing 10 is chemically used The etching method is formed. Compared with the stamping formation, since the chemical etching method does not press or impact the metal casing 10, and does not exert a force on the metal casing 10, the crystal structure of the metal casing 10 does not change, and the metal The housing 10 also does not have local stress, so that the overall structural strength of the metal casing 10 is not affected, and the stability of the overall structure of the metal casing 10 can be maintained. Compared with the CNC milling, the chemical corrosion method is not required. Since the metal housing 10 is not deformed by the positioning clamp having a large clamping force, the recess 13 is formed by the chemical etching method, which not only ensures the thinness and thinness of the metal casing 10, but also improves the resistance of the electronic device 100. Fall performance. In addition, from the perspective of cost, since the chemical etching method does not require a difficult and costly mold (used when stamping is formed) or a tool (which is required for CNC milling), the chemical etching method is simpler than the prior art. , the cost is lower. Moreover, since the protective piece 30 having a relatively high hardness is disposed in the accommodating portion 22 of the support frame 20, when the electronic device 100 is accidentally dropped or hit by an external force, 099131977 Form No. A0101 Page 7 / Total 15 Page 0992056006-0 201215279 Protective sheet 30 The external force can be buffered, and the anti-drop performance of the electronic device 100 is further improved. The greater the hardness of the material of the protective sheet 30, the better the protection effect on the electronic device 100. The protective sheet 30 has a simple structure, a small size, and is disposed inside the metal casing 10 without affecting the appearance of the electronic device 100. [0015] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0016] FIG. 1 is a perspective assembled view of an electronic device according to an embodiment of the present invention. 2 is an exploded perspective view of the electronic device shown in FIG. 1. 3 is an enlarged view of a portion III shown in FIG. 2. [Leg 9] Fig. 4 is a partial cross-sectional view of the electronic device shown in Fig. 1 taken along line IV-IV. [Main Component Symbol Description] [0020] Electronic Device 100 [0021] Metal Housing 10 [0022] Bottom Wall 11 [0023] Side Wall 12 [0024] Depression 13 [0025] Support Frame 20 [0026] Support Wall 21 099131977 Form No. A0101 Page 8 / Total 15 Page 0992056006-0 201215279 υυζ, ι j [0028] [0030] accommodating portion 22 groove 23 protective sheet 30 display screen 4 0 Ο ο 099131977 Form No. Α 0101 Page 9 / Total 15 pages 0992056006-0