TWI442853B - Method and protection apparatus for protecting a thermal sensitive component in a thermal process - Google Patents

Description

Method and protection device for protecting a heat sensitive component in a thermal process

The present invention relates to a protection device and method. More particularly, the present invention relates to a protection device and method for protecting a heat sensitive component during processing to prevent damage from heat.

In today's high environmental awareness, the demand for lead free processes is increasing in printed circuit board assembly (PCBA) technology. For example, in the past, tin-lead solder for printed circuit board assembly was converted to the current more common tin-silver-copper (SAC) alloy solder or tin-copper. Typically, the melting point, soldering temperature, and wave soldering temperature of lead-free solder are 20~30°C higher than that of tin-lead solder. In addition, the solder-free soldering performance of lead-free solder is poor. Generally, the assembler will increase the tin temperature to improve the processability.

In a typical printed circuit board assembly process, some heat sensitive components can only withstand the thermal stress of a lower temperature eutectic solder, but for the high temperature requirements of lead-free processes, these heat sensitive components Not applicable. For example, it is common to assemble a liquid crystal display (LCD) on a printed circuit board that cannot withstand the thermal stresses of a wave soldering process.

In view of the limitations of the above-mentioned heat sensitive components, hand soldering is often used to assemble a liquid crystal display onto a liquid crystal display. However, compared to an automated process, this conventional technique is not a reliable process and is not cost effective. Also less efficient.

In one aspect of the invention, in a printed circuit board assembly process, a protection device and method are provided to protect the heat sensitive component from damage due to heat.

In one aspect of the invention, in a lead-free process, a reliable assembly process is provided for the heat sensitive component, which not only meets the requirements of environmental protection, but also has the advantages of high efficiency and is cost-effective.

In accordance with an embodiment of the invention, a method for a heat sensitive component in a thermal process: providing a plate to place the heat sensitive component on the panel; providing a protective device made of a thermoelectric material and removable And protecting the heat sensitive component with the protection device in the thermal process, wherein in response to applying a voltage to the protection device, the protection device cools the heat sensitive component during the thermal process.

According to another embodiment of the present invention, the protection device includes: a cap body in which the heat sensitive element is capped and in thermal communication with the heat sensitive element; and a battery that causes the thermoelectric material A thermoelectric effect is generated to cool the heat sensitive element.

According to another embodiment of the present invention, the cap body can include a second body portion and a first body portion disposed on the second body portion, wherein the first body portion and the second portion One of the materials of the body portion is a P-type thermoelectric material, and the other material is an N-type thermoelectric material.

According to another embodiment of the present invention, the cap body includes a first substrate, a second substrate, a P-type thermoelectric material wafer between the first substrate and the second substrate, and an N-type thermoelectric material wafer, and a The electrodes of the PN junction, the first substrate and the second substrate are sealable to define a sealed space. Before the step of protecting the heat sensitive component by the protection device, the method further comprises: vacuuming the sealed space of the protection device.

In accordance with another embodiment of the present invention, a protection device for a heat sensitive component in a thermal process is disposed on a board. The protection device includes: a removable device body having a cavity to accommodate at least a portion of the heat sensitive component and being fabricated from a thermoelectric material for protecting the heat sensitive component during the thermal process; and a battery for A voltage is applied to the body of the removable device to cause the protective device to cool the heat sensitive element.

According to another embodiment of the present invention, the removable body includes a second body portion and a first body portion disposed on the second body portion, wherein the first body portion and the first body portion One of the two body portions is made of a P-type thermoelectric material, and the other material is an N-type thermoelectric material.

According to another embodiment of the present invention, the removable device body includes a first substrate, a second substrate, a P-type thermoelectric material wafer between the first substrate and the second substrate, and an N-type thermoelectric material wafer. And an electrode of the PN junction, the first substrate and the second substrate are sealable to define a sealed space. Before the protection device protects the heat sensitive component, the sealed space of the protection device is further evacuated.

The features, advantages, and similar expressions of the present invention are not to be construed as being limited by the scope of the invention. Rather, the specific features, advantages, or characteristics described in connection with the specific embodiments are included in at least one embodiment of the invention. Therefore, the description of features and advantages, and similar expressions in this specification are related to the same specific embodiments, but are not essential.

In addition, the features, advantages, and characteristics of the invention may be combined in any suitable manner in one or more embodiments. It will be apparent to those skilled in the art that the present invention may be practiced without a particular feature or advantage. In other instances, it is apparent that other features and advantages of the specific embodiments may not be present in all embodiments of the invention.

These features and advantages of the present invention will become more apparent from the description of the appended claims appended claims.

A reference to "a particular embodiment" or a similar expression in the specification means that a particular feature, structure, or characteristic described in connection with the specific embodiment is included in at least one embodiment of the invention. Therefore, the appearances of the phrase "in a particular embodiment"

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a protective device and a method for a heat sensitive component on a board in a thermal process in accordance with an embodiment of the present invention will be described with reference to the accompanying drawings. The first figure shows a preferred embodiment of a panel 100 that includes a board 104 (such as, but not limited to, a printed circuit board) having a heat sensitive component 108 disposed thereon (such as, but not limited to, a monitor module) A display module, and other components surrounding the display module 108, may include, but are not limited to, a man/machine interface 112, a capacitor 116, a switch 124, a transducer 128. , memory 132, micro controller 136, pressure sensor 140, light emitting diode (LED) 144, and other components (such as inductors, resistors, connectors, etc.) components and the like. All of the above elements may be conventional components, such as those used in many conventional data processing systems, and may be configured to operate as described herein.

The printed circuit board 104 is a kind of substrate, which can provide various components to be connected and mounted, and achieves specific effects and effects through mutual combination of different components. A common printed circuit board 104 includes a motherboard, a display card, a panel card, a wireless network card, and the like; the display module 108 can be a liquid crystal display module, a plasma display module, etc.; It can be bonded to a circuit board (such as an SMT component) by surface mount technology (SMT), or it can be fixed to a circuit board (such as a pin component) by wave soldering, or can be connected. The technology is combined and the invention is not intended to be limited.

In general, in the wave soldering process, the soldering system uses a pump to form a long tin wave into the liquid tin in the tin furnace, and then the board is passed through the tin wave by means of a conveyor belt in a diagonally rising manner. The liquid tin is filled into the hole at the pin of the pin member, filled with tin, and forms a solder joint. The above process is a part of the conventional wave soldering process, and will not be described herein.

Surface adhesion technology is a related technique for directly bonding components to a substrate of a printed circuit board. In a conventional surface sticking technique, a surface mounter machine is used in conjunction with a surface mount technique to lay components onto a circuit board and then perform subsequent processes. The surface sticking of the components to the surface of the board as described above is part of the prior art and will not be described here. Simultaneously. However, the connection of the components to the circuit board can also be formed using other conventional techniques, and the invention is not intended to be limited.

The second diagram illustrates the aforementioned board 104 (such as but not limited to a printed circuit board), a heat sensitive component 108 (such as but not limited to a display module, an electrolytic capacitor, or a solid capacitor, etc.) in accordance with a preferred embodiment of the present invention. And a schematic diagram of the protection device 200 and its associated processes. The printed circuit board 104 has a front side 202, a back side 204, a through hole 208, and a printed circuit 212. In order to connect the display module 108 to the printed circuit board 104, the display module 108 has a solder connection 216 so that the solder connection 216 can pass through the via 208, and the solder connection 216 can be soldered to the printed circuit 212 of the back side 204. In other words, the soldering of the solder connections 216 to the components of the printed circuit 212 and the display module 108 are disposed on different surfaces of the printed circuit board 104. In addition to the heat sensitive component 108, there are other electronic components 288 that can be attached to the printed circuit board 104 by soldering processes, wave soldering processes, or hand soldering processes.

The heat sensitive component 108, as the name implies, is a heat sensitive component and is susceptible to damage in an overheated environment. For components that are bonded to a board, they are generally classified into a pin through hole (PTH) and a surface mount type. The two types have different tolerances to heat, and the pin insertion type is generally resistant to heat. The degree is about 110 degrees ° C or less, and the surface adhesion type is about 230 degrees ° C or less. In the case of a lead-inserted component, in the case of a display module, at a temperature of more than about 100 ° C, it is susceptible to permanent damage due to thermal shock or thermal fatigue, and an electrolytic capacitor or a solid capacitor is taken as an example at a temperature. Above about 105 or 110 ° C, it is easy to suffer permanent damage due to capacitive cracking.

On the other hand, in order to achieve good soldering results, the display module 108 must often be in a high temperature environment for a period of time during the soldering process. In accordance with a wave soldering process in accordance with a preferred embodiment of the present invention, display module 108 is interposed on printed circuit board 104 and then slowly heated to about 70 to 95 °C. The actual soldering process is then carried out, typically at a temperature of about 90 to 95 ° C for at least 30 to 45 seconds, after which the temperature slowly drops to effect the solidification phase. In particular, when an environmentally-friendly lead-free solder is used, a high-temperature process is carried out at a temperature of about 95 ° C for about 30 seconds, in order to produce a reliable and good solder joint.

Returning to the second figure, in accordance with a preferred embodiment of the present invention, the protection device 200 can include a protection device body 260 having a void 258 and receiving at least a portion of the heat sensitive component 108 with a void 258, and protecting the device body The 260 is made of a thermoelectric material; the protection device 200 further includes a battery 264 for applying a voltage 292 to the protection device body 260 to cause the protection device 200 to generate a thermoelectric effect to cool the heat sensitive element 108.

According to a preferred embodiment of the present invention, the protection device 200 can include: a cap body 260 surrounding at least a portion of the heat sensitive component 108 and fabricated from a thermoelectric material to protect the heat sensitive component 108 during the thermal process; The battery 264 is configured to apply a voltage 292 to the cap body 260 to cause the protection device 200 to generate a thermoelectric effect to cool the heat sensitive element 108. The cap body 260 can include a first body portion 268 and a second body portion 272. A first body portion 268 and a second body portion 272 are coupled, and the first body portion 268 is electrically coupled to the anode 276 of the battery 264 and the second body portion 272 is electrically coupled to the cathode 280 of the battery 264. The material of the first body portion 268 may be a P-type thermoelectric material; the material of the second body portion 272 may be an N-type thermoelectric material. P-type thermoelectric materials and N-type thermoelectric materials, which may be semiconductor or semi-metal elements or compounds with high thermoelectric figure of merit, such as, but not limited to, bismuth telluride (BiSb) 2 (TeSe) 3 series doped with antimony and selenium. , PbTe and PbSnTe series, Half-Heusler metal alloy series, Si (Si) and SiGe series, Silicide Compound series, or tungsten selenide (WSe 2) series. The shape of the first body portion 268 and the second body portion 272 may be respectively a flat plate shape or other suitable shape; the protection device 200 further includes a snap member 284, a non-engagement member or the like to facilitate the cap. Actions, such as side walls, or other suitable shapes, are not intended to limit the invention.

In a preferred embodiment, the engaging member 284 can be a pair of elastic pieces connecting the removable cap body 260 for engaging the heat sensitive element 108 and cooperating with the removable cap body 260 to be hot. The cap heat sensitive element 108 in the process communicates thermally with the heat sensitive element 108 to further cool the heat sensitive element 108 based on the thermoelectric effect of the thermoelectric material. The material of the engaging member 284 may be aluminum or other suitable materials, and the invention is not intended to be limited. Further details of the thermoelectric effect and protection device/method of the cap body 260 and/or the engaging member 284 will be described and illustrated in detail later.

In accordance with a preferred embodiment of the present invention, in order to effectively protect the heat sensitive component 108 (e.g., but not limited to a display module) disposed on the board 104 (such as but not limited to a printed circuit board) in response to the various high temperature environments described above, the third diagram A method 300 of protecting a heat sensitive component 108 in a thermal process is illustrated. Referring to the first to third figures, the method 300 includes: providing a board 104 (step 304); providing a protection device 200 (see the second figure) made of a thermoelectric material (see step 308) Protecting the heat sensitive component 108 with the protective device 200 during the thermal process, wherein the protective device 200 cools the heat sensitive component 108 during the thermal process in response to applying a voltage 292 to the protective device 200 (step 312); and in the thermal process Thereafter, the protective device is removed from the heat sensitive component (step 316).

The so-called thermoelectric effect is a direct conversion of the temperature difference caused by voltage, and vice versa. In the case of a thermoelectric device, in response to a voltage applied thereto, a temperature difference is generated, and on the other hand, a voltage is generated when there is a temperature difference at both ends. Thermoelectric effects are generally applied to cooling objects, heating objects, generating electricity, or measuring temperature.

The thermoelectric effect can generally include three separately defined effects, the Seebeck effect, the Peltier effect, and the Thomson effect. Thermoelectric effects are well known to those skilled in the art, and further see, for example, http://en.wikipedia.org/wiki/Thermoelectric_effect.

The fourth figure is a further explanation of the Seebeck effect. In the fourth figure, the voltage generated by the Seebeck effect can be expressed as follows, where S _A and S _B are the Seebeck coefficients of metals A and B, T ₁ and T ₂ is the temperature at the junction of the two metals. On the other hand, the Peltier effect is the inverse effect of the Seebeck effect, that is, when a potential is generated by adding a power source to the circuit of two metals, there is a temperature difference at the contact point of the different metals.

According to a preferred embodiment of the present invention, the thermal process may be a wave soldering process, an SMT reflow process, a one hand soldering process, or a rework process. More broadly, the thermal process can be a sub-process of a printed circuit board process such as, but not limited to, a repair process, a manufacturing process, or a rework process.

In accordance with a preferred embodiment of the present invention, the fifth diagram illustrates the aforementioned board 104 (such as, but not limited to, a printed circuit board), a heat sensitive component 108 (such as but not limited to a display module, an electrolytic capacitor, or a solid capacitor, etc.), And a schematic diagram of the protection device 550 and its associated processes. As described above, in addition to the heat sensitive component 108, other electronic components 288 are disposed on the board 104. The electronic components 288 may be attached to the printed circuit board 104 by a soldering process, a wave soldering process, or a soldering process. .

Similarly, in order to achieve good soldering results, the heat sensitive component 108 must often be in a high temperature environment for a period of time during the soldering process. Referring to FIG. 5, the protection device 550 has a first substrate 554, a second substrate 558, a P-type thermoelectric material wafer 562, a N-type thermoelectric material wafer 566, and a PN connection between the first substrate 554 and the second substrate 558. The electrode of the face (not shown in the figure). The P-type thermoelectric material wafer 562 and the N-type thermoelectric material wafer 566 may be arranged between the first substrate 554 and the second substrate 558 in a staggered manner or in other similar or equivalent manner. The first base 554 can be an outer casing, and the second base 558 can be an inner casing. The welded portion 590 can be formed by a welding technique to seal the first base (the outer casing) 554 and the second base (the inner casing). 558 to form a sealed space 560 for subsequent vacuuming. Similarly, the first substrate (outer casing) 554 and the second substrate (inner casing) 558 can define a void 578 and the second substrate (inner casing) 558 can accommodate at least a portion of the heat sensitive element 108. The protection device 550 also has a battery 264 that applies a voltage 292 to the first substrate (outer casing) 554 and the second substrate (inner casing) 558 in a similar manner to cause the protection device 550 to generate a thermoelectric effect to cool the heat sensitive element 108. .

The material of the first substrate (outer casing) 554 and the second substrate (inner casing) 558 may be aluminum or other suitable materials; the material of the P-type thermoelectric material wafer 562 may be the aforementioned P-type thermoelectric material, and the N-type thermoelectric material wafer 566. The material may be the aforementioned N-type thermoelectric material; the first substrate (outer casing) 554 and the second substrate (inner casing) 558 may be respectively in the shape of a cap or other suitable shape; the first substrate (outer casing) 554 and the second The base (inner casing) 558 may be integrally formed integrally, or may be separately welded by a plurality of flat plates and joined by a sealing portion 594, for example, and the present invention is not intended to be limited.

In accordance with a preferred embodiment of the present invention, heat sensitive components 108 (e.g., but not limited to display modules) disposed on board 104 (such as, but not limited to, a printed circuit board) are effectively protected in various high temperature environments in response to the various high temperature environments described above. The sixth figure illustrates a method 660 of protecting the heat sensitive element 108 in a thermal process. Referring to the first to fifth figures, the method 660 includes: providing a board 104 (step 664); providing a protection device 550 (see FIG. 5) made of a thermoelectric material (see step 668) Vacuuming (about one atmosphere) of the protection device 550 (step 672), the vacuuming step can achieve the purpose of insulating heat transfer and increasing cooling; protecting the heat sensitive component 108 with the protection device 550 during the thermal process, wherein the response Applying a voltage 292 to the protection device 550, the protection device 550 cools the heat sensitive element 108 during the thermal process (step 676); and after the thermal process, removes the protection device from the heat sensitive element (step 680).

The seventh figure illustrates a schematic diagram of protecting a heat sensitive component 108 during a wave soldering process in accordance with a preferred embodiment of the present invention. On the printed circuit board 104, in addition to the heat sensitive component 108, there are other electronic components 508. Referring to the first to sixth figures, the printed circuit board 104 has perforations 208 for the solder connections 216 on the heat sensitive component 108 to pass. In the seventh diagram, a wave soldering process is used to connect the solder connection 216 to the printed circuit 212 of the printed circuit board 104 (as previously described, the printed circuit 212 and the heat sensitive component 108 are respectively located on opposite sides of the board 104). The wave soldering process shown in the seventh figure uses a conventional wave soldering machine 500, including a tunnel 504, a wave soldering tank 512, and other components not shown, including a housing, and a conveyor (for The workpiece to be welded is conveyed via the tunnel 504, the preheating zone, etc., and the above components are part of the conventional wave soldering machine 500, and are not described herein. The typical wave soldering process has a temperature of about 90 ° C to 260 ° C. During the wave soldering process, the protective device 200 (or the protective device 550 in the fifth figure) is thermally coupled to the heat sensitive element 108 such that the protective device 200 is hot The sensing element 108 isolates heat and provides a cold source to prevent the temperature of the heat sensitive element 200 from rising due to the wave soldering process. The protective device 200 can then be removed after the end of the wave soldering process.

The eighth figure illustrates a schematic diagram of protecting a heat sensitive component 808 during an SMT reflow process. According to a preferred embodiment of the present invention, the SMT heat sensitive component 808 is resistant to heat during reflow of the SMT thermal sensitive component 808. The degree is about 230 degrees ° C and the duration is about 20 to 40 seconds. However, the application of the protection device 200 in the second figure (or the protection device 550 in the fifth figure) can protect the SMT thermal sensor 808 below the tolerable temperature (eg, below about 230 degrees C), and the process time can be extended (eg, About 30 to 80 seconds). Referring again to the technical details shown in the preferred embodiment of the eighth embodiment, on the printed circuit board 104, in addition to the heat sensitive component 108, there are other electronic components 604 that can be fabricated by an SMT process. Attached to the printed circuit board 104. Also illustrated in the eighth figure is an SMT reflow process and associated apparatus. The SMT reflow process can utilize a conventional SMT reflow oven 600, including a reflow oven body 608, and other components not shown, including a transfer. The device is used to transport the workpiece to be reflowed through the reflow furnace body 608. The above components are part of the conventional SMT reflow furnace 600, and will not be described here. The temperature of a typical SMT reflow process is not mentioned here. About 183 ° C to 260 ° C, during the SMT reflow process, the protection device 200 (or the protection device 550 in the fifth figure) is thermally coupled to the heat sensitive element 108 such that the protection device 200 isolates heat from the heat sensitive element 108 and A cold source is provided to prevent the temperature of the heat sensitive component 108 from rising due to the SMT reflow process, while remaining below about 230 degrees C. The protective device 200 can then be removed after the end of the SMT reflow process.

Referring again to the wave soldering process shown in the seventh embodiment, a cooling embodiment will be described below in accordance with a preferred embodiment of the present invention. In the case where the target temperature is kept below 100 ° C, if the desired temperature is 95 ° C, and the current temperature is 125 ° C, and the process time lasts for about 28 seconds, the following equation can be used to calculate the workpiece (ie, heat sensitive element 108). The removed (or added) thermal Q (watts).

Q=m C _p (T _s -T _f )/t, where:

m is the mass (weight) of the workpiece (Kg),

C _p is the heat capacity of the workpiece (J/Kg ° C),

T is the time required to cool (or warm) the workpiece,

T _s is the starting temperature (°C),

T _f is the final temperature (° C.).

Thus, the weight of a workpiece and 10.6 g Example C _p is 0.6 J / Kg ℃, the following equation can be calculated to remove the heat.

Q=10.6/1000*1000*0.6*(125-95)/28=6.8

According to an exemplary embodiment of the present invention, heat sensitive components can be effectively protected and ensure good heat dissipation and cooling in various thermal processes, while the efficiency of process/assembly can be greatly improved, and is applicable to any workpiece having a thermal temperature limit. For example, it is possible to improve the efficiency of the process/assembly caused by manual soldering or mini wave soldering in the conventional technology, which is suitable for various processes and saves cost, and the above high temperature process is more effective. Improve the yield of its products.

The exemplary embodiment described is exemplified by a display module and a protection device having a cap body, but various forms/shapes of protection devices such as, but not limited to, an annular body, a sleeve body, etc.; In addition to the display module, it is also applicable to other heat sensitive components such as, but not limited to, electrolytic capacitors, or solid capacitors, etc., and the invention is not intended to be limited.

The present invention may be embodied in other specific forms without departing from the spirit and scope of the invention. The aspects of the specific embodiments are to be considered as illustrative and not restrictive. Accordingly, the scope of the invention is indicated by the appended claims rather All changes that fall within the meaning and scope of the patent application are deemed to fall within the scope of the patent application.

100. . . panel

104. . . Board, printed circuit board

108. . . Heat sensitive component

112. . . HMI

116. . . capacitance

124. . . switch

128. . . converter

132. . . Memory

136. . . Microcontroller

140. . . Pressure sensor

144. . . Light-emitting diode

200. . . protective device

202. . . positive

204. . . back

208. . . perforation

212. . . Printed circuit

216. . . Welded connection

258. . . Empty hole

260. . . Protection device body

264. . . battery

260. . . Cap body

268. . . First body part

272. . . Second body part

276. . . anode

280. . . cathode

284. . . Clip

288. . . Electronic component

292. . . Voltage

300. . . method

304. . . step

308. . . step

312. . . step

316. . . step

500. . . Wave welder

504. . . tunnel

508. . . Electronic component

512. . . Wave solder bath

550. . . protective device

554. . . First substrate

558. . . Second substrate

562. . . P-type thermoelectric material wafer

566. . . N-type thermoelectric material wafer

560. . . Sealed space 560

578. . . Empty hole

590. . . Welded part

594. . . Welded part

600. . . SMT reflow furnace

604. . . Electronic component

608. . . Reflow furnace body

660. . . method

664. . . step

668. . . step

672. . . step

676. . . step

680. . . step

808. . . Heat sensitive component

In order to immediately understand the advantages of the present invention, the present invention briefly described above will be described in detail with reference to the specific embodiments illustrated in the accompanying drawings. The invention is described with additional clarity and detail with reference to the accompanying drawings in which: FIG.

The first figure is a schematic diagram illustrating a preferred embodiment of a panel in accordance with a preferred embodiment of the present invention.

Second Embodiment A schematic diagram of a protection device for a heat sensitive component is illustrated in accordance with a preferred embodiment of the present invention.

The third figure is a flow chart illustrating a method for protecting a heat sensitive component in a thermal process in accordance with a preferred embodiment of the present invention.

The fourth figure is a schematic diagram illustrating the Seebeck effect of the thermoelectric effect.

Fifth Figure is a schematic illustration of a protection device for a heat sensitive component in accordance with a preferred embodiment of the present invention.

Figure 6 is a flow chart illustrating a method for protecting a heat sensitive component in a thermal process in accordance with a preferred embodiment of the present invention.

Figure 7 is a schematic illustration of the protection of heat sensitive components in a wave soldering process in accordance with a preferred embodiment of the present invention.

Figure 8 is a schematic illustration of the protection of a heat sensitive component during an SMT reflow process in accordance with a preferred embodiment of the present invention.

104. . . board

108. . . Heat sensitive component

200. . . protective device

202. . . positive

204. . . back

208. . . perforation

212. . . Printed circuit

216. . . Welded connection

258. . . Empty hole

260. . . Protection device body

264. . . battery

260. . . Cap body

268. . . First body part

272. . . Second body part

276. . . anode

280. . . cathode

284. . . Clip

288. . . Electronic component

292. . . Voltage

Claims (15)

A method for protecting a heat sensitive component in a thermal process, the heat sensitive component being disposed on a board, comprising: providing the board; providing a protective device made of a thermoelectric material and removable; and The heat sensitive component is protected by the protective device during the thermal process, wherein in response to applying a voltage to the protective device, the protective device cools the thermally sensitive component during the thermal process. The method of claim 1, wherein the thermal process is a sub-process of a printed circuit board process, and the printed circuit board process is selectable from a manufacturing process, a repair process, and a rework process. The group that makes up. The method of claim 1, wherein the thermal process is a wave soldering process, the wave soldering process has a temperature of about 90 ° C to 260 ° C, and the plate includes a perforation for a solder connection on the heat sensitive component. Passing; or wherein the thermal process is an SMT reflow process, the temperature of the SMT reflow process is about 183 ° C to 260 ° C, and the board further includes electronic components attached thereto by an SMT process. The method of claim 1, further comprising: using a wave soldering process to connect the solder circuit to a printed circuit of the board, wherein the printed circuit and the heat sensitive component are respectively located on opposite sides of the board; and responding At the end of the wave soldering process, the protection device is removed. The method of claim 4, wherein during the wave soldering process, the protection device is thermally coupled to the heat sensitive component such that the protective device isolates heat from the heat sensitive component and provides a cold source due to a thermoelectric effect (cold Source) to prevent the temperature of the heat sensitive component from rising due to the wave soldering process. The method of claim 1, wherein the protection device comprises: a cap body in which the heat sensitive component is capped and in thermal communication with the heat sensitive component; and a battery that causes the thermoelectric material to generate a thermoelectric The effect is to cool the heat sensitive element. The method of claim 6, wherein the cap body comprises a second body portion and a first body portion disposed on the second body portion, wherein the first body portion and the second body One of the materials is a P-type thermoelectric material, and the other material is an N-type thermoelectric material. The method of claim 6, wherein the cap body comprises a first substrate, a second substrate, a P-type thermoelectric material wafer and an N-type thermoelectric material wafer between the first substrate and the second substrate, and a The electrodes of the PN junction, the first substrate and the second substrate are sealable to define a sealed space. The method of claim 8, before the step of protecting the heat sensitive component by the protection device, further comprising: evacuating the sealed space of the protection device. A protection device for a heat sensitive component in a thermal process, the heat sensitive component being disposed on a board, comprising: a removable device body having a cavity to receive at least a portion of the heat sensitive component and comprising A thermoelectric material is fabricated in the thermal process to protect the heat sensitive component; and a battery for applying a voltage to the removable device body to cause the protective device to cool the heat sensitive component. The protection device of claim 10, wherein the thermal process is selected from the group consisting of a wave soldering process, an SMT reflow process, a one-hand soldering process, and a rework process. The protection device of claim 10, wherein the thermal process is a wave soldering process, the wave soldering process has a temperature of about 90 ° C to 260 ° C, and the plate includes a perforation for the solder joint on the heat sensitive component to pass; or The hot process is an SMT reflow process, the temperature of the SMT reflow process is about 183 ° C to 260 ° C, and the board further includes electronic components attached thereto by an SMT reflow process. The protection device of claim 10, wherein the removable device body comprises a second body portion and a first body portion disposed on the second body portion, wherein the first body portion and One of the second body portions is made of a P-type thermoelectric material, and the other material is an N-type thermoelectric material. The protection device of claim 10, wherein the removable device body comprises a first substrate, a second substrate, a P-type thermoelectric material wafer and an N-type thermoelectric material wafer between the first substrate and the second substrate And an electrode of a PN junction, the first substrate and the second substrate are sealable to define a sealed space. The protection device of claim 14, wherein the sealed space of the protection device is evacuated before the protection device protects the heat sensitive component.