TWI429916B - High power probe card - Google Patents

Description

High power probe card

The present invention relates to probe card construction and, more particularly, to a high power probe card.

According to the electrical detection method of the electronic object to be tested, a probe card is electrically connected to a tester, and the probe card is used as a test between the detector and the electronic object to be tested (DUT). The signal transmission interface is effective for transmitting the high frequency test signal sent from the detector to the electronic object to be tested, and in order to obtain a good and accurate detection result, the selected probe card must have the detector and the electronic device to be tested. The matching impedance of the object is acceptable.

However, the internal circuit of the electronic object to be tested has a large output power and a high current demand, and in order to avoid excessive current when each signal pin of the probe card contacts a corresponding contact (Pad) disposed on the surface of the electronic object to be tested. The signal pin that is in contact with the contact (Pad) has a needle burning condition (especially the needle tip is significant) due to the excess of the current load. The known method is produced by the current shunting method, as shown in FIG. 1 , that is, the internal circuit 1 is maintained. The current is constant, but a plurality of contacts 2 are disposed on the surface of the electronic object to be tested to divert the current, thereby achieving the purpose of reducing the adverse effect on the signal pin 3. However, when the plurality of signal pins of the probe card are made in parallel, and each signal pin has a corresponding impedance matching structure, it is used in a direct current (DC) test environment, but for high power RF. In the (RF) test environment, it is easy to reduce the impedance due to the parallel effect, causing the attenuation bandwidth to not meet the specification setting, which in turn leads to poor electrical transmission capability of the signal pin.

In view of this, the main object of the present invention is to provide a high-power probe card which can improve the bandwidth and improve the electrical transmission capability.

To achieve the above objective, the high-power probe card provided by the present invention comprises a circuit board, a first signal pin, a second signal pin, an impedance matching component and a grounding pin. Wherein one surface of the circuit board is provided with at least one signal contact, at least one ground contact and a support; the first signal pin is fixed to the support and has a tip and a tail, wherein the tip passes through the support The needle tail is electrically connected to the signal contact of the circuit board, and an impedance matching section is formed between the needle tail and the support; the second signal pin is fixed to the support and has a needle tip and a needle tail, wherein the needle tip is worn The support is provided, the needle tail is wrapped in the support, and is electrically connected to the first signal pin; the impedance matching component is electrically isolated on the impedance matching section of the first signal pin, and The impedance matching component has a first end electrically connected to the ground contact of the circuit board, and a second end is covered by the support; and the ground pin is fixed by the support and has a tip and a tail. The tip of the needle passes through the support, and the tail is electrically connected to the ground contact.

In one embodiment, the pin tail of the grounding pin is wrapped in the support and electrically connected to the second end of the impedance matching component, and a solder is used to electrically connect the first signal pin to the The second signal pin.

In another embodiment, a conductive member is further included, and the conductive member is covered by the support and electrically connected to the second end of the impedance matching member and the tail of the ground pin. In a specific embodiment, the impedance matching component is an enameled wire, and the enamel wire has a wire and an insulating paint film, wherein the two ends of the wire are respectively a first end and a second end, and the insulating paint film covers the wire; the conductive member It is a copper foil, and the surface of the copper foil is in contact with the needle end of the grounding pin and the second end of the wire. Or the impedance matching component is composed of an insulating inner layer and a conductive surface layer, wherein the insulating inner layer covers the first signal pin, and extends from the needle tail of the first signal pin to the surface of the copper foil, and the conductive surface layer is formed. And a ground contact having a first end contacting the circuit board, and a second end contacting the surface of the copper foil.

Thereby, each of the signal pins fabricated in parallel mode does not cause bandwidth attenuation due to the parallel effect, and still maintains good electrical transmission capability.

In order that the present invention may be more clearly described, the preferred embodiments are illustrated in the accompanying drawings.

2 to 5 show a high-power probe card 100 according to a first preferred embodiment of the present invention, including a circuit board 10, at least one first signal pin 18, at least one second signal pin 20, and an enameled wire 24. An example of an impedance matching member, a grounding pin 28 and a conductive member using a copper foil 30 as an example;

The circuit board 10 has a lower surface, and the lower surface is provided with a plurality of signal contacts 12, ground contacts 14 and a support 16 made of an insulating material. Generally, when detecting the electronic object to be tested, the signal contact 12 and the ground contact 14 are electrically connected to the signal contact and the ground contact of the detector, respectively, and the ground contact of the detector is The signal for receiving the backhaul of the electronic object to be tested.

The first signal pin 18 is fixed to the support 16 and has a needle tip 18a and a needle tail 18b. The needle tip 18a passes through the support 16 for contacting the contact surface of the electronic object to be tested (not shown). The pin tail 18b contacts the signal contact 12, so that the first signal pin 18 is electrically connected to the circuit board 10. Further, an impedance matching segment is defined between the pin tail 18b of the first signal pin 18 and the support 16.

The second signal pin 20 is also fixed to the support 16, and also has a tip 20a and a tail 20b. The difference between the second signal pin 20 is shorter than the length of the first signal pin 18, as shown in FIG. It is shown that the needle tip 20a of the second signal pin 20 passes through the support 16, and the needle tail 20b is wrapped in the support 16. The needle tail 20b of the second signal pin 20 is electrically connected to the first signal pin 18 by a solder 22, and the solder 22 is finally covered by the support 16.

As shown in FIG. 4, the enamel wire 24 includes an insulating varnish film 241 and a wire 242 which are disposed in parallel along the impedance matching section of the first signal pin 18 and are covered by an insulating sleeve 26. The insulating paint film 241 maintains the wire 242 and the first signal pin 18 in an electrically isolated state. The two ends of the wire 242 are respectively a first end 242a and a second end 242b, and the insulating paint is extended respectively. The film 241, wherein the first end 242a is electrically connected to the ground contact 14 of the circuit board 10, and the second end 242b is located in the support 16, that is, the support 16 is covered.

The grounding pin 28 is still fixed to the support 16, and has a tip 28a extending out of the support 16, and a tail 28b covering the support 16, the tail 28b contacting the copper also covered by the support 16. The surface of the foil 30, and the copper foil 30 is in contact with the second end 242b of the wire 242. Thus, the grounding pin 28 is transmitted through the copper foil 30 and electrically connected to the wire 242 to the ground potential.

In the structure of the probe card 100 of the above embodiment, the first signal pin 18 and the second signal pin 20 are maintained in parallel, which is suitable for contacting each of the contacts to be tested after the current shunt design, and the current is prevented from being exceeded. The situation of burning needles caused by load. At the same time, in the case that the first signal pin 18 and the second signal pin 20 are electrically connected to each other, the impedance matching structure is integrated on the structure of the first signal pin 18 to avoid bandwidth attenuation due to the parallel effect. In other words, in other words, the probe card 100 maintains a good bandwidth and is capable of improving the electrical transmission capability, and is accurately used for detection.

In addition, the signal pin of the above embodiment is exemplified by a first signal pin 18 and a second signal pin 20. However, it should be emphasized that the number of the second signal pins 20 is not limited thereto. In other words, the second signal pin 20 and the first signal pin 18 are arranged in parallel to obtain the same effect, and the first signal pin 18 and the second signal pin 20 in the above embodiment are selected. The considerations for setting at different heights (ie different needle layers) are due to the limited space in order to place more needles, but in the case of sufficient space, the first signal pin 18 and the second signal can be selected. The needles 20 are placed in the same height (i.e., the same needle layer) as shown in FIG.

Referring to FIG. 7 again, the high power probe card 200 of the second preferred embodiment of the present invention has the same structure as the first embodiment described above, except that:

The impedance matching component 40 of the high-power probe card 200 of the present embodiment includes an insulating inner layer 42 and a conductive surface layer 44. The insulating inner layer 42 covers the entire impedance matching section of the first signal pin 18, and the conductive surface layer 44 is formed. On the surface of the insulating inner layer 42, when one end of the insulating inner layer 42 extends to the surface of the copper foil 30, the conductive surface layer 44 is in contact with the copper foil 30. More specifically, both ends of the conductive surface layer 44 are respectively formed. a first end 44a and a second end 44b, and the first end 44a is for contacting the grounding contact 14 of the circuit board, and the second end 44b is for directly contacting the surface of the copper foil 30. The foil 30 is electrically connected to the conductive surface layer 44 to the ground potential. In addition, the first signal pin 18 is electrically connected to the tail 20b of the second signal pin 20 by a solder 46 to maintain a parallel effect. The structure of the probe card 200 is also applicable to the use of a plurality of second signal pins 20 and a first signal pin 18, and the functions thereof are the same as those in the above embodiments, and are not described herein.

It is to be noted that the pin tail 28b of the grounding pin 28 of the above embodiments is taken as an example of being covered by the support 16. However, the pin tail of the grounding pin can also be selected directly to the grounding contact of the circuit board according to requirements. The connection is as shown in FIG. 8, that is, based on the structure of the first embodiment, the pin tail 32a of the grounding pin 32 passes through the support 16 and is directly connected to the ground contact 14 of the circuit board 10 for electrical conduction. Purpose, the foregoing structure is also suitable for the structural aspect disclosed in the second embodiment described above.

The above description is only for the preferred embodiments of the present invention, and the equivalent structures and manufacturing methods of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.

100. . . Probe card

10. . . Circuit board

12. . . Signal contact

14. . . Ground contact

16. . . Support

18. . . First signal pin

18a. . . Tip

18b. . . Needle tail

20. . . Second signal pin

20a. . . Tip

20b. . . Needle tail

twenty two. . . Solder

twenty four. . . Enameled wire

241. . . Insulating paint film

242. . . wire

242a. . . First end

242b. . . Second end

26. . . Insulating sleeve

28. . . Grounding pin

28a. . . Tip

28b. . . Needle tail

30. . . Copper foil

32. . . Grounding pin

32a. . . Needle tail

200. . . Probe card

40. . . Impedance matching

42. . . Insulating inner layer

44. . . Conductive surface

44a. . . First end

44b. . . Second end

46. . . Solder

Figure 1 is a simplified diagram of a known probe card for electrical detection;

Figure 2 is a side elevational view showing the composition of the probe card of the first preferred embodiment of the present invention;

Figure 3 is a plan view of Figure 2, wherein the circuit board structure is omitted;

Figure 4 is a cross-sectional view taken along line 4-4 of Figure 2;

Figure 5 is a cross-sectional view taken along line 5-5 of Figure 2;

Figure 6 is similar to Figure 5, illustrating that the first signal pin and the second signal pin are at the same height;

Figure 7 is a side elevational view showing the composition of the probe card of the second preferred embodiment of the present invention;

Figure 8 is similar to Figure 3, showing that the pin tail of the grounding pin of the present invention is directly connected to the ground contact of the circuit board.

100. . . Probe card

10. . . Circuit board

12. . . Signal contact

14. . . Ground contact

16. . . Support

18. . . First signal pin

18a. . . Tip

18b. . . Needle tail

20. . . Second signal pin

20a. . . Tip

20b. . . Needle tail

twenty two. . . Solder

242. . . wire

26. . . Insulating sleeve

28. . . Grounding pin

28a. . . Tip

28b. . . Needle tail

30. . . Copper foil

Claims (11)

A high-power probe card comprising: a circuit board having at least one signal contact, at least one ground contact and a support on one surface; a first signal pin fixed for the support and having a tip a needle tail, wherein the needle tip passes through the support, the needle tail is electrically connected to the signal contact of the circuit board, and an impedance matching section is formed between the needle tail and the support; a second signal needle is the support Fixedly having a tip and a tail, wherein the tip passes through the support, the tail is wrapped in the support and electrically connected to the first signal pin; an impedance matching member is electrically isolated The method is disposed on the impedance matching section of the first signal pin, and the impedance matching component has a first end electrically connected to the ground contact of the circuit board, and a second end is covered by the support; and a The grounding pin is fixed to the support and has a tip and a tail, wherein the tip passes through the support, and the tail is electrically connected to the ground contact. The high power probe card of claim 1, wherein the ground pin of the ground pin is wrapped in the support and electrically connected to the second end of the impedance matching member. The high power probe card of claim 1 includes a solder electrically connected to the first signal pin and the second signal pin. The high-power probe card of claim 1 includes a conductive member that is covered by the support and electrically connected to the second end of the impedance matching member and the tail of the ground pin. The high-power probe card of claim 4, wherein the impedance matching component is an enameled wire, the enameled wire has a wire and an insulating paint film, the two ends of the wire are the first end and the second end, respectively The insulating paint film covers the wire; the conductive member is a copper foil, and the surface of the copper foil is in contact with the needle end of the grounding pin and the second end of the wire. The high power probe card of claim 4, wherein the conductive member is a copper foil; the impedance matching member includes an insulating inner layer and a conductive surface layer, the insulating inner layer covering the first signal pin, and The needle tail of the first signal pin extends to the surface of the copper foil, the conductive surface layer is formed on the surface of the insulating inner layer, and the conductive surface layer has the first end and the second end, and the first end contacts the ground connection of the circuit board The second end contacts the surface of the copper foil. A high-power probe card comprising: a circuit board having at least one signal contact, at least one ground contact and a support on one surface; and a plurality of signal pins through the tip of the needle and electrically connected to each other The support is fixed by the support, wherein the needle tail of at least one signal pin passes through the support and is electrically connected to the signal contact of the circuit board; at least one impedance matching component is worn by the needle tail. The signal pins of the support are arranged in parallel in an electrical isolation manner, and the impedance matching member has a first end electrically connected to the ground contact of the circuit board, and a second end is covered by the support; At least one grounding pin is fixed for the support, and the tip of the needle passes through the support, and the tail is electrically connected to the grounding contact. The high-power probe card of claim 7, wherein the signal pins are electrically connected to each other by a solder, and the solder is covered by the support. The high-power probe card of claim 7 includes a conductive member that is covered by the support and electrically connected to the second end of the impedance matching member and the ground pin. The high-power probe card of claim 9, wherein the needle tail of the grounding pin is covered by the support; the impedance matching component is an enameled wire, the enameled wire has a wire and an insulating paint film, and both ends of the wire The first end and the second end are respectively, and the insulating paint film covers the wire; the conductive member is a copper foil, and the surface of the copper foil is in contact with the needle end of the grounding pin and the second end of the wire. The high-power probe card of claim 9, wherein the conductive member is a copper foil; the impedance matching member comprises an insulating inner layer and a conductive surface layer, the insulating inner layer covering the signal pin of the needle tail penetrating the support And extending from the tail of the signal pin to the surface of the copper foil, the conductive surface layer is formed on the surface of the insulating inner layer, and the conductive surface layer has the first end and the second end, the first end contacting the circuit board a ground contact that contacts the surface of the copper foil.