TWI425685B - Led package structure - Google Patents

Description

Light emitting diode package structure

The invention relates to a package structure, in particular to a light emitting diode package structure.

Compared with the traditional illumination source, the Light Emitting Diode (LED) has the advantages of light weight, small volume, low pollution and long life. It has been used as a new type of illumination source. In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights.

Since a large amount of heat is generated during operation of the light-emitting diode, the life of the light-emitting diode is greatly affected. Therefore, how to quickly and effectively dissipate the heat generated by the light-emitting diode wafer is a problem that the industry has been trying to solve.

In view of this, the present invention is directed to providing a light emitting diode package structure that is easy to dissipate heat.

A light emitting diode package structure comprising a substrate, two electrodes formed on the substrate, a light emitting diode chip mounted on the substrate and electrically connected to the two electrodes, a reflective cup surrounding the light emitting diode chip, and a light emitting diode The body chip is encapsulated in an encapsulation layer in the reflective cup, and the substrate and the reflective cup are externally covered with a first housing and a second housing, the first housing holding the substrate and the reflective cup, the second housing package Covering the first housing.

Using a two-layer housing structure, the first housing enables the heat generated by the light-emitting diode to be fast The second housing is capable of isolating heat from the outside, thereby allowing heat to be conducted downwards, facilitating dissipation of heat and preventing heat from affecting other components around it.

The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.

10‧‧‧Substrate

11‧‧‧ hole

12‧‧‧ raised parts

13‧‧‧ first surface

14‧‧‧ second surface

15, 22‧‧‧ hook structure

20‧‧‧Reflection Cup

21‧‧‧ accommodating space

30‧‧‧Light Emitter Wafer

31‧‧‧ wire

40‧‧‧Encapsulation layer

50‧‧‧ first housing

60‧‧‧ second housing

1 is a cross-sectional view showing a light emitting diode package structure according to an embodiment of the present invention.

2 is a top plan view of a light emitting diode package structure according to an embodiment of the invention.

Referring to FIG. 1 and FIG. 2 , the LED package structure includes a substrate 10 , a reflective cup 20 that is opposite to the substrate 10 , and a light emitting diode chip 30 disposed on the substrate 10 and disposed inside the reflective cup 20 . The package layer 40 of the LED substrate 30 and the substrate 10, the first case 50 that holds the substrate 10 and the reflective cup 20, and the second case 60 that is disposed outside the first case 50.

The substrate 10 is made of a metal material, and a hole 11 penetrating the substrate 10 is opened in the middle of the substrate 10. The hole 11 divides the substrate 10 into two pieces to form two electrodes. The shape of the hole 11 can be set according to actual needs. The upper surface of the upper surface of the substrate 10 is upwardly convex to form a convex portion 12, and the first surface 13 and the second surface 14 are formed. The outer edge of the first surface 13 of the convex portion 12 has a turn toward the light-emitting diode wafer 30. The hooked structure 15 is extended. The shape of the substrate 10 is not limited to that shown in FIG. 2, and in other embodiments, it may be a circle, an ellipse, a rectangle, a combination of these shapes, or the like.

The reflective cup 20 is disposed above the substrate 10 to form a cup-shaped accommodating space 21 having an upper opening larger than the lower portion. The reflective cup 20 and the substrate 10 have a loop away from the light-emitting diode wafer 30. The hook structure 22 is closed. In this embodiment, the reflective cup 20 is surrounded by a circular structure, so that the accommodating space 21 is similar to a cup shape. In other embodiments, the reflector cup 20 can also be rounded or the like to suit different needs.

The light-emitting diode chip 30 is mounted on the substrate 10, and the light-emitting diode wafer 30 is fixed on the substrate 10 by a die bonding method, and the wires 31 are respectively connected to the electrodes of the substrate 10 to be electrically connected. In other embodiments, the LED chip 30 can be electrically connected in a flip chip manner according to actual conditions.

The encapsulation layer 40 is disposed in the accommodating space 21 surrounded by the reflective cup 20 and covers the illuminating diode chip 30 and the substrate 10. The encapsulation layer 40 is formed by injecting an encapsulant into the accommodating space 21, and the upper portion of the encapsulation layer 40 and the upper portion of the reflective cup 20 are kept flat by a press molding process. In other embodiments, the encapsulating layer 40 may further include a fluorescent conversion material inside to improve the optical characteristics of the light emitted by the LED wafer 30. A layer of phosphor powder may also be coated on the upper surface of the encapsulating layer 40 ( The figure is not shown) to effect the change of optical characteristics.

The first housing 50 is made of a ceramic material, and is combined with the convex portion 12 of the substrate 10 and the reflective cup 20 by low temperature co-firing. The inside of the first housing 50 is in full contact with the hook-like structure of the convex portion 12 of the substrate 10 and the reflective cup 20, and the outer portion forms a cylindrical outer wall, the upper end is flush with the upper end of the reflective cup 20, and the lower end abuts the substrate. The second surface 14 of 10. The first housing 50 fully connects the substrate 10 and the reflective cup 20, and because the thermal conductivity of the metal is higher than that of the encapsulant, the heat emitted by the LED wafer 30 can be quickly conducted to the metal substrate 10 and the reflective cup 20, thereby Encapsulation layer 40 is prevented from accumulating a large amount of heat resulting in yellowing or damage.

The second housing 60 is disposed on the outer surface of the first housing 50 , and the upper end extends inwardly to cover the upper end surface of the reflective cup 20 , but does not exceed the inner wall of the reflective cup 20 to avoid light emission efficiency, and the lower end abuts against the substrate 10 . The second surface 14. The second housing 60 is made of a heat insulating material Forming, blocking the heat radiated to the reflective cup 20 and the substrate 10 to laterally diverge to affect other surrounding components. The second housing 60 allows heat to be transmitted downward, and the substrate 10 is downwardly, effectively improving the heat conduction path. Since the substrate 10 is made of a metal material, the heat transfer efficiency is improved. The insulation material can be selected from mineral wool, benzene board or tin foil, or coated with thermal insulation coating.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Substrate

11‧‧‧ hole

12‧‧‧ raised parts

13‧‧‧ first surface

14‧‧‧ second surface

15, 22‧‧‧ hook structure

20‧‧‧Reflection Cup

21‧‧‧ accommodating space

30‧‧‧Light Emitter Wafer

31‧‧‧ wire

40‧‧‧Encapsulation layer

50‧‧‧ first housing

60‧‧‧ second housing

Claims (8)

A light emitting diode package structure comprising: a substrate on which two electrodes are formed; a light emitting diode chip mounted on the substrate and electrically connected to the two electrodes; and a reflection disposed on the substrate and surrounding the light emitting diode wafer a cup and an encapsulation layer encapsulating the LED chip in the reflective cup; and a first housing and a second housing, the first housing having one end inserted into the substrate and the other end inserted into the reflective cup to hold the a substrate and a reflective cup, the second housing enclosing the first housing. The light emitting diode package structure according to claim 1, wherein the upper portion of the substrate has a convex portion, and the light emitting diode chip is mounted on the convex portion. The light emitting diode package structure of claim 1, wherein the first housing connects the fixed substrate and the reflective cup, and is in full contact with the substrate and the reflective cup. The light emitting diode package structure of claim 3, wherein the upper portion of the substrate forms a hook-like structure extending toward the light emitting diode chip, and the bottom of the reflective cup is formed to extend away from the light emitting diode wafer. In the hook structure, the first housing is filled in a hook structure of the substrate and the reflective cup. The light emitting diode package structure according to claim 1, wherein the substrate and the reflective cup are made of a metal material, and the first shell is a ceramic material, and the three are formed by low temperature co-firing. The light emitting diode package structure according to claim 1, wherein the second casing is disposed outside the first casing and covered to the upper portion of the reflector cup. The light emitting diode package structure of claim 1, wherein the second housing is made of a heat insulating material. The light emitting diode package structure according to claim 1, wherein the two electrodes are based on A hole partitioning substrate is formed in the board, and the light emitting diode chip is electrically connected to the two electrodes.