TWI425684B - - Google Patents

Info

Publication number
TWI425684B
TWI425684B TW98113423A TW98113423A TWI425684B TW I425684 B TWI425684 B TW I425684B TW 98113423 A TW98113423 A TW 98113423A TW 98113423 A TW98113423 A TW 98113423A TW I425684 B TWI425684 B TW I425684B
Authority
TW
Taiwan
Application number
TW98113423A
Other languages
Chinese (zh)
Other versions
TW201039472A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW98113423A priority Critical patent/TW201039472A/zh
Publication of TW201039472A publication Critical patent/TW201039472A/zh
Application granted granted Critical
Publication of TWI425684B publication Critical patent/TWI425684B/zh

Links

TW98113423A 2009-04-23 2009-04-23 High power LED module structure and method of making the same TW201039472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98113423A TW201039472A (en) 2009-04-23 2009-04-23 High power LED module structure and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98113423A TW201039472A (en) 2009-04-23 2009-04-23 High power LED module structure and method of making the same

Publications (2)

Publication Number Publication Date
TW201039472A TW201039472A (en) 2010-11-01
TWI425684B true TWI425684B (ja) 2014-02-01

Family

ID=44995513

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98113423A TW201039472A (en) 2009-04-23 2009-04-23 High power LED module structure and method of making the same

Country Status (1)

Country Link
TW (1) TW201039472A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013159040A1 (en) 2012-04-19 2013-10-24 Packet Photonics, Inc. Heat removal system for devices and subassemblies
CN110996540B (zh) * 2019-12-31 2022-02-08 生益电子股份有限公司 一种pcb的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166775A (ja) * 2003-12-01 2005-06-23 Osram-Melco Ltd 発光ダイオードモジュール及び発光ダイオードモジュールの製造方法
JP2006344810A (ja) * 2005-06-09 2006-12-21 Sumitomo Metal Electronics Devices Inc 発光素子収納用アルミニウム焼結体
JP2007311760A (ja) * 2006-04-20 2007-11-29 Kokubu Denki Co Ltd Ｌｅｄモジュール
CN101109501A (zh) * 2006-07-19 2008-01-23 Alti电子株式会社 用于发光二极管模块的冷却装置及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166775A (ja) * 2003-12-01 2005-06-23 Osram-Melco Ltd 発光ダイオードモジュール及び発光ダイオードモジュールの製造方法
JP2006344810A (ja) * 2005-06-09 2006-12-21 Sumitomo Metal Electronics Devices Inc 発光素子収納用アルミニウム焼結体
JP2007311760A (ja) * 2006-04-20 2007-11-29 Kokubu Denki Co Ltd Ｌｅｄモジュール
CN101109501A (zh) * 2006-07-19 2008-01-23 Alti电子株式会社 用于发光二极管模块的冷却装置及其制造方法

Also Published As

Publication number Publication date
TW201039472A (en) 2010-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees