TWI424873B - Preparation method of micro / nano colloidal material for shock absorption - Google Patents

Preparation method of micro / nano colloidal material for shock absorption Download PDF

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TWI424873B
TWI424873B TW100127706A TW100127706A TWI424873B TW I424873 B TWI424873 B TW I424873B TW 100127706 A TW100127706 A TW 100127706A TW 100127706 A TW100127706 A TW 100127706A TW I424873 B TWI424873 B TW I424873B
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micro
colloidal solution
nano colloidal
shock absorption
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TW201306933A (en
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Chung Shan Inst Of Science
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用於減震之微/奈米膠體材料之製作方法Micro/nano colloidal material for damping

本發明是有關於一種用於減震之微/奈米膠體材料之製作方法,尤指一種可使本發明快速且低成本的完成高效能之減震結構製程,以廣泛應用於國防、體育、醫療、防護、交通或民生用品,而達到易於製作、成本低、效能佳以及運用層面廣泛之功效者。The invention relates to a method for manufacturing a micro/nano colloidal material for damping, in particular to a high-performance shock absorbing structure process which can quickly and inexpensively implement the invention, and is widely used in national defense, sports, Medical, protective, transportation, or consumer goods, to achieve ease of production, low cost, good performance and a wide range of applications.

按,一般微/奈米膠體溶液在平時係為流體之性質,因此,該微/奈米膠體溶液於實際之應用時,係必須將之塗佈於相關之載體上始能進行使用,因而降低其所佔的重量或體積百分比(最高約20%wt)。According to the general micro/nano colloidal solution, it is usually a fluid property. Therefore, when the micro/nano colloidal solution is applied to the relevant carrier, it can be used, thereby reducing Its weight or volume percentage (up to about 20% wt).

且就目前所知,尚無相關之技術可有系統的將微/奈米膠體溶液製程、微/奈米膠體溶液設計與微/奈米膠體材料測試等相關技術加以整合,故,無法實現將微/奈米膠體材料應用於減震結構之技術。As far as we know, there is no relevant technology to systematically integrate the micro/nano colloid solution process, micro/nano colloid solution design and micro/nano colloid material testing, etc. Micro/nano colloidal materials are used in shock absorbing structures.

為此,本案之發明人特潛心研究,透過本發明之技術可使微/奈米膠體溶液之原材直接膠體化,跳脫以往應用時必須塗佈於載體上之限制,藉由大幅提高減震墊片中有效材料之比例(20%→40%wt),進而強化減震效果,以期達到較佳之實用效果。Therefore, the inventors of the present invention have made great efforts to study, through the technology of the present invention, the raw material of the micro/nano colloidal solution can be directly colloidized, and the limitation that must be applied to the carrier in the past application is removed, by greatly increasing the reduction. The proportion of effective materials in the shock pad (20% → 40% wt), and then enhance the shock absorption effect, in order to achieve better practical results.

本發明之主要目的係在於,可使本發明快速且低成本的完 成高效能之減震結構製程,以廣泛應用於國防、體育、醫療、防護、交通或民生用品,而達到易於製作、成本低、效能佳以及運用層面廣泛之功效。The main object of the present invention is to enable the present invention to be completed quickly and at low cost. It is a high-performance shock absorbing structural process that is widely used in national defense, sports, medical, protective, transportation or civilian products to achieve easy production, low cost, good performance and a wide range of applications.

為達上述之目的,本發明係一種用於減震之微/奈米膠體溶液之製作方法,包含有下列步驟:步驟一:取二氧化矽顆粒及聚乙二醇,並加入適量添加物攪拌至均勻,而形成混合溶液;步驟二:加熱使混合溶液中之添加物揮發,而形成微/奈米膠體溶液原材;步驟三:於微/奈米膠體溶液原材中加入膠聯劑,而形成微/奈米膠體溶液混合材;以及步驟四:將微/奈米膠體溶液混合材填充於模具中,並加熱使其固化塑型,而形成減震結構塑材。For the purpose of the above, the present invention is a method for preparing a micro/nano colloidal solution for shock absorption, comprising the following steps: Step 1: taking cerium oxide particles and polyethylene glycol, and adding an appropriate amount of additives to stir To uniform, to form a mixed solution; Step 2: heating to volatilize the additive in the mixed solution to form a micro/nano colloidal solution raw material; Step 3: adding a gelling agent to the micro/nano colloidal solution raw material, Forming a micro/nano colloidal solution mixture; and step 4: filling the micro/nano colloidal solution mixture into a mold and heating to solidify and shape the plastic structure.

於本發明之一實施例中,該二氧化矽顆粒之粒徑係介於50nm~500μm之間。In an embodiment of the invention, the particle size of the cerium oxide particles is between 50 nm and 500 μm.

於本發明之一實施例中,該聚乙二醇之分子量係介於400~6000之間。In one embodiment of the invention, the molecular weight of the polyethylene glycol is between 400 and 6000.

於本發明之一實施例中,該添加物係可為乙二醇或丙三醇。In one embodiment of the invention, the additive may be ethylene glycol or glycerol.

於本發明之一實施例中,該二氧化矽顆粒徑與聚乙二醇之混合比例係介於20%wt~60%wt之間。In an embodiment of the invention, the mixing ratio of the cerium oxide particle diameter to the polyethylene glycol is between 20% and 60% by weight.

於本發明之一實施例中,該膠聯劑係可為壓克力單體或為高分子聚合物。In an embodiment of the invention, the binder may be an acrylic monomer or a high molecular polymer.

於本發明之一實施例中,該模具係可為耐溫200℃~350℃間之金屬材質。In an embodiment of the invention, the mold may be a metal material with a temperature between 200 ° C and 350 ° C.

於本發明之一實施例中,該模具之表面係可進行鈍化處理以利脫模。In an embodiment of the invention, the surface of the mold can be passivated to facilitate demolding.

於本發明之一實施例中,該步驟四中係以紫外光照射方式進行加熱,而其加熱溫度係介於150℃~190℃之間,且加熱時間係介於1小時~2小時之間。In an embodiment of the present invention, the fourth step is heated by ultraviolet light irradiation, and the heating temperature is between 150 ° C and 190 ° C, and the heating time is between 1 hour and 2 hours. .

請參閱『第1、2、3及第4圖』所示,係分別為本發明步驟一之示意圖、本發明步驟二之示意圖、本發明步驟三之示意圖及本發明步驟四之示意圖。如圖所示:本發明係一種用於減震之微/奈米膠體溶液之製作方法,其至少包含有下列步驟:Please refer to FIG. 1, 2, 3 and 4, which are respectively a schematic diagram of the first step of the present invention, a schematic diagram of the second step of the present invention, a schematic diagram of the third step of the present invention and a schematic diagram of the fourth step of the present invention. As shown in the figure: The present invention is a method for producing a micro/nano colloidal solution for shock absorption, which comprises at least the following steps:

步驟一:取粒徑介於50nm~500μm間之二氧化矽顆粒11、以及分子量介於400~6000間之聚乙二醇12,並加入適量之添加物13後攪拌至均勻,而形成混合溶液1,其中該添加物13係可為乙二醇或丙三醇,且該二氧化矽顆粒11徑與聚乙二醇12之混合比例係介於20%wt~60%wt之間。Step 1: taking cerium oxide particles 11 having a particle diameter of 50 nm to 500 μm and polyethylene glycol 12 having a molecular weight of 400 to 6000, and adding an appropriate amount of additive 13 and stirring until uniform to form a mixed solution. 1. The additive 13 may be ethylene glycol or glycerin, and the mixing ratio of the diameter of the cerium oxide particles 11 to the polyethylene glycol 12 is between 20% and 60% by weight.

步驟二:加熱21使混合溶液1中之添加物13揮發,而形成微/奈米膠體溶液原材2。Step 2: Heating 21 causes the additive 13 in the mixed solution 1 to be volatilized to form a micro/nano colloidal solution raw material 2.

步驟三:於微/奈米膠體溶液原材2中加入膠聯劑31,而形成微/奈米膠體溶液混合材3,其中該膠聯劑31係可為壓克力單體或為高分子聚合物。Step 3: adding a gelling agent 31 to the micro/nano colloidal solution raw material 2 to form a micro/nano colloidal solution mixed material 3, wherein the adhesive linking agent 31 can be an acrylic monomer or a polymer. polymer.

步驟四:將微/奈米膠體溶液混合材3填充於模具41中,而該模具41係可為耐溫200℃~350℃間之金屬材質,且該模具41之表面係可進行鈍化處理以利脫模,並紫外光42照射方式進行加熱使微/奈米膠體溶液混合材3固化塑型, 其中該紫外光42之加熱溫度係介於150℃~190℃之間,且加熱時間係介於1小時~2小時之間,如此,即可使微/奈米膠體溶液混合材3形成減震結構塑材4。Step 4: The micro/nano colloidal solution mixture 3 is filled in the mold 41, and the mold 41 can be a metal material with a temperature between 200 ° C and 350 ° C, and the surface of the mold 41 can be passivated. The mold is released, and the ultraviolet light 42 is irradiated to heat the micro/nano colloidal solution mixture 3 to be solidified. The heating temperature of the ultraviolet light 42 is between 150 ° C and 190 ° C, and the heating time is between 1 hour and 2 hours, so that the micro/nano colloidal solution mixture 3 can be shock-absorbing. Structural plastic material 4.

而當利用上述之步驟製成減震結構塑材4之後,則使用模擬軟體(LS-DYNA)依減震規格與可用之空間,進行結構之建模、應力分析與修正,最後配合高G值衝擊測試以驗證結構之減震能力,確認達成減震目標;而依實測結果,使用8mm厚之減震墊片,在100,000G/25μs的衝擊條件下,平均可達85%以上之衝擊吸收效果,且當減震結構塑材4受到一定範圍內之剪切力時,將因自然形成之氫鍵(hydrogen bond)效果,使二氧化矽顆粒11自動聚集而增加整體之粘度;這種特殊性質非常適合高衝擊值且高頻之減震結構之應用,例如:國防產業之飛彈攻堅過程,可在高衝擊環境中保護關鍵零組件免於物理傷害;在未來,相關之設計亦可應用於體育用品設計(如:鞋墊、球杆或球拍等)、醫療防護(如:老病或傷殘人士之防護衣物)或其它各類有降低衝擊需求之相關應用(如:安全帽、汽車保險桿等)...等,藉以,可使本發明至少達到下列之優點:When the shock absorbing structure plastic material 4 is formed by the above steps, the simulation software (LS-DYNA) is used to perform structural modeling, stress analysis and correction according to the shock absorbing specification and the available space, and finally, the high G value is matched. Impact test to verify the shock absorption capacity of the structure, confirm the achievement of the shock absorption target; and based on the measured results, using 8mm thick shock absorbing gasket, the impact absorption effect of 85% or more on average under 100,000G/25μs impact conditions And when the shock absorbing structure plastic material 4 is subjected to a certain range of shearing force, the cerium oxide particle 11 is automatically aggregated to increase the overall viscosity due to the naturally occurring hydrogen bond effect; this special property Ideal for high-impact and high-frequency shock-absorbing structures, such as the missile industry's missile attack process, which protects critical components from physical damage in high-impact environments; in the future, related designs can also be used in sports Design of supplies (eg insoles, clubs or rackets), medical protection (eg protective clothing for old or disabled people) or other related applications with reduced impact requirements (eg helmets, car insurance) Rod or the like) ... the like, thereby, the present invention can achieve at least the following advantages:

1.藉由本發明之技術,可快速且低成本的完成高效能減震結構塑材4之研製。1. With the technology of the present invention, the development of the high-efficiency shock absorbing structure plastic material 4 can be completed quickly and at low cost.

2.本發明之整合性技術應用範圍廣泛,只要有減震或緩衝的需求,從國防產業乃至一般體育用品、醫療防護或交通安全防護設備等。2. The integrated technology of the present invention has a wide range of applications, as long as there is a need for shock absorption or buffering, from the defense industry to general sporting goods, medical protection or traffic safety protection equipment.

綜上所述,本發明用於減震之微/奈米膠體溶液之製作方法可有效改善習用之種種缺點,可使本發明快速且低成本的完成高效能之減震結構製程,以廣泛應用於國防、體育、醫療、 防護、交通或民生用品,而達到易於製作、成本低、效能佳以及運用層面廣泛之功效;進而使本發明之產生能更進步、更實用、更符合消費者使用之所須,確已符合發明專利申請之要件,爰依法提出專利申請。In summary, the method for manufacturing the micro/nano colloidal solution for shock absorption of the present invention can effectively improve various disadvantages of the conventional use, and can enable the invention to complete the high-efficiency shock absorbing structure process quickly and at low cost for wide application. In defense, sports, medical care, Protection, transportation or livelihood supplies, achieving easy to manufacture, low cost, good performance and a wide range of applications; thus making the invention more progressive, more practical, and more in line with consumer needs, indeed in line with the invention For the requirements of the patent application, the patent application is filed according to law.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍;故,凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾,皆應仍屬本發明專利涵蓋之範圍內。However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; therefore, the simple equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the invention are modified. All should remain within the scope of the invention patent.

1‧‧‧混合溶液1‧‧‧ mixed solution

11‧‧‧二氧化矽顆粒11‧‧‧ cerium oxide particles

12‧‧‧聚乙二醇12‧‧‧ Polyethylene glycol

13‧‧‧添加物13‧‧‧ Additives

2‧‧‧微/奈米膠體溶液原材2‧‧‧Micro/nano colloidal solution raw materials

21‧‧‧加熱21‧‧‧heating

3‧‧‧微/奈米膠體溶液混合材3‧‧‧Micro/nano colloidal solution

31‧‧‧膠聯劑31‧‧‧ glue agent

4‧‧‧減震結構塑材4‧‧‧Vibration structure plastic

41‧‧‧模具41‧‧‧Mold

42‧‧‧紫外光42‧‧‧ ultraviolet light

第1圖,係本發明步驟一之示意圖。Figure 1 is a schematic view of the first step of the present invention.

第2圖,係本發明步驟二之示意圖。Figure 2 is a schematic diagram of the second step of the present invention.

第3圖,係本發明步驟三之示意圖。Figure 3 is a schematic diagram of the third step of the present invention.

第4圖,係本發明步驟四之示意圖Figure 4 is a schematic view of the fourth step of the present invention

3‧‧‧微/奈米膠體溶液混合材3‧‧‧Micro/nano colloidal solution

4‧‧‧減震結構塑材4‧‧‧Vibration structure plastic

41‧‧‧模具41‧‧‧Mold

42‧‧‧紫外光42‧‧‧ ultraviolet light

Claims (8)

一種用於減震之微/奈米膠體溶液之製作方法,其包括有:步驟一:取二氧化矽顆粒及聚乙二醇,並加入適量添加物攪拌至均勻,而形成混合溶液,其中該添加物係可為乙二醇或丙三醇;步驟二:加熱使混合溶液中之添加物揮發,而形成微/奈米膠體溶液原材;步驟三:於微/奈米膠體溶液原材中加入膠聯劑,而形成微/奈米膠體溶液混合材;以及步驟四:將微/奈米膠體溶液混合材填充於模具中,並加熱使其固化塑型,而形成減震結構塑材。 A method for preparing a micro/nano colloidal solution for shock absorption, comprising: step 1: taking cerium oxide particles and polyethylene glycol, and adding an appropriate amount of the additive to be evenly mixed to form a mixed solution, wherein The additive system may be ethylene glycol or glycerol; Step 2: heating to volatilize the additive in the mixed solution to form a micro/nano colloidal solution raw material; Step 3: in the micro/nano colloidal solution raw material The gelling agent is added to form a micro/nano colloidal solution mixture; and step 4: the micro/nano colloidal solution mixture is filled in a mold and heated to be solidified to form a shock absorbing structure plastic material. 依申請專利範圍第1項所述之用於減震之微/奈米膠體溶液之製作方法,其中,該二氧化矽顆粒之粒徑係介於50nm~500μ m之間。The method for producing a micro/nano colloidal solution for shock absorption according to the first aspect of the patent application, wherein the particle size of the cerium oxide particles is between 50 nm and 500 μm . 依申請專利範圍第1項所述之用於減震之微/奈米膠體溶液之製作方法,其中,該聚乙二醇之分子量係介於400~6000之間。 The method for preparing a micro/nano colloidal solution for shock absorption according to the first aspect of the patent application, wherein the polyethylene glycol has a molecular weight of between 400 and 6000. 依申請專利範圍第1項所述之用於減震之微/奈米膠體溶液之製作方法,其中,該二氧化矽顆粒徑與聚乙二醇之混合比例係介於20%wt~60%wt之間。 The method for preparing a micro/nano colloidal solution for shock absorption according to the first aspect of the patent application, wherein the mixing ratio of the cerium oxide particle diameter to the polyethylene glycol is between 20% and 60% Between wt. 依申請專利範圍第1項所述之用於減震之微/奈米膠體溶液之製作方法,其中,該膠聯劑係可為壓克力單體或為高分子聚合物。 The method for producing a micro/nano colloidal solution for shock absorption according to the first aspect of the patent application, wherein the adhesive agent may be an acrylic monomer or a high molecular polymer. 依申請專利範圍第1項所述之用於減震之微/奈米膠體溶液之製作方法,其中,該模具係可為耐溫200℃~350℃間之金 屬材質。 The method for preparing a micro/nano colloidal solution for shock absorption according to the first aspect of the patent application, wherein the mold can be a temperature between 200 ° C and 350 ° C Is a material. 依申請專利範圍第1項所述之用於減震之微/奈米膠體溶液之製作方法,其中,該模具之表面係可進行鈍化處理以利脫模。 The method for preparing a micro/nano colloidal solution for shock absorption according to the first aspect of the patent application, wherein the surface of the mold is passivated to facilitate demolding. 依申請專利範圍第1項所述之用於減震之微/奈米膠體溶液之製作方法,其中,該步驟四中係以紫外光照射方式進行加熱,而其加熱溫度係介於150℃~190℃之間,且加熱時間係介於1小時~2小時之間。 The method for preparing a micro/nano colloidal solution for shock absorption according to the first aspect of the patent application, wherein the fourth step is heated by ultraviolet light irradiation, and the heating temperature is 150 ° C. Between 190 ° C, and the heating time is between 1 hour and 2 hours.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9670334B2 (en) 2014-08-26 2017-06-06 Industrial Technology Research Institute Shear thickening formulation and composite material employing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200408674A (en) * 2002-05-16 2004-06-01 Bayer Inc Rubber compound for a vibration dampening device
TW200424766A (en) * 2003-02-20 2004-11-16 Ciba Sc Holding Ag Photocurable compositions
JP2005225964A (en) * 2004-02-12 2005-08-25 Jsr Corp Composition for optical semiconductor encapsulation
JP2008156625A (en) * 2006-11-30 2008-07-10 Nippon Shokubai Co Ltd Organic inorganic composite resin composition and optical member

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200408674A (en) * 2002-05-16 2004-06-01 Bayer Inc Rubber compound for a vibration dampening device
TW200424766A (en) * 2003-02-20 2004-11-16 Ciba Sc Holding Ag Photocurable compositions
JP2005225964A (en) * 2004-02-12 2005-08-25 Jsr Corp Composition for optical semiconductor encapsulation
JP2008156625A (en) * 2006-11-30 2008-07-10 Nippon Shokubai Co Ltd Organic inorganic composite resin composition and optical member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9670334B2 (en) 2014-08-26 2017-06-06 Industrial Technology Research Institute Shear thickening formulation and composite material employing the same

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