TWI421015B - Chip card holding mechanism and portable electronic device using same - Google Patents
Chip card holding mechanism and portable electronic device using same Download PDFInfo
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- TWI421015B TWI421015B TW99141992A TW99141992A TWI421015B TW I421015 B TWI421015 B TW I421015B TW 99141992 A TW99141992 A TW 99141992A TW 99141992 A TW99141992 A TW 99141992A TW I421015 B TWI421015 B TW I421015B
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Description
本發明涉及一種用於容置並固持晶片卡之固持機構及具有該固持機構之攜帶型電子裝置。The present invention relates to a holding mechanism for accommodating and holding a wafer card and a portable electronic device having the same.
隨著攜帶型電子裝置產品之功能日益多元化,應用於該攜帶型電子裝置上之實現存儲、通訊等不同功能之晶片卡亦愈來愈多,例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card)、SIM卡(Subscriber Identification Module Card,用戶識別卡)等。As the functions of portable electronic device products become more and more diversified, more and more chip cards for implementing different functions such as storage and communication on the portable electronic device, such as an SD card (Secure Digital Memory Card) and a CF card, are increasingly used. (Compact Flash Card), SIM card (Subscriber Identification Module Card), etc.
為了容置、裝設上述晶片卡,於攜帶型電子裝置內必須預設上述晶片卡之卡容置空間及卡固持機構,以將所述晶片卡固定裝設於攜帶型電子裝置內。一種現有之晶片卡固持機構,包括外蓋、轉動軸及設置於攜帶型電子裝置內之卡容置空間底部之彈片,晶片卡裝設於卡容置空間內並彈性抵持於該彈片上。外蓋藉由轉動軸鉸接於攜帶型電子裝置本體上並對應卡合於攜帶型電子裝置本體上以與該彈片一同將晶片卡固定於卡容置空間內。當用戶需要取換晶片卡時,撥開鉸接於攜帶型電子裝置本體上之外蓋,使外蓋繞轉動軸轉動,晶片卡則受彈片之彈性抵持力而被彈出。採用上述晶片卡固持機構,用戶取放晶片卡撥開外蓋時,用力過小時外蓋不能解鎖,用力過大時轉動軸容易被損壞,導致用戶取放晶片卡時極為不便。另外,撥開外蓋後,晶片卡即被彈出,容易因誤操作而使晶片卡彈出,導致資料丟失。In order to accommodate and mount the above-mentioned wafer card, the card housing space of the wafer card and the card holding mechanism must be preset in the portable electronic device to fix the wafer card in the portable electronic device. A conventional wafer card holding mechanism includes an outer cover, a rotating shaft, and a spring piece disposed at a bottom of the card accommodating space in the portable electronic device. The wafer card is mounted in the card accommodating space and elastically resists the elastic piece. The cover is hinged to the body of the portable electronic device by the rotating shaft and correspondingly engaged with the body of the portable electronic device to fix the wafer card in the card accommodating space together with the elastic piece. When the user needs to replace the wafer card, the cover is hinged to the outer cover of the portable electronic device, so that the outer cover rotates around the rotating shaft, and the wafer card is ejected by the elastic resisting force of the elastic piece. By adopting the above-mentioned wafer card holding mechanism, when the user picks up the wafer card and plucks the outer cover, the outer cover cannot be unlocked when the force is too small, and the rotating shaft is easily damaged when the force is too large, which is extremely inconvenient for the user to take the wafer card. In addition, after the cover is opened, the wafer card is ejected, and the wafer card is easily ejected due to an erroneous operation, resulting in loss of data.
有鑒於此,有必要提供一種取放晶片卡方便且不容易誤操作之晶片卡固持機構。In view of the above, it is necessary to provide a wafer card holding mechanism that is convenient for handling a wafer card and that is not easily mishandled.
還有必要提供一種具有該晶片卡固持機構之攜帶型電子裝置。It is also necessary to provide a portable electronic device having the wafer card holding mechanism.
一種晶片卡固持機構,包括支架、彈性件、托盤及卡合組件。支架內形成一具有收容口之收容空間。彈性件裝設於支架上。托盤上凹設一晶片卡承載空間。托盤可滑動地裝設於支架上,並藉由卡合組件收容於支架之收容空間內且彈性抵持於彈性件上。卡合組件活動裝設於支架之收容口位置處。A wafer card holding mechanism includes a bracket, an elastic member, a tray and a snap assembly. A receiving space having a receiving opening is formed in the bracket. The elastic member is mounted on the bracket. A wafer card carrying space is recessed on the tray. The tray is slidably mounted on the bracket, and is received in the receiving space of the bracket by the engaging component and elastically resists the elastic member. The engaging component is movably mounted at the position of the receiving opening of the bracket.
一種採用上述晶片卡固持機構之攜帶型電子裝置,其包括殼體及裝設於殼體內之晶片卡固持機構。殼體上開設有插口。晶片卡固持機構包括支架、彈性件、托盤及卡合組件。支架內形成一具有收容口之收容空間,支架之收容口與殼體之插口相對應。彈性件裝設於支架上。托盤上凹設一晶片卡承載空間。托盤可滑動地裝設於支架上,並藉由卡合組件收容於支架之收容空間內且彈性抵持於彈性件上。卡合組件活動裝設於支架之收容口位置處。A portable electronic device using the above-described wafer card holding mechanism includes a housing and a wafer card holding mechanism installed in the housing. A socket is opened in the housing. The wafer card holding mechanism includes a bracket, an elastic member, a tray, and a snap assembly. A receiving space having a receiving opening is formed in the bracket, and the receiving opening of the bracket corresponds to the socket of the housing. The elastic member is mounted on the bracket. A wafer card carrying space is recessed on the tray. The tray is slidably mounted on the bracket, and is received in the receiving space of the bracket by the engaging component and elastically resists the elastic member. The engaging component is movably mounted at the position of the receiving opening of the bracket.
晶片卡固持機構藉由採用與托盤卡合之卡合組件及彈性抵持托盤之彈性件一起固定托盤,從而固定承載於托盤內之晶片卡。卡合組件施加之卡合力與彈性件施加之抵持力相向一起固持托盤,因此可靠性強,可有效避免晶片卡發生電連接不良。當使用工具使卡合組件解鎖時,彈性件抵持托盤使托盤滑出,以取放晶片卡,操作方便,並可防止誤操作而丟失資料。The wafer card holding mechanism fixes the tray by using the engaging component that engages with the tray and the elastic member that elastically resists the tray, thereby fixing the wafer card carried in the tray. The engaging force applied by the engaging component and the abutting force applied by the elastic member together hold the tray, so that the reliability is strong, and the electrical connection failure of the wafer card can be effectively avoided. When the tool is used to unlock the engaging component, the elastic member resists the tray to slide the tray out to take the wafer card, which is convenient to operate and can prevent misoperation and loss of data.
本發明之攜帶型電子裝置可為觸控式平板電腦、移動電話、數碼相機等。於本實施方式中,以觸控式平板電腦為例進行說明。The portable electronic device of the present invention can be a touch type tablet computer, a mobile phone, a digital camera or the like. In the present embodiment, a touch panel tablet is taken as an example for description.
請參閱圖1及圖2,本發明實施方式之攜帶型電子裝置100包括殼體20、顯示屏30、晶片卡(圖未示)及晶片卡固持機構50。顯示屏30固定裝設於殼體20上,晶片卡收容於殼體20內。晶片卡固持機構50固持晶片卡。為節省篇幅,對攜帶型電子裝置100之其他功能模組,如電路板、背光模組等,未進行描述。晶片卡可為各種功能之SD卡、MMC(multimedia card)卡或SIM卡等。於本實施方式中,以SIM卡為例進行說明。Referring to FIG. 1 and FIG. 2 , the portable electronic device 100 of the embodiment of the present invention includes a housing 20 , a display screen 30 , a wafer card (not shown), and a wafer card holding mechanism 50 . The display screen 30 is fixedly mounted on the casing 20, and the wafer card is housed in the casing 20. The wafer card holding mechanism 50 holds the wafer card. In order to save space, other functional modules of the portable electronic device 100, such as a circuit board and a backlight module, are not described. The chip card can be an SD card, an MMC (multimedia card) card or a SIM card of various functions. In the present embodiment, a SIM card will be described as an example.
請一併參閱圖3及圖7,殼體20包括底殼21及支撐框22。底殼21包括底壁211及周壁212。周壁212從底壁211邊緣向其一側延伸,底壁211與周壁212弧形圓滑過渡,並共同圍成一容納空間213。周壁212上開設有一長條形之插口214。支撐框22固定裝設於底殼21上。支撐框22遠離底殼21之底壁211之一面設置有第一台階面221,於第一台階面221上開設有台階孔223。台階孔223大致為方形,開設於與插口214相對應之位置。台階孔223形成第二台階面224。Referring to FIG. 3 and FIG. 7 together, the housing 20 includes a bottom case 21 and a support frame 22. The bottom case 21 includes a bottom wall 211 and a peripheral wall 212. The peripheral wall 212 extends from the edge of the bottom wall 211 toward one side thereof, and the bottom wall 211 and the peripheral wall 212 are smoothly curved and merged to form a receiving space 213. An elongated socket 214 is defined in the peripheral wall 212. The support frame 22 is fixedly mounted on the bottom case 21. A first step surface 221 is disposed on one surface of the bottom wall 211 of the support frame 22 away from the bottom case 21, and a stepped hole 223 is defined in the first step surface 221 . The stepped hole 223 is substantially square and is opened at a position corresponding to the socket 214. The stepped hole 223 forms a second stepped surface 224.
顯示屏30固定裝設於支撐框22之第一台階面221上。於本實施方式中,顯示屏30採用膠黏方式固定於第一台階面221上。The display screen 30 is fixedly mounted on the first step surface 221 of the support frame 22. In the embodiment, the display screen 30 is fixed on the first step surface 221 by adhesive bonding.
請一併參閱圖4及圖5,晶片卡固持機構50裝設於殼體20內,以用於容置並固持一晶片卡。晶片卡固持機構50包括底座51、支架52、托盤53及卡合組件54。底座51固定裝設於殼體20之底壁211上鄰近周壁212之插口214位置處。於本實施方式中,底座51與底壁211採用膠黏方式固定。底座51包括主體511及端部512。主體511與端部512弧形圓滑過渡相接,且主體511與端部512之形狀與底殼21之形狀相仿,以與底殼21貼合。主體511呈平板狀,用來裝設支架52。端部512包括呈弧形之側面5121及與側面5121相連之頂面5122。側面5121上開設有與插口214相對應之開口5123。頂面5122與主體511表面平行,其鄰近主體511之一側開設弧形之凹槽5124。頂面5122之中間部位形成有限位面5125,限位面5125對卡合組件54之轉動範圍進行限位。Referring to FIG. 4 and FIG. 5 together, the chip card holding mechanism 50 is mounted in the housing 20 for accommodating and holding a wafer card. The wafer card holding mechanism 50 includes a base 51, a bracket 52, a tray 53, and a snap assembly 54. The base 51 is fixedly mounted on the bottom wall 211 of the housing 20 at a position adjacent to the socket 214 of the peripheral wall 212. In the embodiment, the base 51 and the bottom wall 211 are fixed by adhesive bonding. The base 51 includes a body 511 and an end 512. The main body 511 and the end portion 512 are smoothly curved and connected, and the shape of the main body 511 and the end portion 512 are similar to the shape of the bottom case 21 to be attached to the bottom case 21. The main body 511 has a flat shape for mounting the bracket 52. End 512 includes a curved side 5121 and a top surface 5122 that is coupled to side 521. An opening 5123 corresponding to the socket 214 is defined in the side surface 5121. The top surface 5122 is parallel to the surface of the main body 511, and an arcuate groove 5124 is formed adjacent to one side of the main body 511. The middle portion of the top surface 5122 forms a finite plane 5125, and the limiting surface 5125 limits the rotation range of the engaging assembly 54.
請一併參閱圖6,支架52固定裝設於底座51之主體511上,用以收容托盤53於其內。支架52包括上蓋521、下蓋522及彈性件523。上蓋521與下蓋522共同形成一具有收容口5227之大致為矩形之收容空間524。收容口5227與底座51之開口5123及殼體20之插口214相對應,托盤53可由收容口5227插入並收容於收容空間524內。下蓋522包括底壁5225、二側壁5221及抵持壁5222。底壁5225上設置有電連接器(圖未標)。二側壁5221及抵持壁5222均從底壁5225邊緣延伸,二側壁5221相對設置。側壁5221之內側形成有導向槽5224,以於托盤53進出收容空間524時對托盤53導向。抵持壁5222與收容口5227相對並連接二側壁5221。抵持壁5222上開設有避位槽5226及與避位槽5226相連之卡持槽5223。彈性件523為折彎之彈片,並可拆卸地裝設於抵持壁5222上,其一端卡設於卡持槽5223內,另一端朝向插口214彎折並凸出抵持壁5222,以彈性抵持托盤53。As shown in FIG. 6 , the bracket 52 is fixedly mounted on the main body 511 of the base 51 for receiving the tray 53 therein. The bracket 52 includes an upper cover 521, a lower cover 522, and an elastic member 523. The upper cover 521 and the lower cover 522 together form a substantially rectangular receiving space 524 having a receiving opening 5227. The receiving opening 5227 corresponds to the opening 5123 of the base 51 and the socket 214 of the housing 20. The tray 53 can be inserted into the receiving opening 5227 and received in the receiving space 524. The lower cover 522 includes a bottom wall 5225, two side walls 5221, and a resisting wall 5222. An electrical connector (not shown) is disposed on the bottom wall 5225. The two side walls 5221 and the resisting wall 5222 extend from the edge of the bottom wall 5225, and the two side walls 5221 are oppositely disposed. A guide groove 5224 is formed inside the side wall 5221 to guide the tray 53 when the tray 53 enters and exits the accommodating space 524. The resisting wall 5222 is opposite to the receiving opening 5227 and connects the two side walls 5221. A retaining groove 5226 and a retaining groove 5223 connected to the avoiding groove 5226 are defined in the resisting wall 5222. The elastic member 523 is a bent elastic piece and is detachably mounted on the resisting wall 5222. One end of the elastic member 523 is locked in the retaining groove 5223, and the other end is bent toward the socket 214 and protrudes against the retaining wall 5222 to be elastic. Resisting the tray 53.
托盤53可滑動地裝設於支架52上,並藉由卡合組件54收容於支架52之收容空間524內。托盤53包括承載部531、推抵部533及蓋合部532。於本實施方式中,承載部531大致呈矩形板狀,其上沿縱向方向凹設形成一大致矩形之承載空間5311,用以裝設並容置晶片卡。承載空間5311之底壁上沿縱向方向被貫通開設形成一開口534,以利於裝設於承載空間5311內之晶片卡藉由開口534與裝設於支架52上之電連接器電性連接。承載部531之二側對應支架52上之二導向槽5224分別相對向外凸設形成導向凸條5315,以使托盤53可滑動地裝設並收容於支架52上。推抵部533呈楔形塊狀,設置於承載部531之一端。推抵部533之厚度沿朝向開口534方向逐漸變小,包括一遠離開口534一端之卡抵面5335及一朝向開口534及承載部531之另一端傾斜之推抵斜面5332。蓋合部532與推抵部533相鄰設置並位於承載部531之末端位置處,蓋合部532與推抵部533之間對應形成一條形之卡槽5324。蓋合部532之形狀與殼體20上之插口214對應,以使得當托盤53之承載部531被完全收容於支架52之收容空間524內時,蓋合部532對應收容於插口214內。蓋合部532貫通開設有一與卡槽5324連通之解鎖孔5323。The tray 53 is slidably mounted on the bracket 52 and received in the receiving space 524 of the bracket 52 by the engaging component 54. The tray 53 includes a bearing portion 531, a pushing portion 533, and a cover portion 532. In the present embodiment, the carrying portion 531 has a substantially rectangular plate shape, and a substantially rectangular carrying space 5311 is recessed in the longitudinal direction for mounting and accommodating the wafer card. An opening 534 is formed in the bottom wall of the carrying space 5311 in the longitudinal direction to facilitate the electrical connection between the wafer card mounted in the carrying space 5311 and the electrical connector mounted on the bracket 52 via the opening 534. The two guiding grooves 5224 on the two sides of the supporting portion 531 are respectively protruded outwardly to form guiding ribs 5315 so that the tray 53 is slidably mounted and received on the bracket 52. The pushing portion 533 has a wedge-shaped block shape and is disposed at one end of the carrying portion 531. The thickness of the pushing portion 533 gradually decreases toward the opening 534, and includes a locking surface 5335 away from one end of the opening 534 and a pushing inclined surface 5332 inclined toward the opening 534 and the other end of the carrying portion 531. The cover portion 532 is disposed adjacent to the pushing portion 533 and located at the end of the bearing portion 531. The cover portion 532 and the pushing portion 533 are correspondingly formed with a strip-shaped card slot 5324. The shape of the cover portion 532 corresponds to the socket 214 of the housing 20 such that when the carrier portion 531 of the tray 53 is completely received in the receiving space 524 of the bracket 52, the cover portion 532 is correspondingly received in the socket 214. The cover portion 532 defines an unlocking hole 5323 that communicates with the card slot 5324.
卡合組件54對應支架52之收容口5227裝設於底座51之端部512上,以實現對托盤53之卡合或釋放。卡合組件54包括固定部543及卡勾541,卡勾541可旋轉地鉸接於固定部543上。固定部543包括二端部5431及二凸台5432,二凸台5432分別鄰近二端部5431設置。每一凸台5432均凹設有弧形之樞接槽5433。卡勾541包括樞軸5410、固接部5411及接觸部5412。樞軸5410對應凸台5432上之樞接槽5433凸設於固接部5411之二端,以將卡勾541可旋轉地裝設於固定部543上。接觸部5412包括內表面5413及外表面5414,內表面5413與推抵部533之卡抵面5335接觸,外表面5414呈弧面,與內表面5413相對。The receiving portion 54227 of the engaging member 54 corresponding to the bracket 52 is mounted on the end portion 512 of the base 51 to achieve the engagement or release of the tray 53. The engaging component 54 includes a fixing portion 543 and a hook 541, and the hook 541 is rotatably hinged to the fixing portion 543. The fixing portion 543 includes two end portions 5431 and two bosses 5432 respectively disposed adjacent to the two end portions 5431. Each of the bosses 5432 is recessed with a curved pivoting groove 5433. The hook 541 includes a pivot 5410, a fixing portion 5411, and a contact portion 5412. The pivoting groove 5433 of the pivoting portion 5410 corresponding to the boss 5432 protrudes from the two ends of the fixing portion 5411 to rotatably mount the hook 541 on the fixing portion 543. The contact portion 5412 includes an inner surface 5413 and an outer surface 5414. The inner surface 5413 is in contact with the abutting surface 5335 of the pushing portion 533, and the outer surface 5414 is curved to face the inner surface 5413.
組裝攜帶型電子裝置100時,先將底座51固定裝設於底殼21上,使底座51之開口5123與底殼21之插口214相對應;將支架52固定裝設於底座51上,使支架52之收容口5227與底座51之開口5123相對應;將卡合組件54之卡勾541裝設於底座51之端部512上,並使樞軸5410裝設於凹槽5124內;將支撐框22固定裝設於底殼21上,並使台階孔223與底殼21上之插口214相對應;將卡合組件54之固定部543之二端部5431分別裝設於支撐框22之二第二台階面224上,並使固定部543之樞接槽5433與樞軸5410配合,以將卡勾541可轉動固定;將托盤53與蓋合部532相對之一端插入底殼21之插口214內,推抵部533之推抵斜面5332推抵卡勾541,使卡勾541轉動,托盤53繼續推進至卡勾541滑入卡槽5324時停止推進,此時卡勾541之內表面5413與推抵部533之卡抵面5335完全貼合抵持,且托盤53壓縮支架52之彈性件523至一預設值,因此彈性件523與卡勾541一起將托盤53固定於支架52內。When the portable electronic device 100 is assembled, the base 51 is fixedly mounted on the bottom case 21, and the opening 5123 of the base 51 corresponds to the socket 214 of the bottom case 21; the bracket 52 is fixedly mounted on the base 51 to make the bracket The receiving opening 5227 of the 52 corresponds to the opening 5123 of the base 51; the hook 541 of the engaging component 54 is mounted on the end 512 of the base 51, and the pivot 5410 is installed in the recess 5124; 22 is fixedly mounted on the bottom case 21, and the stepped hole 223 corresponds to the socket 214 on the bottom case 21; the two end portions 5431 of the fixing portion 543 of the engaging assembly 54 are respectively mounted on the support frame 22 The two step faces 224 are disposed, and the pivoting groove 5433 of the fixing portion 543 is engaged with the pivot 5410 to rotatably fix the hook 541; the opposite end of the tray 53 and the cover portion 532 is inserted into the socket 214 of the bottom case 21. The pushing surface 533 of the pushing portion 533 pushes against the hook 541 to rotate the hook 541, and the tray 53 continues to advance until the hook 541 slides into the slot 5324 to stop pushing. At this time, the inner surface 5413 of the hook 541 is pushed. The card abutting surface 5335 of the abutting portion 533 is completely abutted, and the tray 53 compresses the elastic member 523 of the bracket 52 to a predetermined value, thereby being elastic The piece 523 and the hook 541 together fix the tray 53 in the bracket 52.
當需要取換晶片卡時,採用一工具插入解鎖孔5323,並接觸卡勾541之弧形之外表面5414而使卡勾541轉動;同時支架52之彈性件523推動托盤53,於該二作用力下卡勾541脫離卡槽5324,從而使托盤53彈出以取換晶片卡。When the wafer card needs to be replaced, a tool is inserted into the unlocking hole 5323, and the curved outer surface 5414 of the hook 541 is touched to rotate the hook 541; and the elastic member 523 of the bracket 52 pushes the tray 53, and the two functions are The lower hook 541 is disengaged from the card slot 5324, so that the tray 53 is ejected to replace the wafer card.
本發明實施方式之晶片卡固持機構50藉由採用與托盤53卡合之卡合組件54及彈性抵持托盤53之彈性件523一起固定托盤53,從而固定承載於托盤53內之晶片卡。卡合組件54施加之卡合力與彈性件523施加之抵持力相向一起固持托盤53,因此可靠性強,可有效避免晶片卡發生電連接不良。當使用工具使卡合組件54解鎖時,彈性件523自動彈出托盤53,以取放晶片卡。操作方便,並可防止誤操作而丟失資料。另外,由於避免採用連接機構將底殼21與蓋合部532連接,不會影響殼體20之整體美觀度。The wafer card holding mechanism 50 of the embodiment of the present invention fixes the tray 53 by using the engaging member 54 engaged with the tray 53 and the elastic member 523 of the elastic abutting tray 53, thereby fixing the wafer card carried in the tray 53. The engaging force applied by the engaging member 54 holds the tray 53 together with the abutting force applied by the elastic member 523, so that the reliability is strong, and the electrical connection failure of the wafer card can be effectively prevented. When the tool is used to unlock the snap-fit assembly 54, the resilient member 523 automatically ejects the tray 53 to access the wafer card. It is easy to operate and can prevent data from being lost due to misuse. In addition, since the connection of the bottom case 21 and the cover portion 532 by the use of the connection mechanism is avoided, the overall appearance of the case 20 is not affected.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
100‧‧‧攜帶型電子裝置100‧‧‧ portable electronic device
20‧‧‧殼體20‧‧‧shell
21‧‧‧底殼21‧‧‧ bottom case
211‧‧‧底壁211‧‧‧ bottom wall
212‧‧‧周壁212‧‧‧Walls
213‧‧‧容納空間213‧‧‧ accommodating space
214‧‧‧插口214‧‧‧ socket
22‧‧‧支撐框22‧‧‧Support frame
221‧‧‧第一台階面221‧‧‧First step surface
223‧‧‧台階孔223‧‧‧step hole
224‧‧‧第二台階面224‧‧‧second step surface
30‧‧‧顯示屏30‧‧‧Display
50‧‧‧晶片卡固持機構50‧‧‧ wafer card retention mechanism
51‧‧‧底座51‧‧‧Base
511‧‧‧主體511‧‧‧ Subject
512‧‧‧端部512‧‧‧ end
5121‧‧‧側面5121‧‧‧ side
5122‧‧‧頂面5122‧‧‧ top surface
5123,534‧‧‧開口5123,534‧‧‧ openings
5124‧‧‧凹槽5124‧‧‧ Groove
5125‧‧‧限位面5125‧‧‧Limited surface
52‧‧‧支架52‧‧‧ bracket
521‧‧‧上蓋521‧‧‧Upper cover
522‧‧‧下蓋522‧‧‧Under the cover
5221‧‧‧側壁5221‧‧‧ side wall
5222‧‧‧抵持壁5222‧‧‧Resist the wall
5223‧‧‧卡持槽5223‧‧‧ card slot
5224‧‧‧導向槽5224‧‧‧ Guide groove
5225‧‧‧底壁5225‧‧‧ bottom wall
5226‧‧‧避位槽5226‧‧‧ avoidance slot
5227‧‧‧收容口5227‧‧‧Hatch
523‧‧‧彈性件523‧‧‧Flexible parts
524‧‧‧收容空間524‧‧‧ accommodating space
53‧‧‧托盤53‧‧‧Tray
531‧‧‧承載部531‧‧‧Loading Department
5311‧‧‧承載空間5311‧‧‧ Carrying space
5315‧‧‧導向凸條5315‧‧‧ Guide ribs
532‧‧‧蓋合部532‧‧‧ Covering Department
5323‧‧‧解鎖孔5323‧‧‧Unlocking hole
5324‧‧‧卡槽5324‧‧‧ card slot
533‧‧‧推抵部533‧‧‧Pushing Department
5332‧‧‧推抵斜面5332‧‧‧Pushing the slope
5335‧‧‧卡抵面5335‧‧‧ card to face
54‧‧‧卡合組件54‧‧‧Clamping components
541‧‧‧卡勾541‧‧‧ hook
5410‧‧‧樞軸5410‧‧‧ pivot
5411‧‧‧固接部5411‧‧‧Fixed parts
5412‧‧‧接觸部5412‧‧‧Contacts
5413‧‧‧內表面5413‧‧‧ inner surface
5414‧‧‧外表面5414‧‧‧Outer surface
543‧‧‧固定部543‧‧‧ Fixed Department
5431‧‧‧端部5431‧‧‧End
5432‧‧‧凸台5432‧‧‧Boss
5433‧‧‧樞接槽5433‧‧‧ pivot slot
圖1係本發明實施方式之攜帶型電子裝置之立體示意圖。1 is a perspective view of a portable electronic device according to an embodiment of the present invention.
圖2係圖1所示攜帶型電子裝置之立體分解示意圖。2 is a perspective exploded view of the portable electronic device shown in FIG. 1.
圖3係圖2中III處之放大示意圖。Figure 3 is an enlarged schematic view of the portion III in Figure 2.
圖4係圖2所示攜帶型電子裝置之晶片卡固持機構之立體組裝圖。4 is a perspective assembled view of the wafer card holding mechanism of the portable electronic device shown in FIG. 2.
圖5係圖4所示之晶片卡固持機構之分解圖。Figure 5 is an exploded view of the wafer card holding mechanism shown in Figure 4.
圖6係圖1所示之攜帶型電子裝置沿VI-VI線之局部剖視圖。6 is a partial cross-sectional view of the portable electronic device shown in FIG. 1 taken along line VI-VI.
圖7係圖1所示之攜帶型電子裝置另一狀態時沿VI-VI線之局部剖視圖。Figure 7 is a partial cross-sectional view taken along line VI-VI of the portable electronic device of Figure 1 in another state.
50‧‧‧晶片卡固持機構 50‧‧‧ wafer card retention mechanism
51‧‧‧底座 51‧‧‧Base
52‧‧‧支架 52‧‧‧ bracket
5223‧‧‧卡持槽 5223‧‧‧ card slot
5226‧‧‧避位槽 5226‧‧‧ avoidance slot
523‧‧‧彈性件 523‧‧‧Flexible parts
53‧‧‧托盤 53‧‧‧Tray
5323‧‧‧解鎖孔 5323‧‧‧Unlocking hole
54‧‧‧卡合組件 54‧‧‧Clamping components
541‧‧‧卡勾 541‧‧‧ hook
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW99141992A TWI421015B (en) | 2010-12-03 | 2010-12-03 | Chip card holding mechanism and portable electronic device using same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99141992A TWI421015B (en) | 2010-12-03 | 2010-12-03 | Chip card holding mechanism and portable electronic device using same |
Publications (2)
Publication Number | Publication Date |
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TW201225804A TW201225804A (en) | 2012-06-16 |
TWI421015B true TWI421015B (en) | 2013-12-21 |
Family
ID=46726319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW99141992A TWI421015B (en) | 2010-12-03 | 2010-12-03 | Chip card holding mechanism and portable electronic device using same |
Country Status (1)
Country | Link |
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TW (1) | TWI421015B (en) |
Families Citing this family (1)
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CN104836071B (en) * | 2014-02-08 | 2019-07-23 | 深圳富泰宏精密工业有限公司 | The electronic device of chip card fixedly holding structure and the application structure |
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TWM326206U (en) * | 2007-03-12 | 2008-01-21 | Hon Hai Prec Ind Co Ltd | Mobile storage device |
US7362309B2 (en) * | 2003-02-27 | 2008-04-22 | Darfon Electronics Corp. | Pointing device with flexible shape |
US7443382B2 (en) * | 2004-08-27 | 2008-10-28 | Microsoft Corporation | Scroll wheel carriage |
TW201008043A (en) * | 2008-08-05 | 2010-02-16 | Asustek Comp Inc | Electronic device with stretchable USB receptacle |
US7821497B2 (en) * | 2005-05-27 | 2010-10-26 | Wen-Chih Chu | Wireless mouse capable of storing wireless receiver therein |
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2010
- 2010-12-03 TW TW99141992A patent/TWI421015B/en not_active IP Right Cessation
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Publication number | Priority date | Publication date | Assignee | Title |
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US7362309B2 (en) * | 2003-02-27 | 2008-04-22 | Darfon Electronics Corp. | Pointing device with flexible shape |
US7443382B2 (en) * | 2004-08-27 | 2008-10-28 | Microsoft Corporation | Scroll wheel carriage |
US7821497B2 (en) * | 2005-05-27 | 2010-10-26 | Wen-Chih Chu | Wireless mouse capable of storing wireless receiver therein |
TWM326206U (en) * | 2007-03-12 | 2008-01-21 | Hon Hai Prec Ind Co Ltd | Mobile storage device |
TW201008043A (en) * | 2008-08-05 | 2010-02-16 | Asustek Comp Inc | Electronic device with stretchable USB receptacle |
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TW201225804A (en) | 2012-06-16 |
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