TWI420663B - Pixel structure of organic emitting device - Google Patents
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本發明是有關於一種有機發光裝置之畫素結構。The present invention relates to a pixel structure of an organic light-emitting device.
資訊通訊產業已成為現今的主流產業,特別是可攜帶式的各種通訊顯示產品更是發展的重點。而由於平面顯示器是人與資訊之間的溝通界面,因此其發展顯得特別重要。有機發光顯示器即是一種有機發光裝置,由於其具有自發光、廣視角、省電、程序簡易、低成本、操作溫度廣泛、高應答速度以及全彩化等等的優點,使其具有極大的潛力,因此可望成為下一代平面顯示器之主流。The information and communication industry has become the mainstream industry today, especially the portable communication display products are the focus of development. Since the flat panel display is the communication interface between people and information, its development is particularly important. An organic light-emitting display is an organic light-emitting device, which has great potential due to its advantages of self-illumination, wide viewing angle, power saving, simple program, low cost, wide operating temperature, high response speed, and full color. Therefore, it is expected to become the mainstream of next-generation flat panel displays.
另外,透明顯示面板的技術也已經在積極發展之中。一般,在透明有機發光顯示器中,大多是利用具有高穿透率的材質作為陽極以及陰極的材料,甚至將顯示器中的所有金屬層都改成高穿透度材料。此種設計雖然可以提高顯示面板的透明度,但是因為有機發光顯示器中無反射層作為共振腔結構,因而反而導致發光亮度降低,進而造成顏色表現不佳。In addition, the technology of transparent display panels has also been actively developed. Generally, in a transparent organic light-emitting display, a material having a high transmittance is often used as a material of an anode and a cathode, and even all metal layers in the display are changed to a high-penetration material. Although such a design can improve the transparency of the display panel, since the non-reflective layer in the organic light-emitting display has a resonant cavity structure, the brightness of the light is reduced, which in turn causes poor color performance.
本發明提供一種有機發光裝置之畫素結構,其不但可以提高有機發光裝置的透明度,還可以增加其發光亮度。The invention provides a pixel structure of an organic light-emitting device, which can not only improve the transparency of the organic light-emitting device, but also increase the brightness of the light-emitting device.
本發明提出一種有機發光裝置之畫素結構,其包括基板、至少一主動元件、第一絕緣層、第一電極層、第二絕緣層、發光層以及第二電極層。基板具有多個子畫素區,且每一個子畫素區具有發光區以及透明區。主動元件位於基板之發光區內。第一絕緣層覆蓋主動元件,其中第一絕緣層位於發光區內且未設置在透明區內。第一電極層位於第一絕緣層上且與主動元件電性連接,其中第一電極層位於發光區內且未設置在透明區內。第二絕緣層位在第一絕緣層以及第一電極層上且暴露出第一電極層,其中第二絕緣層位於發光區內且未設置在透明區內。發光層位於被暴露出的第一電極層上,其中發光層位於發光區內且未設置在透明區內。第二電極層位於發光層上。The invention provides a pixel structure of an organic light-emitting device, comprising a substrate, at least one active component, a first insulating layer, a first electrode layer, a second insulating layer, a light-emitting layer and a second electrode layer. The substrate has a plurality of sub-pixel regions, and each of the sub-pixel regions has a light-emitting region and a transparent region. The active component is located within the illumination region of the substrate. The first insulating layer covers the active device, wherein the first insulating layer is located in the light emitting region and is not disposed in the transparent region. The first electrode layer is located on the first insulating layer and is electrically connected to the active device, wherein the first electrode layer is located in the light emitting region and is not disposed in the transparent region. The second insulating layer is on the first insulating layer and the first electrode layer and exposes the first electrode layer, wherein the second insulating layer is located in the light emitting region and is not disposed in the transparent region. The luminescent layer is on the exposed first electrode layer, wherein the luminescent layer is located in the illuminating region and is not disposed in the transparent region. The second electrode layer is on the light emitting layer.
本發明提出一種有機發光裝置之畫素結構,其包括基板、至少一主動元件、第一絕緣層、第一電極層、第二絕緣層、發光層以及第二電極層。基板具有多個子畫素區,且每一個子畫素區具有發光區以及透明區。主動元件位於基板之發光區內。第一絕緣層覆蓋主動元件,其中第一絕緣層中具有至少一第一開口以暴露出基板之透明區。第一電極層位於發光區內,其中第一電極層設置於第一絕緣層上且與主動元件電性連接。第二絕緣層位在第一絕緣層以及第一電極層上且暴露出第一電極層,其中第二絕緣層中具有至少一第二開口以暴露出第一開口。發光層位於發光區內,其中發光層設置於被暴露出的第一電極層上。第二電極層設置於發光層上。The invention provides a pixel structure of an organic light-emitting device, comprising a substrate, at least one active component, a first insulating layer, a first electrode layer, a second insulating layer, a light-emitting layer and a second electrode layer. The substrate has a plurality of sub-pixel regions, and each of the sub-pixel regions has a light-emitting region and a transparent region. The active component is located within the illumination region of the substrate. The first insulating layer covers the active device, wherein the first insulating layer has at least one first opening therein to expose a transparent region of the substrate. The first electrode layer is located in the light-emitting region, wherein the first electrode layer is disposed on the first insulating layer and electrically connected to the active device. The second insulating layer is on the first insulating layer and the first electrode layer and exposes the first electrode layer, wherein the second insulating layer has at least one second opening therein to expose the first opening. The luminescent layer is located in the illuminating region, wherein the luminescent layer is disposed on the exposed first electrode layer. The second electrode layer is disposed on the light emitting layer.
基於上述,由於本發明將畫素結構之透明區中的膜層移除,因而可以使畫素結構的透明度提昇。此外,本發明將畫素結構的電極層以及發光層都設置在發光區中,且此發光區中可以設置不透光材料,因而可以使有機發光裝置保有共振腔結構,進而使有機發光裝置的發光亮度提昇。Based on the above, since the present invention removes the film layer in the transparent region of the pixel structure, the transparency of the pixel structure can be improved. In addition, in the present invention, the electrode layer and the luminescent layer of the pixel structure are disposed in the illuminating region, and the opaque material can be disposed in the illuminating region, so that the organic illuminating device can maintain the resonant cavity structure, thereby making the organic illuminating device The brightness of the light is increased.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1是根據本發明一實施例之有機發光裝置之畫素結構的剖面示意圖。圖2是圖1之畫素結構之局部上視示意圖。為了清楚的說明本實施例,圖2僅繪示出圖1之畫素結構中之主動元件、第一電極層以及與主動元件電性連接的訊號線,並省略繪示發光層以及第二電極層。1 is a cross-sectional view showing a pixel structure of an organic light-emitting device according to an embodiment of the present invention. Figure 2 is a partial top plan view of the pixel structure of Figure 1. In order to clearly illustrate the present embodiment, FIG. 2 only shows the active device, the first electrode layer, and the signal line electrically connected to the active device in the pixel structure of FIG. 1, and the luminescent layer and the second electrode are omitted. Floor.
請參照圖1及圖2,本實施例之有機發光裝置之畫素結構包括基板100、至少一主動元件T1,T2、第一絕緣層106、第一電極層108、第二絕緣層110、發光層112以及第二電極層114。Referring to FIG. 1 and FIG. 2, the pixel structure of the organic light-emitting device of the present embodiment includes a substrate 100, at least one active device T1, T2, a first insulating layer 106, a first electrode layer 108, a second insulating layer 110, and a light emitting layer. Layer 112 and second electrode layer 114.
基板100之材質可為玻璃、石英、有機聚合物、或是不透光/反射材料(例如:導電材料、金屬、晶圓、陶瓷、或其它可適用的材料)、或是其它可適用的材料。根據本實施例,在基板100之表面上可進一步設置緩衝層101,其可防止基板100中的離子或雜質擴散至形成在基板100上之元件之中。緩衝層101之材質例如是氧化矽、氮化矽、氮氧化矽、其它合適的無機材料、或上述至少二種材料的堆疊層。在本實施例中,緩衝層101是覆蓋基板100之發光區E以及透明區T。The substrate 100 may be made of glass, quartz, organic polymer, or an opaque/reflective material (eg, conductive material, metal, wafer, ceramic, or other applicable material), or other applicable materials. . According to the present embodiment, the buffer layer 101 may be further provided on the surface of the substrate 100, which may prevent ions or impurities in the substrate 100 from diffusing into the elements formed on the substrate 100. The material of the buffer layer 101 is, for example, tantalum oxide, tantalum nitride, niobium oxynitride, other suitable inorganic materials, or a stacked layer of at least two of the above materials. In the present embodiment, the buffer layer 101 is a light-emitting region E and a transparent region T covering the substrate 100.
基板100具有多個子畫素區P,且每一個子畫素區P具有發光區E以及透明區T。在本實施例中,每一子畫素區P內的發光區E以及透明區T是分別設置在子畫素區P的上部以及下部。但是,本發明不限於此。根據其他實施例,每一子畫素區P內的發光區E以及透明區T的排列方式可以是其他種形式,例如發光區E位於子畫素區P的中央且透明區T位於子畫素區的兩側或周圍。類似地,本發明也不限制每一子畫素區P內之發光區E與透明區T的數目。換言之,在每一子畫素區P內可以有一個或一個以上的發光區E以及一個或一個以上的透明區T。The substrate 100 has a plurality of sub-pixel regions P, and each of the sub-pixel regions P has a light-emitting region E and a transparent region T. In the present embodiment, the light-emitting area E and the transparent area T in each sub-pixel area P are respectively disposed at the upper and lower portions of the sub-pixel area P. However, the invention is not limited thereto. According to other embodiments, the arrangement of the light-emitting area E and the transparent area T in each sub-pixel area P may be other forms, for example, the light-emitting area E is located in the center of the sub-pixel area P and the transparent area T is located in the sub-pixel. On either side or around the area. Similarly, the present invention does not limit the number of light-emitting regions E and transparent regions T in each sub-pixel region P. In other words, there may be one or more illuminating regions E and one or more transparent regions T in each sub-pixel region P.
主動元件T1,T2位於基板100之發光區E內。根據本實施例,主動元件T1,T2更進一步與訊號線(掃描線SL、資料線DL及電源線PL)電性連接。此外,在本實施例中,所述畫素結構更包括電容器C。在本實施例中,主動元件T1、T2是以頂部閘極型薄膜電晶體(又可稱為多晶矽薄膜電晶體)為例來說明。The active elements T1, T2 are located in the light-emitting area E of the substrate 100. According to this embodiment, the active devices T1 and T2 are further electrically connected to the signal lines (the scan lines SL, the data lines DL, and the power lines PL). Further, in the embodiment, the pixel structure further includes a capacitor C. In the present embodiment, the active devices T1 and T2 are exemplified by a top gate type thin film transistor (also referred to as a polycrystalline germanium thin film transistor).
主動元件T1具有閘極G1、源極S1、汲極D1以及通道CH1。主動元件T1之閘極G1與掃描線SL電性連接。主動元件T1之源極S1、汲極D1以及通道CH1是形成在一半導體層(多晶矽層)中。在上述半導體層與閘極G1之間夾有一層閘極絕緣層102,且在閘極G1上另覆蓋有一層絕緣層104。源極S1透過形成在絕緣層102、104中的接觸窗V1而與源極金屬層SM1電性連接,源極金屬層SM1更進一步與資料線DL電性連接。汲極D1透過形成在絕緣層102、104中的接觸窗V2而與汲極金屬層DM1電性連接。The active device T1 has a gate G1, a source S1, a drain D1, and a channel CH1. The gate G1 of the active device T1 is electrically connected to the scan line SL. The source S1, the drain D1, and the channel CH1 of the active device T1 are formed in a semiconductor layer (polysilicon layer). A gate insulating layer 102 is interposed between the semiconductor layer and the gate G1, and an insulating layer 104 is additionally covered on the gate G1. The source S1 is electrically connected to the source metal layer SM1 through the contact window V1 formed in the insulating layers 102 and 104. The source metal layer SM1 is further electrically connected to the data line DL. The drain D1 is electrically connected to the gate metal layer DM1 through the contact window V2 formed in the insulating layers 102 and 104.
主動元件T2具有閘極G2、源極S2、汲極D2以及通道CH2。主動元件T2之源極S2、汲極D2以及通道CH2是形成在一半導體層(例如:非晶矽、多晶矽、微晶矽、單晶矽、銦鍺鋅氧化物、銦鍺氧化物、銦鋅氧化物、鍺矽化合物、或其它合適的材料、或上述之組合,其中,以多晶矽層為範例)中。類似地,在上述半導體層與閘極G2之間夾有一層閘極絕緣層102,且在閘極G2上覆蓋有一層絕緣層104。源極S2透過形成在絕緣層104、102中的接觸窗V3而與源極金屬層SM2電性連接,汲極D2透過形成在絕緣層104、102中的接觸窗V4而與汲極金屬層DM2電性連接。此外,源極金屬層SM2又與汲極金屬層DM1電性連接。根據本實施例,主動元件T2的閘極G2是與主動元件T1的汲極D2(汲極金屬層DM2)電性連接,主動元件T2的源極S2(源極金屬層SM2)是與電源線PL電性連接。The active device T2 has a gate G2, a source S2, a drain D2, and a channel CH2. The source S2, the drain D2, and the channel CH2 of the active device T2 are formed in a semiconductor layer (for example, amorphous germanium, polycrystalline germanium, microcrystalline germanium, single crystal germanium, indium germanium zinc oxide, indium germanium oxide, indium zinc). An oxide, a ruthenium compound, or other suitable material, or a combination thereof, wherein the polycrystalline germanium layer is exemplified. Similarly, a gate insulating layer 102 is sandwiched between the above semiconductor layer and the gate G2, and an insulating layer 104 is covered on the gate G2. The source S2 is electrically connected to the source metal layer SM2 through the contact window V3 formed in the insulating layers 104, 102, and the drain D2 passes through the contact window V4 formed in the insulating layers 104, 102 and the gate metal layer DM2. Electrical connection. In addition, the source metal layer SM2 is electrically connected to the gate metal layer DM1. According to the embodiment, the gate G2 of the active device T2 is electrically connected to the drain D2 (the drain metal layer DM2) of the active device T1, and the source S2 (source metal layer SM2) of the active device T2 is connected to the power line. PL is electrically connected.
值得一提的是,上述絕緣層102、104都僅設置在發光區E內而未設置於透明區T內。因此絕緣層102、104在透明區T具有至少一開口(未標示出),以暴露出緩衝層101。It is worth mentioning that the above insulating layers 102, 104 are disposed only in the light emitting region E and are not disposed in the transparent region T. The insulating layers 102, 104 therefore have at least one opening (not shown) in the transparent region T to expose the buffer layer 101.
電容器C的電容電極E1是與主動元件T1的汲極D1電性連接。電容器C的電容電極E2是與電源供應線PL電性連接。The capacitor electrode E1 of the capacitor C is electrically connected to the drain D1 of the active device T1. The capacitor electrode E2 of the capacitor C is electrically connected to the power supply line PL.
在本實施例中是以兩個主動元件搭配一個電容器(2T1C)為例來說明,但並非用以限定本發明。換言之,本發明不限每一子畫素區域P內的主動元件與電容器的個數。In the present embodiment, two active components are combined with a capacitor (2T1C) as an example, but are not intended to limit the present invention. In other words, the present invention is not limited to the number of active elements and capacitors in each sub-pixel area P.
第一絕緣層106覆蓋主動元件T1,T2,其中第一絕緣層106位於發光區E內且未設置在透明區T內。根據本發明之一實施例,第一絕緣層106是覆蓋主動元件T1,T2以及上述之訊號線,而且第一絕緣層106中具有至少一第一開口O1(如圖1所示)以暴露出基板100之透明區T。更詳細來說,第一開口O1與絕緣層102、104中的開口共同暴露出緩衝層101。The first insulating layer 106 covers the active elements T1, T2, wherein the first insulating layer 106 is located in the light-emitting area E and is not disposed in the transparent area T. According to an embodiment of the invention, the first insulating layer 106 covers the active devices T1, T2 and the signal lines, and the first insulating layer 106 has at least one first opening O1 (shown in FIG. 1) to expose The transparent region T of the substrate 100. In more detail, the first opening O1 and the openings in the insulating layers 102, 104 together expose the buffer layer 101.
第一電極層108位於第一絕緣層106上且與主動元件T2電性連接。更詳細來說,第一電極層108是透過形成在第一絕緣層106中的接觸窗V5而與主動元件T2之汲極D2(汲極金屬層DM2)電性連接。特別是,上述之第一電極層108是位於發光E區內且未設置在透明區T內。The first electrode layer 108 is located on the first insulating layer 106 and is electrically connected to the active device T2. In more detail, the first electrode layer 108 is electrically connected to the drain D2 (the drain metal layer DM2) of the active device T2 through the contact window V5 formed in the first insulating layer 106. In particular, the first electrode layer 108 described above is located in the light-emitting E region and is not disposed in the transparent region T.
根據本實施例,第一電極層108較佳的是具有反射性質之電極層。第一電極層108可以單獨由一層反射電極層所構成,或者是由多層導電層108a/108b所構成(如圖1所示)。在圖1之實施例中,第一電極層108之上層電極108a為透明材料層且下層電極108b為反射材料層。當然,在其他實施例中,亦可以是第一電極層108之上層電極108a為反射材料層且下層電極108b是透明材料層。According to this embodiment, the first electrode layer 108 is preferably an electrode layer having reflective properties. The first electrode layer 108 may be composed of a single reflective electrode layer or a plurality of conductive layers 108a/108b (as shown in FIG. 1). In the embodiment of FIG. 1, the upper electrode 108a of the first electrode layer 108 is a transparent material layer and the lower electrode 108b is a reflective material layer. Of course, in other embodiments, the upper electrode 108a of the first electrode layer 108 may be a reflective material layer and the lower electrode 108b may be a transparent material layer.
第二絕緣層110是位在第一絕緣層106以及第一電極層108上且暴露出第一電極層108,其中第二絕緣層110位於發光區E內且未設置在透明區T內。在本實施例中,第二絕緣層110是作為後續欲於第一電極層108上所形成的發光層112之阻隔結構,換言之,所形成之第二絕緣層110可以限制發光層112形成在特定的位置(即被暴露的第一電極層108的表面上)。在本實施例中,第二絕緣層110具有至少一第二開口O2,第二開口O2暴露出第一開口O1。更詳細來說,第二開口O2、第一開口O1與絕緣層102、104中的開口共同暴露出緩衝層101。The second insulating layer 110 is located on the first insulating layer 106 and the first electrode layer 108 and exposes the first electrode layer 108, wherein the second insulating layer 110 is located in the light emitting region E and is not disposed in the transparent region T. In the present embodiment, the second insulating layer 110 is a barrier structure for the subsequent luminescent layer 112 formed on the first electrode layer 108. In other words, the formed second insulating layer 110 may restrict the formation of the luminescent layer 112 to a specific The position (ie, on the surface of the exposed first electrode layer 108). In this embodiment, the second insulating layer 110 has at least one second opening O2, and the second opening O2 exposes the first opening O1. In more detail, the second opening O2, the first opening O1 and the openings in the insulating layers 102, 104 together expose the buffer layer 101.
發光層112位於被暴露出的第一電極層108上,其中發光層112位於發光區E內且未設置在透明區T內發光層112可為紅色有機發光圖案、綠色有機發光圖案、藍色有機發光圖案或是混合各頻譜的光產生的不同顏色(例如白、橘、紫、...等)發光圖案。此外,發光層112中可更包括電子傳輸層、電子注入層、電洞傳輸層以及電洞注入層(未繪示),以增進發光層112的發光效率。The luminescent layer 112 is located on the exposed first electrode layer 108, wherein the luminescent layer 112 is located in the illuminating region E and is not disposed in the transparent region T. The luminescent layer 112 may be a red organic illuminating pattern, a green organic illuminating pattern, or a blue organic The illuminating pattern is a luminescent pattern of different colors (for example, white, orange, purple, etc.) generated by mixing light of each spectrum. In addition, the electron-emitting layer, the electron injection layer, the hole transport layer, and the hole injection layer (not shown) may be further included in the light-emitting layer 112 to enhance the light-emitting efficiency of the light-emitting layer 112.
第二電極層114是位於發光層112上。在本實施例中,第二電極層114是位於發光區E內且未設置在透明區T內。此外,第二電極層112為透明電極層,其材質例如是金屬氧化物或是薄層金屬之疊層。因此,本發明之有機發光裝置,是以頂部發光結構(或稱為向上發光結構),即第一電極層為反射材料所構成,而第二電極層為透明材料所構成,為主要實施範例。而底部發光結構(或向下發光結構),即第一電極層為透明材料所構成,而第二電極層為反射材料所構成,並不適用於本發明中。因為,發光區,例如:位於主動元件區中,底部發光結構中發光層所發射的光會被主動元件區中主動元件的不透光電極(例如:閘極、源極、汲極、掃描線、資料線、電容電極等等)所遮蔽,而沒有任何的光線存在。The second electrode layer 114 is on the light emitting layer 112. In the present embodiment, the second electrode layer 114 is located in the light-emitting area E and is not disposed in the transparent area T. In addition, the second electrode layer 112 is a transparent electrode layer, and the material thereof is, for example, a metal oxide or a laminate of thin metal. Therefore, the organic light-emitting device of the present invention is constituted by a top light-emitting structure (or an upward light-emitting structure), that is, the first electrode layer is made of a reflective material, and the second electrode layer is made of a transparent material, which is a main embodiment. The bottom light-emitting structure (or the downward light-emitting structure), that is, the first electrode layer is made of a transparent material, and the second electrode layer is made of a reflective material, and is not suitable for use in the present invention. Because the light-emitting region, for example, is located in the active device region, the light emitted by the light-emitting layer in the bottom light-emitting structure is absorbed by the opaque electrode of the active component in the active device region (eg, gate, source, drain, scan line) , data lines, capacitor electrodes, etc. are covered, and no light is present.
值得一提的是,在上述畫素結構之訊號線上(例如:掃描線SL、資料線DL、電源線PL其中至少一者)以及/或電容器C上亦可設置第一電極層108、發光層112以及第二電極層114。也就是發光區E可涵蓋設置有訊號線(例如:掃描線SL、資料線DL、電源線PL其中至少一者)以及/或電容器C之處。由於上述設置有訊號線以及電容器的地方原本就不透光,因此將發光區E涵蓋到設置有訊號線以及電容器C之處,可進一步增加畫素結構的發光面積。It is to be noted that the first electrode layer 108 and the light emitting layer may be disposed on the signal line of the pixel structure (for example, at least one of the scan line SL, the data line DL, and the power line PL) and/or the capacitor C. 112 and the second electrode layer 114. That is, the light-emitting area E may cover a place where a signal line (for example, at least one of the scan line SL, the data line DL, and the power line PL) and/or the capacitor C are disposed. Since the above-mentioned signal line and the capacitor are originally opaque, the light-emitting area E is covered with the signal line and the capacitor C, and the light-emitting area of the pixel structure can be further increased.
在上述圖1之實施例中,第一電極層108、發光層112以及第二電極層114是設置在發光區E內,因此每一子畫素區P是發光區E會發出光線,而透明區T是不會發出光線。然,因透明區T內幾乎沒有設置膜層,因此透明T可以保有高度的透明度。如此,可以使得畫素結構的透明度提昇。此外,因本實施例將第一電極層108、發光層112以及第二電極層114是設置在發光區E。而發光區E可以不需對畫素結構的透明度做出貢獻。因此第一電極層108可以選用具有高反射性質之材料,以使畫素結構保有共振腔結構,進而使有機發光裝置之畫素結構的發光亮度提昇。In the embodiment of FIG. 1, the first electrode layer 108, the light-emitting layer 112, and the second electrode layer 114 are disposed in the light-emitting region E, so that each of the sub-pixel regions P is a light-emitting region E that emits light, and is transparent. Zone T is not emitting light. However, since there is almost no film layer disposed in the transparent region T, the transparent T can maintain a high degree of transparency. In this way, the transparency of the pixel structure can be improved. Further, in the present embodiment, the first electrode layer 108, the light-emitting layer 112, and the second electrode layer 114 are disposed in the light-emitting region E. The illuminating area E does not need to contribute to the transparency of the pixel structure. Therefore, the first electrode layer 108 can be made of a material having high reflective properties, so that the pixel structure retains the resonant cavity structure, thereby improving the luminance of the pixel structure of the organic light-emitting device.
在圖1之實施例中,第二電極層114僅設置在發光區E而沒有設置在透明區T中。然,根據其他實施例,第二電極層114可以設置在發光區E以及透明區T中,如圖3所示。圖3之實施例與圖1之實施例相似,因此在此與圖1之實施例相同的元件以相同的符號表示,且不再重複贅述。圖3之實施例與圖1之實施例不相同之處在於,第二電極層114位於發光區E內以及透明區T內,且位於發光區E內的第二電極層114與位於透明區T的第二電極層114,較佳地,是分離開來。於其它實施例中,第二電極層114位於發光區E內以及透明區T內,且位於發光區E內的第二電極層114與位於透明區T的第二電極層114是可連接在一起的。由於第二電極層114是透明電極層,因此即使透明區T內設置有第二電極層114,仍可使透明區T保有一定程度的透明度。In the embodiment of FIG. 1, the second electrode layer 114 is disposed only in the light-emitting region E and is not disposed in the transparent region T. However, according to other embodiments, the second electrode layer 114 may be disposed in the light emitting region E and the transparent region T as shown in FIG. The embodiment of FIG. 3 is similar to the embodiment of FIG. 1. Therefore, the same components as those of the embodiment of FIG. 1 are denoted by the same reference numerals and the detailed description thereof will not be repeated. The embodiment of FIG. 3 is different from the embodiment of FIG. 1 in that the second electrode layer 114 is located in the light-emitting region E and in the transparent region T, and the second electrode layer 114 located in the light-emitting region E is located in the transparent region T. The second electrode layer 114 is preferably separated. In other embodiments, the second electrode layer 114 is located in the light emitting region E and in the transparent region T, and the second electrode layer 114 located in the light emitting region E and the second electrode layer 114 located in the transparent region T are connectable of. Since the second electrode layer 114 is a transparent electrode layer, even if the second electrode layer 114 is provided in the transparent region T, the transparent region T can be maintained with a certain degree of transparency.
在此實施例中,由於第二絕緣層110在透明區T具有第二開口O2,第一絕緣層106在透明區T具有第一開口O1,且絕緣層104、102在透明區T具有開口。上述之第二開口O2、第一開口O1以及絕緣層104、102中的開口共同暴露出緩衝層101。因此,第二電極層114覆蓋位於上述開口底部的緩衝層110,且暴露出上述開口的局部側壁。In this embodiment, since the second insulating layer 110 has the second opening O2 in the transparent region T, the first insulating layer 106 has the first opening O1 in the transparent region T, and the insulating layers 104, 102 have openings in the transparent region T. The second opening O2, the first opening O1, and the openings in the insulating layers 104, 102 collectively expose the buffer layer 101. Therefore, the second electrode layer 114 covers the buffer layer 110 at the bottom of the opening and exposes a partial sidewall of the opening.
另外,在上述圖1之實施例中,透明區T內僅設置有緩衝層101,因此可以增加透明區T的透明度。然,增加透明區T之透明度之方法亦可以其他實施例來實現,如下所述。In addition, in the embodiment of FIG. 1 described above, only the buffer layer 101 is provided in the transparent region T, so that the transparency of the transparent region T can be increased. However, the method of increasing the transparency of the transparent region T can also be implemented in other embodiments, as described below.
圖4是根據本發明一實施例之有機發光裝置之畫素結構的剖面示意圖。圖4之實施例與圖1之實施例相似,因此在此與圖1之實施例相同的元件以相同的符號表示,且不再重複贅述。圖4之實施例與圖1之實施例不相同之處在於基板100上未設置有緩衝層,而位於發光區E內的閘極絕緣層102延伸至透明區T內。在此實施例中,由於透明區T內僅設置有閘極絕緣層102,因此可以增加透明區T的透明度。4 is a cross-sectional view showing a pixel structure of an organic light-emitting device according to an embodiment of the present invention. The embodiment of FIG. 4 is similar to the embodiment of FIG. 1. Therefore, the same components as those of the embodiment of FIG. 1 are denoted by the same reference numerals and the detailed description thereof will not be repeated. The embodiment of FIG. 4 is different from the embodiment of FIG. 1 in that the buffer layer is not disposed on the substrate 100, and the gate insulating layer 102 located in the light-emitting region E extends into the transparent region T. In this embodiment, since only the gate insulating layer 102 is provided in the transparent region T, the transparency of the transparent region T can be increased.
圖5是根據本發明一實施例之有機發光裝置之畫素結構的剖面示意圖。圖5之實施例與圖1之實施例相似,因此在此與圖1之實施例相同的元件以相同的符號表示,且不再重複贅述。圖5之實施例與圖1之實施例不相同之處在於發光區E內的閘極絕緣層102延伸至透明區T內。因此,在此實施例中,透明區T內僅設置有緩衝層101以及閘極絕緣層102。類似地,由於本實施例之透明區T內僅設置有緩衝層101以及閘極絕緣層102,因此可以使透明區T保有一定程度的透明度。FIG. 5 is a cross-sectional view showing a pixel structure of an organic light-emitting device according to an embodiment of the present invention. The embodiment of FIG. 5 is similar to the embodiment of FIG. 1. Therefore, the same components as those of the embodiment of FIG. 1 are denoted by the same reference numerals and the description thereof will not be repeated. The embodiment of FIG. 5 is different from the embodiment of FIG. 1 in that the gate insulating layer 102 in the light-emitting region E extends into the transparent region T. Therefore, in this embodiment, only the buffer layer 101 and the gate insulating layer 102 are provided in the transparent region T. Similarly, since only the buffer layer 101 and the gate insulating layer 102 are provided in the transparent region T of the present embodiment, the transparent region T can be maintained with a certain degree of transparency.
在上述數個實施例中,透明區T內僅設置緩衝層101、閘極絕緣層102或是緩衝層101與閘極絕緣層102。然,根據另一實施例,亦可以是透明區T內完全無設置膜層,也就是透明區T單純僅有基板100。In the above embodiments, only the buffer layer 101, the gate insulating layer 102 or the buffer layer 101 and the gate insulating layer 102 are provided in the transparent region T. However, according to another embodiment, it is also possible that there is no film layer in the transparent region T, that is, the transparent region T is simply the substrate 100.
此外,在上述數個實施例中,畫素結構中的主動元件都是以頂部閘極型薄膜電晶體為例來說明。然,根據其他實施例,本發明之畫素結構中的主動元件也可以採用底部閘極型薄膜電晶體,如下所述。In addition, in the above several embodiments, the active elements in the pixel structure are all exemplified by a top gate type thin film transistor. However, according to other embodiments, the active device in the pixel structure of the present invention may also employ a bottom gate type thin film transistor, as described below.
圖6是根據本發明一實施例之有機發光裝置之畫素結構的剖面示意圖。圖6之實施例與圖1之實施例相似,因此在此與圖1之實施例相同的元件以相同的符號表示,且不再重複贅述。圖6之實施例與圖1之實施例不相同之處在於主動元件T是底部閘極型薄膜電晶體,其包括閘極G、通道CH、源極S以及汲極D。閘極G位於基板100上,閘極絕緣層102覆蓋閘極G,通道CH位於閘極絕緣層102上,且源極與汲極D位於通道CH上。其中,通道CH是由單層或多層的半導體材料所構成,例如:非晶矽、多晶矽、微晶矽、單晶矽、銦鍺鋅氧化物、銦鍺氧化物、銦鋅氧化物、鍺矽化合物、或其它合適的材料、或上述之組合。6 is a cross-sectional view showing a pixel structure of an organic light-emitting device according to an embodiment of the present invention. The embodiment of FIG. 6 is similar to the embodiment of FIG. 1. Therefore, the same components as those of the embodiment of FIG. 1 are denoted by the same reference numerals and the detailed description thereof will not be repeated. The embodiment of FIG. 6 is different from the embodiment of FIG. 1 in that the active device T is a bottom gate type thin film transistor including a gate G, a channel CH, a source S, and a drain D. The gate G is located on the substrate 100, the gate insulating layer 102 covers the gate G, the channel CH is located on the gate insulating layer 102, and the source and the drain D are located on the channel CH. Wherein, the channel CH is composed of a single layer or a plurality of layers of semiconductor materials, for example: amorphous germanium, polycrystalline germanium, microcrystalline germanium, single crystal germanium, indium germanium zinc oxide, indium germanium oxide, indium zinc oxide, germanium A compound, or other suitable material, or a combination of the above.
類似地,第一絕緣層106覆蓋主動元件T,第一電極層108位於第一絕緣層106上,且透過接觸窗V與主動元件T之汲極D電性連接。第二絕緣層110位於第一絕緣層106與第一電極層108上,且暴露出第一電極層108。發光層112位於第一電極層108上,且第二電極層114位於發光層112上。Similarly, the first insulating layer 106 covers the active device T. The first electrode layer 108 is located on the first insulating layer 106 and is electrically connected to the drain D of the active device T through the contact window V. The second insulating layer 110 is located on the first insulating layer 106 and the first electrode layer 108 and exposes the first electrode layer 108. The light emitting layer 112 is located on the first electrode layer 108, and the second electrode layer 114 is located on the light emitting layer 112.
同樣地,第一絕緣層106與第二絕緣層110都僅設置在發光區E中,而沒有設置在透明區T中。在透明區中僅設置有緩衝層101。更詳細來說,第一絕緣層106與第二絕緣層110中具有開口O2、O2,其暴露出透明區T內的緩衝層101。由於透明區T內僅設置有緩衝層101,因此可以增加透明區T的透明度。Likewise, both the first insulating layer 106 and the second insulating layer 110 are disposed only in the light-emitting region E, and are not disposed in the transparent region T. Only the buffer layer 101 is provided in the transparent region. In more detail, the first insulating layer 106 and the second insulating layer 110 have openings O2, O2 therein that expose the buffer layer 101 in the transparent region T. Since only the buffer layer 101 is provided in the transparent region T, the transparency of the transparent region T can be increased.
此外,本發明之有機發光裝置,是以頂部發光結構(或稱為向上發光結構),即第一電極層為反射材料所構成,而第二電極層為透明材料所構成,為主要實施範例。而底部發光結構(或向下發光結構),即第一電極層為透明材料所構成,而第二電極層為反射材料所構成,並不適用於本發明中。因為,發光區,例如:位於主動元件區中,底部發光結構中發光層所發射的光會被主動元件區中主動元件的不透光電極(例如:閘極、源極、汲極、掃描線、資料線、電容電極等等)所遮蔽,而沒有任何的光線存在。In addition, the organic light-emitting device of the present invention is constituted by a top light-emitting structure (or an upward light-emitting structure), that is, the first electrode layer is made of a reflective material, and the second electrode layer is made of a transparent material, which is a main embodiment. The bottom light-emitting structure (or the downward light-emitting structure), that is, the first electrode layer is made of a transparent material, and the second electrode layer is made of a reflective material, and is not suitable for use in the present invention. Because the light-emitting region, for example, is located in the active device region, the light emitted by the light-emitting layer in the bottom light-emitting structure is absorbed by the opaque electrode of the active component in the active device region (eg, gate, source, drain, scan line) , data lines, capacitor electrodes, etc. are covered, and no light is present.
圖7是根據本發明一實施例之有機發光裝置之畫素結構的剖面示意圖。圖7之實施例與圖6之實施例相似,因此在此與圖6之實施例相同的元件以相同的符號表示,且不再重複贅述。圖7之實施例與圖6之實施例不相同之處在於基板100上未設置有緩衝層,而位於發光區E內的閘極絕緣層102延伸至透明區T內。在此實施例中,由於透明區T內僅設置有閘極絕緣層102,因此可以增加透明區T的透明度。7 is a cross-sectional view showing a pixel structure of an organic light-emitting device according to an embodiment of the present invention. The embodiment of FIG. 7 is similar to the embodiment of FIG. 6, and therefore the same components as those of the embodiment of FIG. 6 are denoted by the same reference numerals and the description thereof will not be repeated. The embodiment of FIG. 7 is different from the embodiment of FIG. 6 in that the buffer layer is not disposed on the substrate 100, and the gate insulating layer 102 located in the light-emitting region E extends into the transparent region T. In this embodiment, since only the gate insulating layer 102 is provided in the transparent region T, the transparency of the transparent region T can be increased.
圖8是根據本發明一實施例之有機發光裝置之畫素結構的剖面示意圖。圖8之實施例與圖6之實施例相似,因此在此與圖6之實施例相同的元件以相同的符號表示,且不再重複贅述。圖8之實施例與圖6之實施例不相同之處在於發光區E內的閘極絕緣層102延伸至透明區T內。因此,在此實施例中,透明區T內僅設置有緩衝層101以及閘極絕緣層102。類似地,由於本實施例之透明區T內僅設置有緩衝層101以及閘極絕緣層102,因此可以使透明區T保有一定程度的透明度。FIG. 8 is a cross-sectional view showing a pixel structure of an organic light-emitting device according to an embodiment of the present invention. The embodiment of FIG. 8 is similar to the embodiment of FIG. 6, and therefore the same components as those of the embodiment of FIG. 6 are denoted by the same reference numerals and the description thereof will not be repeated. The embodiment of FIG. 8 is different from the embodiment of FIG. 6 in that the gate insulating layer 102 in the light-emitting region E extends into the transparent region T. Therefore, in this embodiment, only the buffer layer 101 and the gate insulating layer 102 are provided in the transparent region T. Similarly, since only the buffer layer 101 and the gate insulating layer 102 are provided in the transparent region T of the present embodiment, the transparent region T can be maintained with a certain degree of transparency.
類似地,在上述圖6至圖8之具有底部閘極型薄膜電晶體之畫素結構中,其第二電極層114都僅設置在發光區E中。然,根據其他實施例,第二電極層114都也是可設置在發光區E以及透明區T中(類似圖3之第二電極層114的設置方式)。其中,發光區E以及透明區T中的第二電極層114可選擇性的相互連接或不連接。Similarly, in the pixel structure having the bottom gate type thin film transistor of FIGS. 6 to 8 described above, the second electrode layer 114 is disposed only in the light emitting region E. However, according to other embodiments, the second electrode layer 114 can also be disposed in the light-emitting region E and the transparent region T (similar to the arrangement of the second electrode layer 114 of FIG. 3). The light-emitting region E and the second electrode layer 114 in the transparent region T may be selectively connected or not connected.
同樣地,在上述圖6至圖8之實施例中,透明區T內僅設置緩衝層101、閘極絕緣層102或是緩衝層101與閘極絕緣層102。然,根據另一實施例,亦可以是透明區T內完全無設置膜層,也就是透明區T單純僅有基板100。Similarly, in the above embodiments of FIGS. 6 to 8, only the buffer layer 101, the gate insulating layer 102 or the buffer layer 101 and the gate insulating layer 102 are provided in the transparent region T. However, according to another embodiment, it is also possible that there is no film layer in the transparent region T, that is, the transparent region T is simply the substrate 100.
綜上所述,由於本發明將有機發光裝置之畫素結構的透明區中的膜層完全移除,或者是僅留下緩衝層、閘極絕緣層、或緩衝層與閘極絕緣層。並且將畫素結構的發光層設置在發光區中。由於畫素結構之發光區主要是發揮發光作用,且透明區主要是提供畫素結構利用基板外的環境光來提昇畫素結構的透明度。因此,在做成顯示裝置或電子裝置時,會使用框架(未繪示)將有機發光裝置容納於其中,此時,相對於透明區的框架中的部件並不會遮蔽外界環境光從基板外面進入有機發光裝置內。因此,當使用者往有機發光裝置的第二電極看時,有機發光裝置會因為透明區的存在而使得透明度或亮度提昇。In summary, the present invention completely removes the film layer in the transparent region of the pixel structure of the organic light-emitting device, or leaves only the buffer layer, the gate insulating layer, or the buffer layer and the gate insulating layer. And a light-emitting layer of a pixel structure is disposed in the light-emitting region. Since the illuminating region of the pixel structure mainly plays a role of illuminating, and the transparent region mainly provides a pixel structure, the ambient light outside the substrate is used to enhance the transparency of the pixel structure. Therefore, when the display device or the electronic device is formed, a frame (not shown) is used to accommodate the organic light-emitting device therein. At this time, the components in the frame relative to the transparent region do not shield the external ambient light from the outside of the substrate. Enter the organic light-emitting device. Therefore, when the user looks at the second electrode of the organic light-emitting device, the organic light-emitting device may increase the transparency or brightness due to the presence of the transparent region.
此外,本發明將畫素結構的電極層以及發光層都設置在發光區中,且此發光區中可以設置不透光材料當作第一電極。在發光區中設置反射材料/不透光材料可以使有機發光裝置之發光區保有共振腔結構,進而使有機發光裝置的發光亮度提昇。也就是說,有機發光裝置之畫素結構中的有機發光結構較適用頂部發光結構(或稱為向上發光結構),而較不適用底部發光結構(或稱為向下發光結構),其中,二者結構的差異可查閱上述實施例。In addition, in the present invention, the electrode layer and the light-emitting layer of the pixel structure are disposed in the light-emitting region, and an opaque material may be disposed as the first electrode in the light-emitting region. The provision of the reflective material/opaque material in the light-emitting region can maintain the resonant cavity structure of the light-emitting region of the organic light-emitting device, thereby improving the light-emitting brightness of the organic light-emitting device. That is to say, the organic light-emitting structure in the pixel structure of the organic light-emitting device is more suitable for the top-emitting structure (or the upward-emitting structure), and less suitable for the bottom-emitting structure (or the downward-emitting structure), wherein The difference in the structure of the structure can be referred to the above embodiment.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100...基板100. . . Substrate
101...緩衝層101. . . The buffer layer
102...閘極絕緣層102. . . Gate insulation
104,106,110...絕緣層104,106,110. . . Insulation
108...第一電極層108. . . First electrode layer
108a...下層電極108a. . . Lower electrode
108b...上層電極108b. . . Upper electrode
112...發光層112. . . Luminous layer
114...第二電極層114. . . Second electrode layer
T1、T2、T...主動元件T1, T2, T. . . Active component
C...電容器C. . . Capacitor
G1、G2、G...閘極G1, G2, G. . . Gate
S1、S2、S...源極S1, S2, S. . . Source
D1、D2、D...汲極D1, D2, D. . . Bungee
CH1、CH2、CH...通道CH1, CH2, CH. . . aisle
E1、E2...電容電極E1, E2. . . Capacitor electrode
V1~V5、V...接觸窗V1~V5, V. . . Contact window
SM1、SM2...源極金屬層SM1, SM2. . . Source metal layer
DM1、DM2...汲極金屬層DM1, DM2. . . Bungee metal layer
O1、O2...開口O1, O2. . . Opening
E...發光區E. . . Luminous area
T...透明區T. . . Transparent zone
P...子畫素區P. . . Sub-pixel area
DL...資料線DL. . . Data line
SL...掃描線SL. . . Scanning line
PL...電源線PL. . . power cable
圖1是根據本發明一實施例之有機發光裝置之畫素結構的剖面示意圖。1 is a cross-sectional view showing a pixel structure of an organic light-emitting device according to an embodiment of the present invention.
圖2是圖1之畫素結構之局部上視示意圖。Figure 2 is a partial top plan view of the pixel structure of Figure 1.
圖3至圖8是根據本發明之其他實施例之有機發光裝置之畫素結構的剖面示意圖。3 to 8 are schematic cross-sectional views showing a pixel structure of an organic light-emitting device according to another embodiment of the present invention.
100...基板100. . . Substrate
101...緩衝層101. . . The buffer layer
102...閘極絕緣層102. . . Gate insulation
104,106,110...絕緣層104,106,110. . . Insulation
108...第一電極層108. . . First electrode layer
108a...下層電極108a. . . Lower electrode
108b...上層電極108b. . . Upper electrode
112...發光層112. . . Luminous layer
114...第二電極層114. . . Second electrode layer
T1、T2...主動元件T1, T2. . . Active component
C...電容器C. . . Capacitor
G1、G2...閘極G1, G2. . . Gate
S1、S2...源極S1, S2. . . Source
D1、D2...汲極D1, D2. . . Bungee
CH1、CH2...通道CH1, CH2. . . aisle
E1、E2...電容電極E1, E2. . . Capacitor electrode
V1~V5...接觸窗V1 ~ V5. . . Contact window
SM1、SM2...源極金屬層SM1, SM2. . . Source metal layer
DM1、DM2...汲極金屬層DM1, DM2. . . Bungee metal layer
O1、O2...開口O1, O2. . . Opening
E...發光區E. . . Luminous area
T...透明區T. . . Transparent zone
P...子畫素區P. . . Sub-pixel area
Claims (19)
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TW594621B (en) * | 2002-01-11 | 2004-06-21 | Hitachi Ltd | Acive matrix type display device |
TW595026B (en) * | 2002-04-25 | 2004-06-21 | Lg Philips Lcd Co Ltd | Organic electroluminescent display device |
US20060160282A1 (en) * | 2005-01-20 | 2006-07-20 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and manufacturing method thereof |
US20070194696A1 (en) * | 2006-02-22 | 2007-08-23 | Hsiang-Lun Hsu | System for displaying images including electroluminescent device and method for fabricating the same |
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TW594621B (en) * | 2002-01-11 | 2004-06-21 | Hitachi Ltd | Acive matrix type display device |
TW595026B (en) * | 2002-04-25 | 2004-06-21 | Lg Philips Lcd Co Ltd | Organic electroluminescent display device |
US20060160282A1 (en) * | 2005-01-20 | 2006-07-20 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and manufacturing method thereof |
US20070194696A1 (en) * | 2006-02-22 | 2007-08-23 | Hsiang-Lun Hsu | System for displaying images including electroluminescent device and method for fabricating the same |
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