TWI419261B - Method for separating ic substrate and support component - Google Patents

Description

Method for separating IC substrate and carrier

The invention relates to a method for separating an IC substrate and a carrier, in particular to a method for separating an IC substrate and a carrier after a packaging process.

At present, the design and manufacturing method of the separate IC carrier board requires that each IC substrate block is adhered to the strip-shaped carrier base, and after the package is completed, the IC substrate block is removed from the carrier base. However, since the carrier base is not easily bent (the thickness is thicker than the IC substrate block or the material is harder than the IC substrate block), it is likely to cause damage to the packaged IC substrate block (such as chipping or cracking) when it is removed or It is directly caused to break the bearing base. Due to the high cost of the carrier base, if the reuse of the carrier base is not good, the manufacturing cost will be increased.

Therefore, it is necessary to provide a method of separating an IC substrate and a carrier, a method of fabricating an IC substrate strip, and an IC substrate strip to improve the above problems.

An object of the present invention is to provide a method of separating an IC substrate and a carrier and a method of fabricating the IC substrate strip.

In view of the above object of the present invention, the method for separating an IC substrate and a carrier of the present invention comprises the steps of: providing a carrier, wherein the carrier is permeable; arranging the photographic adhesive over the carrier; and attaching at least one IC substrate unit Covering the photoresist to form an IC substrate strip; processing the at least one IC substrate unit; irradiating a specific light from the underside of the carrier to foam the photoresist; and removing the carrier.

In one embodiment of the invention, the photoresist comprises a liquid or condensed photosensitive resin, or a solid photosensitive adhesive.

In an embodiment of the invention, the photoresist comprises an ultraviolet curable resin and the specific light comprises ultraviolet light.

In one embodiment of the invention, the processing process includes a packaging process.

The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims.

Please refer to FIG. 1 to FIG. 8 for a schematic diagram of an embodiment of a method for separating an IC substrate and a carrier according to the present invention. 1 is a flow chart of steps of an embodiment of a method for separating an IC substrate and a carrier according to the present invention; FIG. 2 is a schematic view of an embodiment of a carrier according to the present invention; and FIG. 3 is a photosensitive according to the present invention; FIG. 4 is a schematic view showing an embodiment of an IC substrate unit according to the present invention; and FIGS. 5 to 8 are a method for separating an IC substrate and a carrier according to the present invention; A schematic diagram of an embodiment.

As shown in FIG. 1, the separated IC substrate and the carrier of the present invention first perform step S71: providing a carrier.

As shown in Fig. 2, the carrier 3a of the present invention is permeable to light. In an embodiment of the invention, the carrier 3a is a transparent carrier base, but the invention is not limited to transparency.

The invention then proceeds to step S72: arranging the photoresist over the carrier.

As shown in FIG. 3, step S72 is to uniformly dispose the photosensitive adhesive 4 on the carrier 3a. In one embodiment of the invention, the photosensitive adhesive is a liquid or condensed photosensitive resin, such as an ultraviolet curing resin, but the present invention does not. This is limited to this. In an embodiment of the present invention, the manner of disposing the photosensitive adhesive 4 may be coating, wherein the coating method includes screen printing, roll coating printing or inkjet printing, but the invention is not limited thereto; The glue 4 is dried to remove excess solvent.

In another embodiment of the present invention, the photosensitive adhesive is a viscous solid photosensitive film, and the photosensitive resin which is hardened or foamed by ultraviolet exposure is also used, but the invention is not limited thereto. In an embodiment of the present invention, the photosensitive adhesive 4 may be disposed by attaching and/or pressing. For example, in the conventional electroplating copper process, the resistive plating resist is formed on the surface of the circuit board and/ Or a method of pressing, but the invention is not limited thereto.

It should be noted that if the original size of the carrier member 3a is large, the carrier member 3 can be appropriately cut into strips, and the next step is performed, but the carrier member 3a of the present invention can also be an appropriately sized strip. Shaped carrier base.

The present invention then proceeds to step S73: the IC substrate unit is attached to the photosensitive paste.

As shown in FIG. 4, the IC substrate module 11 of the present invention is an IC substrate block which is cut out by a large-area IC substrate panel 10, and the IC substrate unit 11 includes The IC substrate unit 111, the IC substrate unit 111 are arranged in a matrix, and the IC substrate unit 111 has a wiring layer (not shown). In other words, the IC substrate unit is a package carrier. It may also be a type of circuit board having a high wiring density build-up structure, but the invention is not limited thereto. It should be noted that the number and arrangement of the IC substrate unit 11 and its IC substrate unit element 111 are not limited to FIG. 4 . In other embodiments, the IC substrate unit 11 may include only one IC substrate unit element 111 . It should be noted that the IC described in the present invention is an abbreviation of Integrated Circuit.

In an embodiment of the present invention, the IC substrate unit 11 may have a size of between 10 millimeters (mm) x 10 millimeters (mm) and 50 millimeters (mm) x 50 millimeters (mm), and a thickness of about 0.3 millimeters (mm). However, the invention is not limited thereto.

As shown in FIG. 5, in step S73, each of the IC substrate units 11 is attached to the photosensitive adhesive 4, and since the photosensitive adhesive 4 is a viscous colloid at this time, each IC substrate unit 11 is attached to the photosensitive adhesive 4 After each of the IC substrate units 11 is lightly pressed by a roller, each of the IC substrate units 11 and the photosensitive paste 4 can be tightly coupled. In an embodiment of the present invention, after the IC substrate unit 11 is attached to the photoresist 4, the IC substrate strip 6 of the present invention is formed, and the IC substrate strip 6 can be shipped to the packaging and testing factory for subsequent processing, but the present invention does not This is limited to this.

The present invention then proceeds to step S74: processing the IC substrate unit.

As shown in FIG. 6, in one embodiment of the present invention, the packaging and testing factory performs a packaging process on the IC substrate unit 11 on the IC substrate strip 6, but the present invention is not limited to this process. Since the technology used in the packaging process is not the focus of the present invention, it will not be described here.

The present invention then proceeds to step S75 by irradiating a specific light from under the carrier to foam the photosensitive paste.

As shown in FIG. 7, step S75 irradiates a specific light from the lower side of the carrier 3. Since the carrier 3 is transparent, specific light can penetrate the carrier 3, and the photosensitive adhesive 4 can be foamed after being irradiated with specific light. And lose the viscosity. In an embodiment of the invention, the specific light may be ultraviolet rays (Ultraviolet Rays), but the invention is not limited thereto.

The invention finally proceeds to step S76: removing the carrier.

As shown in FIG. 8, the photosensitive adhesive 4 after the viscosity is lost can be almost automatically separated from the carrier 3 and the IC substrate unit 11. If the residual glue is on the carrier 3 and the IC substrate unit 11, an organic solvent such as a ketone can be used. The solvent-like solvent is cleaned, and the carrier 3 after cleaning can be recycled and reused, which can overcome the loss of damage of the IC substrate unit element 111 or the carrier 3 when the board is removed as in the prior art, so that the package can be increased after the package is removed. The yield of the IC substrate unit 11 and the manufacturing cost are reduced.

To sum up, the present invention, regardless of its purpose, means and efficacy, shows its distinctive features of the prior art. You are requested to review the examination and express the patent as soon as possible. It should be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the invention is intended to be limited by the scope of the claims.

3a, 3. . . Carrier

4. . . Photosensitive adhesive

6. . . IC substrate strip

10. . . IC substrate sheet

11. . . IC substrate unit

111. . . IC substrate unit component

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart showing the steps of an embodiment of a method for separating an IC substrate and a carrier of the present invention.

Figure 2 is a schematic illustration of one embodiment of a carrier of the present invention.

Fig. 3 is a schematic view showing an embodiment of the photosensitive paste of the present invention disposed on a carrier.

Fig. 4 is a schematic view showing an embodiment of an IC substrate unit according to the present invention.

5 to 8 are schematic views showing an embodiment of a method of separating an IC substrate and a carrier according to the present invention.

3. . . Carrier

4. . . Photosensitive adhesive

6. . . IC substrate strip

11. . . IC substrate unit

Claims (7)

A method for separating an IC substrate and a carrier comprises the steps of: providing a carrier, wherein the carrier is transparent; and arranging a photoresist on the carrier; and attaching at least one IC substrate unit to the photosensitive Forming an IC substrate strip on the glue; performing a processing process on the at least one IC substrate unit; irradiating a specific light from the lower side of the carrier member to foam the photosensitive adhesive; and removing the carrier member. The method of claim 1, wherein the method for fabricating the IC substrate strip comprises the steps of: providing a light transmissive carrier base; arranging the photoresist over the base; and The at least one IC substrate unit is attached to the photoresist. The method of claim 1 or 2, wherein the photosensitive adhesive is a liquid or condensed photosensitive resin, or a viscous solid photosensitive film, and the specific light is ultraviolet light. The method of claim 1 or 2, wherein the processing includes a packaging process. The method of claim 1 or 2, wherein each of the at least one IC substrate unit comprises an IC substrate block. The method of claim 1 or 2, wherein the method of disposing the photoresist on the carrier comprises the steps of: coating the photoresist over the carrier; and drying the photoresist. The method of claim 1 or 2, wherein the method of disposing the photoresist on the carrier comprises the steps of: attaching or pressing the photoresist over the carrier; and drying the Photosensitive adhesive.