TWI417169B - Cutting tools with the top of the complex cutting - Google Patents

Description

Cutting tool with multiple cutting tops

The present invention relates to a diamond cutting tool, and more particularly to a cutting tool having a plurality of cutting tips.

Generally, the grinding wheel of a diamond wheel or a diamond dresser needs to have a machining top with a cutting edge, such as a cutting edge, a cutting ridge line, a cutting edge, etc., in order to penetrate into the material to have the ability to remove the workpiece material; Or the diamond abrasive grain with the ridge line facing the workpiece has sharp cutting edge angle and cutting ridge line, and the cutting material has good efficiency; the diamond abrasive grain with the plane facing the workpiece can also cut and plan the material from the workpiece by using the cutting edge around the plane. However, the cutting material is inefficient.

A trimmer for conditioning a wafer polishing pad disclosed in Taiwan Patent Publication No. 200707531, comprising: a substrate having a plurality of grooves on an upper surface thereof; a fixing material filled in the plurality of grooves; and a plurality of grinding The plurality of abrasive particles are fixed in the plurality of grooves by the fixing material. Wherein the plurality of grooves are arranged in a regular manner, and each of the plurality of grooves is sized to accommodate only one abrasive grain.

Applicant No. 097109052, filed on March 14, 2008, the disclosure of which is incorporated herein by reference in its entire entire entire entire entire entire entire entire entire entire entire The plate causes a portion of the plurality of polyhedral abrasives to automatically fall into the plurality of positioning units, respectively, and automatically turns to cause one of the tips of the abrasive to protrude from the first surface of the plate, or to further extend the other end of the abrasive through the positioning unit to protrude the plate The second surface is therefore convenient for the abrasive to be combined with the flat plate according to the set arrangement pattern and the spacing, and the size and shape of the slot of the positioning unit are used to control the exposed height of the tip end of the abrasive protruding plate, and the shape of the positioning unit itself is utilized. The abrasive is limited so that the abrasive is difficult to rotate after it is positioned.

Taiwan Patent Publication No. 200714416 discloses a tool having a sintered body polishing portion and a method of manufacturing the same, comprising an abrasive tool having a polishing portion composed of a super-sintered sintered body, wherein the polishing portion includes a plurality of polishing units having a top portion, and each of the top portions is mutually The ground is on the same plane. A plurality of sets of parallel groove groups are appropriately formed in the boundary portion of the divided polishing portion, and the polishing units are arranged as uniformly as possible on the entire polishing portion.

A CMP conditioner disclosed in U.S. Patent No. 7,150,677, the entire surface of which is bonded to a plurality of diamond abrasive grains, and the (111) crystal face parallel polishing surface of the diamond abrasive grains faces the direction of contacting the CMP polishing pad. However, the cutting efficiency of the planar contact CMP polishing pad is poor.

The present invention has been proposed in order to improve the wear resistance and cutting efficiency of a diamond cutting tool.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a cutting tool having a plurality of cutting tips, wherein a plurality of individual abrasive grains are arranged on a working surface of a base, the abrasive grains being separately formed to have a top portion and a top portion respectively It is connected with the crystal face end of the abrasive grains, and the wear-resistant crystal face of the abrasive grain contacts the processed surface of the workpiece to improve the wear resistance of the cutting tool, improve the cutting efficiency and prolong the service life.

Another object of the present invention is to provide a cutting tool having a plurality of cutting tips such that the tops of the abrasive grains protrude from the working surface by a difference of less than 20% from each other to improve cutting efficiency and quality.

For other purposes and functions of the present invention, please refer to the drawings and the embodiments, which are described in detail below.

In the context of the description and patent application of the present invention, the following terms are used in accordance with the definitions set forth below.

"Working surface" means the side of the material that the tool contacts or is configured to contact the workpiece in a planing or machining program. In some cases, the working surface may only be operated facing the workpiece, but may not be in actual contact. To the workpiece.

"General plane" refers to the appearance, including a planar or contoured appearance, disposed above the surface of the pedestal with the cutting tips, cutting edges or cutting ridges of the abrasive particles aligned with the general plane. Examples of such appearances include , but not limited to the appearance of the wave, the appearance of the convex surface, the appearance of the concave surface, and the appearance of a plurality of steps.

"Top" refers to the portion of the abrasive particles that extends a maximum distance relative to the base of the cutting tool. Thus, when in order to contact the workpiece, the top of the abrasive particles may first contact the surface of the workpiece than other portions of the cutting tool. The penetration depth of the top piercing workpiece is proportional to the spacing between the abrasive grains, and the ratio is related to the grinding parameters (such as the shallower penetration of the relative linear velocity) and the material of the workpiece (such as the piercing of the plastic workpiece is deeper than the metal work) )related. Increasing the sharpness of the top reduces the penetration resistance and penetration depth. Therefore, the shape of the plurality of abrasive grains, the sharpness and spacing of the top portions of the abrasive grains determine the depth distribution of the abrasive grains into the workpiece. The top may be in the shape of a pointed point, a ridge line, a curved surface, or a polygon.

When a rigid abrasive grain (Grit) is machined on the surface of the workpiece, the volume of material removed is related to the hardness of the material, the positive force applied to the material, and the coefficient of friction of the material.

The abrasive material processing depends on the material properties of the workpiece being processed:

1. Ductile materials mold: As shown in Fig. 8, when the abrasive particles 61 penetrate the workpiece 62 of the ductile material, the workpiece 62 will have a plastic deformation, and the surface 620 of the workpiece 62 to be processed will be The raised protrusions 621, when processed by the plurality of abrasive particles 61, produce a plurality of grooves (Groove) on the surface 620 of the workpiece 62, such as materials such as plastic. Therefore, when processing the workpiece 62 of the ductile material, it is necessary to appropriately control the distance between the abrasive grains 61 to produce a plastic deformation region of the Chip pocket material.

2. Brittle materials mold: As shown in FIG. 9, when the hardness of the workpiece 63 is hard, the workpiece 63 will produce lateral micro-cracks 631 at both ends of the abrasive particles 61, and even the workpiece 63 will be formed. Micro cracking is removed. For example, processing hard and brittle materials such as silicon wafers or glass.

As shown in FIGS. 9, 10 and 11, the Wedge angle (θ) of the top 611 of the abrasive grain 61, the pitch (d) of the abrasive particles 61, and the bevel angle (α) of the processing are appropriately designed as shown in FIG. As shown in Fig. 11, the depth (D _p ) of the abrasive particles 61 pierced into the workpiece 64 and the lateral crack width (L) of the chips 641 can be controlled, as shown in Fig. 9, to cause the surface 642 of the workpiece 64 to produce continuous micro-blocks. The shaped chips 641 can control the surface roughness of the workpiece 64 in addition to the effective removal of the material.

When the shapes of the abrasive grains 61 do not match each other, they interact with the workpiece 64 (the workpiece), and there are different processing marks due to interference. Therefore, some of the abrasive particles 61 will cut the material of the workpiece 64, and some of the abrasive particles 61 will plow the material of the workpiece 64, and some of the abrasive particles 61 will only slide over the surface 642 of the workpiece 64. These complicated grinding operations cause the wear scar on the surface 642 of the workpiece 64 to be fine (depending on the size of the abrasive grains) and irregular, and the more the abrasive grains 61 are slipped, the worse the cutting ability is.

Between the abrasive particles 61 and the workpiece 64, the following three interaction modes are included:

1. Cutting: The workpiece 64 has the generation of chips 641 during the cutting process, as shown in Figs.

2. Plowing: During the plowing process, the workpiece 62 is plastically deformed without the generation of chips, but a ridge-shaped projection 621 is produced on both sides of the abrasive grain 61, as shown in FIG. .

3. Rubbing: The abrasive particles 61 rub along the surface 642 of the workpiece 64, and the surface 642 of the workpiece 64 produces an Elastic deformation 644, as shown in FIG.

In the actual processing state, all three modes will occur, but which mode has a higher probability of occurrence, depending on the penetration depth of the abrasive grain and the top shape design, such as the wedge angle at the top of the abrasive grain, the abrasive grain It is sharper and the depth (Dp) penetrated into the workpiece is relatively easy, but its strength is relatively weak. Conversely, when the angle of the wedge angle is larger, it is less likely to penetrate the material, but has higher wear resistance. As shown in Fig. 11, when the abrasive grains 61 are processed at a positive angle (Rank angle, +α), the chips 641 are more likely to slide along the surface of the abrasive particles 61, deforming along the shearing surface, and moving the chips 641. In addition, it is advantageous for processing efficiency; as shown in Fig. 12, when the abrasive grains 61 are processed at a negative oblique angle (-α), the workpiece 64 is easily pressed by the abrasive grains, and the workpiece 64 is plastically deformed by the plowing action, especially It is more likely to occur when it is a soft material.

As shown in FIGS. 10, 11, 14, and 15, when the relationship between the penetration depth (Dp) and the contact angle (β) is considered, when the wedge angle (θ) of the abrasive grain 61 is smaller, the abrasive grain 61 is used. The larger the contact angle (β) with the processed material, as shown in Fig. 11, is easier to remove the material to be processed; the contact angle (β) is in addition to the wedge angle of the abrasive grain 61, and the bevel angle of the processing (Rake angle, α) also has a great relationship. When the angle of the negative bevel is larger, the contact angle (β) is smaller. As shown in Fig. 15, the material is more easily squeezed, and the material removal rate is lower. . As shown in Fig. 14, the contact angle (β) of the abrasive grains 61 with the processed material is between the contact angles (β) as shown in Figs.

The morphology of the abrasive particles, the angle of the wedge angle, the nose angle (r) and the spacing of the abrasive particles all affect the depth of the abrasive material and the removal rate of the material. Therefore, the effective control of these causes can be processed. The pattern is optimized.

The crystal of a diamond has its directionality. For example, an octahedral diamond has a (111) crystal plane on each crystal plane, which is the surface with the most closely arranged carbon atoms, so the hardness is relatively large, that is, it is more wear-resistant; The faceted diamond has a (100) crystal plane on each crystal face and is a surface with a low carbon atom density, so the hardness is soft. Therefore, when the diamond is ground and polished, it is difficult to continue processing when it is ground to the (111) crystal plane of the diamond, and diamond abrasive grains 11, 12, 12 of various shapes as shown in Figs. 1, 2A, 2B, and 3 can be obtained. ', 13. The outer edges of the diamond abrasive grains 11, 12, 12', 13 have a plurality of (111) crystal faces 111, 121, 121', 131. The diamond abrasive grains 11, 12, 12', 13 respectively have a top portion 110, 120, 120', 130; the top portions 110, 120, 120', 130 are respectively sharp, ridged, curved, and platform-shaped; 120, 120', 130 are respectively connected to upper ends of a plurality of (111) crystal faces 111, 121, 121', 131.

The diamond can be formed into a specific shape having a top portion by various processing methods such as mechanical grinding processing and energy beam cutting, in addition to the shapes shown by the diamond abrasive grains 11, 12, 12', and 13 shown in Figs. 1, 2A, 2B, and 3 above. In addition, it can also form a conical shape, a triangular pyramid shape, a quadrangular pyramid shape or other polygonal conical shapes, or a shape of a dome shape, a quadrilateral body or a polygonal body. In addition to the shape change of the processing surface, other diamonds are native. The shape of the face can still be retained, and the top is connected with the upper end of the processed crystal face outside the diamond abrasive grain, for example, the wear-resistant (111) crystal face, and the (111) crystal is used for cutting and grinding the workpiece. Extend the grinding life of the tool.

SUMMARY OF THE INVENTION The present invention provides a cutting tool having a plurality of cutting tips that can be used to cut or otherwise act on a workpiece to remove material from the workpiece and provide a complete, uniform and/or flat surface to the workpiece. The cutting tool of the present invention can be effectively applied, such as a planing device for removing material from a workpiece, a processing device for processing different workpieces, and a grinding device for grinding various different workpieces.

As shown in FIGS. 4 and 5, the cutting tool 20 of the first embodiment of the present invention includes a base 21 including a working surface 211 facing the workpiece 30 as shown in FIG. Performing a cutting or planing operation; a plurality of individual abrasive grains 22, 23, 24, 25, etc. may be arranged on the working surface 211 of the base 21, and the abrasive grains 22, 23, 24, 25 are respectively formed and formed a top portion 221, 231, 241, 251; the angle of the wedge angle of the top portions 221, 231, 241, 251 is 30 to 150 degrees; the contact angle of the abrasive grains 22, 23, 24, 25 with the workpiece 30 is 30 to 150 degrees, respectively. . The top portions 221, 231, 241, 251 are the most prominent portions of the abrasive grains 22, 23, 24, 25, respectively, and may also have sharp-shaped portions, and the sharp points of the sharp-shaped portions have a radius of less than 100 micrometers (Micron). The diameter of the abrasive particles 22, 23, 24, 25 is greater than 0.5 mm. The base 21 is in the shape of a disk. The abrasive grains 22, 23, 24, 25 are arranged on a surface of the work surface 211 in a specific pattern, for example, a specific pattern 200 arranged in a plurality of lines as shown in FIG. The surface of the working surface 211 incorporates more than one hundred abrasive grains 22, 23, 24, 25. The abrasive particles 22, 23, 24, 25 can be industrial diamond abrasive particles. The cutting tool 20 of the present embodiment may also include diamond abrasive grains 11, 12, 12', 13 of various shapes as shown in Figs. 1, 2A, 2B, and 3.

As shown in Figures 4 and 5, the height difference between the top portions 221, 231, 241, 251 and the general plane 40 is within 10 micrometers (Micron). The pitch between the top portions 221, 231, 241, and 251 is 3 to 10 times the diameter of the abrasive grains 22, 23, 24, and 25. As shown in Figures 4, 5, and 6, the heights of the protrusions 211 of each of the top portions 221, 231, 241, and 251 are less than 20% of each other, so that most of the top portions 221, 231, 241, and 251 can At the same time, the workpiece 30 is pierced, and more grooves are formed on the surface of the workpiece 30 to improve cutting efficiency and quality.

As shown in Fig. 6, the cutting tip 221 of the abrasive grain 22 can abut against the workpiece 30, and the abrasive grain 22 can move relative to the workpiece 30, as indicated by the arrow in Fig. 6, to cut, cut, plan or otherwise The workpiece 30 removes the small pieces or chips 31 such that the surface of the workpiece 30 is very flat and has a particular groove shape.

The abrasive grains 22, 23, 24, 25 are respectively a conical shape, a quadrangular pyramid shape, a pentagonal cone shape, a triangular pyramid shape or a specific shape of other polygonal cones, or a shape of a dome shape, a quadrangular body, or a polygonal body. . The abrasive grains 22, 23, 24, 25 may be diamond abrasive grains, respectively, and the top portions 221, 231, 241, and 251 are respectively connected to the crystal face end which is processed outside the diamond abrasive grain, for example, a (111) crystal face, and the crystal is used. The surface is contacted with the workpiece to be ground, and the workpiece is cut and ground, which is more wear-resistant.

As shown in FIG. 7, a cutting tool 50 according to a second embodiment of the present invention includes a base 51 including a working surface 511 facing the workpiece 30 as shown in FIG. 6 to perform cutting or Planing work; a plurality of individual abrasive grains 22, 23, 24, 25, etc. may be arranged on the working surface 511 of the base 51; the contact angles of the abrasive grains 22, 23, 24, 25 with the workpiece are respectively 30 to 150 degree. The base 51 is in the shape of a wheel. The cutting tool 50 of the present embodiment may also include diamond abrasive grains 11, 12, 12', 13 of various shapes as shown in Figs. 1, 2A, 2B, and 3.

The abrasive grains of the present invention may be abrasive grains of superhard materials such as cubic boron nitride (cBN) abrasive grains and diamond abrasive grains.

The present invention can use a plating material, a sintered material, a resin material, a solder material or the like as a bonding agent to fix the bonded abrasive particles and the susceptor, for example, using a metal material as a bonding agent for brazing or sintering (Sintering). The bonding particles are fixed on the pedestal by a combination operation.

The susceptor of the present invention may be a susceptor of any material such as metal, metal alloy, plastic, ceramic, composite material or the like.

The cutting tool of the present invention can be used in a variety of applications, one of which is particularly useful for planing workpieces that are substantially fragile, such as tantalum wafers, glass sheets, metals, flattened recycled used Wafer, LCD glass, LED substrate, tantalum carbide wafer, quartz wafer, tantalum nitride, zirconia, etc. In conventional silicon wafer processing technology, the wafer to be polished can generally be carried by the carrier and positioned on a polishing pad disposed on the rotating platform, when the abrasive is applied to the polishing pad and the pressure is applied to the carrier. In the upper case, the wafer can be polished by the relative movement of the platform and the carrier. Therefore, the germanium wafer is actually smoothed or polished by the action of fine abrasive to obtain a relatively smooth s surface.

The cutting tool of the present invention can also be used in a Chemical Mechanical Polishing (CMP) as a pad dresser, that is, the workpiece 30 can be a CMP pad as shown in FIG. The cutting tool of the present invention can form a roughened region 32 of a particular size and shape in the CMP pad. The roughness (Ra) of the rough regions 32 is less than 50 microns, and the tops of the fibers formed by the rough regions 32 do not protrude beyond the average height of the CMP pad surface by more than 20 microns.

The cutting tool having a plurality of cutting tops of the present invention is such that a plurality of individual abrasive grains are arranged on a working surface of a base, the abrasive grains are separately formed to have a top, and the angle of the wedge angle of the tops For 30~150 degrees, the contact angle of the abrasive grains with the workpiece is 30~150 degrees, and the direction of the top can be perpendicular to the processed surface of the crystal lattice of the abrasive grain to improve the wear resistance of the cutting tool and improve the cutting. Efficiency and prolonging the service life; further making the tops of the abrasive grains protrude from the working surface to a difference of less than 20% from each other to improve the cutting quality.

The above description is only for the embodiments of the present invention, and any modifications and variations made by those skilled in the art using the present invention are the scope of the invention claimed, and are not limited to the embodiments disclosed.

11, 12, 12', 13. . . Diamond abrasive

110, 120, 120', 130. . . top

111, 121, 121', 131 (111). . . Planes

20, 50. . . Cutting tool

200. . . Specific pattern

21, 51. . . Pedestal

211, 511. . . Working face

22, 23, 24, 25, 61. . . Abrasive grain

221, 231, 241, 251, 611. . . top

30, 62, 63, 64. . . Workpiece

31, 641. . . Chip

32. . . Rough area

40. . . General plane

620, 642. . . surface

621. . . obstructive

631. . . Microcrack

644. . . Elastic deformation department

Figure 1 is a schematic illustration of a diamond abrasive grain having a sharp top.

Figure 2A is a schematic illustration of a diamond granule with a ridgeline at the top.

Figure 2B is a schematic illustration of a diamond abrasive grain having a curved top portion.

Figure 3 is a schematic illustration of a diamond abrasive grain having a top as a platform.

Figure 4 is a schematic view of a cutting tool in accordance with a first embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view taken along line AA of FIG. 4. FIG.

Figure 6 is a schematic view of a cutting tool for cutting a workpiece according to the present invention.

Figure 7 is a schematic view of a cutting tool in accordance with a second embodiment of the present invention.

Fig. 8 is a schematic view showing plastic deformation of abrasive grains pierced into a workpiece.

Figure 9 is a schematic illustration of the lateral microcracking of the abrasive particles piercing the workpiece.

Figure 10 is a schematic illustration of a plurality of abrasive particles cutting a workpiece.

Figure 11 is a schematic view of the abrasive grains processed at a positive oblique angle.

Figure 12 is a schematic view of the abrasive grains processed at a negative oblique angle.

Fig. 13 is a schematic view showing that the abrasive grains are rubbed along the surface of the workpiece to produce an elastic deformation portion.

Figure 14 is a schematic illustration of abrasive grains processed at a small contact angle.

Figure 15 is a schematic illustration of abrasive grains processed at a smaller contact angle.

20. . . Cutting tool

200. . . Specific pattern

twenty one. . . Pedestal

211. . . Working face

22, 23, 24, 25. . . Abrasive grain

221, 231, 241, 251. . . top

Claims (26)

A cutting tool having a plurality of cutting tops, comprising: a base having a working surface facing and facing a workpiece; a plurality of individual abrasive grains are arranged in combination on the base according to different processing characteristics The working surface is characterized in that the abrasive grains are respectively formed into a specific shape having a top portion, and the top portions respectively protrude the working surface, and the top portions respectively protrude from the working surface with a height difference of less than one hundred Within 20 minutes; the difference between the top and the general plane is within 10 microns; wherein there is a gap between the abrasive grains to adjust the depth of the abrasive particles into the workpiece to be scored on the workpiece A particular distribution of grooves, and the grooves of the particular distribution determine the roughness of the surface of the workpiece. A cutting tool having a plurality of cutting tips as described in claim 1, wherein the abrasive particles are one of cubic boron nitride abrasive grains or diamond abrasive grains. A cutting tool having a plurality of cutting tips as described in claim 2, wherein the abrasive grains are in the shape of a conical shape, a polygonal cone shape, a dome shape, a quadrilateral body or a polygonal body. A cutting tool having a plurality of cutting tips as described in claim 3, wherein the abrasive grains have a diameter greater than 0.5 mm. A cutting tool having a plurality of cutting tips as described in claim 4, wherein the spacing between the tops is 3 to 10 times the diameter of the abrasive grains. A cutting tool having a plurality of cutting tips as described in claim 5, wherein the abrasive grains are formed by machining one of mechanical grinding or energy beam cutting, respectively. A cutting tool having a plurality of cutting tops as described in claim 6 of the patent application, Wherein the abrasive particles are arranged in a specific pattern on the surface of the work surface. A cutting tool having a plurality of cutting tips as described in claim 7 wherein the surface of the working surface incorporates more than one hundred of the abrasive particles. The cutting tool having a plurality of cutting tops according to claim 8, wherein the shape of the abrasive grains is one of a conical shape or a polygonal cone; the top portions respectively have sharp portions of the abrasive grains The sharp point and its radius is less than 100 microns. A cutting tool having a plurality of cutting tips as described in claim 9 wherein the susceptor is one of a base of metal, metal alloy, plastic, ceramic or composite material. The cutting tool having a plurality of cutting tops according to claim 10, wherein the abrasive grains and the susceptor are fixedly bonded by electroplating, sintering, welding, or fixedly bonded with a resin material as a bonding agent. The cutting tool having a plurality of cutting tops according to claim 11, wherein a work of one of a brazing operation or a sintering operation is performed between the abrasive grains and the base with a metal material as a bonding agent. The abrasive particles are fixed to the base. A cutting tool having a plurality of cutting tips according to any one of claims 1 to 12, wherein the base is disc-shaped. A cutting tool having a plurality of cutting tips as described in claim 13 wherein the cutting tool is a polishing pad dresser; the workpiece is a polishing pad. A cutting tool having a plurality of cutting tips as described in claim 14 wherein the polishing pad is a CMP polishing pad. A cutting tool having a plurality of cutting tips as described in claim 15 wherein the cutting tool forms a specific size and shape in the CMP polishing pad. Rough area; the roughness of the rough area is less than 50 microns. A cutting tool having a plurality of cutting tips as described in claim 16 wherein the roughened regions form a fiber top that does not protrude beyond the average height of the CMP pad surface by more than 20 microns. The cutting tool having a plurality of cutting tips according to claim 17, wherein the abrasive grains are diamond abrasive grains; and the tops of the diamond abrasive grains are respectively opposite to the upper ends of the crystal faces of the diamond abrasive grains. connection. A cutting tool having a plurality of cutting tips as described in claim 18, wherein the crystal faces outside the diamond abrasive grains are (111) crystal faces. A cutting tool having a plurality of cutting tips as described in claim 19, wherein the abrasive grains are industrial diamond abrasive grains. The cutting tool having a plurality of cutting tops according to claim 20, wherein the tops of the abrasive grains are respectively one of a sharp shape, a ridge line shape, a curved surface shape and a platform shape. A cutting tool having a plurality of cutting tips according to any one of claims 1 to 12, wherein the base is a wheel. The cutting tool having a plurality of cutting tops according to claim 22, wherein the abrasive grains are diamond abrasive grains; and the tops of the diamond abrasive grains are respectively opposite to the upper ends of the crystal faces of the diamond abrasive grains. connection. A cutting tool having a plurality of cutting tips as described in claim 23, wherein the crystal faces outside the diamond abrasive grains are (111) crystal faces. A cutting tool having a plurality of cutting tips as described in claim 24, wherein the abrasive particles are industrial diamond abrasive particles. The cutting tool having a plurality of cutting tops according to claim 25, wherein the tops of the abrasive grains are sharp, curved, ribbed and flat, respectively. One of the tables.