TWI416266B - An exposure apparatus, an exposure method, an element manufacturing method, and a maintenance method - Google Patents

Description

Exposure apparatus, exposure method, component manufacturing method, and maintenance method

The present invention relates to an exposure apparatus, an exposure method, and a component manufacturing method for exposing a substrate.

In the photolithography step which is one of the steps of a micro component such as a semiconductor element or a liquid crystal display element, a pattern formed on a photomask is projected onto a photosensitive substrate by using an exposure device. The exposure apparatus has a mask holder for supporting the mask and a substrate stage for supporting the substrate, and the mask image and the substrate stage are sequentially moved while the pattern image of the mask is projected through the projection optical system to Substrate. In the manufacture of microdevices, it is necessary to make the pattern formed on the substrate finer based on the higher density of the elements. In order to respond to this requirement, it is desirable to have a higher resolution of the exposure apparatus. As one of the methods for achieving high resolution, a liquid immersion exposure apparatus as disclosed in Patent Document 1 below has been proposed in which an exposure light path space between a projection optical system and a substrate is filled with a liquid, and is exposed through a liquid. .

[Patent Document 1] International Publication No. 99/49504

In the liquid immersion exposure apparatus, since the exposure processing and the measurement processing are performed by the liquid, the liquid may be contaminated or deteriorated, which may affect the results of the exposure processing and the measurement processing. Therefore, it is important to grasp the state of the liquid and perform appropriate treatment.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an exposure apparatus, an exposure method, and a device manufacturing method capable of accurately grasping a state (properties, composition, and the like) of a liquid.

In order to solve the above problems, the present invention adopts the following configuration corresponding to Figs. 1 to 13 representing the embodiment. Here, the symbols attached to the parentheses of the respective elements are merely illustrative of the relevant elements, and the present invention is not limited to the respective elements.

According to a first aspect of the present invention, there is provided an exposure apparatus for exposing a substrate to an exposure light through an optical member to expose the substrate; wherein the object includes an object and a light exiting side of the optical member The substrate is configured to be different; a liquid immersion mechanism for filling the optical path space between the optical member and the object with a liquid; and a measuring device for forming a liquid immersion area on the object different from the substrate In the state, at least one of the properties and composition of the liquid is measured.

According to the first aspect of the present invention, since the liquid state can be grasped without being in contact with the substrate for exposure, the liquid can be set to a desired state, and the exposure process can be performed with high precision through the liquid. Measurement processing.

According to a second aspect of the present invention, there is provided an exposure apparatus for exposing a substrate to an exposure light through an optical member to expose the substrate; and comprising: a liquid immersion mechanism for placing the optical member a predetermined space on the light exit side is filled with a liquid; and a measuring device that measures at least one of a property and a composition of the liquid; the liquid immersion mechanism has a flow path through the liquid; the measuring device is the first of the flow paths The liquid at the 1 position and the liquid at the 2nd position were measured separately.

According to the second aspect of the present invention, since the liquid in the first position and the liquid in the second position in the flow path of the liquid immersion mechanism can be grasped, the liquid can be set in a desired state. High-precision exposure processing and measurement processing through liquid.

According to a third aspect of the present invention, there is provided an exposure method for exposing a substrate through a liquid; characterized by comprising the steps of: forming a liquid immersion area on an object different from the substrate; In the second step, the liquid state is inspected in a state where the liquid immersion area is formed on the object different from the substrate; the third step is to adjust the exposure condition according to the inspection result; and the fourth step is to adjust the overexposure condition The substrate is irradiated with exposure light through a liquid in a liquid immersion area formed on the substrate to expose the substrate.

According to the exposure method of the third aspect of the present invention, the liquid immersion area is formed by using an object different from the substrate in advance, and the state of the liquid used in the immersion exposure is grasped to set the optimum exposure condition including the liquid state. Exposure processing and measurement processing can be performed with high precision.

According to a fourth aspect of the present invention, there is provided an exposure method for exposing a substrate to a substrate by exposing exposure light to a substrate, wherein the liquid is permeated through the flow path to flow through a predetermined liquid immersion area. And detecting a liquid state at the first position and the second position of the flow path; and forming a liquid immersion area on the substrate according to the detection result and exposing the substrate.

According to the fourth aspect of the present invention, since it is possible to grasp the individual state of the liquid in the first position in the flow path of the liquid immersion area and the liquid in the second position, the liquid is set to a desired state. Exposure processing and measurement processing can be performed with high precision through liquid.

According to a fifth aspect of the present invention, there is provided a method of manufacturing an element using the exposure apparatus of the above aspect. According to the fifth aspect of the present invention, an element can be manufactured by using an exposure apparatus that can perform exposure processing and measurement processing with high precision through a liquid.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a device comprising the steps of: exposing a substrate by the exposure method of the above aspect; developing the substrate after exposure; and processing the substrate after development . According to the sixth aspect of the present invention, an element can be manufactured by using an exposure apparatus that can perform exposure processing and measurement processing with high precision through a liquid.

According to the present invention, exposure processing and measurement processing can be performed with high precision through a liquid.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

<First embodiment>

Fig. 1 is a schematic configuration diagram of an exposure apparatus according to a first embodiment. In FIG. 1, the exposure apparatus EX has a mask stage MST (which can hold the mask M to move), a substrate stage ST1 (having a substrate holder PH holding the substrate P, and the substrate P can be held in the substrate holder) Moving on the PH), the measurement stage ST2 (the optical measuring device that optically performs the measurement on the exposure processing, can be moved independently from the substrate stage ST1), and the illumination optical system IL (which will be in the mask stage MST) The reticle M that is held by the exposure light EL is illuminated, and the projection optical system PL (projects the pattern P of the reticle M illuminated by the exposure light EL to project the substrate P held on the substrate stage ST1) Exposure) and control device CONT (coordinated control of the overall operation of the exposure device EX). A notification device INF for notifying the information on the exposure processing is connected to the control unit CONT. The notification device INF is an alarm device including a display device (display device), an alarm (warning) by sound or light, and the like. Furthermore, the control device CONT is connected to a memory device MRY for storing information about the exposure process.

The exposure apparatus EX of the present embodiment is a liquid immersion exposure apparatus which employs a liquid immersion method (increasing the exposure wavelength to increase the resolution and substantially increases the depth of focus), and includes a liquid immersion mechanism 1 for projecting the optical system PL. The optical path space K1 of the exposure light EL on the image side is filled with the liquid LQ. The liquid immersion mechanism 1 is provided in the vicinity of the image plane of the projection optical system PL, and includes a nozzle member 70 (a supply port 12 for supplying the liquid LQ and a recovery port 22 for recovering the liquid LQ), and a liquid supply mechanism 10 (through the nozzle member 70). The supply port 12 is provided to supply the liquid LQ to the image side of the projection optical system PL, and the liquid recovery mechanism 20 (the liquid on the image side of the projection optical system PL is transmitted through the recovery port 22 provided in the nozzle member 70). LQ is recycled). The nozzle member 70 is formed in a ring shape so as to surround the first optical element LS1 closest to the image plane of the projection optical system PL among the plurality of optical elements constituting the projection optical system PL.

The exposure apparatus EX adopts a partial liquid immersion method, that is, at least one portion of the liquid LQ supplied from the liquid supply mechanism 10 on the substrate P during at least the projection of the pattern image of the reticle M onto the substrate P ( The projection area AR including the projection optical system PL locally forms a liquid immersion area LR which is larger than the projection area AR and smaller than the substrate P. Specifically, the exposure apparatus EX is a liquid in the optical path space K1 between the lower surface LSA of the first optical element LS1 closest to the image plane of the projection optical system PL and the upper surface of the substrate P disposed on the image plane side of the projection optical system PL. The LQ is full, and the exposure light EL that has passed through the mask M is irradiated onto the substrate through the liquid LQ between the projection optical system PL (first optical element LS1) and the substrate P and the projection optical system PL (first optical element LS1). P projects the pattern image of the mask M onto the substrate P. The control device CONT uses the liquid supply mechanism 10 to supply the liquid LQ to the substrate P in a predetermined amount, and uses the liquid recovery mechanism 20 to quantitatively recover the liquid LQ on the substrate P, thereby partially forming the liquid LQ on the substrate P. Liquid immersion area LR.

Further, the exposure apparatus EX includes a measuring device 60 for measuring at least one of the properties and components (liquid state) of the liquid LQ forming the liquid immersion area LR. The measuring device 60 measures at least one of the properties and components of the liquid LQ filled between the projection optical system PL and an object disposed on the image plane side of the projection optical system PL. In the present embodiment, the measuring device 60 measures the liquid LQ recovered by the liquid recovery mechanism 20.

Further, the liquid supply mechanism 10 in the liquid immersion mechanism 1 includes a functional liquid supply device 120 which can supply a functional liquid having a predetermined function different from the liquid LQ for forming the liquid immersion area LR.

In the present embodiment, the exemplified by the exposure apparatus EX uses a scanning type exposure apparatus (so-called scanning stepper) to synchronize the mask M and the substrate P in the scanning direction in the mutually opposite direction (reverse direction). The pattern formed by the mask M is exposed on the substrate P while moving. In the following description, the synchronous movement direction (scanning direction) of the mask M and the substrate P in the horizontal plane is defined as the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction (non-scanning direction). The direction perpendicular to the X-axis direction and the Y-axis direction and the optical axis AX of the projection optical system PL are defined as the Z-axis direction. Further, the directions of rotation (inclination) around the X-axis, the Y-axis, and the Z-axis are defined as θX, θY, and θZ directions, respectively. In addition, the "substrate" as used herein includes a photosensitive material (photoresist) coated on a substrate such as a semiconductor wafer, and the "mask" includes a grating in which an element pattern reduced in projection on the substrate is formed.

The illumination optical system IL includes an exposure light source, an optical integrator that uniformizes the illuminance of the light beam emitted from the exposure light source, a condensing lens that condenses the exposure light EL from the optical integrator, a retardation lens system, and The field of view pupil or the like for setting the illumination area of the mask M to the exposure light EL. The predetermined illumination area on the mask M is illuminated by the exposure light EL distributed by the illumination optical system IL with uniform illumination. For the exposure light EL emitted from the illumination optical system IL, for example, a bright line (g line, h line, i line) emitted from a mercury lamp and a far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm) can be used. ), ArF excimer laser light (wavelength 193 nm), and vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm). In the present embodiment, ArF excimer laser light is used.

In the present embodiment, the liquid LQ forming the liquid immersion area LR is pure water. Pure water not only allows ArF excimer laser light to penetrate, but also allows for bright ultraviolet light (g line, h line, i line) emitted by mercury lamps, and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm). )penetrate.

The mask stage MST can keep the mask M moving. The mask stage MST holds the mask M by vacuum adsorption (or electrostatic adsorption). The mask stage MST can be driven by the mask stage driving device MSTD (including a linear motor controlled by the control unit CONT) while maintaining the mask M, and the optical axis of the projection optical system PL. The AX vertical plane (that is, in the XY plane) performs 2-dimensional spatial movement and micro-rotation in the θZ direction. A moving mirror 91 that moves together with the mask stage MST is disposed on the mask stage MST. Further, a laser interferometer 92 is provided at an opposite position of the moving mirror 91. The position of the mask M in the two-dimensional spatial direction on the mask stage MST and the rotation angle in the θZ direction (sometimes including the rotation angles in the θX and θY directions) are measured instantaneously by the laser interferometer 92. The measurement results of the laser interferometer 92 are output to the control unit CONT. The control unit CONT drives the mask stage driving unit MSTD based on the measurement result of the laser interferometer 92 to positionally control the mask M held by the mask stage MST.

The projection optical system PL projects the pattern image of the mask M onto the substrate P at a predetermined projection magnification β. The projection optical system PL includes a plurality of optical elements that are held by the lens barrel PK. In the present embodiment, the projection magnification β of the projection optical system PL is, for example, a reduction system of 1/4, 1/5, or 1/8. Further, the projection optical system PL may be either an equal magnification system or an amplification system. Further, the projection optical system PL may be any one of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Among the plurality of optical elements constituting the projection optical system PL, the first optical element LS1 closest to the image plane of the projection optical system PL is exposed from the lens barrel PK.

The substrate stage ST1 has a substrate holder PH that holds the substrate P. The substrate stage ST1 is disposed on the image plane side of the projection optical system PL, and is movable on the base member BP on the image plane side of the projection optical system PL. The substrate holder PH is used to hold the substrate P by, for example, vacuum adsorption. A concave portion 96 is provided on the substrate stage ST1, and a substrate holder PH for holding the substrate P is disposed in the concave portion 96. Further, the upper surface of the substrate stage ST1 other than the concave portion 96 is a flat surface (flat portion) having a height equal to the same height (same surface) as the upper surface of the substrate P held by the substrate holder PH.

The substrate stage ST1 can be driven by the substrate stage driving device SD1 including a linear motor driven by the control unit CONT, and the substrate P can be held on the base member BP in a state where the substrate P is held by the substrate holder PH. The plane moves in a two-dimensional space and rotates slightly in the θZ direction. Further, the substrate stage ST1 can also move in the Z-axis direction, the θX direction, and the θY direction. Therefore, the upper surface of the substrate P held by the substrate stage ST1 can be moved in the six-degree-of-freedom directions of the X-axis, the Y-axis, the Z-axis, the θX, the θY, and the θZ directions. A moving mirror 93 that moves together with the substrate stage ST1 is fixed to the side surface of the substrate stage ST1. Further, a laser interferometer 94 is provided at a position opposite to the moving mirror 93. The two-dimensional spatial direction position and the rotation angle of the substrate P on the substrate stage ST1 are measured instantaneously by the laser interferometer 94. In addition, the exposure apparatus EX is provided with a focus leveling detection of an oblique incidence method for detecting surface position information on the substrate P supported by the substrate stage ST1 as disclosed in Japanese Laid-Open Patent Publication No. Hei 8-37149. System (not shown). The focus leveling detection system detects surface position information (position information in the Z-axis direction and tilt information in the θX and θY directions of the substrate P) on the substrate P. In addition, the focus leveling detection system can detect the position information of the surface of the substrate P through the liquid LQ of the liquid immersion area LR, and can also detect the position information of the surface of the substrate P without the liquid LQ outside the liquid immersion area LR. The method of detecting the position information of the surface of the substrate P through the liquid LQ of the liquid immersion area LR is used in combination with the method of detecting the position information of the surface of the substrate P without the liquid LQ. In addition, the focus leveling detection system can also adopt a method using an electrostatic capacitance type sensor. The measurement results of the laser interferometer 94 are also output to the control unit CONT. The measurement results of the focus leveling detection system are also output to the control unit CONT. The control device CONT drives the substrate stage driving device SD1 according to the detection result of the focus leveling detection system, and controls the focus position (Z position) and the tilt angle (θX, θY) of the substrate P so that the substrate P can be coupled with the projection optics. The image planes of the system PL are matched, and based on the measurement results of the laser interferometer 94, the positional control of the substrate P in the X-axis direction, the Y-axis direction, and the θZ direction is performed.

The measurement stage ST2 is equipped with various optical measuring instruments (including measuring members) that optically perform measurement related to exposure processing. The measurement stage ST2 is disposed on the image plane side of the projection optical system PL, and is movable on the base member P on the image plane side of the projection optical system PL. The measurement stage ST2 can be driven by the measurement stage drive unit SD2 including a linear motor driven by the control unit CONT, and is mounted on the base member BP in the XY plane while the optical measuring unit is mounted. The dimensional space moves and rotates slightly in the θZ direction. Further, the measurement stage ST2 can also move in the Z-axis direction, the θX direction, and the θY direction. Therefore, the measurement stage ST2 can move in the six-degree-of-freedom directions of the X-axis, the Y-axis, the Z-axis, the θX, the θY, and the θZ directions in the same manner as the substrate stage ST1. A moving mirror 98 that moves together with the measurement stage ST2 is fixedly disposed on the side of the measurement stage ST2. Further, a laser interferometer 99 is provided at a position opposite to the moving mirror 98. The two-dimensional spatial direction position and the rotation angle of the substrate P on the measurement stage ST2 are measured instantaneously by the laser interferometer 99, and the control unit CONT controls the measurement stage ST2 based on the measurement result of the laser interferometer 99.

The control device CONT uses the stage driving devices SD1, SD2, respectively, so that the substrate stage ST1 and the measurement stage ST2 can move independently of each other on the base member BP. The control device CONT can move the substrate stage ST1 under the projection optical system PL such that the upper surface 95 of the substrate stage ST1 or the substrate P held by the substrate stage ST1 and the projection optical system PL Below the LSA is opposite. Similarly, the control unit CONT can move the measurement stage ST2 under the projection optical system PL such that the upper surface 97 of the measurement stage ST2 opposes the lower LSA of the projection optical system PL.

Further, the substrate stage ST1 and the measurement stage ST2 are disposed in parallel with each other such that the upper surface 95 of the substrate stage ST1 (including the upper surface of the substrate P) and the upper surface 97 of the measurement stage ST2 are substantially at the same height position. Way to set.

2 is a plan view of the substrate stage ST1 and the measurement stage ST2 viewed from above. In FIG. 2, a reference member 300 is provided as an optical measuring device (measuring member) on the upper surface 97 of the measuring stage ST2. The reference member 300 is an alignment position for specifying the substrate P to the image of the mask M after passing through the projection optical system PL, and the projection position of the pattern image and the substrate alignment system (not shown) are in the XY plane. The positional relationship (baseline amount) within the user is measured. On the upper surface 301 of the reference member 300, the first reference mark MFM and the second reference mark PFM are formed in a predetermined positional relationship. The first reference mark MFM is detected by a reticle alignment system of a VRA (visual reticle alignment) method as disclosed in Japanese Laid-Open Patent Publication No. H7-176468. The VRA-type reticle alignment system irradiates light to the reticle and performs image processing on the image of the image captured by the CCD camera to measure the mark position. In addition, the second reference mark PFM is detected by a substrate alignment system of the FIA (field image alignment) method disclosed in Japanese Laid-Open Patent Publication No. Hei 6-65603. The substrate alignment system of the FIA method is to irradiate the target mark with a wide-band detection light beam on which the photosensitive material on the substrate P is not exposed, and to image the image of the object imaged on the light-receiving surface by the reflected light from the target mark. The indicator (the index pattern on the indicator board provided in the substrate alignment system) is imaged by an imaging element (CCD or the like), and the image signals are image-processed to measure the mark position.

Further, on the upper surface of the measurement stage ST2, 97 is provided as an upper plate of the optical measuring instrument. The upper plate is used for measuring the unevenness of the contrast as disclosed in Japanese Laid-Open Patent Publication No. SHO 57-117238, or is used for the exposure light EL of the projection optical system PL as disclosed in Japanese Laid-Open Patent Publication No. 2001-267239. The rate fluctuation amount is measured to constitute a part of the upper plate of the unevenness sensor 400; a part of the upper surface of the space image measuring sensor 500 is disclosed as disclosed in Japanese Laid-Open Patent Publication No. 2002-14005; and, for example, Japanese Patent Laid-Open No. 11-16816 A portion of the illumination amount sensor (illuminance sensor) 600 is formed on the upper plate as disclosed in the publication. The upper surfaces 401, 501, and 601 of the upper plates of the sensors 400, 50, and 600 are disposed on the upper surface 97 of the measurement stage ST2.

In the present embodiment, the upper surface 97 of the measurement stage ST2 including the upper surfaces 301, 401, 501, and 601 of each of the optical measuring instruments 300, 400, 500, and 600 is substantially flat, and the upper surface 97 of each of the measurement stages ST2 and each The upper surfaces 301, 401, 501, and 601 of the optical measuring instruments 300, 400, 500, and 600 are substantially the same surface.

In the present embodiment, the first reference mark MFM formed on the reference member 300 is transmitted through the projection optical system PL and the liquid LQ by the mask alignment system, and the second reference mark PFM is not transmitted through the projection optical system PL and the liquid. The LQ is detected by the substrate alignment system. Further, in the present embodiment, since the substrate P is exposed by the liquid immersion exposure processing, that is, the exposure light EL is applied to the substrate P through the projection optical system PL and the liquid LQ, the measurement processing using the exposure light EL is not performed. The average sensor 400, the aerial image measuring sensor 500, the irradiation amount sensor 600, and the like correspond to the liquid immersion exposure processing, and receive the exposure light EL through the projection optical system PL and the liquid LQ.

As described above, the measurement stage ST2 is a dedicated stage for performing measurement processing on the exposure processing, and does not hold the substrate P. The substrate stage ST1 is not mounted with an optical measuring device that performs measurement on exposure processing. Further, the measurement stage ST2 is disclosed in more detail, for example, in Japanese Laid-Open Patent Publication No. Hei 11-135400, and the European Patent Publication No. 1,041,357.

Further, each of the sensors 400, 500, and 600 may be mounted on the measurement stage ST2 only by one of the optical systems, or may be mounted on the measurement stage ST2. In addition, the optical measuring device mounted on the measurement stage ST2 is not limited to the above-described respective sensors 400, 500, 600 or the reference member 300, and is an optical measuring device (measuring member) that performs measurement processing on exposure processing, Any one of them can be mounted on the measurement stage ST2. Further, one of the above-described respective sensors 400, 500, 600 or the reference member 300 may be provided on the substrate stage ST1.

Further, the measurement stage ST2 disposed on the image plane side of the projection optical system PL has a predetermined area 100 formed so as not to contaminate the liquid LQ. The predetermined area 100 is set in a partial area of the upper surface 97 of the measurement stage ST2. In the present embodiment, the predetermined region 100 is a region other than the optical measuring devices 300, 400, 500, and 600 provided in the upper surface 97 of the measuring stage ST2, and is set at a substantially central portion of the upper surface 97 of the measuring stage ST2. The size of the predetermined area 100 is set to be larger than that of the liquid immersion area LR. Further, the predetermined area 100 is substantially flush with the upper surfaces 301, 401, 501, and 601 of the respective photometric devices 300, 400, 500, and 600. In the present embodiment, the upper surface 97 of the measurement stage ST2 includes the upper surface of the predetermined area 100 and the upper surfaces 301, 401, 501, and 601 of the respective optical measuring instruments 300, 400, 500, and 600.

A predetermined process is performed on a partial region of the upper surface 97 of the measurement stage ST2, and the predetermined region 100 which does not contaminate the liquid LQ is formed by the predetermined process. Here, the term "no contamination liquid LQ" means a foreign matter-containing pollutant (metal, organic) which is dissolved (mixed) in the liquid LQ from the surface of the predetermined region 100 when the liquid LQ is disposed in the predetermined region 100. The ions, inorganic ions, and the like are suppressed to a state below the predetermined allowable amount. In other words, the material of the predetermined region 100 is formed, and the contaminant mixed into the liquid LQ does not substantially occur when it comes into contact with the liquid LQ. Therefore, even if the liquid LQ comes into contact with the predetermined area 100, the contamination of the liquid LQ can be prevented. Further, since the size of the predetermined area 100 is larger than that of the liquid immersion area LR, the liquid immersion area LR of the liquid LQ is formed on the upper surface 97 of the measurement stage ST2 including the predetermined area 100, and the liquid immersion area LR is formed. On the inner side of the predetermined area 100, contamination of the liquid LQ can be suppressed.

In the present embodiment, the substrate on which the upper surface 97 of the measurement stage ST2 is formed is made of ceramic, and in the treatment for preventing liquid LQ contamination, PFA (for tetrafluoroethylene) is applied to the substrate (ceramic) on which the upper surface 97 is formed. C ₂ F ₄ ) Copolymer with perfluoroalkoxyethylene) coating treatment (surface treatment). In the following description, the processing of the covered PFA is expediently referred to as "PFA processing".

In the present embodiment, since the PFA process is performed on a part of the upper surface 97 of the measurement stage ST2 to form the predetermined region 100, it is possible to suppress the contamination (mixing) of the foreign matter-containing pollutants (metal, the liquid LQ from the predetermined region 100). Organic ions, inorganic ions, etc.). Therefore, even if the predetermined area 100 is in contact with the liquid LQ, the contamination of the liquid LQ can be prevented, and the influence on the liquid LQ can be reduced.

Further, the PFA has liquid repellency (water repellency) with respect to the liquid (water), and the liquid immersion mechanism 1 can maintain the shape and size of the liquid immersion area LR in a desired state even if the liquid immersion area LR is formed in the predetermined area 100. . Further, when the operation of removing (recovering) the liquid LQ from the predetermined region 100 is performed, the liquid LQ can be prevented from remaining in the predetermined region 100.

Here, although the treatment for preventing liquid LQ contamination is performed in a partial region of the upper surface 97 of the measurement stage ST2, it is also possible to apply all the areas of the upper surface 97 of the measurement stage ST2 (including the light measuring devices 300, 400, 500, 600). Each of the upper surfaces 301, 401, 501, and 601) performs a process of preventing liquid LQ contamination. At this time, the processing of the area other than the optical measuring instruments 300, 400, 500, 600 in the upper surface 97 of the measuring stage ST2 and the processing of the upper surfaces 301, 401, 501, 601 of the optical measuring apparatuses 300, 400, 500, 600 are performed. It can also be different. For example, PFA processing may be performed on regions other than the optical measuring devices 300, 400, 500, 600 in the upper surface 97 of the measuring stage ST2, for the upper surfaces 301, 401, 501 of the optical measuring devices 300, 400, 500, 600, 601 is applied to cover materials other than PFA. The material to be coated on the upper surfaces 301, 401, 501, and 601 of the optical measuring instruments 300, 400, 500, and 600 is made of a material that does not contaminate the liquid LQ, has liquid repellency to the liquid LQ, and has light transmissivity. good. Such a material can be exemplified by "Saipu (registered trademark)" manufactured by Asahi Glass Co., Ltd. Thereby, even if the liquid immersion area LR is disposed in a region other than the predetermined area 100 in the upper surface 97 of the measurement stage ST2, contamination of the liquid LQ can be suppressed, and the shape, size, and the like of the liquid immersion area LR can be maintained in a desired state. Further, when the operation of removing the liquid LQ from the upper surface 97 of the measurement stage ST2 is performed, the liquid LQ can be prevented from remaining on the upper surface 97. Further, when the upper surface of the optical measuring device (for example, 301) is subjected to the contamination preventing treatment, at least a part of the upper surface may be used as the predetermined region 100.

Further, the material used for the surface treatment of the predetermined region 100 (the upper surface 97) is not limited to the PFA, and any substrate that can form the upper surface 97 of the measurement stage ST2 and the liquid used can be blended as long as it can avoid contamination of the liquid LQ. The physical properties (types) of LQ are suitable for selection. Here, a portion of the upper surface 97 of the measurement stage ST2 is subjected to a surface treatment to form a predetermined region 100. Alternatively, for example, an opening (recess) may be formed in a portion of the upper surface 97 of the measurement stage ST2, and a PFA may be disposed inside the concave portion. The plate-like member is formed such that the upper surface of the plate-like member is a predetermined region 100. Even in the case where the plate-like member is disposed in the recessed portion of the upper surface 97 of the measuring stage ST2, the upper surface of the plate-shaped member is preferably a flat surface, so that the upper surface of the plate-shaped member and the upper surfaces 301, 401 including the respective optical measuring instruments are It is desirable that the upper surface 97 of the measurement stage ST2 of 501 and 601 is substantially the same surface.

Fig. 3 is a view showing a state in which the liquid immersion area LR of the liquid LQ moves between the substrate stage ST1 and the measurement stage ST2. As shown in FIG. 3, the liquid immersion area LR formed on the image surface side of the projection optical system PL (below the first optical element LS1) is movable between the substrate stage ST1 and the measurement stage ST2. When the liquid immersion area LR is moved, the control unit CONT uses the stage driving devices SD1 and SD2 to be in an area close to or in contact with the measurement stage ST2 in the state where the substrate stage ST1 is close to or in contact with the measurement stage ST2. The substrate stage ST1 is moved together with the measurement stage ST2 in the XY plane. The control unit CONT can hold the liquid LQ between at least one of the upper surface 95 of the projection optical system PL and the substrate stage ST1 and the upper surface 97 of the measurement stage ST2 by moving the substrate stage ST1 together with the measurement stage ST2. In this state, the liquid immersion area LR is moved between the upper surface 95 of the substrate stage ST1 and the upper surface 97 of the measurement stage ST2. By this, it is possible to prevent the liquid LQ from flowing out of the gap (void) between the substrate stage ST1 and the measurement stage ST2, and to make the liquid immersion area in a state where the image-side optical path space K1 of the projection optical system PL is filled with the liquid LQ. The LR moves between the substrate stage ST1 and the measurement stage ST2.

Thereby, the liquid immersion area LR of the liquid LQ can be moved between the upper surface 95 of the substrate stage ST1 and the upper surface 97 of the measurement stage ST2 without the need to completely recover the liquid LQ, and thus can be shortened. When the exposure operation of one of the substrates P in the substrate stage ST1 is completed and the exposure operation of the next substrate P is started, the throughput can be improved. Further, since the liquid LQ is often present on the image side of the projection optical system PL, the occurrence of adhesion marks (so-called water marks) of the liquid LQ can be effectively prevented.

Next, the liquid supply mechanism 10 and the liquid recovery mechanism 20 of the liquid immersion mechanism 1 will be described with reference to Fig. 1 . The liquid supply mechanism 10 supplies the liquid LQ to the image plane side of the projection optical system PL. The liquid supply mechanism 10 includes a liquid supply unit 11 that can deliver the liquid LQ, and a supply tube 13 that is connected to the liquid supply unit 11 at one end. A valve 13B that opens and closes the flow path of the supply pipe 13 is provided in the middle of the supply pipe 13. The action of valve 13B is controlled by control unit CONT. The other end of the supply tube 13 is connected to the nozzle member 70. An internal flow path (supply flow path) for connecting the other end of the supply pipe 13 to the supply port 12 is formed inside the nozzle member 70. In the present embodiment, the liquid supply mechanism 10 supplies pure water, and the liquid supply unit 11 includes a pure water producing device 16 and a temperature regulating device 17 that adjusts the temperature of the supplied liquid (pure water) LQ. Further, the liquid supply unit 11 further includes a tank for accommodating the liquid LQ, a pressure pump, and a filter unit for removing foreign matter in the liquid LQ. The liquid supply operation of the liquid supply unit 11 is controlled by the control unit CONT. Further, in the pure water producing apparatus, a pure water producing apparatus may be used instead of the exposure apparatus EX, and a pure water producing apparatus of the factory in which the exposure apparatus EX is disposed may be used. Further, it is not necessary to provide all of the tank, the pressure pump, the filter unit, and the like of the liquid supply mechanism 10 to the exposure apparatus main body EX, and instead of using equipment such as a factory in which the exposure apparatus main body EX is provided.

Further, in the present embodiment, the valve 13B provided in the supply pipe 13 is made to mechanically flow the supply pipe 13 when the drive source (power supply) of the exposure device EX (control device CONT) is stopped due to a power failure or the like. The so-called normally closed mode of occlusion. Thereby, even if an abnormality such as a power failure occurs, the liquid LQ can be prevented from leaking from the supply port 12.

The liquid recovery mechanism 20 recovers the liquid LQ on the image plane side of the projection optical system PL. The liquid recovery mechanism 20 includes a liquid recovery unit 21 that can recover the liquid LQ, and a recovery pipe 23 that is connected to the liquid recovery unit 21 at one end. A valve 23B that can open and close the flow path of the recovery pipe 23 is provided in the middle of the recovery pipe 23. The operation of the valve 23B is controlled by the control unit CONT. The other end of the recovery pipe 23 is connected to the nozzle member 70. An internal flow path (recovery flow path) for connecting the other end of the recovery pipe 23 to the recovery port 22 is formed in the inside of the nozzle member 70. The liquid recovery unit 21 includes a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ from the gas, and a tank that stores the recovered liquid LQ. Further, it is not necessary to provide all of the vacuum system, the gas-liquid separator, and the tank of the liquid recovery mechanism 20 to the exposure apparatus main body EX, and it is possible to use an apparatus such as a factory in which the exposure apparatus main body EX is installed.

The supply port 12 for supplying the liquid LQ and the recovery port 22 for recovering the liquid LQ are formed at the lower surface 70A of the nozzle member 70. The lower surface 70A of the nozzle member 70 is disposed at a position opposite to the upper surface of the substrate P, the upper surface 95 of the substrate stage ST1, and the upper surface 97 of the measurement stage ST2. The nozzle member 70 is an annular member provided to surround the side surface of the first optical element LS1, and the supply port 12 is attached to the lower surface 70A of the nozzle member 70 to surround the first optical element LS1 of the projection optical system PL (projection optical system PL) The optical axis AX) is set in a plurality of ways. Further, the recovery port 22 is provided on the lower surface 70A of the nozzle member 70 so that the first optical element LS1 is disposed outside the supply port 12 so as to surround the first optical element LS1 and the supply port 12.

Further, the control device CONT supplies a predetermined amount of liquid LQ to the substrate P by using the liquid supply mechanism 10, and uses the liquid recovery mechanism 20 to quantitatively recover the liquid LQ on the substrate P, thereby localizing on the substrate P. A liquid immersion area LR of liquid LQ is formed. When the liquid immersion area LR of the liquid LQ is formed, the control unit CONT drives the liquid supply unit 11 and the liquid recovery unit 21, respectively. When the liquid LQ is sent from the liquid supply unit 11 under the control of the control unit CONT, the liquid LQ sent from the liquid supply unit 11 passes through the supply line 13 and then passes through the supply flow path 214 of the nozzle member 70 from the supply port. 12 is supplied to the image plane side of the projection optical system PL. When the liquid recovery unit 21 is driven under the control of the control unit CONT, the image side liquid LQ of the projection optical system PL passes through the recovery port 22 and flows into the recovery flow path of the nozzle member 70, and after flowing through the recovery tube 23, It is recovered by the liquid recovery unit 21.

In the present embodiment, the liquid LQ recovered by the liquid recovery mechanism 20 is returned to the liquid supply unit 11 of the liquid supply mechanism 10. That is, the exposure apparatus EX of the present embodiment is provided with a circulation system that circulates the liquid LQ between the liquid supply mechanism 10 and the liquid recovery mechanism 20. The liquid LQ returned to the liquid supply unit 11 of the liquid supply mechanism 10 is purified by the pure water producing apparatus 16 and then supplied again to the image surface side (on the substrate P) of the projection optical system PL. Further, the liquid LQ recovered by the liquid recovery mechanism 20 may all be returned to the liquid supply mechanism 10 or partially returned to the liquid supply mechanism 10. Alternatively, the liquid LQ recovered by the liquid recovery mechanism 20 may not be returned to the liquid supply mechanism 10, but may be supplied to the projection optical system PL after the liquid LQ or tap water supplied from another supply source is purified by the pure water production device 16. Image side. In addition, the structure of the liquid immersion mechanism 1 such as the nozzle member 70 is not limited to the above-described structure, and for example, European Patent Publication No. 1420298, International Publication No. 2004/055803, International Publication No. 2004/057589, and International Publications are also available. The person described in the publication No. 2004/057590 and International Publication No. 2005/029559.

Next, the liquid supply unit 11 will be described with reference to Fig. 4 . Fig. 4 is a view showing the configuration of the liquid supply unit 11 in detail. The liquid supply unit 11 includes a pure water producing device 16 and a temperature regulating device 17 (which adjusts the temperature of the liquid LQ produced by the pure water producing device 16). The pure water producing apparatus 16 includes a pure water generator 161 (purified water containing a float or an impurity, for example, to produce pure water of a predetermined purity), and an ultrapure water maker 162 (pure water produced by the pure water generator 161). Further removing impurities to produce high-purity pure water (ultra-pure water)). The pure water generator 161 (or the ultrapure water generator 162) includes a liquid reforming member such as an ion exchange membrane or a particle filter, and a liquid reforming device such as an ultraviolet irradiation device (UV lamp), by which the liquid is The reforming member and the liquid reforming device adjust the specific resistance value of the liquid, the amount of foreign matter (fine particles, bubbles), the total organic matter carbon, and the amount of bacteria to a desired value.

Further, as described above, the liquid LQ recovered by the liquid recovery mechanism 20 is returned to the liquid supply unit 11 of the liquid supply mechanism 10. Specifically, the liquid LQ recovered by the liquid recovery mechanism 20 is supplied to the pure water producing device 16 (pure water maker 161) of the liquid supply unit 11 through the return pipe 18. The return pipe 18 is provided with a first valve 18B that opens and closes the flow path of the return pipe 18. The pure water producing apparatus 16 purifies the liquid LQ returned through the return pipe 18 by the liquid reforming member, the liquid reforming device, or the like, and then supplies it to the temperature regulating device 17. Further, the pure water producing device 16 (pure water maker 161) of the liquid supply unit 11 is connected to the functional liquid supply device 120 through the supply pipe 19. The functional fluid supply device 120 can supply the functional liquid LK (having a predetermined function different from the liquid LQ used to form the liquid immersion area LR). In the present embodiment, the functional liquid supply device 120 is supplied with a functional liquid LK having a cleaning action or a sterilizing action or both. As the functional liquid LK, for example, ozone water, an aqueous solution containing a surfactant, an antibacterial agent, a bactericide, a disinfectant or the like or a water-soluble organic solvent can be used. In the present embodiment, hydrogen peroxide water is used as the functional liquid LK. The supply pipe 19 is provided with a second valve 19B that opens and closes the flow path of the supply pipe 19. When the control device CONT operates the first valve 18B so that the flow path of the return pipe 18 is opened to supply the liquid LQ, the second valve 19B is operated to close the flow path of the supply pipe 19 to stop the supply of the functional liquid LK. On the other hand, when the control device CONT operates the second valve 19B to open the flow path of the supply pipe 19 to supply the functional liquid LK, the first valve 18B is operated to close the flow path of the return pipe 18 to stop the supply of the liquid LQ.

The temperature adjustment device 17 is temperature-adjusted to the liquid (pure water) LQ supplied from the pure water production device 16 and supplied to the supply pipe 13, and one end thereof is connected to the pure water production device 16 (ultra-pure water maker 162). The other end is connected to the supply pipe 13, and after temperature adjustment of the liquid LQ manufactured by the pure water producing apparatus 16, the temperature-adjusted liquid LQ is sent out to the supply pipe 13. The temperature adjustment device 17 includes a coarse thermostat 171 for coarsely adjusting the temperature of the liquid LQ supplied from the ultrapure water maker 162 of the pure water producing device 16, and a downstream side of the flow path of the coarse thermostat 171 (supply tube 13) The side is provided with a flow controller 172 called a mass flow regulator for controlling the amount of liquid LQ per unit time flowing through the supply pipe 13 side, so that the dissolved gas concentration in the liquid LQ passing through the flow controller 172 ( a deaerator 173 having a reduced dissolved oxygen concentration and a dissolved nitrogen concentration), a filter 174 for removing foreign matter (fine particles, bubbles) in the liquid LQ deaerated by the deaerator 173, and a filter 174 for passing through the filter 174 The thermostat 175 is fine-tuned to the temperature of the liquid LQ.

The coarse temperature controller 171 adjusts the temperature of the liquid LQ sent from the ultrapure water generator 162 to a target temperature (for example, 23 ° C) with a coarse precision of, for example, about ± 0.1 ° C. The flow rate controller 172 is disposed between the coarse temperature controller 171 and the deaerator 173, and controls the flow rate per unit time of the liquid LQ that has undergone temperature adjustment in the coarse temperature controller 171 on the side of the deaerator 173.

The deaerator 173 is disposed between the coarse thermostat 171 and the micro-temperature regulator 175, specifically between the flow controller 172 and the filter 174, and degases the liquid LQ sent from the flow controller 172. The dissolved gas concentration (including the dissolved oxygen concentration and the dissolved nitrogen concentration) in the liquid LQ is lowered. As the deaerator 173, a known deaerator such as a decompression device that degases the supplied liquid LQ to degas the gas can be used. Further, a device in which a liquid LQ is separated by a filter such as a hollow fiber membrane filter, a gas component separated by a vacuum system to remove a degassing filter, and a liquid LQ by centrifugal force may be used. The gas-liquid separation is performed, and the separated gas component is removed by a vacuum system, and the device including the degassing pump is used. The deaerator 173 adjusts the dissolved gas concentration to a desired value by a liquid reforming member including the above-described degassing filter or a liquid reforming device including the above described degassing pump.

The filter 174 is disposed between the coarse thermostat 171 and the micro-temperature regulator 175, specifically between the deaerator 173 and the micro-temperature regulator 175, and the foreign matter in the liquid LQ sent from the deaeration device 173 Remove. When passing through the flow controller 172 or the degasser 173, a small amount of foreign matter may be mixed in the liquid LQ, and filtration is set on the downstream side of the flow controller 172 or the degasser 173 (on the side of the supply pipe 13). The filter 174 can remove foreign matter by the filter 174. As the filter 174, a known filter such as a hollow fiber membrane filter or a particle filter can be used. The filter 174 including the liquid reforming member such as the particle filter adjusts the amount of foreign matter (fine particles, bubbles) in the liquid to be equal to or lower than the allowable value.

The micro-temperature regulator 175 is disposed between the coarse temperature controller 171 and the supply pipe 13, specifically, between the filter 174 and the supply pipe 13, and can accurately adjust the temperature of the liquid LQ. For example, the thermostat 175 finely adjusts the temperature (temperature stability and temperature uniformity) of the liquid LQ sent from the filter 174 to a target temperature with a high precision of about ±0.01°C to ±0.001°C. In the present embodiment, the micro-temperature regulator 175 among the plurality of instruments constituting the temperature adjustment device 17 is disposed at the position closest to the substrate P to which the liquid LQ is supplied, so that the liquid LQ after the high-precision temperature adjustment can be performed. It is supplied on the substrate P.

Further, the filter 174 is preferably disposed between the coarse temperature controller 171 and the micro-temperature regulator 175 in the temperature adjustment device 17, and may be disposed in different places in the temperature adjustment device 17, or may be disposed in the temperature adjustment device 17 Outside.

As described above, the pure water generator 161, the ultrapure water generator 162, the deaerator 173, and the filter 174 are respectively provided with a liquid reforming member and a liquid reforming device, and have at least one of properties and compositions for the liquid LQ. The role of the adjustment device for adjustment. The devices 161, 162, 173, and 174 are disposed at predetermined positions in which the liquid in the liquid supply mechanism 10 flows through the flow path. Further, in the present embodiment, one liquid supply unit 11 (see FIG. 1) is disposed in one exposure apparatus EX, but the liquid supply unit 11 may be a plurality of exposure apparatuses. Shared by EX. Thereby, the area (arrangement area) occupied by the liquid supply unit 11 can be saved. Alternatively, the pure water producing device 16 constituting the liquid supply portion 11 may be divided into the temperature regulating device 17, so that the plurality of exposure devices EX share the pure water producing device 16, and the temperature adjusting device 17 is not disposed in each of the exposure devices EX. . Thereby, the installation area can be saved, and temperature management can be performed for each exposure apparatus. Further, in the above case, if the liquid supply unit 11 or the pure water producing apparatus 16 shared by the plurality of exposure apparatuses EX is disposed on a ground (for example, underground) different from the floor on which the exposure apparatus EX is installed, it can be used more effectively. The space of the vacuum chamber of the exposure device EX is set.

Next, the measuring device 60 will be described with reference to Fig. 5 . The measuring device 60 measures at least one of the properties and components of the liquid LQ filled between the projection optical system PL and an object disposed on the image plane side of the projection optical system PL. As described above, since the liquid LQ is water in the present embodiment, in the following description, at least one of the properties and the components of the liquid LQ is referred to as "water quality".

The measuring device 60 is disposed in the middle of the recovery pipe 23, and measures the liquid LQ recovered by the liquid recovery mechanism 20. Since the liquid recovery mechanism 20 recovers the liquid LQ filled between the projection optical system PL and the object through the recovery port 22 of the nozzle member 70, the measuring device 60 is flowed for recovery by the recovery port 22 of the nozzle member 70. The liquid LQ of the recovery pipe 23, that is, the water quality (at least one of the properties and the composition) of the liquid LQ filled between the projection optical system PL and the object is measured.

As described with reference to Fig. 3, the liquid immersion area LR of the liquid LQ is movable between the substrate stage ST1 and the measurement stage ST2. When the measuring device 60 is used to measure the water quality of the liquid LQ, the control device CONT performs the supply and recovery of the liquid LQ using the liquid immersion mechanism 1 in a state where the projection optical system PL is opposed to the measurement stage ST2, and the projection optical system The optical path space K1 between the PL and the measurement stage ST2 is filled with the liquid LQ. More specifically, when the measuring device 60 is used to measure the water quality of the liquid LQ, the control device CONT is filled with the liquid LQ between the projection optical system PL and the predetermined region 100 of the upper surface 97 of the measurement stage ST2. The measuring device 60 measures the water quality of the liquid LQ filled between the projection optical system PL and the predetermined region 100 of the measurement stage ST2.

As described above, the predetermined area 100 of the measurement stage ST2 is formed so as not to be contaminated by the liquid LQ. Therefore, the measuring device 60 measures the liquid LQ for preventing contamination which is filled between the projection optical system PL and the predetermined region 100. Therefore, the measuring device 60 can accurately measure the true water quality of the liquid LQ (the liquid LQ supplied to the optical path space K1) filled in the optical path space K1 on the image plane side of the projection optical system PL. The measurement result of the measuring device 60 is output to the control device CONT. The control unit CONT determines whether or not the state (water quality) of the liquid LQ filled between the projection optical system PL and the predetermined region 100 of the measurement stage ST2 is in a desired state, based on the measurement result of the measurement device 60.

For example, the liquid LQ is filled between the projection optical system PL and a member in which a contaminant may occur, and the measuring device 60 measures the condition of the liquid LQ for consideration. In addition, the member which may be a contaminant may be a member (the upper surface of the stage) which is not subjected to the above-described surface treatment (such as PFA treatment), or the photosensitive material substrate P or the like may be coated. In this case, even if it is judged based on the measurement result of the measuring device 60 whether or not the contaminated liquid LQ is present, it is difficult to specify the cause of the contamination (poor condition) of the liquid LQ. That is, in this case, the cause of the contamination (poor condition) of the liquid LQ is considered to be at least the following two cases: the problem caused by the problem of the pure water maker 161 of the liquid supply portion 11, and the occurrence of the above-mentioned members The situation caused by the impact of pollutants. At this time, it is difficult to specify the cause of contamination (poor condition) of the liquid LQ depending on the measurement result of the measuring device 60. If the cause of the contamination (poor condition) of the liquid LQ cannot be specified, it is difficult to solve the problem of the poor condition or the measure for achieving the desired state (clean state) of the liquid LQ. In the present embodiment, since the liquid immersion area LR of the liquid LQ is formed on the predetermined area 100 formed so as not to contaminate the liquid LQ, and the liquid LQ is measured, the control unit CONT can accurately obtain the measurement result based on the measurement unit 60. When the liquid state LQ of the liquid supply portion 11 is contaminated, it is judged that the cause of the contamination is caused by, for example, the problem of the pure water maker 161 of the liquid supply portion 11. Therefore, it is possible to perform an appropriate measure (measure) for allowing the liquid LQ to reach a desired state, such as maintenance of the pure water generator 161.

Further, in addition to the present embodiment, the measurement position is set in the middle of the recovery pipe 23, and for example, a measurement position for measuring the liquid LQ is provided in the middle of the supply pipe 13, and the measuring device 60 measures the water quality of the liquid LQ by the measurement position. The situation to consider. By measuring the liquid LQ with the measurement position set in the middle of the supply tube 13, it is possible to avoid the influence of the member which may cause the pollutants as described above, and the liquid LQ can be measured. However, when the flow path of the predetermined section between the measurement position provided in the middle of the supply pipe 13 and the supply port 12 of the nozzle member 70 is contaminated for any reason, although the flow path flows through the predetermined section, The liquid LQ supplied to the optical path space K1 through the supply port 12 may be contaminated, but since the above-described measurement position is provided on the upstream side of the predetermined section, the measurement device 60 cannot measure the contamination of the liquid LQ. As a result, even if the contaminated liquid LQ is actually supplied to the optical path space K1, the measuring device 60 cannot grasp (measure) the contamination state of the liquid LQ supplied to the optical path space K1, and such a poor result occurs. At this time, not only measures (measures) for maintaining the liquid LQ in a desired state, but also the cause of deterioration of the specific exposure accuracy and measurement accuracy are difficult. Further, since the measurement processing by the photometers 300, 400, 500, and 600 and the exposure processing of the substrate P are performed through the contaminated liquid LQ, the measurement accuracy and the exposure accuracy of the permeated liquid LQ are deteriorated. In the present embodiment, since the measurement position is set on the downstream side of the optical path space K1, specifically, in the middle of the recovery tube 23, it is possible to prevent the occurrence of the above-described inconvenience.

Further, in the present embodiment, since the liquid LQ uses water, the PFA treatment is applied to the predetermined region 100. However, when the liquid LQ is composed of a liquid other than water, foreign matter may be eluted from the predetermined region 100 ( Mixed in) Liquid LQ is moderately poor. In this case, as long as the physical properties (types) of the liquid to be used are used as described above, the measurement stage ST2 may be subjected to a treatment for preventing liquid contamination.

Regarding the nature of the liquid LQ measured by the measuring device 60, the component (water quality or liquid state, or the state of the liquid), the influence of the exposure accuracy and the measurement accuracy of the exposure device EX, or the exposure is considered. It is determined by the influence of the device EX itself. Table 1 shows an example of the nature of the liquid LQ, the composition of the component, and the influence of the item on the exposure accuracy of the exposure apparatus EX or on the exposure apparatus EX itself. As shown in Table 1, in terms of the properties and composition of the liquid LQ, there are physical properties such as specific resistance, metal ions, total organic carbon (TOC), and particles. Bubbles, bacteria-containing substances (foreign matter or contaminants), dissolved oxygen (DO: dissolved oxygen), dissolved nitrogen (DN: dissolved nitrogen) dissolved gases. On the other hand, regarding the item of the exposure accuracy of the exposure apparatus EX or the influence on the exposure apparatus EX itself, there is a turbidity and a water mark of the lens (especially the optical element LS1) (with evaporation of the liquid LQ, in the liquid) The occurrence of adhesion due to curing of impurities, deterioration of optical properties due to refractive index change or light scattering, influence on a photoresist program (formation of a photoresist pattern), occurrence of rust of each member, and the like. Table 1 summarizes the nature of the nature of the project and the impact of the project on what kind of performance, and gives “○” to those who may have adverse effects on the forecast. The nature and composition of the liquid LQ measured by the measuring device 60 are selected from Table 1 depending on the exposure accuracy and measurement accuracy of the exposure device EX or the influence on the exposure device EX itself. Of course, measurements can be made for all items, and can also be measured for items related to the nature and composition not shown in Table 1.

In order to measure an item selected based on the above viewpoint, the measuring device 60 has a plurality of measuring instruments. For example, the measuring device 60 may be provided with a resistance meter for measuring the specific resistance value, a TOC meter for measuring the total organic carbon, a particle counter for measuring the foreign matter containing the particles and the gas, and measuring the dissolved oxygen (dissolved oxygen concentration). The DO meter, the DN meter for measuring the dissolved nitrogen (nitrification concentration), the cerium oxide meter for measuring the concentration of cerium oxide, and the analyzer for analyzing the type and amount of the bacteria are used as the measuring device. In this embodiment, it is an example of all organic carbon and particles. The bubble, the dissolved oxygen, and the specific resistance value are selected as measurement items. As shown in FIG. 5, the measuring device 60 includes a TOC meter 61 for measuring total organic carbon, and a particle counter for measuring foreign matter containing particles and gas. 62. A dissolved oxygen meter (DO meter) 63 for measuring dissolved oxygen, and a specific resistance meter 64.

As shown in FIG. 5, the TOC meter 61 is connected to the branch pipe (branch flow path) 61K branched from the recovery pipe (recovery flow path) 23 connected to the recovery port 22. The recovery pipe 23 has a liquid LQ flowing through the recovery port 22 and flowing therethrough. The liquid LQ flowing through the recovery pipe 23 is a liquid filled between the projection optical system PL and the predetermined region 100 of the measurement stage ST2. A part of the liquid LQ flowing through the liquid LQ of the recovery pipe 23 is recovered to the liquid recovery part 21, and the remaining part flows through the branch pipe 61K and flows into the TOC meter 61. The TOC meter 61 measures total organic carbon (TOC) in the liquid LQ of the branch flow path formed by the flow through the branch pipe 61K. Similarly, the particle counter 62, the dissolved oxygen meter 63, and the specific resistance meter 64 are connected to the branch pipes 62K, 63K, and 64K branched from the middle of the recovery pipe 23, and are formed by the flow-through branch pipes 62K, 63K, and 64K. The foreign matter (fine particles or bubbles), dissolved oxygen, and specific resistance value in the liquid LQ of the branch flow path were measured. Further, the above-mentioned cerium oxide meter and the bacteria analyzer may be connected to a branch pipe branched from the middle of the recovery pipe 23.

Further, since the measurement items of the measuring device 60 are selected as described above, the measuring device 60 may be provided with one or a plurality of the measuring devices 61 to 64.

In the present embodiment, the branch pipes 61K to 64K form separate branch flow paths, and the respective measuring devices 61 to 64 are connected to the respective independent branch flow paths. That is, the plurality of measuring devices 61 to 64 are connected in parallel to the recovery pipe 23 through the branch pipes 61K to 64K. Further, with the configuration of the measuring device, the plurality of measuring devices may be connected in series to the recovery pipe 23, in other words, the liquid LQ branched from the recovery pipe 23 may be measured by the first measuring device, and then passed through the liquid of the first measuring device. The LQ is measured with a second measurer. Further, since the possibility of occurrence of foreign matter (fine particles) increases with the number and position of the branch pipes (branch portions), it is preferable to set the number and position of the branch pipes in consideration of the possibility of occurrence of foreign matter.

Further, a sampling port may be provided to sample a portion of the liquid LQ in the middle of the recovery pipe 23. For example, in order to specify the kind of metal ions contained in the liquid LQ, the liquid LQ may be sampled, and the type of the metal ions may be specified using an analysis device provided separately from the exposure device EX. Thereby, appropriate measures can be taken depending on the specific metal ions. Further, in order to measure the impurities contained in the liquid LQ, the liquid LQ may be sampled, and the amount of pervaporation residue in the liquid LQ is measured by a pervaporation residue meter provided separately from the exposure device EX.

In the present embodiment, the measuring device 60 measures the water quality of the liquid LQ flowing through the branch flow path branched in the middle of the recovery flow path formed by the recovery pipe 23. Thereby, since the measuring device 60 supplies the liquid LQ over time, the control device CONT can perform the same operation as in the immersion exposure, that is, the liquid supply operation through the supply port 12 and the liquid recovery through the recovery port 22. The water quality of the liquid LQ can be measured well without special movements.

Next, a method of exposing the pattern image of the mask M to the substrate P using the exposure apparatus EX having the above configuration will be described with reference to a flowchart of FIG. 6. In the present embodiment, the plurality of substrates P are sequentially exposed. More specifically, the plurality of substrates P are managed in batches, and the exposure apparatus EX performs sequential processing for each of the plurality of batches.

The control device CONT moves the substrate stage ST1 to a predetermined substrate replacement position by using the substrate stage drive device SD1. At the substrate replacement position, the substrate P after the exposure is carried out (unloaded) from the substrate stage ST1 by a transfer system (not shown), and the substrate P before the exposure is carried (loaded). Further, when the substrate P before the exposure is not present on the substrate stage ST1, of course, the substrate P is not carried out, and only the substrate P before the exposure is carried in. Further, there is a case where the substrate P after the exposure is performed only at the substrate replacement position, and the substrate P before the exposure is not carried. In the following description, the operation of at least one of the substrate P before the exposure to the substrate stage ST1 and the substrate P after the exposure to the substrate stage ST1 are expediently referred to as "substrate replacement operation".

In the present embodiment, during the substrate replacement operation on the substrate stage ST1, the measurement process is performed using the measurement stage ST2. The control device CONT starts a predetermined measurement process using the measurement stage ST2 in parallel with at least a part of the substrate replacement operation of the substrate stage ST1 (step SA1).

The control device CONT is disposed in a state where the lower surface LSA of the projection optical system PL is opposed to the predetermined region 100 of the upper surface 97 of the measurement stage ST2, that is, the predetermined region 100 is disposed at a position where the substrate P is exposed. The immersion mechanism 1 supplies and recovers the liquid LQ, and is filled with the liquid LQ between the projection optical system PL and the predetermined region 100 of the measurement stage ST2. Then, the control device CONT uses the measuring device 60 to measure the water quality of the liquid LQ between the projection optical system PL and the predetermined region 100 of the measurement stage ST2. As described above, the measuring device 60 measures the liquid LQ whose pollution is suppressed. The measurement result of the measuring device 60 is output to the control device CONT. The control device CONT stores the measurement result of the measuring device 60 in the memory device MRY (step SA2).

In the present embodiment, the control device CONT stores the measurement result of the liquid LQ disposed on the predetermined region 100 by the measuring device 60 in the memory device MRY in response to the passage of time. For example, a valve sensor that senses whether the flow path of the supply pipe 13 is closed by the valve 13B is provided, and a timer function is set in the control device CONT, whereby the control device CONT can be sensed according to the sensor for the valve As a result, the elapsed time from the opening of the flow path of the supply pipe 13 by the sensing valve 13B, that is, the elapsed time at which the liquid supply mechanism 10 starts supplying the liquid LQ is measured. Thereby, the control device CONT can use the liquid supply mechanism 10 to start the supply of the liquid LQ on the image plane side of the projection optical system PL as the measurement start time point (reference), and store the measurement result of the measurement device 60 in the memory device in response to the passage of time. MRY. Further, the control device CONT can also use the sensing valve 13B to close the flow path of the supply pipe 13, that is, the timing at which the liquid supply mechanism 10 stops supplying the liquid LQ to the image side of the projection optical system PL as the measurement start point (reference). . In the following description, the information corresponding to the time lapse (here, the result of measuring the water quality of the liquid LQ filled between the projection optical system PL and the predetermined area 100 by the measuring device 60) is expediently called It is "1st log information".

Further, in the present embodiment, after the substrate substrate S is sequentially exposed to the substrate stage ST1, the liquid immersion area LR of the liquid LQ is formed in the predetermined area 100 on the measurement stage ST2. The measuring device 60 measures the liquid LQ. The measuring process of the liquid LQ by the measuring device 60 is performed every time the substrate P is replaced with the substrate stage ST1, or after a predetermined number of substrates P are exposed, or for each batch of the substrate P. . The control device CONT stores the measurement result of the measuring device 60 in the memory device MRY corresponding to the substrate P while sequentially exposing the plurality of substrates P. In the following description, the information recorded corresponding to the substrate P (here, the water quality of the liquid LQ filled between the projection optical system PL and the predetermined area 100 of the measurement stage ST2 is measured by the measuring device 60. The result) is expediently referred to as "second log information".

Further, the control unit CONT can display (notify) the measurement result of the measuring device 60 as the notification device INF including the display device.

The control unit CONT judges whether or not the measurement result of the measuring device 60 is abnormal (step SA3). The control device CONT controls the operation of the exposure device EX in accordance with the above-described determination result.

The measurement result of the measuring device 60 is abnormal, and includes the following cases: the state (water quality) of the liquid LQ is not the desired state and is abnormal, and each item measured by the measuring device 60 (TOC, foreign matter, dissolved gas concentration, dioxide) The measured value of the cerium concentration, the bacteria, the specific resistance value, and the like is set to a predetermined allowable value or more, and the exposure processing and the measurement processing of the permeated liquid LQ are not performed in a desired state.

Here, in the following description, the allowable value of the liquid LQ water quality filled between the projection optical system PL and the predetermined region 100 is expediently referred to as a "first allowable value". The first allowable value means an allowable value of the liquid LQ water quality which is not substantially affected by the object (here, the predetermined area 100) disposed on the image plane side of the projection optical system PL.

The first allowable value can be obtained by, for example, a prior experiment or simulation. As long as the measured value of the liquid LQ water quality is equal to or less than the first allowable value, exposure processing and measurement processing can be performed through the liquid LQ in a desired state.

For example, when the value of the total organic carbon in the liquid LQ is larger than the first allowable value (for example, 1.0 ppb) (abnormality), the transmittance of the liquid LQ may be lowered. At this time, the measurement accuracy of the light measuring device 300, 400, 500, 600 through the liquid LQ is deteriorated. Alternatively, the exposure accuracy of the substrate P through the liquid LQ may be deteriorated.

Further, when the amount of foreign matter containing fine particles or bubbles in the liquid LQ is much larger than the first allowable value (abnormality), the measurement accuracy of the light measuring device 300, 400, 500, 600 through the liquid LQ may be deteriorated, or The possibility that the pattern of the liquid LQ transferred to the substrate P causes a defect becomes high.

Further, when the value of the dissolved gas (dissolved gas concentration) containing dissolved oxygen and dissolved nitrogen in the liquid LQ is much larger than the first allowable value (abnormality), for example, the liquid supplied to the substrate P through the supply port 12 When LQ is opened to the atmosphere, it is likely to be generated by the dissolved gas in the liquid LQ, and bubbles are generated in the liquid LQ. When bubbles are generated in the liquid LQ, the measurement accuracy of the photometers 300, 400, 500, and 600 is deteriorated as described above, or the possibility that the pattern transferred to the substrate P is defective is increased.

Further, when the amount of the bacteria is large (abnormality), the liquid LQ is contaminated and the penetration rate is deteriorated. Further, when the amount of the bacteria is large, the member that is in contact with the liquid LQ (the nozzle member 70, the optical element LS1, the measurement stage ST2, the substrate stage ST1, the supply tube 13, the recovery tube 23, etc.) is contaminated, Poor pollution expansion.

Further, when the specific resistance value of the liquid LQ is smaller than the first allowable value (for example, 18.2 MΩ·cm at 25 ° C) (abnormality), the liquid LQ may contain a large amount of metal ions such as sodium ions. If the liquid immersion area LR is formed on the substrate P by the liquid LQ containing a large amount of metal ions, the metal ions of the liquid LQ may impregnate the photosensitive material on the substrate P, and adhere to the element pattern (wiring pattern) which has been formed under the photosensitive material. ), causing poor operation of components, etc.

The control device CONT controls the operation of the exposure device EX based on the first allowable value set in advance for the liquid LQ water quality and the measurement result of the measuring device 60.

In step SA3, when it is judged that the measurement result of the measuring device 60 is not abnormal, that is, the water quality of the liquid LQ is not abnormal, the control device CONT uses the liquid immersion mechanism 1 in the first optical element LS1 of the projection optical system PL and the measurement. The upper surface 97 of the stage ST2 is filled with the liquid LQ, and at least one of the light measuring devices 300, 400, 500, and 600 is used for the measurement operation (step SA4). The liquid LQ filled between the projection optical system PL and the upper surfaces 301, 401, 501, and 601 of the optical measuring instruments 300, 400, 500, and 600 is judged (confirmed) in step SA3 as having no abnormality in water quality. Liquid LQ in the required state. Therefore, the liquid LQ that can pass through the desired state is well measured by the light measuring device.

The measurement operation performed by the light measuring device can be exemplified by the baseline measurement. Specifically, the control device CONT uses the reticle alignment system to simultaneously perform the first reference mark MFM on the reference member 300 provided on the measurement stage ST2 and the reticle alignment mark on the corresponding reticle M. The positional relationship between the first reference mark MFM and the corresponding mask alignment mark is detected. At the same time, or before and after this, the control unit CONT detects the second reference mark PFM on the reference member 300 by the substrate alignment system, and detects the detection reference position of the substrate alignment system and the second reference mark PFM. The positional relationship. Further, as described above, when the first reference mark MFM is measured, the liquid immersion area LR is formed on the first reference mark MFM, and the measurement process is performed by the liquid LQ. On the other hand, when the second reference mark PFM is measured, the liquid immersion area LR is not formed on the second reference mark PFM, and the measurement process is performed without passing through the liquid LQ. Further, the control device CONT is based on the positional relationship between the first reference mark MFM and the corresponding mask alignment mark, the positional relationship between the detection reference position of the substrate alignment system and the second reference mark PFM, and the known first reference mark MFM. Based on the positional relationship with the second reference mark PFM, the distance between the pattern projection position of the mask M caused by the projection optical system PL and the detection reference position of the substrate alignment system (that is, the baseline information of the substrate alignment system) is obtained.

Further, the measurement operation performed by the optical measuring device is not limited to the above-described baseline measurement, and the illuminance unevenness measurement, the spatial image measurement, and the illuminance measurement may be performed using the optical meters 400, 500, and 600 mounted on the measurement stage ST2. At least one of them. The control device CONT performs various correction processes such as correction processing of the projection optical system PL based on the measurement results of the optical measuring devices 400, 500, and 600, and this is reflected in the exposure processing of the substrate P to be performed later. When the light measuring devices 400, 500, and 600 are used for the measurement processing, the control device CONT is filled with the liquid LQ between the first optical element LS1 of the projection optical system PL and the upper surface 97 of the measurement stage ST2, and is transmitted through the liquid LQ. Perform measurement processing.

On the other hand, in step SA3, when it is judged that the measurement result of the measuring device 60 is abnormal, that is, the water quality of the liquid LQ is abnormal, the control device CONT does not perform the measurement operation by the light measuring device, but the measuring device 60 The measurement result informs the notification device INF (step SA14). For example, the control device CONT can display the information on the amount of change in the concentration of the TOC and the dissolved gas contained in the liquid LQ over time in the notification device INF including the display device. Further, when it is judged that the measurement result of the measuring device 60 is abnormal, the control device CONT can issue an alarm (warning) or the like to the notification device INF to inform the device INF that the measurement result is abnormal. Further, when it is judged that the measurement result of the measuring device 60 is abnormal, the control device CONT may also stop supplying the liquid LQ with the liquid supply mechanism 10. The liquid LQ remaining on the measurement stage ST2 can also be recovered by the liquid recovery mechanism 20 including the nozzle member 70.

Further, as described above, the liquid supply unit 11 includes a liquid reforming member and a liquid reforming device, and includes a plurality of adjusting devices for adjusting the water quality of the liquid LQ (pure water generator 161, ultrapure water maker 162, deaerator) 173, filter 174, etc.). The control device CONT can inform at least one of the plurality of adjustment devices according to the measurement result of the measurement device 60, and inform the device INF of the information about the specific adjustment device. For example, depending on the measurement result of the DO meter or the DN meter in the measuring device 60, when it is judged that the dissolved gas concentration is abnormal, the control device CONT displays (informs) the inducing device INF to cause, for example, the degasser 173 among the plurality of adjusting devices. The contents of maintenance (inspection, replacement) of the degassing filter or degassing pump.

Further, when it is judged based on the measurement result of the specific resistance meter in the measuring device 60 whether or not the specific resistance value of the liquid LQ is abnormal, the control device CONT displays (informs) the instructing device INF to cause, for example, pure water among the plurality of adjusting devices. The maintenance (inspection, replacement) of the ion exchange membrane of the manufacturing equipment. Further, when it is judged that the specific resistance value of the liquid LQ is abnormal according to the measurement result of the specific resistance meter in the measuring device 60, the control device CONT displays (informs) the notification device INF to cause, for example, pure among the plurality of adjustment devices. The contents of maintenance (inspection, replacement) of the ion exchange membrane of the water producing device 16. Further, when it is determined that the total organic matter of the liquid LQ is abnormal according to the measurement result of the TOC meter in the measuring device 60, the control device CONT displays (informs) the inducing device INF to cause, for example, a pure water producing device among the plurality of adjusting devices. 16 UV lamp repair (inspection, replacement) content. Further, when it is determined that the amount of foreign matter (fine particles, bubbles) of the liquid LQ is abnormal according to the measurement result of the particle counter in the measuring device 60, the control device CONT displays (informs) the inducing device INF to cause the plurality of adjusting devices. For example, the filter 174 or the maintenance (inspection, replacement) of the particle filter of the pure water producing device 16 is included. Further, when it is judged that the amount of bacteria of the liquid LQ is abnormal according to the analysis result of the bacteria analyzer in the measuring device 60, the control device CONT displays (informs) the inducing device INF to cause, for example, pure water among the plurality of adjusting devices. The contents of maintenance (inspection, replacement) of the UV lamp of the manufacturing device 16. Further, when it is judged that the concentration of cerium oxide of the liquid LQ is abnormal according to the measurement result of the cerium oxide in the measuring device 60, the control device CONT displays (information) by the notification device INF to cause, for example, pure in the plurality of adjusting devices. The contents of maintenance (inspection, replacement) of the filter for removing cerium oxide in the water-making device 16.

Then, based on the notification information of the notification device INF, a measure for maintaining the water quality of the liquid LQ in a desired state including the above-described maintenance processing or the like is performed (step SA15). After the measure is executed, the control unit CONT again uses the measuring device 60 to perform the water quality measuring operation of the liquid LQ (step SA2). The measure for maintaining the water quality of the liquid LQ in the desired state will continue until the measurement result of the measuring device 60 is judged to be abnormal.

When the measurement operation using at least one of the light measuring devices 300, 400, 500, and 600 of step SA4 is completed, the measurement operation using the measurement stage ST2 is ended (step SA5). Next, the control unit CONT issues a command to start the liquid immersion exposure processing of the substrate P (step SA6).

At this time, the substrate replacement operation is completed in advance at the substrate replacement position, and the substrate P before exposure is held on the substrate stage ST1. The control device CONT is, for example, such that the measurement stage ST2 is brought into contact with (close to) the substrate stage ST1, and is moved in the XY plane while maintaining the relative positional relationship, and the substrate P before the exposure is aligned. Here, a plurality of exposure irradiation regions are provided in advance on the substrate P, and alignment marks corresponding to the plurality of exposure irradiation regions are provided. The control unit CONT performs the detection of the alignment marks on the pre-exposure substrate P by the substrate alignment system, and calculates the position coordinates of the plurality of exposure irradiation areas on the substrate P with respect to the detection reference position of the substrate alignment system.

The control device CONT maintains the relative positional relationship between the substrate stage ST1 and the measurement stage ST2 in the Y-axis direction, and simultaneously moves the substrate stage ST1 and the measurement stage ST2 in the -Y direction using the stage driving devices SD1 and SD2. As described with reference to FIG. 3, the control device CONT moves in the -Y direction together in a region including the position immediately below the projection optical system PL in a state where the substrate stage ST1 is in contact with (or close to) the measurement stage ST2. The control device CONT moves the liquid carrier LQ held between the first optical element LS1 of the projection optical system PL and the upper surface 97 of the measurement stage ST2 from the measurement stage ST2 by moving the substrate stage ST1 together with the measurement stage ST2. The upper surface 97 moves to the upper surface 95 of the substrate stage ST1. The liquid immersion area LR of the liquid LQ filled between the first optical element LS1 of the projection optical system PL and the measurement stage ST2 is moved in the -Y direction along with the measurement stage ST2 and the substrate stage ST1, and is sequentially measured. The upper surface 97 of the stage ST2, the upper surface 95 of the substrate stage ST1, and the upper surface of the substrate P move. When the substrate stage ST1 and the measurement stage ST2 are moved together in the -Y direction by a predetermined distance, the liquid LQ is filled between the first optical element LS1 of the projection optical system PL and the substrate P. That is, the liquid immersion area LR of the liquid LQ is disposed on the substrate P of the substrate stage ST1. After the substrate stage ST1 (substrate P) is moved below the projection optical system PL, the control unit CONT retracts the measurement stage ST2 to a predetermined position that does not collide with the substrate stage ST1.

Thereafter, the control unit CONT performs immersion exposure of the substrate P supported by the substrate stage ST1 in a step-scan manner in a state where the substrate stage ST1 and the measurement stage ST2 are separated. When the liquid immersion exposure of the substrate P is performed, the control device CONT fills the optical path space K1 of the exposure light EL between the projection optical system PL and the substrate P by the liquid immersion mechanism 1 to form a liquid LQ on the substrate P. In the liquid immersion area LR, the exposure light EL is applied to the substrate P through the projection optical system PL and the liquid LQ, whereby the substrate P is exposed (step SA7). The liquid LQ filled in the optical path space K1 between the projection optical system PL and the substrate P is the liquid LQ determined to be in a desired state without water quality abnormality in step SA3. Therefore, the substrate P can be well exposed through the liquid LQ in a predetermined state.

The control device CONT performs a liquid immersion exposure operation of the step-and-scan method on the substrate P, and sequentially transfers the pattern of the mask M to the plurality of exposure-illuminated regions on the substrate P. Further, the operation of moving the substrate stage ST1 in order to expose the respective exposure areas on the substrate P is performed based on the position coordinates and the baseline information of the plurality of exposure areas on the substrate P obtained from the substrate alignment result.

Fig. 7 is a view showing the substrate P in a state of liquid immersion exposure. In the immersion exposure, the liquid LQ of the liquid immersion area LR is in contact with the substrate P, and the information on the water quality of the liquid LQ recovered from the substrate P by the liquid recovery mechanism 20 is measured (monitored) by the measuring device 60. The measurement result of the measuring device 60 is output to the control device CONT. The control unit CONT stores the measurement result (monitoring result) of the measuring device 60 in the memory device MRY (step SA8).

The control device CONT stores the measurement result of the liquid LQ disposed on the substrate P by the measuring device 60 in the memory device MRY in response to the passage of time. For example, the control device CONT can be used as the measurement start time point (reference) when the liquid immersion area LR is moved from the measurement stage ST2 to the substrate stage ST1 (substrate P) according to the measurement result of the laser interferometer 94. The measurement result of the measuring device 60 is stored in the memory device MRY corresponding to the passage of time. In the following description, the information corresponding to the time-lapse stored information (here, the water quality of the liquid LQ filled between the projection optical system PL and the substrate P on the substrate stage ST1) is measured by the measuring device 60. ) Expediently referred to as "third log information."

Further, in the present embodiment, the plurality of substrates P are sequentially exposed. When the plurality of substrates P are sequentially exposed, the control device CONT stores the measurement results of the measuring device 60 in the memory device MRY corresponding to the substrate P. In the following description, the information corresponding to the time lapse is stored (here, the liquid LQ filled between the projection optical system PL and the substrate P on the substrate stage ST1 when the plurality of substrates P are sequentially exposed) The water quality is measured by the measurement device 60 and is expediently referred to as "fourth log information".

Further, the control unit CONT stores the measurement result of the measuring device 60 in the memory device MRY corresponding to the exposed exposure area. The control device CONT can determine the position information of the exposure illumination area in the coordinate system defined by the laser interferometer 94, for example, based on the output of the laser interferometer 94 that performs the position measurement of the substrate stage ST1, and obtain the position information. The measurement result of the measuring device 60 when the exposure irradiation region is exposed corresponds to the irradiation exposure region to be stored in the memory device MRY. Moreover, since the point at which the liquid LQ is measured by the measuring device 60 and the time at which the measured liquid LQ is disposed on the substrate P (on the exposed irradiation region), the sampling port (branch tube) and the recovery port 22 of the measuring device 60 are used. The time difference occurs, and it is only necessary to consider the distance to correct the information stored in the memory device MRY. In the following description, the measurement result corresponding to the measuring device 60 stored in the exposure irradiation area is expediently referred to as "5th log information".

The control device CONT is based on the measurement result measured by the measuring device 60 for the liquid LQ filled between the projection optical system PL and the predetermined region 100 of the measurement stage ST2 in step SA2, and the projection optical system in step SA8. The liquid LQ filled between the PL and the substrate P is measured by the measuring device 60, and information about the substrate P is obtained as described below (step SA9).

Fig. 8 is a view showing an example of the substrate P. In FIG. 8, the substrate P has a base material 2 and a photosensitive material 3 covered with a part of the upper surface 2A of the base material 2. The substrate 2 includes, for example, a germanium wafer (semiconductor wafer). The photosensitive material 3 is covered with a predetermined thickness (for example, about 200 nm) in a region where most of the central portion of the upper surface 2A of the substrate 2 is occupied. On the other hand, the peripheral portion 2As of the upper surface 2A of the base material 2 is not covered with the photosensitive material 3, and the base material 2 is exposed at the peripheral portion 2As of the upper surface 2A. Further, the photosensitive material 3 is not coated on the side surface 2C and the lower surface (back surface) 2B of the substrate 2, but the photosensitive material 3 may be coated on the side surface 2C, the lower surface 2B, or the peripheral portion 2As. In the present embodiment, the photosensitive material 3 is a chemically amplified photoresist.

Once the substrate P comes into contact with the liquid LQ of the liquid immersion area LR, a portion of the substrate P is eluted into the liquid LQ. As described above, the photosensitive material 3 of the present embodiment is a chemically amplified photoresist, and the chemically amplified photoresist includes a base resin, a photoacid generator (PAG: Photo Acid Generator) contained in the base resin, and is called Formed by an amine-based substance of a quencher. When such a photosensitive material 3 comes into contact with the liquid LQ, a part of the photosensitive material 3, specifically PAG or an amine-based substance, is eluted into the liquid LQ. Further, even when the peripheral portion 2As of the substrate 2 is in contact with the liquid LQ, a part of the substrate 2 may be eluted into the liquid LQ depending on the type of the material constituting the substrate 2. In the following description, the substance (PAG, amine-based substance, hydrazine, etc.) eluted from the substrate P to the liquid LQ is expediently referred to as "eluting substance".

The liquid LQ measured by the measuring device 60 in step SA8 is the liquid LQ between the projection optical system PL and the substrate P, and is the liquid LQ after coming into contact with the substrate P. Therefore, the liquid LQ measured by the measuring device 60 contains the eluted material eluted from the substrate P into the liquid LQ. On the other hand, the liquid LQ measured by the measuring device 60 in the step SA2 is the liquid LQ whose contamination is suppressed, in other words, the liquid LQ which does not contain the eluted material. Therefore, the control device CONT can compare the measurement result measured in step SA2 with the measurement result measured in step SA8 to determine the elution substance eluted from the substrate P to the liquid LQ in the form of information about the substrate P. Information. Further, the third, fourth, and fifth log information includes information on the eluted material eluted from the substrate P to the liquid LQ.

The information on the eluted material eluted from the substrate P to the liquid LQ includes various information such as the elution amount of the eluted material and the physical property (type). The control device CONT can determine the eluted material eluted from the substrate P to the liquid LQ according to the measurement result of the water quality measured by the measuring device 60 in step SA2 and the measurement result about the water quality measured by the measuring device 60 in step SA8. The amount of dissolution.

For example, the control device CONT can determine the elution amount of the eluted material eluted from the substrate P, particularly the eluted material eluted from the photosensitive material 3, based on the measurement result of the TOC meter 61 in the measuring device 60. Alternatively, the elution amount of the eluted substance (the concentration of the eluted substance in the liquid LQ) is measured by a measuring device that previously sets the concentration of the eluted substance in the measurable liquid LQ as the measuring device 60. Therefore, the control unit CONT can determine the elution amount of the eluted material eluted from the substrate P to the liquid LQ based on the difference between the eluted amount of the eluted substance measured in step SA2 and the eluted amount of the eluted substance measured in step SA8.

Further, if the measuring device 60 is provided with a measuring device capable of measuring the type of eluted matter (photosensitive material 3, PAG, etc.) eluted from the substrate P, the type of the eluted substance can be specified.

As described above, the control device CONT can determine the information on the substrate P, such as the elution amount of the eluted material and the type of the photosensitive material 3, based on the measurement result of the measuring device 60.

Further, in the present embodiment, the relationship between the substrate condition and the elution amount of the eluted material for the liquid LQ is obtained in advance, and the relationship is stored in advance in the memory device MRY. The substrate conditions referred to herein include the conditions of the photosensitive material 3 such as the type of the photosensitive material 3, the physical properties (types) of the substrate 2, whether or not the peripheral portion 2As is formed (whether the substrate 2 and the liquid LQ are in contact with each other), and the like. The condition of the substrate 2. Moreover, the substrate contact also includes the coating conditions when the photosensitive material 3 is applied to the substrate 2, such as the film thickness of the photosensitive material 3.

In the present embodiment, the plurality of substrates P (batch) having the conditions of the different substrates are sequentially exposed, and the memory device MRY stores information on the elution amount of the eluted substances corresponding to the plurality of substrates P (batch). The amount of elution of the eluted material to the liquid LQ changes in accordance with the substrate condition (physical properties, film thickness, and the like of the photosensitive material 3). For example, the substrate condition and the elution of the eluted material to the liquid LQ can be performed in advance by experiments or simulations. The relationship between quantity.

Therefore, when the substrate P of the predetermined substrate condition is immersed and exposed, the measurement value of the measuring device 60 (the elution amount of the eluted material) is relative to the eluted amount of the eluted material corresponding to the predetermined substrate condition stored in the memory device MRY. In the case of a significant difference (when the measurement result of the measuring device 60 is abnormal), the control device CONT determines that the substrate P is in an abnormal state and can control the exposure operation.

Further, when the information on the substrate P held on the substrate stage ST1 is unknown, the measurement result of the measuring device 60 (for example, the TOC meter 61) and the storage information of the memory device MRY (substrate condition and eluted substance) may be used. The relationship with respect to the amount of elution of the liquid LQ is used to predict the information on the substrate P such as the type of the photosensitive material 3 on the substrate P to be measured and the coating conditions.

Further, as shown in FIG. 9, when the photosensitive material 3 is covered with the film 4, the amount of the eluted substance measured by the measuring device 60 becomes small. Here, the film 4 covering the photosensitive material 3 is an anti-reflection film (top ARC) or a surface coating film (protective film). Further, the film 4 may be a surface coating film which covers the antireflection film formed on the photosensitive material 3. The surface coating film is formed by isolating the photosensitive material 3 from the liquid LQ, for example, a fluorine-based liquid-repellent material. By providing the film 4, even if the substrate P comes into contact with the liquid LQ, elution of the eluted material from the photosensitive material 3 into the liquid LQ can be suppressed. In the case where the photosensitive material 3 is covered with the film 4, the difference between the measurement result in the step SA2 (the elution amount of the eluted material) and the measurement result in the step SA8 (the elution amount of the eluted material) is compared with the photosensitive material 3 It is small when it is not covered by the film 4. Therefore, the control unit CONT can determine whether or not the photosensitive material 3 is covered by the film 4 based on the measurement result of the measuring device 60. In this manner, the control unit CONT can determine whether or not the film 4 is used as information about the substrate P based on the measurement result of the measuring device 60.

Further, depending on the substance constituting the film 4, it is possible that a predetermined substance of the photosensitive material 3 is eluted into the liquid through the film 4, or a substance forming the material of the film 4 is eluted into the liquid. Therefore, the information on the substrate P obtained based on the measurement result of the measuring device 60 includes information such as the material (substance) of the film 4 in addition to the presence or absence of the film 4 on the photosensitive material 3.

In the present embodiment, the substrate conditions and the exposure conditions are optimized so that the elution amount of the eluted material eluted from the substrate P to the liquid LQ (the concentration of the eluted substance in the liquid LQ) is equal to or less than the allowable value obtained in advance. Settings. The exposure conditions referred to herein include the conditions of the liquid LQ, which include the physical properties (type) of the liquid LQ, the supply amount of the liquid LQ per unit time, the temperature of the liquid LQ, the flow rate of the liquid LQ on the substrate P, the substrate P and the liquid. Liquid contact time of LQ contact, etc. The substrate P can be well exposed as long as the elution amount of the eluted substance eluted from the liquid LQ (the concentration of the eluted substance in the liquid LQ) is equal to or less than the allowable value.

Here, in the following description, the allowable value of the liquid LQ water quality filled between the projection optical system PL and the substrate P is expediently referred to as a "second allowable value". The second allowable value means an allowable value that the liquid LQ water quality is affected by an object (here, the substrate P) disposed on the image plane side of the projection optical system PL.

The information on the second allowable value of the elution amount can be obtained in advance by, for example, an experiment or a simulation. When the elution amount of the eluted material eluted from the substrate P to the liquid LQ is equal to or higher than the second allowable value, the concentration of the eluted substance in the liquid LQ is increased to lower the liquid LQ transmittance, and the exposure light EL is not transparent to the liquid LQ. When the ground reaches the substrate P, the deterioration of the exposure accuracy of the permeated liquid LQ may occur. In addition, when the elution amount of the eluted material eluted from the substrate P to the liquid LQ is equal to or higher than the second allowable value, the member that is in contact with the liquid LQ (the nozzle member 70, the recovery tube 23, the first optical element LS1, etc.) may be used. It is contaminated, or the eluted substance is attached to the substrate P to become a foreign matter, and an adhesion mark (water mark) is formed. In the present embodiment, the elution amount of the eluted material eluted from the substrate P to the liquid LQ is controlled to be equal to or lower than the second allowable value to suppress the occurrence of the above-described inconvenience.

Further, in the present embodiment, the plurality of substrates P (batch) having different substrate conditions are sequentially exposed, and the memory device MRY stores information of the plurality of second allowable values corresponding to the plurality of substrates P (batch) in advance. In other words, the information on the second allowable value is stored in advance in the memory device MRY for each of the substrates P (per batch). For example, when the substrate P (batch) in which the first photosensitive material and the second photosensitive material are different in physical properties are sequentially exposed, even if the elution amount (concentration) of the eluted material of the first photosensitive material to the liquid LQ is The elution amount (concentration) of the second photosensitive material to the eluted material of the liquid LQ is the same, and depending on the physical properties (absorption coefficient, etc.) of the eluted material, for example, a liquid containing the eluted material of the first photosensitive material may be required. The transmittance, but the liquid containing the eluted material of the second photosensitive material does not have the desired transmittance. In the present embodiment, the second allowable value corresponding to each of the plurality of substrates P (batch) is obtained in advance, and the information on the second allowable value is stored in advance in the memory device MRY. As described above, in the present embodiment, the second allowable value for the eluted amount of the eluted material is individually obtained for each substrate (each batch), and stored in the memory device MRY.

In addition, in order to make the elution amount of the eluted substance eluted from the substrate P to the liquid LQ (the concentration of the eluted substance in the liquid LQ) equal to or less than the second allowable value obtained in advance, the liquid immersion area LR may be formed on the substrate P. For example, a predetermined process for suppressing the elution amount of the eluted substance of the liquid LQ eluted from the substrate P to the liquid immersion area LR by immersing the substrate P in the liquid LQ in which the liquid immersion area LR is not formed is performed in advance. Alternatively, by providing the film 4 as shown in FIG. 9, it is possible to suppress elution of the eluted material from the photosensitive material 3 into the liquid LQ, thereby suppressing adhesion of foreign matter to the substrate P or formation of adhesion marks, or suppression of contact with the liquid LQ. Contamination of the components (mouth member 70, recovery tube 23, etc.).

The control unit CONT determines whether or not the measurement result of the measuring device 60 is abnormal (step SA10). In other words, the control unit CONT determines whether or not the measured value (dissolved amount of the eluted substance) of the measuring device 60 is equal to or greater than the second allowable value based on the second allowable value of the eluted substance and the measurement result of the measuring device 60. Then, the control unit CONT controls the exposure operation in accordance with the aforementioned determination result.

In step SA10, when it is determined that the measurement result of the measuring device 60 is not abnormal, that is, the measurement result of the measuring device 60 (the elution amount of the eluted substance) is less than or equal to the second allowable value of the eluted substance obtained in advance. The control device CONT continues the liquid immersion exposure operation (step SA11). At this time, the control device CONT can inform the measurement device INF of the measurement result (monitoring information) by the notification device INF.

After the immersion exposure of the substrate P on the substrate stage ST1 is completed (step SA12), the control stage CONT moves the measurement stage ST2 using the measurement stage SD2 so that the measurement stage ST2 contacts (closes) toward the substrate stage ST1. Then, the liquid immersion area LR of the liquid LQ is moved from the upper surface 95 of the substrate stage ST1 toward the upper surface 97 of the measurement stage ST2. After the liquid immersion area LR of the liquid LQ is moved to the measurement stage ST2, the substrate stage ST1 is moved to the substrate replacement position. At the substrate replacement position, the exposed substrate P is unloaded from the substrate stage ST1, and the substrate P before exposure is loaded to the substrate stage ST1. Then, exposure processing is performed on the substrate P before the exposure.

Then, the control unit CONT repeats the above procedure to sequentially expose the plurality of substrates P. The first, second, third, fourth, and fifth log information is stored and stored in the memory device MRY. The log information can be used to analyze the poor exposure (error) (step SA13).

On the other hand, when it is determined in step SA10 that the measurement result of the measuring device 60 is abnormal, that is, the measurement result of the measuring device 60 (the elution amount of the eluted substance) is equal to or higher than the second allowable value of the eluted substance obtained in advance. At this time, the control unit CONT stops the exposure operation (step SA16). At this time, the control unit CONT can also drive the valve 13B provided in the supply pipe 13 to close the flow path of the supply pipe 13, and stop the supply of the liquid LQ. Further, after the exposure operation is stopped, the liquid LQ remaining on the substrate P can be recovered by the nozzle member 70 and the liquid recovery mechanism 20. Further, after the residual liquid LQ on the substrate P is recovered, the substrate P can be carried out (unloaded) on the substrate stage ST1. Thereby, it is possible to prevent a situation in which a large number of defective exposure areas (defective substrates) are formed due to continuous exposure processing in an abnormal state.

Further, the control unit CONT notifies the measurement result (monitoring information) of the measuring device 60 to the device INF (step SA17). For example, information on the elution amount of the eluted material caused by the photosensitive material 3 contained in the liquid LQ, information on the amount of change in the eluted material over time, and exposure to a specific exposure irradiation region in the plurality of exposure irradiation regions can be performed. The information on the eluted amount of the eluted substance contained in the liquid LQ (the concentration of the eluted substance in the liquid LQ) is displayed by the notification device INF including the display device. Further, when it is judged that the measurement result of the measuring device 60 is abnormal, the control device CONT can notify the device INF of an alarm (warning) or the like to inform the measurement result that the measurement result is abnormal. In addition, when the elution amount of the eluted material of the second allowable value or more is measured, the notification device INF can be used to notify the correction of the substrate condition (for example, the coating condition of the photosensitive material 3). Alternatively, when the elution amount of the eluted material having the second allowable value or more is measured on the substrate P, the notification device INF can be used to notify the correction of the exposure condition (for example, the supply amount of the liquid LQ unit time).

Moreover, when the measurement of the substance which should not be contained in the photosensitive material 3 used for this board|substrate P (batch) is carried out, it can be notified by the notification apparatus INF. In addition, when the measurement of the substance which should not be contained in the photosensitive material 3 used for the board|substrate P (batch) is carried out, the notification apparatus INF can be informed, and the thing of the inspection of the photosensitive material 3 can be informed. Further, when the film 4 should be coated with the film 4 and the elution amount of the eluted material is equal to or higher than the allowable value, the notification device INF can be used to notify whether or not the film 4 is covered, and whether the film 4 is coated or not is well covered. The gist of the matter.

Alternatively, the information on the amount of change in the concentration of the TOC and the dissolved gas contained in the liquid LQ with respect to the passage of time in the exposure of the substrate P, and the TOC contained in the liquid LQ during exposure to the specific exposure irradiation region in the plurality of exposure irradiation regions can be obtained. The information of the dissolved gas concentration is displayed by the notification device INF including the display device.

Further, in step SA10, even if it is judged that the liquid LQ is abnormal, the control unit CONT can continue the exposure operation. Further, for example, when a specific exposure irradiation region is exposed and it is determined that the measurement result of the TOC meter 61 of the measuring device 60 is abnormal, the control device CONT corresponds to the exposure irradiation region, and the TOC measurement result is abnormal. Information is stored in the memory device MRY. In addition, after the exposure is completed in all the exposure areas, according to the fifth log information stored in the memory device MRY, the control device CONT may cause pattern transfer accuracy due to abnormal measurement results (the elution amount of the eluted material is above the allowable value). The deteriorated exposure area is removed or measures such as avoiding exposure are performed at the time of the next overlapping exposure. Further, when the exposure irradiation region is inspected and it is found that the formed pattern is not abnormal, the exposure irradiation region is not removed, and the exposure irradiation region is continuously used to form the element. Alternatively, the control device CONT may correspond to the exposure irradiation region to notify the device INF to inform the TOC meter 61 that the measurement result is abnormal. As described above, the control device CONT can display the measurement result of the measurement device 60 in the form of monitoring information in real time by the notification device INF, and can also display the log information by the notification device INF.

On the other hand, in the present embodiment, in step SA3, when the measured value (water quality) of each item measured by the measuring device 60 is equal to or greater than a predetermined first allowable value, the control device CONT determines the measuring device 60. The measurement result is abnormal (water quality is abnormal). The first allowable value of the water quality can be appropriately determined in accordance with the exposure program executed after the measurement operation of the measuring device 60. For example, after the measuring operation of the measuring device 60 (step SA2), the measuring action is performed using the light measuring devices 300, 400, 500, 600 (step SA4), depending on the target of the light measuring device 300, 400, 500, 600 The first allowable value for the liquid LQ is appropriately set in accordance with the measurement accuracy. Specifically, when the plurality of batches (substrate P) are exposed, the light measurement operation is performed using the photometers 300, 400, 500, and 600 before the batch (substrate P) is exposed, and when the first batch (the first batch) is used When the first substrate (first substrate) is subjected to the measurement of the liquid LQ, the first allowable value of the liquid LQ water quality is strictly set. In addition, when the other second batch (second substrate) can be allowed to be wider than the first batch (first substrate), the second batch (second substrate) can be measured by the liquid LQ. The relaxation is set for the first allowable value of the liquid LQ water quality.

Alternatively, the second allowable value for the liquid LQ water quality can be appropriately set in accordance with the target exposure accuracy (target pattern transfer accuracy) of the substrate P. Specifically, when a plurality of batches (substrate P) are exposed, when the first batch (first substrate) is required to have high exposure accuracy (pattern transfer accuracy), the first batch (first substrate) is transmitted. When the liquid LQ is exposed, the second allowable value of the liquid LQ water quality is strictly set. In addition, when the other second batch (second substrate) can be allowed to have a wider exposure accuracy (pattern transfer accuracy) than the first batch (first substrate), the second batch (second substrate) can be used for the second batch (second substrate). When the exposure is performed through the liquid LQ, the second allowable value of the liquid LQ water quality is relaxed.

According to the above aspect, the required exposure accuracy and measurement accuracy can be obtained in the first and second batches (the first and second substrates), and the operation efficiency of the exposure apparatus EX can be prevented from being lowered. In other words, the first and second allowable values for the water quality of the first batch and the first and second allowable values for the water quality of the second batch are set to the same value, which is required for the second batch. Water quality. In this way, even if the required water quality is obtained for the second batch, the measurement result of the measuring device 60 is equal to or higher than the first allowable value or the second allowable value. As described above, the measurement operation or the exposure operation is stopped. Therefore, even if the required water quality is obtained, the operation of the exposure apparatus EX is stopped, which may result in a decrease in the operational efficiency of the exposure apparatus EX. However, it is possible to appropriately set the allowable value of the water quality of the liquid LQ according to the target exposure accuracy or the like as described above. The operating efficiency of the exposure device EX is not good.

As described above, at least one of the properties and components of the liquid LQ filled between the projection optical system PL and the predetermined region 100 of the measurement stage ST2 is measured by providing the measuring device 60, and the measurement can be performed according to the measurement. As a result, it is determined accurately whether or not the liquid LQ filled in the optical path space K1 is in a desired state (whether abnormal). Furthermore, when the measurement result of the measuring device 60 is abnormal, the exposure precision of the substrate P through the liquid LQ and the light measurement through the liquid LQ can be prevented by adjusting the liquid LQ to a desired state by taking appropriate measures. The measurement accuracy of the device deteriorates.

Further, in the present embodiment, the liquid LQ disposed in the predetermined area 100 is stored in the memory device MRY as the first and second log information as measured by the measuring device 60, and is disposed on the substrate P. The result of the measurement of the liquid LQ by the measuring device 60 is stored in the memory device MRY in the form of the third, fourth, and fifth log information. For example, each of the adjustment devices (the liquid reforming member and the liquid reforming device) constituting the liquid supply unit 11 can be repaired (inspected and replaced) at the most extreme point in accordance with the first and second log information. Further, the frequency of inspection and replacement corresponding to each adjustment device can be optimally set based on the first and second log information. For example, when it is found from the first log information that the measured value (foreign matter amount) of the particle counter deteriorates with time, the optimum replacement period of the particle filter can be predicted and set according to the degree of change of the measured value with time (replacement) frequency). Moreover, the performance of the used particle filter can be optimally set by the first and second log information. For example, when the measured value of the particle counter deteriorates rapidly with time, a high-performance particle filter is used, but there is no significant change, and a lower-performance (cheap) particle counter can be used. Seek to reduce costs. As described above, the exposure apparatus EX is managed based on the first and second log information, thereby preventing excessive (unnecessary) maintenance from causing a decrease in the operation rate of the exposure apparatus or neglecting the maintenance and not supplying the desired state. This poor condition of liquid LQ occurs.

Moreover, since the first log information is water quality information corresponding to the passage of time, it is possible to specify when the water quality deteriorates. Therefore, the cause of the occurrence of the exposure failure can be analyzed in accordance with the passage of time. Similarly, the use of the second log information can also explain the cause of poor (error) such as poor exposure. When the substrate P is inspected by the inspection step of the subsequent step after the substrate P is exposed, the inspection result is compared with the first and second log information, and the reason for the poor condition is analyzed and specified.

Moreover, the first and second log information are not necessarily obtained, and only one of them may be obtained.

Moreover, the third log information corresponds to the water quality information of the passage of time, so the amount of change of the eluted substance over time can be obtained based on the third log information. Further, when the amount of fluctuation significantly increases with time, it can be judged that the photosensitive material 3 is soluble for the liquid LQ. Moreover, when a lot of poor exposure (pattern defects) occurs in a specific batch or a specific exposure area, refer to the fourth log information (or the fifth log information), and the TOC when the batch (or the exposure area) is exposed. When the measured value is an abnormal value, the cause of the pattern defect is the eluted substance. In addition, for example, after the exposure is completed based on the fourth log information, for example, the substrate P exposed when the measurement result of the measuring device 60 is abnormal may be subjected to a key inspection or the like. Further, when it is determined according to the fifth log information that the liquid LQ is abnormal during the exposure in the specific exposure irradiation region, the control device CONT may remove the specific exposure irradiation region or not perform exposure at the next overlapping exposure. Measures. Alternatively, the control unit CONT may also issue an instruction to the inspection device that performs the inspection step to require more detailed examination of the particular exposure illumination area described above. In addition, the correlation between the pattern defect and the eluted substance can be analyzed based on the third, fourth, and fifth log information, thereby specifying the cause of the poor condition (pattern defect). In addition, measures such as correcting substrate conditions or exposure conditions may be adopted according to the analysis result to avoid occurrence of pattern defects.

Moreover, the third, fourth, and fifth log information are not necessarily all obtained, and one of the third, fourth, and fifth log information or the plural information may be omitted.

Moreover, the control device CONT can control the exposure action and the measurement action according to the measurement result of the measurement device 60. For example, as described above, the exposure amount (illuminance) of the exposure light EL is measured using the photometer 600 before the exposure of the substrate P (step SA4), and the exposure amount (illuminance) of the exposure light EL is used in accordance with the measurement result. After the setting (correction) is the optimum level, the exposure operation is started. For example, in the exposure of the substrate P, the transmittance of the liquid LQ changes due to the TOC fluctuation in the liquid LQ. When the light transmittance of the liquid LQ fluctuates, the exposure amount (accumulated exposure amount) on the substrate P fluctuates, and as a result, the exposure line width of the element pattern formed in the exposure irradiation region may be uneven. Happening. The relationship between the TOC of the liquid LQ and the transmittance of the liquid LQ at this time is obtained in advance and stored in the memory device MRY, and the control device CONT can control the exposure amount according to the storage information and the measurement result of the measuring device 60 (TOC meter 61). In order to prevent the above-mentioned bad situation. That is, the control unit CONT derives the transmittance corresponding to the TOC fluctuation in the liquid LQ based on the stored information, and controls the amount of exposure to the substrate P to be constant. The exposure amount on the substrate P is controlled in accordance with the TOC change measured by the TOC meter 61, whereby the exposure amount in the substrate (exposure irradiation section) or between the substrates is constant, and variation in the exposure line width can be suppressed. Further, the relationship between the transmittance of the TOC and the liquid LQ can be obtained by the measurement process using the light measuring device 600 through the liquid LQ. In the present embodiment, since the exposure light EL uses a laser, the amount of light per one pulse (the amount of light) can be controlled, or the number of pulses can be controlled, and the amount of exposure on the substrate P can be controlled by the method. . Alternatively, the amount of exposure on the substrate P can be controlled by controlling the scanning speed of the substrate P.

Further, the control unit CONT can control the exposure operation and the measurement operation based on the first log information. For example, when it is judged according to the first log information that the TOC value gradually deteriorates with time, the exposure device EX can display the exposure amount according to the value (change amount) corresponding to the TOC time value stored in the form of the first log information. It is controlled over time to adjust the exposure amount between the substrates P to be constant, and to reduce the unevenness of the exposure line width.

On the other hand, as shown in FIG. 1, the liquid supply mechanism 10 in the exposure apparatus EX is provided with the functional liquid supply apparatus 120. The control unit CONT can supply the functional liquid LK from the functional liquid supply device 120 of the liquid supply mechanism 10 according to the first log information or the measurement result of the measuring device 60 for each member that is in contact with the liquid LQ forming the liquid immersion area LR. Wash these components. For example, when the amount of bacteria in the liquid LQ is excessive, and the liquid LQ is not in a desired state but is contaminated, the members in contact with the liquid LQ, specifically, the lower portion 70A of the nozzle member 70, the mouth The internal flow path of the member 70, the supply tube 13 connected to the nozzle member 70, the recovery tube 23, the lower surface LSA of the first optical element LS1, the upper surface 95 of the substrate stage ST1, and the upper surface 97 of the measurement stage ST2 (including the optical measuring device) Each of 300, 400, 500, 600 and a predetermined area 100) may be contaminated. Then, once the members are contaminated, even if the clean liquid LQ is supplied from the liquid supply portion 11, the liquid LQ may be contaminated by contact with the member, and the liquid immersion area LR may be caused by the contaminated liquid LQ. The exposure accuracy and measurement accuracy of the liquid LQ are deteriorated.

Further, when the liquid immersion area LR of the liquid LQ is formed on the substrate P, the liquid LQ contains eluted substances such as PAG eluted from the substrate P. Therefore, the nozzle member 70 that is in contact with the liquid LQ containing the eluted material easily adheres to the contaminant generated by the eluted substance, and in particular, the contaminant is easily attached to the vicinity of the recovery port 22 of the nozzle member 70. Further, when the recovery port 22 is provided with a porous body, the porous body is also likely to adhere to a contaminant. If the state in which the contaminant is adhered is continued, even if the clean liquid LQ is supplied to the optical path space K1, the supplied liquid LQ is contaminated by contact with the contaminated nozzle member 70 or the like.

Therefore, the control unit CONT determines whether or not the member in contact with the liquid LQ is cleaned based on the measurement result of the measuring device 60. That is, in step SA3, depending on the measurement result of the measuring device 60, when it is judged that the measured value is larger than the first allowable value (or the second allowable value or the allowable value for washing), the control device CONT will The functional liquid LK having a washing action (or a sterilizing action) is supplied from the functional liquid supply device (cleaning device) 120 constituting a part of the liquid supply mechanism 10 to wash the respective members.

When the functional liquid LK is supplied from the functional liquid supply device 120, the control device CONT causes the lower LSA of the projection optical system PL to face the upper surface 97 of the measurement stage ST2 or the upper surface 95 of the substrate stage ST1. Alternatively, the dummy substrate DP to be described later may be held on the substrate stage ST1 such that the lower surface LSA of the projection optical system PL faces the dummy substrate DP of the substrate stage ST1.

When the above-described respective members are washed, the control unit CONT drives the second valve 19B provided at the supply pipe 19 that connects the functional liquid supply device 120 and the liquid supply unit 11 to open the flow path of the supply pipe 19, and The flow path of the return pipe 18 is closed by the first valve 18B. Thereby, the functional liquid LK is supplied from the functional liquid supply device 120 to the liquid supply portion 11. The functional liquid LK supplied from the functional liquid supply device 120 flows through the supply pipe 13 and the internal flow path (supply flow path) of the nozzle member 70 after flowing through the liquid supply portion 11, and is supplied from the supply port 12 to the projection optics. The image side of the system PL. Further, when the functional liquid supply device 120 supplies the functional liquid LK, the liquid recovery mechanism 20 performs the liquid recovery operation in the same manner as in the liquid immersion exposure operation. Therefore, the functional liquid LK filled on the image plane side of the projection optical system PL is recovered through the recovery port 22, flows through the recovery pipe 23, and is recovered in the liquid recovery portion 21. The functional liquid LK is washed by the flow path (supply tube 13, recovery tube 23, nozzle member 70, etc.) flowing through the liquid immersion mechanism 1.

Further, the functional liquid LK that is filled on the image plane side of the projection optical system PL is also in contact with the lower surface (liquid contact surface) LSA of the first optical element LS1 and the lower surface (liquid contact surface) 70A of the nozzle member 70. The lower LSA, 70A can be washed. Further, in a state in which the liquid immersion area of the functional liquid LK is formed, the measurement stage ST2 (or the substrate stage ST1) is moved in a two-dimensional space with respect to the liquid immersion area of the functional liquid LK in the XY direction, and the measurement load can be performed. The wide area of the upper surface 97 of the stage ST2 or the upper surface 95 of the substrate stage ST1 is also cleaned. In this manner, the liquid immersion area forming operation of the functional liquid LK is performed in the same order as in the liquid immersion exposure operation, whereby the above-described respective members can be simultaneously washed with high efficiency.

In the order of the cleaning process using the functional liquid LK, after supplying the functional liquid LK from the functional liquid supply device 120, the supply and recovery operation of the functional liquid LK for a predetermined period of time is continued in the same order as in the immersion exposure operation. The image side of the projection optical system PL forms a liquid immersion area of the functional liquid LK. Further, the flow path of the liquid supply mechanism 10 and the liquid recovery mechanism 20 may be passed after the functional liquid LK is heated. Then, after a predetermined period of time, the supply and recovery operation of the functional liquid LK is stopped. In this state, the functional liquid LK is held on the image plane side of the projection optical system PL, and is in an immersed state. Then, after the immersed state is maintained for a predetermined period of time, the control device CONT performs the pure water supply and recovery operation for a predetermined period of time by the liquid supply mechanism 10 and the liquid recovery mechanism 20, and forms a pure water immersion area on the image side of the projection optical system PL. . Thereby, the flow paths of the liquid supply mechanism 10 and the liquid recovery mechanism 20 respectively flow through the pure water, and the pure water is used to wash the flow paths. Further, the lower surface LSA of the first optical element LS1 and the lower surface 70A of the nozzle member 70 can be washed by the liquid immersion area of pure water.

Further, after the cleaning process is completed, the control device CONT fills the projection optical system PL and the predetermined region 100 of the measurement stage ST2 with the liquid LQ using the liquid immersion mechanism 1, and the measurement device 60 measures the liquid LQ. It is confirmed whether or not the washing process is performed satisfactorily, that is, whether the liquid LQ is in a desired state.

The functional liquid LK is preferably formed of a material that does not affect the aforementioned members. In the present embodiment, hydrogen peroxide water is used for the functional liquid LK. Further, among the members described above, the member formed of the material having no resistance to the functional liquid LK may be removed before the cleaning treatment with the functional liquid LK.

In the present embodiment, the case where the cleaning operation is performed by controlling the operation of the liquid supply mechanism 10 including the functional liquid supply device 120 in accordance with the measurement result of the measuring device 60 has been described, but it is of course possible to adopt, for example, every predetermined time interval. (For example, every month, every one year), the composition of the washing process is performed. Further, the contamination source of the above-mentioned member (the nozzle member 70, the first optical element LS1, and the like) which is in contact with the liquid LQ is contaminated not only by the contaminated liquid LQ or the eluted substance from the substrate P, for example, impurities floating in the air adhere to the foregoing. It is also possible for the component to contaminate the aforementioned components. Even in such a case, contamination of the member can be prevented or even contamination of the liquid LQ in contact with the member can be prevented as long as the cleaning process is performed every predetermined time interval regardless of the measurement result of the measuring device 60.

Further, in the first embodiment described above, the water quality measurement when the liquid immersion area is formed on the substrate P may be omitted. That is, steps SA9 to SA11, SA16, and SA17 in the flowchart of FIG. 6 can be omitted.

<Second embodiment>

Next, a second embodiment will be described. In the following description, the same or equivalent components as those in the above-described first embodiment are denoted by the same reference numerals, and their description will be omitted or omitted.

In the first embodiment, the projection optical system PL and the predetermined region 100 of the measurement stage ST2 are filled with the liquid LQ, and the water quality of the liquid LQ is measured in this state (step SA2), and based on the measurement result, it is judged. When the water quality of the liquid-free LQ is abnormal (step SA3), at least one of the light measuring devices 300, 400, 500, and 600 is used for the measurement operation. In the present embodiment, as shown in FIG. 10, the control unit CONT is filled with the liquid LQ between the projection optical system PL and the optical measuring device on the measuring stage ST2 (exemplified here as the sensor 400). In the state, the measurement operation is performed by the sensor 400 such that the measurement operation of the sensor 400 is parallel to at least a portion of the water quality measurement operation of the measurement device 60. That is, the control device CONT supplies and collects the liquid LQ by the liquid immersion mechanism 1 in a state where the projection optical system PL is opposed to the upper surface 401 of the sensor 400 mounted on the measurement stage ST2. Thereby, the optical path space K1 between the projection optical system PL and the sensor 400 is filled with the liquid LQ, the sensor 400 can perform measurement processing through the liquid LQ, and the measuring device 60 can be recovered by the liquid recovery mechanism 20. The water quality of the liquid LQ is measured. As described above, the upper surface 401 of the sensor 400 is covered with, for example, "Saipu (registered trademark)", and is formed so as not to contaminate the liquid LQ. Therefore, the measuring device 60 can measure the liquid LQ whose pollution is suppressed. Here, the case where the measurement operation of the sensor 400 and the measurement operation of the measuring device 60 are parallel is taken as an example, but of course, the measurement action of the reference member 300, the sensors 500, 600, and the measuring device 60 can also be made. Measurement actions are parallel.

As described above, by performing the measurement operation of the light measuring device through the liquid LQ in parallel with the water quality measuring operation of the measuring device 60, the measurement processing time using the measuring stage ST2 can be shortened, and the yield can be improved.

<Third embodiment>

Next, the third embodiment will be described. In the above embodiment, when the water quality of the liquid LQ is measured using the measuring device 60, the control device CONT performs the liquid LQ with the liquid immersion mechanism 1 in a state where the projection optical system PL and the measurement stage ST2 are opposed to each other. Supply and recovery, but as shown in FIG. 11, in the state where the projection optical system PL is opposed to the dummy substrate DP held by the substrate stage ST1, the liquid immersion mechanism 1 supplies the liquid LQ and For recycling, the measuring device 60 measures the liquid LQ in contact with the dummy substrate DP. The dummy substrate DP is a member different from the substrate P for manufacturing the element, and has substantially the same size and shape as the substrate P. Further, at least the region in contact with the liquid LQ among the upper surfaces of the dummy substrate DP is formed so as not to contaminate the liquid LQ. In the present embodiment, the PFA process is applied to the upper surface of the dummy substrate DP in the same manner as in the first embodiment. Thereby, the measuring device 60 can accurately measure the water quality of the liquid LQ without being affected by the object disposed on the image plane side of the projection optical system PL (in this case, the dummy substrate DP).

Alternatively, a partial region (or all regions) of the upper surface 95 of the substrate stage ST1 may be formed by, for example, PFA treatment so as not to contaminate the liquid LQ, and when the measuring device 60 is used to measure the water quality of the liquid LQ, the projection optics is made. The system PL is supplied and recovered by the liquid immersion mechanism 1 in a state in which the system PL is opposed to the upper surface 95 of the substrate stage ST1, and the water quality is measured by the measuring device 60.

Alternatively, the liquid immersion mechanism 1 may supply and recover the liquid LQ in a state in which the predetermined member other than the substrate stage ST1 and the measurement stage ST2 and the projection optical system PL are opposed to each other, and may be measured by the measuring device 60. Water quality. At this time, the predetermined member has a predetermined region formed in such a manner that the liquid LQ is not contaminated. Further, the predetermined member may be movably provided on the image plane side of the projection optical system PL by a driving device including an actuator.

Further, the measuring device 60 may be provided on the measurement stage ST2. At this time, the measuring device 60 includes a measuring device (TOC meter, particle counter, etc.) embedded in the measuring stage ST2 and a sampling port (hole) provided on the upper surface 97 of the measuring stage ST2. When the liquid LQ is measured by the measuring device, the liquid immersion area LR of the liquid LQ is formed on the image side of the projection optical system PL, so that the liquid immersion area LR moves relative to the measurement stage ST2, and the liquid immersion area LR is disposed on the sampling port. The liquid LQ is caused to flow into the sampling port. The meter measures the liquid LQ obtained through the sampling port. Here, the PFA process is performed on the upper surface 97 of the measurement stage ST2, and is formed so as not to contaminate the liquid LQ. Even with such a configuration, the measuring device 60 can accurately measure the water quality of the liquid LQ. Similarly, the measuring device 60 may be provided on the substrate stage ST1.

<Fourth embodiment>

Next, the fourth embodiment will be described with reference to Fig. 12 . The feature of this embodiment is that the measuring device 60 (60A, 60B) measures the water quality of the liquid LQ by measuring a plurality of (here, two) measuring positions in the flow path of the liquid immersion mechanism 1.

In Fig. 12, the liquid immersion mechanism 1 is provided with a supply pipe 13 for supplying the liquid LQ, and a recovery pipe 23 for recovering the liquid LQ. Further, the measuring device 60 includes a first measuring device 60A for measuring the water quality of the liquid LQ at a predetermined position (first position) C1 of the supply pipe 13, and a predetermined position (second position) for the recovery pipe 23. The second measuring device 60B that measures the water quality of the liquid LQ of C2. The first and second measuring devices 60A and 60B have substantially the same configuration as the measuring device 60 of the first embodiment described with reference to Fig. 5 . The measuring device 60 measures the water quality of the liquid LQ at the first position C1 and the second position C2 among the flow paths constituting the liquid immersion mechanism 1 by using the first and second measuring devices 60A and 60B, respectively. The measurement results of the first and second measuring devices 60A, 60B are output to the control device CONT.

The control device CONT can measure the water quality of the liquid LQ according to the measurement result of the first measuring device 60A (that is, the water quality measurement result of the liquid LQ at the first position C1) and the second measuring device 60B (that is, the liquid LQ at the second position C2). As a result, the state of the flow path between the first position C1 and the second position C2 among the liquid immersion mechanisms 1 is obtained. In the present embodiment, the nozzle member 70 is provided between the first position C1 and the second position C2 among the flow paths constituting the liquid immersion mechanism 1. Therefore, the control unit CONT can determine the state of the nozzle member 70 based on the measurement results of the first and second measuring devices 60A and 60B. Specifically, the control device CONT can obtain the contamination state of the flow path including the nozzle member 70 between the first position C1 and the second position C2 based on the measurement results of the first and second measurement devices 60A and 60B.

When the control device CONT obtains the contamination state of the flow path between the first position C1 and the second position C2 by using the first and second measurement devices 60A and 60B, the control unit CONT is such that the lower side of the projection optical system PL LSA (mouth) The lower surface 70A) of the member 70 is in a state of being opposed to the predetermined region 100 of the upper surface 97 of the measurement stage ST2, and the liquid immersion mechanism 1 supplies and recovers the liquid LQ, and the projection optical system PL and the predetermined region 100 are The liquid LQ is full. Thereby, the measuring device 60 (the second measuring device 60B) is not affected by the object disposed on the image plane side of the projection optical system PL, and can measure the water quality of the liquid LQ, and can accurately measure the first position C1 and the second position. The state of the flow between positions C2.

When the flow path between the first position C1 and the second position C2 is contaminated, the control device CONT can be based on the difference between the measurement result of the first measuring device 60A and the measurement result of the second measuring device 60B. The flow path contamination state between the first position C1 and the second position C2 including the nozzle member 70 is obtained from the measurement results of the first and second measuring devices 60A and 60B. When the flow path between the first position C1 and the second position C2 is contaminated, for example, an organic substance is present inside the recovery pipe 23 or inside the recovery flow path (internal flow path) of the nozzle member 70. The measured value of the TOC meter of the second measuring device 60B becomes larger than the measured value of the TOC meter of the first measuring device 60A. Therefore, the control unit CONT can determine the contamination state of the flow path between the first position C1 and the second position C2 based on the measurement results of the first and second measurement devices 60A and 60B.

A nozzle member 70 (a supply port 12 for supplying the liquid LQ to the optical path space K1 and a recovery port 22 for recovering the liquid LQ of the optical path space K1) is disposed between the first position C1 and the second position C2, When the flow path between the first position C1 and the second position C2 is contaminated, the liquid LQ is contaminated by the flow path, and the contaminated liquid LQ is filled in the optical path space K1.

Therefore, the control unit CONT determines whether or not the flow path between the flow path constituting the liquid immersion mechanism 1, in particular, between the first position C1 and the second position C2, is repaired based on the measurement result of the measuring device 60. Specifically, the control device CONT determines whether or not there is an abnormality in the measurement result of the measurement device 60 (the difference between the measured value of the first measuring device 60A and the measured value of the second measuring device 60B), and determines whether or not to perform maintenance based on the determination result.

Here, the measurement result of the measuring device 60 is abnormal, and the difference between the measured value of the first measuring device 60A and the measured value of the second measuring device 60B is equal to or greater than the allowable value set in advance, and the liquid LQ flows through The flow path between the first position C1 and the second position C2 causes the state (water quality) to be no longer in a desired state. When the liquid LQ is filled in the optical path space K1, the exposure processing and measurement processing of the liquid LQ cannot be performed. The condition to be carried out in the state of need. Information about this allowable value can be obtained in advance by, for example, experiment or simulation.

As described above, the nozzle member 70 is easily contaminated by contact with the liquid LQ containing the eluted substance eluted from the substrate P. If the contamination of the nozzle member 70 is ignored, even if the clean liquid LQ is supplied to the optical path space K1, the supplied liquid LQ is contaminated by contact with the contaminated nozzle member 70 or the like. In the present embodiment, by arranging the nozzle member 70 between the first position C1 and the second position C2, the control unit CONT can accurately determine the nozzle member based on the measurement results of the first and second measuring devices 60A and 60B. 70 pollution status. Further, when the nozzle member 70 is contaminated, the nozzle member 70 can be cleaned by appropriate measures to maintain the liquid LQ filled in the optical path space K1 in a desired state.

The control device CONT is based on the measurement result of the measuring device 60 (the first and second measuring devices 60A, 60B), that is, the measurement result of the measuring device 60 (the measured value of the first measuring device 60A and the second measuring device 60B) The difference between the values is determined as to whether or not the result of the determination is abnormal. When it is judged that the flow path maintenance between the first position C1 and the second position C2 is to be performed, a predetermined maintenance work is performed. In the same manner as in the first embodiment, the functional liquid LK having the cleaning function supplied from the functional liquid supply device 120 flows through the flow path of the liquid immersion mechanism 1 (including the first position C1 and the first The flow path between the two positions C2) is used to clean the flow path. Alternatively, in terms of maintenance work, it is also possible to separate the nozzle member 70 from the supply tube 13 and the recovery tube 23, that is, to remove the nozzle member 70 from the exposure device EX to distinguish it from other predetermined cleaning devices of the exposure device EX. The operation of washing the mouth member 70. Alternatively, in the maintenance work, an operation of replacing the nozzle member 70 with a new (clean) member, a washing operation by an operator, or the like may be mentioned.

Further, after the maintenance work is performed, the control device CONT can supply and collect the liquid LQ by the liquid immersion mechanism 1, and measure the water quality of the liquid LQ at the first and second positions C1 and C2, and check whether or not the flow path including the nozzle member 70 is included. Clean.

In the present embodiment, the state of the flow path between the first position C1 and the second position C2 including the nozzle member 70 is measured, but it is of course possible to exclude the nozzle member 70 from the flow path of the liquid immersion mechanism 1. The flow path state between any measurement positions is measured. For example, the state of the supply pipe 13 can be obtained by considering the vicinity of the connection position with the liquid supply portion 11 in the supply pipe 13 as the first position C1 and the vicinity of the position at which the nozzle member 70 is connected as the second position C2. Further, depending on the measurement result of the measuring device, for example, the supply pipe 13 flows through the functional liquid LK, or the supply pipe 13 is removed from the exposure device EX to be cleaned by the cleaning device, or the supply pipe 13 is replaced with a new one. (Clean) pipe fittings, such measures are taken.

Further, in the present embodiment, the measuring device 60 measures the liquid LQ water quality at the first and second positions C1 and C2 among the flow paths of the liquid immersion mechanism 1, but it is of course possible to apply the liquid immersion mechanism 1 The liquid LQ water quality at any of the three positions above the flow path is measured. At this time, the measuring device is set at a plurality of predetermined positions of the flow path of the liquid immersion mechanism 1, and the control device CONT can determine the flow paths between the respective measurement positions according to the measurement results of the individual liquid LQ water quality with respect to the plurality of measurement positions. status.

As described above, the control device CONT can use the measuring device 60 to measure the liquid LQ water quality at a plurality of measurement positions along the flow direction of the liquid LQ among the flow paths of the liquid immersion mechanism 1, and obtain the water quality measurement results according to the respective measurement positions. The state of the flow path between each measurement position. Thereby, it is possible to specify where the liquid LQ water quality changes in the flow path constituting the liquid immersion mechanism 1, and the cause of the change can be easily clarified. Further, the control unit CONT can specify an abnormality in the interval according to the measurement result of each measuring device. Then, the purpose of the abnormality in a certain section is notified by the notification device INF, whereby the section can be promptly investigated to seek to return to the normal state from the abnormal state as early as possible.

<Other Embodiments>

Further, the measuring device 60 in the first to fourth embodiments is always attached to the exposure device EX, but the measuring device 60 may be connected to the exposure device EX, for example, at the time of maintenance of the exposure device EX or at a predetermined time. The tube 13 or the recovery tube 23) measures the water quality of the liquid LQ periodically or irregularly.

In the first to fourth embodiments, the measuring device 60 has a plurality of measuring devices (61, 62, 63, 64), and the individual tubes passing through the plurality of branch pipes are connected to the collecting pipe 23 (or the supply pipe 13). For example, a branch pipe (branch portion) may be provided in the recovery pipe 23 (or the supply pipe 13), and the two branch portions may be sequentially connected while replacing the plurality of measuring devices (61, 62, 63, 64). Water quality measurement of liquid LQ. Further, in the second embodiment, the first measuring device 60A is connected to the supply pipe 13 through the branch pipe, and the second measuring device 60B is connected to the recovery pipe 23 via the branch pipe, but it is also possible to have one measuring device. The first position C1 of the supply pipe 13 and the second position C2 of the recovery pipe 23 are connected, and the flow path is switched by using a valve or the like, thereby measuring the liquid LQ water quality at the first position C1 (second position C2). The liquid LQ water quality at the second position C2 (first position C1) is measured.

<Other Embodiments>

Further, in the first to fourth embodiments, the measuring device 60 is always attached to the exposure device EX, but the measuring device 60 may be connected to the exposure device EX at the time of maintenance of the exposure device EX or at a predetermined time. The tube 13 or the recovery tube 23) performs the water quality measurement of the liquid LQ periodically or irregularly.

In the first to fourth embodiments described above, the measuring device 60 has a plurality of measuring devices (61, 62, 63, 64) connected to the collecting pipe 23 (or the supply pipe 13) through individual branch pipes of the plurality of branch pipes. Alternatively, for example, a branch pipe (branch portion) may be provided in the recovery pipe 23 (or the supply pipe 13), and the plurality of measuring devices (61, 62, 63, 64) may be replaced while the two branch portions are replaced. Connect to perform water quality measurement of liquid LQ. Further, in the second embodiment, the first measuring device 60A is connected to the supply pipe 13 through the branch pipe, and the second measuring device 60B is connected to the recovery pipe 23 via the branch pipe, but it is also possible to have one measuring device. The first position C1 of the supply pipe 13 and the second position C2 of the recovery pipe 23 are connected, and the flow path is switched by using a valve or the like, thereby measuring the liquid LQ water quality at the first position C1 (second position C2). The liquid LQ water quality at the second position C2 (first position C1) is measured.

In the above-described first to fourth embodiments, when the measurement of the growth component in the liquid LQ is desired, the supplied liquid LQ may be sampled at a predetermined timing, and the measurement device separately provided from the exposure device EX may be used. (Analytical device) to measure (analyze) the liquid LQ. Further, even in the case of measuring fine particles, bubbles, dissolved oxygen, or the like, the liquid LQ may be sampled at a predetermined timing without using the in-line mode, and measurement may be performed using a measuring device provided separately from the exposure device EX. Alternatively, for example, a valve may be provided in the branch pipes 61K to 64K in advance, and by operating the valve, the liquid LQ flowing through the supply pipe 13 flows into the measuring device 60 at a predetermined timing, and the liquid LQ is intermittently measured. On the other hand, if the liquid LQ flowing through the supply pipe 13 is constantly supplied to the measuring device 60 for continuous measurement, stabilization of the measurement by the measuring device 60 can be achieved.

In the above-described first to fourth embodiments, the branch pipes 61K, 62K, 63K, and 64K are connected to the recovery pipe 23 located between the liquid recovery part 21 and the nozzle member 70, and the measuring device 60 is branched from the recovery pipe 23. The liquid LQ is measured. At this time, it is preferable that the branch pipe is disposed as close as possible to the nozzle member 70 (near the recovery port 22).

In the above-described first to fourth embodiments, the branch pipes 61K, 62K, 63K, and 64K have a function of sampling the sampling port of the liquid LQ flowing through the recovery pipe 23, and the liquid LQ measured by the measuring device 60 is used in the nozzle. The sample flow path branched in the middle of the recovery pipe 23 between the member 70 and the liquid recovery unit 21 may be sampled, but a sampling port may be installed in the vicinity of the recovery port 22 of the nozzle member 70, for example, and the measuring device 60 may be used to collect the flow. The liquid LQ near the port 22 is measured.

As described above, the liquid LQ in the present embodiment uses pure water. Pure water can be easily obtained from a large number of semiconductor manufacturing plants, and has no adverse effect on the photoresist or the optical element (lens) on the substrate P, which is an advantage. Further, since pure water does not adversely affect the environment and the impurity content is extremely low, it is expected to wash the surface of the substrate P and the surface of the optical element provided on the end surface of the projection optical system PL. Further, when the purity of the pure water supplied by the factory or the like is low, the exposure apparatus can be provided with an ultrapure water maker.

Further, since pure water (water) has a refractive index n of about 1.44 for the exposure light EL having a wavelength of about 193 nm, and when the light source for the exposure light EL uses ArF excimer laser light (wavelength: 193 nm), the substrate P is used. A high resolution of 1/n, that is, short wavelength to about 134 nm can be obtained. Furthermore, since the depth of focus is enlarged to about n times (i.e., about 1.44 times) in the air, the projection optical system PL can be further increased by ensuring that the depth of focus is the same as that in the air. The numerical aperture also contributes to the increase in resolution.

In the present embodiment, the optical element LS1 is attached to the front end of the projection optical system PL, and the optical characteristics of the projection optical system PL, for example, aberration (spherical aberration, coma aberration) can be adjusted by the lens. Further, the optical element mounted on the front end of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Alternatively, it may be a parallel plane plate that can penetrate the exposure light EL.

Further, when the pressure between the optical element at the tip end of the projection optical system PL and the substrate P due to the flow of the liquid LQ is large, the optical element may be non-replaceable, but may be firmly moved without being pressed by pressure. Fixed.

Further, in the present embodiment, the liquid crystal LQ is filled between the projection optical system PL and the surface of the substrate P, but for example, a cover glass made of a parallel flat plate may be attached to the surface of the substrate P. Filled with liquid LQ.

Further, in the projection optical system of the above-described embodiment, the optical path space on the image plane side of the optical element at the front end is filled with a liquid, but the light of the front end optical element as disclosed in the pamphlet of International Publication No. 2004/019128 may be used. The optical path space on the cover side is also a projection optical system filled with liquid.

Further, the liquid LQ in the present embodiment is water, but may be a liquid other than water. For example, when the light source of the exposure light EL is a F ₂ laser, since the F ₂ laser light cannot penetrate the water, the F ₂ laser light cannot penetrate the water. The liquid LQ may be a fluorine-based fluid such as a perfluoropolyether (PFPE) or a fluorine-based oil that can penetrate the F ₂ laser light. At this time, the portion in contact with the liquid LQ is formed into a film by a substance having a fluorine-containing polar low molecular structure to carry out a lyophilization treatment. Further, in the liquid LQ, it is possible to use a transmittance to the exposure light EL and to have a refractive index as high as possible, and to stabilize the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, cedar oil). The surface treatment at this time also corresponds to the polarity of the liquid LQ used.

Further, in the substrate P of each of the above embodiments, not only a semiconductor wafer for semiconductor element fabrication but also a glass substrate for a display element, a ceramic wafer for a thin film magnetic head, or a photomask or a grating used in an exposure apparatus may be used. Original (synthetic quartz, germanium wafer), etc.

In the exposure apparatus EX, in addition to the scanning type exposure apparatus (scanning stepper) that scans the pattern of the mask M in synchronization with the mask M and the substrate P, the mask M can be used. A projection exposure apparatus (stepper) that repeatedly exposes the pattern of the mask M to the substrate P in a stationary state, and sequentially moves the substrate P in a step-and-step manner.

Further, in the exposure apparatus EX, the first pattern and the substrate P may be used to form the first pattern in a substantially stationary state with a projection optical system (for example, a refractive projection optical system that does not include a reflection element at a reduction magnification of 1/8). The exposure device is reduced in such a manner as to perform full exposure on the substrate P. In this case, the full-exposure device of the stitching method can be further used, and the reduced image of the second pattern and the first pattern are partially overlapped by the projection optical system while the second pattern and the substrate P are substantially stationary. A full exposure is performed on the substrate P. Further, as the exposure apparatus of the stitching method, an exposure apparatus of a stepping stitching method may be used, and at least two pattern portions are superimposed and transferred on the substrate P, and then the substrate P is sequentially moved.

In the above embodiment, a light-transmitting type mask (grating) in which a predetermined light-shielding pattern (or a phase pattern or a light-reducing pattern) is formed on a light-transmitting substrate is used, but it is also possible to replace the grating. As disclosed in Japanese Patent No. 6,778,257, an electronic mask that penetrates a pattern or a reflective pattern or a light-emitting pattern is formed in accordance with an electronic material of a pattern to be exposed.

Moreover, the present invention can also use an exposure device (photolithography system) for forming interference fringes on the wafer W as disclosed in the pamphlet of International Publication No. 2001-035168, thereby forming a line and gap pattern on the wafer W. ).

Further, in the present invention, an exposure apparatus including only the substrate stage ST1 holding the substrate P may be omitted, in which the measurement stage ST2 is omitted. In this case, the predetermined region 100 formed so as not to contaminate the liquid LQ may be placed on the substrate stage ST1, or the dummy substrate DP may be held on the substrate stage ST1 and used as a predetermined region. Further, in the above-described embodiment, an exposure apparatus including the projection optical system PL is described as an example, but the exposure apparatus and the exposure method which do not use the projection optical system PL may be used in the present invention. When the projection optical system PL is not used, the light for exposure is irradiated onto the substrate through an optical member such as a lens, and a liquid immersion area is formed in a predetermined space between the optical member and the substrate.

Further, the present invention can also employ a twin stage type exposure apparatus. In the double stage type exposure apparatus, it is only necessary to form a predetermined area on the at least one of the two stages holding the substrate in advance so as not to contaminate the liquid LQ. The structure and the exposure operation of the double-stage type exposure apparatus are disclosed in, for example, Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei 10-214783 (corresponding to U.S. Patent Nos. 6,341,007, 6,400,441, 6,549,269 and 6,590,634). Japanese Patent No. 505958 (corresponding to U.S. Patent No. 5,969,441) or U.S. Patent No. 6,208,407.

Further, in the above-described embodiment, an exposure apparatus that partially fills the liquid between the projection optical system PL and the substrate P is used. However, the present invention can also be used in Japanese Laid-Open Patent Publication No. Hei 6-124873, No. Hei 10-303114. A liquid immersion exposure apparatus that performs exposure in a state where the entire surface of the substrate to be exposed is immersed in a liquid as disclosed in U.S. Patent No. 5,825,043.

The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element in which the substrate P is exposed to the substrate P, and an exposure apparatus for manufacturing a liquid crystal display element or a display can be widely used, and a thin film magnetic head can be manufactured. , an imaging device (CCD) or an exposure device such as a grating or a photomask.

When the substrate stage ST1 and the mask stage MST use a linear motor, either an air floating type of a gas bearing or a magnetic floating type using a Lorentz force or a reactance force can be used. Further, each of the stages ST1, ST2, and MST may be of a type that moves along the guide member or a non-guide type that does not have a guide. An example of a linear motor for a stage is disclosed in U.S. Patent Nos. 5,623,853 and 5,528,118.

The driving mechanism of each of the stages ST1, ST2, and MST may be a planar motor, so that the magnet unit in which the magnet is disposed in a two-dimensional space faces the armature unit in which the coil is disposed in a two-dimensional space, and each stage is electromagnetically driven. ST1, ST2, and MST are driven. In this case, it is only necessary to connect any one of the magnet unit and the armature unit to the stages ST1, ST2, and MST, and to move the other of the magnet unit and the armature unit to the stages ST1, ST2, and MST. The side can be.

In order to prevent the reaction force generated by the movement of the stages ST1, ST2 from being transmitted to the projection optical system PL, the frame member is mechanically released to the ground as described in Japanese Laid-Open Patent Publication No. Hei 8-166475 (U.S. Patent No. 5,528,118). Earth).

In order to prevent the reaction force from being transmitted to the projection optical system PL by the movement of the reticle stage MST, the frame member is mechanically released to the ground as described in Japanese Laid-Open Patent Publication No. Hei 8-330224 (U.S. Patent No. 5,874,820). Earth).

As described above, the exposure apparatus EX according to the embodiment of the present invention includes various quasi-systems in which various constituent elements are cited in the scope of the present application, and is assembled by maintaining the predetermined mechanical precision, electrical precision, and optical precision. . In order to ensure various precisions, adjustments for optical precision are performed for various optical systems before and after assembly, and adjustments for mechanical precision are performed for various mechanical systems, and electrical precision is achieved for various electrical systems. Adjustment. The steps of assembling the exposure device from various quasi-systems include mechanical connection of various quasi-systems, wiring connection of electric circuits, piping connection of pneumatic circuits, and the like. Before the steps of assembling the various quasi-systems into the exposure apparatus, of course, there are individual assembly steps of the respective quasi-systems. After the steps of assembling the various exposure systems into the exposure devices, the overall adjustment is performed to ensure various precisions of the entire exposure apparatus. Further, the production of the exposure apparatus is preferably carried out in a clean room in which temperature and cleanliness are managed.

A micro-element such as a semiconductor element, as shown in FIG. 13, is manufactured by the following steps: a step 201 of performing a function and performance design of the micro-element; a step 202 of fabricating a photomask (grating) according to the design step; and manufacturing the element substrate Step 203 of the substrate; step 204 of exposing the pattern of the mask to the substrate by the exposure apparatus EX of the above embodiment, substrate processing (exposure processing) for developing the exposed substrate; component assembly step (including a cutting step, Combining step, packaging step) 205; checking step 206 and the like. Further, the substrate processing step 204 includes the processing steps described in relation to the drawings of FIG. 6 and the like.

1. . . Liquid immersion mechanism

2. . . Substrate

2A. . . Above

2As. . . Surrounding part

2B. . . below

2C. . . side

3. . . Photographic material

10. . . Liquid supply mechanism

11. . . Liquid supply department

12. . . Supply port

13. . . Supply tube

13B. . . valve

16. . . Pure water manufacturing device

17. . . Temperature control device

18. . . Back pipe

18B. . . First valve

19. . . Supply tube

19B. . . Second valve

20. . . Liquid recovery mechanism

twenty one. . . Liquid recovery department

twenty two. . . Recovery port

twenty three. . . Recovery tube

23B. . . valve

60, 60A, 60B. . . Measuring device

61~64. . . Measurer

61K~64K. . . Branch tube

70. . . Mouth member

70A. . . below

91,93,98. . . Moving mirror

92,94,99. . . Laser interferometer

95,97. . . Above

96. . . Concave

100. . . Established area

120. . . Functional fluid supply device

161. . . Pure water maker

162. . . Ultrapure water maker

171. . . Coarse thermostat

172. . . Flow controller

173. . . Degassing device

174. . . filter

175. . . Micro thermostat

300. . . Reference member

400,500,600. . . Sensor

301,401,501,601. . . Above

AR. . . Projection area

AX. . . Optical axis

BP. . . Base member

C1. . . First position

C2. . . 2nd position

CONT. . . Control device

DP. . . Virtual substrate

EL. . . Exposure light

EX. . . Exposure device

IL. . . Lighting optical system

INF. . . Notification device

K1. . . Light path space

LK. . . Functional fluid

LR. . . Liquid immersion area

LQ. . . liquid

LSA. . . below

LS1. . . First optical element

M. . . Mask

MFM. . . First fiducial mark

MRY. . . Memory device

MST. . . Photomask stage

MSTD. . . Photomask stage drive

P. . . Substrate

PFM. . . 2nd fiducial mark

PH. . . Substrate holder

PK. . . Lens barrel

PL. . . Projection optical system

SD1. . . Substrate stage drive

SD2. . . Measuring stage drive

ST1. . . Substrate stage

ST2. . . Measuring stage

Fig. 1 is a schematic configuration diagram of an exposure apparatus according to a first embodiment.

Figure 2 is a plan view of the stage viewed from above.

Fig. 3 is a view showing a state in which the liquid immersion area moves between the substrate stage and the measurement stage.

Fig. 4 is a schematic configuration diagram showing a liquid supply portion.

Fig. 5 is a view showing a schematic configuration of a measuring device.

Fig. 6 is a flow chart for explaining an example of an exposure sequence.

Figure 7 is a state diagram of the liquid being measured on the substrate.

Fig. 8 is a view showing an example of a substrate.

Fig. 9 is a view showing another example of the substrate.

Fig. 10 is a view showing the exposure apparatus of the second embodiment.

Fig. 11 is a view showing the exposure apparatus of the third embodiment.

Fig. 12 is a view showing the exposure apparatus of the fourth embodiment.

Fig. 13 is a flow chart showing an example of the steps of the semiconductor element.

1. . . Liquid immersion mechanism

10. . . Liquid supply mechanism

11. . . Liquid supply department

12. . . Supply port

13. . . Supply tube

13B. . . valve

16. . . Pure water manufacturing device

17. . . Temperature control device

18. . . Back pipe

18B. . . First valve

19. . . Supply tube

19B. . . Second valve

20. . . Liquid recovery mechanism

twenty one. . . Liquid recovery department

twenty two. . . Recovery port

twenty three. . . Recovery tube

23B. . . valve

60. . . Measuring device

70. . . Mouth member

70A. . . below

91. . . Moving mirror

92. . . Laser interferometer

93. . . Moving mirror

94. . . Laser interferometer

95. . . Above

96. . . Concave

97. . . Above

98. . . Moving mirror

99. . . Laser interferometer

100. . . Established area

120. . . Functional fluid supply device

AR. . . Projection area

AX. . . Optical axis

BP. . . Base member

CONT. . . Control device

EL. . . Exposure light

EX. . . Exposure device

IL. . . Lighting optical system

INF. . . Notification device

K1. . . Light path space

LR. . . Liquid immersion area

LQ. . . liquid

LSA. . . below

LS1. . . First optical element

M. . . Mask

MRY. . . Memory device

MST. . . Photomask stage

MSTD. . . Photomask stage drive

P. . . Substrate

PH. . . Substrate holder

PK. . . Lens barrel

PL. . . Projection optical system

SD1. . . Substrate stage drive

SD2. . . Measuring stage drive

ST1. . . Substrate stage

ST2. . . Measuring stage

Claims (35)

An exposure apparatus for exposing a substrate by exposing exposure light to an optical member through an optical member, comprising: a liquid immersion mechanism for filling the substrate with the liquid disposed on a light exit side of the optical member And an optical path space between the object and the optical member; and the measuring device measures at least one of a property and a composition of the liquid in a state in which the liquid immersion area is formed on the object different from the substrate. The exposure apparatus of claim 1, wherein the optical member is at least a part of a projection optical system. The exposure apparatus of claim 1, wherein the object has a predetermined area that does not contaminate the liquid; the liquid immersion mechanism is filled with liquid between the projection optical system and the predetermined area on the object. The exposure apparatus of claim 1, wherein the liquid immersion mechanism is provided with a liquid recovery mechanism for recovering a liquid; and the measurement device measures the liquid recovered by the liquid recovery mechanism. The exposure apparatus of claim 4, wherein the liquid recovery mechanism includes: a recovery flow path through which the recovered liquid flows, and a branch flow path branched from the middle of the recovery flow path; The liquid of the branch flow path is measured. The exposure apparatus of claim 1, wherein the object is movable on an image side of the projection optical system. The exposure apparatus of claim 6, wherein the object includes a first movable member that can hold the substrate to move. The exposure apparatus of claim 6, wherein the object includes a dummy substrate held by the first movable member that can hold the substrate to move. The exposure apparatus according to claim 6, wherein the object includes a second movable member, and the second movable member can be mounted and moved by an optical measuring device that optically performs exposure-related measurement. The exposure apparatus of claim 9, wherein the measuring action of the optical measuring device is performed in a state where a liquid is filled between the projection optical system and the optical measuring device on the second movable member, and the measuring action is performed The measurement action of the light measurer is in parallel with at least a portion of the measurement action of the measurement device. An exposure apparatus according to claim 1, wherein the exposure apparatus controls the exposure operation based on the measurement result of the measurement apparatus. The exposure apparatus of claim 11, wherein the control device determines whether the measurement result of the measurement device is abnormal, and controls the exposure operation according to the determination result. The exposure apparatus of claim 11, wherein the control device controls the exposure operation based on an allowable value associated with at least one of a property and a composition of the liquid and a measurement result of the measuring device. The exposure apparatus of claim 13, wherein the allowable value is determined according to an exposure program implemented after the measuring operation of the measuring device. An exposure apparatus according to claim 11, which is provided with an informing means for notifying the measurement result of the measuring means; the control means issues a warning by the informing means when the measurement result is abnormal. The exposure apparatus of claim 11, wherein the liquid immersion mechanism has a flow path through which the liquid flows; the exposure device includes a plurality of adjustment devices disposed at a predetermined position of the flow path of the liquid immersion mechanism, At least one of the properties and the composition of the liquid is adjusted; the control device specifies at least one of the plurality of adjustment devices based on the measurement result of the measuring device. The exposure apparatus of claim 11, wherein the control device is based on a first measurement result of the measuring device in a state in which the projection optical system is filled with the liquid and the object, and the projection is filled with the liquid The second measurement result of the measuring device between the optical system and the substrate is used to determine the type of substance eluted from the substrate to the liquid. The exposure apparatus of claim 11, wherein the control device is based on a first measurement result of the measuring device in a state in which the projection optical system is filled with the liquid and the object, and the projection is filled with the liquid The amount of the substance eluted from the substrate to the liquid is obtained from the second measurement result of the measuring device between the optical system and the substrate. The exposure apparatus of claim 18, wherein the control device controls the exposure operation based on a predetermined allowable value associated with the amount of the dissolved substance and a measurement result of the measuring device. The exposure apparatus of claim 11, wherein the substrate has a substrate and a photosensitive material coated on the substrate; the control device is based on a state in which the projection optical system and the object are filled with a liquid The first measurement result of the measuring device and the second measurement result of the measuring device in a state in which the liquid is filled between the projection optical system and the substrate are used to obtain information on the photosensitive material of the substrate. The exposure apparatus according to any one of claims 1 to 20, wherein the liquid immersion mechanism is provided with a supply flow path for supplying a liquid, and a recovery flow path for recovering the liquid; the measuring device is respectively Measuring the liquid at the first position in the supply flow path of the liquid immersion mechanism and the liquid at the second position in the recovery flow path of the liquid immersion mechanism; the control device is based on the measurement result of the liquid at the first position, and As a result of measuring the liquid at the second position, the state of the flow path between the first position and the second position is obtained. The exposure apparatus of claim 21, wherein the liquid immersion mechanism has a nozzle member having at least one of a supply port for supplying a liquid and a recovery port for recovering a liquid; the nozzle member is attached to The first position is between the second position and the second position. The exposure apparatus of claim 21, wherein the control device determines whether to repair the flow path between the first position and the second position based on a measurement result of the measurement device. An exposure apparatus according to any one of claims 1 to 20, which is provided with a memory device for storing measurement results of the measurement device. The exposure apparatus of claim 24, wherein the memory device stores the measurement result of the measuring device in response to a time lapse. The exposure apparatus of claim 24, wherein the plurality of substrates are sequentially exposed; the memory device stores the measurement results of the measuring device corresponding to the substrate. The exposure apparatus according to any one of claims 1 to 20, wherein, by the liquid immersion mechanism, a space of the light path of the exposure light between the projection optical system and the substrate is filled with a liquid; The optical system and the liquid illuminate the substrate with exposure light to expose the substrate. The exposure apparatus according to any one of claims 1 to 20, further comprising a cleaning apparatus that operates in accordance with a measurement result of the measuring apparatus. A method of manufacturing a semiconductor device, comprising: an exposure processing step of exposing a wafer using an exposure apparatus according to any one of claims 1 to 28. An exposure method for exposing a substrate through a liquid, comprising the steps of: forming a liquid immersion area on an object different from the substrate in the first step; and forming a liquid immersion area on the object in the second step Measuring at least one of the properties and composition of the liquid in the state of the liquid immersion area; and the third step of passing the liquid in the liquid immersion area formed on the substrate The substrate is irradiated with exposure light to expose the substrate. The exposure method of claim 30, wherein the liquid supply system for forming a liquid immersion area on the object in the first step is to form a liquid on the substrate in the third step. It is used while immersing the area. The exposure method of claim 30, wherein the liquid contact surface of the object is formed by a material that does not produce a substance in the liquid. The exposure method of claim 30, wherein in the second step, at least one of a property and a component of the liquid recovered from the liquid immersion area is measured. The exposure method of claim 30, wherein the third step further comprises an operation of measuring at least one of a property and a composition of the liquid in the liquid immersion area formed on the substrate, The measurement results of the 3 steps are compared with the measurement results of the second step. The exposure method of claim 30, further comprising the step of replacing the substrate, wherein the first and second steps are performed in the substrate replacement step.