TWI415312B - Light emitting diode packing structure - Google Patents

Abstract

A light emitting diode packing structure includes a substrate, a first electrical conductive section and a second electrical conductive section formed on the substrate, and a light emitting diode chip. The light emitting diode chip includes a first electrode pad and a second electrode pad. The first electrode pad is electrical connected with the first electrical conductive section. The second electrode pad is electrical connected with the second electrical conductive section by a wire. The first electrical conductive section has a first surface for securing the light emitting diode chip, and the light emitting diode chip has a second surface for forming the second electrode pad. The wires has a vertex. A distance between the vertex and the second surface is less than half of a distance between the second surface and the first surface for decreasing the length of the wire.

Description

Light emitting diode package structure

The invention relates to a light emitting diode package structure.

A Light Emitting Diode (LED) is a semiconductor component that converts current into light of a specific wavelength range. The light-emitting diode is widely used in the field of illumination because of its high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, and long life.

In previous LED packages, a connection line was generally required to electrically connect the LED die to the lead frame, a process commonly referred to as wire bonding. In the process of wire bonding, one end of the connecting wire is usually heated and melted by a wire bonding machine and fixed at the electrode position of the light-emitting diode die, and then the other end of the connecting wire is pulled to the other end of the lead frame to be fixed. Previous connections typically formed a barbed structure with one end connected to the electrodes of the light-emitting diode die and the other end connected to the lead frame. However, the above-mentioned connecting lines are usually set higher, which will cause waste of the use of the wires and increase the cost of manufacturing the components.

In view of the above, it is necessary to provide a light emitting diode package structure which can reduce the length of use of the connection line.

A light emitting diode package structure includes a substrate, a first electrical connection portion and a second electrical connection portion disposed on the substrate, and a light emitting diode die disposed on the first electrical connection portion. The first electrical connection portion is electrically insulated from the second electrical connection portion. The light emitting diode die includes a first electrode and a second electrode, the first electrode is electrically connected to the first electrical connection portion, and the second electrode is electrically connected to the second electrical connection portion by the connecting wire connection. The light emitting diode die has a first surface disposed adjacent to the first electrical connection and a second surface disposed adjacent to the second electrode. The connecting line has a highest point, the vertical distance between the highest point and the first surface being greater than the vertical distance between the other portion of the connecting line and the first surface. The vertical distance between the highest point and the second surface is less than half the vertical distance between the first surface and the second surface.

By setting the distance between the highest point of the connecting line and the plane of the second electrode to be less than half of the distance between the second electrode and the surface of the substrate, the length of the connecting line used can be effectively reduced, and the LED component can be reduced. manufacturing cost.

100, 600‧‧‧Light emitting diode package structure

10, 610‧‧‧ substrate

110, 611‧‧‧ first electrical connection

130, 613‧‧‧ first surface

120, 612‧‧‧second electrical connection

20, 620‧‧‧Light-emitting diode grains

210, 621‧‧‧ semiconductor light-emitting structure

220, 622‧‧‧ first electrode

230, 623‧‧‧ second electrode

240, 624‧‧‧ second surface

625‧‧‧ third surface

30, 630‧‧‧ connection line

330, 632‧‧‧ first electrical contact point

642‧‧‧Second electrical contact

633, 643‧‧ ‧ solder balls

The highest point of 310, 631, 641‧‧

40, 650‧‧‧ package

50, 660‧‧‧Reflection Cup

640‧‧‧second cable

1 is a schematic cross-sectional view showing a light emitting diode package structure in a first embodiment of the present invention.

2 is a schematic cross-sectional view showing a light emitting diode package structure in a second embodiment of the present invention.

3 is a schematic cross-sectional view showing a light emitting diode package structure in a third embodiment of the present invention.

4 is a schematic cross-sectional view showing a light emitting diode package structure in a fourth embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view showing a light emitting diode package structure in a fifth embodiment of the present invention.

As shown in FIG. 1 , the LED package structure 100 of the first embodiment of the present invention includes a substrate 10 , a light emitting diode die 20 disposed on the substrate 10 , and a connection line 30 .

The substrate 10 may be an aluminum-based circuit board or a ceramic substrate having a conductive line provided on the surface thereof, such as an alumina substrate, a zinc oxide substrate, or a germanium substrate. The surface of the substrate 10 is provided with a first electrical connection portion 110 and a second electrical connection portion 120. The first electrical connection portion 110 and the second electrical connection portion 120 are insulated from each other. In this embodiment, the first electrical connection portion 110 and the second electrical connection portion 120 extend from the upper surface to the lower surface of the substrate 10, thereby forming a surface mountable structure. The first electrical connection portion 110 has a first surface 130 for arranging the light emitting diode dies 20.

The LED die 20 is disposed on the first surface 130 of the first electrical connection portion 110. The light emitting diode die 20 includes a semiconductor light emitting structure 210 and a first electrode 220 and a second electrode 230 disposed at two ends of the semiconductor light emitting structure 210. In this embodiment, the first electrode 220 is disposed at the bottom of the light emitting diode die 20 . The first electrode 220 is electrically connected to the first surface 130 of the first electrical connection portion 110 by soldering or eutectic bonding, and the light-emitting diode die 20 is fixed to the first electrode. The first surface 130 of the connecting portion 110 is on. The light emitting diode die 20 further includes a second surface 240 disposed away from the first surface 130. The second electrode 230 is disposed on the second surface 240 of the LED die 20 .

The connection line 30 is disposed between the second electrode 230 and the second electrical connection portion 120 to electrically connect the second electrode 230 and the second electrical connection portion 120. The connecting line 30 has a highest point 310, and the vertical distance between the highest point 310 and the first surface 130 is greater than the vertical distance between the other portions of the connecting line 30 and the first surface 130. The position of the highest point 310 satisfies the following relationship: h ₁ <H ₁ /2

Wherein h ₁ is a vertical distance between the highest point 310 and the second surface 240; H ₁ is a vertical distance between the second surface 240 and the first surface. Setting the vertical distance h ₁ between the highest point 310 and the second surface 240 to be less than half of the vertical distance H ₁ between the second surface 240 and the first surface 130 can effectively reduce the height of the connecting line 30, thereby reducing the connection. The length used by the wire 30 is advantageous in reducing the cost of the light-emitting diode component. In addition, due to the decrease in the height of the connecting wire 30, the thickness of the corresponding LED package structure 100 is also reduced, which is advantageous for achieving thinning of components.

The connecting line 30 forms a first electrical contact point 330 with the second electrode 230. The angle θ between the tangent of the connecting line 30 at the position of the first electrical contact 330 and the plane at which the second surface 240 is located is between 0 and 45 degrees. Preferably, in order to further reduce the influence of the stress during the wire bonding on the electrical contact performance between the connection line 30 and the second electrode 230, the tangent to the position of the connection line 30 near the first electrical contact point 330 and the second The angle θ between the planes at which the surface 240 is located is set between 0 and 30 degrees. Reducing the angle of the wire can reduce the amount of the wire 30 to reduce the cost. At the same time, since the wiring 30 is disposed close to the LED die 20, it can reduce the disconnection caused by the collapse of the connection line 30, thereby reducing the probability of failure of the LED package 100.

The LED package structure 100 may further include a package as needed. Body 40. As shown in FIG. 2, the package body 40 completely covers the LED die 20 and the connecting line 30. It is used to prevent the light-emitting diode die 20 from being affected by an external environment such as moisture or dust. Specifically, the package body 40 may be an epoxy resin or a resin or a glass material. In addition, the phosphor 40 particles may be incorporated into the package 40 to realize wavelength conversion to synthesize white light.

The LED package structure 100 may further include a reflective cup 50 as needed. Referring to FIG. 3 , the reflector cup 50 is disposed on the first surface 130 of the substrate 10 and surrounds the periphery of the LED die 20 . The reflector cup 50 and the substrate 10 form an accommodating cavity. The LED die 20 is disposed inside the accommodating cavity, and the light emitted toward the reflective cup 50 is reflected by the reflector cup. The inner wall of 50 is reflected and then emitted to the outside world. At this time, the package body 40 can be disposed inside the accommodating cavity, and the package body 40 completely covers the illuminating diode die 20 and the connecting line 30. At the same time, the inside of the package 40 may be doped with phosphor particles to achieve wavelength conversion to synthesize white light.

In addition, the two electrodes of the light-emitting diode crystal grains are not limited to the opposite sides of the crystal grains as described in the above embodiment, and may be located on the same side of the crystal grains. Referring to FIG. 4 , the LED package structure 600 of the fourth embodiment of the present invention includes a substrate 610 , a light emitting diode die 620 disposed on the substrate 610 , a connection line 630 , a second connection line 640 , and a package 650 . And a reflector cup 660.

The surface of the substrate 610 is provided with a first electrical connection portion 611 and a second electrical connection portion 612. The first electrical connection portion 611 and the second electrical connection portion 612 are insulated from each other. The first electrical connection portion 611 has a first surface 613 on which the light emitting diode die 620 is disposed.

The LED die 620 is disposed on the first surface 613 of the first electrical connection portion 611. The light emitting diode die 620 includes a semiconductor light emitting structure 621 and first and second electrodes 622 and 623. The semiconductor light emitting structure 621 has a second surface 624 and a third surface 625 disposed on the same side. The second electrode 623 is disposed on the second surface 624 , and the first electrode 622 is disposed on the third surface 625 . The second electrode 623 is electrically connected to the second electrical connection portion 612 by a connection line 630. The connecting line 630 has a highest point 631, and the vertical distance between the highest point 631 and the first surface 613 is greater than the vertical distance between the other portion of the connecting line 630 and the first surface 613. The position of the highest point 631 satisfies the following relationship: h ₂ <H ₂ /2

Wherein h ₂ is a vertical distance between the highest point 631 and the second surface 624; H ₂ is a vertical distance between the second surface 624 and the first surface 613. Different from the first embodiment, in the embodiment, the LED die 620 is fixed on the surface of the first electrical connection portion 611 by a bonding adhesive. The second connection line 640 is disposed between the first electrode 622 and the first electrical connection portion 611 to electrically connect the first electrode 622 and the first electrical connection portion 611 . The second electrical connection line 640 has a highest point 641. The vertical distance between the highest point 641 and the first surface 613 is greater than the vertical distance between the other portion of the second electrical connection line 640 and the first surface 613. The position of the highest point 641 satisfies the following relationship: h ₃ <H ₃ /2

Where h ₃ is the vertical distance between the highest point 641 and the third surface 625; H ₃ is the vertical distance between the third surface 625 and the first surface 613. By setting the height of the connection line 630 and the second connection line 640, the thickness of the light-emitting diode package structure 600 can be effectively controlled, and the device can be made thinner.

The connection line 630 forms a first electrical contact 632 with the second electrode 623. The angle between the tangent of the connecting line 630 at the position of the first electrical contact 632 and the plane where the second surface 624 is located is between 0 and 45 degrees to reduce the disconnection of the connecting line 630 due to external stress. . Preferably, the angle between the tangent of the connecting line 630 at the location of the first electrical contact 632 and the plane at which the second surface 624 is located is between 0 and 30 degrees.

The second connection line 640 forms a second electrical contact point 642 with the first electrode 622. The angle between the tangent to the second electrical contact 642 and the plane at which the third surface 625 is located is between 0 and 45 degrees. Preferably, the angle between the tangent to the second electrical contact 642 and the plane at which the third surface 625 is located is between 0 and 30 degrees.

The LED package structure 600 may further include a package 650 as needed. The package body 650 covers the LED die 620 and the connection line 630 and the second connection line 640. The package 650 is used to prevent the LED 620 and corresponding electrical contacts from being affected by the external environment. The package 650 can be an epoxy resin or a resin or a glass material. In addition, the phosphor granules may be incorporated into the package 650 to realize wavelength conversion to synthesize white light.

The light emitting diode package structure 600 may further include a reflective cup 660 as needed. The reflective cup 660 is disposed on the substrate 610 and surrounds the periphery of the light emitting diode die 620. The reflector cup 660 and the substrate 610 form an accommodating cavity, and the illuminating diode die 620 is disposed inside the accommodating cavity. The light directed toward the reflective cup 660 will be reflected by the inner wall of the reflective cup 660 and then exit to the outside. At this time, the package body 650 can be disposed inside the accommodating cavity, and the package body 650 completely covers the LED dies 620, the connection line 630, and the second connection line 640. At the same time, the inside of the package 650 may be doped with phosphor particles to achieve wavelength conversion to synthesize white light.

If necessary, a solder ball 633 formed by melting the connecting wire 630 may be formed at the contact point of the connecting wire 630 and the second electrode 623 during the wire bonding, as shown in FIG. The solder ball 633 serves to enhance the electrical contact performance between the connection line and the second electrode 623. The solder ball 633 has an inclined shape as needed, and a surface of the solder ball 633 opposite to the contact point of the connection line 630 forms an included angle θ 3 between 0 and 90 degrees with the plane where the second electrode 624 is located. Preferably, the included angle is from 0 degrees to 45 degrees. The angle between the solder ball 633 and the second electrode 623 is set to be between 0 degrees and 90 degrees. The purpose is to place the wiring line 630 adjacent to the light-emitting diode die 620, which can reduce the collapse of the connection line 630. The disconnection occurs, thereby reducing the probability of failure of the LED package 600.

Similarly, a solder ball 643 formed by melting the connection line 640 may be formed between the connection line 640 and the first electrode 622. The surface of the solder ball 643 opposite to the contact point of the connection line 640 forms an angle θ 2 between 0 and 90 degrees with the plane of the first electrode 622 for bringing the connection line 640 close to the light-emitting diode die 620. It is provided to reduce the disconnection caused by the collapse of the connecting wire 640.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Anyone who is familiar with the skill of this case is assisted by the present invention. Equivalent modifications or variations made by the spirit are to be covered by the following patents.

100‧‧‧Light emitting diode package structure

10‧‧‧Substrate

110‧‧‧First electrical connection

130‧‧‧ first surface

120‧‧‧Second electrical connection

20‧‧‧Light-emitting diode grains

210‧‧‧Semiconductor light-emitting structure

220‧‧‧First electrode

230‧‧‧second electrode

240‧‧‧ second surface

330‧‧‧First electrical contact point

30‧‧‧Connecting line

310‧‧ ‧ highest point

Claims (9)

A light emitting diode package structure includes a substrate, a first electrical connection portion and a second electrical connection portion disposed on the substrate, and a light emitting diode die disposed on the first electrical connection portion, the first The electrical connection portion is electrically insulated from the second electrical connection portion, the light emitting diode die includes a first electrode and a second electrode, the first electrode is electrically connected to the first electrical connection portion, and the second electrode Electrically connecting with the second electrical connection portion, the first electrical connection portion has a first surface for arranging the light emitting diode die, and the light emitting diode die has a a second surface of the second electrode, the connecting line having a highest point, a vertical distance between the highest point and the first surface being greater than a vertical distance between the other portion of the connecting line and the first surface, the improvement being that a vertical distance between the highest point and the second surface is less than a half of a vertical distance between the first surface and the second surface, and a contact point is formed between the connecting line and the second electrode, and the solder ball is inclined to Second electrode setting, the solder ball Opposite to the angle between the plane surface of the connecting line and the second electrode contact point between 0 degrees and 90 degrees. The light emitting diode package structure of claim 1, wherein the connecting line forms a first electrical contact point with the second electrode, the connecting line is close to the tangent of the first electrical contact point and the second The angle between the surfaces ranges from 0 to 45 degrees. The LED package structure of claim 2, wherein an angle between the tangent to the second electrical contact of the connecting line and the second surface ranges from 0 to 30 degrees. The light emitting diode package structure according to claim 1, wherein the The LED package structure further includes a package that completely covers the LED die and the connection lines. The light emitting diode package structure according to claim 4, wherein the package body is doped with phosphor powder particles. The illuminating diode package structure of claim 1, wherein the illuminating diode package further comprises a reflective cup, and the reflective cup and the substrate together form an accommodating cavity, the illuminating two The polar body grains are disposed inside the accommodating cavity. The illuminating diode package structure of claim 6, wherein the accommodating cavity is filled with an encapsulating material, and the encapsulating material completely covers the illuminating diode die and the connecting line. The light emitting diode package structure of claim 1, wherein the light emitting diode die has a third surface, the first electrode is disposed on the third surface and The second connecting line is electrically connected to the first electrical connecting portion, the second electrical connecting line has a second high point, and the vertical distance between the second high point and the first surface is greater than other portions of the second connecting line The vertical distance between the first surfaces, the vertical distance between the second high point and the third surface is less than half the vertical distance between the first surface and the third surface. The light emitting diode package structure of claim 8, wherein the second connecting line forms a second electrical contact point with the first electrode, and the second connecting line is adjacent to the second electrical contact point. The angle between the tangent and the third surface ranges from 0 to 45 degrees.