TWI414094B - Led package structure and the method of manufacturing the same - Google Patents

Abstract

The present invention provides an LED package structure and the method of manufacturing the same. First, the LED chips are connected with the substrate electrically. Then, the substrate is accommodated into the housing, wherein a part of the housing forms a reflecting cup.

Description

Light-emitting diode package structure and manufacturing method thereof

The invention relates to a package structure, in particular to a light emitting diode package structure, and to a method for manufacturing a light emitting diode package structure.

In the prior art, in order to improve the luminous efficiency of a light emitting diode (LED), a reflective cup structure is usually formed on a package substrate, and then a solid crystal wire or a flip chip is used in the recess formed by the reflective cup. The method is to install a light emitting diode chip.

Since the light-emitting diode chip needs to be installed in the recess, the mechanical equipment needs to be extended into the recess when the solid crystal is wired or flipped, and the space for mechanical equipment operation is limited, one is technically more difficult, and the second is easily affected. The yield of the finished product.

In view of the above, the present invention aims to provide a light emitting diode package structure in which a light emitting diode is electrically connected to form a reflective cup, and a manufacturing method thereof.

A manufacturing method of a light emitting diode package structure, comprising the steps of: providing a substrate and forming two electrodes on the substrate; mounting the light emitting diode chip on the substrate and electrically connecting the electrode; Providing a casing, the casing comprising a surrounding wall having a height greater than a thickness of the substrate, the bottom surface of the surrounding wall is provided with a circuit structure, the substrate is disposed in the casing, and the electrode is electrically connected to the circuit structure; An encapsulation layer is formed and the light emitting diode chip is packaged within the housing.

A light emitting diode package structure comprising a substrate, an electrode disposed on the substrate, a light emitting diode chip mounted on the substrate and electrically connected to the electrode, and an encapsulation layer covering the light emitting diode chip, further comprising surrounding the a housing of the substrate and the encapsulation layer, the housing comprising a surrounding wall having a height greater than a thickness of the substrate, the bottom of the surrounding wall being provided with a circuit structure electrically connected to the electrode.

First, the LED wiring is electrically connected to the substrate by performing a solid crystal wire bonding or a flip chip process on the package substrate, and then the housing is sleeved on the package substrate to form a reflective cup. The use of such a process step makes the operation of the solid crystal wire bonding or flip chip easier, improves the yield of the electrically connected LED chip, and ensures the light-emitting and reflection efficiency of the LED.

The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.

10‧‧‧Substrate

20‧‧‧ electrodes

30‧‧‧Light Emitter Wafer

32‧‧‧Wire

40, 80‧‧‧ shell

41, 81‧‧‧ wall

42‧‧‧Half wall

43, 83‧‧‧ circuit structure

44‧‧‧ interval

45‧‧‧Connection block

46, 86‧‧‧ metal layer

46a‧‧‧ Conductive layer

46b‧‧‧reflective layer

50‧‧‧Encapsulation layer

1 is a schematic flow chart showing the steps of a method for fabricating a light emitting diode package structure according to the present invention.

2 to FIG. 3 are schematic cross-sectional views showing a light emitting diode package structure obtained in steps 1 and 2 of the method for fabricating a light emitting diode package structure according to the present invention.

4 is a third step of the manufacturing method of the LED package structure of the present invention A schematic view of the housing structure provided.

FIG. 5 is a schematic top plan view showing a housing structure of another embodiment provided by the third step of the manufacturing method of the LED package structure of the present invention.

6 is a cross-sectional view showing a light emitting diode package structure obtained in the fourth step of the method for fabricating a light emitting diode package structure according to the present invention.

FIG. 7 to FIG. 8 are schematic top views of the LED package structure obtained in the third and fourth steps of the manufacturing method of the LED package structure according to another embodiment of the present invention.

As shown in FIG. 6 and FIG. 8 , a light emitting diode package structure according to an embodiment of the present invention includes a substrate 10 , an electrode 20 formed on the substrate 10 , and a light emitting diode mounted on the substrate 10 and electrically connected to the electrode 20 . The bulk wafer 30 surrounds the housing 40 of the substrate 10 and the encapsulation layer 50 covering the LED substrate 30. The housing 40 includes a surrounding wall 41 having a height greater than the thickness of the substrate 10 such that the surrounding wall 41 of the substrate 10 forms a reflective cup structure. A circuit structure 43 is mounted on the bottom of the surrounding wall 41, and the electrode 20 of the substrate 10 abuts against the circuit structure 43.

Hereinafter, a method of manufacturing the light emitting diode package structure of the present invention will be described in detail in conjunction with other drawings and embodiments.

1 is a flow chart showing the steps of a method for fabricating a light emitting diode package structure according to an embodiment of the invention. Referring to FIG. 2 simultaneously, in the first step of the manufacturing method of the LED package structure of the present invention, first, a substrate 10 is provided, and the substrate 10 has a flat shape. Forming an electrode 20 on the substrate 10, the electrode 20 can be mechanically, etched or Techniques such as laser processing are formed on the substrate 10.

Referring to FIG. 3, the LEDs 30 are electrically connected to the electrodes 20 by wires 32 by means of a die bonding method on the substrate 10. Since the upper surface of the substrate 10 is flat without any obstruction and obstruction, the space for the wire is not limited, so the wire machine can operate more flexibly and at the same time, it is beneficial to improve the wire bonding yield. In other embodiments, the electrodes 20 are arranged differently depending on the substrate 10. It is also possible to electrically connect the light-emitting diode wafer 30 to the electrode 20 by flip chip.

As shown in FIG. 4, a housing 40 is provided. The housing 40 includes a surrounding wall 41, a circuit structure 43 disposed at the bottom of the surrounding wall 41, and a metal layer 46 abutting against the inner wall of the surrounding wall 41.

The surrounding wall 41 includes two separate half-walls 42. In the present embodiment, the two half-walls 42 are made of a metal material and are surrounded by an insulating layer formed by the connecting block 45 to form a rectangular frame and insulated from each other. The length and width of the accommodating space of the surrounding wall 41 are matched with the length and width of the substrate 10 to ensure that the substrate 10 can be pushed into the casing 40 from top to bottom; the height of the surrounding wall 41 is greater than the thickness of the substrate 10, The reflector cup structure is formed to ensure that the half wall 42 of the substrate 10 is raised.

The circuit structure 43 is made of a conductive metal material, and the electrode 20 is electrically connected, and functions as a barrier when the substrate 10 is received in the casing 40. The circuit structure 43 is separated and insulated from each other by the connecting block 45 as a boundary line, with a space 44 left therebetween. The substrate 10 that has completed the electrical connection step is pushed down into the casing 40 until the electrode 20 at the bottom of the substrate 10 is in sufficient contact with the circuit structure 43 to constitute an electrical connection.

Referring to FIG. 6 at the same time, the metal layer 46 is divided into a conductive layer 46a and a reflective layer 46b. The portion in contact with the substrate 10 is a conductive layer 46a, which is selected from the same general conductive metal material as the circuit structure 43, such as copper, etc.; the portion above the substrate 10 is a reflective layer 46b, which is selected from materials having good reflectivity, such as Silver and so on. Of course, in other embodiments, the metal layer 46 can be made of the same single metal material as the circuit structure 43 for ease of fabrication.

FIG. 5 is a top plan view of a housing 80 according to another embodiment of the present invention. The housing 80 includes a surrounding wall 81, a metal layer 86 that abuts against the inner wall of the surrounding wall 81, and a circuit structure 83 that is insulated from each other at the bottom of the surrounding wall 81. The surrounding wall 81 has a rectangular frame shape, and can be formed by an integral injection molding process, and then forms a metal layer 86 on the inner wall thereof, and at the same time ensures that the height of the surrounding wall 81 is greater than the thickness of the substrate 10, and the length and width can be carded. Holding the substrate 10. Of course, when the surrounding wall 81 is made of a non-metallic material, as in the previous embodiment, two half-walls are first formed, and the two half-walls are connected and fixed.

As shown in FIG. 6, an encapsulation layer 50 is formed within the housing 40 and covers the LED array 30. The encapsulation layer 50 is completed by a dispensing process. The encapsulant is first applied to the upper surface of the substrate 10 by a dispenser, so that the encapsulant covers the LED wafer 30 and fills the area surrounded by the housing 40, and then the mold is used. The upper end of the encapsulation layer 50 is flush with the upper end of the casing 40. In other embodiments, the phosphor powder may be mixed during preparation of the encapsulant, or a phosphor layer (not shown) may be coated on the upper surface of the encapsulation layer 50 after the package is completed.

FIG. 7 is a schematic structural view of a light emitting diode package structure obtained by another embodiment of the third step of the manufacturing method of the light emitting diode package structure of the present invention. Two symmetrical half-walls 42 are provided, the half-walls 42 being made of a metal material and having a bottom The same circuit structure is also laid. The two half-walls 42 are symmetrically placed on the left and right sides of the substrate 10, and the sum of the lengths of the two half-walls 42 is smaller than the length of the substrate 10. Referring to FIG. 8 at the same time, the half wall 42 is pushed inwardly until the left and right sides of the substrate 10 abut against the inner wall of the half wall 42 from which the two half walls 42 are still at a certain distance. The connecting block 45 is formed by filling with an insulating glue, so that the connecting and fixing the two half-walls 42 are insulated from each other and form a complete casing 40. Of course, the two half-walls 42 can also be made of a non-metallic material. After being fixed to the substrate 10, the two half-walls 42 are connected and fixed by a colloid.

The encapsulation layer 50 is then encapsulated within the housing 40 to cover the LED array 30. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only a preferred embodiment of the present invention, since This cannot limit the scope of patent application in this case. Anyone who is familiar with the skills of this case Equivalent modifications or variations made by Shishi in accordance with the spirit of the present invention are intended to be included in the scope of the following claims.

Claims (9)

A manufacturing method of a light emitting diode package structure, comprising the steps of: providing a substrate and forming two electrodes on the substrate; mounting the light emitting diode chip on the substrate and electrically connecting the electrode; providing a housing The body includes a surrounding wall, which is a non-metallic material, the height of the surrounding wall is greater than the thickness of the substrate, and the bottom surface of the surrounding wall is provided with a circuit structure, the inner surface of the surrounding wall has a metal layer, and the metal layer includes contact with the substrate a conductive layer and a reflective layer above the substrate, the conductive layer and the reflective layer are different in material, the substrate is placed in the case, the electrode is electrically connected to the circuit structure; and the package layer is formed and the light emitting diode chip is packaged in the case . The manufacturing method of the light-emitting diode package structure according to claim 1, wherein the surrounding wall comprises two mutually spaced half-walls, and the two half-walls are connected and fixed by a non-metal material. The method for manufacturing a light-emitting diode package structure according to claim 1, wherein the surrounding wall is made of a non-metal material and is formed by integral molding. The method for manufacturing a light-emitting diode package structure according to claim 2, wherein the step of placing the substrate in the casing is to first connect the two half-walls with a non-metal material to form a casing, and then Push the substrate from the vertical direction into the housing. The method for manufacturing a light emitting diode package structure according to claim 2, wherein the step of placing the substrate in the casing is to first divide the two half walls Push horizontally from the left and right sides of the substrate to hold the substrate, and then fill in the non-metallic material to connect and fix the two half-walls. The manufacturing method of the light emitting diode package structure according to claim 3, wherein the step of placing the substrate in the casing directly pushes the substrate into the surrounding wall from the vertical direction, so that the electrode abuts On the circuit structure. A light emitting diode package structure comprising a substrate, an electrode disposed on the substrate, a light emitting diode chip mounted on the substrate and electrically connected to the electrode, and an encapsulation layer covering the LED chip, wherein the improvement is: The housing further includes a casing surrounding the substrate and the encapsulation layer, the casing including a surrounding wall having a non-metallic material, the height of the surrounding wall being greater than the thickness of the substrate, and the bottom of the surrounding wall is provided with a circuit structure, the surrounding wall The inner surface has a metal layer including a conductive layer in contact with the substrate and a reflective layer above the substrate, the conductive layer being different from the material of the reflective layer, the circuit structure being electrically connected to the electrode. The light emitting diode package structure of claim 7, wherein the surrounding wall comprises two mutually spaced half-walls, the two half-walls being fixed by a non-metallic material. The light emitting diode package structure according to claim 7, wherein the surrounding wall is integrally formed by using a non-metal material.