TWI412552B - 用於製造阻燃性物件之模塑材料,用於彼之顏料,及彼之用途 - Google Patents
用於製造阻燃性物件之模塑材料,用於彼之顏料,及彼之用途 Download PDFInfo
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- TWI412552B TWI412552B TW94134992A TW94134992A TWI412552B TW I412552 B TWI412552 B TW I412552B TW 94134992 A TW94134992 A TW 94134992A TW 94134992 A TW94134992 A TW 94134992A TW I412552 B TWI412552 B TW I412552B
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- Prior art keywords
- pigment
- molding material
- material according
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- 239000000049 pigment Substances 0.000 title claims abstract description 36
- 239000000463 material Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000000465 moulding Methods 0.000 title abstract 2
- 150000001768 cations Chemical class 0.000 claims abstract description 32
- 239000000203 mixture Substances 0.000 claims abstract description 30
- 150000001875 compounds Chemical class 0.000 claims abstract description 26
- 150000003839 salts Chemical class 0.000 claims abstract description 18
- 239000003063 flame retardant Substances 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000011159 matrix material Substances 0.000 claims abstract description 10
- 125000001477 organic nitrogen group Chemical group 0.000 claims abstract description 10
- 229910052718 tin Inorganic materials 0.000 claims abstract description 10
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 6
- 230000000737 periodic effect Effects 0.000 claims abstract description 6
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 6
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 5
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 5
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 5
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 5
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 claims abstract description 5
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 229910052747 lanthanoid Inorganic materials 0.000 claims abstract description 4
- 150000002602 lanthanoids Chemical class 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052777 Praseodymium Inorganic materials 0.000 claims abstract description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract 4
- -1 salt compound Chemical class 0.000 claims description 31
- 239000012778 molding material Substances 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 22
- 229920003023 plastic Polymers 0.000 claims description 16
- 239000004033 plastic Substances 0.000 claims description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 12
- 150000001450 anions Chemical class 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 229920000877 Melamine resin Polymers 0.000 claims description 10
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 8
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 7
- 239000010955 niobium Substances 0.000 claims description 7
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- 239000011572 manganese Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 229920006324 polyoxymethylene Polymers 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 229920000768 polyamine Polymers 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 235000011176 polyphosphates Nutrition 0.000 claims description 5
- 239000012815 thermoplastic material Substances 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229930182556 Polyacetal Natural products 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 150000007974 melamines Chemical class 0.000 claims description 3
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- YZYDPPZYDIRSJT-UHFFFAOYSA-K boron phosphate Chemical compound [B+3].[O-]P([O-])([O-])=O YZYDPPZYDIRSJT-UHFFFAOYSA-K 0.000 claims description 2
- 229910000149 boron phosphate Inorganic materials 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- 125000002091 cationic group Chemical group 0.000 claims description 2
- 239000007859 condensation product Substances 0.000 claims description 2
- 229960004198 guanidine Drugs 0.000 claims description 2
- GDVWDDRKKYMHKS-UHFFFAOYSA-N hepta-1,4,6-trien-3-one;styrene Chemical compound C=CC=CC(=O)C=C.C=CC1=CC=CC=C1 GDVWDDRKKYMHKS-UHFFFAOYSA-N 0.000 claims description 2
- YSRVJVDFHZYRPA-UHFFFAOYSA-N melem Chemical compound NC1=NC(N23)=NC(N)=NC2=NC(N)=NC3=N1 YSRVJVDFHZYRPA-UHFFFAOYSA-N 0.000 claims description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920006393 polyether sulfone Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 229920000193 polymethacrylate Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052712 strontium Inorganic materials 0.000 claims description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims 3
- 229910019142 PO4 Inorganic materials 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 2
- 239000010452 phosphate Substances 0.000 claims 2
- 239000004114 Ammonium polyphosphate Substances 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000002671 adjuvant Substances 0.000 claims 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims 1
- 229920001276 ammonium polyphosphate Polymers 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 229920001643 poly(ether ketone) Polymers 0.000 claims 1
- 229920001707 polybutylene terephthalate Polymers 0.000 claims 1
- 230000002195 synergetic effect Effects 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 abstract description 7
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 3
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
- 238000004079 fireproofing Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 6
- 229920001519 homopolymer Polymers 0.000 description 5
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
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- 150000002009 diols Chemical class 0.000 description 3
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- 230000004580 weight loss Effects 0.000 description 3
- 229920000388 Polyphosphate Polymers 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004587 chromatography analysis Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910017053 inorganic salt Inorganic materials 0.000 description 2
- 238000010147 laser engraving Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229940117969 neopentyl glycol Drugs 0.000 description 2
- 239000001205 polyphosphate Substances 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- YQPCHPBGAALCRT-UHFFFAOYSA-N 2-[1-(carboxymethyl)cyclohexyl]acetic acid Chemical compound OC(=O)CC1(CC(O)=O)CCCCC1 YQPCHPBGAALCRT-UHFFFAOYSA-N 0.000 description 1
- YZEZMSPGIPTEBA-UHFFFAOYSA-N 2-n-(4,6-diamino-1,3,5-triazin-2-yl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(NC=2N=C(N)N=C(N)N=2)=N1 YZEZMSPGIPTEBA-UHFFFAOYSA-N 0.000 description 1
- BDBZTOMUANOKRT-UHFFFAOYSA-N 4-[2-(4-aminocyclohexyl)propan-2-yl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1C(C)(C)C1CCC(N)CC1 BDBZTOMUANOKRT-UHFFFAOYSA-N 0.000 description 1
- XJZZLSMVWFMLBH-UHFFFAOYSA-N C(CC=CO)O.C(CC=CO)O Chemical compound C(CC=CO)O.C(CC=CO)O XJZZLSMVWFMLBH-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- NPKITLFRFSTZCI-UHFFFAOYSA-L O.[OH-].[OH-].[Cu++] Chemical compound O.[OH-].[OH-].[Cu++] NPKITLFRFSTZCI-UHFFFAOYSA-L 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- INDXRDWMTVLQID-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO.OCCCCO INDXRDWMTVLQID-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- 229940116007 ferrous phosphate Drugs 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- BMXFPSYOCKSSBE-UHFFFAOYSA-N guanidine Chemical compound NC(N)=N.NC(N)=N BMXFPSYOCKSSBE-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- SWFMWXHHVGHUFO-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN.NCCCCCCN SWFMWXHHVGHUFO-UHFFFAOYSA-N 0.000 description 1
- HJJLDNAELNDBBL-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO.OCCCCCCO HJJLDNAELNDBBL-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 229910000155 iron(II) phosphate Inorganic materials 0.000 description 1
- SDEKDNPYZOERBP-UHFFFAOYSA-H iron(ii) phosphate Chemical compound [Fe+2].[Fe+2].[Fe+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O SDEKDNPYZOERBP-UHFFFAOYSA-H 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- YRVCHYUHISNKSG-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO.OCCCO YRVCHYUHISNKSG-UHFFFAOYSA-N 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- 125000004354 sulfur functional group Chemical group 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34928—Salts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Description
本發明係有關用於製造阻燃性物件之模塑材料、用於彼之顏料、及彼之用途。
一般知道,阻燃的防火材料會以微粒的形式均勻地加入塑料物件中或其表面。如德國專利DE-A-101 45 093號中記載,利用具有有機氮基化合物之聚磷酸鹽化合物(Polyphosphate),如胍(Guanidin)或蜜胺(Melamin)或蜜胺衍生物,作為塑料中的防火材料,或可保護紡織品的防火物質。如世界專利WO 00/02869號中提到,特別是在具強化玻璃纖維的聚醯胺與聚酯中,可以利用聚磷酸鹽作為防火材料。從許多其他的文獻中已知,可以利用其他有機的氮基化合物作為防火材料,而業界的趨勢是採用不含鹵素的防火材料,如氫氧化鋁、氫氧化鎂或蜜胺氰尿酸鹽(Melamincyanurat)。
若將這些防火材料摻入不含鹵素的熱塑性塑料中,會有改變塑料特性的缺點。
許多應用領域中,需要可以在不燃性塑料物件上用雷射來雕字或做記號,但這在實際上有困難,尤其是目前不含鹵素的難燃性防火材料並無法顯現充分的對比功效,使其在實務上無法使用。
因此,本發明的目的在於提供一種塑料用之模塑材料,使塑料物件可以雷雕,而且塑料的特性也不會變差。根據本發明之模塑材料可用於製造阻燃性物件,其具有一以熱塑性材料為材料之基質與散佈於該基質中粒狀的防火顏料,此模塑材料之特徵在於,該顏料具感光性,且經雷射作用後,會改變顏料的顏色或塑料之基質的顏色,且該顏料係為至少一種不含鹵素之阻燃性有機氮基化合物與(1)至少一種含有至少兩個完全不同陽離子的複合鹽類,及/或(2)一鹽類化合物的混合物,其透過加熱可轉換成如(1)之至少一種含有至少兩個不同陽離子的複合鹽類,之一反應產物,其中種類(1)與(2)中至少一個陽離子是選自下述(A)類之元素:鈦(Ti)、鉻(Cr)、錳(Mn)、鐵(Fe)、鈷(Co)、鎳(Ni)、銅(Cu)、鋅(Zn)、釔(Y)、鋯(Zr)、鈮(Nb)、鉬(Mo)、銀(Ag)、錫(Sn)、銻(Sb)、鑭(La)、鐠(Pr)、鉭(Ta)、鎢(W)和鈰(Ce),而且至少一個另一陽離子是選自(B)類之元素:週期表第3到6週期的第二與第三主族元素、第5和6週期的第四主族元素、與第4和5週期的第三至第八副族元素或鑭系元素。
作為基質的材料可為所有已知的塑料,如在烏爾曼工業化學百科全書(第15冊,第457頁)中所敘述者,且其中部分目前已經使用於雷雕刻字的應用上。適合的塑料是例如聚乙烯、聚丙烯、聚醯胺、聚酯、聚苯醚(
Polyphenylenoxid)、聚縮醛(Polyacetal)、聚對苯二甲酸丁二醇酯(Polybutylenterephthalat)、聚甲基丙烯酸酯(Polymethacrylat)、聚甲醛(Polyoxymethylen)、聚乙烯醇縮乙醛(Polyvinylacetal)、聚苯乙烯(Polystyrol)、丙烯酸-丁二烯-苯乙烯(Acryl-Butadien-Styrol)(ABS)、丙烯腈-苯乙烯-丙烯酸酯(Acrylnitril-Styrol-Acryl)(ASA)、聚碳酸酯(Polycarbonat)、聚醚碸(Polyethersulfon)、聚乙醚酮(Polyethyletherketon)、聚氯乙烯(Polyvinylchlorid)以及熱塑性的聚胺基甲酸酯(Polyurethan)。
這裡描述的聚縮醛(Polyacetal)為主要含有氧伸甲基(CH2O-)的聚合物。其中包括聚甲醛(Polyoxymethylen)的均聚物(Homopolymere)、共聚物(Copolymere)、三聚物(Terpolymere)與嵌段共聚物(Blockcopolymere)。
聚酯意指主鏈中具有重複的酯單元的熱塑性聚合物。例子是萘二羧酸(Naphthalindicarbonsäuren)、對苯二甲酸(Terephthalsäure)、異苯二甲酸(Isophthalsäure)、己二酸(Adipinsäure)、壬二酸(Azelainsäure)、癸二酸(Sebacinsäure)、十二烷二酸(Dodecandisäure)、環己烷二羧酸(Cyclohexandicarbonsäure)、所述羧酸的混合物、及其與二元醇所形成的聚酯衍生物之縮聚產物(其中該二元醇是例如乙二醇(Ethylenglykol)、1,3-丙二醇(1,3-Propandiol)、1,4-丁二醇(1,4-Butandiol)
、1,4-丁烯二醇(1,4-Butendiol)、1,6-己二醇(1,6-Hexandiol)、1,4-己二醇(1,4-Hexandiol)、1,4-環己二醇(1,4-Cyclohexandiol)、1,4-二羥甲基環己烷(1,4-Di-(hydroxymethyl)-cyclohexan)、雙酚A(Bisphenol A)、新戊二醇(Neopentylglycol)、寡/聚乙二醇(Oligo-/Polyethylenglykole)、寡/聚丙二醇(Oligo-/Polypropylenglykole)、寡/聚丁二醇(Oligo-/Poly-(tetramethylen)-glykole)、所述二元醇的混合物、以及其酯化衍生物),以及其他可能的共聚物。
較佳的基質成份為聚對苯二甲酸乙二醇酯(Polyethylenterephthalat)、聚對苯二甲酸丁二醇酯(Polybutylenterephthalat)與聚醚酯嵌段共聚物(Polyether-esterblockcopolymere)。
聚醯胺係指主鏈中具有重複的醯胺基(Säureamidgruppen)之熱塑性聚合物,即均聚物(Homopolymere)以及含其他共聚單體之共聚物(Copolymere)。包含胺基羧酸類均聚物(Amincarbonsaeuretyps)與二胺基二羧酸類均聚物(Diamin-Dicarbonsaeuretyps)以及其他可能的AA-、BB-與AB-型共聚物(Comonomeren)。可應用的聚醯胺非常普遍,例如John Wiley & Sons Inc.1988年出版的聚合物科學與工程百科全書,第十一版,第315至489頁中有說明。
聚醯胺的例子是聚己二醯己二胺(
Polyhexamethylenadipinsäureamid)、聚壬二醯己二胺(Polyhexamethylenazelainsäureamid)、聚癸二醯己二胺(Polyhexamethylensebacinsäureamid)、聚十二烷二醯己二胺(Polyhexamethylendodekandisäureamid)、聚胺基十一烷醯胺(Poly-aminoundekansäureamid)與雙(對胺基環己基)甲烷十二烷醯胺(Bis-(p-amino-cyclohexyl)-methandodekansäureamid),或閉環的內醯胺(Lactamen),如聚己內醯胺(Polycaprolactam)或聚月桂內醯胺(Polylaurinlactam)的產物。以具對苯二甲酸基或異苯二甲酸基作為酸成分及/或以三甲基己二胺(Trimethylhexamethylendiamin)或雙(對胺基環己基)丙烷(Bis-(p-aminocyclohexyl)-propan)作為雙胺成分之聚醯胺,以及經兩種或多種前述聚合物或其成分聚合作用製造出的聚醯胺基礎樹脂皆適合。例如上述之對苯二甲酸、異苯二甲酸、己二胺(Hexamethylendiamin)與己內醯胺(Caprolactam)之共縮聚物。
聚芳基硫醚(Polyarylensulfide)意指在重覆的芳香族主鏈中具有重複的硫基團的熱塑性聚合物,包括均聚物與共聚物。
本文中作為混合組份之熱塑性聚合物可為任何部分結晶態、液晶態與非晶態聚合物。
感光性化合物為有機或無機鹽類化合物,有著前述定義之不同陽離子或有受到雷射光源照射的位置即會變色的不同陽離子鹽類化合物的混合物之組合。
塑性聚胺基甲酸酯(TPU)因具高力學強度且可節省處理成本,因此特別合適。熱塑性的聚胺基甲酸酯長久以來已於許多文獻和專利中揭露。
需均勻地散佈於熱塑性基質中的粒狀顏料,具有(1)與(2)所描述的變化,包含具備至少兩個不同陽離子的複合鹽類,或者雖處尚未改變的前一階段,但加熱融化後也會導致形成本身屬於種類(1)之有著至少兩個不同陽離子的複合鹽類的顏料。
尤其是,金屬組份不論鹽類或其前一階段,不但有雷射雕字或寫畫對比性高的特性,同時能增加防火效果。
本發明之上述態樣的效果係經由具有阻燃特性又因其吸收雷射而具有雷射可寫畫的性質之顏料所產生。此顏料係為至少一種不含鹵素之阻燃性有機氮基化合物與種類(1)和(2)所述之組份中之一者的反應產物。較佳的有機氮基化合物為蜜胺(Melamin)或其衍生物,例如蜜胺氰尿酸鹽(Melamincyanurat)、蜜胺正磷酸鹽(Melaminorthophosphat)、二蜜胺正磷酸鹽(Dimelaminorthophosphat)、蜜胺焦磷酸鹽(Melaminpyrrophosphat)、蜜胺聚磷酸鹽(Melaminpolyphosphat)、蜜胺硼酸鹽(Melaminborat)、部分酯化的磷酸(Teilphosphorsäureester)之蜜胺鹽類、磷氧化合物的鹽類、聚磷酸銨(Ammoniumpolyphosphat)、磷酸硼與/或上述物質之混合物。所使用的防火材料亦可應用於三氮雜苯聚合物(Triazin-Polymere)、蜜勒
胺(Melem)、蜜白胺(Melam)、尿素(Harnstoff)、胍(Guanidin)等。
根據本發明的鹽類或組成物意指在水中至少部份解離成陽離子與陰離子的化合物,或由一酸成分與一鹼成分組成者。
至於顏色的改變,可為從一色調變成另一色調,如從黃變紅或從透明變黑。根據本發明,顏色的改變亦可為亮度的改變,例如從淺棕變成深棕,亦可為塑料顏色的改變。
根據本發明,粒狀意指顏料以細微的固態粒子存在,其中,以主要顆粒的平均粒徑(d50)為定量的基準。主要顆粒的大小係界於奈米到微米的範圍。合適的主要顆粒之平均粒徑(d50)係為小於10微米,較佳者為小於5微米。
在不偏離本發明精神的範圍裡,根據本發明之顏料可額外含有其他陽離子,特別是例如包含於第2到5週期的第一主族元素。也有可能是,於顏料中另外加入無機氧化物和/或其他改變顏色的添加物和/或一般的可改變特定性質之添加物,例如加入抗紫外線劑、抗分解劑、熱化劑或熱氧化劑以增加抗水解與抗疊氮化(azidolytischen)的能力,或加入潤滑劑、脫模劑、結晶調節劑、結核劑、填充物、柔軟劑與其他添加物等。
本發明所指顏料的色差包含不同光源下局部亮度之密度,與局部顏色數值的不同,如在CIELab系統或RGB系
統裡所指的局部色值差異。
對於物質的選擇,一般係考量在可利用的雷射波長範圍內儘可能具有強力吸收的能力者。
所用的雷射波長範圍基本上無特別限定。適用的雷射波長範圍從157奈米至10.6毫米,其中532奈米至10.6毫米列入優先考慮。例如二氧化碳雷射(10.6毫米)與Nd:YAG雷射(1064奈米)或脈衝式紫外光雷射。
常見的準分子雷射(Excimerlaser)具下列波長:F2-準分子雷射(157奈米)、ArF-準分子雷射(193奈米)、XeCl-準分子雷射(308奈米)、XeF-準分子雷射(351奈米)、波長可為532奈米(二倍頻)、355奈米(三倍頻)或265奈米(四倍頻)之倍頻式Nd:YAG-雷射。較佳者為使用Nd:YAG-雷射(1064或532奈米)與二氧化碳雷射。根據本發明,使用的雷射之能量密度一般在0.3 mJ/cm2至50 J/cm2的範圍內,較佳者為0.3 mJ/cm2至10 J/cm2的範圍內。一般使用的脈衝式雷射的脈衝頻率在1至30 kHz範圍內。
此處描述的感光性化合物可為有機或無機鹽類化合物,或鹽類化合物的混合物,皆帶有前述定義的不同陽離子的組合,其受雷射源照射之處會改變顏色。
這些化合物可為一般具有特定化學組成的鹽類,其由一種或多種陰離子與含多種且至少兩種不同元素的陽離子組合而成,亦可為無特定化學組成的組合物,但也可由至少兩種不同元素的陽離子所組成。
對於陰離子基本上亦無特別限定,它只要能讓有至少兩種不同元素的陽離子群能組成化合物。尤其是,大多採用有至少兩種不同元素的陰離子。
特別適合的組份是含有具週期表中的氧酸根陰離子(例外者為亞膦酸根(Phosphinaten)和二亞膦酸根(Diphosphinaten)和/或其聚合物)、有機羧酸陰離子或碳酸陰離子作為陰離子,與數種陽離子形成的組合。
這裡會被優先列入考慮的組合物為在所使用的光波長範圍中有吸光作用之未曝光的化合物。
另外亦會被列入考慮的組合物為其未曝光化合物的特徵色可經改變陽離子的莫爾比例來控制者。
本發明突顯出任意一未曝光化合物與其曝光後有著顯著的顏色差異。在CIELab系統中這表示如下式所示之dE*值的提高:
其中指數1代表未曝光的模塑材料,指數2為曝光後的模塑材料。
CIELab系統為1976年國際照明協會(Commission Internationale d’Eclairage)所訂定的色譜(Farbraum),等式中之L*表示亮度,a*表示紅-綠色值,b*表示黃-藍色值。
本發明的一種較佳實施態樣中,所擇之未曝光的化合物具有儘可能高的亮度(在CIELab色譜中也就是儘可能
高的L*亮度值)與儘可能不明顯的特徵顏色(在黑-白軸線中的差異儘可能地小,也就是儘可能小的a*與b*值)。則曝光的化合物具有儘可能低的亮度(儘可能小的L*亮度值)與儘可能不明顯的特徵顏色(儘可能低的a*與b*值)。
本發明的另一種較佳實施態樣中,所擇之未曝光的組合物具有儘可能高的亮度(在CIELab色譜中儘量高的L*亮度值)與儘可能不明顯的特徵顏色(在黑-白軸線中的差異儘可能地小,也就是儘可能小的a*與b*值)。在這裡,曝光的組合物具有儘可能明顯的特徵顏色(儘可能高的a*和/或b*值)。
據本發明的組成物之一種較佳實施態樣中,上述成分可以通式AaOo(OH)y z-表示,其中A表示三價或五價磷、四價鉬或六價鎢,a、o與z彼此獨立為從1至20的整數,且y為從0至10的整數。
根據本發明的組成物之一種較佳實施態樣中,該顏料含至少一種由兩種不同元素組成之組合物,且該兩種不同元素係選自:銅(Cu)、錫(Sn)、銻(Sb)與鐵(Fe)。
根據本發明的組成物之一種特別較佳實施態樣中,顏料包含五價磷酸與/或三價磷酸或其縮合產物之陰離子,或必要時更包含其他氫氧根離子,且陽離子包含銅(Cu)和鐵(Fe)、或銅(Cu)和錫(Sn)、或銅(Cu)和銻(Sb)、或錫(Sn)和鐵(Fe)。
較佳者為使用特別具有熱穩定性之金屬鹽類,如此使得經由攙入物質而製備的組合產物被混合至聚合物中時不致發生分解。可使用具有熱穩定性高於200℃(重量損失2%)之鹽類或配體(Ligand),較佳者為具有熱穩定性高於250℃(重量損失2%),更較佳者為具有熱穩定性高於300℃(重量損失2%)的鹽類或配體。
可經由攙入雜質、反應與將有機氮基化合物混入上述組合物(1)或(2)的金屬化合物中以製造得出具有感光性的防火材料組合物。攙入雜質意指藉由將一種或多種溶解型態或懸浮液型態之上述固態成份混合,以及隨後將該粉末狀產品乾燥而製造一種或多種粉末型態之上述固態成份之混合物。
所有根據本發明的產物具有阻燃與可雷雕的特性。
本發明涵蓋用於製造具有上述模塑材料的特性之同時防火又可以做雷雕的塑料物件之顏料。同時本發明也涉及具有上述特徵的顏料之用於製備防火與同時可雷雕的塑料物件的用途,尤其是用於熱塑性材料之生產。
用於本發明之模塑材料的顏料的製法係如下所述:在裝有水的攪拌器中加入0.1莫爾氫氧化銅(Kupferhydroxid)和0.1莫爾異氰尿酸(Isocyanursäure)並仔細拌勻。這會產生有鹽結晶的中和反應。接著加入1
莫爾磷酸亞錫(Trizinnphosphat即Sn3(PO4)2)。30分鐘後,以一比一比例加入10莫爾蜜胺和10莫爾氰尿酸(Cyanursäure)。攪拌全部混合物1小時後,在110℃下真空乾燥。
根據以下的方法,可以從所得的顏料製得本發明之模塑材料。並測量其防燃性與可雷雕特性。
這裡使用的雷射為一般市面上可取得的Nd-YAG-雷射(波長1064奈米)。對比值是由一台裝有顯微鏡的數位相機與圖片分析軟體計算出。防燃性係由一個根據UL94防火等級的UL箱測出。比較留痕指數值(CTI)則依據德國工業標準DIN IEC 60112/VDE 0303第一部分,RAL 7035項目作比對。
以上取得之熱塑性模塑材料不但有極佳的防燃性(自動熄滅),同時在雷射雕字方面有極高的對比值(K-值)。
用於本發明模塑材料的顏料(1)的製法係如下所述
:在一個50公升裝有攪拌器的反應鍋內加入29.25公升純水。在室溫下一邊攪拌一邊加入正磷酸(Orthophosphorsäure)(74.75莫爾)。因為放熱反應,反應鍋的內容物溫度升高且維持在50℃下10分鐘。接著一邊攪拌一邊緩緩加入蜜胺(74.75莫爾)以防止結塊。等到形成均勻的懸浮液後,再加入0.74莫爾氫氧化銅(Kupferhydroxid)與亞磷酸亞鐵(Eisen-II-phosphit)(0.29莫爾,Fe3(PO3)2)的混合物。全部混合物在100℃下持續攪拌1小時後,接著調高溫度並在真空狀態下乾燥。
所得之經攙入物質的蜜胺正磷酸鹽(Melaminorthophosphat)在340℃的烤箱中轉換成蜜胺聚磷酸鹽(Melaminpolyphosphat)。再仔細地將所得的產物研磨至5微米大小。
這個模塑材料同樣具有極佳的防燃性與可雷雕性(或K-值)。
Claims (16)
- 一種可用於製造高阻燃性物件之模塑材料,其包含一以熱塑性材料為材料之基質與散佈於該基質中之粒狀的防火顏料,此模塑材料之特徵在於,該顏料具感光性且經雷射照射後會改變顏色,該顏料係為至少一種不含鹵素之阻燃性有機氮基化合物與下列之反應產物:(1)至少一種含有至少兩個不同陽離子之複合鹽類,及/或(2)一鹽類化合物的混合物,其透過加熱可轉換成如(1)之至少一種含有至少兩個不同陽離子之複合鹽類,其中,種類(1)與(2)中至少一個陽離子係選自以下(A)類之元素:鈦(Ti)、鉻(Cr)、錳(Mn)、鐵(Fe)、鈷(Co)、鎳(Ni)、銅(Cu)、鋅(Zn)、釔(Y)、鋯(Zr)、鈮(Nb)、鉬(Mo)、銀(Ag)、錫(Sn)、銻(Sb)、鑭(La)、鐠(Pr)、鉭(Ta)、鎢(W)和鈰(Ce),且至少一個另一陽離子是選自以下(B)類之元素:週期表第3到6週期的第二與第三主族元素、第5和6週期的第四主族元素、與第4和5週期的第三至第八副族元素或鑭系元素。
- 如申請專利範圍第1項所述之模塑材料,其中,該顏料之顆粒大小的平均粒徑(d50)係為小於10微米。
- 如申請專利範圍第2項所述之模塑材料,其中,該顏料之顆粒大小的平均粒徑(d50)係為小於5微米。
- 如申請專利範圍第1至3項中任一項所述之模塑材料,其中,除該(A)類與該(B)類中各種陽離子外,其另外包含第2到第5週期的第一主族元素中的陽離子。
- 如申請專利範圍第1項所述之模塑材料,其中,該顏料含有具週期表中氧酸根陰離子(例外者為亞膦酸根(Phosphinaten)和二亞膦酸根(Diphosphinaten)和/或其聚合物)、及有機羧酸陰離子或碳酸陰離子作為陰離子的鹽類化合物。
- 如申請專利範圍第5項所述之模塑材料,其中,該顏料的陰離子包括含磷的氧酸根,尤其是氰尿酸鹽氧酸根(Cyanurat-Oxoanionen)、磷酸鹽氧酸根(Phosphat-Oxoanionen)、縮合磷酸鹽氧酸根、膦酸鹽氧酸根(Phosphonat-Oxoanionen)、亞磷酸鹽氧酸根(Phosphit-Oxoanionen)、與混合的氫氧化物與磷酸鹽氧酸根(Hydroxid-Phosphat-Oxoanionen)。
- 如申請專利範圍第1項所述之模塑材料,其中,該顏料的陰離子之通式為AaOo(OH)y z-,其中A表示五價磷、四價鉬或六價鎢,a、o與z彼此獨立地為從1至20的整數,且y為從0至10的整數。
- 如申請專利範圍第1項所述之模塑材料,其中,該顏料的陽離子元素選自於銅(Cu)、錫(Sn)、銻(Sb)、及/或鐵(Fe)。
- 如申請專利範圍第1項所述之模塑材料,其中, 該鹽類化合物陰離子係選自五價磷酸及/或三價磷酸或其縮合產物之陰離子,或必要時更包含其他氫氧根離子,且陽離子包含銅(Cu)和鐵(Fe)、或銅(Cu)和錫(Sn)、或銅(Cu)和銻(Sb)、或錫(Sn)和鐵(Fe)。
- 如申請專利範圍第1項所述之模塑材料,其中,(A)與(B)類的化合物彼此組合,使得這些化合物之未曝光的組合於157 nm至10.6 mm的波長範圍中吸收光。
- 如申請專利範圍第1項所述之模塑材料,其中,該模塑材料包含至少一種立體受阻酚與磷化合物當作輔助劑。
- 如申請專利範圍第1項所述之模塑材料,其中,該熱塑性材料基質包含必要時可以玻璃纖維強化之下列材料:聚丙烯、聚乙烯、聚醯胺、聚對苯二甲酸丁二醇酯(Polybutylenterephthalat)、聚對苯二甲酸乙二醇酯(Polyethylenterephthalat)、聚酯、聚苯醚(Polyphenylenoxid)、聚縮醛(Polyacetal)、聚甲基丙烯酸酯(Polymethacrylat)、聚甲醛(Polyoxymethylen)、聚乙烯醇縮乙醛(Polyvinylacetal)、聚苯乙烯(Polystyrol)、丙烯酸-丁二烯-苯乙烯(Acryl-Butadien-Styrol)(ABS)、丙烯腈-苯乙烯-丙烯酸酯(Acrylnitril-Styrol-Acrylester)(ASA)、聚碳酸酯(Polycarbonat)、聚醚碸(Polyethersulfon)、聚醚酮(Polyetherketon)、聚氯乙烯(Polyvinylchlorid)、及熱 塑性聚胺基甲酸酯(Polyurethan)、及/或其共聚物及/或混合物。
- 如申請專利範圍第1項所述之模塑材料,其中,該不含鹵素的有機氮基化合物包括蜜胺(Melamin)、蜜胺氰尿酸鹽(Melamincyanurat)、蜜胺正磷酸鹽(Melaminorthophosphat)、二蜜胺正磷酸鹽(Dimelaminorthophosphat)、蜜胺焦磷酸鹽(Melaminpyrrophosphat)、蜜胺聚磷酸鹽(Melaminpolyphosphat)、蜜胺硼酸鹽(Melaminborat)、部分酯化的磷酸(Phosphorsäureteilestern)之蜜胺鹽類、三價與五價磷氧化合物的一種或多種鹽類、聚磷酸銨(Ammoniumpolyphosphat)、磷酸硼及/或上述物質之混合物,及必要時其與協同物所形成之混合物,而該協同物可為季戊四醇(Pentaerythrit)、二季戊四醇(Dipentaerythrit)、三羥乙基異氰尿酸鹽(THEIC)、三氮雜苯聚合物(Triacinpolymere)、尿素(Harnstoff)、胍(Guanidin)、蜜勒胺(Melem)或蜜白胺(Melam)。
- 一種具光敏性且在雷射光的影響下會改變顏色之粒狀顏料,其特徵在於該顏料係為至少一種不含鹵素之阻燃性有機氮基化合物與下列之反應產物:(1)至少一種含有至少兩個不同陽離子之複合鹽類,及/或(2)一鹽類化合物的混合物,其透過加熱可轉換成如(1)之至少一種含有至少兩個不同陽離子之複合鹽 類,其中,種類(1)與(2)中至少一個陽離子係選自以下(A)類之元素:鈦(Ti)、鉻(Cr)、錳(Mn)、鐵(Fe)、鈷(Co)、鎳(Ni)、銅(Cu)、鋅(Zn)、釔(Y)、鋯(Zr)、鈮(Nb)、鉬(Mo)、銀(Ag)、錫(Sn)、銻(Sb)、鑭(La)、鐠(Pr)、鉭(Ta)、鎢(W)和鈰(Ce),且至少一個另一陽離子是選自以下(B)類之元素:週期表第3到6週期的第二與第三主族元素、第5和6週期的第四主族元素、與第4和5週期的第三至第八副族元素或鑭系元素。
- 一種如申請專利範圍第14項之顏料的用途,其係用於製造高阻燃性且可雷雕之塑料物件。
- 如申請專利範圍第15項之用途,其係用於製造高阻燃性且可雷雕之由熱塑性材料製得的塑料物件。
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- 2004-10-15 DE DE102004050479A patent/DE102004050479A1/de not_active Withdrawn
-
2005
- 2005-10-06 TW TW94134992A patent/TWI412552B/zh not_active IP Right Cessation
- 2005-10-14 AU AU2005296848A patent/AU2005296848B2/en not_active Ceased
- 2005-10-14 US US11/665,200 patent/US7863355B2/en active Active
- 2005-10-14 JP JP2007536189A patent/JP2008517087A/ja active Pending
- 2005-10-14 CN CN2005800353746A patent/CN101044225B/zh not_active Expired - Fee Related
- 2005-10-14 EP EP05796965A patent/EP1807484B1/de not_active Expired - Lifetime
- 2005-10-14 ES ES05796965T patent/ES2327433T3/es not_active Expired - Lifetime
- 2005-10-14 KR KR20077010275A patent/KR101276802B1/ko not_active Expired - Fee Related
- 2005-10-14 DE DE200550007587 patent/DE502005007587D1/de not_active Expired - Lifetime
- 2005-10-14 AT AT05796965T patent/ATE434655T1/de not_active IP Right Cessation
- 2005-10-14 WO PCT/EP2005/055282 patent/WO2006042830A1/de not_active Ceased
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20070084003A (ko) | 2007-08-24 |
| TW200626644A (en) | 2006-08-01 |
| EP1807484A1 (de) | 2007-07-18 |
| WO2006042830A1 (de) | 2006-04-27 |
| US20080255278A1 (en) | 2008-10-16 |
| DE102004050479A1 (de) | 2006-04-27 |
| AU2005296848B2 (en) | 2011-02-03 |
| DE502005007587D1 (de) | 2009-08-06 |
| CN101044225A (zh) | 2007-09-26 |
| ES2327433T3 (es) | 2009-10-29 |
| EP1807484B1 (de) | 2009-06-24 |
| AU2005296848A1 (en) | 2006-04-27 |
| CN101044225B (zh) | 2011-01-19 |
| JP2008517087A (ja) | 2008-05-22 |
| HK1110622A1 (zh) | 2008-07-18 |
| ATE434655T1 (de) | 2009-07-15 |
| KR101276802B1 (ko) | 2013-06-20 |
| US7863355B2 (en) | 2011-01-04 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |