TWI409976B - Light emitting diode pakage struture and the method thereof - Google Patents

Abstract

A method of encapsulating the light-emitting diode package structure includes the following steps: providing a substrate which has a first surface and a second surface opposite to the first surface; disposing a circuit structure which divides the substrate into several main practice places and the non- practice places on the first surface of the substrate; disposing the support structure on the substrate; disposing some dies in the main practice places; and disposing the package with covering the dies. The present invention also provides a method of manufacturing the substrate of the light-emitting diode.

Description

Light-emitting diode package structure and manufacturing method thereof

The invention relates to a light emitting diode package structure, in particular to a light emitting diode package structure and a manufacturing method thereof.

Light Emitting Diode (LED) is usually fabricated by forming a circuit structure on a resin or plastic substrate, and then fixing the LED die to the substrate and electrically connecting with the circuit structure, and finally forming The encapsulation layer covers the light emitting diode die and is cut to form a plurality of components.

However, with the trend of increasingly thinner LEDs today, substrates carrying light-emitting diode dies are becoming thinner and thinner. However, due to the reduction in the thickness of the thin substrate, the rigidity of the substrate is lowered to cause the substrate to bend, which in turn causes the substrate to be uneven and the manufacturing yield to be degraded. Therefore, how to provide a light emitting diode package structure and a method for manufacturing the same that overcome the above disadvantages is a problem to be solved in the industry.

In view of the above, it is necessary to provide a light emitting diode package structure and a method of manufacturing the same that enhance the rigidity of the substrate.

A method for fabricating a light emitting diode structure, the method comprising: a first step of providing a substrate having a first surface and an opposite second surface; and a second step of disposing a circuit structure on the substrate, and the circuit structure The third step extends to the second surface; the third step is to set the support structure on the substrate; in the fourth step, a plurality of light-emitting diode chips are disposed on the substrate and electrically connected with the circuit structure; The encapsulation layer covers the light emitting diode grains.

A light emitting diode package structure includes a substrate, a circuit structure disposed on the substrate, a light emitting diode die disposed on the substrate and electrically connected to the circuit structure, disposed on the substrate and covering the light emitting diode die An encapsulation layer and a support structure disposed on the substrate.

Compared with the prior art, the present invention utilizes a support structure formed on a substrate to absorb substrate tension or stress, and at the same time increase rigidity of the substrate structure, thereby avoiding deformation of the substrate, thereby reducing problems such as unevenness of the substrate and a decrease in yield.

The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.

10‧‧‧Substrate

11‧‧‧ first surface

12‧‧‧ second surface

13‧‧‧ hole

20‧‧‧Circuit structure

21‧‧‧Main operating area

22‧‧‧ Non-main operating area

30‧‧‧Support structure

31‧‧‧Main support

32‧‧‧ Peripheral support

33‧‧‧ Extended support

40‧‧‧Light-emitting diode grains

50‧‧‧Encapsulation layer

1 is a flow chart of a method of fabricating a light emitting diode package structure according to an embodiment of the invention.

2 is a step of manufacturing a light emitting diode package structure according to an embodiment of the invention A schematic cross-sectional view of a light-emitting diode package structure obtained by the step.

3 is a top plan view of a light emitting diode package structure obtained by the second step of the method for fabricating a light emitting diode package structure according to an embodiment of the invention.

4 is a top plan view of a light emitting diode package structure obtained by the third step of the method for fabricating a light emitting diode package structure according to an embodiment of the invention.

FIG. 5 is a top view of a light emitting diode package structure obtained by the third step of the method for fabricating a light emitting diode package structure according to another embodiment of the invention.

FIG. 6 is a top view of a light emitting diode package structure obtained by the fourth step of the method for fabricating a light emitting diode package structure according to an embodiment of the invention.

FIG. 1 shows a flow of a method of fabricating a light emitting diode package structure according to an embodiment of the invention. The manufacturing method of the LED package structure generally includes the following steps: a first step, providing a substrate 10 having a first surface 11 and an opposite second surface 12; and a second step of disposing the circuit structure 20 on the substrate 10 The third step is to set the support structure 30 on the substrate 10; in the fourth step, a plurality of LED dies 40 are disposed on the substrate 10 and electrically connected to the circuit structure 20; and in the fifth step, the encapsulation layer 50 is disposed. The substrate 10 is covered on the substrate 10 and covers the light emitting diode die 40.

The process will be described in detail below in conjunction with other diagrams. Referring to FIG. 2 and FIG. 3 simultaneously, first, as shown in step 102, a substrate 10 is provided. The substrate 10 has a flat shape and includes a first surface 11 and an opposite second surface 12. The substrate 10 is provided with a plurality of main work areas 21 and non-main work areas 22, wherein the non-main work areas 22 isolate the main work areas 21 from each other. In the present embodiment, each of the main working areas 21 is provided with a non-main working area 22, and in other embodiments, the non-main working areas 22 may be distributed only between the main working areas 21. The material of the substrate 10 may be resin or plastic.

Then, as shown in step 104, a circuit structure 20 is disposed on the first surface 11 of the substrate 10, the circuit structure 20 extending from the first surface 11 to the second surface 12, the circuit structures 20 being distributed throughout the main work area 21. The fabrication of the circuit structure 20 includes first forming a hole 13 through the first surface 11 and the second surface 12 on the substrate 10 by mechanical, etching or laser processing techniques, and then using holes, holes, or plating techniques in the holes 13 A circuit structure 20 is formed therein, and the circuit structure 20 is exposed to the outside of the first surface 11 and the second surface 12, respectively. In addition, the embodiment may further include a process of forming a solid crystal recessed region (not shown) for carrying the crystal grains on the first surface 11 of the substrate 10 by a technique of laser processing, mechanical or polishing.

Next, as shown in step 106, a support structure 30 is disposed on the substrate 10. Referring to FIG. 4, the support structure 30 in this embodiment includes a main support 31 located completely within the non-main work area 22 and located between the main work areas 21, a peripheral support 32 located around the periphery of the substrate 10, and from the main work area. The circuit structure 20 of 21 extends to the extended support 33 of the non-primary work area 22. The extension support 33 and the partial trunk support 31 are interdigitated. In this embodiment, the main support 31 and the peripheral support 32 is interconnected. In another embodiment, the backbone support 31 and the peripheral support 32 are separated from one another without contact, as shown in FIG. The support structure 30 can be disposed only on the first surface 11, or on the second surface 12, or simultaneously on the first surface 11 and the second surface 12. In this embodiment, the support structure 30 is disposed on the first surface. On the surface 11. The material of the support structure 30 can be metal and made using techniques such as evaporation, sputtering or electroplating. Of course, in other embodiments, the support structure 30 can also be made of resin or plastic material using printing or screen printing techniques. When the support structure 30 is made of a metal material, the fabrication of the support structure 30 can be completed in synchronization with the fabrication of the circuit structure 20. When the support structure 30 is made of a resin or a plastic material, it is required to be completed after the step of disposing the circuit structure 20. In other embodiments, the trunk support 31, the perimeter support 32, and the extension support 33 in the support structure 30 may retain only one or more of them. For example, the support structure 30 may only include the non-main work area 22 The trunk support 31, which is located between the main work areas 21, may also include a main support 31 and an extended support 33 extending from the main work area 21 to the non-main work area 22.

Since the support structure 30 can increase the rigidity of the substrate 10 and absorb the tension or stress of the substrate 10, deformation of the substrate 10 can be avoided, and the problem of a decrease in yield due to deformation of the substrate 10 can be reduced.

As shown in step 108, and referring to FIG. 6, together, a plurality of LED dies 40 are disposed on the substrate 10. The plurality of LED dies 40 are located in the main working area 21 and electrically connected to the circuit structure 20. connection. The step of electrically connecting can be completed by flip chip, eutectic or solid crystal wiring. In this embodiment, a plurality of light-emitting diode dies 40 and the circuit structure 20 are electrically connected by a solid crystal wire bonding method. Sexual connection.

As shown in step 110, an encapsulation layer 50 is disposed on the substrate 10 and covers all of the light emitting diode dies 40. The encapsulation layer 50 can be formed by a die casting process using a resin, epoxy resin or other transparent material. In the present embodiment, the encapsulation layer 50 includes a fluorescent conversion material that can change the light characteristics of the emitted light after receiving the light of the LED dipoles 40. The fluorescent conversion material may be garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide-based phosphor powder, thiogallate-based phosphor powder, and nitride. Base fluorescent powder.

It is to be understood that those skilled in the art can make various other changes and modifications in accordance with the technical concept of the present invention, and all such changes and modifications are intended to fall within the scope of the appended claims.

Claims (7)

A manufacturing method of a light emitting diode package structure, comprising the steps of: providing a substrate having a first surface and an opposite second surface; and a second step of disposing a circuit structure on the substrate, and The circuit structure extends from the first surface to the second surface; in the third step, the support structure is disposed on the substrate, the support structure is made of a metal material, is formed by evaporation, sputtering or electroplating, and is completed synchronously with the set circuit structure In the fourth step, a plurality of light-emitting diode chips are disposed on the substrate and electrically connected to the circuit structure; and in the fifth step, the package layer is disposed to cover the light-emitting diode grains. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the substrate comprises a plurality of main working areas and a plurality of non-main working areas, and the non-main working areas are to In isolation, the circuit structure is disposed in a main working area of the substrate. A method of manufacturing a light emitting diode package structure according to claim 2, wherein the support structure comprises a trunk support disposed in the non-main operation area and located between the main operation areas. The method for manufacturing a light emitting diode package structure according to claim 3, wherein the support structure further comprises an extended support extending from the main working area to the non-main working area, the extended support and the trunk Support each other Wrong setting. A method of manufacturing a light emitting diode package structure according to claim 3, wherein the support structure further comprises a peripheral support disposed at a periphery of the substrate. The method of manufacturing a light emitting diode package according to claim 5, wherein the trunk support and the peripheral support are connected to each other or separated from each other. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the support structure is disposed on one of the first surface or the second surface, or is disposed on the first surface and the first surface. Two surfaces.