TWI409928B - Universal chip-on-lead leadframe - Google Patents

Abstract

Disclosed is an universal Chip-On-Lead (COL) leadframe. A molding area is defined, the leadframe primarily comprises a plurality of first-sided leads and a plurality of second-sided leads. The first-sided leads formed in the molding area are central inner leads each having a central convergent finger through a first wire-bonding area and a central extended finger extending into a second wire-bonding area. The second-sided leads formed in the molding area are lateral inner leads each having a lateral convergent finger through the second wire-bonding area and a lateral extended finger extending into the first wire-bonding area. Accordingly, the two-sided leads can carry a chip by attaching backside of the chip to the central and lateral inner leads. Additionally, the leadframe is universal for two kinds of chips having different pad arrangements.

Description

Lead frame for wafer on shared pin

The present invention relates to components of a semiconductor device, and more particularly to a lead frame for a chip-on-lead (COL).

In the evolution of wafer carriers used in semiconductor packages, leadframes have long been used due to their low material cost and high reliability. For semiconductor products with low input/output pins, the package construction using leadframes is still cost effective. . When the wafer is electrically connected to the lead frame, the lead material of the lead frame may be copper, iron or an alloy thereof, and the material of the bonding wire is gold, but the bonding property between copper and gold is not good, so usually The area on the lead frame where the wire is to be grounded (for example, the finger joint portion) is pre-plated with a silver layer or a metal that is easy to bond, and when the wire is wired, the wire is bonded to the silver layer on the lead to form a metal bond structure. The bonding wire can electrically connect the pad of the wafer to the pin of the lead frame. Depending on the location of the carrier chip, the lead frame can be further divided into a conventional lead frame using a wafer holder, a lead frame on a lead on a chip (LOC), and a lead frame on a lead-on-chip (COL), wherein "on-wafer leads" ( The difference between LOC) and "on-wafer chip" (COL) is that the "lead on the wafer" (LOC) is to attach the lead of the lead frame to the active side of the wafer, and the "on-wafer" is the back of the wafer. Attached to the lead of the lead frame. The conventional "on-chip" (COL) leadframe has several disadvantages. The carrier carrying the wafer on one side leads to poor bearing capacity and is susceptible to mold flow and wafer offset. In addition, there is a specificity for the wafer on the lead frame design, that is, the sharing is poor.

As shown in FIG. 1A, a lead frame 100 for a pin-on-chip (COL) is defined as a die seal region 110. The molding region 110 is a predetermined formation region of the encapsulant 40 formed by a molding (as shown in FIG. 1C). The molding region 110 has a first side 111 and a second side 112 parallel to each other for introduction of the pins on both sides. The die seal region 110 includes a wire bonding region 113 relatively close to the first side edge 111. The lead frame 100 includes a plurality of first side pins 120 disposed on the first side 111 and a plurality of second side pins 130 disposed on the second side 112. The pins 120 and 130 are formed by the same lead frame 100, and are all made of a metal material such as copper, iron or an alloy thereof, and the cutting operation after the molding can separate the pins. The first side pin 120 and the second side pin 130 have different lengths depending on the type of the package to be packaged, and the second side pin 130 is longer than the first side pin 120 and is carried by the one-side long pin. A first wafer 10 (as shown in Figure 1B). The second side pin 130 has a plurality of short side inner pins 122 in the mold sealing area 110. The short side inner pins 122 extend to the wire bonding area 113 to form a plurality of central convergence fingers. 123. The second side pins 130 have a plurality of long-side inner leads 132 in the mold-sealing region 110. The long-side inner leads 132 extend to the wire bonding area 113 to form a plurality of sides. The extension finger 134 is extended.

As shown in FIGS. 1B and 1C , the back surface of the first wafer 10 is adhered to the second side lead 130 of the lead frame 100 , and the active surface of the first wafer 10 has a plurality of first pads 11 . The pads 11 are arranged unilaterally adjacent to the wire bonding region 113 (cf. Figures 1A and 1B). As shown in FIGS. 1B and 1C, the short-side inner pins 122 are fixed by a first insulating tape 150, and the long-side inner leads 132 are adhered by a second insulating tape 160 for fixing. An electroplated bonding layer 140 is formed on the upper surface of the central converging contact fingers 123 and the side extending fingers 134 in the wire bonding region 113 for the plurality of first bonding wires 31 to be formed by the first bonding pads 11 is electrically bonded to the plated bonding layer 140 on the central convergence fingers 123 and the side extension fingers 134. As shown in FIGS. 1A and 1B, the central convergence fingers 123 and the side extension fingers 134 are designed in the wire bonding region 113 and outside the first wafer 10 to provide connection thereto. The shortest wire-bonding distance of the first pads 11. Therefore, in order to match the pad configuration of the first wafer 10, the second side pins 130 should be longer than the first side pins 120 to carry the first wafer 10 with a single-sided pin.

As shown in FIG. 2A, there is another lead-on-chip (COL) lead frame 200. Similarly, the lead frame 200 defines a molding area 210, and the molding area 210 is a sealing body 40. The predetermined formation region (as shown in Fig. 2C) may be the same size as the aforementioned molding region 110. The molding area 210 has a first side 211 and a second side 212 that are parallel to each other. Depending on the type of wafer to be used, the mold region 210 includes a wire bond region 214 adjacent the second side 212. The lead frame 200 includes a plurality of first side pins 220 and a plurality of second side pins 230. The first side pin 220 is longer than the second side pin 230, and carries a second wafer 20 with a single long pin (as shown in FIG. 2B).

As shown in FIGS. 2B and 2C, the back surface of the second wafer 20 is adhered to the first side pin 220 of the lead frame 200, and the active surface of the second wafer 20 has a plurality of second pads 21, The pads 21 are arranged unilaterally adjacent to the wire bonding region 214 (cf. Figures 2A and 2B). The first side pins 220 have a plurality of long side pins 222 in the mold region 210. The long side pins 222 extend to the wire bonding region 214 to form a plurality of central extensions. Finger 224. As shown in FIG. 2C, the long-side inner leads 222 can be fixed by a second insulating tape 260. The second side pins 230 have a plurality of short side inner pins 232 in the mold sealing area 210. The short side inner pins 232 extend to the wire bonding area 214 to form a plurality of sides. Convergence refers to 233.

As shown in FIG. 2A and FIG. 2B, the central extension fingers 224 and the upper surface of the side convergence fingers 233 are formed with an electroplated bonding layer 240 in the wire bonding region 214 for a plurality of second bonding wires. The second bonding pads 21 are electrically bonded to the plating bonding layer 240 on the central extension fingers 224 and the side convergence fingers 233. As shown in FIGS. 2A and 2B, the central extension fingers 224 and the side convergence fingers 233 are designed in the wire bonding region 214 and outside the second wafer 20 to provide connections thereto. The shortest wire bonding moment of the second pad 21 is separated. Therefore, in order to match the pad configuration of the second wafer 20, the first side pins 220 are longer than the second side pins 230, and the second wafer 20 is carried by the one-sided pins.

At the same time, in comparison with the first and second embodiments, in order to carry the wafers 10 and 20 of different designs, it is necessary to design the lead frames 100 and 200 having different lead lengths on both sides to adapt to the wire position and the wafer of the wafers 10 and 20. Dimensions, because the wire bonding area is distributed on different sides, the supplier needs to have two kinds of plating molds and two kinds of masks to meet different lead frames 100 and 200, which causes the equipment cost to increase and the lead frame to be increased.

The main object of the present invention is to provide a lead frame for a chip on a common pin, which is suitable for wafers of two different pad positions, only one set of plating mold and mask, and can be applied to multi-wafer stacking. In addition, the central and side inner leads of the different side extensions are attached to the back side of the wafer, and the pins on both sides can collectively carry the wafer to avoid wafer offset during molding.

The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The present invention discloses a lead frame for a chip on a shared pin, which defines a die seal region having first and second sides parallel to each other, and the die seal region includes a proximity a first wire bonding zone on the first side and a second wire bonding zone adjacent to the second side. The lead frame mainly includes a plurality of first side pins and a plurality of second side pins. The first side pins have a plurality of first outer leads outside the molding area and arranged on the first side, and a plurality of central inner pins in the molding area, wherein the The central inner pin is converged toward a center line of the mold sealing area, and the central inner lead is formed through the first wire bonding area to form a plurality of central convergence fingers, and the central inner pins are The end system extends to the second wire bonding zone to form a plurality of central extension fingers. The second side pins have a plurality of second outer leads outside the mold sealing region and arranged on the second side, and a plurality of pins in the mold sealing region and dispersed in the central pins The inner side pins of the two sides, wherein the inner side pins converge toward the two sides of the mold sealing area without interleaving between the central inner pins, and the inner side pins are passed through The second wire bonding region is formed as a plurality of side convergence fingers, and the side inner pins extend to the first wire bonding region to form a plurality of side extension fingers. The central convergence fingers are aligned with the side extension fingers in a straight line, and the central extension fingers are aligned with the side convergence fingers in a straight line.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.

In the above lead frame, the central convergence fingers, the side extension fingers, and the central extension fingers may form an electroplated bonding layer with the side convergence fingers.

In the aforementioned lead frame, the plating joint layer may be a silver layer.

In the aforementioned lead frame, the side inner pins can pass through the first wire bonding zone such that the inner ends thereof are formed into a plurality of mold flow balance fingers.

In the foregoing lead frame, the gap distance of the mold flow balance fingers to the first side may correspond to the gap distance between the central extension fingers and the second side.

In the foregoing lead frame, a first insulating tape may be further disposed between the first side edge and the first wire bonding area, and the mold flow balance fingers and the central inner pins are attached and fixed. .

In the lead frame, a second insulating tape may be further disposed between the first wire bonding zone and the second wire bonding zone, and the central pins are attached and fixed to the side edges. Pin.

In the foregoing lead frame, at least one independent short pin may be further included in the mold sealing area and attached by the second insulating tape.

In the lead frame of the foregoing, the side inner pins may have a planar concave meander between the first wire bonding zone and the second wire bonding zone.

In the aforementioned lead frame, at least one of the central inner leads of the central inner leads may have a widened hollow portion.

In the aforementioned lead frame, at least one of the side inner pins of the side inner pins may have a widened hollow portion.

It can be seen from the above technical solutions that the lead frame of the chip on the shared pin of the present invention has the following advantages and effects:

1. Each of the two pins can have a central inner pin and a side inner pin, and each inner pin has two kinds of fingers in different wire bonding areas as one of the technical means, and is applicable to two different types. The wafer at the pad location, the plating mold and the mask are only one set and can be used for multi-wafer stacking. In addition, the central and side inner leads of the different side extensions can be attached to the back side of the wafer to collectively carry the wafer, thereby avoiding wafer offset during molding.

Second, the two sides of the pin can have a central inner pin and a side inner pin, each inner pin has two kinds of fingers in different wire bonding areas as one of the technical means, so that different designs of the chip share The same lead frame reduces the preparation of the lead frame in the factory.

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings in which FIG. The components and combinations related to this case, the components shown in the figure are not drawn in proportion to the actual number, shape and size of the actual implementation. Some size ratios are proportional to other related sizes or have been exaggerated or simplified to provide clearer description of. The actual number, shape and size ratio of the implementation is an optional design, and the detailed component layout may be more complicated.

In accordance with an embodiment of the present invention, a lead frame for a wafer on a shared pin is illustrated in a top view of Figures 3A through 3C. The lead frame of the chip on the shared pin, wherein the "on-pin wafer" is the Chinese name of the Chip-On-Lead, referred to as COL, and the back side of the chip is adhered to the package type on the pin. The lead frame 300 defines a die seal area 310. The mold seal area 310 has a first side 311 and a second side 312 which are parallel to each other. The mold seal area 310 includes a first side 311 adjacent to the first side 311. The first wire bonding zone 313 and a second wire bonding zone 314 are adjacent to the second side edge 312. Referring to FIGS. 4A and 5A, the lead frame 300 has a commonality, and one of the first pads 10 or/and a second wafer 20 can be provided with different pad position designs, wherein the first wafer 10 is soldered. The pad configuration is adjacent to the first wire bonding region 313, and the pad configuration of the second wafer 20 is adjacent to the second wire bonding region 314. The molding area 310 is formed by forming a gel 40 (as shown in FIG. 4B ). Generally, the sealing area 310 is larger than the wafers 10 and 20 , so that the sealing body 40 can seal the wafers 10 smoothly. 20. In this embodiment, the first wafer 10 can be smaller than the second wafer 20. The first wire bonding area 313 is provided with the wire frame 300 for electrically connecting to the first wafer 10 . The second wire bonding area 314 is provided with the wire frame 300 for electrically connecting to the second wafer 20 . In the present embodiment, as shown in FIG. 3A, the wire bonding regions 313 and 314 are arranged in parallel straight lines to conform to the pad configuration of different wafers.

The lead frame 300 mainly includes a plurality of first side pins 320 and a plurality of second side pins 330. The first side pins 320 and the second side pins 330 are the same metal material of the same layer of the lead frame 300, and the material thereof may be copper, iron or an alloy thereof. The first side pins 320 extend from the first side 311 to the second side 312. The second side pins 330 extend from the second side 312 to the first side 311.

Referring to FIGS. 3A and 3B, the first side pins 320 have a plurality of first outer leads 321 outside the mold region 310 and arranged on the first side 311, and a plurality of The central inner lead 322 in the die seal area 310, wherein the central inner leads 322 converge toward a center line 315 of the mold sealing area 310. In other words, the gaps of the central inner leads 322 are smaller than the first A gap between the outer leads 321 and tends to concentrate on the centerline 315. The central inner pins 322 are formed through the first wire bonding regions 313 to form a plurality of central convergence fingers 323, and the inner ends of the central inner pins 322 extend to the second wire bonding regions 314. Formed as a plurality of central extension fingers 324. As shown in FIG. 3A, the central convergence fingers 323 are positioned within the first wire bonding zone 313, and the central extension fingers 324 are positioned within the second wire bonding zone 314. The central extension fingers 324 are the free ends of the first side pins 320.

Referring to FIGS. 3A and 3C, the second side pins 330 have a plurality of second outer leads 331 outside the mold region 310 and arranged on the second side 312, and a plurality of The die pad 310 is disposed on the side inner pins 332 of the two inner pins 322. In other words, the gap between the side inner pins 332 is smaller than the gap between the second outer pins 331. Away away from the direction of the centerline 315. The side inner pins 332 are adjacent to the sides of the two outer pins of the mold region 310 (ie, the vertical sides between the first side 311 and the second side 312). They are not interleaved between the central inner leads 322 to ensure alignment with the conventional two (multiple) non-shared leadframes. Moreover, the side inner pins 332 are formed through the second wire bonding region 314 to form a plurality of side convergence fingers 333, and the side inner pins 332 extend to the first wire bonding region. 313 is formed as a plurality of side extension fingers 334. The central convergence fingers 323 and the side extension fingers 334 are aligned in a straight line and are located in the first wire bonding area 313. The central extension fingers 324 and the side convergence fingers The 333 series alignment is arranged in a straight line and is located in the second wire bonding area 314. In other words, the first side pins 320 and the second side pins 330 are long pins and are not interleaved by individual pins, and the first side pins 320 and the second side pins 330 Any one of the first wire bonding area 313 and the second wire bonding area 314 are connected to each other and the fingers of the different side pins are divided into a center and a side, and can be electrically connected by wire bonding. Wafers with different pad configurations.

As shown in FIG. 4B, after the die bonding, wire bonding, and formation of the package body 40, the first side pins 320 and the second side pins 330 may be formed by a chipping machine by a frame removing step ( As shown in FIG. 3A, the frame of the lead frame 300 is cut and separated, and then the forming operation of bending the first outer leads 321 and the second outer leads 331 is performed as external electrical transmission. The first outer leads 321 and the second outer leads 331 can be bent into a gulla lead or can be bent into other shapes, such as an I shape or a J shape.

Specifically, as shown in FIG. 3A, the central convergence fingers 323, the central extension fingers 324, the side convergence fingers 333, and the side extension fingers 334 are each formed with a plating joint. Layer 340 (as in the diagonal portion of Figure 3A) to enhance the reliability of wire bonding. Typically, the plated bonding layer 340 can be a silver layer.

Further, as shown in FIGS. 3A and 3C, preferably, the side inner pins 332 can pass through the first wire bonding region 313 such that the inner ends thereof are formed into a plurality of mold flow balance fingers 335. In the past, the single-sided long pin carrier chip can not match the mold flow balance effect. The mold flow balance fingers 335 are the suspended inner ends of the second side pins 330. More specifically, as shown in FIGS. 6A and 6B, the gap distance D1 of the mold flow balance fingers 335 to the first side edges 311 may correspond to the central extension fingers 324 to the second side edges 312. The gap distance D2 is more effective in making the mold flow balance when the sealant is molded. The allowable error of the "equal" gap distance referred to above (ie, the absolute value of D1 minus D2 divided by the percentage of D1 or D2) may be less than 10%.

Specifically, as shown in FIGS. 4A and 4B, the lead frame 300 may further include a first insulating tape 350 disposed on the first side edge 311 and the first wire bonding area 313 (ie, provided) Between the central convergence fingers 323 and the positions of the side extension fingers 334, the mold flow balance fingers 335 and the central inner pins 322 can be attached and affixed. In addition, the lead frame may further include a second insulating tape 360 between the first wire bonding zone 313 and the second wire bonding zone 314 (as shown in FIG. 3A), and attach and fix the wires. The central inner pin 322 and the side inner pins 332. The first insulating tape 350 and the second insulating tape 360 are electrically insulated adhesive patches, and the material thereof may be polyimide, such as Kapton. tape. As shown in FIG. 4B, the first insulating tape 350 and the second insulating tape 360 are simultaneously attached and fixed on the lower surfaces of the two side pins 320 and 330 to stabilize the two sides of the pins. In the case of the conventional insulating tape, only one side of the pin can be adhered, and the pin can be displaced or shaken during the molding.

As shown in FIGS. 3A and 4A, the lead frame 300 may further include at least one independent short lead 370 which is completely formed in the mold sealing area 310 and is attached and fixed by the second insulating tape 360. The independent short pin 370 can be a dummy lead for the non-electrical transfer function to eliminate static electricity.

Specifically, as shown in FIGS. 3A and 3C, the side inner pins 332 may be concave and concave between the first wire bonding region 313 and the second wire bonding region 314. The central inner pins 322 are retracted in the direction to increase the bonding force of the side inner pins 332. Preferably, at least one central inner lead 322 of the central inner leads 322 can have a widened hollow portion 322A. At least one of the side inner pins 332 of the side inner pins 332 may have a widened hollow portion 332A. The widened hollow portions 322A, 332A can be disposed in the first wire bonding region 313, and the pin width can be increased to provide better wire-supporting force, because the sealing body fills the hollow portion to achieve better locking. force.

Referring to Figures 4A and 5A, the lead frame 300 of the present invention can be used to provide wafers 10, 20 of different pad settings, the wafers 10, 20 having different side pad configurations and having different wafer sizes. In the package appearance of the TSOP48 for DDR, the 4th, 5th, 6th, 7th, 8th, 9th, 10th, 12th, 13th, 14, 15, 16, and 17 of the first side pins 320 may be The 18 and 19 pins are pulled to but not to the second side 312. This design has the flexibility and commonness of the conventional lead frame, and the plating area is on the left and right sides (ie, the first wire bonding area 313 of FIG. 3A and The second wire bonding zone 314), so the mold only needs to open one set and can simultaneously plate the wire bonding areas on the left and right sides. The structure can be packaged in a single chip package or a multi-wafer stack. In addition, the central and side inner leads of the different side extensions can be attached to the back side of the wafer, and the pins on both sides can share the wafer together to avoid wafer offset during molding.

As shown in FIGS. 4A and 4B, the active surface of the first wafer 10 has a plurality of first pads 11 which are unilaterally arranged adjacent to the first bonding region 313 ( As shown in FIG. 3A, the first wafer 10 can be electrically connected to the central convergence fingers 323 and the side extension fingers 334 by a plurality of first bonding wires 31. As shown in FIGS. 5A and 5B, the active surface of the second wafer 20 has a plurality of second pads 21 which are arranged unilaterally adjacent to the second bonding region 314 (eg, As shown in FIG. 3A , the second wafer 20 can be electrically connected to the central extension fingers 324 and the side convergence fingers 333 by a plurality of second bonding wires 32 .

As shown in FIGS. 4B and 5B, the package body 40 may be formed by a molding (or transfer forming) method to seal the first wafer 10 (or the second wafer 20), the bonding wires 31 (or 32), and the The central inner pins 322 and the inner inner pins 332 are used to isolate the internal components from the outside world from external impact or contamination. The package 40 can be an insulating thermosetting resin containing a cerium oxide filler, such as an epoxy molding compound (EMC). Therefore, the first wafer 10 and the second wafer 20 can share the same lead frame, and the supplier can change the photomask and increase the plating area without increasing the equipment cost, and there is no material preparation problem in the factory, thereby saving cost. In the multi-wafer stack package (not shown), the first wafer 10 may be pre-disposed on the lead frame 300, and its single-sided pad 11 is wired to the first wire bonding region 313, and then stacked. The second wafer 20 is wired to the second bonding pad 314 to complete different types of multi-wafer stacking on the lead frame of the wafer on the common pin.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modifications, equivalent changes and modifications made without departing from the technical scope of the present invention are still within the technical scope of the present invention.

D1. . . distance

D2. . . distance

10. . . First wafer

11. . . First pad

20. . . Second chip

twenty one. . . Second pad

31. . . First wire bond

32. . . Second wire

40. . . Sealant

100. . . Lead frame

110. . . Molded area

111. . . First side

112. . . Second side

113. . . Wire junction

120. . . First side pin

122. . . Short-edge pin

123. . . Central convergence

130. . . Second side pin

132. . . Long side pin

134. . . Side extension finger

140. . . Plating joint

150. . . First insulating tape

160. . . Second insulating tape

200. . . Lead frame

210. . . Molded area

211. . . First side

212. . . Second side

214. . . Wire junction

220. . . First side pin

222. . . Long side pin

224. . . Central extension finger

230. . . Second side pin

232. . . Short-edge pin

233. . . Side convergence

240. . . Plating joint

260. . . Second insulating tape

300. . . Lead frame

310. . . Molded area

311. . . First side

312. . . Second side

313. . . First junction area

314. . . Second wire joint

315. . . Center line

320. . . First side pin

321. . . First outer pin

322. . . Central pin

322A. . . Widening the hollow

323. . . Central convergence

324. . . Central extension finger

330. . . Second side pin

331. . . Second outer pin

332. . . Side pin

332A. . . Widening the hollow

333. . . Side convergence

334. . . Side extension finger

335. . . Mold flow balance

340. . . Plating joint

350. . . First insulating tape

360. . . Second insulating tape

370. . . Independent short pin

1A to 1C are schematic plan views and cross-sectional views of a lead frame of a conventional lead frame after the first wafer is disposed.

2A to 2C are schematic top views of a conventional lead frame, and a schematic plan view and a cross-sectional view of the lead frame after the second wafer is disposed.

3A-3C are top plan views of a lead frame of a common pin-on-chip, a top view of a first side pin, and a top view of a second side pin, in accordance with an embodiment of the present invention.

4A and 4B are schematic top and cross-sectional views of a lead frame of a wafer on a shared pin according to an embodiment of the present invention after the first wafer is disposed.

5A and 5B are schematic top and cross-sectional views of a lead frame of a wafer on a shared pin according to an embodiment of the present invention after a second wafer is disposed.

6A and 6B are partially enlarged plan views showing a first side and a second side of a lead frame of a wafer on a shared pin according to an embodiment of the present invention.

300‧‧‧ lead frame

310‧‧‧Molding area

311‧‧‧ first side

312‧‧‧ second side

313‧‧‧First wire junction

314‧‧‧Second wire junction

315‧‧‧ center line

320‧‧‧First side pin

321‧‧‧First outer lead

322‧‧‧Central pin

322A‧‧‧ widened hollow

323‧‧‧Central convergence finger

324‧‧‧Central extension finger

330‧‧‧Second side pin

331‧‧‧Second outer pin

332‧‧‧ Side pin

332A‧‧‧ widened hollow

333‧‧‧Side convergence

334‧‧‧Side extension finger

335‧‧‧Moldflow balance

340‧‧‧Electroplating joint

370‧‧‧Independent short pin

Claims (11)

A lead frame for a chip on a shared pin, defining a die seal region having first and second sides parallel to each other, the die seal region including a first side adjacent to the first side a first wire bonding area of the edge and a second wire bonding area adjacent to the second side, the lead frame comprising: a plurality of first side pins, the plurality of which are outside the molding area and arranged a first outer lead of the first side and a plurality of central inner leads in the mold region, wherein the central inner leads converge toward a center line of the mold sealing area, and the central inner leads a plurality of central convergence fingers are formed through the first wire bonding zone, and the inner ends of the central inner pins extend to the second wire bonding zone to form a plurality of central extension fingers; a plurality of second side pins having a plurality of second outer leads outside the molding area and arranged on the second side, and a plurality of the second outer leads in the mold sealing area and dispersed in the central inner leads The inner side pins of the two sides of the foot, wherein the inner side pins are on both sides of the mold sealing area Converging without interleaving between the central inner pins, the side inner pins are formed through the second wire bonding region to form a plurality of side convergence fingers, and the side pins are further Extending to the first wire bonding area to form a plurality of side extending fingers; wherein the central convergence fingers and the side extending fingers are aligned in a straight line, the central extending fingers and the The side convergence fingers are aligned in a straight line. The lead frame of the chip on the shared pin according to the first aspect of the patent application, wherein the central convergence fingers, the side extension fingers, the central extension fingers, and the side convergence fingers are An electroplated bonding layer is formed. A lead frame for a wafer on a shared pin according to item 2 of the patent application, wherein the plated bonding layer is a silver layer. The lead frame of the chip on the common type pin according to the first aspect of the patent application, wherein the side inner pins pass through the first wire bonding region such that the inner ends thereof are formed into a plurality of mold flow balance fingers. The lead frame of the chip on the common type of lead according to claim 4, wherein the gaps of the mold flow balances to the first side are equal to the gap between the central extension fingers and the second side distance. The lead frame of the chip on the common type of lead according to claim 4 of the patent application scope further includes a first insulating tape between the first side edge and the first wire bonding area, and attaching and fixing the molds Flow balancing refers to the internal pins. The lead frame of the chip on the common type pin according to claim 1 or 6 of the patent application further includes a second insulating tape between the first wire bonding zone and the second wire bonding zone, and is attached and fixed The central inner pins and the inner pins of the sides. The lead frame of the chip on the common type pin according to Item 7 of the patent application scope further includes at least one independent short pin which is completely formed in the mold sealing area and is fixed by the second insulating tape. The lead frame of the chip on the common type of pin according to the first aspect of the patent application, wherein the side inner pins are in a plane concave zigzag between the first wire bonding zone and the second wire bonding zone. A lead frame for a wafer on a shared pin according to the first aspect of the patent application, wherein at least one of the central inner leads of the central inner leads has a widened hollow portion. The lead frame of the chip on the shared pin according to the first aspect of the patent application, wherein at least one of the side inner pins of the side inner pins has a widened hollow portion.