TWI409365B - Method for recovering noble metal ions from plating - Google Patents

Method for recovering noble metal ions from plating Download PDF

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TWI409365B
TWI409365B TW100139360A TW100139360A TWI409365B TW I409365 B TWI409365 B TW I409365B TW 100139360 A TW100139360 A TW 100139360A TW 100139360 A TW100139360 A TW 100139360A TW I409365 B TWI409365 B TW I409365B
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plating
concentration
metal ions
recovery tank
recovery
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TW100139360A
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TW201226632A (en
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Shinji Abe
Takayuki Washio
Tetsuya Sato
Haruko Sasaki
Ryotaro Tadokoro
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Tanaka Precious Metal Ind
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/20Electrolytic production, recovery or refining of metals by electrolysis of solutions of noble metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/20Regeneration of process solutions of rinse-solutions
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/42Treatment of water, waste water, or sewage by ion-exchange
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22BPRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/20Treatment or purification of solutions, e.g. obtained by leaching
    • C22B3/42Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/22Regeneration of process solutions by ion-exchange

Abstract

[Problem] To provide a method that can: efficiently recover precious-metal ions from precious-metal-ion-containing plating wastewater discharged from a plating recovery tank and a plating cleaning tank; and minimize performance problems in objects being plated. [Solution] The present invention is a method for recovering precious-metal ions from plating wastewater. Said method keeps the concentration of precious-metal ions in a solution in a plating recovery tank high, within a certain range, by setting the wastewater discharge volume per discharge from the plating recovery tank to an amount, from 10% to 50% of the capacity of said plating recovery tank, such that the object being plated stays immersed in said plating recovery tank. Said method also keeps the concentration of precious-metal ions in a solution in a plating cleaning tank low, within a certain range.

Description

自鍍覆排水回收貴金屬離子之方法Method for recovering precious metal ions from plated drainage

本發明關於自鍍敷排水回收貴金屬離子之方法,特別地關於可自鍍敷回收槽及鍍敷洗淨槽的鍍敷排水中,高效率回收貴金屬離子,而且可抑制鍍敷被處理物的性能不良之自鍍敷排水回收貴金屬離子之方法。The present invention relates to a method for recovering precious metal ions from a plating drainage, and particularly relates to high-efficiency recovery of precious metal ions in plating drainage from a plating recovery tank and a plating cleaning tank, and suppressing performance of a plating material to be treated Poor method of recovering precious metal ions from plating drainage.

貴金屬由於物性特性、可靠性、美觀等優異,而是工業上非常有用的材料,作為鍍敷材,在以電子零件或印刷配線板等的電子機器領域為首的廣泛領域中被利用。另一方面,貴金屬係稀少地存在,而為非常高價的材料。因此,要求盡可能地回收及再利用鍍敷排水中所含有的貴金屬。The precious metal is industrially very useful because it is excellent in physical properties, reliability, and aesthetics, and is used as a plating material in a wide range of fields including electronic components such as electronic components and printed wiring boards. On the other hand, precious metals are scarcely present and are very expensive materials. Therefore, it is required to recover and reuse the precious metal contained in the plating drainage as much as possible.

一般地,鍍敷排水係分為來自鍍敷槽、鍍敷回收槽及鍍敷洗淨槽之排水。鍍敷回收槽由於作為鍍敷槽的鍍敷處理後之一次洗淨槽的角色,故在來自鍍敷回收槽的排水中,含有比鍍敷槽的排水還低濃度的貴金屬離子。又,鍍敷洗淨槽由於作為二次或三次洗淨槽的角色,故在來自鍍敷洗淨槽的排水中,含有比鍍敷回收槽的排水還低濃度的貴金屬離子。如此地,自各槽所排出的鍍敷排水之貴金屬離子濃度係不同。Generally, the plating drainage system is divided into drainage water from a plating tank, a plating recovery tank, and a plating washing tank. Since the plating recovery tank functions as a primary cleaning tank after the plating treatment of the plating tank, the drainage water from the plating recovery tank contains a noble metal ion having a lower concentration than the drainage water of the plating tank. Further, since the plating washing tank functions as a secondary or tertiary washing tank, the drain water from the plating washing tank contains a noble metal ion having a lower concentration than the drain of the plating collecting tank. As such, the concentration of precious metal ions in the plating drainage discharged from each tank is different.

又,要求鍍敷回收槽及鍍敷洗淨槽中的過剩地附著於鍍敷被處理物之貴金屬離子或鹽成分的洗出,更且抑制鍍敷液的成分之有機物所致的黴菌或細菌之發生、鍍敷回收槽的槽內之管理。In addition, it is required to wash out precious metal ions or salt components excessively adhered to the plating target in the plating recovery tank and the plating washing tank, and to suppress mold or bacteria caused by organic substances of the components of the plating solution. The occurrence and management of the plating tank.

作為自鍍敷排水回收貴金屬離子之方法,一般已知電解回收法、樹脂回收法及活性碳吸附回收法。電解回收法雖然對於自貴金屬離子的濃度高之鍍敷排水中回收貴金屬離子者優異,但是若為低濃度的鍍敷排水,則即使將電解槽內循環,電流密度也不會上升,而貴金屬離子的回收效率變差。另一方面,樹脂回收法及活性碳吸附回收法,雖然對於自貴金屬離子濃度低的鍍敷排水中回收貴金屬離子者優異,但是若使高濃度的鍍敷排水通過,則變無法充分回收貴金屬離子。因此,必須管理自鍍敷洗淨槽排水時的貴金屬離子濃度。As a method of recovering precious metal ions from the plating drainage, an electrolytic recovery method, a resin recovery method, and an activated carbon adsorption recovery method are generally known. The electrolytic recovery method is excellent for recovering precious metal ions from plating drainage having a high concentration of noble metal ions. However, if the plating is drained at a low concentration, the current density does not rise even if the electrolytic cell is circulated, and the noble metal ions are not increased. The recycling efficiency is worse. On the other hand, the resin recovery method and the activated carbon adsorption recovery method are excellent in recovering precious metal ions from plating drainage having a low concentration of noble metal ions. However, if a high-concentration plating drainage is passed, the precious metal ions cannot be sufficiently recovered. . Therefore, it is necessary to manage the concentration of noble metal ions when draining from the plating bath.

作為自以各種濃度含有貴金屬的複數種類之廢液中有效率地回收貴金屬之方法,例如已知使以低濃度含有貴金屬的低濃度廢液通過螯合系離子交換樹脂,而將貴金屬吸附於螯合系離子交換樹脂,取出所吸附的貴金屬,使以高濃度含有貴金屬的高濃度廢液在電解槽中被電解處理,而在電極上析出貴金屬,回收所析出的貴金屬之方法(專利文獻1)。As a method for efficiently recovering a noble metal from a plurality of kinds of waste liquids containing precious metals in various concentrations, for example, it is known that a low-concentration waste liquid containing a noble metal at a low concentration is passed through a chelate-type ion exchange resin, and a noble metal is adsorbed to the chelate. A method of extracting a noble metal adsorbed by a high-concentration waste liquid containing a noble metal at a high concentration in a electrolytic cell, and depositing a precious metal on the electrode to recover the deposited precious metal (Patent Document 1) .

[先前技術文獻][Previous Technical Literature] [專利文獻][Patent Literature]

[專利文獻1]特開2001-279343號公報[Patent Document 1] JP-A-2001-279343

以往,作為自鍍敷回收槽部分地排水之方法,採用使定期地溢流之方法或藉由計時器來自動設定而定期地排水之時間管理法、或操作者手動地定期排水之方法。如此地,藉由定期地排出一定量的鍍敷回收槽內的收容液,及注水而定期地減低鍍敷回收槽內的收容液之貴金屬離子濃度。Conventionally, as a method of partially draining from the plating recovery tank, a method of periodically overflowing or a time management method of automatically draining by a timer and periodically draining the water, or a method of manually draining the water manually by the operator is employed. In this manner, the precious metal ion concentration of the contained liquid in the plating recovery tank is periodically reduced by periodically discharging a predetermined amount of the liquid in the plating recovery tank and water injection.

然而,鍍敷回收槽內的收容液之貴金屬離子濃度,未必經常以一定的比例上升,視情況而定,也會急劇地上升。又,按照鍍敷被處理物的生產量,鍍敷回收槽內的收容液之貴金屬離子濃度係有各式各樣的變動。因此,於含有比較低濃度的貴金屬離子之鍍敷排水時,得不到充分的電流密度,藉由電解回收法來回收貴金屬離子的效率變差。另一方面,於含有比較高濃度的貴金屬離子之鍍敷排水時,以自動設定的循環時間會無法處理,此係成為使貴金屬離子的回收效率降低之原因。However, the concentration of the noble metal ions of the contained liquid in the plating recovery tank does not always increase at a constant rate, and may rise sharply depending on the situation. Further, according to the production amount of the plated material to be treated, the concentration of the noble metal ions in the solution liquid in the plating recovery tank varies in various ways. Therefore, when plating drainage containing a relatively low concentration of noble metal ions, a sufficient current density cannot be obtained, and the efficiency of recovering precious metal ions by the electrolytic recovery method is deteriorated. On the other hand, in the case of plating drainage containing a relatively high concentration of noble metal ions, the cycle time which is automatically set cannot be handled, which is a cause of lowering the recovery efficiency of noble metal ions.

再者,鍍敷回收槽內的收容液之貴金屬離子濃度若過度上升,則來自後步驟的處理槽之鍍敷洗淨槽的鍍敷排水中所含有的貴金屬離子濃度上升,藉由樹脂回收法、活性碳吸附回收法來回收貴金屬離子係有變無法充分進行之問題。When the concentration of the noble metal ions of the liquid in the plating tank is excessively increased, the concentration of precious metal ions contained in the plating drainage from the plating tank of the treatment tank in the subsequent step is increased by the resin recovery method. The activated carbon adsorption recovery method recovers the problem that the noble metal ion system cannot be sufficiently changed.

本發明之目的在於提供一種方法,其可自鍍敷回收槽及鍍敷洗淨槽所排出之含有貴金屬離子的鍍敷排水中高效率地回收貴金屬離子,而且可抑制鍍敷被處理物的性能不良。An object of the present invention is to provide a method for efficiently recovering precious metal ions from a plating drainage water containing precious metal ions discharged from a plating recovery tank and a plating cleaning tank, and suppressing poor performance of a plating material to be treated .

本發明者為了解決上述問題,進行專心致力研究,結果發現將鍍敷回收槽及鍍敷洗淨槽內的收容液之貴金屬離子濃度維持在指定的範圍者,以該知識為基礎,終於完成本發明。即,本發明係自鍍敷排水回收貴金屬離子之方法,其係藉由使來自鍍敷回收槽的每一次之排水量成為鍍敷回收槽的滿水量之10~50%的範圍內,而且於鍍敷回收槽內,成為確保鍍敷被處理物的浸漬之量,而將鍍敷回收槽內的收容液之貴金屬離子濃度以高濃度維持在一定的範圍,而且將鍍敷洗淨槽內的收容液之貴金屬離子濃度以低濃度維持在一定的範圍。In order to solve the above problems, the inventors of the present invention have conducted intensive studies and found that the precious metal ion concentration of the liquid in the plating recovery tank and the plating cleaning tank is maintained within a specified range, and based on this knowledge, the present invention is finally completed. invention. That is, the present invention is a method for recovering precious metal ions from a plating drainage by making the amount of water discharged from the plating recovery tank into a range of 10 to 50% of the amount of water in the plating recovery tank, and plating. In the coating tank, the amount of the impregnation of the material to be treated is ensured, and the concentration of the noble metal ions of the liquid in the plating recovery tank is maintained at a high concentration in a high concentration, and the plating chamber is accommodated in the cleaning tank. The precious metal ion concentration of the liquid is maintained at a low concentration in a certain range.

於本發明中,可對於貴金屬離子的濃度以高濃度維持在一定的範圍之來自鍍敷回收槽的鍍敷排水,併用電解回收法與樹脂回收法或活性碳吸附回收法來回收貴金屬離子,對於貴金屬離子的濃度以低濃度維持在一定的範圍之來自鍍敷洗淨槽的鍍敷排水,藉由樹脂回收法或活性碳吸附回收法來回收貴金屬離子。In the present invention, the plating drainage from the plating recovery tank can be maintained at a high concentration in the concentration of the noble metal ions, and the noble metal ions can be recovered by the electrolytic recovery method and the resin recovery method or the activated carbon adsorption recovery method. The concentration of the noble metal ions is maintained at a low concentration in a plating bath from the plating bath at a low concentration, and the noble metal ions are recovered by a resin recovery method or an activated carbon adsorption recovery method.

若依照本發明,可在不停止鍍敷被處理物的鍍敷處理下,自鍍敷回收槽及鍍敷洗淨槽所排出之含有貴金屬離子的鍍敷排水中高效率地回收貴金屬離子,而且可抑制鍍敷被處理物的性能不良。According to the present invention, it is possible to efficiently recover precious metal ions from the plating drainage water containing precious metal ions discharged from the plating recovery tank and the plating cleaning tank without stopping the plating treatment of the plated workpiece. The performance of the plating object to be treated is suppressed to be poor.

[實施發明的形態][Formation of the Invention]

本發明係適用於一般的鍍敷處理,即含有以下步驟之處理:在收容有鍍敷液的鍍敷槽中浸漬被處理物以進行鍍敷之步驟,在鍍敷回收槽內的收容液中浸漬被處理物,最初洗淨被處理物之步驟,及在鍍敷洗淨槽內的收容液中浸漬被處理物,最終洗淨被處理物之步驟;對於來自鍍敷回收槽的鍍敷排水,併用電解回收法與樹脂回收法或活性碳吸附回收法來回收貴金屬離子,另一方面,對於來自鍍敷洗淨槽的鍍敷排水,藉由樹脂回收法或活性碳吸附回收法來回收貴金屬離子。The present invention is applied to a general plating treatment, that is, a treatment comprising the steps of immersing a workpiece in a plating bath containing a plating solution to perform plating, in a liquid in a plating recovery tank. a step of immersing the object to be treated, first washing the object to be treated, immersing the object to be treated in the solution liquid in the plating tank, and finally washing the object to be treated; and plating drainage from the plating recovery tank And recovering precious metal ions by electrolytic recovery method, resin recovery method or activated carbon adsorption recovery method. On the other hand, for the plating drainage from the plating cleaning tank, the precious metal is recovered by the resin recovery method or the activated carbon adsorption recovery method. ion.

前述被處理物係如電子零件或印刷配線板等,被一對的輥所連續鍍敷處理之製品,及於鍍敷槽等中,重複浸漬、提起步驟,分批地鍍敷處理之製品。又,鍍敷回收槽及鍍敷洗淨槽內的收容液,通常為經離子交換樹脂所處理的離子交換水,但在自鍍敷洗淨槽的收容液中回收貴金屬離子後,已進行活性碳處理及逆滲透膜處理的純水亦可適用。The object to be processed is a product which is continuously plated by a pair of rolls, such as an electronic component or a printed wiring board, and is subjected to repeated immersion and lifting steps in a plating bath or the like, and the processed product is plated in batches. Further, the plating solution in the plating recovery tank and the plating washing tank is usually ion-exchanged water treated with an ion exchange resin, but is activated after recovering precious metal ions from the liquid containing the plating bath. Pure water treated with carbon treatment and reverse osmosis membrane is also suitable.

於本發明中,藉由使來自鍍敷回收槽的每一次之排水量成為鍍敷回收槽的滿水量之10~50%的範圍內,而且於鍍敷回收槽內,成為確保鍍敷被處理物的浸漬之量,而將鍍敷回收槽內的收容液之貴金屬離子濃度以高濃度維持在一定的範圍,而且將鍍敷洗淨槽內的收容液之貴金屬離子濃度以低濃度維持在一定的範圍。而且,可對於貴金屬離子的濃度以高濃度維持在一定的範圍之來自鍍敷回收槽的鍍敷排水,併用電解回收法與樹脂回收法或活性碳吸附回收法來回收貴金屬離子,對於貴金屬離子的濃度以低濃度維持在一定的範圍之來自鍍敷洗淨槽的鍍敷排水,藉由樹脂回收法或活性碳吸附回收法來回收貴金屬離子。In the present invention, the amount of water discharged from the plating recovery tank is in the range of 10 to 50% of the total amount of water in the plating recovery tank, and in the plating recovery tank, the plating material is ensured. The concentration of the noble metal ions in the receiving liquid in the plating recovery tank is maintained at a high concentration in a high concentration, and the concentration of the noble metal ions in the receiving liquid in the plating cleaning tank is maintained at a low concentration at a constant concentration. range. Further, the plating drainage from the plating recovery tank can be maintained at a high concentration for the concentration of the noble metal ions, and the noble metal ions can be recovered by the electrolytic recovery method and the resin recovery method or the activated carbon adsorption recovery method for the noble metal ions. The plating drainage from the plating washing tank is maintained at a low concentration at a low concentration, and the noble metal ions are recovered by a resin recovery method or an activated carbon adsorption recovery method.

來自鍍敷回收槽的每一次之排水量較佳為鍍敷回收槽的滿水量之10~50%的範圍內,而且於鍍敷回收槽內,較佳成為確保鍍敷被處理物的浸漬之量。每一次的排水量若超過鍍敷回收槽的滿水量之50%,則由於注水而使鍍敷回收槽中的水溫大幅變動,將附著於鍍敷被處理物的過剩之貴金屬離子或鹽成分回收之效率係降低,更且黴菌或細菌等變容易繁殖,對鍍敷被處理物的附著而導致性能不良,或良率降低。The amount of water discharged from the plating recovery tank is preferably in the range of 10 to 50% of the total amount of water in the plating recovery tank, and in the plating recovery tank, it is preferable to ensure the amount of impregnation of the plating material to be treated. . When the amount of water per drain exceeds 50% of the amount of water in the plating recovery tank, the water temperature in the plating recovery tank greatly changes due to water injection, and excess precious metal ions or salt components adhering to the material to be treated are recovered. The efficiency is lowered, and molds, bacteria, and the like are easily propagated, and adhesion to the plated material is caused, resulting in poor performance or a decrease in yield.

另一方面,每一次的排水量若低於滿水量之10%,則貴金屬離子濃度的管理、及鍍敷回收槽的排水、注水作業變煩雜。又,由於作業的煩雜而發生管理不良,將附著於鍍敷被處理物的過剩之貴金屬離子或鹽成分回收之效率係降低,不僅污染鍍敷被處理物,而且貴金屬離子的回收效率亦會降低。再者,使每一次的排水量成為確保鍍敷被處理物的浸漬之量的理由,係為了不停止鍍敷處理。On the other hand, if the amount of displacement per time is less than 10% of the full amount of water, the management of the precious metal ion concentration and the drainage and water injection operation of the plating recovery tank become complicated. In addition, management troubles occur due to troublesome work, and the efficiency of recovering excess precious metal ions or salt components adhering to the material to be plated is reduced, which not only contaminates the material to be treated, but also reduces the recovery efficiency of precious metal ions. . In addition, the reason why the amount of water discharged per time is the amount of immersion for ensuring the plating target material is to prevent the plating process from being stopped.

又,鍍敷回收槽內的收容液之水溫較佳為35℃以上,更佳為40℃以上。鍍敷回收槽未必需要進行積極的溫度調整,但較佳為尤其不使水溫過度降低。特別地,若水溫低於35℃,則附著於鍍敷被處理物的過剩之貴金屬離子或鹽成分的洗出效率變差,變成促進黴菌或細菌等的繁殖,由於對於鍍敷被處理物,貴金屬離子或鹽成分殘留或黴菌或細菌附著,而引起性能不良及良率降低。Further, the water temperature of the liquid contained in the plating recovery tank is preferably 35 ° C or higher, more preferably 40 ° C or higher. The plating recovery tank does not necessarily require a positive temperature adjustment, but it is preferred that the water temperature is not excessively lowered. In particular, when the water temperature is lower than 35° C., the elution efficiency of excess precious metal ions or salt components adhering to the material to be treated is deteriorated, and the growth of molds, bacteria, and the like is promoted. Residual precious metal ions or salt components or mold or bacteria adhesion, resulting in poor performance and reduced yield.

一般地於鍍敷槽中,在60~90℃左右的加溫狀態下施予鍍敷處理。因此,經加溫的鍍敷被處理物及附著於鍍敷被處理物的鍍敷液,係在鍍敷回收槽中移動,而成為使鍍敷回收槽的水溫上升之原因。另一個使鍍敷回收槽的水溫上升之原因,係因為連續設置鍍敷槽及鍍敷回收槽,由來自鍍敷槽的輻射熱所造成。Generally, the plating treatment is applied to the plating bath at a heating state of about 60 to 90 °C. Therefore, the plated material to be treated which has been heated and the plating liquid adhering to the material to be plated are moved in the plating recovery tank, which causes the water temperature in the plating recovery tank to rise. Another reason for the increase in the temperature of the water in the plating recovery tank is that the plating bath and the plating recovery tank are continuously provided, and the radiant heat from the plating tank is caused.

然而,水溫上升未必會導致鍍敷回收槽中的鍍敷被處理物之性能不良或良率降低。當然,如前述記載,鍍敷回收槽內的收容液之水溫較佳為35℃以上,更佳為40℃以上,特別地,從附著於鍍敷被處理物的過剩之貴金屬離子或鹽成分的洗出效率良好,抑制黴菌或細菌的繁殖之觀點來看,水溫高者係較佳。However, an increase in the temperature of the water does not necessarily result in poor performance or a decrease in yield of the plated material to be treated in the plating recovery tank. As a matter of course, as described above, the water temperature of the storage liquid in the plating recovery tank is preferably 35° C. or higher, more preferably 40° C. or higher, and particularly, excess precious metal ions or salt components adhering to the plating target material. From the standpoint of good washing out efficiency and inhibition of the growth of mold or bacteria, it is preferred that the water temperature is high.

一般地,當鍍敷被處理物的處理量少時,於以往的時間管理法或溢流法及全量替換法中,過剩地進行排水及注水,而成為引起水溫降低之原因。In general, when the amount of treatment of the plated workpiece is small, in the conventional time management method, the overflow method, and the full amount replacement method, drainage and water injection are excessively performed, which causes a decrease in water temperature.

因此,於本發明中,如後述地,重要的是在鍍敷回收槽內設置電極,藉由電流值及經由校正曲線來估計貴金屬離子濃度,而估計鍍敷被處理物的處理量,使來自鍍敷回收槽的每一次之排水量成為鍍敷回收槽的滿水量之10~50%的範圍之量。例如,藉由熱量計算,當鍍敷回收槽的水溫50℃時,以20℃的注水置換滿水量的50%時,水溫係成為降低10℃的範圍,即使鍍敷被處理物的處理量比較少時,也不使水溫低於35℃而管理。Therefore, in the present invention, as will be described later, it is important to provide an electrode in the plating recovery tank, and estimate the amount of the deposited metal material by the current value and the concentration of the noble metal ion via the calibration curve to estimate the amount of the processed material to be processed. The amount of displacement per one time of the plating recovery tank is in the range of 10 to 50% of the total amount of water in the plating recovery tank. For example, when the water temperature of the plating recovery tank is 50° C., when the water temperature of the plating recovery tank is 50° C., the water temperature is reduced by 10° C., and the water temperature is reduced by 10° C., even if the treated material is treated. When the amount is relatively small, the water temperature is not managed below 35 °C.

於本發明中,將鍍敷回收槽內的收容液之貴金屬離子濃度以高濃度維持在指定的範圍。以高濃度維持在一定範圍的排水,係適合併用電解回收法與樹脂回收法或活性碳吸附回收法。In the present invention, the noble metal ion concentration of the contained liquid in the plating recovery tank is maintained at a high concentration in a predetermined range. The drainage which is maintained at a high concentration in a certain range is suitable for the electrolytic recovery method, the resin recovery method or the activated carbon adsorption recovery method.

此處所謂以高濃度維持在一定的範圍,就是意味與將鍍敷洗淨槽內的收容液之貴金屬離子濃度以低濃度維持在一定的範圍者比較下,以高濃度維持者。Here, the fact that the concentration is maintained at a high concentration in a predetermined range means that the concentration of the noble metal ions of the contained liquid in the plating bath is maintained at a low concentration and maintained at a high concentration.

又,於貴金屬離子的回收之設備設計中,按照貴金屬離子濃度或每單位時間的處理量,適宜選擇電解回收裝置的設置個數或樹脂及活性碳的填充量等。再者,若使用本發明的貴金屬離子回收方法,即使來自並列設置的複數之鍍敷回收槽的鍍敷排水,只要含有相同的貴金屬離子,則可在一個途徑中收集各自的鍍敷排水,進行電解回收。Further, in the design of the apparatus for recovering precious metal ions, the number of the electrolytic recovery devices, the amount of the resin and the amount of the activated carbon, and the like are appropriately selected in accordance with the concentration of the noble metal ions or the amount of the treatment per unit time. Further, according to the noble metal ion recovery method of the present invention, even if the plating drainage from the plurality of plating recovery tanks arranged in parallel is contained, as long as the same noble metal ions are contained, the plating drainage can be collected in one route. Electrolytic recovery.

作為本發明的實施形態,當貴金屬離子為高濃度時,適宜選擇併用電解回收法與樹脂回收法或活性碳吸附回收法者,另一方面,當低濃度時,適宜選擇樹脂回收法或活性碳吸附回收法。In the embodiment of the present invention, when the noble metal ion is at a high concentration, the electrolytic recovery method, the resin recovery method, or the activated carbon adsorption recovery method are suitably selected, and on the other hand, when the concentration is low, the resin recovery method or activated carbon is appropriately selected. Adsorption recovery method.

為了以高效率電解回收槽內的收容液之貴金屬離子,當投入回收設備時,較佳為將貴金屬離子濃度維持在一定的範圍。於一般的電解回收法中,按照鍍敷裝置之排水時的貴金屬離子濃度或排水的每單位時間之處理量,設計電解回收裝置的設置個數等回收設備。將來自鍍敷回收槽所排出的收容液一次儲存,自該儲存槽,將一定的處理量移動到電解回收用槽,一邊使收容液在電解回收用槽與電解回收裝置循環,一邊電解回收貴金屬離子。電解回收係藉由循環時間來設定,對於貴金屬離子濃度的變動,適宜地調整循環時間。因此,所謂一定的範圍,就是維持在適合於設計貴金屬離子的回收設備之處理性能的濃度,若超過一定的範圍,則變成超過電解回收後的樹脂或活性碳吸附回收之回收可能容量,回收效率降低。另一方面,若低於一定的範圍,則在電解回收中,低濃度的回收效率低,每單位時間的回收效率降低。In order to electrolyze the precious metal ions of the contained liquid in the recovery tank with high efficiency, it is preferable to maintain the concentration of the noble metal ions in a certain range when the recovery apparatus is put into the recovery apparatus. In the general electrolytic recovery method, a recovery device such as the number of installations of the electrolytic recovery device is designed in accordance with the concentration of precious metal ions in the drainage of the plating device or the amount of treatment per unit time of the drainage. The storage liquid discharged from the plating recovery tank is once stored, and a certain amount of treatment is moved from the storage tank to the electrolytic recovery tank, and the storage liquid is circulated in the electrolytic recovery tank and the electrolytic recovery unit, and the precious metal is electrolytically recovered. ion. The electrolysis recovery is set by the cycle time, and the cycle time is appropriately adjusted for the fluctuation of the noble metal ion concentration. Therefore, the so-called range is to maintain the concentration of the processing performance of the recovery equipment suitable for designing precious metal ions. If it exceeds a certain range, it will exceed the recovery capacity of the resin or activated carbon adsorption recovery after electrolysis recovery, and the recovery efficiency. reduce. On the other hand, if it is less than a certain range, in the electrolytic recovery, the recovery efficiency of a low concentration is low, and the collection efficiency per unit time falls.

根據以上,將收容液的貴金屬離子濃度以高濃度維持在一定的範圍者,係可最大限度地利用回收設備的回收效率,結果可實現高收率。According to the above, when the concentration of the noble metal ions of the contained liquid is maintained at a high concentration in a certain range, the recovery efficiency of the recovery equipment can be utilized to the utmost, and as a result, a high yield can be achieved.

又,於來自鍍敷回收槽的收容液中,取決於鍍敷液的種類,會有電流密度無法充分上升的情況,為了電流密度的上升,亦可任意地追加添加苛性鈉等的電解質。In addition, in the liquid to be contained in the plating recovery tank, the current density may not be sufficiently increased depending on the type of the plating liquid, and an electrolyte such as caustic soda may be arbitrarily added in order to increase the current density.

例如,當將本發明所規定之鍍敷回收槽內的收容液之貴金屬離子以高濃度維持在一定的範圍時,較佳為以10~200mg/L的範圍維持。鍍敷回收槽內的收容液之貴金屬離子的濃度若超過200mg/L,則即使併用電解回收法與樹脂回收法或活性碳吸附回收法,貴金屬離子的回收也不充分,而且由於過剩的貴金屬離子流出到鍍敷洗淨槽,鍍敷洗淨槽的貴金屬離子濃度超過10mg/L的可能性變高,而降低來自鍍敷洗淨槽的鍍敷排水中所含有的貴金屬離子之回收效率。For example, when the noble metal ions of the storage liquid in the plating recovery tank defined by the present invention are maintained at a high concentration in a certain range, it is preferably maintained in the range of 10 to 200 mg/L. When the concentration of the noble metal ions in the storage liquid in the plating recovery tank exceeds 200 mg/L, the recovery of the noble metal ions is insufficient even if the electrolytic recovery method, the resin recovery method, or the activated carbon adsorption recovery method are used in combination, and the excess noble metal ions are excessive. When it flows out to the plating washing tank, the possibility that the precious metal ion concentration of the plating washing tank exceeds 10 mg/L becomes high, and the recovery efficiency of the noble metal ion contained in the plating drainage from the plating washing tank is reduced.

另一方面,鍍敷回收槽內的收容液之貴金屬離子濃度若未達10mg/L,則電解回收法與樹脂回收法或活性碳吸附回收法之併用係成為過剩的設計,變成經濟上無效率。又,鍍敷回收槽內的收容液中所含有的貴金屬離子之濃度低於10mg/L的管理,在實施形態上係幾乎沒有,不符合現實。On the other hand, if the concentration of the noble metal ions of the contained liquid in the plating recovery tank is less than 10 mg/L, the combination of the electrolytic recovery method and the resin recovery method or the activated carbon adsorption recovery method becomes an excessive design and becomes economically inefficient. . Moreover, the management of the concentration of the noble metal ions contained in the contained liquid in the plating recovery tank is less than 10 mg/L, and there is almost no embodiment, which is not realistic.

於本發明中,鍍敷洗淨槽內的收容液之貴金屬濃度,係藉由在鍍敷回收槽中將貴金屬離子濃度維持在一定的濃度範圍,而將由鍍敷回收槽移動至鍍敷洗淨槽的貴金屬離子以低濃度維持在一定的範圍。又,鍍敷回收槽內的收容液經由電解回收法所處理後之收容液,亦同樣地被以低濃度維持在一定的範圍。由於任一者皆可以低濃度被維持在一定的範圍,可依照貴金屬離子濃度及每單位時間的處理量來適宜選擇樹脂及活性碳的填充量等。In the present invention, the precious metal concentration of the contained liquid in the plating cleaning tank is maintained by the plating recovery tank to the plating by maintaining the concentration of the noble metal ions in a constant concentration range in the plating recovery tank. The noble metal ions of the tank are maintained at a low concentration in a certain range. Further, the contained liquid in the plating recovery tank treated by the electrolytic recovery method is similarly maintained at a low concentration in a predetermined range. Since either of them can be maintained at a low concentration in a certain range, the filling amount of the resin and the activated carbon can be appropriately selected in accordance with the concentration of the noble metal ions and the amount of treatment per unit time.

例如,當將本發明所規定之鍍敷洗淨槽內的收容液之貴金屬濃度以低濃度維持在一定的範圍時,較佳為維持在10mg/L以下。此係因為若超過10mg/L,則藉由樹脂回收法或活性碳吸附回收法來回收貴金屬離子會變不充分。For example, when the precious metal concentration of the contained liquid in the plating bath defined by the present invention is maintained at a low concentration in a predetermined range, it is preferably maintained at 10 mg/L or less. In this case, if it exceeds 10 mg/L, recovery of noble metal ions by the resin recovery method or the activated carbon adsorption recovery method may become insufficient.

如前述,鍍敷回收槽內的收容液之貴金屬離子濃度最大為200mg/L,因此,附著於自鍍敷回收槽所送出的鍍敷被處理物之過剩的貴金屬離子之最大濃度為200mg/L,例如在鍍敷洗淨槽中若藉由純水將上述附著液稀釋至25~50倍,則25倍稀釋時的貴金屬離子濃度為8mg/L,50倍稀釋時為4mg/L,被維持在10mg/L以下。As described above, since the concentration of the noble metal ions in the plating solution in the plating recovery tank is at most 200 mg/L, the maximum concentration of excess precious metal ions adhering to the plated material to be processed from the plating recovery tank is 200 mg/L. For example, if the above-mentioned adhering liquid is diluted to 25 to 50 times by pure water in the plating washing tank, the precious metal ion concentration at the time of 25-fold dilution is 8 mg/L, and 4 mg/L at the time of 50-fold dilution is maintained. Below 10mg/L.

於本發明中,當自鍍敷回收槽的鍍敷排水中回收貴金屬離子時,併用電解回收法與樹脂回收法或活性碳吸附回收法而進行。不僅電解回收法單獨,而且藉由與樹脂回收法或活性碳吸附回收法的組合,可顯著地提高貴金屬離子的回收效率。In the present invention, when precious metal ions are recovered from the plating drainage of the plating recovery tank, they are carried out by an electrolytic recovery method, a resin recovery method or an activated carbon adsorption recovery method. Not only the electrolytic recovery method alone, but also in combination with the resin recovery method or the activated carbon adsorption recovery method, the recovery efficiency of noble metal ions can be remarkably improved.

電解回收法係在電解槽中導入鍍敷排水,藉由電分解使貴金屬離子析出在電極上,進行回收之方法。作為所使用的陽極,可例示由Pt鍍敷Ti材、Ir燒結Ti材或肥粒鐵材所成的電極,作為陰極,可例示由Ti材、SUS材或肥粒鐵材所成的電極。於本發明中,作為自鍍敷回收槽的鍍敷排水中以高電解效率回收貴金屬的條件,按照鍍敷液的種類及貴金屬離子種,適宜地設定電極的種類或電流密度。例如,於氰系鍍敷液的排水中,由於氰離子溶解Pt,故使用Ir燒結Ti材電極。又,於含有Pt或Pd等的鉑族之鍍敷液的排水中,因為藉由水之水解所產生的氫而剝離所析出的鉑族,故以低電流密度使用。再者,在陰極所析出的貴金屬之去除、回收方法,係沒有特別的限定,但藉由王水等來剝離而去除、回收所析出的貴金屬時,宜使用Ti材當作陰極。The electrolytic recovery method is a method in which a plating drainage is introduced into an electrolytic cell, and precious metal ions are deposited on the electrode by electrolysis. As the anode to be used, an electrode made of a Pt-plated Ti material, an Ir sintered Ti material, or a fat-grained iron material can be exemplified, and as the cathode, an electrode made of a Ti material, a SUS material, or a fat iron material can be exemplified. In the present invention, as the condition for recovering the noble metal by high electrolysis efficiency in the plating drainage from the plating recovery tank, the type or current density of the electrode is appropriately set in accordance with the type of the plating solution and the noble metal ion species. For example, in the drainage of the cyanide plating solution, since the cyanide ions dissolve Pt, the Ti sintered electrode electrode is used. Further, in the drainage of the platinum group plating solution containing Pt or Pd or the like, since the precipitated platinum group is peeled off by hydrogen generated by hydrolysis of water, it is used at a low current density. In addition, the method of removing and recovering the precious metal deposited on the cathode is not particularly limited. However, when the precipitated noble metal is removed and recovered by aqua regia or the like, it is preferable to use a Ti material as the cathode.

樹脂回收法係使鍍敷排水通過樹脂而捕集貴金屬離子,燒掉該樹脂而回收貴金屬之方法。作為樹脂回收法所用的樹脂,例如可舉出陽離子交換樹脂、陰離子交換樹脂、螯合樹脂、合成吸附材,較佳為高效率地回收貴金屬離子者。具體地,陰離子交換樹脂,例如具有四級銨鹼(三甲基銨鹼、二甲基乙醇銨鹼等)的強鹼性離子交換樹脂、具有一級、二級或三級胺基的弱鹼性離子交換樹脂等;陽離子交換樹脂,例如具有磺酸基的強酸性離子交換樹脂、具有氟化烷基磺酸基的超強酸性離子交換樹脂、具有羧基、膦酸基、次膦酸基的弱酸性離子交換樹脂等;螯合樹脂,例如亞脒基醋酸型螯合樹脂、聚胺型螯合樹脂係合適。The resin recovery method is a method in which a plating drainage is passed through a resin to collect precious metal ions, and the resin is burned to recover a precious metal. Examples of the resin used in the resin recovery method include a cation exchange resin, an anion exchange resin, a chelating resin, and a synthetic adsorption material, and it is preferred to recover precious metal ions with high efficiency. Specifically, an anion exchange resin such as a strongly basic ion exchange resin having a quaternary ammonium base (trimethylammonium base, dimethylethanolammonium base, etc.) or a weakly basic one having a primary, secondary or tertiary amine group An ion exchange resin or the like; a cation exchange resin such as a strongly acidic ion exchange resin having a sulfonic acid group, a super strong acidic ion exchange resin having a fluorinated alkylsulfonic acid group, and a weak carboxyl group, a phosphonic acid group, and a phosphinic acid group. An acidic ion exchange resin or the like; a chelate resin such as a mercaptoacetic acid type chelate resin or a polyamine type chelate resin is suitable.

與電解回收法併用的活性碳吸附回收法,係使用活性碳捕集貴金屬離子,使此活性碳燃燒而灰化,自所得之灰化物回收貴金屬離子之方法。使用活性碳捕集貴金屬離子時,例如於鍍敷排水中含浸活性碳,使鍍敷排水通過在管柱中所填充的活性碳而進行。The activated carbon adsorption recovery method used in combination with the electrolytic recovery method is a method of recovering noble metal ions by using activated carbon to trap precious metal ions, burning and activating the activated carbon, and recovering precious metal ions from the obtained ash. When the noble metal ions are trapped using activated carbon, for example, the plating water is impregnated with activated carbon, and the plating drainage is carried out through the activated carbon filled in the column.

自鍍敷洗淨槽的鍍敷排水中回收貴金屬離子時,使用樹脂回收法或括性碳吸附回收法來進行。樹脂回收法或活性碳吸附回收法係如前述。When precious metal ions are recovered from the plating drainage of the plating washing tank, the resin recovery method or the carbon adsorption recovery method is used. The resin recovery method or the activated carbon adsorption recovery method is as described above.

使來自鍍敷回收槽的每一次之排水量成為鍍敷回收槽的滿水量之10~50%的範圍時,鍍敷回收槽的排水及注水較佳為藉由一部分排水、一部分注水而進行。通常,工業上為了進行大量的鍍敷處理,要求以不妨礙鍍敷被處理物的製造之方式,連續地在鍍敷回收槽中處理,但若一次實施全量排水,則使鍍敷被處理物的鍍敷處理停止,故前置時間變長,有生產性降低之問題。再者,若進行全量排水而進行新的全量注水,則使鍍敷回收槽的水溫大幅地變動,故貴金屬離子的回收效率降低。When the amount of water discharged from the plating recovery tank is in the range of 10 to 50% of the total amount of water in the plating recovery tank, it is preferable that the drainage and water injection in the plating recovery tank are performed by a part of the drainage and a part of the water injection. In general, in order to perform a large amount of plating treatment in the industry, it is required to continuously treat the material to be processed in the plating recovery tank so as not to hinder the production of the material to be plated. However, if the entire amount of drainage is performed once, the material to be treated is plated. Since the plating treatment is stopped, the lead time is prolonged, and the productivity is lowered. In addition, when a full amount of water is injected and a full amount of water is injected, the water temperature of the plating recovery tank is largely changed, so that the recovery efficiency of precious metal ions is lowered.

作為使來自鍍敷回收槽的每一次之排水量成為鍍敷回收槽的滿水量之10~50%的範圍之方法,並沒有特別的限定,例如於鍍敷回收槽中設置二個電極、使恆定電壓或恆定電流通電的電源、與使排水和注水作動的電動閥等,對鍍敷回收槽進行通電,藉由所測定的電流值或電位值來控制排水及注水的電動閥等之作動。The method of setting the amount of water discharged from the plating recovery tank to 10 to 50% of the total amount of water in the plating recovery tank is not particularly limited. For example, two electrodes are provided in the plating recovery tank to make a constant A power source that is energized by a voltage or a constant current, an electric valve that operates by draining water and water injection, and the like are energized to the plating recovery tank, and the operation of the drain valve and the water-filled electric valve is controlled by the measured current value or potential value.

具體地,例如在設置於鍍敷回收槽的電極間,以恆定電壓或恆定電流進行通電,對於鍍敷回收槽內的收容液,預先作成表示電流值或電位值、與該收容液內所含有的貴金屬離子濃度之關係的校正曲線,在設置於鍍敷回收槽的電極間,以恆定電壓或恆定電流進行通電,測定該電極間的電流值或電位值,以所得之測定值與上述校正曲線為基礎,將鍍敷回收槽內的收容液之貴金屬離子濃度定量,當所得之定量值達到指定的設定值時,藉由進行鍍敷回收槽的排水及/或注水,而將鍍敷回收槽內的收容液之貴金屬離子濃度以高濃度維持在一定的範圍。Specifically, for example, the electrodes provided in the plating recovery tank are energized at a constant voltage or a constant current, and the liquid contained in the plating recovery tank is previously formed to indicate a current value or a potential value, and is contained in the contained liquid. The calibration curve of the relationship between the concentration of the noble metal ions is energized at a constant voltage or a constant current between the electrodes provided in the plating recovery tank, and the current value or potential value between the electrodes is measured, and the obtained measured value and the above calibration curve are obtained. Based on the basis, the precious metal ion concentration of the receiving liquid in the plating recovery tank is quantified, and when the quantitative value obtained reaches a predetermined set value, the plating recovery tank is drained and/or water-filled by the plating recovery tank. The concentration of noble metal ions in the contained liquid is maintained at a high concentration in a certain range.

作為前述電極,在陽極中較佳為由提高電流密度時不溶出的Pt鍍敷Ti材、Ir燒結Ti材或肥粒鐵材所成之電極,在陰極中較佳為由Ti材、SUS材或肥粒鐵材所成之電極。又,該電極的形狀可適宜選擇平板、圓棒、圓筒、網狀等,但若考慮安裝時的電極相向,更佳為圓棒或圓筒的形狀。As the electrode, an electrode made of a Pt-plated Ti material, an Ir-sintered Ti material, or a fat-grained iron material which is not eluted at the time of increasing the current density is preferably used in the anode, and the cathode is preferably made of a Ti material or a SUS material. Or the electrode made of fat iron. Further, the shape of the electrode may be selected from a flat plate, a round bar, a cylinder, a mesh, etc., but it is more preferably a round bar or a cylinder in consideration of the electrode orientation at the time of mounting.

於作成前述校正曲線時,及實際上對鍍敷回收槽進行通電,測定電流值或電位值時,關於設置於鍍敷回收槽的電極之電極形狀、電極長度、電極間距離及外加電壓,係配合鍍敷回收槽的鍍敷排水之電導度而適宜選擇。該鍍敷排水的電導度係包含貴金屬離子及其它電解質等的鍍敷排水全體之電導度,若貴金屬離子濃度高,則電導度變高。當鍍敷排水的貴金屬離子濃度-電流值曲線的斜率大時,為比較低的電壓施加,電極直徑小,可縮短電極,取得寬的電極間距離。另一方面,當斜率小時,為比較高的電壓施加,電極直徑大,可加長電極,取得寬的電極間距離,而調整斜率。例如,將外加電壓設定在12~24V,可使對應於貴金屬離子濃度的前述上限值之電流值成為200~800mA,使對應於貴金屬離子濃度的前述下限值之電流值成為100~500mA。較佳為選擇可將貴金屬離子濃度的前述上下值與前述下限值的差分值管理在100~300mA的範圍之電極條件。When the calibration curve is created and the plating recovery tank is actually energized to measure the current value or the potential value, the electrode shape, the electrode length, the distance between the electrodes, and the applied voltage of the electrode provided in the plating recovery tank are It is suitable for the conductivity of the plating drainage of the plating recovery tank. The electrical conductivity of the plating drainage includes the electrical conductivity of the entire plating drainage of noble metal ions and other electrolytes, and if the concentration of the noble metal ions is high, the electrical conductivity becomes high. When the slope of the precious metal ion concentration-current value curve of the plating drainage is large, the electrode diameter is small for a relatively low voltage application, and the electrode can be shortened to obtain a wide interelectrode distance. On the other hand, when the slope is small, for a relatively high voltage application, the electrode diameter is large, the electrode can be lengthened, a wide interelectrode distance is obtained, and the slope is adjusted. For example, when the applied voltage is set to 12 to 24 V, the current value corresponding to the upper limit value of the noble metal ion concentration can be set to 200 to 800 mA, and the current value corresponding to the lower limit value of the noble metal ion concentration can be set to 100 to 500 mA. It is preferable to select an electrode condition in which the difference value between the above-described upper and lower values of the noble metal ion concentration and the lower limit value can be managed in the range of 100 to 300 mA.

鍍敷回收槽的排水及/或注水,例如採用排水用及注水用電動閥同時作動之方式,於排水用電動閥作動,排水完成後,注水用電動閥作動之方式,排水中注水用電動閥作動之方式等,藉由控制盤自動地控制而進行。再者,代替電動閥,可使用電磁閥等具有同樣的機能者。Drainage and/or water injection in the plating recovery tank. For example, the electric valve for drainage and water injection is operated simultaneously, and the electric valve for drainage is actuated. After the drainage is completed, the electric valve for water injection is actuated, and the electric valve for water injection in the drainage is used. The manner of actuation, etc., is performed by the control panel being automatically controlled. Further, instead of the electric valve, a solenoid valve or the like having the same function can be used.

於排水用及注水用電動閥同時作動之方式中,若鍍敷回收槽內的收容液之電流值到達所設定的上限值,則排水用及注水用電動閥同時作動,若到達所設定的下限值,則排水用及注水用電動閥停止。藉由鍍敷回收槽內的收容液的電流值,控制排水及注水的時期,而管理貴金屬離子濃度的上限值及下限值。In the method of simultaneously operating the electric valve for water discharge and water injection, if the current value of the liquid contained in the plating recovery tank reaches the set upper limit value, the electric valve for draining and water injection is simultaneously operated, and if the set is reached at the same time, The lower limit value is used to stop the electric valve for draining and water injection. The upper limit and the lower limit of the precious metal ion concentration are managed by controlling the current value of the liquid in the plating tank and controlling the period of drainage and water injection.

於排水用電動閥作動,排水完成後,注水用電動閥作動之方式中,若鍍敷回收槽內的收容液之電流值到達所設定的上限值,則僅排水用電動閥作動,排水至下限水位為止。此時,該收容液的電流值係沒有變動。若排水完成,則接著注水用電動閥作動,若注水到達滿水位則停止。藉由鍍敷回收槽內的收容液之電流值,控制排水的時期,而管理貴金屬離子溫度的上限值,排水量及注水量係藉由水位的測定來管理,而管理貴金屬離子濃度的下限值。When the electric valve for the water discharge is operated, and the electric valve for the water injection is activated, if the current value of the liquid contained in the plating recovery tank reaches the set upper limit value, only the electric valve for draining is actuated, and the water is drained to The lower limit water level. At this time, the current value of the contained liquid did not change. If the drainage is completed, then the water injection is actuated by the electric valve, and if the water injection reaches the full water level, it stops. By controlling the current value of the liquid in the plating tank, controlling the drainage period, and managing the upper limit of the precious metal ion temperature, the displacement and the water injection amount are managed by the water level measurement, and the lower limit of the precious metal ion concentration is managed. value.

於排水中注水用電動閥作動之方式中,若鍍敷回收槽內的收容液之電流值到達所設定的上限值,則排水用電動閥作動,在該排水中注水用電動閥作動,若前述電流值到達所設定的下限值,則排水用及注水用電動閥的作動係停止,注水係結束。藉由鍍敷回收槽內的收容液的電流值,控制排水及注水的時期,而管理貴金屬離子濃度的上限值及下限值。When the electric current of the liquid in the plating recovery tank reaches the set upper limit value, the electric valve for draining is actuated, and the electric valve for water injection is actuated in the drain. When the current value reaches the set lower limit value, the operation of the electric valve for drainage and water injection is stopped, and the water injection system is completed. The upper limit and the lower limit of the precious metal ion concentration are managed by controlling the current value of the liquid in the plating tank and controlling the period of drainage and water injection.

於本發明中,回收對象的貴金屬離子之貴金屬係Au、Pd、Ag、Pt或Rh。因此,在鍍敷被處理物所處理的鍍敷液之種類係含有Au、Pd、Ag、Pt及Rh中的至少一種以上之鍍敷液,亦可為含有上述貴金屬與Ni、Co、Fe、Zn等的非貴金屬之合金鍍敷液。又,作為鍍敷方法,可舉出氰系鍍敷、非氰系鍍敷、電解鍍敷、無電解鍍敷等。還有,鍍敷槽內所收容的鍍敷液通常使用貴金屬離子濃度為1~70g/L者。In the present invention, the precious metal of the noble metal ion of the object to be recovered is Au, Pd, Ag, Pt or Rh. Therefore, the type of the plating solution to be treated by plating the workpiece is a plating solution containing at least one of Au, Pd, Ag, Pt, and Rh, and may contain the noble metal and Ni, Co, Fe, An alloy plating solution of non-noble metal such as Zn. Further, examples of the plating method include cyan-based plating, non-cyanide plating, electrolytic plating, and electroless plating. Further, the plating solution contained in the plating tank is usually a noble metal ion concentration of 1 to 70 g/L.

以下,舉出實施本發明時,維持鍍敷回收槽及鍍敷洗淨槽內的收容液之貴金屬濃度的實施形態之例。Hereinafter, an example of an embodiment in which the concentration of the noble metal in the plating liquid in the plating recovery tank and the plating washing tank is maintained in the practice of the present invention will be described.

[實施形態1][Embodiment 1]

使用鍍Au液(日本電鍍工程(EEJA)公司製,商品名:Temperex MLA100;Au6~10g/L),進行鍍敷處理之際,將鍍敷回收槽內的收容液之水溫設定在50℃,將該收容液的Au離子濃度之上限值設定在50~59mg/L,將下限值設定在34~43mg/L時,作為設置於鍍敷回收槽的電極、電極形狀、電極長度、電極間距離及外加電壓之最合適條件的1例,若外加電壓成為24V,則顯示Au離子濃度的前述上限值之電流值為350mA,顯示前述下限值的電流值為250mA,Au離子濃度的前述上限值及前述下限管理值之差分以電流值表示被管理在100mA的範圍之最合適電極,係由Pt鍍敷Ti材所成的陽極,由Ti材所成的陰極,例示圓棒形狀、電極直徑Φ 15mm、電極長度23mm、極間距離35mm。The plated Au liquid (manufactured by Electroplating Engineering (EEJA), trade name: Temperex MLA100; Au6 to 10 g/L) was used to set the water temperature of the liquid in the plating recovery tank at 50 °C. The upper limit of the Au ion concentration of the contained liquid is set to 50 to 59 mg/L, and the lower limit is set to 34 to 43 mg/L, and the electrode, the electrode shape, the electrode length, and the length of the electrode provided in the plating recovery tank are In the case of the most suitable condition for the distance between the electrodes and the applied voltage, if the applied voltage is 24 V, the current value indicating the upper limit of the Au ion concentration is 350 mA, and the current value indicating the lower limit value is 250 mA, and the Au ion concentration is The difference between the upper limit value and the lower limit management value is the most suitable electrode to be managed in the range of 100 mA by current value, and is an anode formed of a Pt-plated Ti material, a cathode formed of a Ti material, and an example of a round bar. The shape, the electrode diameter Φ 15 mm, the electrode length 23 mm, and the interelectrode distance 35 mm.

以排水用及注水用電動閥同時作動之方式來實施鍍敷回收槽的排水與注水時,當到達前述上限值的350mA時,排水用及注水用電動閥同時作動,當到達前述下限值的250mA時,停止排水用及注水用電動閥的作動。因此,所排水的Au離子濃度係前述上限濃度的50~59mg/L與前述下限濃度的34~43mg/L之範圍,鍍敷回收槽內的收容液之20%被交換。附著於鍍敷回收槽所洗淨的鍍敷被處理物之附著液的Au離子濃度係最大59mg/L,於鍍敷洗淨槽中,藉由以水稀釋此附著液,而將Au離子濃度維持在10mg/L以下的低濃度。注水的水溫係約20℃,連續運轉中的鍍敷回收槽之水溫為44~46℃。When the drainage and water injection of the plating recovery tank are performed simultaneously by the electric valve for drainage and water injection, when the upper limit value is 350 mA, the electric valve for drainage and water injection is simultaneously operated, and when the lower limit value is reached At 250 mA, the operation of the electric valve for draining and water injection is stopped. Therefore, the Au ion concentration to be drained is in the range of 50 to 59 mg/L of the upper limit concentration and 34 to 43 mg/L of the lower limit concentration, and 20% of the contained liquid in the plating recovery tank is exchanged. The Au ion concentration of the plating solution adhering to the plating material to be washed in the plating recovery tank is 59 mg/L at the maximum, and the Au concentration is diluted in the plating bath by diluting the adhesion liquid with water. Maintain a low concentration below 10 mg/L. The water temperature of the water injection is about 20 ° C, and the water temperature of the plating recovery tank during continuous operation is 44 to 46 ° C.

來自鍍敷回收槽的鍍敷排水中所含有的高濃度之Au離子的電解回收,係使用由Ir燒結Ti材所成的陽極、由Ti材所成的陰極電極而構成之循環處理容量約200L的電解回收裝置(田中貴金屬工業公司製:MINI Recover Cell),以130~200mA/dm2 的電解密度進行Au離子的回收。The electrolytic recovery of the high-concentration Au ions contained in the plating drainage from the plating recovery tank is a cycle treatment capacity of about 200 L using an anode made of an Ir sintered Ti material and a cathode electrode made of a Ti material. The electrolysis recovery device (manufactured by Tanaka Kikin Metal Co., Ltd.: MINI Recover Cell) collects Au ions at an electrolytic density of 130 to 200 mA/dm 2 .

來自上述電解回收後的廢液及鍍敷洗淨槽的鍍敷排水中所含有的低濃度Au離子之樹脂回收,係各自可使用同樣的樹脂,使用填充有陰離子交換樹脂的離子交換樹脂裝置(田中貴金屬工業公司製:Eagle RE)來進行Au離子的回收。The resin of the low-concentration Au ion contained in the plating liquid of the waste liquid after the electrolytic recovery and the plating washing tank is recovered, and the same resin can be used, and an ion exchange resin device filled with an anion exchange resin is used. Tanaka Precious Metal Industry Co., Ltd.: Eagle RE) to recover Au ions.

本實施形態的回收處理後之殘留的Au離子濃度係未達0.2mg/L。The concentration of Au ions remaining after the recovery treatment in the present embodiment is less than 0.2 mg/L.

[實施形態2][Embodiment 2]

使用鍍Au液(EEJA公司製,商品名:Temperex 8400;Au3~5g/L),進行鍍敷處理之際,將鍍敷回收槽內的收容液之水溫設定在50℃,將該收容液的Au離子濃度之上限值設定在50~63mg/L,將下限值設定在33~42mg/L時,作為設置於鍍敷回收槽的電極、電極形狀、電極長度、電極間距離及外加電壓之最合適條件的1例,若外加電壓成為24V,則顯示Au離子濃度的前述上限值之電流值為370mA,顯示前述下限值的電流值為270mA,Au離子濃度的前述上限值及前述下限管理值之差分以電流值表示被管理在100mA的範圍之最合適電極,係由Pt鍍敷Ti材所成的陽極,由Ti材所成的陰極,例示圓棒形狀、電極直徑Φ 15mm、電極長度23mm、極間距離35mm。When the plating treatment is performed using the Au plating solution (trade name: Temperex 8400; Au3 to 5 g/L), the water temperature of the storage liquid in the plating recovery tank is set to 50 ° C, and the liquid is contained. The upper limit of the Au ion concentration is set to 50 to 63 mg/L, and the lower limit is set to 33 to 42 mg/L. The electrode, the electrode shape, the electrode length, the distance between the electrodes, and the external electrode are provided in the plating recovery tank. In the case of the most suitable condition of the voltage, when the applied voltage is 24 V, the current value indicating the upper limit value of the Au ion concentration is 370 mA, and the current value indicating the lower limit value is 270 mA, and the upper limit value of the Au ion concentration. The difference between the lower limit management value and the current value indicates the most suitable electrode to be managed in the range of 100 mA, which is an anode formed of Pt-plated Ti material, a cathode formed of a Ti material, and an example of a round bar shape and an electrode diameter Φ. 15mm, electrode length 23mm, pole distance 35mm.

與實施形態1同樣地,以排水用及注水用電動閥同時作動之方式來實施鍍敷回收槽的排水與注水時,當到達前述上限值的370mA時,排水用及注水用電動閥同時作動,當到達前述下限值的270mA時,停止排水用及注水用電動閥的作動。因此,所排水的Au離子濃度係前述上限濃度的50~63mg/L與前述下限濃度的33~42mg/L之範圍,鍍敷回收槽內的收容液之20%被交換。附著於鍍敷回收槽所洗淨的鍍敷被處理物之附著液的Au離子濃度係最大63mg/L,於鍍敷洗淨槽中,藉由以水稀釋此附著液,而將Au離子濃度維持在10mg/L以下的低濃度。注水的水溫係約20℃,連續運轉中的鍍敷回收槽之水溫為44~46℃。In the same manner as in the first embodiment, when the drainage and water injection for the drainage and the water injection are simultaneously performed, when the water is drained and the water is injected, when the water is at the upper limit of 370 mA, the electric valve for drainage and water injection is simultaneously activated. When the 270 mA of the lower limit value is reached, the operation of the electric valve for drainage and water injection is stopped. Therefore, the Au ion concentration to be drained is in the range of 50 to 63 mg/L of the upper limit concentration and 33 to 42 mg/L of the lower limit concentration, and 20% of the contained liquid in the plating recovery tank is exchanged. The Au ion concentration of the plating solution adhering to the plating material to be washed in the plating recovery tank is 63 mg/L at the maximum, and the Au concentration is diluted in the plating bath by diluting the adhesion liquid with water. Maintain a low concentration below 10 mg/L. The water temperature of the water injection is about 20 ° C, and the water temperature of the plating recovery tank during continuous operation is 44 to 46 ° C.

來自鍍敷回收槽的鍍敷排水中所含有的高濃度之Au離子的電解回收,係使用由Ir燒結Ti材所成的陽極、由Ti材所成的陰極電極而構成之循環處理容量約200L的電解回收裝置(田中貴金屬工業公司製:MINI Recover Cell),以130~200mA/dm2 的電解密度進行Au離子的回收。The electrolytic recovery of the high-concentration Au ions contained in the plating drainage from the plating recovery tank is a cycle treatment capacity of about 200 L using an anode made of an Ir sintered Ti material and a cathode electrode made of a Ti material. The electrolysis recovery device (manufactured by Tanaka Kikin Metal Co., Ltd.: MINI Recover Cell) collects Au ions at an electrolytic density of 130 to 200 mA/dm 2 .

來自上述電解回收後的廢液及鍍敷洗淨槽的鍍敷排水中所含有的低濃度Au離子之樹脂回收,係各自可使用同樣的樹脂,使用填充有陰離子交換樹脂的離子交換樹脂裝置(田中貴金屬工業公司製:Eagle RE)來進行Au離子的回收。The resin of the low-concentration Au ion contained in the plating liquid of the waste liquid after the electrolytic recovery and the plating washing tank is recovered, and the same resin can be used, and an ion exchange resin device filled with an anion exchange resin is used. Tanaka Precious Metal Industry Co., Ltd.: Eagle RE) to recover Au ions.

本實施形態的回收處理後之殘留的Au離子濃度係未達0.2mg/L。The concentration of Au ions remaining after the recovery treatment in the present embodiment is less than 0.2 mg/L.

[實施形態3][Embodiment 3]

使用鍍Au液(EEJA公司製,商品名:Autrobond TN;Au1~3g/L),進行鍍敷處理之際,將鍍敷回收槽內的收容液之水溫設定在50℃,將該收容液的Au離子濃度之上限值設定在28~95mg/L,將下限值設定在17~74mg/L時,作為設置於鍍敷回收槽的電極、電極形狀、電極長度、電極間距離及外加電壓之最合適條件的1例,若外加電壓成為12V,則顯示Au離子濃度的前述上限值之電流值為450mA,顯示前述下限值的電流值為350mA,作為Au離子濃度的前述上限值及前述下限管理值之差分以電流值表示被管理在100mA的範圍之最合適電極,係由Pt鍍敷Ti材所成的陽極,由Ti材所成的陰極,例示圓棒形狀、電極直徑Φ 15mm、電極長度23mm、極間距離35mm。When the plating treatment is performed using the Au plating solution (trade name: Autrobond TN; Au1 to 3 g/L), the water temperature of the storage liquid in the plating recovery tank is set to 50 ° C, and the liquid is contained. The upper limit of the Au ion concentration is set to 28 to 95 mg/L, and the lower limit is set to 17 to 74 mg/L, and the electrode, the electrode shape, the electrode length, the distance between the electrodes, and the external electrode are provided in the plating recovery tank. In the case of the most suitable condition of the voltage, when the applied voltage is 12 V, the current value indicating the upper limit value of the Au ion concentration is 450 mA, and the current value indicating the lower limit value is 350 mA, which is the upper limit of the Au ion concentration. The difference between the value and the aforementioned lower limit management value is the most suitable electrode to be managed in the range of 100 mA in terms of current value, and is an anode formed of Pt-plated Ti material, a cathode formed of Ti material, and an example of a round bar shape and an electrode diameter. Φ 15mm, electrode length 23mm, pole distance 35mm.

與實施形態1同樣地,以排水用及注水用電動閥同時作動之方式來實施鍍敷回收槽的排水與注水時,當到達前述上限值的450mA時,排水用及注水用電動閥同時作動,當到達前述下限值的350mA時,停止排水用及注水用電動閥的作動。因此,所排水的Au離子濃度係前述上限濃度的28~95mg/L與前述下限濃度的17~74mg/L之範圍,鍍敷回收槽內的收容液之20%被交換。附著於鍍敷回收槽所洗淨的鍍敷被處理物之附著液的Au離子濃度係最大95mg/L,於鍍敷洗淨槽中,藉由以水稀釋此附著液,而將Au離子濃度維持在10mg/L以下的低濃度。注水的水溫係約20℃,連續運轉中的鍍敷回收槽之水溫為44~46℃。In the same manner as in the first embodiment, when the drainage and the water injection electric valve are simultaneously operated to perform the drainage and water injection of the plating recovery tank, when the upper limit is reached at 450 mA, the electric valve for drainage and water injection is simultaneously activated. When it reaches 350 mA of the lower limit value, the operation of the electric valve for draining and water injection is stopped. Therefore, the Au ion concentration to be drained is in the range of 28 to 95 mg/L of the upper limit concentration and 17 to 74 mg/L of the lower limit concentration, and 20% of the contained liquid in the plating recovery tank is exchanged. The Au ion concentration of the plating solution adhering to the plating material to be washed in the plating recovery tank is 95 mg/L at the maximum, and the Au concentration is diluted in the plating bath by diluting the adhesion liquid with water. Maintain a low concentration below 10 mg/L. The water temperature of the water injection is about 20 ° C, and the water temperature of the plating recovery tank during continuous operation is 44 to 46 ° C.

來自鍍敷回收槽的鍍敷排水中所含有的高濃度之Au離子的電解回收,係使用由Ir燒結Ti材所成的陽極、由Ti材所成的陰極電極而構成之循環處理容量約200L的電解回收裝置(田中貴金屬工業公司製:MINI Recover Cell),以130~200mA/dm2 的電解密度進行Au離子的回收。The electrolytic recovery of the high-concentration Au ions contained in the plating drainage from the plating recovery tank is a cycle treatment capacity of about 200 L using an anode made of an Ir sintered Ti material and a cathode electrode made of a Ti material. The electrolysis recovery device (manufactured by Tanaka Kikin Metal Co., Ltd.: MINI Recover Cell) collects Au ions at an electrolytic density of 130 to 200 mA/dm 2 .

來自上述電解回收後的廢液及鍍敷洗淨槽的鍍敷排水中所含有的低濃度Au離子之樹脂回收,係各自可使用同樣的樹脂,使用填充有陰離子交換樹脂的離子交換樹脂裝置(田中貴金屬工業公司製:Eagle RE)來進行Au離子的回收。The resin of the low-concentration Au ion contained in the plating liquid of the waste liquid after the electrolytic recovery and the plating washing tank is recovered, and the same resin can be used, and an ion exchange resin device filled with an anion exchange resin is used. Tanaka Precious Metal Industry Co., Ltd.: Eagle RE) to recover Au ions.

本實施形態的回收處理後之殘留的Au離子濃度係未達0.2mg/L。The concentration of Au ions remaining after the recovery treatment in the present embodiment is less than 0.2 mg/L.

[實施形態4][Embodiment 4]

使用鍍Pd液(EEJA公司製,商品名:Palladex 100;Pd25~30g/L),進行鍍敷處理之際,將鍍敷回收槽內的收容液之水溫設定在50℃,將該收容液的Pd離子之上限值設定在129~157mg/L,將下限值設定在38~77mg/L時,作為設置於鍍敷回收槽的電極、電極形狀、電極長度、電極間距離及外加電壓之最合適條件的1例,若外加電壓成為12V,則顯示Pd離子濃度的前述上限值之電流值為550mA,顯示前述下限值的電流值為450mA,Pd離子濃度的前述上限值及前述下限管理值之差分以電流值表示被管理在100mA的範圍之最合適電極,係由Pt鍍敷Ti材所成的陽極,由Ti材所成的陰極電極,例示圓棒形狀、電極直徑Φ 15mm、電極長度23mm、極間距離45mm。When the plating treatment is performed using a Pd-plated liquid (manufactured by EEJA Co., Ltd., trade name: Palladex 100; Pd 25 to 30 g/L), the water temperature of the liquid contained in the plating recovery tank is set to 50 ° C, and the liquid is contained. The upper limit of the Pd ion is set to 129 to 157 mg/L, and the lower limit is set to 38 to 77 mg/L. The electrode, the electrode shape, the electrode length, the distance between the electrodes, and the applied voltage are provided in the plating recovery tank. In the first case of the most suitable condition, when the applied voltage is 12V, the current value indicating the upper limit value of the Pd ion concentration is 550 mA, and the current value indicating the lower limit value is 450 mA, and the upper limit value of the Pd ion concentration and The difference between the lower limit management values and the current value indicates the most suitable electrode to be managed in the range of 100 mA, which is an anode formed of a Pt-plated Ti material, and a cathode electrode formed of a Ti material, exemplified by a round bar shape and an electrode diameter Φ. 15mm, electrode length 23mm, pole distance 45mm.

以排水用電動閥作動,排水完成後,注水用電動閥作動之方式,實施鍍敷回收槽的排水與注水時,當到達前述上限值的550mA時,排水用電動閥作動,當排出滿水量的40%時,注水用電動閥作動,當滿水時停止。因此,所排水的Pd離子濃度係前述上限濃度的129~157mg/L之範圍,附著於鍍敷回收槽所洗淨的鍍敷被處理物之附著液的Pd離子濃度係最大157mg/L,於鍍敷洗淨槽中,藉由以水稀釋此附著液,而將Pd離子濃度維持在10mg/L以下的低濃度。注水的水溫係約20℃,連續運轉中的鍍敷回收槽之水溫為40~42℃。When the drainage is completed, the water injection is operated by the electric valve, and when the drainage and the water injection of the plating recovery tank are performed, when the 550 mA of the above upper limit is reached, the electric valve for drainage is actuated, and when the water is discharged, the amount of water is discharged. At 40% of the time, the water injection is actuated by the electric valve and stops when it is full. Therefore, the Pd ion concentration to be drained is in the range of 129 to 157 mg/L of the upper limit concentration, and the Pd ion concentration of the adhering liquid adhered to the plating target treated by the plating recovery tank is at most 157 mg/L. In the plating washing tank, the Pd ion concentration is maintained at a low concentration of 10 mg/L or less by diluting the adhering liquid with water. The water temperature of the water injection is about 20 ° C, and the water temperature of the plating recovery tank during continuous operation is 40 to 42 ° C.

來自鍍敷回收槽的鍍敷排水中所含有的高濃度之Pd離子的電解回收,係使用由Pt鍍敷Ti材所成的陽極、由Ti材所成的陰極電極而構成之循環處理容量約200L的電解回收裝置(田中貴金屬工業公司製:MINI Recover Cell),以100~270mA/dm2 的電解密度進行Pd離子的回收。The electrolytic recovery of high-concentration Pd ions contained in the plating drainage from the plating recovery tank is performed by using an anode formed of a Pt-plated Ti material and a cathode electrode formed of a Ti material. A 200 L electrolytic recovery device (manufactured by Tanaka Kiyoshi Metal Co., Ltd.: MINI Recover Cell) was used to recover Pd ions at an electrolytic density of 100 to 270 mA/dm 2 .

來自上述電解回收後的廢液及鍍敷洗淨槽的鍍敷排水中所含有的低濃度Pd離子之樹脂回收,係各自可使用同樣的樹脂,使用填充有螯合樹脂的離子交換樹脂裝置(田中貴金屬工業公司製:Eagle RE)來進行Pd離子的回收。The resin from the low-concentration Pd ions contained in the plating liquid of the waste liquid after the electrolytic recovery and the plating washing tank is recovered, and the same resin can be used, and an ion exchange resin device filled with a chelating resin is used. Tanaka Precious Metal Industry Co., Ltd.: Eagle RE) to recover Pd ions.

本實施形態的回收處理後之殘留的Pd離子濃度係未達0.5mg/L。The Pd ion concentration remaining after the recovery treatment in the present embodiment is less than 0.5 mg/L.

[實施形態5][Embodiment 5]

使用鍍Ag液(NE Chemcat公司製,商品名:AG-10;Ag50~70g/L),進行鍍敷處理之際,將鍍敷回收槽內的收容液之水溫設定在50℃,將該收容液的Ag離子濃度之上限值設定在148~195mg/L,將下限值設定在49~83mg/L時,作為設置於鍍敷回收槽的電極、電極形狀、電極長度、電極間距離及外加電壓之最合適條件的1例,若外加電壓成為12V,則顯示Ag離子濃度的前述上限值之電流值為650mA,顯示前述下限值的電流值為550mA,作為Ag離子濃度的前述上限值及前述下限管理值之差分以電流值表示被管理在100mA的範圍之最合適電極,係由Pt鍍敷Ti材所成的陽極,由Ti材所成的陰極電極,例示圓棒形狀、電極直徑Φ 15mm、電極長度23mm、極間距離55mm。When the plating treatment is performed using an Ag plating solution (manufactured by NE Chemcat Co., Ltd., trade name: AG-10; Ag 50 to 70 g/L), the water temperature of the storage liquid in the plating recovery tank is set to 50 ° C. The upper limit of the Ag ion concentration of the contained liquid is set to 148 to 195 mg/L, and the lower limit is set to 49 to 83 mg/L. The electrode, the electrode shape, the electrode length, and the distance between the electrodes are set in the plating recovery tank. In the case of the most suitable condition of the applied voltage, when the applied voltage is 12 V, the current value indicating the upper limit of the Ag ion concentration is 650 mA, and the current value indicating the lower limit value is 550 mA, which is the Ag ion concentration. The difference between the upper limit value and the lower limit management value is the most suitable electrode to be managed in the range of 100 mA. The anode is made of Pt-plated Ti material, and the cathode electrode made of Ti material is illustrated as a round bar shape. The electrode diameter is Φ 15 mm, the electrode length is 23 mm, and the interelectrode distance is 55 mm.

與實施形態4同樣地,鍍敷回收槽的排水及注水,當以排水用電動閥作動,排水完成後,注水用電動閥作動之方式實施時,於到達前述上限值的650mA時,排水用電動閥作動,於排出滿水量的50%時,注水用電動閥作動,於滿水時停止。因此,所排水的Ag離子濃度係前述上限濃度的148~195mg/L之範圍,附著於鍍敷洗淨槽所洗淨的鍍敷被處理物之附著液的Ag離子濃度係最大195mg/L,於鍍敷洗淨槽中,藉由以水稀釋此附著液,而將Ag離子濃度維持在10mg/L以下的低濃度。注水的水溫係約20℃,連續運轉中的鍍敷回收槽之水溫為39~41℃。In the same manner as in the fourth embodiment, the drainage and the water injection in the plating recovery tank are operated by the electric valve for drainage, and when the water injection is performed by the electric valve after the completion of the drainage, the water is discharged to the upper limit of 650 mA. When the electric valve is actuated, when the water is discharged 50%, the water injection is actuated by the electric valve and stops when the water is full. Therefore, the Ag ion concentration to be drained is in the range of 148 to 195 mg/L of the upper limit concentration, and the Ag ion concentration of the adhering liquid adhered to the plating target treated by the plating washing tank is 195 mg/L at the maximum. In the plating washing tank, the Ag concentration was maintained at a low concentration of 10 mg/L or less by diluting the adhering liquid with water. The water temperature of the water injection is about 20 ° C, and the water temperature of the plating recovery tank during continuous operation is 39 to 41 ° C.

來自鍍敷回收槽的鍍敷排水中所含有的高濃度之Ag離子的電解回收,係使用由Ir燒結Ti材所成的陽極、由Ti材所成的陰極電極而構成之循環處理容量約200L的電解回收裝置(田中貴金屬工業公司製:MINI Recover Cell),以130~200mA/dm2 的電解密度進行Ag離子的回收。The electrolytic recovery of the high-concentration Ag ions contained in the plating drainage from the plating recovery tank is a cycle treatment capacity of about 200 L using an anode made of an Ir sintered Ti material and a cathode electrode made of a Ti material. The electrolytic recovery device (MINI Recover Cell, manufactured by Tanaka Kikin Metal Co., Ltd.) was used to recover Ag ions at an electrolytic density of 130 to 200 mA/dm 2 .

來自上述電解回收後的廢液及鍍敷洗淨槽的鍍敷排水中所含有的低濃度Ag離子之樹脂回收,係各自可使用同樣的樹脂,使用填充有陰離子交換樹脂的離子交換樹脂裝置(田中貴金屬工業公司製:Eagle RE)來進行Ag離子的回收。The resin of the low-concentration Ag ion contained in the plating liquid of the waste liquid after electrolysis and the plating washing tank is recovered, and the same resin can be used, and an ion exchange resin device filled with an anion exchange resin is used. Tanaka Precious Metal Industry Co., Ltd.: Eagle RE) to recover Ag ions.

本實施形態的回收處理後之殘留的Ag離子濃度係未達0.2mg/L。The Ag ion concentration remaining after the recovery treatment in the present embodiment is less than 0.2 mg/L.

[實施形態6][Embodiment 6]

使用鍍Pt液(EEJA公司製,商品名:Preciousfab Pt100;Pt10~14g/L),進行鍍敷處理之際,將鍍敷回收槽內的收容液之水溫設定在50℃,將該收容液的Pt離子濃度之上限值設定在96~120mg/L,將下限值設定在45~63mg/L時,作為設置於鍍敷回收槽的電極、電極形狀、電極長度、電極間距離及外加電壓之最合適條件的1例,若外加電壓成為15V,則顯示Pt離子濃度的前述上限值之電流值為500mA,顯示前述下限值的電流值為400mA,作為Pt離子濃度的前述上限值及前述下限管理值之差分以電流值表示被管理在100mA的範圍之最合適電極,係由Pt鍍敷Ti材所成的陽極,由Ti材所成的陰極電極,例示圓棒形狀、電極直徑Φ 15mm、電極長度23mm、極間距離40mm。When the plating treatment is performed using a Pt-plated liquid (manufactured by EEJA Co., Ltd., trade name: Preciousfab Pt100; Pt10 to 14 g/L), the water temperature of the liquid contained in the plating recovery tank is set to 50 ° C, and the liquid is contained. The upper limit of the Pt ion concentration is set to 96 to 120 mg/L, and the lower limit is set to 45 to 63 mg/L. The electrode, the electrode shape, the electrode length, the distance between the electrodes, and the external electrode are provided in the plating recovery tank. In the case of the most suitable condition of the voltage, when the applied voltage is 15 V, the current value indicating the upper limit of the Pt ion concentration is 500 mA, and the current value indicating the lower limit value is 400 mA, which is the upper limit of the Pt ion concentration. The difference between the value and the aforementioned lower limit management value is the most suitable electrode to be managed in the range of 100 mA by the current value, and is an anode formed of Pt-plated Ti material, a cathode electrode formed of Ti material, and an example of a round bar shape and an electrode. The diameter is Φ 15mm, the electrode length is 23mm, and the distance between the poles is 40mm.

以排水中注水用電動閥作動之方式來實施鍍敷回收槽的排水與注水時,當到達前述上限值的500mA時,排水用電動閥作動,排水中注水用電動閥作動,當到達下限值的400mA時,停止排水用及注水用電動閥之作動。因此,所排水的Pt離子濃度係前述上限濃度的96~120mg/L與前述下限濃度的45~63mg/L之範圍,鍍敷回收槽內的收容液之40%被交換。附著於鍍敷洗淨槽所洗淨的鍍敷被處理物之附著液的Pt離子濃度係最大120mg/L,於鍍敷洗淨槽中,藉由以水稀釋此附著液,而維持在10mg/L以下的低濃度。注水的水溫係約20℃,連續運轉中的鍍敷回收槽之水溫為40~42℃。When draining and water-injecting the plating recovery tank by means of an electric valve for water injection in the drain, when the upper limit value is 500 mA, the electric valve for draining is actuated, and the water-filled water is actuated by the electric valve to reach the lower limit. When the value is 400 mA, the operation of the electric valve for draining and water injection is stopped. Therefore, the Pt ion concentration to be drained is in the range of 96 to 120 mg/L of the upper limit concentration and 45 to 63 mg/L of the lower limit concentration, and 40% of the contained liquid in the plating recovery tank is exchanged. The Pt ion concentration of the plating solution adhered to the plating treatment tank to be cleaned is 120 mg/L at the maximum, and is maintained at 10 mg by diluting the adhesion liquid with water in the plating washing tank. Low concentration below /L. The water temperature of the water injection is about 20 ° C, and the water temperature of the plating recovery tank during continuous operation is 40 to 42 ° C.

來自鍍敷回收槽的鍍敷排水中所含有的高濃度之Pt離子的電解回收,係使用由Pt鍍敷Ti材所成的陽極、由Ti材所成的陰極電極而構成之循環處理容量約200L的電解回收裝置(田中貴金屬工業公司製:MINI Recover Cell),以30~140mA/dm2 的電解密度進行Pt離子的回收。The electrolytic recovery of the high-concentration Pt ions contained in the plating drainage from the plating recovery tank is performed by using an anode formed of a Pt-plated Ti material and a cathode electrode formed of a Ti material. A 200 L electrolytic recovery device (manufactured by Tanaka Kiyoshi Metal Co., Ltd.: MINI Recover Cell) was used to recover Pt ions at an electrolytic density of 30 to 140 mA/dm 2 .

來自上述電解回收後的廢液及鍍敷洗淨槽的鍍敷排水中所含有的低濃度Pt離子之樹脂回收,係各自可使用同樣的樹脂,使用填充有陽離子交換樹脂的離子交換樹脂裝置(田中貴金屬工業公司製:Eagle RE)來進行Pt離子的回收。The resin of low-concentration Pt ions contained in the plating liquid of the waste liquid after electrolysis and the plating washing tank is recovered, and the same resin can be used, and an ion exchange resin device filled with a cation exchange resin is used. Tanaka Precious Metal Industry Co., Ltd.: Eagle RE) to recover Pt ions.

本實施形態的回收處理後之殘留的Pt離子濃度係未達0.5mg/L。The Pt ion concentration remaining after the recovery treatment in the present embodiment is less than 0.5 mg/L.

[實施形態7][Embodiment 7]

使用鍍Rh液(NE Chemcat公司製,商品名:RH221;Rh3~5g/L),進行鍍敷處理之際,將鍍敷回收槽內的收容液之水溫設定在50℃,將該收容液的Rh離子濃度之上限值設定在42~60mg/L,將下限值設定在16~32mg/L時,作為設置於鍍敷回收槽的電極、電極形狀、電極長度、電極間距離及外加電壓之最合適條件的1例,若外加電壓成為24V,則顯示Rh離子濃度的前述上限值之電流值為450mA,顯示前述下限值的電流值為350mA,作為Rh離子濃度的前述上限值及前述下限管理值之差分以電流值表示被管理在100mA的範圍之最合適電極,係由Pt鍍敷Ti材所成的陽極,由Ti材所成的陰極電極,例示圓棒形狀、電極直徑Φ 15mm、電極長度23mm、極間距離35mm。When the plating treatment is performed using a Rh-containing liquid (manufactured by NE Chemcat Co., Ltd., trade name: RH221; Rh 3 to 5 g/L), the water temperature of the liquid contained in the plating recovery tank is set to 50 ° C, and the liquid is contained. The upper limit of the Rh ion concentration is set to 42 to 60 mg/L, and the lower limit is set to 16 to 32 mg/L, and the electrode, the electrode shape, the electrode length, the distance between the electrodes, and the external electrode are provided in the plating recovery tank. In the case of the most suitable condition of the voltage, when the applied voltage is 24 V, the current value indicating the upper limit value of the Rh ion concentration is 450 mA, and the current value indicating the lower limit value is 350 mA, which is the upper limit of the Rh ion concentration. The difference between the value and the aforementioned lower limit management value is the most suitable electrode to be managed in the range of 100 mA by the current value, and is an anode formed of Pt-plated Ti material, a cathode electrode formed of Ti material, and an example of a round bar shape and an electrode. The diameter is Φ 15mm, the electrode length is 23mm, and the distance between the poles is 35mm.

與實施形態6同樣地,以排水中注水作動之方式來實施鍍敷回收槽的排水及注水時,當到達前述上限值的450mA時,排水電動閥作動,排水中注水用電動閥作動,當到達前述下限值的350mA時,停止排水用及注水用電動閥的作動。因此,所排水的Rh離子濃度係前述上限濃度的42~60mg/L與前述下限濃度的16~32mg/L之範圍,鍍敷回收槽內的收容液之30%被交換。附著於鍍敷洗淨槽所洗淨的鍍敷被處理物之附著液的Rh離子濃度係最大60mg/L,於鍍敷洗淨槽中,藉由以水稀釋此附著液,而維持在10mg/L以下的低濃度。注水的水溫係約20℃,連續運轉中的鍍敷回收槽之水溫為42~44℃。In the same manner as in the sixth embodiment, when the drainage and the water injection of the plating recovery tank are performed by the water injection in the drainage, when the upper limit value is 450 mA, the drain electric valve is actuated, and the water injection in the drainage is actuated by the electric valve. When it reaches 350 mA of the lower limit value, the operation of the electric valve for draining and water injection is stopped. Therefore, the Rh ion concentration to be drained is in the range of 42 to 60 mg/L of the upper limit concentration and 16 to 32 mg/L of the lower limit concentration, and 30% of the contained liquid in the plating recovery tank is exchanged. The Rh ion concentration of the plating solution adhered to the plating treatment tank to be washed is up to 60 mg/L, and is maintained at 10 mg by diluting the adhesion liquid with water in the plating washing tank. Low concentration below /L. The water temperature of the water injection is about 20 ° C, and the water temperature of the plating recovery tank during continuous operation is 42 to 44 ° C.

來自鍍敷回收槽的鍍敷排水中所含有的高濃度之Rh離子的電解回收,係使用由Pt鍍敷Ti材所成的陽極、由Ti材所成的陰極電極而構成之循環處理容量約200L的電解回收裝置(田中貴金屬工業公司製:MINI Recover Cell),以30~140mA/dm2 的電解密度進行Rh離子的回收。The electrolytic recovery of the high-concentration Rh ion contained in the plating drainage from the plating recovery tank is performed by using an anode formed of a Pt-plated Ti material and a cathode electrode formed of a Ti material. A 200 L electrolytic recovery device (manufactured by Tanaka Kiyoshi Metal Co., Ltd.: MINI Recover Cell) was used to recover Rh ions at an electrolytic density of 30 to 140 mA/dm 2 .

來自上述電解回收後的廢液及鍍敷洗淨槽的鍍敷排水中所含有的低濃度Rh離子之樹脂回收,係各自可使用同樣的樹脂,使用填充有陽離子交換樹脂的離子交換樹脂裝置(田中貴金屬工業公司製:Eagle RE)來進行Rh離子的回收。The resin from the low-concentration Rh ion contained in the plating liquid of the waste liquid after electrolysis and the plating washing tank is recovered, and the same resin can be used, and an ion exchange resin device filled with a cation exchange resin is used. Tanaka Precious Metal Industry Co., Ltd.: Eagle RE) to recover Rh ions.

本實施形態的回收處理後之殘留的Rh離子濃度係未達0.5mg/L。The Rh ion concentration remaining after the recovery treatment in the present embodiment is less than 0.5 mg/L.

[比較形態1][Comparative form 1]

使來自實施形態3的鍍敷回收槽之每一次的排水量成為鍍敷回收槽的滿水量之60%而排水,進行收容液的Au離子濃度之上限值及下限值的設定。然而,於60%的排水中,鍍敷回收槽的水溫係低於35℃,附著於鍍敷被處理物的過剩之貴金屬離子或鹽成分的洗出效率降低,更且發生黴菌或細菌的繁殖,發生品質降低所導致的鍍敷被處理物之良率降低。The amount of water discharged from the plating recovery tank of the third embodiment is set to 60% of the total amount of water in the plating recovery tank, and is drained, and the upper limit and the lower limit of the Au ion concentration of the storage liquid are set. However, in 60% of the drainage, the water temperature of the plating recovery tank is lower than 35 ° C, and the elution efficiency of excess precious metal ions or salt components attached to the plated material to be treated is lowered, and mold or bacteria are generated. Reproduction, the quality of the plated material to be treated is reduced due to the deterioration in quality.

[比較形態2][Comparative Form 2]

使來自實施形態5的鍍敷回收槽之每一次的排水量成為鍍敷回收槽的滿水量之5%而排水,進行收容液的Ag離子濃度之上限值及下限值的設定。然而,於5%的排水中,無法在上限值及下限值的範圍中設立充分的差,變無法藉由Ag離子濃度的電流值進行管理,結果Ag離子濃度超過800mg/L,將附著於鍍敷被處理物的過剩之貴金屬離子或鹽成分回收之效率係降低,發生品質降低所導致的鍍敷被處理物之良率降低。再者,於鍍敷洗淨槽中,Ag離子濃度係超過離子交換樹脂裝置的回收能力,貴金屬的回收率降低。The amount of water discharged from the plating recovery tank of the fifth embodiment is set to 5% of the full amount of water in the plating recovery tank, and the upper limit and the lower limit of the Ag ion concentration of the storage liquid are set. However, in 5% of the drainage, a sufficient difference cannot be established in the range of the upper limit value and the lower limit value, and the current value of the Ag ion concentration cannot be managed. As a result, the Ag ion concentration exceeds 800 mg/L, and the adhesion is adhered. The efficiency of recovering excess precious metal ions or salt components in the plated material to be treated is lowered, and the yield of the plated workpiece due to the deterioration in quality is lowered. Further, in the plating cleaning tank, the Ag ion concentration exceeds the recovery ability of the ion exchange resin device, and the recovery rate of the precious metal is lowered.

Claims (3)

一種自鍍敷排水回收貴金屬離子之方法,其特徵為:藉由使來自鍍敷回收槽的每一次之排水量成為鍍敷回收槽的滿水量之10~50%的範圍內,而且於鍍敷回收槽內,成為確保鍍敷被處理物的浸漬之量,而將鍍敷回收槽內的收容液之貴金屬離子濃度以10~200mg/L之高濃度維持,而且將鍍敷洗淨槽內的收容液之貴金屬離子濃度以10mg/L以下之低濃度維持,同時對於貴金屬離子的濃度以10~200mg/L之高濃度維持之來自鍍敷回收槽的鍍敷排水,併用電解回收法與樹脂回收法或活性碳吸附回收法來回收貴金屬離子,對於貴金屬離子的濃度以10mg/L以下之低濃度維持之來自鍍敷洗淨槽的鍍敷排水,藉由樹脂回收法或活性碳吸附回收法來回收貴金屬離子。 A method for recovering precious metal ions from a plating drainage, characterized in that the amount of water discharged from the plating recovery tank is within a range of 10 to 50% of the total amount of water in the plating recovery tank, and is recovered by plating. In the tank, the amount of the impregnation of the material to be treated is ensured, and the concentration of the noble metal ions of the liquid in the plating recovery tank is maintained at a high concentration of 10 to 200 mg/L, and the plating is cleaned in the tank. The precious metal ion concentration of the liquid is maintained at a low concentration of 10 mg/L or less, and the plating drainage from the plating recovery tank is maintained at a high concentration of 10 to 200 mg/L for the concentration of the noble metal ions, and the electrolytic recovery method and the resin recovery method are used. Or the activated carbon adsorption recovery method to recover precious metal ions, and the plating drainage from the plating cleaning tank maintained at a low concentration of noble metal ions at a concentration lower than 10 mg/L is recovered by a resin recovery method or an activated carbon adsorption recovery method. Precious metal ions. 如申請專利範圍第1項之回收貴金屬離子之方法,其中貴金屬離子係選自由Au、Pd、Ag、Pt及Rh所成之群組中的1種以上之貴金屬的離子。 A method for recovering noble metal ions according to the first aspect of the invention, wherein the noble metal ion is selected from the group consisting of ions of one or more noble metals selected from the group consisting of Au, Pd, Ag, Pt, and Rh. 如申請專利範圍第1或2項之回收貴金屬離子之方法,其中在設置於鍍敷回收槽的電極間,以恆定電壓或恆定電流進行通電,對於鍍敷回收槽內的收容液,預先作成表示電流值或電位值、與該收容液內所含有的貴金屬離子濃度之關係的校正曲線,在設置於鍍敷回收槽的電極間,以恆定電壓或恆定電 流進行通電,測定該電極間的電流值或電位值,以所得之測定值與上述校正曲線為基礎,將鍍敷回收槽內的收容液之貴金屬離子濃度定量,將貴金屬離子濃度維持在一定的範圍。A method for recovering precious metal ions according to the first or second aspect of the patent application, wherein a current is applied between the electrodes provided in the plating recovery tank at a constant voltage or a constant current, and the liquid in the plating recovery tank is previously expressed. A calibration curve for the relationship between the current value or the potential value and the concentration of the noble metal ions contained in the contained liquid is constant voltage or constant between the electrodes provided in the plating recovery tank The current is supplied to the flow, and the current value or the potential value between the electrodes is measured. Based on the obtained measured value and the calibration curve, the precious metal ion concentration of the liquid contained in the plating recovery tank is quantified, and the noble metal ion concentration is maintained at a constant value. range.
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