KR20110037581A - Apparatus for removing plated metal by plating and method for removing plated metal using the same - Google Patents

Apparatus for removing plated metal by plating and method for removing plated metal using the same Download PDF

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Publication number
KR20110037581A
KR20110037581A KR1020090095083A KR20090095083A KR20110037581A KR 20110037581 A KR20110037581 A KR 20110037581A KR 1020090095083 A KR1020090095083 A KR 1020090095083A KR 20090095083 A KR20090095083 A KR 20090095083A KR 20110037581 A KR20110037581 A KR 20110037581A
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KR
South Korea
Prior art keywords
plating
precipitate
plated
metal
supply device
Prior art date
Application number
KR1020090095083A
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Korean (ko)
Inventor
홍대조
Original Assignee
삼성전기주식회사
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Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020090095083A priority Critical patent/KR20110037581A/en
Publication of KR20110037581A publication Critical patent/KR20110037581A/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/20—Electrolytic production, recovery or refining of metals by electrolysis of solutions of noble metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

PURPOSE: An apparatus and a method for removing plated metal are provided to obtain a metal plate by recycling plated metal collected from waste plating liquid. CONSTITUTION: An apparatus for removing plated metal comprises a plating bath(10), a current supply device(20), a plating holder(30), and a metal plate(40). The plating bath receives waste plating liquid produced after plating an object with plating metal. The current supply device comprises an anode and a cathode and is connected to the plating bath. The plating holder is connected to the anode and formed with plated metal on the part thereof which is electrically connected to the object. The metal plate is connected to the cathode and precipitates the plated metal that is electrolyzed and removed from the connection part on the surface thereof.

Description

Apparatus for removing plated metal by plating and method for removing plated metal using the same}

The present invention relates to a plating precipitate removal apparatus and a plating precipitate removal method using the same.

In general, the electroplating apparatus injects the metal to be plated into the electrolytic solution of the plating bath, and then supplies electricity through the conducting unit to metal-plat the plated object.

The plating process using such an electrolytic plating apparatus is largely composed of a pretreatment step of a plating object, a plating step on a plating object, a water washing step after plating and a post-plating treatment step.

In the post-plating step, unwanted plating may be generated in the jig fixing the plating object, and a separate process of removing the plating may be required.

Conventional processes use oxidizing sulfuric acid, nitric acid, hydrogen peroxide or a mixture of these to remove unwanted plating.

Since the drug must maintain a constant concentration through the concentration analysis periodically, it is necessary to replace the new drug to increase the manufacturing cost.

In addition, as the oxidizing chemicals, the plating material formed on the jig may not be sufficiently removed, and the plating material not removed may cause a defect on the surface of the product in the plating bath.

Moreover, the use of such oxidizing agents may pose a risk of worker exposure to the chemicals and environmental pollution from the use of the chemicals.

In addition to the environmental aspects described above, it is necessary to prepare a method to reduce the plating cost and to increase the plating quality by recovering and recycling such metals from the economical aspect in consideration of resource recycling.

The present invention is to solve the above problems, an object of the present invention is to deposit a high concentration of metal in the plating waste liquid to recycle the metal plate to reduce the manufacturing cost of the plated precipitate removal device and a method for removing the plated precipitate using the same To provide.

In order to achieve the above object, one embodiment of the present invention,

Plating tank containing the plating liquid after the plating object is plated with a plating metal, a current supply device connected to the plating bath and having a positive electrode and a negative electrode, and connected to the positive electrode and the plating object is separated and electrically connected to the plating object. Provided is a plated deposit removing device including a plating holder having a plated laminate produced in a connecting portion and a metal plate connected to the cathode and for depositing the plated laminate electrolytically removed from the connecting portion.

Here, the adjustment of the removal rate of the plating stack may be made by adjusting the current amount of the current supply device.

Here, the plating metal may be at least one selected from gold, silver, copper, nickel, chromium, zinc and tin.

The metal plate may be made of at least one material selected from conductive metals such as copper and stainless steel.

In order to achieve the above object, another embodiment of the present invention,

Providing a current supply device having a positive electrode and a negative electrode connected to a plating bath in which a plating solution is plated with a plating metal after receiving the plating object, wherein the plating object is separated and a plating precipitate formed at an electrical connection with the plating object Connecting the plating holder with the positive electrode, connecting the metal plate with the negative electrode, and applying the current to the current supply device to electrolytically decompose the plated precipitate, thereby removing the plated precipitate from the connection portion. It provides a plated precipitate removal method comprising the step of precipitating the prepared plated precipitate on the surface of the metal plate.

Here, the adjustment of the removal rate of the plated precipitate may be made by adjusting the amount of current of the current supply device.

Here, the plating gold, silver, copper, nickel, chromium, zinc, tin may be made of at least one selected from.

The metal plate may be formed of at least one material selected from conductive metals such as copper and stainless steel.

According to the present invention, it is possible to provide a plating precipitate removal apparatus and a plating precipitate removal method using the same, which can reduce manufacturing costs by depositing a high concentration of metal in the plating waste liquid and recycling the metal plate.

In addition, it is possible to solve the risk of workers exposure to the chemical exposure of the oxidizing agent in the existing process, the manufacturing cost increase due to the use of the chemical and environmental pollution due to the use of the chemical.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity, and the elements denoted by the same reference numerals in the drawings are the same elements.

1 is a cross-sectional view schematically showing a plating precipitate removal apparatus manufactured according to an embodiment of the present invention.

Plating precipitate removal apparatus 100 manufactured according to an embodiment of the present invention is a plating bath 10, a plating waste solution 11 is received after plating, the current supply device 20 connected to the plating bath 10, the A plating holder 30 having a plating precipitate 33 formed in the electrical connection portion 31 and connected to the current supply device 20 and the plating precipitate connected to the current supply device 20 and electrolytically removed. The metal plate 40 which precipitates 33 is included.

The plating bath 10 accommodates the plating waste liquid 11 remaining after the plating object (not shown) is plated with the plating metal.

Here, the material of the plating metal is not particularly limited as long as it is a metal capable of plating, but may be at least one selected from gold, silver, copper, nickel, chromium, zinc, and tin.

In addition, a current supply device 20 is connected to the plating bath 10, and the current supply device 20 includes a positive electrode 21 and a negative electrode 23 for electrolysis.

In addition, the plating holder 30 is disposed in the plating bath 10. The plating holder 30 is in a state in which a plating object is separated after plating, and is connected to the anode 21 of the current supply device 20.

The plating holder 30 is made of a metal material through which current flows, and the surface of the plating holder 30 is entirely coated with a polymer material of a series such as epoxy or polypropylene. However, in order to conduct current during the plating process, the electrical connection 31 with the plating target is not covered with a polymer material.

The undesired plating precipitate 33 is often generated after the plating process on the damaged portion around the electrical connection portion 31 or the surface coated with the polymer material of the plating holder 30.

In addition, a metal plate 40 is disposed in the plating bath 10. The metal plate 40 is connected to the cathode 23 of the current supply device 20.

Here, the metal plate 40 serves to deposit on the surface the unwanted plating precipitate 33 which is electrolyzed and removed from the electrical connection 31 of the plating holder 30.

In addition, the material of the metal plate 40 is not particularly limited as long as it is a metal capable of conducting current, but may be made of at least one material selected from conductive metals such as copper and stainless steel. In particular, when copper is used as the metal plate 40, there is an advantage in that reprocessing into an electric wire or copper for plating is easy.

On the other hand, by adjusting the amount of current in the current supply device 20 it is possible to control the removal and the deposition rate of the plated precipitate (33).

Hereinafter, the removal process of a plated precipitate is demonstrated with reference to FIG.

2 is a flowchart illustrating a process of removing a plated precipitate according to an embodiment of the present invention.

The removal process of the plating precipitate 33 according to the embodiment of the present invention is connected to the plating bath 10 in which the plating liquid 11 is accommodated after the plating object is plated with the plating metal, and the anode 21 and the cathode 23 are disposed. In the step of providing a current supply device 20 having a plating object, the plating object is separated, the plating holder 30 having a plating precipitate 33 generated in the electrical connection portion 31 with the plating object Connecting to the positive electrode 21, connecting the metal plate 40 to the negative electrode 23, and applying a current to the current supply device 20 to electrolyze the plating precipitate 33 to the connection part 31. Removing the plating precipitate 33 from the same) and simultaneously depositing the removed plating precipitate 33 on the surface of the metal plate 40.

First, after the plating object (not shown) is plated with a plating metal, a current supply device 20 connected to the plating bath 10 accommodating the remaining plating waste liquid 11 is prepared (S1).

Here, the material of the plating metal is not particularly limited as long as it is a metal capable of plating, but may be at least one selected from gold, silver, copper, nickel, chromium, zinc, and tin. In addition, the current supply device 20 includes a positive electrode 21 and a negative electrode 23 for electrolysis.

Next, the plating holder 30 having the unwanted plating precipitate 33 generated at the electrical connection portion 31 with the plating object is connected to the anode 21 of the current supply device 20 (S2).

Here, the plating holder 30 is a state in which the plating object is separated after plating.

The plating holder 30 is made of a metal material through which current flows, and the surface thereof is entirely epoxy. It is coated with a polymer of a series such as polypropylene. However, in order to conduct current during the plating process, the electrical connection 31 with the plating target is not covered with a polymer material.

The undesired plating precipitate 33 is often generated after the plating process on the damaged portion around the electrical connection portion 31 or the surface coated with the polymer material of the plating holder 30.

Next, the metal plate 40 is connected to the cathode 23 of the current supply device 20 (S3).

Here, the metal plate 40 serves to deposit on the surface the unwanted plating precipitate 33 which is electrolyzed and removed from the electrical connection 31 of the plating holder 30.

In addition, the material of the metal plate 40 is not particularly limited as long as it is a metal capable of conducting current, but may be made of at least one material selected from conductive metals such as copper and stainless steel. In particular, when copper is used as the metal plate 40, there is an advantage in that reprocessing into an electric wire or copper for plating is easy.

Next, an electric current is applied to the current supply device 20 to electrolyze the plated precipitate 33, thereby removing the unwanted plated precipitate 33 from the connecting portion 31 and simultaneously replating the removed plated precipitate 33. Precipitates to the surface of 40 (S4).

Here, in the electrical connection portion 31 of the plating holder 30 connected to the anode 21 of the current supply device 20, an oxidation reaction of the metal occurs, and the ionized plating precipitate 33 elutes to the plating liquid 11. do. At the same time, in the metal plate 40 connected to the cathode 23 of the current supply device 20, a reduction reaction of the metal occurs to deposit the plating precipitate 33 eluted in the plating waste liquid 11 again on the surface.

When the desired amount of plated precipitate 33 is deposited on the surface of the metal plate 40 by the above process, the metal plate 40 may be taken out of the plating bath 100 and the new metal plate 40 may be replaced to continue the process. .

According to an embodiment of the present invention, there is an advantage that the manufacturing cost can be reduced by precipitating a high concentration of metal in the plating waste liquid and recycling the metal plate.

In addition, it is possible to solve the risk of workers exposure to the chemical exposure of the oxidizing agent in the existing process, the manufacturing cost increase due to the use of the chemical and environmental pollution due to the use of the chemical.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

1 is a cross-sectional view schematically showing a plating precipitate removal apparatus manufactured according to an embodiment of the present invention.

2 is a flowchart illustrating a process of removing a plated precipitate according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: plating bath 11: plating waste liquid

20: current supply device 21: anode

23: cathode 30: plating holder

31: electrical connection 33: plated precipitate

40: metal plate 100: plating precipitate removal device

Claims (8)

A plating bath in which a plating waste liquid is received after plating a plating object with a plating metal; A current supply device connected to the plating bath and having a cathode and an anode; A plating holder connected to the anode and separated from the plating object, the plating holder including a plating precipitate formed on an electrical connection with the plating object; And And a metal plate connected to the cathode and for depositing the plated precipitate that has been electrolyzed and removed from the connection unit. The method of claim 1, The control of the removal rate of the plated stone layer is plated precipitate removal apparatus, characterized in that made by adjusting the current amount of the current supply device. The method of claim 1, The plating metal removal device, characterized in that at least one selected from gold, silver, copper, nickel, chromium, zinc, tin. The method of claim 1, The metal plate is a plating precipitate removal device, characterized in that made of at least one material selected from a conductive metal, such as copper, stainless steel. Providing a current supply device having a positive electrode and a negative electrode connected to a plating bath in which a plating waste liquid is plated after plating a plating object with a plating metal; Connecting the plating holder with the anode, wherein the plating object is separated, and the plating holder having the plating precipitate generated in the electrical connection portion with the plating object; Connecting the metal plate with the cathode and applying current to the current supply device to electrolyze the plated precipitate to remove the plated precipitate from the connection and simultaneously to deposit the removed plated precipitate onto the surface of the metal plate. Plating precipitate removal method comprising a. The method of claim 5, Adjusting the removal rate of the plating precipitate is made by adjusting the amount of current in the current supply device. The method of claim 5, The plating metal is a plating precipitate removal method, characterized in that made of at least one selected from gold, silver, copper, nickel, chromium, zinc, tin. The method of claim 5, The metal plate is a method for removing a plated stone layer, characterized in that formed of at least one material selected from a conductive metal such as copper, stainless steel.
KR1020090095083A 2009-10-07 2009-10-07 Apparatus for removing plated metal by plating and method for removing plated metal using the same KR20110037581A (en)

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KR1020090095083A KR20110037581A (en) 2009-10-07 2009-10-07 Apparatus for removing plated metal by plating and method for removing plated metal using the same

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Application Number Priority Date Filing Date Title
KR1020090095083A KR20110037581A (en) 2009-10-07 2009-10-07 Apparatus for removing plated metal by plating and method for removing plated metal using the same

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KR20110037581A true KR20110037581A (en) 2011-04-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130113370A (en) * 2012-03-30 2013-10-15 노벨러스 시스템즈, 인코포레이티드 Cleaning electroplating substrate holders using reverse current deplating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130113370A (en) * 2012-03-30 2013-10-15 노벨러스 시스템즈, 인코포레이티드 Cleaning electroplating substrate holders using reverse current deplating
US11542630B2 (en) 2012-03-30 2023-01-03 Novellus Systems, Inc. Cleaning electroplating substrate holders using reverse current deplating

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