TWI407500B - - Google Patents

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Publication number
TWI407500B
TWI407500B TW100104697A TW100104697A TWI407500B TW I407500 B TWI407500 B TW I407500B TW 100104697 A TW100104697 A TW 100104697A TW 100104697 A TW100104697 A TW 100104697A TW I407500 B TWI407500 B TW I407500B
Authority
TW
Taiwan
Prior art keywords
breaking
wafer
adjusting
procedure
comparing
Prior art date
Application number
TW100104697A
Other languages
English (en)
Other versions
TW201234464A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100104697A priority Critical patent/TW201234464A/zh
Publication of TW201234464A publication Critical patent/TW201234464A/zh
Application granted granted Critical
Publication of TWI407500B publication Critical patent/TWI407500B/zh

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW100104697A 2011-02-14 2011-02-14 Breaking point height detection method of wafer breaking TW201234464A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100104697A TW201234464A (en) 2011-02-14 2011-02-14 Breaking point height detection method of wafer breaking

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100104697A TW201234464A (en) 2011-02-14 2011-02-14 Breaking point height detection method of wafer breaking

Publications (2)

Publication Number Publication Date
TW201234464A TW201234464A (en) 2012-08-16
TWI407500B true TWI407500B (zh) 2013-09-01

Family

ID=47070127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100104697A TW201234464A (en) 2011-02-14 2011-02-14 Breaking point height detection method of wafer breaking

Country Status (1)

Country Link
TW (1) TW201234464A (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200415453A (en) * 2002-09-30 2004-08-16 Tokyo Electron Ltd Method and apparatus for the monitoring and control of a semiconductor manufacturing process
TW200622509A (en) * 2004-09-14 2006-07-01 Asml Masktools Bv A method for performing full-chip manufacturing reliability checking and correction
TW200931552A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Optical detection method of cleaving wafer
TW201100779A (en) * 2009-01-13 2011-01-01 Semiconductor Technologies & Instr Pte Ltd System and method for inspecting a wafer (3)

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200415453A (en) * 2002-09-30 2004-08-16 Tokyo Electron Ltd Method and apparatus for the monitoring and control of a semiconductor manufacturing process
TW200622509A (en) * 2004-09-14 2006-07-01 Asml Masktools Bv A method for performing full-chip manufacturing reliability checking and correction
TW200931552A (en) * 2008-01-11 2009-07-16 Horng Terng Automation Co Ltd Optical detection method of cleaving wafer
TW201100779A (en) * 2009-01-13 2011-01-01 Semiconductor Technologies & Instr Pte Ltd System and method for inspecting a wafer (3)

Also Published As

Publication number Publication date
TW201234464A (en) 2012-08-16

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MM4A Annulment or lapse of patent due to non-payment of fees