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Electric Connection Of Electric Components To Printed Circuits
(AREA)
Manufacturing Of Printed Circuit Boards
(AREA)
Abstract
Disclosed is a burrs removing method for an aluminum printed circuit board, which includes a carrying unit having an aluminum substrate, a circuit layout layer and a solder mask in which the aluminum substrate has not gone through burrs removal since its first formation; a protective layer for protection disposed on one side of the aluminum substrate and one side of the solder mask respectively; and an etchant selected among acidic etchants or alkaline etchants, wherein said etchant can remove the burrs around the aluminum substrate. Hereby, the effects of removing the burrs easily, increasing the process yield rate and reducing the manufacture costs can be realized.
TW99124099A2010-07-222010-07-22Burrs removing method for aluminum printed circuit board
TW201206278A
(en)
Copper foil for printed circuit board production, copper foil with carrier, and copper-clad laminate plate, and printed circuit board production method using copper foil for printed circuit board production, copper foil with carrier, and copper-clad laminate plate
Method for creating a slot-line on a multilayer substrate and multilayer printed circuit comprising at least one slot-line realized according to said method and used as an isolating slot or antenna
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