201206278 六、發明說明： 【發明所屬之技術領域】 ， 一本發明是㈣於-獅基印刷電路板毛邊去除方法，尤指 -種可達則於去除毛邊、提升製程良率以及降低製作成本之 功效者。 【先前技術】 按，一般習用發光二極體模、组之銘基印刷電路板（散熱鋁201206278 VI. Description of the invention: [Technical field to which the invention pertains], a invention is a method for removing burrs of a lion-based printed circuit board, in particular, a method for removing burrs, improving process yield, and reducing production cost. By. [Prior Art] Press, commonly used light-emitting diode mold, group of Ming-based printed circuit boards (heat-dissipating aluminum
• 板或紹芯印刷電路板），外型多以模沖、CNC銑切或V-CUT 方式成型，待成型後再進行相關之後製加工程序，藉以製成一 鋁基印刷電路板。 然而以模沖、CNC銑域V_CUT枝狀紹基板， 其成型邊（峰板周緣）易產生有毛邊之現象，因此，再初次 -細之财半會再以CNC精修、模沖祕或以卫刀修之方 - 式加以去除，如此，不但會使得去除毛邊之手續繁複，而耗費 較多之工時、工序及製作成本，且更會造成毛邊之毛頭不易除 • 淨，而導致有製程良率降低之情形發生。 【發明内容】 本發明之主要目的係在於’可翻躲去除毛邊、提升製 程良率以及降低製作成本之功效。 為達上述之目的，本發明係一種鋁基印刷電路板毛邊去除 方法，包含有一具有鋁基板、電路佈局層及防焊層之承載單 元，該贿板係初:域錢核過毛邊去除；分顺於銘基板 與防焊層-面上做為防護之保護層；以及選自於酸性姓刻液或 鹼性蝕刻液之餘刻液，該蝕刻液係可去除鋁基板周緣之毛 [s 201206278 於本發明之一實施例中，該鋁基板係以模沖、CNC銑切或 ν-CUT方式成型。 於本發明之一實施例中，該防焊層上係設有多數開口，可 分別透過各開口設置一發光二極體，且使各發光二極體與電路 佈局層電性連接。 於本發明之一實施例中，該保護層係為可剥膠。 於本發明之一實施例中，該保護層係可為耐酸鹼膠帶。 於本發明之一實施例中，該保護層係可為光阻劑。 鲁於本發明之一實施例中，該光阻劑係可為正負型乾膜光阻 劑或液態油墨阻劑。 於本發明之一實施例中，該酸性蝕刻液係可為氣化銅酸性 蝕刻液或氣化鐵酸性蝕刻液。 於本發明之一實施例中’該氯化銅酸性蝕刻液之比重為10 '〜1.5 ;銅含量為 60〜180g/L ; C1 為 120〜220g/L。 ' 於本發明之一實施例中，該氣化鐵酸性钕刻液之銅濃量為 30〜180g/L ;鹽酸濃度10〜40g/L。 • 於本發明之一實施例中’該鹼性蝕刻液係可為氣化銨性飯 刻液或氫氧化鈉溶液。 於本發明之一實施例中，該氣化銨鹼性蝕刻液之比重為i .〇 〜1.5 ;鋼含量為30〜180g/L。 於本發明之一實施例中，該氫氧化鈉溶液之氫氧化鈉濃度 為2〜20%。 【實施方式】 請參閱『第1及第2圖』所示，係分別為本發明運用時之 201206278 剖面狀態示意圖及本發明之後續運用狀態示意圖。如圖所示： 本發明係一種鋁基印刷電路板毛邊去除方法，其至少包含一承 載單元1、保護層2及蝕刻液3所構成。 上述所提之承載單元1係包含有一初次成型後之鋁基板 11、一層豐於鋁基板11上之電路佈局層12、及一層疊於 電路佈局層12上之防焊層13，該鋁基板11係以臈沖、 CNC銑切或V-CUT方式成型，且該鋁基板1 1係未經過毛邊 111去除，而該防焊層13上係設有多數開口131 ,其中 該電路佈局層1 2内依f際需求财包含數廣電路佈局或數 層絕緣層。 各保護層2係分別設於鋁基板χ丄與防焊層13之一面 上做為防護，而該保護層2係為可剥膠、耐酸鹼膠帶或為光阻 劑，且該光阻劑係可為正負型乾膜光阻劑或液態油膜阻劑。 該蝕刻液3係選自於酸性蝕刻液或鹼性蝕刻液，可利用該 姓刻液3去除紹基板1 1周緣之毛邊i丄丄，而該酸性侧液 係可為氣化銅酸性蝕刻液或氣化鐵酸性蝕刻液，且該鹼性蝕刻 液係可為氣化銨鹼性蝕刻液或氫氧化鈉溶液◊如是，藉由上述 之結構構成一全新之鋁基印刷電路板毛邊去除方法。 當本發明於運用時’係可先將各保護層2分別設於铭基板 1 1底面與防焊層1 3之-面上做為防護，之後再祕刻液3 應用於錄板i !周緣之毛邊去除，的舰職3為氣化銅 酸性姓刻液時其比重為⑶〜丨』；鋼含量為6Q〜18Gg/L ; α 為120〜220g/L，當該蝕刻液3為氯化鐵酸性蝕刻液時其銅濃 度為30〜l8Gg/L ;鹽酸濃度1G〜4喊，#該侧液3為氣化 錄驗性侧液時其比重為1()〜丨5 ;鋼含量為3()〜18喊，^ 201206278 =該鞋顺3為氫氧化鋼溶液時其氨氧 = ==::輪或_刻液之二3以 =:雷例如:將發光二_4透過心=:: 131與電路佈局層i 2電 =上，各開 路板毛邊後將保護層2移除。接並於凡成去除紹基印刷電• Board or Shaoxin printed circuit board), the shape is mostly molded by die punching, CNC milling or V-CUT. After molding, the relevant post-processing procedure is carried out to make an aluminum-based printed circuit board. However, in the die-cutting and CNC milling domain V_CUT, the forming edge (the periphery of the peak plate) is prone to burrs. Therefore, the first-fine grain will be refined by CNC, die-cut or The method of repairing the knives is removed, so that not only will the procedures for removing the burrs be complicated, but also the labor, process and production costs will be more expensive, and the hairs of the burrs will not be easily removed, resulting in a good process. The rate reduction situation occurs. SUMMARY OF THE INVENTION The main object of the present invention is to reduce the burrs, improve process yield, and reduce manufacturing costs. In order to achieve the above object, the present invention relates to a method for removing a burr of an aluminum-based printed circuit board, comprising: a carrying unit having an aluminum substrate, a circuit layout layer and a solder resist layer, wherein the brim board is initially removed by a burr; A protective layer on the surface of the substrate and the solder mask-protected layer; and a residual solution selected from an acid surging solution or an alkaline etching solution, which can remove the hair around the periphery of the aluminum substrate [s 201206278 In an embodiment of the invention, the aluminum substrate is formed by die punching, CNC milling or ν-CUT. In one embodiment of the present invention, the solder resist layer is provided with a plurality of openings, and a light emitting diode is disposed through each of the openings, and each of the light emitting diodes is electrically connected to the circuit layout layer. In an embodiment of the invention, the protective layer is peelable. In an embodiment of the invention, the protective layer may be an acid-resistant tape. In an embodiment of the invention, the protective layer can be a photoresist. In one embodiment of the invention, the photoresist may be a positive or negative dry film photoresist or a liquid ink resist. In an embodiment of the invention, the acidic etching solution may be a vaporized copper acidic etching solution or a vaporized iron acidic etching solution. In one embodiment of the present invention, the specific gravity of the copper chloride acidic etching solution is 10 ' to 1.5; the copper content is 60 to 180 g/L; and C1 is 120 to 220 g/L. In one embodiment of the present invention, the concentration of copper in the vaporized iron acid etching solution is 30 to 180 g/L; and the concentration of hydrochloric acid is 10 to 40 g/L. • In an embodiment of the invention, the alkaline etching solution can be a vaporized ammonium rice stream or a sodium hydroxide solution. In an embodiment of the present invention, the vaporized ammonium alkaline etching solution has a specific gravity of i. 〇 1.5 1.5; and the steel content is 30 〜 180 g/L. In one embodiment of the invention, the sodium hydroxide solution has a sodium hydroxide concentration of from 2 to 20%. [Embodiment] Please refer to "1st and 2nd drawings" for a schematic view of the state of the 201206278 profile and the subsequent operational state of the present invention. As shown in the figure: The present invention is a method for removing a burr of an aluminum-based printed circuit board, which comprises at least a load cell 1, a protective layer 2 and an etchant 3. The carrying unit 1 mentioned above comprises an aluminum substrate 11 after initial molding, a circuit layout layer 12 on the aluminum substrate 11, and a solder resist layer 13 laminated on the circuit layout layer 12, the aluminum substrate 11 The aluminum substrate 11 is not removed by the burr 111, and the solder resist layer 13 is provided with a plurality of openings 131, wherein the circuit layout layer 1 2 is formed by a buffering, a CNC milling or a V-CUT method. According to the demand, the circuit includes a number of circuit layouts or several layers of insulation. Each of the protective layers 2 is respectively disposed on one surface of the aluminum substrate χ丄 and the solder resist layer 13 , and the protective layer 2 is a peelable adhesive, an acid-resistant adhesive tape or a photoresist, and the photoresist is used. It can be a positive or negative dry film photoresist or a liquid oil film resist. The etching solution 3 is selected from an acidic etching solution or an alkaline etching solution, and the burr 3 of the substrate 1 can be removed by using the surname 3, and the acidic side liquid can be a vaporized copper acidic etching solution. Or a vaporized iron acidic etching solution, and the alkaline etching liquid can be a vaporized ammonium alkaline etching solution or a sodium hydroxide solution, for example, a new aluminum-based printed circuit board burr removal method is constructed by the above structure. When the present invention is applied, the protective layers 2 may be respectively disposed on the bottom surface of the substrate 1 1 and the surface of the solder resist layer 13 for protection, and then the secret engraving liquid 3 is applied to the recording board i! The burr is removed, and the ship's position 3 is (3) ~ 丨 when the vaporized copper acid surname is etched; the steel content is 6Q~18Gg/L; α is 120~220g/L, when the etchant 3 is chlorinated When the iron acid etching solution has a copper concentration of 30~l8Gg/L; the hydrochloric acid concentration is 1G~4, the side liquid 3 is a gasification recording side liquid with a specific gravity of 1 () ~ 丨 5; the steel content is 3 () ~ 18 shout, ^ 201206278 = the shoe cis 3 is the hydroxide steel solution when its ammonia oxygen = ==:: wheel or _ engraved two 3 to =: Ray, for example: will emit two _4 through the heart =: : 131 and the circuit layout layer i 2 electric = upper, the protective layer 2 is removed after each open circuit board is burred. And Yu Fancheng removes Shaoji printing
善習刺t騎與触毛除料可有效改 降低製作纟i可到易於去除毛邊、提竹程良率以及 件，爰依法提出專利申請。確已符合發明專利申請之要 惟以上所述者，僅為本發明之較佳實施 此限定本發明實施之銘图·从 °田不此以 明說明書内容所作之&單凡依本發明申請專利範圍及發 專利涵蓋之範圍内/ 變化與修飾，皆應仍屬本發明 【圖式簡單說明】 第1圖，係本發明運用時之剖面狀態示意圖。 第2圖，係本發明之後續運用狀態示意圖。 【主要元件符號說明】 承載單元1 鋁基板1 1 毛邊1 1 1 電路佈局層12 201206278 防焊層1 3 數開口131 保護層2 餘刻液3 發光二極體4Good habits and rides can be effectively improved. Reduce the production of 纟i to easy to remove the burrs, improve the bamboo yield and parts, and file a patent application according to law. It is true that the above-mentioned invention patent application is only for the purpose of the present invention, and it is only the preferred embodiment of the invention that the invention is limited to the embodiment of the invention. The scope of the patent and the scope of the patents/changes and modifications shall remain in the present invention. [Simplified description of the drawings] Fig. 1 is a schematic diagram showing the state of the profile when the invention is used. Figure 2 is a schematic diagram of the subsequent operational state of the present invention. [Main component symbol description] Carrying unit 1 Aluminum substrate 1 1 Raw edge 1 1 1 Circuit layout layer 12 201206278 Solder mask 1 3 Number opening 131 Protective layer 2 Remnant 3 Light-emitting diode 4