TWI406315B - Circuit protection apparatuses and methods for driving the same - Google Patents

Abstract

The invention discloses a circuit protective apparatus and the motion mode thereof. The circuit protective apparatus comprises a substrate, a first sheet material, and a second sheet material located at one side of the first sheet material, wherein an assembly is formed upon the substrate; the circuits connected at two ends of the substrate are electrically connected to the assembly; and the coefficient of thermal expansion of the first sheet material in the substrate is higher than that of the second sheet material. The circuit protective apparatus of the utility model can solve the problem that the short circuit resulting from the overheating of the conventional circuit protective apparatus is an irreversible procedure.

Description

Line protection device and its action mode

The present invention relates to line protection devices, and more particularly to the manner in which they operate in an overheated condition.

The use of electricity has become an indispensable part of modern human society. The use of electric power equipment surrounds the periphery of life, especially computerized, informationized industries, home, transportation, education, entertainment, etc., and there is no electricity. The use of electricity and its equipment has created a convenient modern life. In contrast, safe use of electricity is also a must for modern people. In general, a main switch for power control is provided in the overall line circuit of the power supply. Usually, the main switch is in the state of being energized (ON), and a fuse or a breaker is set thereon. When there is too much electric appliance used in the circuit circuit, causing current overload, short circuit, overheating of the line, etc., the fuse is blown or the breaker is tripped. The open circuit (OFF) state of the overall circuit loop is formed. In addition, there are separate circuit loops in the overall circuit loop, and a control switch is additionally provided in the circuit loop, and the switch mainly performs two kinds of actuation strokes of energization (ON) and power-off (OFF) of the respective current loops. In order to enhance the safety of power consumption, many switches also have the function of automatically tripping and de-energizing when the current is overloaded and overheated, so as to prevent the fuse or breaker of the whole line loop from reacting immediately to power off or trip when the current is overloaded. And the danger of wire fires. In addition to the above-mentioned integral circuit loops and individual circuit loops, the current overload and overheating of fuses, breakers and switches are automatically tripped and the power-off structure is used. Some single electronic and electrical products, such as high-priced electronic products and data processing. Information equipment or electricity consumption to teach higher electric heating appliances, etc., are also provided with a line protection structure of the temperature sensing breaker, thereby protecting the single electronic and electrical products, and the current overload of the single electronic and electrical products themselves. When the line is overheated, it will be powered off immediately, so as not to burn the product itself. At the same time, it can avoid the current overload and overheat condition of each line circuit and the whole line circuit caused by the problems of single electronic and electrical products, resulting in the circuit loop and the whole. The problem that other electrical equipment in the line loop cannot operate.

However, most of the line protection structures are destructive protection devices such as fuses. That is to say, the process of blowing the fuse when the line is overheated is an irreversible process, and the operation cannot be reconnected even after the line is cooled. To re-operate the overall line, the fuse needs to be replaced. Another problem is that most of the line protection devices only momentarily turn off the power when it is overheated, and the components cannot continue to function, causing great inconvenience to the user.

In summary, there is a need for a reusable line protection structure that can continue to be used even when the line is overheated.

An embodiment of the present invention provides a line protection device including: a substrate including a first plate, the second plate is located on a side of the first plate; the component is located on the substrate; and the first line is in contact with the second plate One side of the first plate is electrically connected to the component; and the second wire is contacted to the other side of the first plate on which the second plate is not disposed to be electrically connected to the component, wherein the first The coefficient of thermal expansion of the sheet is higher than the coefficient of thermal expansion of the second sheet.

Another embodiment of the present invention provides a circuit protection device, comprising: providing the above-mentioned line protection device; providing a driving current flowing from the first line to the second line to actuate the component; the heat generated by the component Passing to the substrate to expand the first plate and the second plate of the substrate; and when the temperature of the substrate is overheated, the side having the first plate on which the second plate is formed will warp, so that the first line cannot contact the first One side of the sheet is in turn incapable of being electrically connected to the component.

A further embodiment of the present invention provides a line protection device including: a substrate including a first plate, the second plate is located on a side of the first plate; the first component is located on the substrate; and the first line has a contact a side of the first sheet on which the two sheets are located to be electrically connected to the first member; and a second line contacting the other side of the first sheet on which the second sheet is not disposed to be electrically connected to The first component; the third circuit is located on the second board and spaced apart from the second board, and the third line is electrically connected to the second component, wherein the first board has a thermal expansion coefficient higher than a thermal expansion coefficient of the second board.

A further embodiment of the present invention provides a circuit protection device, comprising: providing the above-mentioned line protection device; providing a driving current flowing from the first line to the second line to operate the first element; The heat is transferred to the substrate to expand the first plate and the second plate of the substrate; and when the temperature of the substrate is overheated, the side having the first plate on which the second plate is formed will warp, making the first line impossible The side contacting the first sheet is further incapable of being electrically connected to the first member, and the third line is in contact with the second sheet and electrically connected to the second member.

In order to improve the problem that the open circuit protection device is in an irreversible process when the line is overheated, an embodiment of the present invention provides a line protection device 100 as shown in FIG. The substrate 101 of the line protection device may be a printed circuit board, a metal core printed circuit board, or an integrated circuit board, and is mainly composed of a board 101A, and one side of the board 101A is covered with another board 101B. A heat generating component 103 such as a light emitting diode, a wafer, a capacitor, or an inductor is formed on the board 101, and the lines 105A and 105B contacting the both ends of the substrate 101 are electrically connected to the element 103 by the wiring layout of the substrate 101. A side view of the above line protection device 100 is shown in Fig. 2.

The thermal expansion coefficient of the above-mentioned sheet material 101A must be larger than the thermal expansion coefficient of the sheet material 101B. For example, the plate 101A may have a coefficient of thermal expansion between 5.0 ppm/K and 50.0 ppm/K, and the plate 101B may have a coefficient of thermal expansion between 1.0 ppm/K and 30.0 ppm/K. In an embodiment of the invention, the ratio of thermal expansion coefficients of the sheets 101A and 101B is between 1:0.2 and 1:0.9. When the drive current flows from the line 105A through the element 103 to the line 105B to actuate the element 103, the heat generated by the element 103 is conducted to the substrate 101. As a result, the one end side of the plate 101A and 101B overlaps, and the warpage phenomenon occurs due to the difference in thermal expansion coefficient between the two, so that the element 103 cannot be electrically connected to the line 105B, as shown in FIG.

When the operating temperature of the line protection device 100 is normal (for example, between -40 ° C and 45 ° C), the wiring diagram is as shown in FIG. 4A. When the operating temperature of the element 103 is too high (for example, between 70 ° C and 300 ° C) and the substrate 101 is warped, the wiring pattern thereof is as shown in FIG. 4B, that is, an open circuit is formed. However, when the circuit is broken for a while, the cooled substrate 101 will return to its original state, and its circuit diagram will return to the state shown in FIG. 4A. It can be seen from FIGS. 2 and 3 (or FIGS. 4A and 4B) that the open circuit phenomenon caused by the overheating warpage of the substrate 101 is a reversible process, and therefore it is not necessary to replace the line protection unit such as a fuse after the disconnection.

In another embodiment of the present invention, the line protection device 100' is further provided with a line 105C above the line 105B in addition to the above-described substrate 101 containing the two types of sheets 101A and 101B, and the line 105C is connected to another element such as Light-emitting diodes, wafers, resistors, capacitors, or inductors. The side view of the line protection device 100' is as shown in Fig. 5, and the lines 105B and 105C are separated by a distance. In an embodiment of the invention, lines 105B and 105C are separated by a distance of between 0.05 mm and 10.00 mm. If the distance between the lines 105B and 105C is too long, the substrate 101 will not be smoothly electrically connected to the line 105C after being warped by heat. If the distance between the lines 105B and 105C is too short, when the heat generated by the element 103 is transferred to the substrate 101, the end of the plate 101A and 101B overlaps due to the difference in thermal expansion coefficient between the two, causing the element 103 to be warped. It is not electrically connected to line 105B and is electrically connected to line 105C as shown in FIG.

When the operating temperature of the line protection device 100' is normal (e.g., between -40 ° C and 45 ° C), the wiring diagram is as shown in Fig. 7A. When the operating temperature of the element 103 is too high (for example, between 70 ° C and 300 ° C) and the substrate 101 is warped and electrically connected to the line 105C and the element 107, the wiring diagram is as shown in FIG. 7B. In the case where the voltage applied to the line protection device 100' is the same, the overheated substrate 101 can be electrically connected to the line 105C and the element 107, thereby reducing the current passing through the element 103 (i.e., cooling the substrate 101 and the element 103). Compared with the previous embodiment, the substrate 101 of this embodiment does not completely break after warping, and allows the component 103 to continue to operate a part of the function, so that the component 103 is not completely disabled.

After the substrate 101 is warped for a period of time, the cooled substrate 101 will return to its original state, and its circuit diagram will return to the state shown in Fig. 7A. It can be seen from FIGS. 5 and 6 (or FIGS. 7A and 7B) that the phenomenon in which the element 103 is connected to the line 105C due to the overheating warpage of the substrate 101 is a reversible process, so that it is not necessary to perform additional actions after the substrate warps to cause the element 103. Reconnect to line 105B.

It should be noted that although the plate 101B of the substrate 101 is embedded in the plate 101A and has a contoured surface, the upper surface of the plate 101B may be higher or lower than the upper surface of the plate 101A, such as 8A or Figure 8B shows. In some embodiments of the invention, sheet 101B may be formed directly on sheet 101A to save on the cost of the inlay process, as shown in Figure 8C.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

100, 100’. . . Line protection device

101. . . Substrate

101A, 101B. . . Plate

103, 107. . . element

105A, 105B, 105C. . . line

1 is a top view of a line protection device in an embodiment of the present invention;

2 is a side view of the line protection device at a normal operating temperature in an embodiment of the present invention;

Figure 3 is a side view of the line protection device at an overheating operating temperature in an embodiment of the present invention;

4A is a circuit diagram of a line protection device at a normal operating temperature in an embodiment of the present invention;

4B is a circuit diagram of the line protection device at an overheating operating temperature in an embodiment of the present invention;

Figure 5 is a side view of the line protection device at a normal operating temperature in an embodiment of the present invention;

Figure 6 is a side elevational view of the line protection device at an overheating operating temperature in an embodiment of the present invention;

7A is a circuit diagram of a line protection device at a normal operating temperature in an embodiment of the present invention;

Figure 7B is a circuit diagram of the line protection device at an overheating operating temperature in an embodiment of the present invention;

8A-8C are side views of two different embodiments of the present invention in which two sheets of different thermal expansion coefficients are combined into a substrate.

100’. . . Line protection device

101. . . Substrate

101A, 101B. . . Plate

103. . . element

105A, 105B, 105C. . . line

Claims (14)

A circuit protection device comprising: a substrate comprising a first plate, and a second plate on a side of the first plate; an element on the substrate; a first line contacting the second plate One side of the first plate on which the first plate is electrically connected to the element; and a second line contacting the other side of the first plate on which the second plate is not disposed to be electrically connected To the component, wherein the first sheet has a coefficient of thermal expansion higher than a coefficient of thermal expansion of the second sheet. The line protection device according to claim 1, wherein the first plate has a thermal expansion coefficient of 5.0 ppm/K to 50.0 ppm/K, and the second plate has a thermal expansion coefficient of 1.0 ppm/K to 30.0. Between ppm/K. The line protection device of claim 1, wherein the first plate and the second plate have a thermal expansion coefficient ratio of between 1:0.2 and 1:0.9. The line protection device of claim 1, wherein the component comprises a light emitting diode, a chip, a capacitor, or an inductor. The circuit protection device of claim 1, wherein the substrate comprises a printed circuit board, a metal core printed circuit board, or an integrated circuit board. A method for actuating a line protection device, comprising: providing a line protection device according to claim 1; providing a driving current flowing from the first line to the second line to actuate the element; The heat generated by the component is transferred to the substrate to expand the first sheet and the second sheet of the substrate; and when the temperature of the substrate is overheated, having one of the first sheets on which the second sheet is formed The side will be warped such that the first line cannot contact one side of the first sheet and thus cannot be electrically connected to the element. A circuit protection device comprising: a substrate comprising a first plate, and a second plate on a side of the first plate; a first component on the substrate; and a first line, the contact having the a second plate on one side of the first plate to be electrically connected to the first member; and a second line contacting the other side of the first plate on which the second plate is not located Electrically connecting to the first component; a third line on the second board and spaced apart from the second board, and the third line is electrically connected to a second component, wherein the first The coefficient of thermal expansion of the sheet is higher than the coefficient of thermal expansion of the second sheet. The line protection device according to claim 7, wherein the first plate has a thermal expansion coefficient of between 1.0 ppm/K and 30.0 ppm/K, and the second plate has a thermal expansion coefficient of 5.0 ppm/K. Up to 50.0ppm / K. The line protection device of claim 7, wherein the first plate and the second plate have a thermal expansion coefficient ratio of between 1:0.2 and 1:0.9. The line protection device of claim 7, wherein the first component comprises a light emitting diode, a wafer, a resistor, a capacitor, or an inductor. The line protection device of claim 7, wherein the second component comprises a light emitting diode, a wafer, a resistor, a capacitor, or an inductor. The line protection device of claim 7, wherein the substrate comprises a printed circuit board, a metal core printed circuit board, or an integrated circuit board. The line protection device of claim 7, wherein the second plate is spaced apart from the third line by a distance of between 0.05 mm and 10.00 mm. A method for actuating a line protection device, comprising: providing a line protection device according to claim 7; providing a driving current flowing from the first line through the element to the second line to actuate the first component The heat generated by the first component is transferred to the substrate to expand the first plate and the second plate of the substrate; and when the temperature of the substrate is overheated, the second plate is formed thereon One side of a plate will be warped so that the first line cannot contact one side of the first plate and is not electrically connected to the first component, and the third line contacts the second plate and is electrically connected to The second component.