TWI406062B - A photosensitive resin composition for optical spacers, an optical spacers, and a liquid crystal display device - Google Patents

A photosensitive resin composition for optical spacers, an optical spacers, and a liquid crystal display device Download PDF

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TWI406062B
TWI406062B TW095125271A TW95125271A TWI406062B TW I406062 B TWI406062 B TW I406062B TW 095125271 A TW095125271 A TW 095125271A TW 95125271 A TW95125271 A TW 95125271A TW I406062 B TWI406062 B TW I406062B
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compound
resin composition
photosensitive resin
group
acrylate
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TW095125271A
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Chinese (zh)
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TW200715010A (en
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Kazuo Takebe
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Sumitomo Chemical Co
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Abstract

A photosensitive resin composition for photosensitive clearance material comprises a resin binder (A), a photo-polymerization compound (B), a photo-polymerization initiator (C) and a solvent (D), the photo-polymerization compound (B) contains a compound of the formula (I) with a content of 5-60 wt% in a total amount of resin binder, photo-polymerization compound (B) and photo-polymerization initiator (C). In formula (I), R1-R6 separately represent H or any group of formula (I-1) to (I-3), at least four groups of R1-R6 are selected from the groups of (I-1) to (I-3) and at least one group of R1-R6 is selected from the groups of (I-2) to (I-3).

Description

光間隔物用感光性樹脂組成物、光間隔物及液晶顯示裝置Photosensitive resin composition for photo spacer, photo spacer, and liquid crystal display device

本發明係關於一種光間隔物用感光性樹脂組成物。The present invention relates to a photosensitive resin composition for a photo spacer.

在構成液晶顯示裝置或觸摸面板等顯示裝置之濾光片與陣列基板之間,為保持兩基板之間隔設有間隔物。此間隔物已被提出一種使用感光性樹脂組成物而形成間隔物之光間隔物法以取代散布習知之球形粒子。A spacer is provided between the filter constituting the display device such as a liquid crystal display device or a touch panel and the array substrate to maintain a space between the two substrates. This spacer has been proposed as a photo spacer method in which a spacer is formed using a photosensitive resin composition in place of the conventional spherical particles.

此光間隔物法所使用之感光性樹脂組成物己提出一種含有甲基丙烯酸/甲基丙烯酸烯丙酯共聚合物作為黏結劑樹脂,並含有二季戊四醇六丙烯酸酯作為光聚合性化合物之光間隔物用感光性樹脂組成物。(參照特開2003-302639號公報)。The photosensitive resin composition used in the photo spacer method has proposed a light interval containing a methacrylic acid/allyl methacrylate copolymer as a binder resin and dipentaerythritol hexaacrylate as a photopolymerizable compound. A photosensitive resin composition is used for the object. (Refer to JP-A-2003-302639).

但,若使用特開2003-302639號公報所揭示之光間隔物用感光性樹脂組成物而形成光間隔物,有塑形變形量不充分之問題。However, when a photo-spacer is formed by using a photosensitive resin composition for a photo spacer disclosed in Japanese Laid-Open Patent Publication No. 2003-302639, there is a problem that the amount of deformation is insufficient.

本發明人等為發現一可形成如上述問題很少之光間隔物的感光性樹脂組成物,經研究後,發現含有某種光聚合性化合物之感光性樹脂組成物賦予塑形變形量很大之光間隔物。The present inventors have found that a photosensitive resin composition which can form a photo spacer having few problems as described above has been found to have a large amount of deformation of a photosensitive resin composition containing a certain photopolymerizable compound. Light spacers.

(發明之揭示)(disclosure of the invention)

本發明之目的在於提供一種可形成塑形變形量很大之光間隔物之感光性樹脂組成物。An object of the present invention is to provide a photosensitive resin composition which can form a photo spacer having a large amount of deformation.

亦即,本發明係提供以下之[1]~[6]者。That is, the present invention provides the following [1] to [6].

[1].一種光間隔物用感光性樹脂組成物,係含有黏結劑樹脂(A)、光聚合性化合物(B)、光聚合起始劑(C)及溶劑(D),其特徵在於:該光聚合性化合物(B)為含有以式(I)所示之化合物,且以式(I)所示之光聚合性化合物(B)的含量相對於黏結劑樹脂(A)、光聚合性化合物(B)及光聚合起始劑(C)之合計量就質量分率為5~60質量%。[1] A photosensitive resin composition for a photo spacer comprising a binder resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C), and a solvent (D), wherein: The photopolymerizable compound (B) contains a compound represented by the formula (I), and the content of the photopolymerizable compound (B) represented by the formula (I) is relative to the binder resin (A) and photopolymerizability. The total amount of the compound (B) and the photopolymerization initiator (C) is from 5 to 60% by mass.

[式(I)中,R1 ~R6 係分別獨立地表示氫原子或下述式(I-1)~(I-3)的任一者之基,R1 ~R6 之至少4個的基為(I-1)~(I-3)的任一者之基,R1 ~R6 之至少一個的基為(I-2)或(I-3)] In the formula (I), R 1 to R 6 each independently represent a hydrogen atom or a group of any one of the following formulas (I-1) to (I-3), and at least 4 of R 1 to R 6 The base of any of (I-1) to (I-3), the base of at least one of R 1 to R 6 is (I-2) or (I-3)]

[2].如[1]項之組成物,其中以式(I)所示之光聚合性化合物(B)的含量相對於黏結劑樹脂(A)、光聚合性化合物(B)及光聚合起始劑(C)之合計量就質量分率為20~40質量%。[2] The composition of the item [1], wherein the content of the photopolymerizable compound (B) represented by the formula (I) is relative to the binder resin (A), the photopolymerizable compound (B), and photopolymerization. The total amount of the initiator (C) is 20 to 40% by mass.

[3].如[1]或[2]項之組成物,其中黏結劑樹脂(A)為使化合物(A2)~(A5)之任何至少2種共聚合所得到之樹脂;(A2):具有可與(A4)共聚合之不飽和鍵結的化合物(A3):具有不飽和鍵結之羧酸(A4):於一分子中具有不飽和鍵結與環氧基之化合物(A5):酸酐但,(A2)~(A5)係分別互相不同。[3] The composition of [1] or [2], wherein the binder resin (A) is a resin obtained by copolymerizing at least two of the compounds (A2) to (A5); (A2): Compound (A3) having an unsaturated bond copolymerizable with (A4): a carboxylic acid having an unsaturated bond (A4): a compound having an unsaturated bond and an epoxy group in one molecule (A5): However, the (A2) to (A5) systems are different from each other.

[4].如[1]~[3]項中任一項之組成物,其中光聚合起始劑(C)為含有至少一種選自三嗪(Triazine)、苯乙酮化合物、雙咪唑化合物、肟化合物及醯基氧化膦化合物所構成之群的化合物。[4] The composition according to any one of [1] to [3] wherein the photopolymerization initiator (C) contains at least one selected from the group consisting of triazine, acetophenone, and biimidazole. A compound of the group consisting of a ruthenium compound and a ruthenium phosphine oxide compound.

[5].一種光間隔物,係使用如[1]~[4]項中任一項之組成物所形成者。[5] A photo spacer which is formed by using the composition according to any one of [1] to [4].

[6].一種液晶顯示裝置,係含有如[5]項之光間隔物。[6] A liquid crystal display device comprising the photo spacer according to [5].

(用以實施發明之形態)(to implement the form of the invention)

以下,詳細說明本發明。Hereinafter, the present invention will be described in detail.

本發明之感光性樹脂組成物係一種光間隔物用感光性樹脂組成物,其係含有黏結劑樹脂(A)、光聚合性化合物(B)、光聚合起始劑(C)、依需要而其他之添加劑(E)被溶解分散於溶劑(D),光聚合性化合物(B)含有以式(I)所示之化合物,以式(I)所示之化合物(B)的含量相對於黏結劑樹脂(A)、光聚合性化合物(B)及光聚合起始劑(C)之合計量就質量分率為5~60質量%。The photosensitive resin composition of the present invention is a photosensitive resin composition for a photo spacer, which comprises a binder resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C), and if necessary The other additive (E) is dissolved and dispersed in the solvent (D), and the photopolymerizable compound (B) contains the compound represented by the formula (I), and the content of the compound (B) represented by the formula (I) is relative to the binder. The total amount of the resin (A), the photopolymerizable compound (B), and the photopolymerization initiator (C) is from 5 to 60% by mass.

黏結劑樹脂(A)宜為具有鹼溶解性之樹脂、或具有鹼可溶性且具有以光或熱之作用進行反應性的樹脂。The binder resin (A) is preferably a resin having alkali solubility or a resin having alkali solubility and having reactivity by light or heat.

如此之黏結劑樹脂(A),可舉例如使以下之化合物(A2)~(A5)之任何至少2種((A2)、(A3)、(A4)、(A5))分別只看成1種,例如屬於(A2)之2個相異之化合物為1種)共聚合所得到之樹脂等。In the above-mentioned binder resin (A), for example, at least two of the following compounds (A2) to (A5) ((A2), (A3), (A4), (A5)) are regarded as only 1 For example, a resin obtained by copolymerization of one of two different compounds belonging to (A2) is used.

(A2):具有可與(A4)共聚合之不飽和鍵結的化合物(A3):具有不飽和鍵結之羧酸(A4):於一分子中具有不飽和鍵結與環氧基之化合物(A5):酸酐(A2): Compound (A3) having an unsaturated bond copolymerizable with (A4): a carboxylic acid having an unsaturated bond (A4): a compound having an unsaturated bond and an epoxy group in one molecule (A5): Anhydride

但,(A2)~(A5)係分別互相不同。However, (A2)~(A5) are different from each other.

具有可與(A4)共聚合之不飽和鍵結的化合物(A2)具體上可舉例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-羥基乙酯及(甲基)丙烯酸胺基乙酯等之未取代或取代的不飽和羧酸烷酯;含有(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸甲基環己酯、(甲基)丙烯酸環庚酯、(甲基)丙烯酸環辛酯、(甲基)丙烯酸萜烷基酯、(甲基)丙烯酸環戊烯酯、(甲基)丙烯酸環己烯酯、(甲基)丙烯酸環庚烯酯、(甲基)丙烯酸環辛烯酯、(甲基)丙烯酸萜二烯基酯、(甲基)丙烯酸異冰片酯、(甲基)丙烯酸蒎酯、(甲基)丙烯酸金剛烷酯、(甲基)丙烯酸降冰片烯酯、(甲基)丙烯酸蒎烯酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烷基氧乙酯、(甲基)丙烯酸二環戊烯基乙酯等之脂環式基的不飽和羧酯化合物;(甲基)丙烯酸寡乙二醇單烷基酯等之甘醇類的單飽和羧酯化合物;(甲基)丙烯酸苯甲酯、(甲基)丙烯酸苯氧基酯等之含有芳香環的不飽和羧酯化合物;苯乙烯、α -甲基苯乙烯、α -苯基苯乙烯、乙烯基甲苯等之芳香族乙烯基化合物;醋酸乙烯酯、丙酸乙烯酯等之羧酸乙烯酯;(甲基)丙烯腈、α -氯丙烯腈等之氰化乙烯基化合物;N-環己基馬來醯亞胺或N-苯基馬來醯亞胺、N-苯甲基馬來醯亞胺等之N-取代馬來醯亞胺化合物等。此等係可分別單獨或組合2種以上而使用。The compound (A2) having an unsaturated bond copolymerizable with (A4) may, for example, specifically be methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, or (methyl) An unsubstituted or substituted unsaturated carboxylic acid alkyl ester such as 2-hydroxyethyl acrylate or aminoethyl (meth) acrylate; containing cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, Methylcyclohexyl (meth)acrylate, cycloheptyl (meth)acrylate, cyclooctyl (meth)acrylate, decyl (meth)acrylate, cyclopentenyl (meth)acrylate, ( Cyclohexene methacrylate, cycloheptenyl (meth) acrylate, cyclooctene (meth) acrylate, decadienyl (meth) acrylate, isobornyl (meth) acrylate, ( Ethyl methacrylate, adamantyl (meth)acrylate, norbornene (meth)acrylate, terpene (meth)acrylate, dicyclopentanyl (meth)acrylate, (meth)acrylic acid An alicyclic unsaturated ester compound such as dicyclopentenyl ester, dicyclopentyloxyethyl (meth)acrylate or dicyclopentenylethyl (meth)acrylate; (meth)acrylic acid Oligo a monosaturated carboxy ester compound of a glycol such as a diol monoalkyl ester; an aromatic carboxyl group-containing unsaturated carboxylate compound such as benzyl (meth)acrylate or phenoxy (meth)acrylate; styrene; , an aromatic vinyl compound such as α -methylstyrene, α -phenylstyrene or vinyltoluene; a vinyl carboxylate such as vinyl acetate or vinyl propionate; (meth)acrylonitrile, α- a cyanidated vinyl compound such as chloroacrylonitrile; an N-substituted malayanium such as N-cyclohexylmaleimide or N-phenylmaleimide or N-benzylmaleimide Amine compounds and the like. These may be used alone or in combination of two or more.

此處,本說明書中之(甲基)丙烯酸酯係意指至少一種丙烯酸酯及(甲基)丙烯酸酯所構成之群。又,(甲基)丙烯酸係意指至少一種丙烯酸及甲基丙烯酸所構成之群。Here, the (meth) acrylate in the present specification means a group composed of at least one acrylate and (meth) acrylate. Further, (meth)acrylic means a group of at least one of acrylic acid and methacrylic acid.

具有不飽和鍵結的羧酸(A3)具體上可舉例如丙烯酸及甲基丙烯酸。丙烯酸及甲基丙烯酸係可分別單獨亦可組合兩者而使用。又,除此等丙烯酸或甲基丙烯酸以外,尚亦可使用具有其他之不飽和基的羧酸。具有其他之不飽和基的羧酸具體上可舉例如巴豆酸、衣康酸、馬來酸、富馬酸等。又,亦可於如α -(羥甲基)丙烯酸之同一分子中含有羥基及羧基,併用具有不飽和基之羧酸。The carboxylic acid (A3) having an unsaturated bond may specifically be, for example, acrylic acid or methacrylic acid. Acrylic acid and methacrylic acid can be used individually or in combination of both. Further, in addition to such acrylic acid or methacrylic acid, a carboxylic acid having another unsaturated group may also be used. Specific examples of the carboxylic acid having another unsaturated group include crotonic acid, itaconic acid, maleic acid, fumaric acid and the like. Further, a hydroxyl group and a carboxyl group may be contained in the same molecule as α- (hydroxymethyl)acrylic acid, and a carboxylic acid having an unsaturated group may be used.

於一分子中具有不飽和鍵結與環氧基之化合物(A4)可舉例如(甲基)丙烯酸縮水甘油基酯、(甲基)丙烯酸-β-甲基縮水甘油基酯、(甲基)丙烯酸-β-乙基縮水甘油基酯、(甲基)丙烯酸-β-丙基縮水甘油基酯、α -乙基丙烯酸-β-甲基縮水甘油基酯、(甲基)丙烯酸-3-甲基-3,4-環氧基丁酯、(甲基)丙烯酸-3-乙基-3,4-環氧基丁酯、(甲基)丙烯酸-4-甲基-4,5-環氧基戊酯、(甲基)丙烯酸-5-甲基-5,6-環氧基己酯、縮水甘油基乙烯基醚等,較佳係可舉例如(甲基)丙烯酸縮水甘油基酯。The compound (A4) having an unsaturated bond and an epoxy group in one molecule may, for example, be glycidyl (meth)acrylate, β-methylglycidyl (meth)acrylate, or (meth) Acrylic acid-β-ethyl glycidyl ester, β-propyl glycidyl (meth)acrylate, β-methyl glycidyl α -ethyl acrylate, 3-methyl (meth)acrylate 3-,4-epoxybutyl butyl ester, 3-ethyl-3,4-epoxybutyl (meth)acrylate, 4-methyl-4,5-epoxy (meth)acrylate The amyl amyl ester, 5-methyl-5,6-epoxyhexyl (meth)acrylate, glycidyl vinyl ether, etc. are preferably, for example, glycidyl (meth)acrylate.

酸酐(A5)係於一分子中具有1個酸酐之化合物,具體上可舉例如馬來酸酐、琥珀酸酐、衣康酸酐、酞酸酐、四氫酞酸酐、六氫酞酸酐、甲基末端亞甲基四氫酞酸酐、甲基四氫酞酸酐、偏苯三酸酐等,較佳係可舉例如四氫酞酸酐。The acid anhydride (A5) is a compound having one acid anhydride in one molecule, and specific examples thereof include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methyl terminal methylene. The tetrahydrofurfuric anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride or the like is preferably, for example, tetrahydrophthalic anhydride.

本發明之黏結劑樹脂(A)係可使前述各化合物任意地聚合而得到,但較佳係可舉例如(A2)與(A3)之共聚合物;在源自(A2)與(A3)之共聚合物中之(A3)的羧基部位進一步使(A4)反應之共聚合物;(A2)與(A4)之共聚合物而得到共聚合物1,使所得到之共聚合物1與(A3)在源自共聚合物1之(A4)的環氧基部位反應而得到共聚合物2;使所得到之共聚合物1與(A3)在源自共聚合物1之(A4)的環氧基部位反應而得到共聚合物2,進一步使所得到之共聚合物2與(A5)在以共聚合物1之(A4)與(A3)的反應所生成之至少一部分的羥基部位反應所得到之(A2)~(A5)共聚合物等。The binder resin (A) of the present invention can be obtained by arbitrarily polymerizing the above-mentioned respective compounds, but preferably, for example, a copolymer of (A2) and (A3); and (A2) and (A3) The carboxyl group of (A3) in the copolymer (4) further reacts the copolymer of (A4); the copolymer of (A2) and (A4) to obtain the copolymer 1, and the obtained copolymer 1 is (A3) reacting at an epoxy group derived from (A4) of the copolymer 1 to obtain a copolymer 2; and the obtained copolymer 1 and (A3) are derived from the copolymer 1 (A4) The epoxy group is reacted to obtain the copolymer 2, and the obtained copolymer 2 and (A5) are at least a part of the hydroxyl group formed by the reaction of (A4) and (A3) of the copolymer 1. The (A2) to (A5) copolymer obtained by the reaction.

(A2)與(A3)之共聚合物係可以工業上一般進行之條件下進行製造。例如於具備攪拌機、溫度計、回流冷卻管、滴下漏斗及氮氣導入管之燒瓶中,相對於(A2)與(A3)之合計量就質量基準,導入0.5~20倍量之溶劑,燒瓶內環境從空氣取代成氮氣。其後使溶劑昇溫至40~140℃後,相對於特定量之(A2)與(A3)、(A2)與(A3)之合計量而就質量基準於0~20倍量之溶劑中,使偶氮雙異丁腈或過氧化苯甲醯基等之聚合起始劑相對於(A2)與(A3)之合計莫耳數,添加0.1~10莫耳%的溶液(在室溫或加熱下攪拌溶解)從滴下漏斗花0.1~8小時滴下於前述燒瓶內,進一步以40~140℃之溫度範圍攪拌1~10小時。又,在上述之步驟中,亦可於燒瓶側饋入聚合起始劑之一部分或全量,亦可於燒瓶側饋入(A2)與(A3)之一部分或全量。又,為控制分子量或分子量分布。亦可使用α -甲基苯乙烯偶體或氫硫基化合物作為鏈移動劑。α -甲基苯乙烯偶體或氫硫基化合物之使用量相對於(A2)與(A3)之合計量,就質量基準一般為0.005~5%。又,考量製造設備或聚合所產生之發熱量等,亦可適當調整饋入方法或反應溫度。The copolymer of (A2) and (A3) can be produced under the conditions generally carried out industrially. For example, in a flask equipped with a stirrer, a thermometer, a reflux cooling tube, a dropping funnel, and a nitrogen introduction tube, a solvent is introduced in an amount of 0.5 to 20 times based on the total mass of (A2) and (A3), and the environment inside the flask is from The air is replaced by nitrogen. Thereafter, the temperature of the solvent is raised to 40 to 140 ° C, and then the amount of (A2) and (A3), (A2) and (A3) is used in a total amount of 0 to 20 times by mass based on the mass. a polymerization initiator such as azobisisobutyronitrile or benzoyl peroxide, and a molar amount of (A2) and (A3), and a solution of 0.1 to 10 mol% (at room temperature or under heating) The mixture was dropped into the flask from the dropping funnel for 0.1 to 8 hours, and further stirred at a temperature of 40 to 140 ° C for 1 to 10 hours. Further, in the above step, a part or the whole amount of the polymerization initiator may be fed to the flask side, or a part or the whole amount of (A2) and (A3) may be fed to the flask side. Also, to control the molecular weight or molecular weight distribution. An α -methylstyrene or a thiol compound can also be used as the chain shifting agent. The amount of the α -methylstyrene or the thiol compound to be used is generally 0.005 to 5% by mass based on the total amount of (A2) and (A3). Further, the feeding method or the reaction temperature may be appropriately adjusted in consideration of the amount of heat generated by the manufacturing equipment or the polymerization.

衍生自各別化合物之構成成分的比率,相對於構成前述共聚合物之構成成分的合計莫耳數,就莫耳分率宜在以下之範圍。The ratio of the constituent components derived from the respective compounds is preferably in the range of the molar fraction with respect to the total number of moles constituting the constituent components of the above-mentioned copolymer.

衍生自(A2)之構成單元:5~95莫耳%衍生自(A3)之構成單元:5~95莫耳%The constituent unit derived from (A2): 5~95 mol% is derived from the constituent unit of (A3): 5~95 mol%

又,若前述之構成成分的比率為以下之範圍,因顯像性良好,更佳。Moreover, when the ratio of the above-mentioned constituent components is in the following range, the developing property is good, and it is more preferable.

衍生自(A2)之構成單元:10~90莫耳%衍生自(A3)之構成單元:10~90莫耳%The constituent unit derived from (A2): 10~90 mol% is derived from the constituent unit of (A3): 10~90 mol%

又,使前述之(A2)與(A3)之共聚合物與(A4)在源自前述共聚合物之(A3)的羧基之部位反應所得到的共聚合物中,(A4)之加成量相對於前述共聚合物之(A3)的羧基,一般為5~60莫耳%,更宜為10~50莫耳%。Further, in the copolymer obtained by reacting the above-mentioned (A2) and (A3) copolymer with (A4) at the site derived from the carboxyl group of (A3) of the above-mentioned copolymer, the addition of (A4) The amount is usually 5 to 60 mol%, more preferably 10 to 50 mol%, based on the carboxyl group of (A3) of the above copolymer.

若(A4)之組成比在上述範圍內,可得到顯像性優且充分之光硬化性或熱硬化性,信賴性優,故佳。When the composition ratio of (A4) is within the above range, excellent photosensitivity and sufficient photocurability or thermosetting property can be obtained, and the reliability is excellent, which is preferable.

又,使前述(A2)及(A4)共聚合而得到共聚合物1,使所得到之共聚合物1與(A3)在源自共聚合物1之(A4)的環氧基部位反應而得到共聚合物2,進一步使所得到之共聚合物2與(A5)在藉共聚合物1之(A4)與(A3)的反應所生成的羥基部位反應所得到之(A2)~(A5)共聚合物係較宜使用。Further, the above (A2) and (A4) are copolymerized to obtain a copolymer 1, and the obtained copolymer 1 and (A3) are reacted at an epoxy group derived from (A4) of the copolymer 1. The copolymer 2 is obtained, and the obtained copolymer 2 is further reacted with (A5) by a hydroxyl group formed by the reaction of (A4) and (A3) of the copolymer 1 (A2) to (A5). The copolymer is preferably used.

前述(A2)~(A5)共聚合物可如以下般製造。The aforementioned (A2) to (A5) copolymer can be produced as follows.

首先為得到共聚合物1,使(A2)及(A4)共聚合。此共聚合時係在一般之條件下進行製造。例如於具備有攪拌機、溫度計、回流冷卻管、滴下漏斗及氮氣導入管之燒瓶中,相對於(A2)與(A4)之合計量就質量基準,導入0.5~20倍量之溶劑,燒瓶內環境從空氣取代成氮氣。其後使溶劑昇溫至40~140℃後,相對於(A2)及(A4)之合計量而就質量基準於0~20倍量之溶劑中,使偶氮雙異丁腈或過氧化苯甲醯基等之聚合起始劑相對於(A2)及(A4)之合計莫耳數,添加0.1~10莫耳%的溶液(在室溫或加熱下攪拌溶解)從滴下漏斗花0.1~8小時滴下於前述燒瓶內,進一步以40~140℃攪拌1~10小時。First, in order to obtain the copolymer 1, (A2) and (A4) are copolymerized. This copolymerization is carried out under normal conditions. For example, in a flask equipped with a stirrer, a thermometer, a reflux cooling tube, a dropping funnel, and a nitrogen introduction tube, a solvent of 0.5 to 20 times is introduced with respect to the mass ratio of (A2) and (A4), and the flask environment is introduced. Replaced from air to nitrogen. Thereafter, after raising the temperature of the solvent to 40 to 140 ° C, azobisisobutyronitrile or benzoic acid is used in a solvent having a mass ratio of 0 to 20 times based on the total amount of (A2) and (A4). The polymerization initiator of the thiol group or the like is added to the total number of moles of (A2) and (A4) by adding 0.1 to 10 mol% of the solution (stirring at room temperature or under heating) from the dropping funnel for 0.1 to 8 hours. The mixture was dropped into the flask, and further stirred at 40 to 140 ° C for 1 to 10 hours.

又,在上述之步驟中,亦可於燒瓶側饋入聚合起始劑之一部分或全量,亦可於燒瓶側饋入(A2)及(A4)之一部分或全量。又,為控制分子量或分子量分布。亦可使用α -甲基苯乙烯偶體或氫硫基化合物作為鏈移動劑。α -甲基苯乙烯偶體或氫硫基化合物之使用量相對於(A2)~(A3)之合計量,就質量基準一般為0.005~5%。又,考量製造設備或聚合所產生之發熱量等,亦可適當調整饋入方法或反應溫度。Further, in the above step, one part or the whole amount of the polymerization initiator may be fed to the flask side, or one part or the whole amount of (A2) and (A4) may be fed to the flask side. Also, to control the molecular weight or molecular weight distribution. An α -methylstyrene or a thiol compound can also be used as the chain shifting agent. The amount of use of the α -methylstyrene or the thiol compound is generally 0.005 to 5% based on the total mass of (A2) to (A3). Further, the feeding method or the reaction temperature may be appropriately adjusted in consideration of the amount of heat generated by the manufacturing equipment or the polymerization.

衍生自各別化合物之構成成分的比率,相對於構成前述共聚合物1之構成成分的合計莫耳數,就莫耳分率宜在以下之範圍。The ratio of the constituent components derived from the respective compounds to the total number of moles constituting the constituent components of the above-mentioned copolymer 1 is preferably in the range of the following.

衍生自(A2)之構成單元:2~97莫耳%衍生自(A4)之構成單元:3~98莫耳%The constituent unit derived from (A2): 2~97 mol% is derived from the constituent unit of (A4): 3~98 mol%

又,若前述之構成成分的比率為以下之範圍,可撓性及耐熱性之均衡性良好,可得到較佳之主幹聚合物,故更佳。Further, when the ratio of the above-mentioned constituent components is in the following range, the balance between flexibility and heat resistance is good, and a preferred trunk polymer can be obtained, which is more preferable.

衍生自(A2)之構成單元:15~85莫耳%衍生自(A4)之構成單元:15~85莫耳%Component unit derived from (A2): 15~85 mol% derived from (A4) constituent unit: 15~85 mol%

其次,於前述之共聚合物1中加成(A3)而於黏結劑樹脂(A)賦予光硬化性或熱硬化性。Next, it is added to the above-mentioned copolymer 1 (A3) to impart photocurability or thermosetting property to the binder resin (A).

共聚合物1與(A3)之反應可舉例如以記載於特開2001-89533號公報之條件下實施。具體上使燒瓶內環境從氮氣取代成空氣,於燒瓶內,相對於前述共聚合物1之(A4)所衍生之構成單元就莫耳分率,置入5~100莫耳%之(A3);就羧基與環氧基之反應觸媒而言,可舉例如使三雙甲基胺基甲基酚相對於(A2)~(A4)之合計就質量基準置入0.01~5%;及,就聚合抑制劑而言,可舉例如使氫醌相對於(A2)~(A4)之合計量就質量基準置入0.001~5%,在60~130℃下,反應1~10小時,俾使前述之共聚合物1與(A3)反應而得到共聚合物2。又,考量製造設備或聚合之發熱量等,亦可適當調整饋入方去或反應溫度。The reaction of the copolymer 1 and (A3) can be carried out, for example, under the conditions described in JP-A-2001-89533. Specifically, the atmosphere in the flask is replaced with nitrogen from air, and in the flask, the molar fraction of the constituent unit derived from (A4) of the above-mentioned copolymer 1 is set to 5 to 100 mol% (A3). In the case of a reaction catalyst of a carboxyl group and an epoxy group, for example, tris-methylaminomethylphenol is placed in a mass ratio of 0.01 to 5% with respect to the total of (A2) to (A4); In the polymerization inhibitor, for example, hydroquinone is placed in a total amount of 0.001 to 5% based on the total amount of (A2) to (A4), and reacted at 60 to 130 ° C for 1 to 10 hours. The aforementioned copolymer 1 is reacted with (A3) to obtain a copolymer 2. Moreover, the heat of the manufacturing equipment or the heat of polymerization may be considered, and the feed-in or reaction temperature may be appropriately adjusted.

(A3)之添加量係相對於使(A2)及(A4)共聚合所得到之樹脂中的環氧基(源自(A4)成分),一般為5~100莫耳%,宜為10~95莫耳%。The amount of (A3) added is usually from 5 to 100 mol%, preferably from 10 to 100%, based on the epoxy group (from (A4) component) in the resin obtained by copolymerizing (A2) and (A4). 95% by mole.

若(A4)之組成比在上述範圍內,可得到充分之光硬化性或熱硬化性,信賴性優,故佳。When the composition ratio of (A4) is within the above range, sufficient photocurability or thermosetting property can be obtained, and the reliability is excellent, which is preferable.

最後,使前述共聚合物2與(A5)反應而對黏結劑樹脂(A)賦予鹼溶解性。Finally, the copolymer 2 is reacted with (A5) to impart alkali solubility to the binder resin (A).

共聚合物2與(A5)之反應可舉例如以記載於特開2001-89533號公報之條件下實施。具體上於燒瓶內,相對於前述共聚合物2之(A3)所衍生之構成單元就莫耳分率,置入5~100莫耳%之(A5);就反應觸媒而言,可舉例如使三乙基胺相對於(A2)~(A4)之合計就質量基準置入0.01~5%,在60~130℃之溫度範圍下,反應1~10小時,俾使前述之共聚合物2與(A5)反應。又,考量製造設備或聚合之發熱量等,亦可適當調整饋入方去或反應溫度。The reaction of the copolymer 2 and (A5) can be carried out, for example, under the conditions described in JP-A-2001-89533. Specifically, in the flask, 5 to 100 mol% (A5) is placed in relation to the constituent unit derived from (A3) of the above-mentioned copolymer 2, and in the case of the reaction catalyst, for example, For example, the triethylamine is placed in a mass ratio of 0.01 to 5% with respect to the total of (A2) to (A4), and the reaction is carried out for 1 to 10 hours at a temperature of 60 to 130 ° C to cause the aforementioned copolymer. 2 reacts with (A5). Moreover, the heat of the manufacturing equipment or the heat of polymerization may be considered, and the feed-in or reaction temperature may be appropriately adjusted.

(A5)之添加量係相對於使共聚合物2之醇性羥基的莫耳數(源自(A3)成分),一般為5~100莫耳%,宜為10~95莫耳%。The amount of addition of (A5) is usually from 5 to 100 mol%, preferably from 10 to 95 mol%, based on the number of moles of the alcoholic hydroxyl group of the copolymer 2 (derived from the (A3) component).

更具體地黏結劑樹脂(A)宜至少一種的共聚合物選自由構成單元(U1)、(U2)及(U3)所構成的共聚合物(U1-2-3)以及構成單元(U1)、(U2)及(U4)所構成的共聚合物(U1-2-4)所構成之群。More specifically, the binder resin (A) is preferably at least one copolymer selected from the group consisting of the constituent units (U1), (U2) and (U3), and the constituent unit (U1). A group of copolymers (U1-2-4) composed of (U2) and (U4).

此處,構成單元(U1)係表示至少一種之構成單元選自由構成單元(U1-1)及構成單元(U1-2)所構成之群。Here, the constituent unit (U1) indicates that at least one of the constituent units is selected from the group consisting of the constituent unit (U1-1) and the constituent unit (U1-2).

R1 分別獨立地表示氫原子、甲基、或羥甲基之任一者。R 1 each independently represents either a hydrogen atom, a methyl group, or a hydroxymethyl group.

R2 係表示亦可被R5 基取代之苯基、-COOH、或-C(=O)O-R5 基。R 2 R 5 are diagrams may also be substituted with the phenyl group, -COOH, or -C (= O) OR 5 group.

R3 表示氧原子、硫原子、-NH-、或-N(R5 )-基。R 3 represents an oxygen atom, a sulfur atom, -NH-, or -N(R 5 )- group.

R4 表示下述之2價基。R 4 represents a divalent group described below.

-CH2 .CH2 -, -CH 2 . CH 2 -,

此處,R5 表示甲基、乙基、丙基、丁基、戊基、己基、環己基、苯基、苯甲基、萘基、金剛烷基、異冰片基、二環戊烷基、二環戊烯基、二環戊烯基氧乙基、二環戊烯基氧乙基、或氫氧基之任一者。Here, R 5 represents methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, phenyl, benzyl, naphthyl, adamantyl, isobornyl, dicyclopentanyl, Any one of a dicyclopentenyl group, a dicyclopentenyloxyethyl group, a dicyclopentenyloxyethyl group, or a hydroxyl group.

黏結劑樹脂(A)之聚苯乙烯換算的重量平均分子量宜為3000~100000,更宜為5000~30000。黏結劑樹脂(A)之重量平均分子量若在前述之範圍,塗布性良好,顯像時很難造成膜減少,進一步有顯像時未曝光部分之脫去性良好之傾向,故佳。The polystyrene-equivalent weight average molecular weight of the binder resin (A) is preferably from 3,000 to 100,000, more preferably from 5,000 to 30,000. When the weight average molecular weight of the binder resin (A) is within the above range, the coating property is good, and it is difficult to cause a film to be reduced during development, and further, the release property of the unexposed portion tends to be good at the time of development, which is preferable.

黏結劑樹脂(A)之分子量分布[重量平均分子量(Mw)/數目平均分子量(Mn)]宜為1.5~6.0,更宜為1.8~4.0。分子量分布若在前述之範圍,顯像性優,故佳。The molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (Mn)] of the binder resin (A) is preferably from 1.5 to 6.0, more preferably from 1.8 to 4.0. If the molecular weight distribution is in the above range, the image forming property is excellent, which is preferable.

在本發明之光間隔物用感光性樹脂組成物所使用的黏結劑樹脂(A)之含量,相對於光間隔物用感光性樹脂組成物之固形分,質量分率宜為5~90質量%,更宜為10~70質量%。黏結劑樹脂(A)之含量,若在前述之範圍,對顯像液之溶解性充分,於未曝光部分之基板上很難產生顯像殘渣,又,有顯像時曝光部之像素部分很難造成膜減少,未曝光部分之脫去性良好之傾向,故佳。The content of the binder resin (A) used in the photosensitive resin composition for a photo spacer of the present invention is preferably 5 to 90% by mass based on the solid content of the photosensitive resin composition for the photo spacer. More preferably, it is 10 to 70% by mass. When the content of the binder resin (A) is within the above range, the solubility in the developing solution is sufficient, and it is difficult to generate a developing residue on the unexposed portion of the substrate, and the pixel portion of the exposed portion is large in development. It is difficult to cause a film to be reduced, and the unexposed portion has a good tendency to be removed, which is preferable.

本發明之光間隔物用感光性樹脂組成物所使用之光聚合性化合物(B)係含有以式(I)所示之化合物,或以式(I)所示之化合物。The photopolymerizable compound (B) used for the photosensitive resin composition for a photo spacer of the present invention contains a compound represented by the formula (I) or a compound represented by the formula (I).

[式(I)中,R1 ~R6 係分別獨立地表示氫原子或下述式(I-1)~(I-3)的任一者之基,R1 ~R6 之至少4個的基為(I-1)~(I-3)的任一者之基,R1 ~R6 之至少一個的基為(I-2)或(I-3)] In the formula (I), R 1 to R 6 each independently represent a hydrogen atom or a group of any one of the following formulas (I-1) to (I-3), and at least 4 of R 1 to R 6 The base of any of (I-1) to (I-3), the base of at least one of R 1 to R 6 is (I-2) or (I-3)]

以式(I)所示之化合物可舉例如使二季戊四醇進行已內酯改性之多官能丙烯酸酯化合物。具體上,可舉例如日本化藥(股)製KAYARAD DPCA-60(商品名)、KAYARAD DPCA-120(商品名)等之市售者。The compound represented by the formula (I) may, for example, be a polyfunctional acrylate compound in which dipentaerythritol is subjected to lactone modification. Specifically, for example, KAYARAD DPCA-60 (trade name) manufactured by Nippon Kayaku Co., Ltd., and KAYARAD DPCA-120 (trade name) may be used.

在本發明之組成物中,若為無損本發明之效果的範圍,亦可含有本發明之黏結劑樹脂(A)、光聚合性化合物(B)以外之聚合性化合物,該化合物係可併用單官能單體之外,2官能單體、3官能以上之多官能單體(但,除了以式(I)所示之化合物)。In the composition of the present invention, a polymerizable compound other than the binder resin (A) and the photopolymerizable compound (B) of the present invention may be contained in the composition of the present invention, and the compound may be used in combination. In addition to the functional monomer, a bifunctional monomer or a trifunctional or higher polyfunctional monomer (except for the compound represented by the formula (I)).

單官能單體之具體例可舉例如壬基苯基卡必醇丙烯酸酯、2-羥基-3-苯氧基丙烯酸酯、2-乙基己基卡必醇丙烯酸酯、2-羥基乙基丙烯酸酯、N-乙烯基吡咯烷酮等。Specific examples of the monofunctional monomer include mercaptophenylcarbitol acrylate, 2-hydroxy-3-phenoxy acrylate, 2-ethylhexyl carbitol acrylate, and 2-hydroxyethyl acrylate. , N-vinyl pyrrolidone, and the like.

2官能單體之具體例可舉例如1,6-己二醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、雙酚A之雙(丙烯醯氧乙基)醚、3-甲基戊二醇二(甲基)丙烯酸酯等。Specific examples of the bifunctional monomer include, for example, 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, and triethyl ethane. Diol (meth) acrylate, bis (acryloyloxyethyl) ether of bisphenol A, 3-methyl pentanediol di (meth) acrylate, and the like.

3官能以上之多官能單體的具體例可舉例如三羥甲基丙烷三(甲基)丙烯酸酯、五季戊四醇三(甲基)丙烯酸酯、五季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、五季戊四醇三(甲基)丙烯酸酯與酸酐之反應物、二季戊四醇五(甲基)丙烯酸酯與酸酐之反應物等。Specific examples of the trifunctional or higher polyfunctional monomer include, for example, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol-5. A reaction product of (meth) acrylate, dipentaerythritol hexa(meth) acrylate, pentaerythritol tri(meth) acrylate and an acid anhydride, dipentaerythritol penta (meth) acrylate and an acid anhydride, and the like.

此等之中,宜使用3官能以上之多官能單體。Among these, a trifunctional or higher polyfunctional monomer is preferably used.

光聚合性化合物(B)的含量相對於光間隔物用感光性樹脂組成物中之黏結劑樹脂(A)、光聚合性化合物(B)及光聚合起始劑(C)之合計100質量份,必須為5~60質量份,較佳係10~50質量份,更宜為20~40質量份。光聚合性化合物(B)之含量若在於前述之範圍,光間隔物之塑性變形量很大,有表面平滑性變良好的傾向,故佳。The content of the photopolymerizable compound (B) is 100 parts by mass based on the total of the binder resin (A), the photopolymerizable compound (B), and the photopolymerization initiator (C) in the photosensitive resin composition for a photo spacer. It must be 5 to 60 parts by mass, preferably 10 to 50 parts by mass, more preferably 20 to 40 parts by mass. When the content of the photopolymerizable compound (B) is within the above range, the amount of plastic deformation of the photo spacer is large, and the surface smoothness tends to be good, which is preferable.

本發明之光間隔物用感光性樹脂組成物所含有的光聚合起始劑(C)可舉例如苯乙酮系化合物、雙咪唑系化合物、肟系化合物、三嗪系化合物。又,藉由併用前述之光聚合起始劑(C)與光聚合起始助劑(C-1),感光性樹脂組成物係成為更高感度,使用此而形成圖型時之生產性會提高,故佳。但,光聚合起始助劑(C-1)之吸收波長位於較光聚合起始劑(C)之吸收波長更長波長側時,所形成之膜的透過率變低,故宜在無損本發明效果之程度使用。The photopolymerization initiator (C) contained in the photosensitive resin composition for a photo spacer of the present invention may, for example, be an acetophenone compound, a bisimidazole compound, an anthraquinone compound or a triazine compound. In addition, by using the photopolymerization initiator (C) and the photopolymerization initiation aid (C-1) in combination, the photosensitive resin composition has a higher sensitivity, and the productivity when forming a pattern is used. Improve, so good. However, when the absorption wavelength of the photopolymerization initiation aid (C-1) is on the longer wavelength side than the absorption wavelength of the photopolymerization initiator (C), the transmittance of the formed film becomes lower, so it is preferable to avoid the loss. The degree of the effect of the invention is used.

前述之苯乙酮系化合物可舉例如二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、苯甲基二甲基縮酮、2-羥基-1-[4-(2-羥乙氧基)苯基]-2-甲基丙烷-1-酮、1-羥基環己基苯基酮、2-甲基-1-(4-甲基硫苯基)-2-嗎啉基丙烷-1-酮、2-苯甲基-2-二甲基胺基-1-(4-嗎啉基苯基)丁烷-1-酮、苯乙酮系具體上可舉例如2-(2-甲基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(3-甲基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(4-甲基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2-乙基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2-丙基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2-丁基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2,3-二甲基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2,4-二甲基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2-氯苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2-溴苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(3-氯苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(4-氯苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(3-溴苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(4-溴苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2-甲氧基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、、2-(3-甲氧基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(4-甲氧基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2-甲基-4-甲氧基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2-甲基-4-溴苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2-溴-4-甲氧基苯甲基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-羥基-2-甲基-1-[4-(1-甲基乙烯基)苯基]丙烷-1-酮之寡聚物等。The aforementioned acetophenone-based compound may, for example, be diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, or 2-hydroxy- 1-[4-(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylthiobenzene) 2-morpholinylpropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)butan-1-one, acetophenone Specific examples thereof include 2-(2-methylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone and 2-(3-methylbenzylmethyl). -2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(4-methylbenzyl)-2-dimethylamino-1-(4- Morpholinylphenyl)-butanone, 2-(2-ethylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2- Propylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-butylbenzyl)-2-dimethylamino- 1-(4-morpholinylphenyl)-butanone, 2-(2,3-dimethylbenzyl) 2-Dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2,4-dimethylbenzyl)-2-dimethylamino-1-(4) -morpholinylphenyl)-butanone, 2-(2-chlorobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2- Bromobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(3-chlorobenzyl)-2-dimethylamino-1- (4-morpholinylphenyl)-butanone, 2-(4-chlorobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-( 3-bromobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(4-bromobenzyl)-2-dimethylamino- 1-(4-morpholinylphenyl)-butanone, 2-(2-methoxybenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone , 2-(3-methoxybenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(4-methoxybenzyl) -2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-methyl-4-methoxybenzyl)-2-dimethylamino- 1-( 4-morpholinylphenyl)-butanone, 2-(2-methyl-4-bromobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone , 2-(2-bromo-4-methoxybenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-hydroxy-2-methyl- An oligomer of 1-[4-(1-methylvinyl)phenyl]propan-1-one or the like.

前述之雙咪唑系化合物可舉例如2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基雙咪唑、2,2'-雙(2,3-二氯苯基)-4,4',5,5'-四苯基雙咪唑(例如參照特開平6-75372號公報、特開平6-75373號公報等)、2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基雙咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(烷氧基苯基)雙咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(二烷氧基苯基)雙咪唑、2,2'-雙(2-氯苯基)-4,4',5,5'-四(三烷氧基苯基)雙咪唑(例如參照特開平48-38403號公報、特開平62-174204號公報等)、4,4',5,5'-位之苯基被羰烷氧基取代之咪唑化合物(例如參照特開平7-10913號公報等)等,較佳係可舉例如2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基雙咪唑、2,2'-雙(2,3-二氯苯基)-4,4',5,5'-四苯基雙咪唑。The aforementioned biimidazole-based compound may, for example, be 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole, 2,2'-bis (2,3- Dichlorophenyl)-4,4',5,5'-tetraphenylbisimidazole (for example, JP-A-6-75372, JP-A-6-75373, etc.), 2, 2'-double (2) -Chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetra(alkoxy) Biphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(dialkoxyphenyl)bisimidazole, 2,2'-bis ( 2-chlorophenyl)-4,4',5,5'-tetrakis(trialkoxyphenyl)bisimidazole (for example, JP-A-48-38403, JP-A-62-174204, etc.), 4 The imidazole compound in which the phenyl group at the 4', 5, and 5'-position is substituted with a carbonyl alkoxy group (for example, see JP-A-7-10913, etc.), etc., preferably, for example, 2,2'-bis (2) -Chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-four Phenyl diimidazole.

前述之肟系化合物可舉例如O-乙氧基羰基-α -氧亞胺基-1-苯基丙烷-1-酮、以式(a)所表示之化合物、以式(b)所取代之化合物等。The above-mentioned oxime-based compound may, for example, be O-ethoxycarbonyl- α -oxyimino-1-phenylpropan-1-one, a compound represented by the formula (a), and substituted by the formula (b). Compounds, etc.

前述之三嗪系化合物可舉例如2,4-雙(三氯甲基)-6-(4-甲氧基苯基)-1,3,5-三嗪、2,4-雙(三氯甲基)-6-(4-甲氧基萘基)-1,3,5-三嗪、2,4-雙(三氯甲基)-6-胡椒基-1,3,5-三嗪、2,4-雙(三氯甲基)-6-(4-甲氧基苯乙烯基)-1,3,5-三嗪、2,4-雙(三氯甲基)-6-(2-(5-甲基呋喃-2-基)乙炔基)-1,3,5-三嗪、2,4-雙(三氯甲基)-6-(2-(呋喃-2-基)乙烯基)-1,3,5-三嗪、2,4-雙(三氯甲基)-6-(2-(4-二乙基胺基-2-甲基苯基)乙烯基)-1,3,5-三嗪、2,4-雙(三氯甲基)-6-[2-(3,4-二甲氧基苯基)乙烯基]-1,3,5-三嗪等。The aforementioned triazine-based compound may, for example, be 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine or 2,4-bis(trichloro). Methyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperidin-1,3,5-triazine , 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-( 2-(5-methylfuran-2-yl)ethynyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(2-(furan-2-yl) Vinyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(2-(4-diethylamino-2-methylphenyl)vinyl)- 1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine Wait.

又,若為無損本發明之效果的程度,可進一步併用在此領域一般所使用之光聚合起始劑等,可舉例如苯偶因系化合物、苯乙酮系化合物、硫雜蒽酮系化合物、蒽系化合物等之光聚合起始劑。In addition, as long as the effect of the present invention is not impaired, a photopolymerization initiator or the like which is generally used in the field can be used in combination, and examples thereof include a benzoin-based compound, an acetophenone-based compound, and a thioxanthone-based compound. A photopolymerization initiator such as a lanthanide compound.

更具體地係可舉例如以下之化合物,此等係可分別單獨,亦可組合2種以上而使用。More specifically, for example, the following compounds may be used, and these may be used alone or in combination of two or more.

前述之苯偶因系化合物可舉例如苯偶因、苯偶因甲基醚、苯偶因乙基醚、苯偶因異丙基醚、苯偶因異丁基醚等。The benzoin-based compound may, for example, be benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether or benzoin isobutyl ether.

前述之苯乙酮系化合物可舉例如苯乙酮、鄰苯甲醯基安息香酸甲酯、4-苯基苯乙酮、4-苯甲醯基-4'-甲基二苯基硫醚、3,3',4,4'-四(第三丁基過氧化羰基)苯乙酮、2,4,6-三甲基苯乙酮等。The acetophenone-based compound may, for example, be acetophenone, methyl ortho-benzoyl benzoate, 4-phenylacetophenone or 4-benzylidene-4'-methyldiphenyl sulfide. 3,3',4,4'-tetra(t-butylperoxycarbonyl)acetophenone, 2,4,6-trimethylacetophenone, and the like.

前述硫雜蒽酮系化合物可舉例如2-異丙基硫雜蒽酮、4-異丙基硫雜蒽酮、2,4-二乙基硫雜蒽酮、2,4-二氯硫雜蒽酮、1-氯-4-丙氧基硫雜蒽酮等。Examples of the thioxanthone-based compound include 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthiaxanone, and 2,4-dichlorothiazepine. Anthrone, 1-chloro-4-propoxythioxanthone, and the like.

前述之蒽系化合物可舉例如9,10-二甲氧基蒽、2-乙基-9,10-二甲氧基蒽、9,10-二乙氧基基蒽、2-乙基-9,10-二乙氧基蒽等。The aforementioned lanthanoid compound may, for example, be 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxy fluorene, 2-ethyl-9. , 10-diethoxyanthracene, and the like.

其他亦可併用2,4,6-三甲基苯甲醯基二苯基氧化膦、10-丁基-2-氯茚酮、2-乙基蒽醌、苯甲基、9,10-菲醌、樟腦醌、苯基乙醛酸甲酯、二茂鈦化合物等之光聚合起始劑。Others may also be used in combination with 2,4,6-trimethylbenzimidyldiphenylphosphine oxide, 10-butyl-2-chloroindanone, 2-ethylhydrazine, benzyl, 9,10-phenanthrene A photopolymerization initiator such as ruthenium, camphorquinone, methyl phenylglyoxylate or a titanocene compound.

又,具有引起鏈移動之基的光聚合起始劑可併用特表2002-544205號公報所記載者。Further, the photopolymerization initiator having a group which causes chain shift can be used in combination with the one described in JP-A-2002-544205.

具有引起前述鏈移動之基的光聚合起始劑可舉例如以下述式(2)~(7)所示之化合物。The photopolymerization initiator having a group which causes the chain shift is exemplified by the compounds represented by the following formulas (2) to (7).

具有引起前述鏈移動之基的光聚合起始劑係可使用來作為共聚合物1之構成成分(A2)。繼而,使用(A2)所得到之黏結劑樹脂(A)係可併用於本發明之黏結劑樹脂。A photopolymerization initiator having a group which causes the aforementioned chain shift can be used as a constituent component (A2) of the copolymer 1. Then, the binder resin (A) obtained by using (A2) can be used in the binder resin of the present invention.

又,亦可於光聚合起始劑組合光聚合起始助劑(C-1)而使用。光聚合起始助劑宜為胺化合物及下述之羧酸化合物,胺化合物更宜為芳香族胺化合物。但,光聚合起始助劑(C-1)之吸收波長位於較光聚合起始劑(C)之吸收波長更長波長側時,所形成之膜的透過率變低,故宜在無損本發明之效果的程度使用。Further, the photopolymerization initiator may be used in combination with a photopolymerization initiation aid (C-1). The photopolymerization initiation aid is preferably an amine compound and a carboxylic acid compound described below, and the amine compound is more preferably an aromatic amine compound. However, when the absorption wavelength of the photopolymerization initiation aid (C-1) is on the longer wavelength side than the absorption wavelength of the photopolymerization initiator (C), the transmittance of the formed film becomes lower, so it is preferable to avoid the loss. The degree of the effect of the invention is used.

光聚合起始助劑之具體例可舉例如三乙醇胺、甲基二乙醇胺、三異丙醇胺等之脂肪族胺化合物、4-二甲基胺基安息香酸甲酯、4-二甲基胺基安息香酸乙酯、4-二甲基胺基安息香酸異戊酯、4-二甲基胺基安息香酸2-乙基己酯、安息香酸2-二甲基胺基乙酯、N,N-二甲基對甲苯胺、4,4'-雙(二甲基胺基)苯乙酮(通稱:米氏酮(Micheler's ketone))、4,4'-雙(二甲基胺基)苯乙酮之芳香族胺化合物等。Specific examples of the photopolymerization initiation aid include aliphatic amine compounds such as triethanolamine, methyldiethanolamine, and triisopropanolamine, methyl 4-dimethylaminobenzoate, and 4-dimethylamine. Ethyl chlorate, isoamyl 4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, N, N - dimethyl-p-toluidine, 4,4'-bis(dimethylamino)acetophenone (general name: Micheler's ketone), 4,4'-bis(dimethylamino)benzene An aromatic amine compound of ethyl ketone or the like.

前述之羧酸化合物可舉例如苯基硫醋酸、甲基苯基硫醋酸、乙基苯基硫醋酸、甲乙基苯基硫醋酸、二甲基苯基硫醋酸、甲氧基苯基硫醋酸、二甲氧基苯基硫醋酸、氯苯基硫醋酸、二氯苯基硫醋酸、N-苯基甘氨酸、苯氧基醋酸、萘基硫醋酸、N萘基甘氨酸、萘氧基醋酸等之芳香族雜醋酸類等。Examples of the carboxylic acid compound include phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylsulfuric acid, dimethylphenylsulfuric acid, and methoxyphenylthioacetic acid. Aroma of dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N-phenylglycine, phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, naphthyloxyacetic acid, etc. Family of acetic acid and the like.

光聚合起始劑(C)之含量相對於相對於黏結劑樹脂(A)及光聚合性化合物(B)之合計100質量份宜為0.1~40質量份,更宜為1~30質量份。The content of the photopolymerization initiator (C) is preferably 0.1 to 40 parts by mass, more preferably 1 to 30 parts by mass, per 100 parts by mass of the total of the binder resin (A) and the photopolymerizable compound (B).

使用光聚合起始助劑(C-1)時,其含量以前述之基準,宜為0.1~50質量份,更宜為0.1~40質量份。When the photopolymerization initiation aid (C-1) is used, the content thereof is preferably from 0.1 to 50 parts by mass, more preferably from 0.1 to 40 parts by mass, based on the above-mentioned basis.

若光聚合起始劑(C)之含量在於前述的範圍,光間隔物用感光性樹脂組成物成為高感度,使用前述之光間隔物形成用感光性樹脂組成物所形成的光間隔物表面之平滑性有變良好的傾向,故佳。除前述外,尚且若光聚合起始助劑(C-1)之量位於前述之範圍,所得到之光間隔物形成用感光性樹脂組成物之感度變更高,使用前述之光間隔物用感光性樹脂組成物所形成之圖型基板的生產性有提高之傾向,故佳。When the content of the photopolymerization initiator (C) is in the above range, the photosensitive resin composition for a photo spacer has high sensitivity, and the surface of the photo spacer formed by using the photoreceptor forming photosensitive resin composition described above is used. The smoothness tends to be good, so it is good. In addition to the above, if the amount of the photopolymerization initiation aid (C-1) is within the above range, the sensitivity of the photosensitive resin composition for forming a photo spacer obtained is changed to be high, and the photo spacer for use is used. The productivity of the pattern substrate formed of the resin composition tends to be improved, which is preferable.

本發明之光間隔物用感光性樹脂組成物所含有的溶劑(D)可舉例如在感光性樹脂組成物之領域所使用的各種有機溶劑。The solvent (D) to be contained in the photosensitive resin composition for a photo-spacer of the present invention is, for example, various organic solvents used in the field of the photosensitive resin composition.

其具體例可舉例如乙二醇單甲基醚、乙二醇單乙基醚、乙二醇單丙基醚及乙二醇單丁基醚等之乙二醇單烷基醚類;二乙二醇二甲基醚、二乙二醇二乙基醚、二乙二醇二丙基醚及二乙二醇二丁基醚等之二乙二醇二烷基醚類;甲基溶纖劑乙酸酯及乙基溶纖劑乙酸酯等之乙二醇烷基醚乙酸酯類;丙二醇單甲基醚乙酸酯、丙二醇單乙基醚乙酸酯、丙二醇單丙基醚乙酸酯、甲氧基丁基乙酸酯及甲氧基戊基乙酸酯等之伸烷基甘醇烷基醚乙酸酯類;如苯、甲苯、二甲苯及三甲苯之芳香族烴類;甲乙酮、丙酮、甲基戊基酮、甲基異丁基酮及環己酮等之酮類;乙醇、丙醇、丁醇、己醇、環己醇、乙二醇及甘油等之醇類;3-乙氧基丙酸乙酯及3-甲氧基丙酸甲酯等之酯類;γ-丁內酯等之環狀酯纇等。Specific examples thereof include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; Diethylene glycol dialkyl ethers such as diol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether and diethylene glycol dibutyl ether; methyl cellosolve Ethylene glycol alkyl ether acetates such as acetate and ethyl cellosolve acetate; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate Alkyl glycol alkyl ether acetates such as methoxybutyl acetate and methoxypentyl acetate; aromatic hydrocarbons such as benzene, toluene, xylene and trimethylbenzene; methyl ethyl ketone, Ketones such as acetone, methyl amyl ketone, methyl isobutyl ketone and cyclohexanone; alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol and glycerin; An ester of ethyl ethoxypropionate or methyl 3-methoxypropionate; a cyclic ester of γ-butyrolactone or the like.

上述之溶劑中,就塗佈性、乾燥性而言,較佳係在上述溶劑之中使用沸點為100~200℃之有機溶劑,更佳係可使用如伸烷基甘醇烷基醚乙酸酯類、酮類、3-乙氧基丙酸乙酯及3-甲氧基丙酸甲酯之酯類,更宜使用丙二醇單甲基醚乙酸酯、丙二醇單乙基醚乙酸酯、環己酮、3-乙氧基丙酸乙酯、3-甲氧基丙酸甲酯。Among the above-mentioned solvents, in terms of coatability and drying property, an organic solvent having a boiling point of 100 to 200 ° C is preferably used among the above solvents, and more preferably an alkyl glycol glycol alkyl ether acetate can be used. Esters, ketones, ethyl 3-ethoxypropionate and methyl 3-methoxypropionate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ring Hexanone, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate.

此等之溶劑(D)可分別單獨,亦可混合2種以上而使用。These solvents (D) may be used alone or in combination of two or more.

本發明之光間隔物用感光性樹脂組成物中之溶劑(D)的含量係相對於光間隔物形成用感光性樹脂組成物,就質量分率宜為60~95質量%,更宜為70~90質量%。溶劑(D)之含量若在於前述之範圍,以旋塗器、狹縫式及旋塗器、狹縫式塗佈器(有時亦被稱為模頭式塗佈器、簾幕流動式塗佈器)、噴墨等之塗佈裝置進行塗佈時,有塗佈性變良好之傾向,故佳。The content of the solvent (D) in the photosensitive resin composition for a photo-spacer of the present invention is preferably 60 to 95% by mass, and more preferably 70, based on the photosensitive resin composition for forming a photo spacer. ~90% by mass. If the content of the solvent (D) is in the above range, spin coater, slit type and spin coater, slit coater (sometimes referred to as die coater, curtain flow coating) When the coating device such as a cloth or an inkjet is applied, the coating property tends to be good, which is preferable.

在本發明之光間隔物用感光性樹脂組成物中依需要亦可併用填充劑、其他之高分子化合物、界面活性劑、密著促進劑、抗氧化劑、紫外線吸收劑、凝集劑、鏈移動劑等之其他的化合物((E)成分)。In the photosensitive resin composition for a photo spacer of the present invention, a filler, other polymer compound, a surfactant, an adhesion promoter, an antioxidant, an ultraviolet absorber, a coagulant, and a chain shifting agent may be used in combination as needed. Other compounds ((E) component).

填充劑可舉例如玻璃、矽石、氧化鋁等。The filler may, for example, be glass, vermiculite, alumina or the like.

其他之高分子化合物可例示環氧樹脂(市售品係可得自三井化學(股)Tecmoa VG 3101L(商品名)、住友化學(股)製Sumi Epoxy系列(商品名)、Japan epoxy樹脂(股)製Epikote系列(商品名)等)、馬來醯亞胺樹脂等之硬化性樹脂或聚乙烯醇、聚丙烯酸、聚乙二醇單烷基醚、聚氟烷基丙烯酸酯、聚酯、聚胺基甲酸脂等之熱塑性樹脂等。Other polymer compounds are exemplified by epoxy resins (commercially available from Mitsui Chemicals Co., Ltd.) Tecmoa VG 3101L (trade name), Sumitomo Chemical Co., Ltd. Sumi Epoxy series (trade name), Japan epoxy resin (shares) ) Epikote series (trade name), etc., curable resin such as maleic imine resin or polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, poly A thermoplastic resin such as urethane or the like.

界面活性劑係可使用市售之界面活性劑,可舉例如聚矽氧系、氟系、酯系、陽離子系、陰離子系、非離子系、兩性等之界面活性劑等,可分別單獨使用,亦可組合2種以上而使用。前述之界面活性劑之例可舉例如聚氧乙烯烷基醚類、聚氧乙烯烷基苯基醚類、聚乙二醇二酯類、山梨糖醇酐脂肪酸酯類、脂肪酸改性聚酯類、三級胺改性聚氨基甲酸酯類、聚乙烯亞胺類等之外,就商品名為KP(信越化學工業(股)製)、Polyfolw(共榮化學(股)製)、EFTOP(Tohkem Products公司製)、Megaface(大日本油墨化學工業(股)製)、Fluorid(住友3M(股)製)、Asahi Guard、saflow(以上,旭硝子(股)製)、Solsperse(Zeneca公司製)、EFKA(EFKA CHEMICALS公司製)、PB821(味之素(股)製)等。As the surfactant, a commercially available surfactant can be used, and examples thereof include a surfactant such as a polyfluorene-based, a fluorine-based, an ester-based, a cationic-based, an anionic-based, nonionic-based or amphoteric surfactant, and these can be used alone. Two or more types may be used in combination. Examples of the above-mentioned surfactants include polyoxyethylene alkyl ethers, polyoxyethylene alkylphenyl ethers, polyethylene glycol diesters, sorbitan fatty acid esters, and fatty acid-modified polyesters. In addition to the tertiary amine-modified polyurethanes and polyethyleneimine, the trade name is KP (Shin-Etsu Chemical Co., Ltd.), Polyfolw (Kyoei Chemical Co., Ltd.), EFTOP (Tohkem). Products, Ltd., Megaface (Daily Ink Chemical Industry Co., Ltd.), Fluorid (Sumitomo 3M (share) system), Asahi Guard, saflow (above, Asahi Glass Co., Ltd.), Solsperse (made by Zeneca), EFKA (made by EFKA CHEMICALS), PB821 (made by Ajinomoto Co., Ltd.), etc.

密著促進劑具體上可舉例如乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、乙烯基三(2-甲氧基乙氧基)矽烷、N-(2-胺乙基)-3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、3-環氧丙烷基丙基三甲氧基矽烷、3-環氧丙烷基丙基甲基二甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、3-氯丙基甲基二甲氧基矽烷、3-氯丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-氫硫基丙基三甲氧基矽烷等。Specific examples of the adhesion promoter include vinyl trimethoxy decane, vinyl triethoxy decane, vinyl tris(2-methoxyethoxy) decane, and N-(2-aminoethyl)-3. -Aminopropyltrimethoxydecane, 3-aminopropyltriethoxydecane, 3-epoxypropanepropyltrimethoxydecane, 3-epoxypropanepropylmethyldimethoxydecane , 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, 3-chloropropylmethyldimethoxydecane, 3-chloropropyltrimethoxydecane, 3-methylpropene oxime Oxypropyltrimethoxydecane, 3-hydrothiopropyltrimethoxydecane, and the like.

抗氧化劑具體上可舉例如2,2'-硫雙(4-甲基-6-第三丁基酚)、2,6-二第三丁基-4-甲基酚等。Specific examples of the antioxidant include 2,2'-thiobis(4-methyl-6-tert-butylphenol) and 2,6-di-t-butyl-4-methylphenol.

紫外線吸收劑具體上可舉例如2-(3-第三丁基-2-羥基-5-甲基苯基)-5-氯苯並三唑、烷氧基苯乙酮。Specific examples of the ultraviolet absorber include 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chlorobenzotriazole and alkoxyacetophenone.

又,凝集劑具體上可舉例如聚丙烯酸鈉等。Further, the aggregating agent may specifically be, for example, sodium polyacrylate or the like.

鏈移動劑可舉例如十二碳烷基硫醇、2,4-二苯基-4-甲基-1-戊烯等。The chain shifting agent may, for example, be a dodecyl mercaptan or 2,4-diphenyl-4-methyl-1-pentene.

本發明之光間隔物用感光性樹脂組成物係藉由以任意之順序混合前述(A)~(D)的各成分、依需要之(E)成分等之方法,可容易進行調整。The photosensitive resin composition for a photo-spacer of the present invention can be easily adjusted by mixing the components (A) to (D) and the component (E) as needed in an arbitrary order.

光間隔物用感光性樹脂組成物係例如以下般做法而塗佈於基材上,進行光硬化及顯像,而可形成圖型。首先,將此組成物塗佈於基板(一般係玻璃或薄膜)或由先前所形成之另一感光性樹脂組成物的固形分所構成的層上而形成感光性樹脂組成物層。塗布係可使用旋塗器、狹縫示塗佈器、簾式流動塗佈器、桿式塗佈器等公知的裝置而實施。The photoreceptor photosensitive resin composition is applied to a substrate by, for example, the following method, and photohardening and development are carried out to form a pattern. First, the composition is applied onto a substrate (generally a glass or a film) or a layer composed of a solid component of another photosensitive resin composition previously formed to form a photosensitive resin composition layer. The coating system can be carried out using a known device such as a spin coater, a slit coater, a curtain flow coater, or a rod coater.

塗佈、所形成之感光性樹脂組成物層係藉由預烘烤以除去溶劑等之揮發成分,形成平滑的塗膜而得到。此時之塗膜的厚度一般為1~6μ m左右。對如此做法所得到之塗膜,介由一用以形成目的之圖型的光罩而照射紫外線。此時,對曝光部全體均一地照射平行光線,且為對準玻璃與基板之正確位置,宜使用光罩對準器或步進器等之裝置。進一步此後,使硬化終了之塗膜接觸於鹼水溶液而溶解非曝光部,進行顯像,俾得到目的之圖型形狀。顯像方法亦可採用盛液法、浸漬法、噴塗法等之任一方法。進一步,顯像時亦可使基板傾斜或成適當的角度。顯像後,進行水洗,進一步依需要而於150~230℃之溫度範圍保持10~60分鐘實施後烘烤。The coating and the formed photosensitive resin composition layer are obtained by prebaking to remove volatile components such as a solvent to form a smooth coating film. The thickness of the coating film at this time is generally about 1 to 6 μm . The coating film thus obtained is irradiated with ultraviolet rays through a mask for forming a pattern of interest. In this case, the entire exposed portion is uniformly irradiated with parallel rays, and it is preferable to use a device such as a mask aligner or a stepper for aligning the correct position of the glass and the substrate. After that, the coating film which has been hardened is brought into contact with the aqueous alkali solution to dissolve the non-exposed portion, and development is carried out to obtain the desired pattern shape. The development method may be any one of a liquid-filling method, a dipping method, and a spraying method. Further, the substrate can be tilted or at an appropriate angle during development. After the development, the water is washed, and further, after the need to maintain the temperature range of 150 to 230 ° C for 10 to 60 minutes to perform post-baking.

使用於圖型化曝光後之顯像的顯像液,一般係含有鹼性化合物與界面活性劑之水溶液。The developing solution used for the development after the patterning exposure is generally an aqueous solution containing a basic compound and a surfactant.

鹼性化合物係亦可為無機及有機之鹼性化合物。無機鹼性化合物之具體例可舉例如氫氧化鈉、氫氧化鉀、磷酸氫二鈉、磷酸二氫鈉、磷酸氫二銨、磷酸二氫銨、磷酸二氫鉀、矽酸鈉、矽酸鉀、碳酸鈉、碳酸鉀、碳酸氫鈉、碳酸氫鉀、硼酸鈉、硼酸鉀、氨等。The basic compound may also be an inorganic or organic basic compound. Specific examples of the inorganic basic compound include sodium hydroxide, potassium hydroxide, disodium hydrogen phosphate, sodium dihydrogen phosphate, diammonium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium citrate, and potassium citrate. , sodium carbonate, potassium carbonate, sodium hydrogencarbonate, potassium hydrogencarbonate, sodium borate, potassium borate, ammonia, and the like.

有機鹼性化合物之具體例可舉例如氫氧化四甲基銨、氫氧化2-羥乙基三甲基銨、單甲基胺、二甲基胺、三甲基胺、單乙基胺、二乙胺、三乙胺、單異丙胺、二異丙胺、乙醇胺等。此等之無機及有機之鹼性化合物係可分別單獨,亦可組合2種以上而使用。鹼顯像液中之鹼性化合物的濃度宜為0.01~10質量%,更宜為0.03~5質量%。Specific examples of the organic basic compound include tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, and Ethylamine, triethylamine, monoisopropylamine, diisopropylamine, ethanolamine, and the like. These inorganic and organic basic compounds may be used alone or in combination of two or more. The concentration of the basic compound in the alkali developing solution is preferably from 0.01 to 10% by mass, more preferably from 0.03 to 5% by mass.

鹼顯像液中之界面活性劑亦可為非離子系界面活性劑、陰離子系界面活性劑或陽離子系界面活性劑之任一者。The surfactant in the alkali developing solution may be any of a nonionic surfactant, an anionic surfactant, or a cationic surfactant.

非離子系界面活性劑之具體例可舉例如聚氧乙烯烷基醚、聚氧乙烯芳基醚、聚氧乙烯烷基芳基醚、其他之聚氧乙烯衍生物、氧乙烯/氧丙烯嵌段共聚物、山梨糖醇酐脂肪酸酯、聚氧乙烯山梨糖醇酐脂肪酸酯、聚氧乙烯山梨糖醇脂肪酸酯、甘油脂肪酸酯、、聚氧乙烯脂肪酸酯、聚氧乙烯烷基胺等。Specific examples of the nonionic surfactant include polyoxyethylene alkyl ether, polyoxyethylene aryl ether, polyoxyethylene alkyl aryl ether, other polyoxyethylene derivatives, and oxyethylene/oxypropylene blocks. Copolymer, sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, glycerin fatty acid ester, polyoxyethylene fatty acid ester, polyoxyethylene alkyl Amines, etc.

陰離子系界面活性劑可舉例如月桂基醇硫酸酯鈉或油基醇硫酸酯鈉之高級醇硫酸酯鹽類、月桂基硫酸鈉或月桂基硫酸銨之烷基硫酸鹽類、十二烷基苯磺酸鈉或十二烷基萘磺酸鈉之烷基芳基磺酸鹽類等。The anionic surfactant may, for example, be a sodium alcohol lauryl sulfate or a higher alcohol sulfate salt of sodium oleyl sulfate, an alkyl sulfate of sodium lauryl sulfate or ammonium lauryl sulfate, or a dodecylbenzene. An alkyl aryl sulfonate such as sodium sulfonate or sodium dodecyl naphthalene sulfonate.

陽離子系界面活性劑之具體例可舉例如硬脂基胺鹽酸鹽或氯化月桂基三甲基銨之胺鹽或第四級銨鹽等。Specific examples of the cationic surfactant include stearylamine hydrochloride or an amine salt of lauryl trimethylammonium chloride or a fourth-order ammonium salt.

此等之界面活性劑可分別單獨使用亦可組合2種以上而使用。These surfactants may be used alone or in combination of two or more.

鹼顯像液中之界面活性劑的濃度一般為0.01~10質量%、宜為0.05~8質量%,更宜為0.1~5質量%。The concentration of the surfactant in the alkali developing solution is generally 0.01 to 10% by mass, preferably 0.05 to 8% by mass, more preferably 0.1 to 5% by mass.

可經過如以上之光間隔物用感光性樹脂組成物的塗佈、乾燥、對所得到之乾燥塗膜的圖型曝光、繼而所謂顯像之各操作,於基板上或彩色濾光片基板上或液晶驅動用基板上形成光間隔物。Coating, drying, pattern exposure of the obtained dried coating film, and subsequent so-called development of the photosensitive resin composition as described above, on the substrate or on the color filter substrate Or a photo spacer is formed on the substrate for liquid crystal driving.

又,此光間隔物可用於液晶顯示裝置。又,液晶顯示裝置之中,經改善視野之Multi-domain Vertical Alignment(以下,MVA)液晶顯示裝置,係於配向膜之基底,局部地設有構造物而形成突起,即使形成如此之構造物,使用本發明之感光性樹脂組成物所形成的光間隔物係有用。又,若使用本發明之光間隔物用感光性樹脂組成物,對乾燥塗膜的圖型曝光時若使用孔洞形成用光罩,可形成孔洞,此係用來作為層間絕緣膜。進一步,若使用本發明之光間隔物用感光性樹脂組成物,對乾燥塗膜的曝光時,不使用光罩而以曝光及加熱硬化或僅加熱硬化可形成樹脂膜,此樹脂膜可用來作為外覆層。Further, this photo spacer can be used for a liquid crystal display device. Further, in the liquid crystal display device, the Multi-domain Vertical Alignment (hereinafter, MVA) liquid crystal display device having improved field of view is provided on the base of the alignment film, and a structure is partially provided to form a protrusion, and even if such a structure is formed, A photo spacer formed using the photosensitive resin composition of the present invention is useful. Further, when the photosensitive resin composition for a photo-spacer of the present invention is used, a hole-forming mask can be used for the pattern exposure of the dried coating film, and a hole can be formed, which is used as an interlayer insulating film. Further, when the photosensitive resin composition for a photo spacer of the present invention is used, when the dried coating film is exposed, a resin film can be formed by exposure, heat curing or only heat curing without using a photomask, and the resin film can be used as a resin film. Overlay.

使用本發明之光間隔物用感光性樹脂組成物所製造之光間隔物係面內之膜厚差小,例如1~6μ m之膜厚,使面內膜厚差形成0.15μ m以下,進一步形成0.05μ m以下。因此,如此所得到之光間隔物係平滑性優者,又,藉由將此組入於彩色液晶顯示裝置,可以更高良率製造優異品質之液晶顯示裝置。The film thickness difference in the surface of the photo spacer used in the photosensitive resin composition for a photo spacer of the present invention is small, for example, a film thickness of 1 to 6 μm , and the in-plane film thickness difference is 0.15 μm or less. Further formed to be 0.05 μm or less. Therefore, the optical spacers thus obtained are excellent in smoothness, and by incorporating them into a color liquid crystal display device, it is possible to manufacture a liquid crystal display device of superior quality at a higher yield.

製造液晶顯示裝置之方法可例示以下之方法。The method of manufacturing a liquid crystal display device can exemplify the following method.

於經過配向膜之形成步驟、摩擦步驟之TFT陣列基板,使本發明之光間隔物用感光性樹脂組成物的進行塗佈、乾燥,對所得到之基板上的乾燥塗膜圖型化曝光、繼而進行所謂顯像之操作,製造附有光間隔物之基板。繼而,以ITO膜形成面與光間隔物形成面相向之方式,貼合附有ITO膜之彩色濾光片與附有光間隔物之基板,藉彩色濾光片與TFT陣列基板之間的光間隔物於所形成之空間注入液晶,藉由密封周圍,可製造液晶顯示裝置。The photosensitive resin composition for a photo-spacer of the present invention is applied and dried by a TFT array substrate having a step of forming an alignment film and a rubbing step, and the dried coating film on the obtained substrate is patterned and exposed. Then, a so-called development operation is performed to manufacture a substrate with a photo spacer. Then, the color filter with the ITO film and the substrate with the photo spacer are bonded to each other by the ITO film forming surface and the photo spacer forming surface, and the light between the color filter and the TFT array substrate is bonded. The spacer injects liquid crystal into the formed space, and by sealing the periphery, a liquid crystal display device can be manufactured.

本發明之光間隔物用感光性樹脂組成物係貯存安定性良好,感度高,故藉使用該感光性樹脂組成物,可形成塑性變形量大之光間隔物。In the photosensitive resin composition for a photo-spacer of the present invention, the storage stability is good and the sensitivity is high. Therefore, by using the photosensitive resin composition, a photo spacer having a large plastic deformation amount can be formed.

實施例Example

以下,依據實施例更詳細地說明本發明,但當然本發明不受此等之實施例所限定。Hereinafter, the present invention will be described in more detail based on the examples, but the invention is of course not limited by the examples.

實施例1、2及比較例1Examples 1, 2 and Comparative Example 1

將實施例1所使用之黏結劑樹脂Aa之構造及莫耳比等表示於式(X)及表1中。表1中,a~d係表示莫耳比。The structure of the binder resin Aa used in Example 1 and the molar ratio and the like are shown in the formula (X) and Table 1. In Table 1, a~d indicates the molar ratio.

構成單元之說明Description of the constituent units

a:由共聚合物1中之(A2)所衍生的構成單元。a: a constituent unit derived from (A2) in the copolymer 1.

b:由共聚合物1中之(A2)所衍生的構成單元。b: a constituent unit derived from (A2) in the copolymer 1.

c:於由共聚合物1中之(A4)所衍生的構成單元使(A3)反應所衍生之構成單元。c: a constituent unit derived from the (A3) reaction in a constituent unit derived from (A4) in the copolymer 1.

d:在源自於共聚合物2中之(A3)的部位使(A5)反應所衍生之構成單元。d: a constituent unit derived from the reaction of (A5) at a site derived from (A3) in the copolymer 2.

有關上述黏結劑聚合物之聚苯乙烯換算重量平均分子量(Mw)及數目平均分子量(Mn)之測定,係使用GPC法,而以下之條件實施。The measurement of the polystyrene-equivalent weight average molecular weight (Mw) and the number average molecular weight (Mn) of the above-mentioned binder polymer was carried out by the GPC method under the following conditions.

裝置:HLC-8120GPC(Tosoh(股)製)Device: HLC-8120GPC (Tosoh system)

管柱:TSK-GELG4000HXL+TSK-GELG2000HXL(串聯連接)Pipe string: TSK-GELG4000HXL+TSK-GELG2000HXL (series connection)

管柱溫度:40℃Column temperature: 40 ° C

溶劑:THFSolvent: THF

流速:1.0mL/分Flow rate: 1.0 mL / min

注入量:50μLInjection volume: 50μL

檢測器:RIDetector: RI

測定試料濃度:0.6質量%(溶劑:THF)Determination of sample concentration: 0.6% by mass (solvent: THF)

校正用標準物質:TSK STANDARD POLYSTYRENE F-40、F-4、F-1、A-2500、A-500(Tosoh(股)製)Standard materials for calibration: TSK STANDARD POLYSTYRENE F-40, F-4, F-1, A-2500, A-500 (made by Tosoh)

於上述所得到之重量平均分子量及數目平均分子量之比作為分子量分布(Mw/Mn)。The ratio of the weight average molecular weight and the number average molecular weight obtained above was defined as a molecular weight distribution (Mw/Mn).

將實施例及比較例之調配組成表示於表2中。表2中之數值表示質量份數。The formulation compositions of the examples and comparative examples are shown in Table 2. The numerical values in Table 2 indicate the parts by mass.

使2平方英寸之玻璃基板(#1737:康寧公司製)以中性清潔劑、水及醇依序進行洗淨後乾燥。於此玻璃基板上,使感光性樹脂組成物(表2)以100mJ/cm2 之曝光量(365mm)進行曝光,顯像,水洗,後烘烤後之膜厚成為4.7μ m之方式進行旋塗,然後,無塵室中,以100℃預烘烤3分鐘。冷卻後,塗佈此感光性樹脂組成物之基板與石英玻璃製光罩(具有一邊為10μ m之正方形與間隔部之間隔為100μ m之圖型)之間隔為150μ m,使用超高壓水銀燈(USH-250D;Ushio電機(股)製)而於大氣壓下以100mJ/cm2 之曝光量(365mm)進行光照射。其後,於含有非離子系界面活性劑0.12質量%與氫氧化鉀0.05質量%之水系顯像液中在23℃下攪拌上述塗膜(以磁攪拌子300rpm)之顯像液中浸漬80秒而顯像,水洗後,以220℃進行後烘烤30分鍾,得到硬化樹脂圖型。A 2 square inch glass substrate (#1737: manufactured by Corning Incorporated) was washed with a neutral detergent, water, and alcohol in order, and then dried. On the glass substrate, the photosensitive resin composition (Table 2) was exposed to an exposure amount (365 mm) of 100 mJ/cm 2 , developed, washed, and the film thickness after post-baking was 4.7 μm . Apply, then, in a clean room, pre-bake at 100 ° C for 3 minutes. After cooling, the substrate coated with the photosensitive resin composition and the quartz glass mask (having a pattern of a square having a side of 10 μm and a space of 100 μm from the spacer) were 150 μm , and the use was super. A high-pressure mercury lamp (USH-250D; manufactured by Ushio Electric Co., Ltd.) was irradiated with light at an exposure pressure (365 mm) of 100 mJ/cm 2 under atmospheric pressure. Thereafter, the coating film (with a magnetic stirrer of 300 rpm) was immersed in a developing solution containing 0.12% by mass of a nonionic surfactant and 0.05% by mass of potassium hydroxide in a water-based developing solution at 80 ° C for 80 seconds. After the image was washed, it was post-baked at 220 ° C for 30 minutes to obtain a hardened resin pattern.

在所得到之硬化樹脂圖型的下述項目中進行測定等之結果表示於表3中。The results of measurement and the like in the following items of the obtained cured resin pattern are shown in Table 3.

(表3中之說明)(Description in Table 3)

表面平滑性:表面平滑性之基準係以目視觀察表面,若具有光澤表示為○,成白濁(不透明)表示為×。Surface smoothness: The basis of the surface smoothness is a visual observation of the surface, and if it has a gloss, it is represented by ○, and a white turbidity (opaque) is represented by ×.

線幅:使用SEM(型號S-4100;(股)日立製作所製)而測定在圖型之底部中的二邊之尺寸,求出所得到之二邊的平均值。Line width: The dimensions of the two sides in the bottom of the pattern were measured using an SEM (Model S-4100; manufactured by Hitachi, Ltd.), and the average value of the obtained two sides was obtained.

形狀:相對於圖型之基板等呈垂直之截面,相對於此之截面,使用與上述相同之SEM而觀察。若對基板而圖型之稜線小於90度,則記為順推拔狀,若大於90度則記為逆推拔狀。Shape: A cross section perpendicular to the substrate of the pattern or the like, and the cross section is observed using the same SEM as described above. If the ridge line of the pattern is less than 90 degrees on the substrate, it is marked as a push-pull shape, and if it is greater than 90 degrees, it is marked as a reverse push-up shape.

總位移量:使用動態超微小硬度計(DUH-W201S;(股)島津製作所製),而以如下之條件測定總位移量(μ m)。此處,一般上,若塑形位移量大,可謂總位移量亦大。Total displacement: Using a dynamic ultra-micro hardness tester (DUH-W201S; manufactured by Shimadzu Corporation), the total displacement ( μm ) was measured under the following conditions. Here, in general, if the amount of shaping displacement is large, the total displacement amount is also large.

試驗模式:負載-除負載試驗試驗力:5gf(SI單位換算值:0.049N)負荷連度:0.45gf/秒(SI單元換算值:0.0044N/秒)保持時間:5秒壓子:圓錐台壓子(直徑50mm ψ)保存安定性:以下式求出在23℃下保管3個月左右之黏度變化率。Test mode: Load-except load test Test force: 5gf (SI unit conversion value: 0.049N) Load connection degree: 0.45gf/sec (SI unit conversion value: 0.0044N/sec) Hold time: 5 seconds Pressure: Conical table Pressure retention (diameter: 50 mm ψ) Storage stability: The viscosity change rate at 23 ° C for about 3 months was determined by the following formula.

黏度變化率(%)=[(保管後黏度)/保管前黏度]×100Viscosity change rate (%) = [(viscosity after storage) / viscosity before storage] × 100

線膨脹係數:於4英吋矽晶圓上,後烘烤感光性樹脂組成物後以成為0.3μ m之方式成膜。此時,不使用光罩及省略顯像步驟以外,進行與成膜於2平方英寸之玻璃基板相同的操作。Linear expansion coefficient: After baking the photosensitive resin composition on a 4-inch wafer, it was formed into a film of 0.3 μm . At this time, the same operation as that of the glass substrate formed of 2 square inches was performed without using a photomask and omitting the development step.

使用斜入射X線分析裝置(X'Pert MRD;菲利浦製)而所得到之塗膜測定在30℃~200℃下之膜厚變化。又,X線輸出:45kV/40mA、X線:CuKα1線、環境:以氮氣實施。The film thickness obtained by using an oblique incident X-ray analyzer (X'Pert MRD; manufactured by Philips) was measured at a film thickness of 30 ° C to 200 ° C. Further, X-ray output: 45 kV/40 mA, X-ray: CuKα1 line, environment: carried out with nitrogen.

又,線膨脹係數之單元為10 6 /℃。Further, the unit of the coefficient of linear expansion is 10 - 6 / °C.

熱分析:在形成硬化樹脂圖案之操作中,於不使用光罩而全面曝光以外,其餘係進行相同之操作,得到膜厚3μ m之硬化塗膜。以剃刀刮取硬化塗膜,測定240℃×1小時之加熱減量(試樣溫度到達240℃時之重量為100,而240℃×1小時保溫度後之質量以百分率表示)。Thermal analysis: In the operation of forming a cured resin pattern, the same operation was carried out without using a photomask, and the same operation was carried out to obtain a cured coating film having a film thickness of 3 μm . The hardened coating film was scraped off with a razor, and the heating loss at 240 ° C for 1 hour was measured (the weight of the sample when the temperature reached 240 ° C was 100, and the mass after 240 ° C × 1 hour of temperature retention was expressed as a percentage).

裝置:微分熱熱重量同時測定裝置(TG/DTA220:精工儀器(股)裝)測定環境:氮氣氮氣流流量:300mL/分Device: Differential thermal and thermal weight simultaneous measuring device (TG/DTA220: Seiko Instruments) The measuring environment: nitrogen and nitrogen flow rate: 300 mL/min

可知含有以式(1)所示之光聚合性化合物之實施例1及2的光間隔物用感光性樹脂組成物係可得到總位移量大,進一步表面平滑性、圖型形狀優之光間隔物,但不含有以式(1)所示之光聚合性化合物的比較例1之光間隔物用感光性樹脂組成物中,係總位移量小。It is understood that the photosensitive resin composition for photo spacers of Examples 1 and 2 containing the photopolymerizable compound represented by the formula (1) has a large total shift amount, and further has a smooth surface and a pattern shape. In the photosensitive resin composition for a photo-spacer of Comparative Example 1 which does not contain the photopolymerizable compound represented by the formula (1), the total amount of displacement is small.

實施例3、比較例2、比較例3Example 3, Comparative Example 2, Comparative Example 3

在實施例3、比較例2、比較例3中,將使用來作為黏結劑樹脂(A)之樹脂的構造Ab、組成等,表示於式(Y)及表4中。表4中,a~d表示莫耳比。In Example 3, Comparative Example 2, and Comparative Example 3, the structure Ab, the composition, and the like of the resin used as the binder resin (A) are shown in the formula (Y) and Table 4. In Table 4, a~d represents the molar ratio.

以表示於表5之組成,與實施例1相同做法而進行評估。其結果表示於表6中。The evaluation was carried out in the same manner as in Example 1 in the composition shown in Table 5. The results are shown in Table 6.

構成單元之說明Description of the constituent units

a:由共聚合物1中之(A2)所衍生的構成單元。a: a constituent unit derived from (A2) in the copolymer 1.

b:由共聚合物1中之(A2)所衍生的構成單元。b: a constituent unit derived from (A2) in the copolymer 1.

c:由共聚合物1中之(A2)所衍生的構成單元。c: a constituent unit derived from (A2) in the copolymer 1.

d:由共聚合物1中之(A3)所衍生的構成單元。d: a constituent unit derived from (A3) in the copolymer 1.

e:由共聚合物1中之(A3)所衍生的構成單元使(A4)反應所衍生之構成單元。e: a constituent unit derived from the reaction of (A4) by a constituent unit derived from (A3) in the copolymer 1.

樹脂Ab之聚苯乙烯換算重量分子量及數目平均分子量之測定,係與實施例1相同地實施。The measurement of the polystyrene-equivalent weight molecular weight and the number average molecular weight of the resin Ab was carried out in the same manner as in Example 1.

<光間隔物用感光性樹脂組成物之調製><Preparation of photosensitive resin composition for photo spacers>

將實施例及比較例之調配組成表示於表5中。表5中之數值表示質量份數。The formulation compositions of the examples and comparative examples are shown in Table 5. The numerical values in Table 5 indicate the parts by mass.

評估結果表示於表6中。The results of the evaluation are shown in Table 6.

接著性試驗Follow-up test

使形成硬化樹脂圖型之玻璃基板(#1737;康寧公司製)切割成1cm×5cm,使同尺寸之玻璃基板(#1737;康寧公司製)介由硬化樹脂圖型呈十字狀重疊後(貼合之面積為1cm2 )、在300Pa之壓力下、150℃下以1小時之條件壓接。The glass substrate (#1737; manufactured by Corning Co., Ltd.) which forms a hardened resin pattern was cut into 1 cm × 5 cm, and the same size of the glass substrate (#1737; manufactured by Corning) was superimposed in a cross shape via a hardened resin pattern. The area was 1 cm 2 ), and it was pressure-bonded under the pressure of 300 Pa at 150 ° C for 1 hour.

取出試驗片,冷卻至室溫後,剝離所貼合之基板後,在使用實施例1-3之組成物所形成之硬化樹脂圖型上基板會接着,但使用比較例1之組成物所形成的硬化樹脂圖型中基板不接着。又,在比較例2~3之組成物中,無法形成硬化樹脂圖型(於非曝光部有膜殘留),故不能試驗。After the test piece was taken out, and after cooling to room temperature, the bonded substrate was peeled off, and the substrate was formed on the cured resin pattern formed using the composition of Example 1-3, but was formed using the composition of Comparative Example 1. The substrate in the hardened resin pattern is not followed. Further, in the compositions of Comparative Examples 2 to 3, the cured resin pattern could not be formed (the film remained in the non-exposed portion), and therefore the test could not be performed.

產業上之利用可能性Industrial use possibility

以本發明之光間隔物形成用感光性樹脂組成物所形成的光間隔物係塑性變形量大、進一步表面平滑性優,可解析至3~50μ m之微細圖型,故脫除性良好,適於殘留如光間隔物之圖型。The photo spacer formed by the photosensitive resin composition for photo spacer formation of the present invention has a large plastic deformation amount and is excellent in surface smoothness, and can be analyzed to a fine pattern of 3 to 50 μm , so that the release property is good. Suitable for residual patterns such as photo spacers.

本發明之光間隔物形成用感光性樹脂組成物係除可使用於液晶顯示裝置中之光間隔物的形成,亦可使用於絕緣膜(接觸孔形成)、外覆層(平坦化膜)、液晶配向控制用之塗起形成材的形成。進一步,可使用來作為其等接着所使用之接著劑。The photosensitive resin composition for forming a photo spacer of the present invention can be used for forming a photo spacer used in a liquid crystal display device, and can be used for an insulating film (contact hole formation), an overcoat layer (planarization film), The formation of the forming material for liquid crystal alignment control. Further, it can be used as an adhesive for its subsequent use.

Claims (5)

一種光間隔物用感光性樹脂組成物,係含有黏結劑樹脂(A)、光聚合性化合物(B)、光聚合起始劑(C)及溶劑(D),其特徵在於:該光聚合性化合物(B)為含有以式(I)所示之化合物,且以式(I)所示之光聚合性化合物(B)的含量相對於黏結劑樹脂(A)、光聚合性化合物(B)及光聚合起始劑(C)之合計量就質量分率為5~60質量%,其中光聚合起始劑(C)為含有至少一種選自三嗪(Triazine)、苯乙酮化合物、雙咪唑化合物、肟化合物及醯基氧化膦化合物所構成之群的化合物。 [式(I)中,R1 ~R6 係分別獨立地表示氫原子或下述式(I-1)~(I-3)的任一者之基,R1 ~R6 之至少4個的基為(I-1)~(I-3)的任一者之基,R1 ~R6 之至少一個的基為(I-2)或(I-3)] A photosensitive resin composition for a photo spacer comprising a binder resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C), and a solvent (D), characterized in that the photopolymerizable property The compound (B) is a compound containing the compound represented by the formula (I), and the content of the photopolymerizable compound (B) represented by the formula (I) is relative to the binder resin (A) and the photopolymerizable compound (B). And the total amount of the photopolymerization initiator (C) is 5 to 60% by mass, wherein the photopolymerization initiator (C) contains at least one selected from the group consisting of triazine, acetophenone compound, and double A compound of the group consisting of an imidazole compound, an anthracene compound, and a fluorenylphosphine oxide compound. In the formula (I), R 1 to R 6 each independently represent a hydrogen atom or a group of any one of the following formulas (I-1) to (I-3), and at least 4 of R 1 to R 6 The base of any of (I-1) to (I-3), the base of at least one of R 1 to R 6 is (I-2) or (I-3)] 如申請專利範圍第1項之組成物,其中以式(I)所示之光聚合性化合物(B)的含量相對於黏結劑樹脂(A)、光聚合性化合物(B)及光聚合起始劑(C)之合計量就質量分率為20~40質量%。 The composition of the first aspect of the patent application, wherein the content of the photopolymerizable compound (B) represented by the formula (I) is relative to the binder resin (A), the photopolymerizable compound (B), and the photopolymerization initiation. The total amount of the agent (C) is 20 to 40% by mass. 如申請專利範圍第1或2項之組成物,其中黏結劑樹脂(A)為使化合物(A2)~(A5)之任何至少2種共聚合所得到之樹脂;(A2);具有可與(A4)共聚合之不飽和鍵結的化合物;(A3);具有不飽和鍵結之羧酸;(A4);於一分子中具有不飽和鍵結與環氧基之化合物;(A5);酸酐;但,(A2)~(A5)係分別互相不同。 The composition of claim 1 or 2, wherein the binder resin (A) is a resin obtained by copolymerizing at least two of the compounds (A2) to (A5); (A2); A4) a copolymerized unsaturated-bonded compound; (A3); a carboxylic acid having an unsaturated bond; (A4); a compound having an unsaturated bond and an epoxy group in one molecule; (A5); an acid anhydride However, (A2)~(A5) are different from each other. 一種光間隔物,係使用如申請專利範圍第1~3項中任一項之組成物所形成者。 A photo spacer which is formed by using the composition according to any one of claims 1 to 3. 一種液晶顯示裝置,係含有如申請專利範圍第4項之光間隔物。 A liquid crystal display device comprising the photo spacer according to item 4 of the patent application.
TW095125271A 2005-07-29 2006-07-11 A photosensitive resin composition for optical spacers, an optical spacers, and a liquid crystal display device TWI406062B (en)

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100849360B1 (en) * 2007-02-13 2008-07-29 동우 화인켐 주식회사 A colored photosensitive resin composition, patterning method thereof, color filter, liquid crystal display device and imaging device having the same
KR100973644B1 (en) * 2007-07-18 2010-08-02 동우 화인켐 주식회사 A colored photosensitive resin composition, color filter and liquid crystal display device having the same
WO2011007649A1 (en) * 2009-07-13 2011-01-20 株式会社Adeka Sealing agent for liquid crystal dripping method
KR102437844B1 (en) 2015-04-02 2022-08-31 롬엔드하스전자재료코리아유한회사 Colored photosensitive resin composition and black column spacer prepared therefrom
JP2020076945A (en) * 2018-09-21 2020-05-21 旭化成株式会社 Photosensitive resin composition

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710913A (en) * 1993-06-22 1995-01-13 Mitsubishi Chem Corp Photopolymerizable composition
JP2001174621A (en) * 1999-12-16 2001-06-29 Nippon Kayaku Co Ltd Resin composition, film and cured substance thereof
TW473647B (en) * 2000-01-29 2002-01-21 Chi Mei Corp Photosensitive resin composition
JP2002293877A (en) * 2001-03-29 2002-10-09 Taiyo Ink Mfg Ltd Photo-curing and thermosetting resin composition, and cured material thereof
JP2003084433A (en) * 2001-09-14 2003-03-19 Nippon Shokubai Co Ltd Image forming photosensitive resin composition
JP2003345015A (en) * 2002-05-29 2003-12-03 Sumitomo Chem Co Ltd Photosensitive resin composition
TW576950B (en) * 2000-12-27 2004-02-21 Chisso Corp Photosensitive resin compound, spacer, forming material, colorfilter forming material and the liquid crystal display device
JP2005049842A (en) * 2003-07-11 2005-02-24 Sumitomo Chemical Co Ltd Photosensitive resin composition
US20050079436A1 (en) * 2002-02-27 2005-04-14 Shuichi Takahashi Photosensitve resin composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1172693A4 (en) * 2000-01-25 2006-04-05 Daicel Chem Photocurable resin compositions
CN1237400C (en) * 2001-09-27 2006-01-18 Az电子材料(日本)株式会社 Photosensitive resin composition
CN1191301C (en) * 2001-10-15 2005-03-02 奇美实业股份有限公司 Photosensitive resin composite for gap body of liquid crystal display
JP2003177525A (en) * 2001-12-13 2003-06-27 Sumitomo Chem Co Ltd Colored photosensitive resin composition
CN1291279C (en) * 2003-08-22 2006-12-20 奇美实业股份有限公司 Light sensitive resin composition for gap

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0710913A (en) * 1993-06-22 1995-01-13 Mitsubishi Chem Corp Photopolymerizable composition
JP2001174621A (en) * 1999-12-16 2001-06-29 Nippon Kayaku Co Ltd Resin composition, film and cured substance thereof
TW473647B (en) * 2000-01-29 2002-01-21 Chi Mei Corp Photosensitive resin composition
TW576950B (en) * 2000-12-27 2004-02-21 Chisso Corp Photosensitive resin compound, spacer, forming material, colorfilter forming material and the liquid crystal display device
JP2002293877A (en) * 2001-03-29 2002-10-09 Taiyo Ink Mfg Ltd Photo-curing and thermosetting resin composition, and cured material thereof
JP2003084433A (en) * 2001-09-14 2003-03-19 Nippon Shokubai Co Ltd Image forming photosensitive resin composition
US20050079436A1 (en) * 2002-02-27 2005-04-14 Shuichi Takahashi Photosensitve resin composition
JP2003345015A (en) * 2002-05-29 2003-12-03 Sumitomo Chem Co Ltd Photosensitive resin composition
JP2005049842A (en) * 2003-07-11 2005-02-24 Sumitomo Chemical Co Ltd Photosensitive resin composition

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