TWI404167B - Substrate holding apparatus and the method thereof - Google Patents

Abstract

The invention discloses a substrate holding apparatus and the fabrication method thereof, the holding apparatus including: a base; a platform board to load the substrate; a heat exchanger configured on the base to cool or heat the platform board to form a liquid-drop distribution or to remove it on/from the surface of the platform board, respectively, wherein the liquid-drop distribution is used to attach the substrate on the platform board; a moving unit connected to the platform board and configured to let the platform board approach or leave the heat exchanger; and a controller electrically connected to the heat exchanger and the moving unit to control cooling or heating of the heat exchanger and move of the moving unit.

Description

Device for adsorbing substrate and method thereof

The present invention relates to a substrate adsorption technique, and more particularly to a substrate adsorption apparatus and method using surface tension of condensed droplets.

Substrate adsorption technology plays an important role in the field of semiconductor manufacturing or precision processing. Most of the adsorption platforms currently used are fabricated metal plates or non-metal plates with adsorption structures (such as micropores, grooves, etc.) on the surface, assembled to a vacuum. The chamber is connected to a platform of a vacuum pump or a platform made directly of a porous material (such as an alumina ceramic platform or a porous aluminum powder sintering platform) in combination with a vacuum pump. However, for a flexible substrate, such an adsorption device is susceptible to microbubbles or depressions when applied to a soft substrate due to the uniformity of the adsorption structure of the platform surface or the uniformity of the porous material and the adsorption pressure of the vacuum pump. The situation, the problem of reduced process yield. For example, in a laser processing process of a soft substrate, the phenomenon of particles or microbubbles may cause the flatness of the surface of the flexible substrate to be deteriorated, thereby affecting the operating distance, processing line width, or processing energy of the laser processing. Therefore, it is necessary to develop new substrate adsorption technology to be applied to the application field of flexible substrates.

In view of this, in an aspect of the invention, an embodiment provides an apparatus for adsorbing a substrate, comprising: a base; a platform for carrying a substrate; and a thermal adjustment unit disposed on the base Cooling to form a droplet distribution on the surface of the platform and heating to remove the droplet distribution of the surface of the platform, wherein the droplet distribution is used to adsorb the substrate on the platform; a lifting unit, the system Linking to the platform for lifting the platform to approach or away from the thermal conditioning unit; and a control unit coupled to the thermal conditioning unit and the lifting unit for controlling refrigeration or heating of the thermal conditioning unit and The lifting movement of the platform.

In another aspect of the present invention, another embodiment provides a method of adsorbing a substrate, comprising the steps of: providing a substrate adsorption device comprising: a platform and a thermal adjustment unit; moving the platform until the thermal adjustment is contacted a unit; by controlling the thermal conditioning unit, cooling the platform to form a droplet distributed on the platform; placing a substrate on the platform, adsorbing the substrate by the surface tension of the droplet distribution And the droplet distribution forms a liquid film between the substrate and the platform.

The features, objects, and functions of the present invention, as well as the technical means for achieving the same, are described in detail with reference to the accompanying drawings. It is understood that the scope and technical means of the invention are not limited thereby. In the description of the embodiments, the description of the "on" or "under" of each layer (film), region, pattern or structure formed on the substrate, layers (films), regions, spacers or patterns. The "upper" and "lower" systems include all direct or indirectly formed objects. In addition, the above or below each layer will be described based on the drawings. For the sake of convenience and clarity in the description, the thickness or size of each layer in the drawings is expressed in a rough, exaggerated or brief manner, and the dimensions of the constituent elements are not completely the actual size.

1 is a schematic structural diagram of a substrate adsorption apparatus 100 according to an embodiment of the present invention. The substrate adsorption apparatus 100 includes a base 110, a platform 120, a thermal adjustment unit 130, a lifting unit 140, and a The control unit 150 is characterized in that a droplet distribution 160 is formed on the surface of the platform 120 by the cooling action of the thermal conditioning unit 130, and the surface tension of the droplet distribution 160 acts to adsorb one. The substrate 170 is on the platform 120.

The pedestal 110 is used to support the structure of the entire substrate adsorption device 100, and the thermal adjustment unit 130 having a cooling and heating function is disposed thereon; and in order to maintain the stability of the cooling temperature, the heat transfer mechanism of the thermal adjustment unit 130 is provided. In order to avoid the influence of excessive temperature change on the cooling during cooling, the susceptibility of the condensed droplets is affected, so that the susceptor is preferably composed of a material having a high thermal conductivity. The platform 120 is used to carry and fix a substrate 170 for subsequent processing or laser processing. Therefore, the platform 120 may be a platform with a flat surface made of glass or metal material. It should be noted that this embodiment can be applied to a substrate of a rigid or flexible material, including a plastic substrate or a flexible printed circuit (PCB) substrate; in a practical embodiment, a flat glass plate platform is used, and A flexible substrate for use in flexible liquid crystal displays.

The thermal conditioning unit 130 is disposed on the susceptor 110 for cooling to form a droplet distribution 160 on the surface of the platform 120 and heating to remove the droplet distribution 160 of the surface of the platform 120; wherein the embodiment will By the surface tension of the droplet distribution 160, the substrate 170 is closely adsorbed on the platform 120 to avoid or improve the air pressure formed by the vacuum by the prior art, and the micropores must be installed or drilled in the adsorption platform. Difficulties in trenches (especially in glass or ceramic plates) and problems arising from air pressure adsorption of vacuum.

The structure of the thermal adjustment unit 130 of this embodiment can be schematically illustrated in FIG. 2, which is composed of a pair of P-type and N-type semiconductors 131/132 connected in series to generate a function of rapid heating or cooling, above and below The end face is packaged with ceramic-like heat-distributing plates 133/134 to uniformly distribute the heat or the cooling energy of the entire surface of the heat regulating unit 130. When the thermal conditioning unit acts 130, one end produces refrigeration and the other end produces heating. When the thermal regulation unit 130 applies a direct current, the electrical energy can be converted into thermal energy: for the current flowing from the N-type semiconductor to the junction 135 of the P-type semiconductor, the heat is absorbed as a cold end; for the current from the P-type semiconductor to the N A junction 136 of a semiconductor that releases heat and is a hot end. The amount of heat absorbed or released may be determined by the magnitude and direction of the current, which is controlled by control unit 150 coupled to the thermal conditioning unit 130. The lifting unit 140 of the embodiment is connected to the platform 120, and the platform 120 is raised and lowered to approach or away from the thermal adjustment unit 130; the platform 120 can be moved up and down using a manual, automatic, or semi-automatic manner, depending on the actual Depending on the situation.

When the surface of the platform 120 is to be formed into a droplet distribution, the platform 120 can be brought close to the thermal adjustment unit 130 to cool the platform 120 by the lifting unit 140, wherein the formation of the droplet distribution is selected. Since the steam, coagulation, and spraying, the present embodiment mainly forms the droplet distribution 160 by causing the saturated steam to condense on the surface of the platform 120 by lowering the temperature of the surface of the platform 120 to below the Dew point temperature. . After the substrate 170 and the platform 120 are closely adsorbed by the surface tension of the droplets, the droplet distribution 160 forms a liquid film (in this embodiment, a water film), and the thickness of the liquid film is between 1 μm and The water film of this example was about 30 μm between 1000 μm. When the substrate 170 is to be separated from the platform 120, the thermal conditioning unit 130 is heated to the platform 120 to evaporate the water film, thereby removing the surface tension and easily removing the substrate 170.

The control unit 150 is coupled to the thermal conditioning unit 130 and the lifting unit 140 for controlling the cooling or heating of the thermal conditioning unit 130 and the lifting movement of the platform 120. The control unit 150 of this embodiment includes: a power supply, a driving circuit to drive the thermal conditioning unit 130 and can perform positive and negative polarity switching, and a control circuit to control the lifting unit 140.

The operation flow or the steps of the embodiment may be the same as the following embodiments; FIG. 3 is a schematic flow chart of the substrate adsorption method according to another embodiment of the present invention. Referring to FIG. 1 and FIG. 3 simultaneously, the method 200 for adsorbing a substrate includes the following steps: Step 210, providing a substrate adsorption device 100, comprising: a platform 120 and a thermal adjustment unit 130; and step 220, moving the platform 120 until contact To the thermal conditioning unit 130; in step 230, the platform 120 is cooled to form a droplet distribution 160 on the platform 120 by controlling the thermal conditioning unit 130; in step 240, a substrate 170 is placed on the platform 120. The substrate 170 is adsorbed on the platform 120 by the surface tension of the droplet distribution 160; and in step 250, the droplet distribution forms a liquid film between the substrate 170 and the platform 120; wherein the liquid A drop distribution 160 may be formed on the back side of the substrate 170. For a description of the platform 120, the thermal adjustment unit 130, and the substrate 170, refer to the description of the previous embodiment, and details are not described herein again.

The droplet distribution may be formed by steam, condensation, or spraying. In this embodiment, the saturated steam is condensed on the surface of the platform 120 by lowering the temperature of the surface of the platform 120 to below the dew point temperature. This droplet distribution 160 is formed. When the saturated vapor comes into contact with the surface of the substrate or platform below its saturation temperature, latent heat is released and condensed to form droplets. The formation conditions of the droplets are related to the temperature and humidity of the air in the operating environment; the temperature required for water condensation can be estimated by the principle of water condensation and the relationship between the operating environment temperature and the relative humidity. For example, please refer to the temperature and humidity relationship diagram of the droplet condensation environment in Figure 4. The relative humidity of the clean room is controlled between 40% and 50%, and the temperature is between 20 °C and 22 °C. As shown in the frame line area of Fig. 4, it can be seen that the temperature at which the condensation occurs is in the range of 7 ° C to 14 ° C, that is, the temperature of the substrate or the platform is lowered to 7 ° C or less by the thermal adjustment unit 130, and the condensation phenomenon may occur. The droplet distribution is formed on the substrate or the platform, and the substrate is flatly adsorbed by the surface tension of the droplets, that is, the operation of the entire adsorption device and method is completed. As described above, the method 200 of adsorbing a substrate may thus further include a step 205 of providing a normal-pressure operating environment having a relative humidity of at least 30% and a temperature between 15 ° C and 32 ° C to create a water droplet. The proper environment for condensation.

With the method of adsorbing a substrate disclosed in this embodiment, the method can be further applied to a subsequent semiconductor process or laser processing, for example, a process of applying laser processing to the substrate 170 in step 260 shown in FIG. 3, and The water film is used as a protective layer to prevent the laser from harming the platform 120 and improving the backside splashing of the laser processing, especially the laser light source with a wavelength above 355 μm, but not limited thereto; or the processing of the step 262 The substrate 170 is used as a protective layer to prevent the substrate 170 from being scratched by direct contact with the platform 120. However, it is not limited thereto, and may be processed or processed by other forms of substrates. Finally, for the removal of the substrate after the end of the process, the method 200 of the embodiment may further include the following steps: Step 270: heating the platform 120 to remove the liquid film or water film by controlling the thermal adjustment unit 130; and step 280 The substrate 170 is separated and taken out from the platform 120 to complete the entire fabrication process.

The above description includes the features, structures, and other similar effects, which are merely preferred embodiments of the present invention, and the scope of the present invention is not limited thereto. The features, structures, and other similar effects shown in the above embodiments may also be varied and modified by those skilled in the art in accordance with the scope of the present invention, and the present invention will remain without departing from the scope of the present invention. Further implementations of the invention are considered to be within the spirit and scope of the invention. Moreover, the embodiments described above are merely exemplary embodiments and are not intended to limit the scope of the invention. For example, the elements or units used in the various embodiments can be modified and implemented by those skilled in the art, without departing from the scope of the invention.

100. . . Substrate adsorption device

110. . . Pedestal

120. . . platform

130. . . Thermal conditioning unit

131. . . P-type semiconductor

132. . . N-type semiconductor

133/134. . . Homogenizing plate

135/136. . . Connector

140. . . Lifting unit

150. . . control unit

160. . . Droplet distribution

170. . . Substrate

200. . . Adsorption substrate method

Steps 205/210/220/230/240/250/260/262/270/280

1 is a schematic view showing the structure of a substrate adsorption device according to an embodiment of the present invention.

2 is a schematic view showing a series connection structure of a P-type and an N-type semiconductor of the thermal conditioning unit of the present embodiment.

3 is a schematic flow chart of a substrate adsorption method according to another embodiment of the present invention.

Figure 4 is a graph showing the temperature and humidity relationship of the droplet condensation environment.

100. . . Substrate adsorption device

110. . . Pedestal

120. . . platform

130. . . Thermal conditioning unit

140. . . Lifting unit

150. . . control unit

160. . . Droplet distribution

170. . . Substrate

Claims (29)

A substrate adsorption device comprising: a base; a platform for carrying a substrate; a thermal adjustment unit disposed on the base for cooling to form a droplet distributed on a surface of the platform and Heating to remove the droplet distribution of the surface of the platform, wherein the droplet distribution is for adsorbing the substrate on the platform; a lifting unit coupled to the platform for lifting the platform to approach or away from the platform a thermal conditioning unit; and a control unit coupled to the thermal conditioning unit and the lifting unit for controlling refrigeration or heating of the thermal conditioning unit and lifting movement of the platform. The substrate adsorption device of claim 1, wherein the base is composed of a material having a high heat transfer coefficient. The substrate adsorption device of claim 1, wherein the platform is made of glass or a metal material. The substrate adsorption device of claim 1, wherein the thermal conditioning unit comprises: a pair of P-type and N-type semiconductors; and two heat-radiating plates respectively serving as the P-type and N-type semiconductor packages The lower end surface uniformly distributes heat or cooling of the surface of the thermal conditioning unit. The substrate adsorption device of claim 4, wherein the thermal conditioning unit further comprises: two or more pairs of P-type and N-type semiconductors connected in series with each other. The substrate adsorption device according to claim 4, wherein the heat equalizing plate is composed of a ceramic material. The substrate adsorption device of claim 1, wherein the lifting unit can move the platform up and down using a manual, automatic, or semi-automatic manner. The substrate adsorption device of claim 1, wherein the droplet distribution is formed by steam, condensation, and spraying. The substrate adsorption device of claim 1, wherein the droplets are distributed to form a liquid film after the substrate and the platform are closely adsorbed. The substrate adsorption device according to claim 9, wherein the liquid film is a water film. The substrate adsorption device according to claim 9, wherein the liquid film has a thickness of between 1 μm and 1000 μm. The substrate adsorption device of claim 1, wherein the control unit comprises: a power supply; a driving circuit for driving the thermal adjustment unit, and can perform positive and negative polarity switching; and a control circuit, To control the lifting unit. The substrate adsorption device of claim 1, wherein the substrate is composed of a soft or flexible material. The substrate adsorption device according to claim 13, wherein the substrate is a plastic substrate or a flexible printed circuit substrate. A method of adsorbing a substrate, comprising: providing a substrate adsorption device comprising: a platform and a thermal conditioning unit; moving the platform until contacting the thermal conditioning unit; and cooling the platform by controlling the thermal conditioning unit To form a droplet distributed on the platform. The method of adsorbing a substrate according to claim 15, wherein the droplet distribution is formed on a back surface of the substrate. The method for adsorbing a substrate according to claim 15 , further comprising: placing a substrate on the platform, adsorbing the substrate on the platform by a surface tension of the droplet distribution; and the droplet The distribution forms a liquid film between the substrate and the platform. The method of adsorbing a substrate according to claim 17, wherein the liquid film is a water film. The method of adsorbing a substrate according to claim 18, wherein the droplet distribution is formed by condensing saturated steam on the surface of the platform by lowering the temperature of the surface of the platform to below the dew point temperature. The method of adsorbing a substrate according to claim 18, further comprising: providing an operating environment having a relative humidity of at least 30% and a temperature between 15 ° C and 32 ° C. The method for adsorbing a substrate according to claim 18, further comprising: applying a laser processing process to the substrate, and using the water film as a protective layer to prevent laser damage to the platform and improving laser processing. The back of the splash. The method for adsorbing a substrate according to claim 18, further comprising: processing the substrate, and using the water film as a protective layer to prevent the substrate from being scratched by direct contact with the platform. The method of adsorbing a substrate according to claim 15, wherein the platform is made of glass or a metal material. The method of adsorbing a substrate according to claim 15, wherein the thermal conditioning unit comprises: a pair of P-type and N-type semiconductors; and two uniformizing plates respectively serving as the P-type and N-type semiconductor packages. And the lower end surface, the heat or the cooling energy of the surface of the thermal conditioning unit is evenly distributed. The method of adsorbing a substrate according to claim 24, wherein the thermal conditioning unit further comprises: two or more pairs of P-type and N-type semiconductors connected in series with each other. The method of adsorbing a substrate according to claim 24, wherein the leveling plate is composed of a ceramic material. The method of adsorbing a substrate according to claim 15, wherein the droplet distribution is formed by steam, coagulation, and spraying, and the liquid film has a thickness of between 1 μm and 1000 μm. The method of adsorbing a substrate according to claim 15, wherein the substrate is composed of a soft or flexible material. The method of adsorbing a substrate according to claim 17, further comprising: heating the platform to remove the liquid film by controlling the thermal conditioning unit; and separating and removing the substrate from the platform.