TWI402923B - - Google Patents
Info
- Publication number
- TWI402923B TWI402923B TW099106657A TW99106657A TWI402923B TW I402923 B TWI402923 B TW I402923B TW 099106657 A TW099106657 A TW 099106657A TW 99106657 A TW99106657 A TW 99106657A TW I402923 B TWI402923 B TW I402923B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H10W72/30—
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- H10W72/07351—
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- H10W74/00—
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- H10W90/736—
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- H10W90/756—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099106657A TW201131670A (en) | 2010-03-08 | 2010-03-08 | Manufacturing method and structure of surface mount diode component of silicon chip-substrate integrated packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099106657A TW201131670A (en) | 2010-03-08 | 2010-03-08 | Manufacturing method and structure of surface mount diode component of silicon chip-substrate integrated packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201131670A TW201131670A (en) | 2011-09-16 |
| TWI402923B true TWI402923B (cg-RX-API-DMAC10.html) | 2013-07-21 |
Family
ID=49225975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099106657A TW201131670A (en) | 2010-03-08 | 2010-03-08 | Manufacturing method and structure of surface mount diode component of silicon chip-substrate integrated packaging |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201131670A (cg-RX-API-DMAC10.html) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3489961A (en) * | 1966-09-29 | 1970-01-13 | Fairchild Camera Instr Co | Mesa etching for isolation of functional elements in integrated circuits |
| US4016593A (en) * | 1974-06-07 | 1977-04-05 | Hitachi, Ltd. | Bidirectional photothyristor device |
| JPS6260234A (ja) * | 1985-09-09 | 1987-03-16 | Fuji Electric Co Ltd | 半導体ダイオ−ド素子の製造方法 |
| US4667189A (en) * | 1984-04-25 | 1987-05-19 | Energy Conversion Devices, Inc. | Programmable semiconductor switch for a display matrix or the like and method for making same |
| US6617670B2 (en) * | 2000-03-20 | 2003-09-09 | Sarnoff Corporation | Surface PIN device |
| US20070221944A1 (en) * | 2005-11-15 | 2007-09-27 | Myung Cheol Yoo | Light emitting diodes and fabrication methods thereof |
-
2010
- 2010-03-08 TW TW099106657A patent/TW201131670A/zh not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3489961A (en) * | 1966-09-29 | 1970-01-13 | Fairchild Camera Instr Co | Mesa etching for isolation of functional elements in integrated circuits |
| US4016593A (en) * | 1974-06-07 | 1977-04-05 | Hitachi, Ltd. | Bidirectional photothyristor device |
| US4667189A (en) * | 1984-04-25 | 1987-05-19 | Energy Conversion Devices, Inc. | Programmable semiconductor switch for a display matrix or the like and method for making same |
| JPS6260234A (ja) * | 1985-09-09 | 1987-03-16 | Fuji Electric Co Ltd | 半導体ダイオ−ド素子の製造方法 |
| US6617670B2 (en) * | 2000-03-20 | 2003-09-09 | Sarnoff Corporation | Surface PIN device |
| US20070221944A1 (en) * | 2005-11-15 | 2007-09-27 | Myung Cheol Yoo | Light emitting diodes and fabrication methods thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201131670A (en) | 2011-09-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |